BD53108G-CZ (新产品) [ROHM]
BD53108G-CZ is S pole detection Hall IC with wide VDD voltage range and wide operation temperature range. This IC can detect magnetic field with superior sensitivity stability by using the chopper stabilized way. This IC has various protection features built-in. (Reverse supply voltage protection, output over current protection, over temperature protection, under voltage lockout protection). Therefore, this IC is suitable for a wide range of automotive applications.;型号: | BD53108G-CZ (新产品) |
厂家: | ROHM |
描述: | BD53108G-CZ is S pole detection Hall IC with wide VDD voltage range and wide operation temperature range. This IC can detect magnetic field with superior sensitivity stability by using the chopper stabilized way. This IC has various protection features built-in. (Reverse supply voltage protection, output over current protection, over temperature protection, under voltage lockout protection). Therefore, this IC is suitable for a wide range of automotive applications. |
文件: | 总17页 (文件大小:951K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Automotive Hall Effect Switch Series
(S Pole Detection)
BD5310xG-CZ Series
General Description
Key Specifications
BD5310xG-CZ series are S pole detection Hall IC with wide
VDD voltage range and wide operation temperature range.
These ICs can detect magnetic field with superior
sensitivity stability by using the chopper stabilized way.
◼
◼
◼
◼
◼
◼
◼
◼
VDD Voltage Range:
2.7 V to 38 V
3.5 mT to 28.0 mT 6 type (Typ)
2.5 mT to 22.5 mT 6 type (Typ)
Operate Point:
Release Point:
Bop Temperature Coefficient:
Magnetic Signal Input Frequency:
Supply Current:
-1200 ppm/ °C (Typ)
10 kHz (Max)
1.3 mA (Typ)
Nch Open Drain
-40 °C to +150 °C
These ICs have various protection features built-in.
(Reverse supply voltage protection, output over current
protection, over temperature protection, under voltage
lockout protection).
Output Type:
Operating Temperature Range:
Therefore, these ICs are suitable for a wide range of
automotive applications.
Product Name
BD53103G-CZ
BD53104G-CZ
BD53105G-CZ
BD53106G-CZ
BD53107G-CZ
BD53108G-CZ
Operate Point (Typ)
3.5 mT
7.5 mT
10.0 mT
12.5 mT
Features
◼
◼
◼
◼
◼
◼
◼
AEC-Q100 Qualified (Note 1)
S Pole Detection
Nch Open Drain
18.0 mT
28.0 mT
Output Over Current Protection
Over Temperature Protection
Reverse Supply Voltage Protection
Under Voltage Lockout
Package
W (Typ) x D (Typ) x H (Max)
2.92 mm x 2.4 mm x 1.12 mm
SSOP3A
(Note 1) Grade1
Applications
◼
Open and Close Detection, Attaching Detection,
Proximity Detection, Position Sensing
Typical Application Circuit, Block Diagram
Adjust the bypass capacitor
value as necessary, according
to
power
supply
noise
conditions, etc.
TOP VIEW
Pin Configuration
Pin Descriptions
3
GND
Pin
No.
Pin Name
VDD
Function
Power supply (Note 2)
Output (Detect to the south pole)
Ground
1
2
3
OUT
1
2
GND
VDD
OUT
(Note 2) Dispose a bypass capacitor between VDD and GND.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Typical Application Circuit, Block Diagram......................................................................................................................................1
Pin Descriptions..............................................................................................................................................................................1
Pin Configuration ............................................................................................................................................................................1
Absolute Maximum Ratings ............................................................................................................................................................3
Thermal Resistance........................................................................................................................................................................3
Recommended Operating Conditions.............................................................................................................................................4
Magnetic Characteristics.................................................................................................................................................................4
Electrical Characteristics.................................................................................................................................................................5
Typical Performance Curves...........................................................................................................................................................6
Figure 1. Operate Point, Release Point vs Ambient Temperature ................................................................................................6
Figure 2. Operate Point, Release Point vs Supply Voltage...........................................................................................................6
Figure 3. Output Low Voltage vs Ambient Temperature ...............................................................................................................6
Figure 4. Output Low Voltage vs Supply Voltage..........................................................................................................................6
Figure 5. Supply Current vs Ambient Temperature.......................................................................................................................7
Figure 6. Supply Current vs Supply Voltage .................................................................................................................................7
Figure 7. Output Current Limitation vs Ambient Temperature.......................................................................................................7
Description of Operations ...............................................................................................................................................................8
Operation at Power ON and Under Voltage Lockout ......................................................................................................................9
Magnet Selection............................................................................................................................................................................9
Position of the Hall Element............................................................................................................................................................9
Output Equivalence Circuit .............................................................................................................................................................9
Operational Notes.........................................................................................................................................................................10
Ordering Information.....................................................................................................................................................................12
Marking Diagram ..........................................................................................................................................................................12
Physical Dimension and Packing Information...............................................................................................................................13
Revision History............................................................................................................................................................................14
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Power Supply Voltage
Symbol
Rating
Unit
VDD
VOUT
IOUT
-36 to +42
-0.3 to +42
25
V
V
Output Voltage
Continuous Output Current
Storage Temperature Range
Maximum Junction Temperature
mA
°C
°C
Tstg
-55 to +150
Tjmax
150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size
and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 3)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 5)
2s2p(Note 6)
SSOP3A
Junction to Ambient
Junction to Top Characterization Parameter (Note 4)
θJA
465.9
48
265.1
52
°C/W
°C/W
ΨJT
(Note 3) Based on JESD51-2A (Still-Air).
