BD60223FP_技术文档

Datasheet

36V Stepping Motor Driver

BD60223FP

General Description

Key Specifications

BD60223FP is a bipolar low-consumption driver that

driven by PWM current. Rated power supply voltage of

the device is 36 V, and rated output current is 1.5 A. CLK-

IN driving mode is adopted for input interface, and

excitation mode is corresponding to FULL STEP mode,

HALF STEP mode, QUARTER STEP and 1/16 STEP

mode via a built-in DAC. In the method of current decay,

the FAST DECAY/SLOW DECAY ratio can set without any

limitation, and all available modes can be controlled in the

most appropriate way. In addition, the power supply can

be driven by one single system, which simplifies the

design.

■

Range of Power Supply Voltage

Rated Output Current (continuous)

Rated Output Current (peak value)

Range of Operating Temperature -25°C to +85°C

Output ON Resistance

8V to 28V

1.5A

2.0A

0.55Ω(Typ)

(total of upper and lower resistors)

Package

HSOP25

W(Typ) x D(Typ)x H(Max)

13.60mm x 7.80mm x 2.11mm

Features

■

Rated Output Current(DC)1.5A

Low ON Resistance DMOS Output

CLK-IN Drive Mode

PWM Constant Current (the other excitation

method)

■

Built-in Spike Noise Blanking Function (external

noise filter is unnecessary)

■

Full-, Half-, Quarter-, 1/16 Step Functionality

Free Timing Excitation Mode Switch

Current Decay Mode Switch Function

(linearly variable FAST/SLOW DECAY ratio)

Normal Rotation and Reverse Rotation Switching

Function

Typical Application Circuit

■

GND

TEST

■

Power Save Function

Built-in Logic Input Pull-down Resistor

Power-on Reset Function

Thermal Shutdown Circuit (TSD)

Over-current Protection Circuit(OCP)

Under Voltage Lock Out Circuit (UVLO)

Over Voltage Lock Out Circuit (OVLO)

Ghost Supply Prevention (protects against

malfunction when power supply is disconnected)

Adjacent Pins Short Protection

PS

CLK

MODE1

MODE0

CW_CCW

ENABLE

VCC1

OUT1A

■

VREF

OUT1B

RNF1

RNF1S

VCC2

Application

PPC, Multi-function printer, Laser beam printer, and

■

OUT2A

CR

Ink-jet printer, Monitoring camera and WEB camera,

Sewing machine, Photo printer, FAX, Scanner and

Mini printer, Toy and Robot

OUT2B

RNF2

MTH

RNF2S

GND

Figure 1. BD60223FP application circuit diagram

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration

Block Diagram

[TOP VIEW]

6

TEST

MODE1

MODE0

CW_CCW

ENABLE

CLK

1

2

3

4

5

6

25 PS

TSD

OCP

5

CLK

24 N.C.

23 MTH

22 VREF

Translator

14

GND

OVLO

UVLO

MODE1

MODE0

1

2

RESET

25 PS

3

4

CW_CCW

ENABLE

CR

21

20

GND

TEST

＋

－

VREF 22

DAC

FIN

19

VCC1

FIN

＋

－

18 OUT1A

RNF1S

RNF2S

15

16

OUT1B

RNF1

VCC2

OUT2A

RNF2S

7

8

9

＋

－

19 VCC1

18 OUT1A

17 RNF1S

16 RNF1

15 OUT1B

17 RNF1S

Blank time

PWM control

RNF2 10

N.C. 11

7

VCC2

8

OUT2A

OUT2B

CR 21

OSC

12

OUT2B 12

N.C. 13

RNF2

10

9

Mix decay

control

GND

14

MTH

23

RNF2S

GND

Regulator

20

Figure 2. Pins Configuration Diagram

Figure 3. BD60223FP Block Diagram

Pin Description

No.

Pin name

Function

Pin name

Function

MODE1

MODE0

Motor excitation mode setting pin

GND

Ground pin

H bridge output pin

1

2

14

OUT1B

15

Connection pin of resistor for output

CW_CCW Motor rotating direction setting pin

RNF1

3

16

current detection

Input pin of current detection

comparator

ENABLE

CLK

RNF1S

OUT1A

VCC1

4

5

6

Output enable pin

17

18

19

Clock input pin for advancing the

electrical angle.

Pin for testing

H bridge output pin

Power supply pin

TEST

(Used by connecting with GND)

Pin for Thermal

FIN

7

FIN

20

FIN

GND

CR

(Used by connecting with GND)

VCC2

OUT2A

Ground pin

Power supply pin

Connection pin of CR for setting

chopping frequency

8

H bridge output pin

21

Input pin of current detection

comparator

RNF2S

RNF2

VREF

MTH

9

22

23

Output current value setting pin

Current decay mode setting pin

Connection pin of resistor for output

current detection

10

N.C.

OUT2B

N.C.

