BD5354 [ROHM]
Free Delay Time Setting CMOS Voltage Detector IC Series; 免费延时时间设定CMOS电压检测器IC系列型号: | BD5354 |
厂家: | ROHM |
描述: | Free Delay Time Setting CMOS Voltage Detector IC Series |
文件: | 总10页 (文件大小:270K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Voltage Detector IC Series
Free Delay Time Setting
CMOS Voltage Detector IC Series
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
No.09006EBT03
Description
ROHM’s BD52□□G/FVE and BD53□□G/FVE series are highly accurate, low current consumption reset IC series with a
built-in delay circuit. The lineup was established with tow output types (Nch open drain and CMOS output) and detection
voltages range from 2.3V to 6.0V in increments of 0.1V, so that the series may be selected according the application at
hand.
Features
1) Detection voltage: 2.3V to 6.0V (Typ.), 0.1V steps
2) High accuracy detection voltage: ±1.0%
3) Ultra-low current consumption: 0.8µA (Typ.)
4) Nch open drain output (BD52□□G/FVE), CMOS output (BD53□□G/FVE)
5) Compact packages VSOF5: BD52□□FVE, BD53□□FVE
SSOP5: BD52□□G, BD53□□G
Applications
All electronic devices that use micro controllers and logic circuits
Selection Guide
No.
Specifications
Description
1
Output Circuit Format
Detection Voltage
Package
2:Open Drain Output, 3:CMOS Output
Example: Displays VS over a 2.3V to 6.0V range in
0.1V increments.
Part Number : BD5
2
3
1
2
3
G:SSOP5 / FVE:VSOF5
Lineup
Detection
Voltage
6.0V
5.9V
5.8V
5.7V
5.6V
5.5V
5.4V
5.3V
5.2V
5.1V
5.0V
4.9V
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
Part
Detection
Part
Detection
Part
Detection
Voltage
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
Part
Marking
Marking
Marking
Marking
Number
BD5260
BD5259
BD5258
BD5257
BD5256
BD5255
BD5254
BD5253
BD5252
BD5251
BD5250
BD5249
BD5248
BD5247
BD5246
BD5245
BD5244
BD5243
BD5242
Voltage
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
Number
BD5241
BD5240
BD5239
BD5238
BD5237
BD5236
BD5235
BD5234
BD5233
BD5232
BD5231
BD5230
BD5229
BD5228
BD5227
BD5226
BD5225
BD5224
BD5223
Voltage
6.0V
5.9V
5.8V
5.7V
5.6V
5.5V
5.4V
5.3V
5.2V
5.1V
5.0V
4.9V
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
Number
BD5360
BD5359
BD5358
BD5357
BD5356
BD5355
BD5354
BD5353
BD5352
BD5351
BD5350
BD5349
BD5348
BD5347
BD5346
BD5345
BD5344
BD5343
BD5342
Number
BD5341
BD5340
BD5339
BD5338
BD5337
BD5336
BD5335
BD5334
BD5333
BD5332
BD5331
BD5330
BD5329
BD5328
BD5327
BD5326
BD5325
BD5324
BD5323
PW
PV
PU
PT
PS
PR
PQ
PP
PN
PM
PL
PB
PA
RW
RV
RU
RT
RS
RR
RQ
RP
RN
RM
RL
RB
RA
QV
QU
QT
QS
QR
QQ
QP
QN
QM
QL
QK
QJ
MV
MU
MT
MS
MR
MQ
MP
MN
MM
ML
MK
MJ
PK
PJ
RK
RJ
PH
PG
PF
PE
PD
PC
RH
RG
RF
RE
RD
RC
MH
MG
MF
ME
MD
QH
QG
QF
QE
QD
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.06 - Rev.B
1/9
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
Absolute maximum ratings (Ta=25°C)
Parameter
Power Supply Voltage
Symbol
Limits
-0.3 ~ +10
GND-0.3 ~ +10
GND-0.3 ~ VDD+0.3
540
Unit
V
VDD-GND
Nch Open Drain Output
CMOS Output
Output Voltage
VOUT
Pd
V
*1*3
Power
SSOP5
VSOF5
mW
*2*3
Dissipation
210
Operating Temperature
Topr
Tstg
-40 ~ +105
-55 ~ +125
°C
°C
Ambient Storage Temperature
*1 Use above Ta=25°C results in a 5.4mW loss per degree.
*2 Use above Ta=25°C results in a 2.1mW loss per degree.
*3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.
Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Limit
Parameter
Detection Voltage
Symbol
VDET
Condition
VDD=HL, RL=470kΩ
Unit
Min.
