BD52W01G-C [ROHM]
ROHM可灵活设置延迟时间的窗口电压检测器IC系列是采用CMOS工艺的、内置高精度且低耗电量的延迟电路的CMOS复位IC系列产品，延迟时间可通过外置电容器进行设置。输出形式为Nch开漏，Dual输出。在从-40℃到+125℃的整个工作温度范围内，将延迟时间精度控制在±50%以内。;
| 型号： | BD52W01G-C |
| 厂家： | 
ROHM |
| 描述： | ROHM可灵活设置延迟时间的窗口电压检测器IC系列是采用CMOS工艺的、内置高精度且低耗电量的延迟电路的CMOS复位IC系列产品，延迟时间可通过外置电容器进行设置。输出形式为Nch开漏，Dual输出。在从-40℃到+125℃的整个工作温度范围内，将延迟时间精度控制在±50%以内。 电容器 |
| 文件： | 总23页 (文件大小：1375K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Nano EnergyTM
Datasheet
Voltage Detector (Reset) IC Series for Automotive Application
Free Time Delay Setting Dual Output
Window Voltage Detector (Reset) IC
BD52WxxG-C
General Description
Key Specifications
ROHM's free time delay setting window voltage
detector ICs are highly accurate, with low current
consumption feature that uses CMOS process. Delay
time setting can be control by an external capacitor. It
has dual N-channel open drain output. The time delay
◼ Over Voltage Detection:
1.32 V, 1.65 V, 1.98 V, 2.75 V, 3.63 V, 5.50 V (Typ)
◼ Under Voltage Detection:
1.08 V, 1.35 V, 1.62 V, 2.25 V, 2.97 V, 4.50 V (Typ)
◼ Ultra-Low Current Consumption:
300 nA (Typ)
±50 % (-40 °C to +125 °C)
(CT pin capacitor ≥ 1 nF)
has ±50
% accuracy for the entire operating
◼ Delay Time Accuracy:
temperature range of -40 °C to +125 °C.
Features
◼ Nano Energy™
◼ AEC-Q100 Qualified(Note 1)
Special Characteristics
◼ Detection Voltage Accuracy:
◼ Functional Safety Supportive Automotive Products
◼ Under and Over Voltage Monitor
◼ Free Time Delay Setting
±5.0 % (-40 °C to +125 °C)
Package
W (Typ) x D (Typ) x H (Max)
2.9 mm x 2.8 mm x 1.25 mm
◼ Nch Open Drain Output
SSOP6:
◼ Very Small, Lightweight and Thin Package
◼ SSOP6 Package is Similar to SOT-23-6 (JEDEC)
(Note 1) Grade 1
Application
All Automotive Devices That Requires Voltage Detection
Typical Application Circuit
VSENSE
VDD2
VDD1
VDD SENSE
UVB
RST
CT
OVB
Microcontroller
GND
CCT
GND
Nano Energy™ is a trademark or a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Pin Configuration
SSOP6
TOP VIEW
SENSE GND OVB
4
3
CT
UVB
VDD
Pin Description
Pin No.
