BD6047AGUL [ROHM]
BD6047AGUL可防止整机因来自USB端子的超标输入电压而损坏。除以往的充电保护IC的功能外，还可在不增加外置部件的前提下对因USB的反接等而发生的负电压进行保护。通过采用罗姆自有的本系列技术，实现了针对最大±30V的异常输入电压的保护。;
| 型号： | BD6047AGUL |
| 厂家： | 
ROHM |
| 描述： | BD6047AGUL可防止整机因来自USB端子的超标输入电压而损坏。除以往的充电保护IC的功能外，还可在不增加外置部件的前提下对因USB的反接等而发生的负电压进行保护。通过采用罗姆自有的本系列技术，实现了针对最大±30V的异常输入电压的保护。 |
| 文件： | 总18页 (文件大小：1046K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Charge protection ICs with Built-in FET
Negative Voltage Protection type
BD6047AGUL
●General Description
●Key Specifications
BD6047AGUL protects the devices from the abnormal
input voltage at the USB port.
Input voltage range:
2.2V to 28V
±30V
125mΩ(Typ.)
6.0msec(Typ.)
Voltage Protection range:
Internal Low Ron:
Start Up Delay:
Addition to the conventinal charge protection IC, it
prevents the negative voltage happened by
the USB reverse insertion without any additional
compornents. ROHM's original charge protection IC
series enables to protect the abnormal input voltage
from -30V to +30V.
Operating temperature range:
-40℃ to +85℃
●Package
W(Typ.) D(Typ.) H (Max.)
●Features
Over Voltage Protection up to 30V
Negative Voltage Protection down to -30V
Over voltage Lockout (OVLO)
Under voltage Lockout (UVLO)
Over Current Protect
Thermal Shut Down
●Applications
Mobile phones, MP3 players, Digital Still Camera, PDA,
IC recorder, Electronic Dictionary, Handheld Game,
Game Controller, Camcorder, Bluetooth Headsets, etc
VCSP50L1
1.95mm x 1.95mm x 0.55mm
●Typical Application Circuit
OVP
FLGB
CPU
IN
Cin
1.0uF
28V-OVP
Travel
Adapter
GND
OUT
Cout
0.47uF
CHGIN
PMIC
Charger
BATT
Li-ion
1cell
・Safety is high because it detects, and it protects it for an abnormal voltage up to ±30V.
・It contributes to the miniaturization because all external is built into.
○Product structure : Silicon monolithic integrated circuit ○This product is not designed protection against radio active rays.
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BD6047AGUL
●Block Diagram
Travel
Adapter
OUT
CHARGE
OUT
IN IN
IN IN IN
OUT
NVP
FLGB
Initial
Delay
VREF
UVLO
Gate
Driver
OVLO
OCP
TSD
Timing
Generator
Initial
Delay
OSC
GND
●Pin Configuration
●Pin Description
PIN
NAME
IN
FUNCTION
Input voltage Pin. A 1µF low ESR capacitor,
or larger must be connected between this pin and GND
A1, A2, A3
B1, B2
C1, C2
OUT
FLGB
GND
Output Voltage Pin
Open-drain output pin that turns low when any protection event occurs.
(overvoltage protection, thermal shut down)
C3
B3
Ground Pin
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BD6047AGUL
●Absolute Maximum Ratings (Ta=25℃)
Contents
Symbol
Vmax1
Vmax2
Pd
Rating
-30 to 30
-0.3 to 7
900
Unit
V
Conditions
Input supply voltage 1
Input supply voltage 2
Power dissipation
IN
V
other
mW
℃
Operating temperature range
Storage temperature range
Topr
-40 to +85
-55 to +150
Tstr
℃
※1 When using more than at Ta=25℃, it is reduced 7.2mW per 1℃. ROHM specification board 50mm× 58mm mounting.
●Recommended Operating Ratings (Ta = -40℃ to +85℃)
Parameter
Input voltage range
Symbol
Vin
Range
Unit
V
2.2 to 28
●Electrical Characteristics
(Unless otherwise noted, Ta = 25C, IN=5V)
Limit
Typ.
