BD53108G-CZ (新产品) [ROHM]

BD53108G-CZ is S pole detection Hall IC with wide VDD voltage range and wide operation temperature range. This IC can detect magnetic field with superior sensitivity stability by using the chopper stabilized way. This IC has various protection features built-in. (Reverse supply voltage protection, output over current protection, over temperature protection, under voltage lockout protection). Therefore, this IC is suitable for a wide range of automotive applications.;
BD53108G-CZ (新产品)
型号: BD53108G-CZ (新产品)
厂家: ROHM    ROHM
描述:

BD53108G-CZ is S pole detection Hall IC with wide VDD voltage range and wide operation temperature range. This IC can detect magnetic field with superior sensitivity stability by using the chopper stabilized way. This IC has various protection features built-in. (Reverse supply voltage protection, output over current protection, over temperature protection, under voltage lockout protection). Therefore, this IC is suitable for a wide range of automotive applications.

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Datasheet  
Automotive Hall Effect Switch Series  
(S Pole Detection)  
BD5310xG-CZ Series  
General Description  
Key Specifications  
BD5310xG-CZ series are S pole detection Hall IC with wide  
VDD voltage range and wide operation temperature range.  
These ICs can detect magnetic field with superior  
sensitivity stability by using the chopper stabilized way.  
VDD Voltage Range:  
2.7 V to 38 V  
3.5 mT to 28.0 mT 6 type (Typ)  
2.5 mT to 22.5 mT 6 type (Typ)  
Operate Point:  
Release Point:  
Bop Temperature Coefficient:  
Magnetic Signal Input Frequency:  
Supply Current:  
-1200 ppm/ °C (Typ)  
10 kHz (Max)  
1.3 mA (Typ)  
Nch Open Drain  
-40 °C to +150 °C  
These ICs have various protection features built-in.  
(Reverse supply voltage protection, output over current  
protection, over temperature protection, under voltage  
lockout protection).  
Output Type:  
Operating Temperature Range:  
Therefore, these ICs are suitable for a wide range of  
automotive applications.  
Product Name  
BD53103G-CZ  
BD53104G-CZ  
BD53105G-CZ  
BD53106G-CZ  
BD53107G-CZ  
BD53108G-CZ  
Operate Point (Typ)  
3.5 mT  
7.5 mT  
10.0 mT  
12.5 mT  
Features  
AEC-Q100 Qualified (Note 1)  
S Pole Detection  
Nch Open Drain  
18.0 mT  
28.0 mT  
Output Over Current Protection  
Over Temperature Protection  
Reverse Supply Voltage Protection  
Under Voltage Lockout  
Package  
W (Typ) x D (Typ) x H (Max)  
2.92 mm x 2.4 mm x 1.12 mm  
SSOP3A  
(Note 1) Grade1  
Applications  
Open and Close Detection, Attaching Detection,  
Proximity Detection, Position Sensing  
Typical Application Circuit, Block Diagram  
Adjust the bypass capacitor  
value as necessary, according  
to  
power  
supply  
noise  
conditions, etc.  
TOP VIEW  
Pin Configuration  
Pin Descriptions  
3
GND  
Pin  
No.  
Pin Name  
VDD  
Function  
Power supply (Note 2)  
Output (Detect to the south pole)  
Ground  
1
2
3
OUT  
1
2
GND  
VDD  
OUT  
(Note 2) Dispose a bypass capacitor between VDD and GND.  
Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays  
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BD5310xG-CZ Series  
Contents  
General Description........................................................................................................................................................................1  
Features..........................................................................................................................................................................................1  
Key Specifications ..........................................................................................................................................................................1  
Package..........................................................................................................................................................................................1  
Applications ....................................................................................................................................................................................1  
Typical Application Circuit, Block Diagram......................................................................................................................................1  
Pin Descriptions..............................................................................................................................................................................1  
Pin Configuration ............................................................................................................................................................................1  
Absolute Maximum Ratings ............................................................................................................................................................3  
Thermal Resistance........................................................................................................................................................................3  
Recommended Operating Conditions.............................................................................................................................................4  
Magnetic Characteristics.................................................................................................................................................................4  
Electrical Characteristics.................................................................................................................................................................5  
Typical Performance Curves...........................................................................................................................................................6  
Figure 1. Operate Point, Release Point vs Ambient Temperature ................................................................................................6  
Figure 2. Operate Point, Release Point vs Supply Voltage...........................................................................................................6  
Figure 3. Output Low Voltage vs Ambient Temperature ...............................................................................................................6  
Figure 4. Output Low Voltage vs Supply Voltage..........................................................................................................................6  
Figure 5. Supply Current vs Ambient Temperature.......................................................................................................................7  
Figure 6. Supply Current vs Supply Voltage .................................................................................................................................7  
Figure 7. Output Current Limitation vs Ambient Temperature.......................................................................................................7  
Description of Operations ...............................................................................................................................................................8  
Operation at Power ON and Under Voltage Lockout ......................................................................................................................9  
Magnet Selection............................................................................................................................................................................9  
Position of the Hall Element............................................................................................................................................................9  
Output Equivalence Circuit .............................................................................................................................................................9  
Operational Notes.........................................................................................................................................................................10  
Ordering Information.....................................................................................................................................................................12  
Marking Diagram ..........................................................................................................................................................................12  
Physical Dimension and Packing Information...............................................................................................................................13  
Revision History............................................................................................................................................................................14  
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2/14  
TSZ22111 • 15 • 001  
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BD5310xG-CZ Series  
Absolute Maximum Ratings (Ta = 25 °C)  
Parameter  
Power Supply Voltage  
Symbol  
Rating  
Unit  
VDD  
VOUT  
IOUT  
-36 to +42  
-0.3 to +42  
25  
V
V
Output Voltage  
Continuous Output Current  
Storage Temperature Range  
Maximum Junction Temperature  
mA  
°C  
°C  
Tstg  
-55 to +150  
Tjmax  
150  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the  
absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size  
and copper area so as not to exceed the maximum junction temperature rating.  
Thermal Resistance (Note 3)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 5)  
2s2p(Note 6)  
SSOP3A  
Junction to Ambient  
Junction to Top Characterization Parameter (Note 4)  
θJA  
465.9  
48  
265.1  
52  
°C/W  
°C/W  
ΨJT  
(Note 3) Based on JESD51-2A (Still-Air).  
(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface  
of the component package.  
(Note 5) Using a PCB board based on JESD51-3.  
(Note 6) Using a PCB board based on JESD51-7.  
Layer Number of  
Measurement Board  
Material  
Board Size  
Single  
FR-4  
114.3 mm x 76.2 mm x 1.57 mmt  
Top  
Copper Pattern  
Footprints and Traces  
Thickness  
70 μm  
Layer Number of  
Measurement Board  
Material  
Board Size  
4 Layers  
FR-4  
114.3 mm x 76.2 mm x 1.6 mmt  
2 Internal Layers  
Top  
Bottom  
Copper Pattern  
Footprints and Traces  
Thickness Copper Pattern  
70 μm 74.2 mm x 74.2 mm  
Thickness Copper Pattern  
Thickness  
70 μm  
35 μm  
74.2 mm x 74.2 mm  
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3/14  
23.May.2022 Rev.001  
BD5310xG-CZ Series  
Recommended Operating Conditions  
Parameter  
Symbol  
VDD  
Min  
2.7  
-40  
Typ  
12  
Max  
38  
Unit  
V
Power Supply Voltage  
Operating Temperature  
Topr  
+25  
+150  
°C  
Magnetic Characteristics (Unless otherwise specified VDD = 12.0 V Ta = 25 °C)  
Product Name  
Parameter  
Operate Point  
Release Point  
Hysteresis  
Symbol  
Min  
Typ  
Max  
Unit  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
mT  
Comment  
BOP  
-
3.5  
5.0  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
BRP  
1.0  
2.5  
-
BD53103G-CZ  
BHYS  
BOP  
-
1.0  
-
Operate Point  
Release Point  
Hysteresis  
-
7.5  
9.7  
BRP  
2.8  
5.0  
-
BD53104G-CZ  
BD53105G-CZ  
BD53106G-CZ  
BD53107G-CZ  
BD53108G-CZ  
BHYS  
BOP  
-
2.5  
-
Operate Point  
Release Point  
Hysteresis  
-
10.0  
8.5  
13.0  
BRP  
5.5  
-
BHYS  
BOP  
-
1.5  
-
Operate Point  
Release Point  
Hysteresis  
-
12.5  
9.5  
15.9  
BRP  
6.1  
-
BHYS  
BOP  
-
3.0  
-
Operate Point  
Release Point  
Hysteresis  
-
18.0  
12.5  
5.5  
23.0  
BRP  
7.5  
-
BHYS  
BOP  
-
-
Operate Point  
Release Point  
Hysteresis  
-
17.0  
-
28.0  
22.5  
5.5  
33.5  
BRP  
-
BHYS  
-
(Note) Polarity of Magnetic flux density is defined as positive when south pole side of magnet approaches top surface of the device.  