1
Pin Name
CT
Function
Capacitor connection pin for output
delay time setting
2
3
4
5
6
VDD
UVB
Power supply voltage
Under voltage detection output pin
Over voltage detection output pin
GND
OVB
GND
SENSE
SENSE pin
Block Diagram
VDD
(Note)
UVB
OVB
SENSE
(Note)
(Note)
Delay
(Note)
Vref
Circuit
(Note)
GND
CT
(Note) Parasitic Diode
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
VDD
Limit
-0.3 to +7
-0.3 to +7
(GND - 0.3) to +7
(GND - 0.3) to +7
(GND - 0.3) to +7
70
Unit
V
Power Supply Voltage
SENSE Pin Voltage
VSENSE
VCT
CT Pin Voltage
VUVB
UVB Pin Voltage
VOVB
IOUVB
IOOVB
Tjmax
Tstg
OVB Pin Voltage
UVB Pin Output Current
OVB Pin Output Current
Maximum Junction Temperature
Storage Temperature Range
mA
70
+150
°C
°C
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
SSOP6
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
376.5
40
185.4
30
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A (Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter
Symbol
VDD
Min
1.6
0
Typ
Max
6.0
Unit
Operating Supply Voltage
SENSE Pin Voltage
-
-
V
V
VSENSE
Topr
6.0
Operating Temperature
-40
+25
+125
°C
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Electrical Characteristics (Unless otherwise specified Ta = -40 °C to +125 °C, VDD = 1.6 V to 6.0 V)
Limit
Parameter
Symbol
Condition
Unit
V
Min
1.02
1.28
1.54
2.13
2.82
4.27
1.25
1.56
1.88
2.61
3.45
5.22
-
Typ
1.08
1.35
1.62
2.25
2.97
4.50
1.32
1.65
1.98
2.75
3.63
5.50
Max
1.14
1.42
1.70
2.37
3.12
4.73
1.39
1.74
2.08
2.89
3.82
5.78
BD52W01G-C
BD52W02G-C
BD52W03G-C
BD52W04G-C
BD52W05G-C
BD52W06G-C
BD52W01G-C
BD52W02G-C
BD52W03G-C
BD52W04G-C
BD52W05G-C
BD52W06G-C
Under Voltage
VUVDET
VSENSE = H→L, RL = 100 kΩ
Detection Voltage
Over Voltage
VOVDET
VSENSE = L→H, RL = 100 kΩ
V
Detection Voltage
Circuit Current
UVB Operating
Voltage Range
OVB Operating
Voltage Range
IDD
VDD = VSENSE = (VUVDET + VOVDET) / 2
VOLUVB ≤ 0.4 V, Ta = -40 °C to +125 °C,
RL = 100 kΩ
nA
V
300
3000
VOPLUVB
1.6
1.6
-
-
VOLOVB ≤ 0.4 V, Ta = -40 °C to +125 °C,
RL = 100 kΩ
VOPLOVB
VOLUVB
VOLOVB
tPLH
-
-
V
V
VSENSE < VUVDET, VDD = 1.6 V, ISINK = 1.0 mA
VSENSE < VUVDET, VDD = 2.4 V, ISINK = 2.0 mA
VSENSE > VOVDET, VDD = 1.6 V, ISINK = 1.0 mA
VSENSE > VOVDET, VDD = 2.4 V, ISINK = 2.0 mA
-
-
-
-
-
-
-
-
0.4
0.4
0.4
0.4
UVB “Low” Output Voltage
OVB “Low” Output Voltage
V
L→H Propagation
Delay Time
VUVB = GND→50 %, CCT = 0.01 μF, VDD = 3.0 V
27.7
55.5
83.2
ms
(Note 1)
RL: Pull-up resistor connected between UVB, OVB and power supply.
(Note 1) CT delay capacitor range: open to 4.7 μF.
Function Explanation
1. Nano Energy™
Nano Energy™ is a combination of technologies which realizes ultra low quiescent current operation.