Parameter
Symbol
Unit
Conditions
Min.
Max.
●ELECTRICAL
Input Voltage Range
VIN
ICC
-
-
-
28
80
V
µA
V
Supply Quiescent Current
Under Voltage Lockout
Under Voltage Lockout Hysteresis
Over Voltage Lockout
Over Voltage Lockout Hysteresis
Current limit
40
UVLO
UVLOh
OVLO
OVLOh
ILM
3.42
50
5.7
50
1.7
-
3.6
100
5.85
100
-
3.78
150
6.0
150
-
IN=decreasing
mV
V
IN=increasing
IN=increasing
IN=decreasing
mV
A
Vin vs. Vout Res.
RON
125
150
mΩ
FLGB Output Low Voltage
FLGB Leakage Current
OUT pin input Current
●TIMINGS
FLGBVO
FLGBleak
OUTIIN
-
-
-
-
-
-
400
1
mV
µA
SINK=1mA
1
mA
IN=3V(UVLO), OUT=3V
Start Up Delay
Output Turn Off Time
Alert Delay
Ton
Toff
-
-
-
6
2
10
10
10
msec
µsec
µsec
Tovp
1.5
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BD6047AGUL
●Typical Performance Curves
※The test conditions for the Typical Operating Characteristics are IN=5V、CIN=1µF、COUT=0.47µF、Ta=25℃,
Unless otherwise noted.
IN(5V/div)
IN(20V/div)
OUT(2V/div)
OUT(5V/div)
FLGB(5V/div)
FLGB(5V/div)
Figure 1. Start up
Figure 2. Input Steps
(0→5V)
(0→-30V)
IN(20V/div)
IN(20V/div)
OUT(2V/div)
OUT(5V/div)
FLGB(5V/div)
FLGB(5V/div)
Figure 3. Input Steps
Figure 4. Input Steps
（0→30V）
（5→30V）
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BD6047AGUL
●Typical Performance Curves - continued
IN(20V/div)
OUT(5V/div)
FLGB(5V/div)
Figure 5. Input Steps
（30→5V）
IN(5V/div)
IN(5V/div)
Io(2A/div)
Io(2A/div)
OUT(5V/div)
OUT(5V/div)
FLGB(5V/div)
FLGB(5V/div)
Figure 6. Output Short Circuit
Figure 7. Output Short Circuit (Zoom)
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BD6047AGUL
●Typical Performance Curves - continued
2.5
2.0
1.5
1.0
0.5
0.0
0
-10
-20
-30
-40
-50
-60
0
5
10
15
20
25
30
-30
-20
-10
0
IN[V]
IN[V]
Figure 9. ICC vs Input Voltage
(0-30V)
Figure 8. ICC vs Input Voltage
(-30-0V)
100
80
60
40
20
0
140
120
100
80
60
40
20
0
-100
-50
0
50
100
150
0
2
4
6
IN[V]
Temp[℃]
温度(℃)
IN(V)
Figure 10. ICC vs Input Voltage
Figure 11. ICC vs Temperature
(IN=5V)
（0-7V）
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BD6047AGUL
●Typical Performance Curves - continued
7
6
5
4
3
2
1
0
150
140
130
120
110
100
OVLO
UVLO
3.5
4.0
4.5
5.0
5.5
-50
0
50
Temp[℃]
100
150
IN[V]
Figure 13. RON vs Input Voltage
Figure 12. UVLO/OVLO vs Temperature
200
180
160
140
120
100
80
-60 -40 -20
0
20 40 60 80 100 120 140
Temp[℃]
]
Figure 14. RON vs Temperature
（IN=5V）
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BD6047AGUL
●Timing Diagram
OVLO
UVLO
IN
OUT
6.0msec
(Ton)
FLGB
Figure 15. Start up sequence
OVLO
UVLO
IN
2.0μ sec
(Toff)
OUT
1.5μ sec
(Tovp)
FLGB
Figure 16. Shutdown by over voltage detection
15V
IN
5V
6.0msec
OUT
1μ sec
FLGB
Figure 17. Recovery from overvoltage protection
.