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BD5310xG-CZ Series  
Electrical Characteristics (Unless otherwise specified VDD = 12.0 V Ta = 25 °C)  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
μs  
μA  
V
Comment  
Power-On Time  
tPON  
-
-
-
-
25  
-
-
Output Leakage Current  
Output Low Voltage  
Output Current Limitation  
Output Rise Time  
ILEAK  
VOL  
ILIMIT  
tr  
10  
-
-
0.5  
120  
2
IOUT = +20 mA  
30  
-
55  
-
mA  
μs  
μs  
mA  
V
-
VOUT = 12 V  
RL = 1 kΩ CL = 20 pF  
Output Fall Time  
tf  
-
-
2
Supply Current  
IDD  
-
1.3  
-
1.9  
2.7  
-
-
Under Voltage Lockout  
VDD_UVLO  
2.1  
(Note)The on-chip over temperature protection switches off the output (High-Z).  
(Note)The on-chip under voltage lockout protection switches off the output (High-Z).  
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TSZ22111 • 15 • 001  
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BD5310xG-CZ Series  
Typical Performance Curves  
10.0  
10.0  
8.0  
6.0  
4.0  
2.0  
0.0  
VDD = 12 V  
BD53104G-CZ  
Ta = 25 °C  
BD53104G-CZ  
BOP  
8.0  
6.0  
4.0  
2.0  
0.0  
BOP  
BRP  
BRP  
-50 -25  
0
25 50 75 100 125 150 175  
0
10  
20  
30  
40  
Ambient Temperature: Ta [°C]  
Supply Voltage: VDD [V]  
Figure 1. Operate Point, Release Point vs Ambient  
Temperature  
Figure 2. Operate Point, Release Point vs Supply Voltage  
0.5  
0.5  
VDD = 12 V  
Ta = 25 °C  
IOUT = 20 mA  
IOUT = 20 mA  
0.4  
0.3  
0.2  
0.1  
0.0  
0.4  
0.3  
0.2  
0.1  
0.0  
-50 -25  
0
25 50 75 100 125 150 175  
0
10  
20  
30  
40  
Ambient Temperature: Ta [°C]  
Supply Voltage: VDD [V]  
Figure 4. Output Low Voltage vs Supply Voltage  
Figure 3. Output Low Voltage vs Ambient Temperature  
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BD5310xG-CZ Series  
Typical Performance Curves - continued  
2.0  
2.0  
1.5  
1.0  
0.5  
0.0  
VDD = 12 V  
Ta = 25°C  
1.5  
1.0  
0.5  
0.0  
-50 -25  
0
25 50 75 100 125 150 175  
0
10  
20  
30  
40  
Supply Voltage: VDD [V]  
Ambient Temperature: Ta [°C]  
Figure 6. Supply Current vs Supply Voltage  
Figure 5. Supply Current vs Ambient Temperature  
120  
VDD = 12 V  
100  
80  
60  
40  
20  
0
-50 -25  
0
25 50 75 100 125 150 175  
Ambient Temperature: Ta [°C]  
Figure 7. Output Current Limitation vs Ambient Temperature  
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BD5310xG-CZ Series  
Description of Operations  
(Offset Cancellation)  
VDD  
The Hall elements are shown with an equivalent  
Wheatstone (resistor) bridge circuit. Offset voltage may  
be generated by a differential in this bridge resistance, or  
can arise from changes of resistance due to package or  
bonding stress. A dynamic offset cancellation circuit is  
employed to cancel this offset voltage.  
I
When the Hall elements are connected as shown in  
Figure 8 and a magnetic field is applied perpendicular to  
the Hall elements, a voltage is generated at the  
mid-points of the bridge. This is known as Hall voltage.  
Dynamic offset cancellation switches the wiring to  
redirect the current flow to a 90° angle from its original  
path, and thereby cancels the offset voltage of Hall  
elements.  