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Typical Performance Curves
1.0
0.9
0.8
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
+125 °C
6.0 V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
3.0 V
+25 °C
-40 °C
1.6 V
1
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
Operating Supply Voltage: VDD [V]
Temperature: Ta [°C]
Figure 1. Circuit Current vs Operating Supply
Voltage (VDD = SENSE)
Figure 2. Circuit Current vs Temperature
(VDD = SENSE)
2.1
2.0
1.9
1.8
1.7
1.6
1.5
2.1
2.0
1.9
1.8
1.7
1.6
1.5
BD52W03G-C
VOVDET
BD52W03G-C
VOVDET
VUVDET
VUVDET
1.0
2.0
3.0
4.0
5.0
6.0
-50 -25
0
25
50
75 100 125 150
Operating Supply Voltage: VDD [V]
Temperature: Ta [°C]
Figure 3. Detection Voltage vs Operating Supply
Voltage (Ta = 25 °C)
Figure 4. Detection Voltage vs Temperature
(VDD = 3 V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
2.0
1.5
1.0
0.5
0.0
2.0
1.5
UVB
UVB
1.0
OVB
OVB
0.5
0.0
-50 -25
0
25
50
75 100 125 150
1.0
2.0
3.0
4.0
5.0
6.0
Temperature: Ta [°C]
Operating Supply Voltage: VDD [V]
Figure 5. Hysteresis Voltage vs Operating Supply
Voltage (Ta = 25 °C)
Figure 6. Hysteresis Voltage vs Temperature
(VDD = 3 V)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
2.0
1.5
1.0
0.5
0.0
Pull-up to 5 V
Pull-up resistance: 100 kΩ
Pull-up to 5 V
Pull-up resistance: 100 kΩ
BD52W03G-C
OVB
UVB
1.5
1.6
1.7
1.8
1.9
2.0
2.1
-50 -25
0
25
50
75 100 125 150
Operating Supply Voltage: VDD [V]
Temperature: Ta [°C]
Figure 8. Operating Voltage vs Temperature
Figure 7. Output Voltage vs Operating Supply
Voltage
(Ta = 25 °C, VDD = SENSE, UVB = OVB)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
90
80
90
80
70
60
50
40
30
20
10
0
VDD = 2.4 V (OVB)
70
60
VDD = 2.4 V (UVB)
VDD = 2.4 V (OVB)
50
VDD = 1.6 V (OVB)
40
VDD = 2.4 V (UVB)
30
VDD = 1.6 V (OVB)
20
VDD = 1.6 V (UVB)
VDD = 1.6 V (UVB)
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25
0
25
50
75 100 125 150
Drain-Source Voltage : VDS [V]
Temperature: Ta [°C]
Figure 9. “Low” Output Current vs Drain-Source
Voltage (Ta = 25 °C)
Figure 10. “Low” Output Current vs Temperature
(VDS = 0.4 V)
90
80
70
60
50
40
30
20
90
80
70
60
50
40
30
20
OVB
UVB
OVB
UVB
1.0
2.0
3.0
4.0
5.0
6.0
-50 -25
0
25
50
75 100 125 150
Operating Supply Voltage: VDD [V]
Temperature: Ta [°C]
Figure 12. L→H Propagation Delay Time vs
Temperature (VDD = 3 V, CCT = 10 nF)
Figure 11. L→H Propagation Delay Time vs
Operating Supply Voltage
(Ta = 25 °C, CCT = 10 nF)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
120
100
120
100
80
60
40
20
0
80
60
40
20
0
UVB
UVB
OVB
OVB
1.0
2.0
3.0
4.0
5.0
6.0
-50 -25
0
25
50
75 100 125 150
Operating Supply Voltage: VDD [V]
Temperature: Ta [°C]
Figure 13. H→L Propagation Delay Time vs
Operating Supply Voltage
(Ta = 25 °C)
Figure 14. H→L Propagation Delay Time vs
Temperature (VDD = 3 V)
100000
10000
1000
100
70
60
50
40
30
20
10
0
UVB
UVB
OVB
10
OVB
1
0.1
0.0001
0.001
0.01
0.1
1
10
0.0001
0.001
0.01
0.1
1
10
CT Pin Capacitance: CCT [µF]
CT Pin Capacitance: CCT [µF]
Figure 15. L→H Propagation Delay Time vs CT
Pin Capacitance (VDD = 3 V, Ta = 25 °C)
Figure 16. H→L Propagation Delay Time vs CT
Pin Capacitance (VDD = 3 V, Ta = 25 °C)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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BD52WxxG-C
Timing Chart
The following shows the change of the output voltages when operating supply voltage (VDD) and SENSE pin Voltage (VSENSE
)
sweep.