PS

11

12

13

Non connection

H bridge output pin

Non connection

24

25

Non connection

Power save pin

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Absolute Maximum Rating (Ta=25°C)

Item

Symbol

Rated Value

Unit

Supply Voltage

V_CC1,V_CC2

V_IN

-0.2 to +36.0

-0.2 to +5.5

0.7

V

Input Voltage for Control Pin

RNF Maximum Voltage

V

V_RNF

Maximum Output Current (DC)

Maximum Output Current (PEAK) ^{(Note 2)}

Storage Temperature Range

Maximum Junction Temperature

I_OUT

1.5^{(Note 1)}

2.0^{(Note 1)}

-55 to +150

+150

A/Phase

°C

I_OUTPEAK

Tstg

Tjmax

°C

(Note 1) Do not, however exceed Tjmax=150°C.

(Note 2) Pulse width tw≤1ms, duty 20%.

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Recommended Operating Condition

Item

Symbol

Rated Value

Unit

Operating Temperature Range

Supply Voltage

Topr

V_CC1,V_CC2

I_OUT

-25 to +85

8 to 28

°C

V

Maximum Output Current (DC)

1.2^{(Note 3)}

A/Phase

(Note 3) Not exceeding Tj=150°C.

Thermal Resistance^{(Note 4)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 6)}

2s2p^{(Note 7)}

HSOP25

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 5)}

θ_JA

102.4

9

46.8

5

°C/W

Ψ_JT

(Note 4) Based on JESD51-2A(Still-Air).

(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 6) Using a PCB board based on JESD51-3.

(Note 7) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

4 Layers

Top

Copper Pattern

Bottom

Copper Pattern

74.2mm x 74.2mm

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

70μm

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Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC1, VCC2=24V)

Specification

Item

Symbol

Unit

Condition

Min

Typ

Max

[Whole]

Circuit Current at Standby

Circuit Current

I_CCST

I_CC

-

10

µA

PS=L

2.5

5.0

mA

PS=H, VREF=3V

[Control Input]

H-level Input Voltage

L-level Input Voltage

H-level Input Current

L-level Input Current

[Control Input] ( PS )

H-level Input Voltage

L-level Input Voltage

H-level Input Current

L-level Input Current

[Output]

V_IN1H

V_IN1L

I_IN1H

I_IN1L

2.0

-

V

0.8

100

-

35

-10

50

0

µA

V_IN1=5V

V_IN1=0V

V_IN2H

V_IN2L

I_IN2H

I_IN2L

2.0

-

V

0.8

300

-

105

-10

150

0

µA

V_IN2=5V

V_IN2=0V

I_OUT=±1.0A (total of upper and

lower resistors)

Output ON Resistance

Output Leak Current

[Current Control]

R_ON

-

0.55

-

0.80

10

Ω

I_LEAK

µA

RNFXS Input Current

RNFX Input Current

VREF Input Current

VREF Input Voltage Range

MTH Input Current

MTH Input Voltage Range

I_RNFS

I_RNF

-2.0

-80

-2.0

0

-0.1

-40

-0.1

-

µA

V

RNFXS=0V

RNFX=0V

VREF=0V

I_VREF

V_VREF

I_MTH

-

3.0

-

-2.0

0

-0.1

-

µA

V

MTH=0V

V_MTH

t_ONMIN

V_CTH

3.5

1.5

0.621

Minimum ON Time

(Blank time)

0.3

0.579

0.7

0.600

µs

V

C=1000pF, R=39kΩ

Comparator Threshold

VREF=3V

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Function Explanation

CLK/Clock input Pin for advancing the electrical angle

CLK is working on rising edge. The Electrical angle advances by one for each CLK input.

Motor’s misstep will occur if noise gets mixed with the CLK pin, so design the pattern there is no noise plunging.

MODE0, MODE1/Motor Excitation Mode Setting Pin

Set the motor excitation mode

MODE0

MODE1

Excitation Mode

L

H

L

FULL STEP

HALF STEP

H

QUARTER STEP

1/16 STEP

H

Refer to the P.14 for the timing chart and motor torque vector of various excitation modes.

Unrelated to CLK, change of setting is forcibly reflected. (refer to P.16).

CW_CCW Pin/Motor rotating direction setting

Set the motor’s rotating direction. Change of setting is reflected by the CLK rising edge immediately after that. (refer to P.15)

CW_CCW

Rotating Direction

L

Clockwise (CH2’s current is outputted with a phase lag of 90°on the basis of CH1’s current)

Counter Clockwise(CH2’s current is outputted with a phase lead of 90°on the basis of CH1’s

H

current)

ENABLE Pin/Output enable Pin

Turn off forcibly all the output transistors (motor output is open).

When ENABLE=L, input to CLK is blocked, and phase advance operation of internal translator circuit is stopped.

However, when the excitation mode (MODE 0, MODE 1) is switched in the ENABLE = L periode, The switched mode is valid

in the excitation mode when the ENABLE Pin returns from Low to High. (refer to P. 16)

ENABLE

Motor Output

OPEN (electrical angle maintained)

ACTIVE

L

H

PS/Power save Pin

PS can make circuit standby state and motor output OPEN. In standby state, translator circuit is reset (initialized) and electrical

angle is initialized.

Be careful because there is a delay of 40µs(Max), as PS=L→H, until it is returned from standby state to normal state and the

motor output becomes ACTIVE (refer to P.13).

PS

Status

Standby State(RESET)

ACTIVE

L

H

The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows.