VDET(T)
×0.99
Typ.
Max.
VDET(T)
×1.01
*1
VDET(T)
V
V
DET =2.3-3.1V
-
0.80
0.85
0.90
0.95
0.75
0.80
0.85
0.90
-
2.40
VDET =3.2-4.2V
VDET =4.3-5.2V
VDET =5.3-6.0V
-
2.55
µA
Circuit Current when ON
Circuit Current when OFF
IDD1
IDD2
VDD=VDET-0.2V
VDD=VDET+2.0V
-
2.70
-
2.85
2.25
V
DET =2.3-3.1V
-
-
VDET =3.2-4.2V
VDET =4.3-5.2V
VDET =5.3-6.0V
2.40
µA
-
2.55
-
2.70
VOL≤0.4V, Ta=25~105°C, RL=470kΩ
VOL≤0.4V, Ta=-40~25°C, RL=470kΩ
VDS=0.5V VDD=1.2V
0.95
1.20
0.4
-
Operating Voltage Range
‘Low’ Output Current (Nch)
VOPL
IOL
V
-
-
1.2
-
mA
-
VDS=0.5V VDD=2.4V
VDS=0.5V VDD=4.8V VDET=2.3-4.2V
2.0
0.7
5.0
1.4
-
VDS=0.5V VDD=6.0V VDET=4.3-5.2V
VDS=0.5V VDD=8.0V VDET=5.3-6.0V
0.9
1.1
1.8
2.2
-
‘High’ Output Current (Pch)
Leak Current when OFF
IOH
mA
-
*1
Ileak VDD=VDS=10V
VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ
-
-
0.1
VDD
×0.60
µA
V
VDD
×0.30
VDD
×0.40
VDD
×0.30
VDD
×0.35
VDD
×0.40
5.5
VDD
×0.45
VDD
×0.50
VDD
×0.50
9
VDD
×0.60
VDD
×0.60
VDD
×0.60
12.5
-
VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ
VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ
VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ
CT pin Threshold Voltage
VCTH
*1
*1
Output Delay Resistance
CT pin Output Current
RCT
ICT
VDD=VDET×1.1 VCT=0.5V
VCT=0.1V VDD=0.95V
VCT=0.5V VDD=1.5V
MΩ
15
40
µA
150
240
-
Detection Voltage
VDET/∆T Ta=-40°C to 105°C
-
±100
±360 ppm/°C
Temperature coefficient
VDET
VDET
VDET
V
Hysteresis Voltage
∆VS VDD=LHL, RL=470kΩ
×0.03
×0.05
×0.08
VS(T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Designed Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
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2009.06 - Rev.B
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
Block Diagrams
BD52□□G/FVE
BD53□□G/FVE
VDD
V
DD
VOUT
VOUT
Vref
Vref
GND
CT
GND
CT
Fig.1
Fig.2
TOP VIEW
TOP VIEW
SSOP5
VSOF5
PIN No.
Symbol
VOUT
VDD
Function
Reset Output
PIN No.
Symbol
VOUT
SUB
Function
1
2
3
4
1
2
Reset Output
Substrate*
Power Supply Voltage
GND
GND
Capacitor connection terminal for
output delay time
3
CT
N.C.
Unconnected Terminal
Capacitor connection terminal for
output delay time
4
5
GND
VDD
GND
5
CT
Power Supply Voltage
*Connect the substrate to GND.