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BD6047AGUL
●Examples of Application Circuit (Ball Configuration is Bottom View)
A: In case of FLGB pins are connected.
IN
OUT
Adapter
/ USB
PMIC
/ charger
Li-ion
1cell
1.0uF
. 7uF
04
BD6047
100kΩ
※
FLGB
CPU
Pleaseinserttheresister
※
voltage.
to limit current of negative
GND
OUT
FLGB
GND
OUT
IN
C
B
A
IN
IN
2
IN
1
IN
3
B: In case of FLGB pins are not connected.
IN
OUT
Adapter
/ USB
PMIC
/ charger
Li-ion
1.0uF
0.47uF
1cell
BD6047
FLGB
GND
OUT
IN
OUT FLGB
OUT OUT
C
FLGB
GND
C
GND SHORT
OPEN
GND
IN
or
IN
IN
B
A
B
A
IN
2
IN
1
IN
3
IN
2
IN
1
IN
3
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BD6047AGUL
●BD6047 Evaluation Board
Power Supply
（ Adapter)
Charger IC
C1:
1.0uF(50V)
U1
IN
OUT
C2
C1
C3
R1
FLGB
DVDD:
FLGBPin
Pull-Up
GND
C2: 0.47μF
DVDD
Power Supply
FLGB:
OVLO=L
UVLO/ NORMAL=H
R1:
100kΩ
Charger IC
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BD6047AGUL
●Power dissipation
1.5
1
Pd=0.90W
-7.2mW/℃
0.5
Ta_MAX=85℃
0
0
25
50
75
100
125
150
Ta (℃)
※
On the ROHM’s specification Board
●I/O equivalence circuit
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BD6047AGUL
●Operational Notes
(1) Absolute maximum ratings
If applied voltage (VDD, VIN), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is
a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which absolute
maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures.
(2) Recommended operating range
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it is
those that are guaranteed under the conditions for each parameter. Even when these are within the recommended
operating range, voltage and temperature characteristics are indicated.
(3) Power supply lines
In the design of the board pattern, make power supply and GND line wiring low impedance.
When doing so, although the digital power supply and analog power supply are the same potential, separate the digital power
supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the
common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well.
Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND
pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss occurring at
low temperatures is not a problem for various characteristics of the capacitors used.
(4) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm
that there are no pins for which the potential becomes less than a GND by actually including transition phenomena.
(5) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is
installed erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign substance
getting between pins or between a pin and a power supply or GND.
(6) Operation in strong magnetic fields
Be careful when using the LSI in a strong magnetic field, since it may malfunction.
(7) Inspection in set board
When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to low
impedance LSI pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the inspection
process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the power
supply. Furthermore, as countermeasures against static electricity, use grounding in the assembly process and take
appropriate care in transport and storage.
(8) Input pins
Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements
operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage.
Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other ways such that parasitic
elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to
the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a voltage less than the power
supply voltage as well as within the guaranteed values of electrical characteristics.
(9) Ground wiring pattern
When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND
pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage
variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND voltage to
change. Take care that the GND wiring pattern of externally attached components also does not change.
(10) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering
of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(11) Thermal shutdown circuit (TSD)
When the junction temperature reaches the defined value, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at
the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI
assuming its operation.
(12) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual
states of use.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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BD6047AGUL
●Ordering Information
B
D
6
0
4
7
A
G U
L
-
E 2
Part Number
Package
GUL : VCSP50L1
Packaging and forming specification
E2: Embossed tape and reel
●Marking Diagram
VCSP50L1
(TOP VIEW)
1PIN MARK
Part Number Marking
LOT Number
0 4 7 A
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BD6047AGUL
●Physical Dimension Tape and Reel Information
Package Name
VCSP50L1
1PIN MARK
Lot No.
1.95±0.05
S
0.06 S
9-φ0.25±0.05
A
0.05 A B
C
(φ0.15)INDEX POST
B
B
A
1
2
3
0.475±0.05
P=0.5×2
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BD6047AGUL
●Revision History
Date
Revision
001
Changes
21.May.2013
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
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General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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