(refer to P.14)

Excitation Mode

Initial Electrical Angle

FULL STEP

45°

HALFSTEP

QUARTERSTEP

1/16 STEP

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Function Explanation – continued

VCC1, VCC2/Power supply Pin

Motor’s drive current is flowing in it, so the wire is thick, short and has low impedance. Voltage VCC may have great fluctuation,

so arrange the bypass capacitor of about 100µF to 470µF as close to the pin as possible and adjust the voltage VCC is stable.

Increase the capacity as needed especially, when a large current is used or those motors that have great back electromotive

force are used.

In addition, for the purpose of reducing of power supply’s impedance in wideband, it is recommended to set parallel connection

of multi-layered ceramic capacitor of 0.01µF to 0.1µF etc. Extreme care must be used to make sure that the voltage VCC

does not exceed the rating even for a moment. VCC1 and VCC2 are shorted inside IC, but be sure to short externally VCC1

and VCC2 when using. If used without shorting, malfunction or destruction may occur because of concentration of current

routes etc. Still more, in the power supply pin, there is built-in clamp component for preventing of electrostatic destruction.

When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp

component operates, as a result there is the danger of destruction, so be sure that the absolute maximum rating must not be

exceeded. It is effective to mount a Zener diode of about the absolute maximum rating. Moreover, the diode for preventing of

electrostatic destruction is inserted between VCC pin and GND pin, as a result there is the danger of IC destruction if reverse

voltage is applied between VCC pin and GND pin, so be careful.

GND/Ground Pin

In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, the wiring

impedance from this pin is made as low as possible to achieve the lowest electrical potential no matter what operating state

it can be. Moreover, design patterns not to have any common impedance with other GND patterns.

OUT1A, OUT1B, OUT2A, OUT2B/H Bridge output Pin

Motor’s drive current is flowing in it, so the wire is thick, short and has low impedance. It is also effective to add a Schottky

diode if output has positive or negative great fluctuation when large current is used. For example, counter electromotive

voltage etc. Moreover, in the output pin, there is built-in clamp component for preventing of electrostatic destruction. When a

steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp component

operates, as a result there is the danger of even destruction, so be sure that the absolute maximum rating must not exceeded.

RNF1, RNF2/Connection Pin of resistor for detecting of output current

Connect the resistor of 0.1Ω to 0.3Ω for current detection between this pin and GND. Determine the resistor so that power

consumptionW=I_OUT²･R [W] of the current-detecting resistor does not exceed the power dissipation of the resistor. In addition,

it has a low impedance and does not have a common impedance with other GND patterns because motor’s drive current

flows in the pattern through RNF Pin to current-detecting resistor to GND. Do not exceed the rating because there is the

possibility of circuits’malfunction etc., if RNF voltage has exceeded the maximum rating (0.7V). Moreover, be careful because

if RNF pin is shorted to GND, large current flows without normal PWM constant current control, then there is the danger that

OCP or TSD will operate. If RNF pin is open, then there is the possibility of such malfunction as output current does not flow

either, so do not let it open.

RNF1S, RNF2S/Input Pin of current detection comparator

In this series, RNFS pin, which is the input pin of current detection comparator, is independently arranged in order to decrease

the lowering of current-detecting accuracy caused by the wire impedance inside the IC of RNF pin. Therefore, be sure to

connect RNF pin and RNFS pin together when using in the case of PWM constant current control. In addition, because the

wires from RNFS pin is connected near the current-detecting resistor in the case of interconnection, the lowering of current-

detecting accuracy, which is caused by the impedance of board pattern between RNF pin and the current-detecting resistor,

can be decreased. Moreover, design the pattern there is no noise plunging. In addition, be careful because if pins of RNF1S

and RNF2S are shorted to GND, large current flows without normal PWM constant current control and, then there is the

danger that OCP or TSD will operate.

VREF/Output current value setting Pin

This is the pin to set the output current value. It can be set by VREF voltage and current-detecting resistor (RNF resistor).

푉푅퐸퐹

퐼_푂푈푇

=

× 0.7071/ ꢀ푁ꢁ

[A] (FULL Step)

5

^푉푅퐸퐹/ ꢀ푁ꢁ

[A] (ALL step modes except FULL Step)

5

Where:

I_OUT

is the output current.

VREF is the voltage of output current value-setting pin.

RNF is the current-detecting resistor.

Avoid using it with VREF pin open because if VREF pin is open, the input is unsettled, and the VREF voltage increases, and

then there is the possibility of such malfunctions as the setting current increases and a large current flows etc. Keep to the

input voltage range because if the voltage of 3V or more is applied on VREF pin, then there is also the danger that a large

current flows in the output and so OCP or TSD will operate. Besides, select the resistance value in consideration of the

outflow current (Max 2µA) if it is inputted by resistance division. The minimum current, which can be controlled by VREF

voltage, is determined by motor coil’s L, R values and minimum ON time because there is a minimum ON time in PWM drive.

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Function Explanation – continued

CR/Connection pin of CR for setting chopping frequency

This is the pin to set the chopping frequency of output. Connect the external C(470pF to 1500pF) and R(10kΩ to 200kΩ) to

GND. Refer to P9.

