BD60A00NUX_12 [ROHM]

White LED Driver; 白光LED驱动器
BD60A00NUX_12
型号: BD60A00NUX_12
厂家: ROHM    ROHM
描述:

White LED Driver
白光LED驱动器

驱动器
文件: 总25页 (文件大小:885K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Datasheet  
White LED Driver  
With PWM Brightness Control  
for up to 11 LEDs in Series  
BD60A00NUX  
BD60A60NUX  
General Description  
Key Specifications  
Operating power supply voltage range: 2.7V to 5.5V  
This IC is boost DC/DC converter that can drive white  
LED with constant current. More stabled white LED  
lighting can be achieved by direct current connection  
without electric tolerance and High-speed response by  
current mode. Moreover, separating IC power supply  
(2.7V to 5.5V) and coil power supply (2.3V to 20V)  
makes it possible to widen input range, which will be  
helpful to be applied to various kinds of applications.  
Over voltage setting can be selected corresponding to  
the number of LED lightings. BD60A00NUX is for max  
11 lightings, BD60A60NUX is for max 6 lightings.  
LED maximum current:  
Switching Frequency:  
Quiescent Current:  
30mA (Max.)  
600kHz(Typ.)  
0.1μA (Typ.)  
Operating temperature range:  
-40˚C to +85˚C  
Package W(Typ.) x D(Typ.) x H(Max.)  
Features  
Boost DC/DC converter  
Drive LED 11 lightings  
(VOUT=3.6V×11+0.7V=40.3V <VF MAX=3.7V>)  
BD60A00NUX  
Brightness control by outside PWM signal (PWM  
frequency =100Hz to 30kHz, 25kHz 1% dimming  
application)  
VSON008X2030  
2.00mm x 3.00mm x 0.60mm  
Brightness control by DC input  
Soft start function (1ms Typ.)  
Over voltage protection  
BD60A00NUX:  
BD60A60NUX:  
SBD open protection and output short protection  
Over current protection  
Applications  
Digital video cameras, digital single-lens reflexes,  
digital still cameras, digital photo frames, personal  
navigations (PND), mobile phones, smart phones, MID,  
PDA, hand-held computers, MP3 players, GPS, digital  
media players, etc.  
42V (Typ.)  
28V (Typ.)  
LED terminal over voltage protection  
UVLO  
Typical Application Circuit  
L1  
11 LEDs  
10μH  
Coil Power  
2.3V to 20V  
COUT  
D1  
2.2μF  
Ccoil  
4.7μF  
SW  
VOUT  
IC Power  
2.7V to 5.5V  
VIN  
CIN  
1μF  
FB  
BD60AxxNUX  
ISET  
PWM  
PWM control  
GND  
EN  
Enable control  
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211114001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
1/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Absolute Maximum Ratings  
Parameter  
Symbol  
VMAX1  
Ratings  
7
Unit  
V
Condition  
Maximum applied voltage 1  
VIN, EN, PWM, ISET terminals  
FB, SW, VOUT terminals  
BD60A00NUX  
FB, SW, VOUT terminals  
BD60A60NUX  
Maximum applied voltage 2  
Maximum applied voltage 3  
VMAX2  
VMAX3  
45  
31  
V
V
Operating temperature range  
Storage temperature range  
Power dissipation 1  
Topr  
Tstg  
Pd1  
-40 to +85  
-55 to +150  
2000  
˚C  
˚C  
*1  
mW  
*1 4 layer (ROHM Standard board) has been mounted. When it’s used by more than Ta=25˚C, it’s reduced by 20mW/˚C.  
Recommended Operating Ratings (Ta=-40˚C to +85˚C)  
Parameter  
Symbol  
VIN  
Ratings  
Unit  
V
Conditions  
VIN terminal  
Operating power supply voltage  
Operating coil voltage  
2.7 to 5.5 *  
2.3 to 20  
Vcoil  
V
Coil voltage  
*When the operating supply voltage is over 4.61V for BD60A00NUX, please refer the application P.16  
Electrical Characteristics (Unless otherwise specified, Ta=25˚C, VIN=3.6V)  
Limits  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
-
Typ.  
0.1  
Max.  
1.0  
Quiescent Current  
Iq  
μA  
mA  
mA  
EN=0V  
Current Consumption  
(No Boost)  
IddNB  
IddB  
-
-
1.5  
2.5  
3.0  
EN=2.8V, PWM=0V  
EN=2.8V, PWM=2.8V  
Current Consumption (Boost)  
[EN, PWM Terminal]  
Low Input Voltage range  
High Input Voltage range  
Pull down register  
5.0.  