VSENSE
VDD
VDD
Vref
RL
UVB
RL
SENSE
CVDD
Delay
OVB
Circuit
CL
GND
CL
CT
CCT
Figure 17. Set-up diagram
VDD
VOPL: <1.6 V
VOPL: <1.6 V
VSENSE
VOVDET
VOVREL
VUVDET
VUVREL
VUVB
tPLH
VOVB
tPLH
5
1
2
3
4
6
4
7
1
Figure 18. Timing Chart
Operating Conditions Explanation
1. The Output Voltage (VOVB and VUVB) becomes unstable until VDD exceeds the Minimum Operating Voltage (VOPL).
2. When VDD exceeds the Minimum Operating Voltage (VOPL) but VSENSE is the Under Voltage Detection Voltage (VUVDET
)
or less, VUVB changes to “L” and VOVB changes to “H”. However, this change depends on the VUVB and VOVB rise time
when the power supply starts up, so thorough confirmation is required.
3. When VSENSE rises and exceeds the Under Voltage Release Voltage (VUVREL), delay time (tPLH) set by the capacitor at
CT pin (CCT) happens and VUVB switches from “L” to “H”.
4. Both Under Voltage and Over Voltage are undetected so VUVB and VOVB remains “H”.
5. When VSENSE rises further and exceeds the Over Voltage Detection Voltage (VOVDET), VOVB changes from “H” to “L” and
state becomes Over Voltage Detection.
6. When VSENSE drops and falls below the Over Voltage Release Voltage (VOVREL), delay time (tPLH) set by the capacitor at
CT pin (CCT) happens and VOVB switches from “L” to “H”.
7. When VSENSE decreases further and falls below the Under Voltage Detection Voltage (VUVDET), VUVB changes from “H”
to “L” and state becomes Under Voltage Detection.
(Note) The potential difference between the detection voltage and the release voltage is known as the Hysteresis Voltage width. The system is designed such
that the output will not toggle with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise.
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BD52WxxG-C
Application Information
Operation Description
The detection and release voltage are used as threshold voltages. When the voltage applied to the SENSE pin reaches the
applicable threshold voltage, the VOVB and VUVB levels switch from either “H” to “L” or “L” to “H”. BD52WxxG-C have delay time
function, which set tPLH using an external capacitor connected in CT pin (CCT) when output switches “L” to “H”. Because the
BD52WxxG-C uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another power supply. (In
this case, the output “H” voltage becomes VDD or the voltage of another power supply).
Setting of Detector Delay Time
The detection release delay time (tPLH) can be set according to the CCT value of the capacitor connected to the CT pin. The
detection release delay time (tPLH) is the time when VUVB or VOVB rises to 1/2 of VDD after VSENSE rises and exceeds the under
voltage release voltage (VUVREL) or VSENSE drops and falls below the Over Voltage Release Voltage (VOVREL) after VDD rising.
The delay time is calculated from the following formula. When CT capacitor is 1 nF or more, delay time when CT pin is open
(tCTO) has less effect and tPLH computation is shown on Example No. 2. The result has ±50 % tolerance within the operating
temperature range of -40 °C to +125 °C.
Formula: (Ta = 25 °C)
푡푃퐿퐻 = 퐶ꢀ푇 × 퐷푒푙푎푦 퐶표푒푓푓푖푐푖푒푛푡 + 푡ꢀ푇푂 [s]
where:
CCT is the CT pin external capacitor.
Delay Coefficient is equal to 5.55 x 106.
tCTO is the delay time when CT = open(Note 1)
Delay time (tCTO
)
Temperature range
UVB
Typ
OVB
Typ
Min
Max
Min
Max
Ta = -40 °C to +125 °C
30 μs
85 μs
250 μs
40 μs
125 μs
600 μs
(Note 1) tCTO is design guarantee only.