Interconnect from external components to GND not to have a common impedance with other GND patterns. In addition, carry

out the wire pattern design it keeps away such steep pulses as square wave etc. and has little noise plunging. Mount the two

components of C and R if being used by PWM constant current control because normal PWM constant current control

becomes impossible if CR Pin is open or it is biased externally.

MTH/Current decay mode-setting Pin

This is the pin to set the current decay mode. Current decay mode can be optionally set according to input voltage.

MTH pin input voltage[V]

Current decay mode

0 to 0.3

SLOW DECAY

MIX DECAY

0.4 to 1.0

1.5 to 3.5

FAST DECAY

Connect to GND if using at SLOW DECAY mode.

Avoid using with MTH pin open because if MTH pin is open, the input is unsettled, and then there is the danger that PWM

operation becomes unstable. Besides, select the resistance value in consideration of the outflow current (Max 2µA) if it is

inputted by resistance division.

TEST/Pin for inspection

This pin is used for delivery inspection on IC, and shall be grounded before use.

In addition, malfunctions can be caused by application without grounding.

NC

This pin is unconnected electrically with IC internal circuit.

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Protection Circuits

Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises 175°C (Typ) or

more, the motor output becomes OPEN. Also, when the temperature returns to 150°C (Typ) or less, it automatically returns

to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive

can lead to destruction.

Over Current Protection (OCP)

This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted

each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition

when the regulated current flows for 4µs (Typ). It returns with power reactivation or a reset of the PS pin. The over current

protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor output shorts, and

is not meant to be used as protection or security for the set. Therefore, sets should not be designed to take into account

this circuit’s functions. After OCP operating, if irregular situations continue and the return by power reactivation or a reset

of the PS pin is carried out repeatedly, then OCP operates repeatedly and the IC may generate heat or otherwise deteriorate.

When the L value of the wiring is great due to the wiring being long, if the output pin voltage jumps up and the absolute

maximum values can be exceeded after the over current has flowed, there is a possibility of destruction. Also, when current

which is the output current rating or more and the OCP detection current or less flows, the IC can heat up to Tjmax=150°C

or more and can deteriorate, so current which exceeds the output rating should not be applied.

Under Voltage Lock Out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under

voltage. When the applied voltage to the VCC pin goes 5V (Typ) or less, the motor output is set to OPEN. This switching

voltage has a 1V (Typ) hysteresis to prevent false operation by noise etc. Be aware that this circuit does not operate during

power save mode. Also, the electrical angle is reset when the UVLO circuit operates.

Over Voltage Lock Out (OVLO)

This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage.

When the applied voltage to the VCC pin goes 32V (Typ) or more, the motor output is set to OPEN. This switching voltage

has a 1V (Typ) hysteresis and a 4µs (Typ) mask time to prevent false operation by noise etc.

Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value

for power supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Be aware that this

circuit does not operate during power save mode.

Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a signal (logic input, MTH, VREF) is input when there is no power supplied to this IC, there is a function which prevents

a malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic destruction

prevention diode from these input pins to the VCC. Therefore, there is no malfunction of the circuit even when voltage is

supplied to these input pins while there is no power supply.

Operation Under Strong Electromagnetic Field

The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is

found when using the IC in a strong electromagnetic field.

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PWM Constant Current Control

1) Current control operation

The output current increases due to the output transistor turned on. When the voltage on the RNF pin, the output current is

converted it due to connect the external resistance to RNF pin, reaches the voltage value set by the internal 4-bit DAC and

the VREF input voltage, the current limit comparator engages and enters current decay mode. Thereafter the output turned

on again after a period of time determined the CR pin. The process repeats itself constantly.

2) Noise-masking function

In order to avoid misdetection of current detection comparator due to RNF spikes that may occur when the output turns ON,

the IC employs an automatic current detection-masking period (tONMIN), while the minimum ON-time from the output transistor

turned on is invalidated the current detection. This allows for constant-current drive without the need for an external filter.

3) CR Timer

The CR pin is repeatedly charged and discharged between the V_CRHand V_CRLlevels by connected the external capacitor and

resistor. The CR pin voltage decides in IC and it is V_CRL=0.4V, V_CRH=1.0V respectively. The detection of the current detection

comparator is masked while charging from V_CRLto V_CRH. (As mentioned above, this period defines the minimum ON-time of

the motor output transistor.) The CR pin begins discharging once the voltage reaches V_CRH. When the output current reaches

the current limit during this period, then the IC enters decay mode. The CR continues to discharge during this period until it

reaches V_CRL, at which point the IC output is switched back ON. The current output and CR pin begin charging simultaneously.

The CR charge time (t_ONMIN) and discharge time (t_DISCHARGE) are set by external components, according to the following

formulas. The total of t_ONMINand t_DISCHARGEyield the chopping period, t_CHOP

.

′

푅 ×푅

푉ꢄ푅−ꢅ.4

푉ꢄ푅−ꢆ.ꢅ

푡_{푂ꢂ푀ꢃꢂ}≈ 퐶 ×

× 푙푛 (

)

[s]

′

푅 +푅

is the minimum ON-time.

is the capacitance of the CR Pin.

is the resistance of the CR Pin.

t_ONMIN

C

R

0.30

0.25

0.20

0.15

0.10

0.05

0.00

is the CR Pin internal impedance 5kΩ(Typ)

is the CR Pin voltage.