VthL  
VthH  
Rcnt  
-
-
-
0.5  
-
V
V
1.4  
65  
100  
135  
kΩ  
[Switching Regulator]  
FB Terminal Control Voltage  
Switching Frequency  
Max Duty  
FB  
0.56  
0.70  
600  
95  
0.84  
V
kHz  
%
fSW  
-
90  
-
-
-
Duty  
Ronn  
IqSW  
FB=0V  
SW Transistor ON Resistor  
SW Transistor Leak Current  
[Protection]  
0.5  
0.1  
-
Isw=80mA  
EN=0V  
-
2.0  
μA  
Over Current Limit  
Icoil  
-
750  
42  
-
mA  
V
*1  
Over Voltage Limit  
BD60A00NUX  
OVP1  
40  
44  
Detect voltage of VOUT terminal  
Over Voltage Limit  
BD60A60NUX  
OVP2  
26  
28  
30  
V
Detect Voltage of VOUT terminal  
Over Voltage Limit Hysteresis  
VOUT Terminal Leak Current  
Shot key Diode Open Protection  
OVPhy  
IqVOUT  
Sop  
-
-
-
1
-
1.0  
-
V
μA  
V
0.1  
0.2  
EN=0V  
Detect Voltage of VOUT terminal  
LED Terminal  
Over Voltage Protection  
LEDOVP  
UVLO  
4.4  
-
5.9  
2.2  
6.4  
-
V
V
PWM=2.8V  
Detect Voltage of Low Voltage  
[Current Driver]  
VIN falling edge  
LED Maximum Current  
LED Current Accuracy  
ILMAX  
-
-
-
-
30  
mA  
%
VIN=4V, COUT=1µF  
ILED=20mA  
ILACCU  
±3.0  
Current Limit Value at  
ISET Resistor 1kSetting  
LED Current Limit  
ILOCP  
-
0
0.1  
mA  
LED Leak Current  
IqLED  
Iset  
-
-
0.1  
0.6  
2.0  
-
μA  
EN=0V  
ISET Terminal Voltage  
V
*1 This parameter is tested with DC measurement.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
2/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Pin Description  
PIN No.  
PIN Name  
In/Out  
In  
Function  
Enable Control  
Terminal Diagram  
1
2
3
4
5
6
7
8
EN  
VIN  
B
C
B
A
B
B
C
B
In  
Battery Input  
PWM  
ISET  
FB  
In  
PWM Input  
In  
LED Current Setting Terminal  
Feedback Voltage Input  
Over Voltage Protection Input  
GND  
In  
VOUT  
GND  
SW  
In  
-
Out  
Switching Terminal  
Pin ESD Type  
VIN  
VIN  
PIN  
PIN  
GND  
GND  
GND  
A
B
C
Figure 1. Pin ESD Type  
Block Diagram  
VOUT  
SW  
+
-
Thermal  
Shutdown  
VIN  
TSD  
Over & under Voltage Protect  
ERRAMP  
UVLO  
PWMcomp  
FB  
-
S
R
-
Control  
+
+
Q1  
Q
Current  
Driver  
ISET  
Current  
Sense  
OSC  
+
Over Current  
protect  
PWM  
EN  
GND  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
3/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Main characteristics examples  
LED 6series, coil: VLF302512MT-100M  
Condition:  
VIN=3.6V  
LED=6series  
ILED Sweep (10->30mA)  
CIN=1μF/10V  
Ccoil=1μF/25V  
COUT=2.2μF/50V  
SBD=RB160M-60  
Coil=VLF302512MT-100M  
LED 10series, coil: VLF302512MT-100M  
Condition:  
VIN=3.6V  
LED=10series  
ILED Sweep (10->30mA)  
CIN=1μF/10V  
Ccoil=1μF/25V  
COUT=2.2μF/50V  
SBD=RB160M-60  
Coil=VLF302512MT-100M  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
4/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Main characteristics examples- continued  
IC Power=5.0V, Coil Power=4V to 16V  
BD60A00NUX  
IC Power=5.0V, Coil Power=2.7V to 20V, LED 8serial, LED current =25mA,  
coil 1094AS-10M (TOKO), SBD RB060M-60TR (ROHM)  
95  
90  
85  
eff1  
eff2  
80  
eff 1 = (VOUT x ILED) / (Vcoil x Icoil) x100  
75  
eff 2 = (VOUT x ILED) / (Vcoil x Icoil + VIN x IVIN) x100  
70  
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20  
Vcoil (V)  
BD60A60NUX  
IC Power=5.0V, Coil Power=2.7V to 20V, LED 6serial, LED current =25mA,  
coil 1094AS-10M (TOKO), SBD RB521A-40TR (ROHM)  
95  
90  
85  
80  
75  
eff = (VOUT x ILED) / (Vcoil x Icoil + VIN x IVIN) x100  
70  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
Vcoil (V)  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
5/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Main characteristics examples- continued  
100mV/div  
VOUT  
LED current  
PWM  
40µs/div  
PWM 20kHz Duty 50%  
100mV/div  
VOUT  
LED current  
PWM  
200ns/div  
PWM 20kHz Duty 1%  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
6/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Main characteristics examples - continued  
BD60A00NUX PWM duty – LED current  
IC Power=5.0V, LED 8serial, LED current =25mA, PWM frequency = 20 kHz, Ta=25deg  
coil 1094AS-10M (TOKO), SBD RB060M-60TR (ROHM)  
100.00  
10.00  
1.00  
0.10  
0.01  
0.1  
1.0  
10.0  
100.0  
PWM duty (%)  
0.4%  
Possible to Duty 0.4% at PWM=20 kHz  
Functional Descriptions  
1) PWM current mode DC/DC converter  
This IC keeps output voltage invariably by setting PWM duty to make FB terminal 0.7V when the power is on. As for the  
inputs of the PWM comparator as the feature of the PWM current mode, one is overlapped with error components from  
the error amplifier, and the other is overlapped with a current sense signal that controls the inductor current into Slope  
waveform to prevent sub harmonic oscillation. This output controls internal Nch Tr via the RS latch. In the period where  
internal Nch Tr gate is ON, energy is accumulated in the external inductor, and in the period where internal Nch Tr gate  
is OFF, energy is transferred to the output capacitor via external SBD.  