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2009.06 - Rev.B
3/9
© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
Reference Data (Unless specified otherwise, Ta=25°C)
2.0
1.5
1.0
0.5
0.0
18
15
12
9
45
40
35
30
25
20
15
10
5
BD5242G/FVE
BD5242G/FVE
】
BD5342G/FVE
【
】
【
【
】
VDD=2.4V
VDD=8.0V
6
VDD=6.0V
VDD=4.8V
3
VDD=1.2V
2.0
0
0
0
1
2
3
4
5
6
7
8
9
10
0.0
0.5
1.0
1.5
2.5
0
1
2
3
4
5
6
VDD SUPPLY VOLTAGE VDD[V]
DRAIN-SOURCE VOLTAGE VDS[V]
:
:
DRAIN-SOURCE VOLTAGE VDS[V]
:
Fig.3 Circuit Current
Fig.4 “Low” Output Current
Fig.5 “High” Output Current
9
8
7
6
5
4
3
2
1
0
1.0
450
400
350
300
250
200
150
100
50
BD5242G/FVE
【
】
BD5242G/FVE
【 】
BD5242G/FVE
【
】
0.8
0.6
0.4
0.2
0.0
Ta=25
℃
Ta=25
℃
0
0.0
0.5
1.0
1.5
2.0
2.5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
1
2
3
4
5
VDD SUPPLY VOLTAGE VDD[V]
:
V
DD SUPPLY VOLTAGE VDD[V]
:
VDD SUPPLY VOLTAGE VDD[V]
:
Fig.7 Operating Limit Voltage
Fig.8 CT Terminal Current
Fig.6 I/O Characteristics
5.4
5.0
4.6
4.2
3.8
3.4
1.5
1.5
1.0
0.5
0.0
BD5242G/FVE
【
】
BD5242G/FVE
BD5242G/FVE
【 】
【
】
Low to high(VDET+ΔVDET
)
1.0
0.5
0.0
High to low(VDET
)
~
~
-40
0
40
80
-40 -20
0
20 40 60 80 100
-40 -20
TEMPERATURE Ta[ ]
℃
0
20 40 60 80 100
TEMPERATURE Ta[
]
℃
TEMPERATURE Ta[
]
℃
:
:
:
Fig.9 Detection Voltage
Release Voltage
Fig.10 Circuit Current when ON
Fig.11 Circuit Current when OFF
1.5
1.0
0.5
0.0
10000
13
12
11
10
9
8
7
6
5
BD5242G/FVE
BD5242G/FVE
BD5242G/FVE
【
】
【
】
【
】
1000
100
10
1
4
0.1
3
2
1
0
0.01
0.001
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
0.0001
0.001
0.01
0.1
TEMPERATURE Ta[
]
℃
TEMPERATURE Ta[
]
℃
:
:
CAPACITANCE OF CT CCT[μF]
:
Fig.12 Operating Limit Voltage
Fig.14 Delay Time (TPLH) and
Fig.13 Ct Terminal Circuit Resistance
CT Terminal External Capacitance
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.06 - Rev.B
4/9
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
Setting of Detector Delay Time
This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal.
Delay time at the rise of VDD
voltage(VDET+∆VDET
TPLH:Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release
)
V
DD-VCTH
TPLH = -CCT×RCT×ln
VDD
C CT
:
CT pin Externally Attached Capacitance
RCT : CT pin Internal Impedance (P.2 RCT refer.)
VCTH
:
CT pin Threshold Voltage(P.2 VCTH refer.)
Ln : Natural Logarithm
Reference Data of Falling Time (TPHL) Output
Examples of Falling Time (TPHL) Output
Part Number
BD5227G
tPHL[µs] -40°C
tPHL[µs] ,+25°C
tPHL[µs],+105°C
30.8
26.8
30
26
28.8
24.8
BD5327G
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
Explanation of Operation
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD52□□G/FVE series uses an open drain
output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in
this case becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
RL
Q2
Q1
R1
R2
R1
R2
VDD
RESET
Vref
Vref
RESET
VOUT
VOUT
Q1
Q3
Q3
R3
R3
GND
GND
CT
CT
Fig.15 (BD52□□Type Internal Block Diagram)
Fig.16 (BD53□□Type Internal Block Diagram)
Timing Waveforms
Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in
Fig.15 and 16).
1
When the power supply is turned on, the output is unsettled from
DD
V
after over the operating limit voltage (VOPL) until TPHL. There fore it is
possible that the reset signal is not outputted when the rise time of
VDD is faster than TPHL.
When VDD is greater than VOPL but less than the reset release
voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT)
VDET+ΔVDET
⑤
VDET
2
VOPL
0V
voltages will switch to L.
CT
V
3
1/2 VDD
If VDD exceeds the reset release voltage (VDET+∆VDET), then
VOUT switches from L to H (with a delay to the CT terminal).
4
If VDD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply fluctuation,
VOUT switches to L (with a delay of TPHL).
OUT
V
TPLH
TPHL
TPLH
TPHL
5
The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (∆VDET). The
system is designed such that the output does not flip-flop with power
supply fluctuations within this hysteresis width, preventing
malfunctions due to noise.
①
②
③
④
Fig.17
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2009.06 - Rev.B
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
Circuit Applications
1) Examples of a common power supply detection reset circuit
VDD1
VDD2
Application examples of BD52□□G/FVE series (Open
Drain output type) and BD53□□G/FVE series (CMOS
output type) are shown below.
RL
Microcontroller
BD52□□□
CASE1: the power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
CT
CL
(Noise-filtering
Capacitor)
Use the open drain output type (BD52□□G/FVE) attached
a load resistance (RL) between the output and VDD2. (As
shown Fig.15)
GND
Fig.18 Open Collector Output Type
CASE2: the power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use CMOS output type (BD53□□G/FVE) or open drain
output type (BD52□□G/FVE) attached a load resistance
(RL) between the output and Vdd1. (As shown Fig.16)
VDD1
Microcontroller
BD53□□□
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform of
the rise and fall of the output voltage (VOUT).