R’

VCR

푅

′

ꢇ퐶ꢀ = ꢇ × _{푅 +푅}

[V]

is the internal regulator voltage 5V(Typ).

V

0

500

1000

C [pF]

1500

2000

ꢆ+훼

푡_{퐷ꢃ푆ꢄ퐻퐴푅퐺퐸}≈ 퐶 × ꢀ × 푙푛 (

)

[s]

ꢅ.4

is the CR discharge time.

refer to the right graph.

t_DISCHARGE

α

푡_ꢄ퐻푂푃= 푡_{푂ꢂ푀ꢃꢂ}ꢈ 푡_{퐷ꢃ푆ꢄ퐻퐴푅퐺퐸}

[s]

is the chopping period.

t_CHOP

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3)CR Timer – continued

Spike noise

Current limit Value

0mA

Output current

RNF Voltage

Current limit Value

GND

V_CRH(1.0V Typ)

CR Voltage

V_CRL(0.4V Typ)

GND

Discharge

time

t_DISCHARGE

Chopping Period

t_CHOP

Minimum ON Time

t_ONMIN

Figure 4. Timing chart of CR voltage, RNF voltage and output current

Attach a resistor of at least 10 kΩ to the CR Pin (10 kΩ to 200 kΩ recommended) as lower values may keep the CR from

reaching the V_CRHvoltage level. A capacitor in the range of 470 pF to 1500 pF is also recommended. As the capacitance

value is thousands or more, however, the noise-masking period (t_ONMIN) also increases, and there is a risk that the output

current may exceed the current setting value due to the internal L and R components of the output motor coil. Also, ensure

that the chopping period (t_CHOP) is not set longer than necessary, as doing so will increase the output ripple, thereby

decreasing the average output current and yielding lower output rotation efficiency. Select optimal value so that motor drive

sound, and distortion of output current waveform can be minimized.

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PWM Constant Current Control – continued

Current Decay Mode

PWM Constant Current Control can be optionally set the current decay mode in which the ratio of fast and slow decay.

The following diagrams show the state of each transistor and the regenerative current path during the current decay for each

decay mode:

FAST DECAY

SLOW DECAY

OFF→OFF

ON→OFF

OFF→ON

ON→OFF

OFF→ON

M

ON→ON

Output ON Time

Current Decay Time

Figure 5. Route of Regenerated Current during Current Decay

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PWM Constant Current Control – continued

The merits of each decay mode are as follows:

SLOW DECAY

The voltage of motor coils is small and the regenerative current decreases slowly. So the output current ripple is small and

this is favorable for keeping motor torque high. However, output current increasing according to fall-off current characteristic

deterioration in the low-current region and it is easily influenced by EMF when pulse late is high. As a result, the waveform

is distortion and motor oscillation increasing in half-step or quarter-step modes. Thus, this decay mode is most suited to

full-step modes or low-pulse-rate as half-step or quarter-step modes.

FAST DECAY

Fast decay decreases the regeneration current much more quickly than slow decay, greatly reducing distortion of the output

current waveform. However, fast decay yields a much larger output current ripple, which decreases the overall average

current running through the motor. This causes two problems: first, the motor torque decreases (increasing the current limit

value can help eliminate this problem, but the rated output current must be taken into consideration); and sond, the power

loss within the motor increases and thereby radiates more heat. If neither of these problems is of concern, then fast decay

can be used for high-pulse rate half-step or quarter-step drive.

Additionally, this IC allows for a mixed decay mode that can help to improve upon problems that arise from using fast or slow

decay. In this mode, the current control characteristic improves without increasing the output current ripple by switching the

IC between slow and fast decay. The time ratio of fast to slow decay can be changed via the voltage input to the MTH pin;

therefore, it is possible for each motor to be realized the optimal control state. During mixed decay mode about chopping

cycle, the first X%(t1 to t2) of which operates the IC in slow decay mode, and the remainder(t2 to t3) of which operates in fast

decay mode. However, if the output current (i.e., the voltage on the RNF pin) does not reach the set current limit during the

first X% (t1 to t2) decay period, the IC operates in fast decay mode only.

MTH Pin input Voltage [V]

Current Decay Mode

SLOW DECAY

MIX DECAY

0 to 0.3

0.4 to 1.0

1.5 to 3.5

FAST DECAY

t2

t3

t1

1.0V

CR Voltage

MTH Voltage

0.4V

GND

Chopping Period

t_CHOP

Current limit value

Output Current

FAST DECAY

SLOW

DECAY

0A

Figure 6. CR Pin voltage and output current during mixed decay

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BD60223FP

Translator Circuit

This series builds in translator circuit and can drive stepping motor in CLK-IN mode.

The operation of the translator circuit in CLK-IN drive mode is described as below.

Reset operation

The translator circuit is initialized by power ON Reset function and PS Pin.