This IC has many safety functions, and their detection signals stop switching operation at once.  
2) Soft Start  
This IC has soft start function, which prevents rush current at turning on.  
After EN and PWM are changed LH, soft start becomes effective within 1ms. Soft start doesn't become effective  
even if Enable is changed LH, after that. By changing EN and PWM LH, soft start can become effective.  
Since a soft start function stops working at the time of following PWM=H when EN=H is held with PWM=L  
After EN=H should input a PWM signal within 10ms.  
EN  
EN  
Soft start time Finish  
Within 10ms  
PWM  
PWM  
Soft Start OFF  
ON  
OFF  
ON  
OFF  
OFF  
ON  
Soft Start  
Reset  
OFF  
OFF  
Reset  
Reset  
Figure 2. Soft start  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
7/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Protection  
Over voltage protection  
At such an error of output open as the output DC/DC and the LED is not connected to IC, the DC/DC boosts too much  
and the VOUT terminal exceeds the absolute maximum ratings, and may destruct the IC. Therefore, when the VOUT  
becomes sensing voltage or higher, the over voltage limit protection works, turns off the switching Tr, DC/DC will be  
stopped, and the output voltage goes down slowly. When output voltage becomes below the hysteresis voltage of Over  
voltage protection, A boost function works and output voltage reaches detection voltage again.  
This operation is repeated unless the abnormalities in application are recovered.  
Schottky Diode open protection  
In the case of external SBD is not connected to IC, or VOUT is shorted to GND, the coil or internal Tr may be destructed.  
Therefore, at such an error as VOUT becoming 0.2V or below, turns off the output Tr, and prevents the coil and the IC  
from being destructed.  
And the IC changes from activation into non-activation, and current does not flow to the coil (0mA).  
Thermal shut down  
This IC has thermal shut down function.  
The thermal shut down works at 175˚C or higher, and the IC changes from activation into non-activation.  
Over Current Protection  
Over current flows the current detection resistor that is connected to between internal switching transistor source and  
GND. Current sense voltage turns more than detection voltage, over current protection is operating and it is prevented  
from flowing more than detection current by reducing ON duty of switching Tr without stopping boost.  
As over current detector of This IC is detected peak current, current more than over current setting value does not flow.  
SW  
+
-
< The estimate of the current value which need for the normal operation>  
As over current detector of This IC is detected the peak current, it has to estimate peak current to flow to the coil by  
operating condition.  
In case of, Switching frequency = fsw  
Supply voltage of coil = VIN  
Output voltage = VOUT  
Typ.=0.6MHz  
Inductance value of coil = L  
Total LED current = IOUT  
Peak current of coil = Ipeak  
Average current of coil = Iave  
Efficiency = eff  
ON time of switching transistor = Ton  
Ipeak = (VIN / L) × (1 / fsw) × (1-(VIN / VOUT))  
Iave=(VOUT × IOUT / VIN) / eff  
Ton=(Iave × (1-VIN/VOUT) × (1/fsw) × (L/VIN) × 2)1/2  
As peak current varies according to whether there is the direct current superposed, the next is decided.  
