BD61251FV [ROHM]
BD61251FV是驱动由外接MOSFET构成的单相H桥输出的预驱动器IC。搭载了丰富的功能，如支持通过PWM信号输入进行速度控制、高效降低电机驱动音的PWM软开关、简化电机设计的输入输出duty特性调整功能等。;
| 型号： | BD61251FV |
| 厂家： | 
ROHM |
| 描述： | BD61251FV是驱动由外接MOSFET构成的单相H桥输出的预驱动器IC。搭载了丰富的功能，如支持通过PWM信号输入进行速度控制、高效降低电机驱动音的PWM软开关、简化电机设计的输入输出duty特性调整功能等。 开关 电机 驱动 驱动器 |
| 文件： | 总27页 (文件大小：1610K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
DC Brushless Fan Motor Driver
Multifunction Single-phase Full-wave
Fan Motor Driver
BD61251FV
General Description
BD61251FV is pre-driver IC to drive single phase H
bridge output composed of external MOS FET.
It incorporates various functions such as speed
controllable by PWM, PWM soft switching, Input / output
duty slope adjustment.
Key Specifications
Operating Voltage Range:
Operating Temperature Range:
4.5V to 16V
-40°C to +105°C
Features
Package
SSOP-B16
W (Typ) x D (Typ) x H (Max)
5.00mm x 6.40mm x 1.35mm
Pre Driver for External Power MOS FET
Speed Controllable by PWM
Input / Output Duty Slope Adjustment
Silent Drive by the PWM Soft Switching
Lead Angle Function (Fixed value)
Soft Start
Standby Mode
Current Limit
Lock Protection and Automatic Restart
Rotation Speed Pulse Signal(FG)
Applications
SSOP-B16
General consumer equipment of Desktop PC, Server,
etc.
Office equipment, Copier, FAX, Laser Printer, etc.
Typical Application Circuits
5V (Typ)
PWM
VCC
OSC
PWM
I/O
(
)
PWM
A1H
A2H
A2L
OUT1
OUT2
M
REF
VOLTAGE
REGULATOR
A1L
A2H
A2L
PRE-
DRIVE
CONTROL
LOGIC
HP
+
HALL
COMP
HM
-
SSW
SST
ADJ
CS
+
COMP
-
A/D
CONVERTER
TSD
FG
(
)
SIG
SLP
GND
Figure 1. Application of Direct PWM Input
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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Pin Configuration
Block Diagram
(TOP VIEW)
5V (Typ)
VCC
OSC
A1H
A1L
VCC
FG
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A2H
A2L
CS
PWM
I/O
PWM
REF
A1H
VOLTAGE
REGULATOR
A1L
A2H
A2L
GND
SSW
SST
ADJ
SLP
PRE-
DRIVE
CONTROL
LOGIC
PWM
HP
HP
+
COMP
HM
-
HM
SSW
SST
ADJ
CS
+
COMP
REF
-
A/D
CONVERTER
TSD
FG
SLP
GND
Pin Description
Pin No. Pin Name
Function
1
2
A1H
A1L
VCC
FG
High side output 1
Low side output 1
Power supply
3
4
Speed pulse signal output
PWM signal input
5
PWM
HP
6
Hall signal input +
7
HM
Hall signal input -
8
REF
SLP
ADJ
SST
SSW
GND
CS
Reference voltage output
9
Input-output duty slope setting
Output duty correction
Soft start time setting
Soft switching angle setting
GND
10
11
12
13
14
15
16
Current sensing
A2L
A2H
Low side output 2
High side output 2
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Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage
VCC
Pd
18
0.88(Note 1)
-40 to +105
-55 to +150
+150
V
W
°C
°C
°C
V
Power Dissipation
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
High Side Output Voltage
Topr
Tstr
Tjmax
VOH
VOL
VCC-7 to VCC
0 to 7
10
Low Side Output Voltage
V
Output Current
IOMAX
VFG
mA
V
Rotation Speed Pulse Signal (FG) Output Voltage
Rotation Speed Pulse Signal (FG) Output Current
Reference Voltage (REF) Output Current
Input Voltage1 (PWM, CS)
18
IFG
10
mA
mA
V
IREF
VIN1
VIN2
10
5.3
Input Voltage2 (HP, HM, ADC input terminal)
3.3
V
(Note 1) Derate by 7.04mW/°C when operating above Ta=25°C. (Mounted on 114.3mm×76.2mm×1.57mm 1layer board)