Initializing operation when power supply is turned on

①If power supply is turned on at PS=L (Use this sequence as a general rule)

When power supply is turned on, the power ON reset function operates in IC and initialized, but as long as it is PS=L,

the motor output is the OPEN state. After power supply is turned on, because of the changing of PS=L→H, the motor

output becomes the ACTIVE state, and the excitation is started at the initial electrical angle.

But at the time of PS=L→H, it returns from the standby state to the normal state and there is a delay of 40µs(Max)

until the motor output has become the ACTIVE state.

ACTIVE

Reset is released

①

Delay

②

PS

CLK

OUT1A

OUT1B

Motor output OPEN

②If power supply is turned on at PS=H

Motor output ON

When power supply is turned on, the power ON function in IC operates, and be initialized before the motor output

becomes the ACTIVE state during EN=H, and the excitation is started at the initial electrical angle.

Initializing operation during motor operating

Input the reset signal to PS pin when the translator circuit is initialized during motor fundamentally operating. (Refer to

P.15) But at the time of PS=L→H, it returns from the standby state to the normal state and there is a delay of 40µs

(Max) until the motor output has become the ACTIVE state, so be careful.

Control input timing

Input as shown below because the translator circuit operates at the rising edge of CLK signal. If you disobey this timing and

input, then there is the possibility that the translator circuit does not operate as expected. In addition, at the time of PS=L→H,

it returns from the standby state to the normal state and there is a delay of 40µs (Max) until the motor output has become the

ACTIVE state, so within this delay interval there is no phase advance operation even if CLK is inputted.

A

PS

B

C

CLK

MODE0

MODE1

D

E

F

G

F

G

CW_CCW

ENABLE

A: PS minimum input pulse width • • • • 20µs

B: PS rising edge to CLK rising edge input possible maximum delay time • • • • 40µs

C: CLK minimum period • • • • 4µs

D: CLK minimum input H pulse width • • • • 2µs

E: CLK minimum input L pulse width • • • • 2µs

F: MODE0, MODE1, CW_CCW, ENABLE set-up time • • • • 1µs

G: MODE0, MODE1, CW_CCW, ENABLE hold time • • • • 1µs

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Translator Circuit – continued

Full step

Half step

Quarter step

1/16 step

ch1 current[%] ch2 current[%] step angle[°]

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

9

100.00

99.52

98.08

95.69

92.39

88.19

83.15

77.30

70.71

63.44

55.56

47.14

38.27

29.03

19.51

9.80

0.00

9.80

0.0

5.6

11.3

16.9

22.5

28.1

33.8

39.4

45.0

50.6

56.3

61.9

67.5

73.1

78.8

84.4

90.0

19.51

29.03

38.27

47.14

55.56

63.44

70.71

77.30

83.15

88.19

92.39

95.69

98.08

99.52

100.00

99.52

98.08

95.69

92.39

88.19

83.15

77.30

70.71

63.44

55.56

47.14

38.27

29.03

19.51

9.80

2

3

initial position→

1

2

3

4

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

4

5

0.00

-9.80

95.6

-19.51

-29.03

-38.27

-47.14

-55.56

-63.44

-70.71

-77.30

-83.15

-88.19

-92.39

-95.69

-98.08

-99.52

-100.00

-99.52

-98.08

-95.69

-92.39

-88.19

-83.15

-77.30

-70.71

-63.44

-55.56

-47.14

-38.27

-29.03

-19.51

-9.80

101.3

106.9

112.5

118.1

123.8

129.4

135.0

140.6

146.3

151.9

157.5

163.1

168.8

174.4

180.0

185.6

191.3

196.9

202.5

208.1

213.8

219.4

225.0

230.6

236.3

241.9

247.5

253.1

258.8

264.4

270.0

275.6

281.3

286.9

292.5

298.1

303.8

309.4

315.0

320.6

326.3

331.9

337.5

343.1

348.8

354.4

6

7

8

9

0.00

-9.80

-19.51

-29.03

-38.27

-47.14

-55.56

-63.44

-70.71

-77.30

-83.15

-88.19

-92.39

-95.69

-98.08

-99.52

-100.00

-99.52

-98.08

-95.69

-92.39

-88.19

-83.15

-77.30

-70.71

-63.44

-55.56

-47.14

-38.27

-29.03

-19.51

-9.80

10

11

12

13

14

15

16

0.00

9.80

19.51

29.03

38.27

47.14

55.56

63.44

70.71

77.30

83.15

88.19

92.39

95.69

98.08

99.52

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Translator Circuit – continued

Reset Timing Chart (QUARTER STEP, MODE0=L, MODE1=H, CW_CCW=L, ENABLE=H)

If the Pin PS is input to L, the reset operation is done with regardless of other input signals when reset the translator circuit

while motor is working. At this time, IC internal circuit enters the standby mode, and makes the motor output OPEN.

RESET

①

②

③

④

⑤

⑥

⑦

⑧

⑨

⑩

①

②

③

④

⑤

⑥

⑦

⑧

PS

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100%

67%

33%

IOUT(CH1)

IOUT(CH2)

-33%

-67%

-100%

100%

67%

33%

-33%

-67%

-100%

CW_CCW Switch Timing Chart (FULL STEP, MODE0=L, MODE1=L, ENABLE=H)

The switch of CW_CCW is reflected by the rising edge of CLK that comes immediately after the changes of the CW_CCW

signal. However, depending on the state of operation of the motor at the switch the motor cannot follow even if the control on

driver IC side is correspondent and there are possibilities of step-out and mistake step in motor, so evaluate the sequence of

the switch enough.