(1-VIN/VOUT) × (1/fsw) < Ton  
(1-VIN/VOUT) × (1/fsw) > Ton  
peak current = Ipeak /2 + Iave (continuous mode CCM)  
peak current = (VIN / L)×Ton (discontinuous mode DCM)  
(Example 1)  
In case of, VIN=6.0V, L=10µH, fsw=0.6MHz, VOUT=32.5V, IOUT=25mA, current =85%  
Ipeak = (6.0V / 10µH) × (1 / 0.6MHz) × (1-(6.0V / 32.5V)) =0.82 A  
Iave = (32.5V × 25mA / 6.0V) / 85% = 0.16A  
Ton = (0.16A × (1-6.0V / 32.5V) × (1 / 0.75MHz) × (10µH /6.0V) × 2)1/2 = 0.85µs  
(1-VIN/VOUT) × (1/fsw)=1.36µs > Ton  
peak current = (6.0V / 10µH)×0.85µs =0.51A  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
8/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Protection - continued  
LED terminal over voltage protection  
When FB terminal becomes higher than 5.9V (Typ.), IC senses the situation trouble after 100µs and then stops constant  
current driver and DC/DC. Therefore IC becomes never heated, even if output and FB are both shorted. Moreover, if FB  
terminal becomes lower than 5.9V (Typ.), IC senses normal condition and activates constant current driver.  
5.9V  
FB  
0.7V  
Current Driver reset  
Active  
Active  
reset  
reset  
DC/DC  
PWM  
reset  
L
100µs  
H
Prevention of LED terminal over voltage protection malfunction  
As the below diagrams show, voltage drop of FB terminal becomes slow when PWM operates by connecting capacitor on  
a parallel with LED and decreasing LED current. At that time, LED terminal voltage protection works after condition of FB  
terminal > 5.9V keeps more than 100µs. LED terminal voltage protection might stop current driver and DC/DC and also  
turns off LEDs, so that please set up coil selection and LED current setting less than 100µs until FB terminal < 5.9V.  
FB  
5.9 V  
100µs  
VOUT  
Current Driver  
DC/DC  
reset  
reset  
reset  
reset  
Active  
Active  
FB  
PWM  
EN  
H
H
L
L
Low voltage detect protection (UVLO)  
Supply voltage(VIN) becomes lower than low voltage detect voltage 2.2V(Typ.), IC stops DC/DC and constant current  
driver. Moreover, this function can be off by boosting supply voltage up to more than hysteresis voltage.  
VIN  
5%  
2.32 V  
2.20 V  
0V  
DC/DC  
Current Driver  
Active  
reset  
Active  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
9/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Operating of the application deficiency  
1) When 1 LED or 1string OPEN during the operating  
Since FB terminal is set to 0V when set to OPEN, Output boosts up to the over voltage protection voltage. When over  
voltage is detected, the boosting operation stops and then output voltage goes down slowly. Later, if output voltage  
becomes less than hysteresis of over current protection, output voltage keeps boosting up to over voltage protection  
voltage again.  
Vout  
Hysteresis voltage  
FB voltage  
FB  
LED  
normal  
20mA  
Open  
0mA  
connection  
LED current  
Figure 3. LED open detect  
2) When LED short-circuited in the plural  
Even if one LED short-circuits during boost operation, it usually passes along LED and it is turned on. By making LED  
shorted, FB terminal voltage increases by LED VF. Therefore output voltage becomes lower by LED VF, and the  
condition turns to be normal.  
VOUT  
output  
VF of LED  
LED short  
0.7V+VF of LED  
VF of LED  
FB  
0.7V  
FB  
LED current  
20mA  
Figure 4. One LED shorted  
VOUT  
VOUT  
FB  
LED short  
VIN  
5.9V  
FB  
0.7V  
20mA  
LED current  
0.1mA  
100µs  
Figure 5. FB terminal – VOUT terminal shorted  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
10/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Operating of the application deficiency - continued  
3) When Schottky diode (SBD) remove  
In the situation that connection is opened and also DC/DC is activated, SW terminal voltage becomes more than rated  
voltage due to a lack of parts that can accept the current accumulated inside the coil. Consequently IC might be  
destroyed. To prevent the IC destruction, SBD open protection is functioned. SW terminal is never destroyed as  
boosting operation is stopped after VOUT terminal detects less than 0.2V.  
4) When resistance linked to an ISET terminal short-circuits  
Since Resistor connected to ISET terminal becomes 0, LED current setting value becomes more than rating. In order  
to avoid this trouble, this IC has LED current limit protection. By using this function, setting current of rating current  
driver becomes 0mA, and the current flow of LED is almost same as leak current.  
Control signal input timing  
2.2V  
VIN  
VIN  
Min. 100µs  
EN  
EN  
Min. 10ms  
PWM  
PWM  
DC/DC VOUT  
DC/DC VOUT  
Figure 6. Control signal input timing  
When input control signals such as Enable and PWM without completing the standup of supply voltage (VIN), be  
careful of the following points.  
Input each control signal after VIN exceeds 2.2V and UVLO is off.  
When input Enable and PWM, the standup time should be placed as Min.100µs from 2.2V to stable voltage for  
VIN.  
Since a soft start function stops working at the time of following PWM=H when EN=H is held with PWM=L.  
After EN=H should input a PWM signal within 10ms.  