B
+
×
Hall Voltage  
-
Only the magnetic signal is maintained in the  
sample/hold circuit process and then released.  
GND  
Figure 8. Equivalent Circuit of Hall Elements  
(Magnetic Field Direction Definition)  
Polarity of Magnetic flux density is defined as positive when south pole side of magnet approaches top surface of the device.  
S
Top Surface  
Top Surface  
S
OUT [V]  
High  
Low  
B [mT]  
BRP  
BOP  
S pole  
0
N pole  
Magnetic Flux Density  
Figure 9. S-pole Detection  
OUT detects only S pole magnetic field. (OUT doesn’t detect N pole.)  
Note that the output voltage may change if the magnetic flux density between the operate point and the release point is  
applied to this IC continuously.  
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BD5310xG-CZ Series  
Operation at Power ON and Under Voltage Lockout  
VDD  
2.7 V  
UVLO OFF  
UVLO ON  
2.1 V  
t
B < BRP, BRP < B < BOP  
B < BRP, BRP < B < BOP  
OUT  
Output State  
Undefined for  
VDD < 2.1 V  
B > BOP  
B > BOP  
t
tPON  
tPON  
Figure 10. Operation at Power ON and UVLO  
After VDD power on, the initial state of OUT is High (Hi-Z).  
After tPON time pass after VDD exceeds the OFF voltage of Under Voltage Lockout (UVLO), OUT becomes L when the  
magnetic field is beyond BOP  
.
When VDD is less than ON voltage of UVLO, OUT becomes High (Hi-Z).  
Magnet Selection  
Neodymium and ferrite are major permanent magnets. Neodymium generally offers greater magnetic power per volume than  
ferrite, thereby enabling miniaturization of magnet. The larger neodymium magnet is, the stronger magnetic flux density is.  
And the farther detection distance is, the weaker it is. Therefore, the proper size and detection distance of the magnet should  
be determined according to the operate point of Hall IC. To increase the magnet’s detection distance, the magnet which is  
thicker or larger sectional area is used.  
Position of the Hall Element  
Output Equivalence Circuit  
(Reference)  
SSOP3A  
2.92  
OUT  
Center of  
sensitive area  
5  
1.47  
OUT  
1.14  
1.26  
2.40  
0.22  
(UNIT: mm)  
Figure 11. Position of the Hall Element  
Figure 12. Output Equivalence Circuit  
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BD5310xG-CZ Series  
Operational Notes  
1. Reverse Connection of Power Supply  
This IC has a built-in reverse supply voltage protection circuit that prevents damage to the IC. Do not use in a situation  
that exceeds the absolute maximum ratings of built-in reverse supply voltage protection circuit.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3. Ground Voltage  
Except for pins built-in reverse protection, ensure that no pins are at a voltage below that of the ground pin at any time,  
even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
6. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and  
routing of connections.  
7. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
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BD5310xG-CZ Series  
Operational Notes – continued  
8. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
9. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
10. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 13. Example of Monolithic IC Structure  
11. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
12. Thermal Shutdown Circuit (TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the  
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj  
falls below the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from  
heat damage.  
13. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
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BD5310xG-CZ Series  
Ordering Information  
B
D
5
3
1
0
x
G
-
CZTL  
Sensitivity BOP (Typ)  
3: 3.5 mT  
4: 7.5 mT  
5: 10.0 mT  
6: 12.5 mT  
7: 18.0 mT  
8: 28.0 mT  
Product Rank  
C: for Automotive  
Package  
G: SSOP3A  
Packaging and forming specification  
TL: Embossed tape and reel  
Marking Diagram  
SSOP3A (TOP VIEW)  
Part Number Marking  
LOT Number  
Part Number  
Marking  
Package  
SSOP3A  
Orderable Part  
Number  
AE  
AF  
AG  
AH  
AJ  
AK  
BD53103G-CZTL  
BD53104G-CZTL  
BD53105G-CZTL  
BD53106G-CZTL  
BD53107G-CZTL  
BD53108G-CZTL  
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BD5310xG-CZ Series  
Physical Dimension and Packing Information  
Package Name  
SSOP3A  
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BD5310xG-CZ Series  
Revision History  
Date  
Revision  
001  
Changes  
23.May.2022  
New Release  
.www.rohm.com  
© 2022 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0M2M0F421070-1-2  
14/14  
23.May.2022 Rev.001  
Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHMs Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  

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