(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 5) Using a PCB board based on JESD51-3.
(Note 6) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Footprints and Traces
Thickness
70 μm
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Top
Bottom
Copper Pattern
Footprints and Traces
Thickness Copper Pattern
70 μm 74.2 mm x 74.2 mm
Thickness Copper Pattern
Thickness
70 μm
35 μm
74.2 mm x 74.2 mm
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Recommended Operating Conditions
Parameter
Symbol
VDD
Min
2.7
-40
Typ
12
Max
38
Unit
V
Power Supply Voltage
Operating Temperature
Topr
+25
+150
°C
Magnetic Characteristics (Unless otherwise specified VDD = 12.0 V Ta = 25 °C)
Product Name
Parameter
Operate Point
Release Point
Hysteresis
Symbol
Min
Typ
Max
Unit
mT
mT
mT
mT
mT
mT
mT
mT
mT
mT
mT
mT
mT
mT
mT
mT
mT
mT
Comment
BOP
-
3.5
5.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
BRP
1.0
2.5
-
BD53103G-CZ
BHYS
BOP
-
1.0
-
Operate Point
Release Point
Hysteresis
-
7.5
9.7
BRP
2.8
5.0
-
BD53104G-CZ
BD53105G-CZ
BD53106G-CZ
BD53107G-CZ
BD53108G-CZ
BHYS
BOP
-
2.5
-
Operate Point
Release Point
Hysteresis
-
10.0
8.5
13.0
BRP
5.5
-
BHYS
BOP
-
1.5
-
Operate Point
Release Point
Hysteresis
-
12.5
9.5
15.9
BRP
6.1
-
BHYS
BOP
-
3.0
-
Operate Point
Release Point
Hysteresis
-
18.0
12.5
5.5
23.0
BRP
7.5
-
BHYS
BOP
-
-
Operate Point
Release Point
Hysteresis
-
17.0
-
28.0
22.5
5.5
33.5
BRP
-
BHYS
-
(Note) Polarity of Magnetic flux density is defined as positive when south pole side of magnet approaches top surface of the device.
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BD5310xG-CZ Series
Electrical Characteristics (Unless otherwise specified VDD = 12.0 V Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
μs
μA
V
Comment
Power-On Time
tPON
-
-
-
-
25
-
-
Output Leakage Current
Output Low Voltage
Output Current Limitation
Output Rise Time
ILEAK
VOL
ILIMIT
tr
10
-
-
0.5
120
2
IOUT = +20 mA
30
-
55
-
mA
μs
μs
mA
V
-
VOUT = 12 V
RL = 1 kΩ CL = 20 pF
Output Fall Time
tf
-
-
2
Supply Current
IDD
-
1.3
-
1.9
2.7
-
-
Under Voltage Lockout
VDD_UVLO
2.1
(Note)The on-chip over temperature protection switches off the output (High-Z).
(Note)The on-chip under voltage lockout protection switches off the output (High-Z).
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Typical Performance Curves
10.0
10.0
8.0
6.0
4.0
2.0
0.0
VDD = 12 V
BD53104G-CZ
Ta = 25 °C
BD53104G-CZ
BOP
8.0
6.0
4.0
2.0
0.0
BOP
BRP
BRP
-50 -25
0
25 50 75 100 125 150 175
0
10
20
30
40
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 1. Operate Point, Release Point vs Ambient
Temperature
Figure 2. Operate Point, Release Point vs Supply Voltage
0.5
0.5
VDD = 12 V
Ta = 25 °C
IOUT = 20 mA
IOUT = 20 mA
0.4
0.3
0.2
0.1
0.0
0.4
0.3
0.2
0.1
0.0
-50 -25
0
25 50 75 100 125 150 175
0
10
20
30
40
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 4. Output Low Voltage vs Supply Voltage
Figure 3. Output Low Voltage vs Ambient Temperature
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BD5310xG-CZ Series
Typical Performance Curves - continued
2.0
2.0
1.5
1.0
0.5
0.0
VDD = 12 V
Ta = 25°C
1.5
1.0
0.5
0.0
-50 -25
0
25 50 75 100 125 150 175
0
10
20
30
40
Supply Voltage: VDD [V]
Ambient Temperature: Ta [°C]
Figure 6. Supply Current vs Supply Voltage
Figure 5. Supply Current vs Ambient Temperature
120
VDD = 12 V
100
80
60
40
20
0
-50 -25
0
25 50 75 100 125 150 175
Ambient Temperature: Ta [°C]
Figure 7. Output Current Limitation vs Ambient Temperature
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Description of Operations
(Offset Cancellation)
VDD
The Hall elements are shown with an equivalent
Wheatstone (resistor) bridge circuit. Offset voltage may
be generated by a differential in this bridge resistance, or
can arise from changes of resistance due to package or
bonding stress. A dynamic offset cancellation circuit is
employed to cancel this offset voltage.