Start control (EN) and select LED current driver (PWM)  
This IC can control the IC system by EN terminal and also turns off compulsorily by setting “L” level input voltage 0.4V  
or below. It also powers on when EN becomes more than “H” level input voltage 1.4V. In the case of EN=H, LED  
current fixed by ISET resistor with PWM=H flows. When it is selected at PWM=L, LED current stop to flow.  
EN  
L
PWM  
IC  
LED current  
L
L
Off  
On  
Off  
On  
Off  
Off  
Off  
H
L
H
H
H
Current fixed by ISET  
LED current setting range  
LED current sets up normal current by resister (RISET) connected to ISET voltage.  
Each setting current is shown as below.  
Normal current = 600/RISET [A]  
Normal current setting range is 10mA to 30mA, and also LED current at off setting is MAX 2µA of leak current.  
ISET Normal current setting example  
RISET  
LED current  
30.0mA  
20.0k(E96)  
24.0k(E24)  
30.0k(E24)  
56.0k(E24)  
25.0mA  
20.0mA  
10.7mA  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
11/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Brightness control  
There are two dimming method available; the first method is analog dimming that applies analog voltage to ISET terminal,  
and the second method is digital dimming that inputs PWM to PWM terminal. Since each method has the different merits,  
please choose a suitable method for the application of use.  
1) Current driver PWM control is controlled by providing PWM signal to PWM, as it is shown Figure 7.  
The current set up with ISET is chosen as the H section of PWM and the current is off as the L section. Therefore, the  
average LED current increases in proportion to duty cycle of PWM signal. This method that internal circuit and DC/DC  
work, because it becomes to switch the driver, the current tolerance is a few when the PWM brightness is adjusted, so it  
makes it possible to brightness control until 0.4µs (MIN1% at 25kHz). And, don't use for the brightness control, because  
effect of ISET changeover is big under 0.4µs ON time and under 3µs OFF time. Typical PWM frequency is 100Hz to  
25kHz.  
L1  
10μH  
VIN  
30  
25  
20  
15  
10  
5
2.7V to 4.6V  
COUT  
CIN  
4.7μF  
2.2μF  
VIN  
PWM  
EN  
SW  
VOUT  
PWM Input  
25mA  
RESET  
FB  
GND  
ISET  
R1  
24kꢀ  
0
0
20  
40  
60  
80  
100  
PWM  
ON  
OFF  
PWM Hi duty [%]  
LED current  
ON  
ON  
OFF  
OFF  
ON  
Coil current  
IC’s active current  
Figure 7. PWM sequence  
2) Analog dimming can be operated by applying voltage to ISET terminal via resistor as the below figure shows. ISET  
terminal voltage works to become 0.6V regardless of the connected resistor. LED current increases ISET terminal current  
600 times, so that LED current can be minimized by decreasing flow current into ISET terminal using external DC input  
L1  
10μH  
VIN  
2.7V to 4.6V  
COUT  
30  
25  
20  
15  
10  
5
CIN  
4.7μF  
2.2μF  
Vin  
PWM  
EN  
SW  
VOUT  
LED ON/OFF  
RESET  
FB  
GND  
R2 22kꢀ  
DC  
ISET  
R1  
470kꢀ  
1000 x 0.6V  
1000  
22k  
LED current =  
+
0.6V - DAC output  
0
470kꢀ  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7  
DC Voltage [V]  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
12/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Brightness control - continued  
3) The brightness control to set large current over IC max setting current is made by giving DC control voltage to VFB pin of  
IC via a series resistor as shown in under figure. LED luminance (current) changed by giving DC voltage to VFB directly.  
DC voltage is given from filtered one of DAC signal, or PWM signal shown in under figure.  
LED current (ILED) is next expression.  
ILED = [[(FB-DC) / R1] * R2 + FB ] / RFB  
L1  
10μH  
BD60A60NUX 3LEDx7parallel  
VIN  
2.7V to 4.6V  
160  
140  
120  
100  
80  
COUT  
3s7p  
CIN  
2.2μF  
4.7μF  
VIN  
PWM  
EN  
SW  
VOUT  
R2  
6.8kꢀ  
RESET  
FB  
RFB  
6.49ꢀ  
60  
R1  
22kꢀ  
ISET  
GND  
40  
20  
DC  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
DC [V]  
L1  
10μH  
BD60A60NUX 3LEDx7parallel  
VIN  
200  
180  
160  
140  
120  
100  
80  
2.7V to 4.6V  
COUT  
2.2μF  
3s7p  
CIN  
4.7μF  
VIN  
SW  
VOUT  
PWM  
EN  
RESET  
33kꢀ  
47kꢀ  
FB  
GND  
5ꢀ  
ISET  
60  
40  
100kꢀ  
PWM  
0 - 3.3V  
20  
47nF  
0
0
20  
40  
60  
80  
100  
PWM Duty [%] st 20kHz  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
13/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
The coil selection  
The DC/DC is designed by more than 4.7µH. When L value sets to a lower value, it is possibility that the specific  
sub-harmonic oscillation of current mode DC / DC will be happened.  