CW

CCW

①

②

③

②

①

PS

CW_CCW

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100%

IOUT(CH1)

IOUT(CH2)

-100%

100%

-100%

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Translator Circuit – continued

ENABLE Switch Timing Chart (FULL STEP, MODE0=L, MODE1=L)

The switch of the ENABLE signal is reflected by the change in the ENABLE signal with regardless of other input signals.

In the section of ENABLE=L, the motor output becomes OPEN and the electrical angle doesn't advance. Because the

translator circuit stop and CLK input is canceled. Therefore, the progress of ENABLE=L→H is completed before the input of

ENABLE=L. Excitation mode (MODE0, MODE1) also switches within ENABLE=L interval. Where excitation mode switched

within ENABLE=L interval, restoring of ENABLE=L→H was done in the excitation mode after switch.

Output off & Translator stop

①

②

③

PS

ENABLE

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100%

IOUT(CH1)

IOUT(CH2)

-100%

100%

-100%

Restoring in the state prior to input of ENABLE=L

About the Switch of the Motor Excitation Mode

The switch of the excitation mode can be done with regardless of the CLK signal at the same time as changing of the signal

MODE0 and MODE1. The following built-in function can prevent motor out-of-step caused by discrepancies of torque vector

of transitional excitations during switch between excitation modes. However, due to operation state of motor during switch,

motor may not act following control on driver IC side control, and thereby lead to out-of-step or miss step. Therefore, switch

sequence shall be evaluated sufficiently before any decision.

Cautions of Bidirectional Switch of CW_CCW and Excitation Modes (MODE0, MODE1)

As shown in the figure below, the area between the end of reset discharge (PS=L→H) and beginning of the first CLK signal

input is defined as interval A, while the area until the end of the first CLK signal input is defined as interval B.

Interval A

=> For CW_CCW, no limitation is applied on switch of excitation mode.

Interval B

=> In CLK1 period, or within ENABLE=L interval, CW_CCW and excitation mode can’t be switched together.

Violation of this restriction may lead to false step (with one extra leading phase) or out-of-step.

Therefore, in case that CW_CCW and excitation modes are switched simultaneously, PS Pin must be input with reset

signal. Then start to operate in interval A before carrying out such bidirectional switch.

Interval A

Interval B

PS

CLK

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Power Dissipation

Confirm that the IC’s chip temperature Tj is not over 150°C in consideration of the IC’s power consumption (W), thermal

resistance (°C/W) and ambient temperature (Ta). When Tj=150°C is exceeded, the functions as a semiconductor do not

operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration

and eventually destruction of the IC. Tjmax=150°C must be strictly obeyed under all circumstances.

Thermal Calculation

The IC’s consumed power can be estimated roughly with the power supply voltage (V_CC), circuit current (I_CC), output ON

resistance (RONH, RONL) and motor output current value (I_OUT).

The calculation method during FULL STEP drive, SLOW DECAY mode is shown here:

푊

푉ꢄꢄ

= ꢇ × 퐼_ꢄꢄ

[W]

ꢄꢄ

where:

W_VCC

V_CC

is the consumed power of the V_CC

is the power supply voltage.

is the circuit current.

.

I_CC

푊_퐷푀푂푆= 푊 ꢈ 푊_{퐷퐸ꢄ퐴푌}[W]

푂ꢂ

= ꢀ_푂ꢂ퐻ꢈ ꢀ_푂ꢂ퐿× 퐼_푂푈푇²× ꢋ × 표푛_푑푢푡푦 [W]

ꢉ

ꢊ

푊

푂ꢂ

2

ꢉ

ꢊ

ꢉ

ꢊ

푊_{퐷퐸ꢄ퐴푌}= ꢋ × ꢀ_푂ꢂ퐿× 퐼_푂푈푇× ꢋ × 1 ꢌ 표푛_푑푢푡푦 [W]

where:

is the consumed power of the output DMOS.

is the consumed power during output ON.

is the consumed power during current decay.

is the upper P-channel DMOS ON-resistance.

is the lower N-channel DMOS ON-resistance.

is the motor output current value.

W_DMOS

W_ON

W_DECAY

R_ONH

R_ONL

I_OUT

PWM on duty

on_duty

푡_푂ꢂ

=

⁄

푡_ꢄ퐻푂푃

is the H bridge A and B.

“ ꢋ ”

t_ONvaries depending on the L and R values of the motor coil and the current set value. Confirm by actual measurement, or

make an approximate calculation.

t_CHOPis the chopping period, which depends on the external CR. Refer to P. 9, 10 for details.

Upper Pch DMOS ON Resistance

Lower Nch DMOS ON Resistance

IC number

BD60223FP

R_ONH[Ω] (Typ)

R_ONL[Ω] (Typ)

0.35

0.20

푊_푡표푡푎푙 = 푊 ꢈ 푊_퐷푀푂푆[W]

푉ꢄꢄ

ꢍ푗 = ꢍ푎 ꢈ 휃푗푎 × 푊_푡표푡푎푙 [°C]

where:

is the consumed total power of IC.

is the junction temperature.

is the air temperature.