Example No. 1:
CT capacitor = 100 pF
−ꢃ2
× 5.55 × 106 × 0.5 + 30 × 10−6 = 308 μs
)
(
푡푃퐿퐻_푚ꢁꢂ = 100 × 10
−ꢃ2
× 5.55 × 106 × 1.0 + 85 × 10−6 = ꢆ40 μs
)
(
푡푃퐿퐻_ꢄꢅ푝 = 100 × 10
−ꢃ2
× 5.55 × 106 × 1.5 + ꢈ50 × 10−6 = 1083 μs
)
(
푡푃퐿퐻_푚ꢇ푥 = 100 × 10
Example No. 2:
CT capacitor = 1 nF
푡푃퐿퐻_ꢄꢅ푝 = 1 × 10−9 × 5.55 × 106 = 5.55 ms
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BD52WxxG-C
Application Information - continued
Bypass Capacitor for Noise Rejection
For the stable operation of the IC, put capacitor 0.1 μF or more between the VDD and GND pin and connect it closer to the pin
as possible. When using extremely big capacitors, the transient response speed becomes slow so check thoroughly.
External Parameters
The recommended value of CT capacitor is from open to 4.7 μF and pull-up resistance value is 50 kΩ to 1 MΩ. Since the
changes are brought by many factors (circuit configuration, board layout, etc.) when using, ensure that confirmation of the real
function was carried out. In addition, this IC has high impedance design. So depending on the condition of use, this may be
affected by unexpected leak route due to the uncleanness of PCB surface. For example, if a 10 MΩ leakage is assumed between
the output and GND pins, it is recommended to set the value of pull-up resistor to 1/10 or less of the impedance of assumed
leakage route.
Behavior at less than the Operating Voltage Range
When VDD falls less than the operating voltage range, output will be undefined. When output is connected to pull-up voltage,
output will be equivalent to pull-up voltage.
Precautions when Steep Power Supply Rise
In case of a steep power supply rise, the output may be unstable even if VDD exceeds the operating voltage range. This is due
to the undefined output when the supply is less than the operating voltage range of the IC. When this waveform affects the
application, make the rise time slower by attaching capacitor to VDD (CVDD). Make the VDD Rise Time to 200 μs or more.
CT Pin Discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input pulse is
applied, and in this case, the delay time may not be controlled. Verify the actual operation.
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BD52WxxG-C
Application Examples
Examples of the Power Supply with Resistor Dividers
The following shows example of applications of a resistor divider circuit in applications which the resistor connected to the
power supply voltage (VDD) of an IC. In case of the VDD pin is shorted to the SENSE pin, When the output logic changes its
state, an Inrush current will flow suddenly into the circuit. This current flow may cause malfunction in the systems operation
such as output oscillations, etc. The recommended value of RA is 4.7 kΩ or less, and CVDD is 0.1 μF or more. (Inrush current
will flow suddenly from the power supply (VDD) to GND when the output level switches to “H” or “L”.)
VIN
(Note 1)
RA
(RA ≤ 4.7 kΩ)
IDD
I1
VDD
SENSE
RL
VUVB
Inrush current
(Note 1)
RB
CVDD
(CVDD ≥ 0.1 µF)
VOVB
CL
GND
VDD
0
VDET
Figure 19. Resistor Divider Connection Application
Figure 20. Current Consumption vs VDD Voltage
(Note 1) The circuit example mentioned above does not guarantee successful operation.
Perform thorough evaluation using the actual application and set countermeasures.
For example, during low voltage detection release, a voltage drop [Inrush current (I1)] x [input resistor (RA)] is caused by the
Inrush current when output changes from “L” to “H”, and causes the input voltage to drop. When the input voltage drops and
falls below the detection voltage, the output will switch from “H” to “L”. At this time, the Inrush current stops flowing through
output “L”, and the voltage drop disappears. As a result, the output switches from “L” to “H”, which again causes the Inrush
current to flow and the voltage to drop. This operation repeats and leads to oscillation. In case resistor divider is not use and
only use RA, same response will happen. In addition, note that the same phenomenon occurs during over voltage detection.