Please do not let L value to 3.3µH or below.  
And, L value increases, the phase margin of DC / DC becomes to zero. Please enlarge the output capacitor value when you  
increase L value.  
Output capacitor selection  
Output Capacitor smoothly keeps output voltage and supplies LED current.  
If LED current is set more than 20mA with Vcoil=2.3V to 5.5V, please make output capacitor more than 2.2µF. Otherwise  
phase margin of DC/DC decreases and might oscillate.  
Output Voltage consists of Charge (FET ON) and Discharge (LED current). So Output voltage has Output ripple Voltage  
every FET switching.  
Output ripple voltage is calculated as following.  
Output ripple Voltage  
- Switching cycle = T  
- Total LED current = ILED  
- Switching ON duty = D  
- Output ripple Voltage = Vripple  
- Output Capacitor (real value) = Creal  
- Output Capacitor = COUT  
- Decreasing ratio of Capacitor = Cerror  
Creal = COUT × Cerror  
(Capacitor value is decreased by Bias, so)  
Creal = ILED × (1-D) × T / Vripple  
COUT = ILED × (1-D) × T / Vripple / Cerror  
(Example 1)  
In case of, VIN=5.0V, fsw = 0.6MHz, VOUT =32.5V, ILED =20mA, COUT = 2.2µF, Cerror = 50%  
T = 1 / 0.6MHz  
D = 1 – VIN / VOUT = 1 – 5/32.5  
Vripple  
=
=
ILED × (1-D) × T / (COUT×Cerror) = 20mA × (5/32.5) ×(1 / 0.6MHz) / (2.2µF×0.5)  
4.7mV  
COUT  
real  
C
0V  
35V  
50V  
Output voltage  
LED selection  
Please select LED VF that input voltage is smaller than output voltage (VOUT).  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
14/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
The separation of the IC power supply and coil power supply  
This IC can work in separating the power source in both IC power supply and coil power supply. With this application, it can  
obtain that decrease of IC power consumption, and the applied voltage exceeds IC rating 5.5V.  
That application is shown in below Figure 8. The coil power supply is connected to high voltage source applied from  
adapters. Then the IC power supply is connected to the power supply that should be different from the coil power supply.  
2,3cell Battery  
L1  
Coil Power  
2.3V to 20V  
10μH  
Ccoil  
COUT  
4.7μF  
2.2μF  
IC Power  
Step down  
DC/DC  
CIN  
2.7V to 4.6V  
1μF  
VIN SW  
PWM  
VOUT  
25mA  
PWM Input  
RESET  
EN  
FB  
GND  
ISET  
R1  
24kꢀ  
Figure 8. Application at the time of power supply separation  
1 cell Battery  
L1  
10μH  
IC Power  
2.3V to 4.6V  
COUT  
CIN  
4.7μF  
2.2μF  
VIN SW  
PWM  
VOUT  
25mA  
PWM Input  
RESET  
EN  
FB  
ISET  
R1  
24kꢀ  
GND  
Figure 9. Application at the time of power supply common  
The number of available LEDs by each power supply voltage condition  
PWM dimming(LED current setting=25mA)  
2セル  
1セル  
2.7V 3V  
3セル  
VIN  
4V  
5V  
6V  
7V  
8V  
9V 10V 11V 12V 13V 14V 15V 16V 17V 18V 19V 20V  
LEDs  
2
3
4
5
6
7
8
9
10  
C、S C、S C、S C、S  
C、S C、S C、S C、S  
C、S C、S C、S C、S  
C、S C、S C、S C、S  
C、S C、S C、S C、S  
C、S C、S C、S C、S  
C、S C、S C、S C、S  
C、S C、S C、S C、S  
C、S C、S C、S C、S  
×
S
S
S
S
S
S
S
S
×
S
S
S
S
S
S
S
S
×
×
S
S
S
S
S
S
S
×
×
S
S
S
S
S
S
S
×
×
S
S
S
S
S
S
S
×
×
×
S
S
S
S
S
S
×
×
×
S
S
S
S
S
S
×
×
×
×
S
S
S
S
S
×
×
×
×
S
S
S
S
S
×
×
×
×
×
S
S
S
S
×
×
×
×
×
S
S
S
S
×
×
×
×
×
×
S
×
×
×
×
×
×
×
S
×
×
×
×
×
×
×
S
×
×
×
×
×
×
×
×
S
S
S
S
S
※ C・・・Vcoil-Vin common power supply  
ꢀ S・・・Vcoil-Vin separated power supply  
×・・・No use due to LED terminal over voltage protection  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
15/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
About the order of a power supply injection at the time of power supply separation  
Even if the IC power supply is 0V, leak channel is blocked as pull down resistor for power off is placed inside the  
IC. The resistor intercepts leak channel from coil power supply. Additionally, there is no order for standing up and down of  
coil and IC power supply.  