W_total

Tj

Ta

is the thermal resistance value.

θja

However, the thermal resistance value θja[°C/W] differs greatly depending on circuit board conditions. The calculated values

above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application board used,

and create the thermal design with enough margin to not exceed Tjmax=150°C. Although unnecessary with normal use, if

the IC is to be used under especially strict heat conditions, consider externally attaching a Schottky diode between the motor

output pin and GND to abate heat from the IC.

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Power Dissipation – continued

Temperature Monitoring

In respect of BD60223FP, there is a way to directly measure the approximate chip temperature by using the TEST pin with a

protection diode for prevention from electrostatic discharge. However, temperature monitor using this TEST pin is only for

evaluation and experimenting, and must not be used in actual usage conditions.

(1) Measure the pin voltage when a current of I_DIODE=50µA flows from the TEST pin to the GND, without supplying VCC to

the IC. This is measurement of the V_Fvoltage inside the diode.

(2) Measure the temperature characteristics of this pin voltage. (V_Fhas a linear negative temperature factor against the

temperature.) With the results of these temperature characteristics, chip temperature can calibrated from the TEST pin

voltage.

(3) Supply VCC, confirm the TEST pin voltage while running the motor, and the chip temperature can be approximated from

the results of (2).

-V_F[mV]

TEST

Internal circuit

I_DIODE

V

25

150 Chip temperature Tj[°C]

Figure 7. Model diagram for measuring chip temperature

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Example for Applied Circuit

Power save pin

Refer to P.5 for detail.

Logic input pins

Refer to P.5 for detail.

TSD

OCP

CLK

TEST

PS

MODE1 16

OVLO

UVLO

Translator

MODE0

CW_CCW

ENABLE

RESET

20

＋

－

VREF

DAC

Bypass capacitor.

Set the output current.

Input by resistor division.

Refer to P.6 for detail.

Setting range is

100µF to 470µF(electrolytic)

0.01µF to 0.1µF(multilayer ceramic etc.)

Refer to P.6 for detail.

VCC1

OUT1A

＋

－

Be sure to short VCC1 and VCC2.

RNF1S

RNF2S

Set the chopping

frequency.

Setting range is

C:470pF to 1500pF

R:10kΩ to 200kΩ

OUT1B

RNF1

＋

－

0.2Ω

100µF

0.1µF

RNF1S

VCC2

Refer to P.7, 9 for detail.

Blank time

PWM control

OUT2A

CR

OSC

Resistor for current detection

Setting range is

0.1Ω to 0.3Ω.

OUT2B

RNF2

39kΩ

1000pF

Mix decay

control

Refer to P.6 for detail.

0.2Ω

MTH

RNF2S

GND

Regulator

Set the current decay mode.

①SLOW DECAY

Connect to GND.

Resistor for current detection

Setting range is

0.1Ω to 0.3Ω.

Refer to P.6 for detail.

②MIX DECAY

Input by resistor division.

Refer to P.7, 12 for detail.

Figure 8. BD60223FP block diagram and applied circuit diagram

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Input Output Equivalent Circuit Diagram

CW_CCW

MODE0

MODE1

CLK

VREF

MTH

10kΩ

5kΩ

ENABLE

10kΩ

PS

10kΩ

100kΩ

33kΩ

VREG (internal regulator)

RNF1S

RNF2S

5kΩ

CR

5kΩ

VCC

OUT1A

OUT2A

OUT1B

OUT2B

RNF1, RNF2

circuit

Figure 9. Input output equivalent circuit diagram

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic can be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

9. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 10. Example of monolithic IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. The IC should

be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the

OFF state even if the Tj falls below the TSD threshold.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

14. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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BD60223FP

Ordering Information

F

P

B D 6

0

2

3

-

E 2

Package type

FP : HSOP25 E2: Reel-wound embossed taping

Packing, Forming specification

ROHM Model

Marking Diagram

HSOP25 (TOP VIEW)

Part Number Marking

LOT Number

BD60223FP

Pin 1 Mark

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TSZ22111 • 15 • 001

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BD60223FP

Physical Dimension and Packing Information

Package Name

HSOP25

Max 13.95 (include. BURR)

(UNIT: mm)

PKG: HSOP25

Drawing: EX139-5001

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BD60223FP

Revision History

Date

Revision

001

Changes

22.Mar.2018

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD60223FP
厂家：	ROHM
描述：	BD60223FP是额定电源36V、额定输出电流1.5A的低功耗双极PWM恒流驱动器。输入接口采用CLK-IN驱动方式，通过内置DAC，励磁模式可适用于FULL STEP、HALF STEP、QUARTER STEP、1/16 STEP模式。电流衰减方式方面可任意设定FAST DECAY/SLOW DECAY的比率，可对所有电机实现很好的控制状态。另外，也可使用一个系统电源进行驱动，有助于提高整机设计的便利性。电机驱动驱动器
文件：	总28页 (文件大小：2370K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD60223FP [ROHM]

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