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation and thermal resistance
taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
SSOP-B16
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
140.9
6
77.2
5
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Material
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Measurement Board
4 Layers
FR-4
Top
Bottom
Copper Pattern
74.2mm x 74.2mm
Copper Pattern
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
70μm
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Recommended Operating Conditions
Parameter
Supply Voltage
Symbol
Min
Typ
Max
Unit
VCC
VH
fIN
4.5
0
12
-
16
2
V
V
Hall Input Voltage
PWM Input Frequency
1
-
100
kHz
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V)
Limit
Characteristic
Parameter
Symbol
Unit
Conditions
Min
2.0
0.1
±5
Typ
3.3
0.3
±10
-
Max
5
Data
Figure 2
Figure 3
Figure 4
-
Circuit Current
ICC
1
2
mA
mA
mV
V
Standby Current
ICC
0.5
±15
5.3
+0.8
+10
-12
65
Hall Input Hysteresis
PWM Input High Level
PWM Input Low Level
VHYS
VPWMH
VPWML
IPWMH
IPWML
fPWM
2
-0.3
-10
-50
35
-
V
-
0
µA
µA
kHz
V
VPWM=5V
VPWM=0V
Figure 5
Figure 6
-
PWM Input Current
-25
50
3.0
160
PWM Drive Frequency
Reference Voltage
Current Limit Voltage
High Side Output
High Voltage
VREF
2.7
140
3.3
180
IREF=-1mA
Figure 7, 8
Figure 9
VCL
mV
VOHH
VOHL
VOLH
VOLL
VCC-0.6 VCC-0.4 VCC-0.1
VCC-5.2 VCC-4.9 VCC-4.6
V
V
V
V
IO=-3mA
IO=+3mA
IO=-3mA
IO=+3mA
Figure 10
Figure 11
Figure 12
Figure 13
High Side Output
Low Voltage
Low Side Output
4.1
-
4.5
0.1
4.8
0.2
High Voltage
Low Side Output
Low Voltage
FG Output Low Voltage
FG Output Leak Current
Lock Protection ON Time
Lock Protection OFF Time
VFGL
IFGL
tON
-
-
-
-
0.3
10
0.4
8
V
µA
s
IFG=+5mA
VFG=18V
Figure 14
Figure 15
Figure 16
Figure 17
0.2
0.3
tOFF
4
6
s
About a current item, define the inflow current to IC as a positive notation.
Input-Output Truth Table
Input
IC Output
Motor Drive Output
HP
H
L
HM
L
PWM
A1H
H
A1L
H
A2H
L
A2L
FG
Hi-Z
L
OUT1
OUT2
H
H
L
L
H
L
L
H
H
L
H
L
L
H
H
L
L
H
H
H
H-Z
L
L
Hi-Z
L
H
L
H
L
H
H
Hi-Z
H; High, L; Low, Hi-Z; High impedance
FG output is open drain output.
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Typical Performance Curves (Reference Data)
6
5
6
5
4
3
2
1
0
4
105°C
25°C
3
-40°C
Operating Voltage Range
2
105°C
25°C
1
-40°C
Operating Voltage Range
0
0
5
10
15
20
0
5
10
15
20
Supply Voltage: VCC[V]
Supply Voltage: VCC[V]
Figure 2. Circuit Current vs Supply Voltage
Figure 3. Standby Current vs Supply Voltage
20
15
10
5
30
20
10
0
105°C
25°C
-40°C
Operating Voltage Range
-40°C
25°C
-40°C
0
-10
-20
-30
25°C
105°C
105°C
-5
Operating Voltage Range
-10
0
5
10
15
20
0
5
10
15
20
Supply Voltage: VCC[V]
Supply Voltage: VCC[V]
Figure 4. Hall Input Hysteresis vs Supply Voltage
Figure 5. PWM Input Current vs Supply Voltage
(VPWM=5V)
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Typical Performance Curves (Reference Data) – continued
0
3.4
3.2
3.0
2.8
2.6
2.4
-10
-20
105℃
25℃
-40℃
-40°C
25°C
-30
105°C
-40
Operating Voltage Range
-50
0
5
10
15
20
0
2
4
6
8
10
Supply Voltage: VCC[V]
Source Current: IREF[mA]
Figure 7. Reference Voltage vs Source Current
(VCC=12V)
Figure 6. PWM Input Current vs Supply Voltage
(VPWM=0V)
3.4