At the time of starting  
It doesn’t matter whether coil Power or IC Power becomes activated first.  
At the time of power supply OFF  
Please turn off after make EN terminal “L”. If power supply voltage of coil power becomes low, coil current increases  
due to high boosting, which leads to over current limit. In order to avoid this state, before turning off a power supply  
it is necessary to surely set EN to L.  
Coil Power  
Free  
IC Power  
EN  
PWM  
VOUT  
Input voltage 5VBD60A00NUX)  
The GND noise become big by impedance of PCB boards, so that wake up characteristics might become unstable.  
To select input voltage to 5V(input voltage 4.61V over), we recommend under application to insert 4.7ꢀ  
between input voltage line and Vin terminal  
L1  
10μH  
VIN  
2.7V to 5.5V  
COUT  
4.7ꢀ  
CIN  
2.2μF  
4.7μF  
VIN  
SW  
VOUT  
PWM Input  
25mA  
PWM  
EN  
RESET  
FB  
GND  
ISET  
RISET  
24kꢀ  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
16/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
PCB Layout  
In order to make the most of the performance of this IC, its PCB layout is very important. Characteristics such as efficiency  
and ripple and the likes change greatly with PCB layout, which please note carefully  
L1  
10μH  
SBD  
VIN  
2.7V to 4.6V  
COUT  
CIN  
2.2μF  
4.7μF  
VIN  
SW  
VOUT  
PWM Input  
25mA  
PWM  
EN  
RESET  
FB  
GND  
ISET  
RISET  
24kꢀ  
<Input capacitor CIN for coil>  
Connect input capacitor CIN as close as possible between coil L1 and GND.  
<Schottky barrier diode SBD>  
Connect schottky barrier diode SBD as close as possible between coils L1and SW pin.  
<Output capacitor COUT>  
Connect output capacitor COUT between cathode of SBD and GND.  
Make both GND sides of CIN and COUT as close as possible.  
<LED current setting resistor RISET(24k)>>  
Connect LED current setting resistor RISET(24k) as close as possible between ISET pin and GND.  
There is possibility to oscillate when capacity is added to ISET terminal, So pay attention that capacity isn’t added.  
<Heat radiation of back side PAD>  
PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin.  
Moreover, connect ground plane of board using via as shown in the patterns of next page.  
The efficiency of heat radiation improves according to the area of ground plane.  
<Others>  
When those pins are not connected directly near the chip, influence is give to the performance of BD60A00NUX, and  
may limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to  
reduce electric power consumption and increase the entire efficiency.  
The PCB layout in consideration of these is shown in the next page.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
17/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Recommended PCB layout  
SBD  
coil  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
18/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Selection of external parts  
Recommended external parts are as shown below.  
When to use other parts than these, select the following equivalent parts.  
L1: This coil is for boosting. Recommended capacity value is 10uH. Please use the coil with adequate direct current  
capacity and also low direct current resistor.  
Size  
Horizontal  
3.8  
DC current  
(mA)  
800  
DCR  
()  
Value  
Manufacturer  
Product number  
Vertical  
4.0  
Height  
1.2  
10µH  
10µH  
10µH  
10µH  
TDK  
TDK  
VLF4012AT-100MR79  
VLF302512MT-100M  
1094AS-100M  
0.30  
0.25  
0.18  
0.24  
3.0  
2.5  
1.2  
690  
TOKO  
TOKO  
3.5  
3.7  
1.2  
760  
1229AS-H-100M  
3.5  
3.7  
1.2  
750  
CIN: This is bypath capacitor for power supply, which removes power supply noise occurred instantly and provides stable  
power supply for IC. In order to obtain better quality, please use low ESR products such as ceramic capacitors.  
Recommended capacity value is more than 1µF.  
COUT: This is output smoothing capacitor. Recommended capacity value is 2.2µF.  
When choosing capacitors such as CIN and COUT, please be careful of pressure. The base line of pressure is about 2  
times of actual applying voltage. If pressure margin decreases, it might be happened that capacity value becomes almost a  
half of nominal value.  
Pressur Manufactur  
Size  
Value  
Product number  
e
e
Vertical  
1.6.  
Horizontal  
Height  
0.5.  
[ CIN : Power supply voltage capacitor]  
1.0µF  
10V.  
MURATA  
GRM185B31A105  
0.8.  
[COUT : Output capacitor ]  
1.0µF  
2.2µF  
50V  
50V  
MURATA  
MURATA  
GRM31MB31H105  
GRM31CB31H225  
3.2  
3.2  
1.6  
1.6  
1.15  
1.6  
RISET: LED current ILEDshould be decided when activated.  