160
BD52W03G-C
140
120
CVDD = open
100
80
CVDD = 0.1 μF
60
CVDD = 10 μF
40
20
0
1.0
10.0
100.0
RA [kΩ]
Figure 21. ΔVDET vs RA (Reference)
(Ta = 125 °C, VIN = SWEEP)
The graph above shows the deviation of detection voltage ΔVDET dependent on RA and CVDD
.
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BD52WxxG-C
Examples of the Power Supply with Resistor Dividers - continued
Depending on the application set-up, there are times that VDD voltage is always below the Release Voltage because of the
effect of Inrush current as shown follows.
Voltage
VIN
ΔVDROP = Inrush Current x RA
VUVDET + ΔVUVDET
VDD
Hysteresis Voltage (ΔVUVDET
)
VUVDET
t
Figure 22. VDD Drop Caused by Inrush Current
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BD52WxxG-C
Application Examples - continued
Considerations on Input and Output Capacitor
It is suggested to use capacitors between the input pin and GND, and the output pin and GND, which is positioned as near
as possible to the pins. The capacitor between the input pin and GND is effective when the power supply impedance
increases or when the wiring is long. A large capacitor between the output pin and GND improves stability and output load
characteristics. Check the state of mounting. In addition, the ceramic capacitor deviates and has temperature characteristics
and AC bias characteristics in general. Furthermore, depending on the usage, the capacitance value decreases over time.
It is recommended that ceramic capacitor to use is decided after gathering detailed data information by consulting brand
manufacturers.
10 V withstand voltage
B1 characteristics
10
0
-10
10 V withstand voltage
B characteristics
-20
-30
6.3 V withstand voltage
B characteristics
10 V withstand voltage
-40
F characteristics
-50
-60
4 V withstand voltage
X6S characteristics
-70
-80
-90
-100
0
1
2
3
4
DC Bias Voltage [V]
Figure 23. Ceramic Capacitance Change vs DC Bias voltage
(Characteristic example)
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BD52WxxG-C
I/O Equivalence Circuits
Pin No.
Pin Name
Pin Description
Equivalence Circuit
2
Capacitor connection pin for
output delay time setting
1
CT
1
5
3, 4
Under voltage detection output
3
4
UVB
OVB
pin
Over voltage detection output
pin
5
6
6
SENSE
SENSE pin
5
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BD52WxxG-C
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply
voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages
within the values specified in the electrical characteristics of this IC.
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BD52WxxG-C
Operational Notes – continued
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Functional Safety
“ISO 26262 Process Compliant to Support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.
“Functional Safety Supportive Automotive Products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the
functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
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BD52WxxG-C
Ordering Information
B
D
5
2
W
x
x
G
-
C
T
R
UVDET OVDET
Package
G: SSOP6
Product Rank
C: for Automotive
Packaging and forming
specification
TR: Embossed tape and reel
01: 1.08 V
02: 1.35 V
03: 1.62 V
04: 2.25 V
05: 2.97 V
06: 4.50 V
1.32 V
1.65 V
1.98 V
2.75 V
3.63 V
5.50 V
Lineup
Orderable Part
Number
UVDET
OVDET
Marking
Package
1.08 V
1.35 V
1.62 V
2.25 V
2.97 V
4.50 V
1.32 V
1.65 V
1.98 V
2.75 V
3.63 V
5.50 V
BT
BU
BV
BW
BX
GC
BD52W01G-CTR
BD52W02G-CTR
BD52W03G-CTR
SSOP6
Reel of 3000
BD52W04G-CTR
BD52W05G-CTR
BD52W06G-CTR
Marking Diagram
SSOP6 (TOP VIEW)
Part Number Marking
LOT Number
Pin 1 Mark
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BD52WxxG-C
Physical Dimension and Packing Information
Package Name
SSOP6
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BD52WxxG-C
Revision History
Date
Revision
Changes
26.Dec.2019
17.May.2021
001
002
New Release
Add Lineup
Added BD52W02G-C and BD52W04G-C in the line-up,
added Nano Energy™ trademark
05.Nov.2021
003
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
BD52W02G-C (开发中)
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