I
When the Hall elements are connected as shown in
Figure 8 and a magnetic field is applied perpendicular to
the Hall elements, a voltage is generated at the
mid-points of the bridge. This is known as Hall voltage.
Dynamic offset cancellation switches the wiring to
redirect the current flow to a 90° angle from its original
path, and thereby cancels the offset voltage of Hall
elements.
B
+
×
Hall Voltage
-
Only the magnetic signal is maintained in the
sample/hold circuit process and then released.
GND
Figure 8. Equivalent Circuit of Hall Elements
(Magnetic Field Direction Definition)
Polarity of Magnetic flux density is defined as positive when south pole side of magnet approaches top surface of the device.
S
N
Top Surface
Top Surface
N
S
OUT [V]
High
Low
B [mT]
BRP
BOP
S pole
0
N pole
Magnetic Flux Density
Figure 9. S-pole Detection
OUT detects only S pole magnetic field. (OUT doesn’t detect N pole.)
Note that the output voltage may change if the magnetic flux density between the operate point and the release point is
applied to this IC continuously.
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BD5310xG-CZ Series
Operation at Power ON and Under Voltage Lockout
VDD
2.7 V
UVLO OFF
UVLO ON
2.1 V
t
B < BRP, BRP < B < BOP
B < BRP, BRP < B < BOP
OUT
Output State
Undefined for
VDD < 2.1 V
B > BOP
B > BOP
t
tPON
tPON
Figure 10. Operation at Power ON and UVLO
After VDD power on, the initial state of OUT is High (Hi-Z).
After tPON time pass after VDD exceeds the OFF voltage of Under Voltage Lockout (UVLO), OUT becomes L when the
magnetic field is beyond BOP
.
When VDD is less than ON voltage of UVLO, OUT becomes High (Hi-Z).
Magnet Selection
Neodymium and ferrite are major permanent magnets. Neodymium generally offers greater magnetic power per volume than
ferrite, thereby enabling miniaturization of magnet. The larger neodymium magnet is, the stronger magnetic flux density is.
And the farther detection distance is, the weaker it is. Therefore, the proper size and detection distance of the magnet should
be determined according to the operate point of Hall IC. To increase the magnet’s detection distance, the magnet which is
thicker or larger sectional area is used.
Position of the Hall Element
Output Equivalence Circuit
(Reference)
SSOP3A
2.92
OUT
Center of
sensitive area
5
1.47
OUT
1.14
1.26
2.40
0.22
(UNIT: mm)
Figure 11. Position of the Hall Element
Figure 12. Output Equivalence Circuit
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BD5310xG-CZ Series
Operational Notes
1. Reverse Connection of Power Supply
This IC has a built-in reverse supply voltage protection circuit that prevents damage to the IC. Do not use in a situation
that exceeds the absolute maximum ratings of built-in reverse supply voltage protection circuit.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Except for pins built-in reverse protection, ensure that no pins are at a voltage below that of the ground pin at any time,
even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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Operational Notes – continued
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 13. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD5310xG-CZ Series
Ordering Information
B
D
5
3
1
0
x
G
-
CZTL
Sensitivity BOP (Typ)
3: 3.5 mT
4: 7.5 mT
5: 10.0 mT
6: 12.5 mT
7: 18.0 mT
8: 28.0 mT
Product Rank
C: for Automotive
Package
G: SSOP3A
Packaging and forming specification
TL: Embossed tape and reel
Marking Diagram
SSOP3A (TOP VIEW)
Part Number Marking
LOT Number
Part Number
Marking
Package
SSOP3A
Orderable Part
Number
AE
AF
AG
AH
AJ
AK
BD53103G-CZTL
BD53104G-CZTL
BD53105G-CZTL
BD53106G-CZTL
BD53107G-CZTL
BD53108G-CZTL
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Physical Dimension and Packing Information
Package Name
SSOP3A
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Revision History
Date
Revision
001
Changes
23.May.2022
New Release
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
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H2S, NH3, SO2, and NO2
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[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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BD5310G-2M
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