Value Tolerance Manufacturer Product number  
[RISET : Resistor used for deciding LED current]  
Size  
I
LED (mA)  
Vertical  
Horizontal  
Height  
20kꢀ  
24kꢀ  
30kꢀ  
56kꢀ  
±0.5%  
±0.5%  
±0.5%  
±0.5%  
ROHM  
ROHM  
ROHM  
ROHM  
MCR03PZPZD2002  
1.6  
1.6  
1.6  
1.6  
0.8  
0.8  
0.8  
0.8  
0.45  
0.45  
0.45  
0.45  
30  
25  
MCR03PZPZD2402  
MCR03PZPZD3002  
MCR03PZPZD5602  
20  
10.7  
SBD: This schottky diode (SBD) is for output rectification. In order to obtain higher switching efficiency, please use low VF  
low reverse leak, and high current capacity.  
Size  
Pressure  
Manufacturer  
Product Number  
Vertical  
3.5  
Horizontal  
1.6  
Height  
0.8  
60V  
40V  
60V  
ROHM  
ROHM  
ROHM  
RB160M-60  
RB521S-40  
RB060M-60  
1.6  
0.8  
0.6  
3.5  
1.6  
0.8  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
19/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Operational Notes  
(1) Absolute Maximum Ratings  
An excess in the absolute maximum ratings, such as supply voltage (VIN), temperature range of operating conditions  
(Topr), etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an  
open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given  
to take physical safety measures including the use of fuses, etc.  
(2) Operating conditions  
These conditions represent a range within which characteristics can be provided approximately as expected. The  
electrical characteristics are guaranteed under the conditions of each parameter.  
(3) Reverse connection of power supply connector  
The reverse connection of power supply connector can break down ICs. Take protective measures against the  
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s  
power supply terminal.  
(4) Power supply line  
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.  
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.  
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the  
capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus  
determining the constant.  
(5) GND voltage  
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.  
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric  
transient.  
(6) Short circuit between terminals and erroneous mounting  
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting  
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or  
between the terminal and the power supply or the GND terminal, the ICs can break down.  
(7) Operation in strong electromagnetic field  
Be noted that using ICs in the strong electromagnetic field can malfunction them.  
(8) Inspection with set PCB  
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.  
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set  
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to  
the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In  
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention  
to the transportation and the storage of the set PCB.  
(9) Input terminals  
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the  
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of  
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input  
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not  
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power  
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the  
guaranteed value of electrical characteristics.  
(10) Ground wiring pattern  
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND  
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that  
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of  
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.  
(11) External capacitor  
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a  
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.  
(12) Thermal shutdown circuit (TSD)  
When junction temperatures become 175˚C (Typ.) or higher, the thermal shutdown circuit operates and turns a switch  
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is  
not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit  
operating or use the LSI assuming its operation.  
(13) Thermal design  
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in  
actual states of use.  
(14) Selection of coil  
Select the low DCR inductors to decrease power loss for DC/DC converter.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
20/22  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Ordering Information  
B
D
6
0
A
x
0
N
U
X
-
T R  
Part Number  
Package  
NUX: VSON008X2030  
Packaging and forming  
specification  
TR: Embossed tape and reel  
Marking Diagram  
VSON008X2030 (TOP VIEW)  
Marking  
Part Number  
BD60A00NUX  
Part Number Marking  
LOT Number  
D 6 0  
A 0 0  
D 6 0  
A 6 0  
BD60A60NUX  
1PIN MARK  
Physical Dimension Tape and Reel Information  
VSON008X2030  
<Tape and Reel information>  
2.0 0.1  
Tape  
Embossed carrier tape  
4000pcs  
Quantity  
TR  
1PIN MARK  
S
Direction  
of feed  
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
0.08  
S
1.5 0.1  
0.5  
C0.25  
1
4
8
5
0.25  
Direction of feed  
1pin  
+0.05  
0.04  
0.25  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
(Unit : mm)  
Status of this document  
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference  
to help reading the formal version.  
If there are any differences in translation version of this document formal version takes priority.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
21/22  
27.SEP.2012 Rev.001  
Daattaasshheeeett  
BD60A00NUX  
BD60A60NUX  
Revision History  
Date  
Revision  
001  
Changes  
27.Sep.2012  
New Release  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0G3G0C200320-1-2  
27.SEP.2012 Rev.001  
22/22  
Daattaasshheeeett  
Notice  
General Precaution  
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2) All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
Precaution on using ROHM Products  
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3) Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4) The Products are not subject to radiation-proof design.  
5) Please verify and confirm characteristics of the final or mounted products in using the Products.  
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8) Confirm that operation temperature is within the specified range described in the product specification.  
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precaution for Mounting / Circuit board design  
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Precautions Regarding Application Examples and External Circuits  
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2) You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1) All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Other Precaution  
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
5) The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  

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