CT
CL
(Noise-filtering
Capacitor)
GND
Fig.19 CMOS Output Type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltages
resets the microcontroller.
VDD1
VDD2
VDD3
RL
BD52□□□
BD52□□□
RST
microcontroller
NO.1
NO.2
CT
CT
GND
Fig.20
When there are many power supplies of the system, power supplies VDD1 and VDD2 are being monitored separately, and it is
necessary to reset the microcomputer, it is possible to use an OR connection on the open drain output type BD52□□G/FVE
series to pull-up to the desired voltage (VDD3) as shown in Fig.17 and make the output “High” voltage matches the power
supply voltage VDD3 of the microcontroller.
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2009.06 - Rev.B
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
3) Examples of the power supply with resistor dividers
In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through
current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output
oscillatory state).
(Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level
switches from “High” to “Low” or vice versa.)
V1
IDD
R2
R1
I1
Through
Current
DD
V
BD52□□
BD53□□
OUT
V
CIN
L
C
GND
VDD
VDET
0
Fig.21
A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to
descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection
voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through output
“Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again causes the
through current to flow and the voltage drop. This process is repeated, resulting in oscillation.
Temp - IDD(BD52xx)
VDD - IDD Peak Current Ta=25°C
BU43xx
BU42xx
BD52xx
BD53xx
VDD3V
VDD5V
VDD7V
VDD10V
10
1
0.4
0.3
0.2
0.1
0
0.1
0.01
0.001
3
4
5
6
7
8
9
10
-50 -30 -10
10
30
50
70
90
110 130
VDD[V]
Temp[°C]
Fig.22 Current Consumption vs. Power Supply Voltage
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
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2009.06 - Rev.B
7/9
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
Operation Notes
1 . Absolute maximum range
Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the
failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given
when a specific mode to be beyond absolute maximum ratings is considered.
2 . GND potential
GND terminal should be a lowest voltage potential every state.
Please make sure all pins, which are over ground even if, include transient feature.
3 . Electrical Characteristics
Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature,
supply voltage, and external circuit.
4 . Bypass Capacitor for Noise Rejection
Please put into the capacitor of 1µF or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT
pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently
for the point.
5 . Short Circuit between Terminal and Soldering
Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the
IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is
mistaken the IC may be destroyed.
6 . Electromagnetic Field
Mal-function may happen when the device is used in the strong electromagnetic field.
7 . The VDD line inpedance might cause oscillation because of the detection current.
8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition.
10. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause
unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed
between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak
resistance. If 10Mꢀ leakage is assumed between the CT terminal and the GND terminal, 1Mꢀ connection between the CT
terminal and the VDD terminal would be recommended. The value of RCT depends on the external resistor that is
connected to CT terminal, so please consider the delay time that is decided by τ×RCT×CCT changes.
11. External parameters
The recommended parameter range for CT is 100pF~0.1µF and RL is 50kꢀ~1Mꢀ. There are many factors (board layout,
etc) that can affect characteristics. Please verify and confirm using practical applications.
12. Power on reset operation
Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.
13. Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be
certain to use proper discharge procedure before each process of the test operation.
To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any
equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer
and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is
OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.
14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic
unsettled, the couple capacitance, GND pattern of width and leading line must be considered.
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2009.06 - Rev.B
8/9
© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
Part Number Selection
B
D
5
2
2
3
G
-
T
R
BD52: Adjustable Delay Time
CMOS Reset IC
Reset Voltage Value
23: 2.3V to (0.1V step)
60: 6.0V
Package
Taping Specifications
Embossed Taping
G: SSOP5
Open Drain Type
FVE: VSOF5
BD53: Adjustable Delay Time
CMOS Reset IC
CMOS Output Type
SSOP5
<Tape and Reel information>
°
°
+
−4
2.9 0.2
6
°
4
Tape
Embossed carrier tape
3000pcs
5
4
Quantity
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
1pin
+0.05
0.13
−0.03
+0.05
−0.04
0.42
0.1
0.95
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
Reel
(Unit : mm)
∗
VSOF5
<Tape and Reel information>
1.6 0.05
1.0 0.05
Tape
Embossed carrier tape
3000pcs
5
4
Quantity
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1pin
1
2
3
0.13 0.05
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
0.22 0.05
0.5
Reel
(Unit : mm)
∗
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.06 - Rev.B
9/9
Notice
N o t e s
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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