3.2
3.0
2.8
2.6
2.4
200
180
160
140
120
100
VCC=16V
VCC=12V
105°C
25°C
VCC=4.5V
-40°C
Operating Voltage Range
0
2
4
6
8
10
0
5
10
15
20
Source Current: IREF[mA]
Supply Voltage: VCC[V]
Figure 8. Reference Voltage vs Source Current
Figure 9. Current Limit Voltage vs Supply Voltage
（Ta=25°C)
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Typical Performance Curves (Reference Data) – continued
0
0
-1
-2
-3
-4
-5
-6
-1
-2
-3
-4
-5
-6
-40°C
25°C
105°C
105°C
25°C
-40°C
0
2
4
6
8
10
0
2
4
6
8
10
Output Source Current: IO[mA]
Output Sink Current: IO[mA]
Figure 10. High Side Output High Voltage vs Source Current
Figure 11. High Side Output Low Voltage vs Sink Current
(VCC=12V, differential voltage to VCC
)
(VCC=12V, differential voltage to VCC)
6
5
4
3
2
1
0
6
5
4
3
2
1
0
–-40°C
25°C
105°C
105°C
25°C
-40°C
0
2
4
6
8
10
0
2
4
6
8
10
Output Source Current: IO[mA]
Output Sink Current: IO[mA]
Figure 12. Low Side Output High Voltage vs Source Current
(VCC=12V)
Figure 13. Low Side Output Low Voltage vs Sink Current
(VCC=12V)
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Typical Performance Curves (Reference Data) – continued
1.0
10
8
0.8
0.6
0.4
6
4
105°C
25°C
-40°C
2
0.2
105°C
25°C
-40°C
0
0.0
0
5
10
FG Voltage: VFG[V]
15
20
0
2
4
6
8
10
FG Sink Current: IFG[mA]
Figure 15. FG Output Leak Current vs FG Voltage
Figure 14. FG Output Low Voltage vs Sink Current
10
8
0.5
0.4
0.3
0.2
0.1
-40°C
25°C
105°C
-40°C
25°C
105°C
6
4
Operating Voltage Range
Operating Voltage Range
2
0
5
10
15
20
0
5
10
15
20
Supply Voltage: VCC[V]
Supply Voltage: VCC[V]
Figure 17. Lock Protection OFF Time vs Supply Voltage
Figure 16. Lock Protection ON Time vs Supply Voltage
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Application circuit Reference
Direct PWM Control
This is the application example of direct PWM input into PWM terminal.
1μF to
4.7μF
0.1μF
to 1μF
5V (Typ)
VCC
OSC
10kΩ to 100kΩ
PWM
I/O
(
)
PWM
PWM
0Ω to 1kΩ
A1H
A2H
A2L
OUT1
OUT2
M
REF
VOLTAGE
REGULATOR
A1L
A2H
A2L
PRE-
DRIVE
500Ω
to 2kΩ
CONTROL
LOGIC
0Ω to 1kΩ
HP
10kΩ to 100kΩ
0Ω to 0.5Ω
+
HALL
COMP
HM
-
SSW
SST
ADJ
CS
+
COMP
-
A/D
CONVERTER
TSD
FG
(
)
SIG
SLP
GND
10kΩ to
100kΩ
When a function is not used, do not let the A/D converter input terminal (SSW,SST,ADJ,SLP) open.
Resistor Divider
OK
Resistor Pull-down
(GND Short)
Terminal Open
(Prohibited input)
Resistor Pull-up
(REF Short)
OK
NG
OK
REF
A/D
REF
A/D
REF
A/D
REF
A/D
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Functional Descriptions
1. PWM Operation by Pulse Input in PWM Terminal
Output PWM duty is changed depending on input PWM duty from PWM terminal, and rotational speed is controlled. Please
refer to input voltage 1(P.3) and recommended operating conditions (P.4) for the signal input condition from a PWM terminal.
In the case of PWM terminal is open, internal voltage (about 5V) is applied to PWM terminal, and output is driven in 100%.
There must be a pull- down resistance outside of IC to make it to 0% duty when the PWM terminal opens (However, only at
the controller of the complimentary output type.). Insert the protective resistance if necessary.
Because the PWM signal is filtered inside the IC and is signal processed, the PWM frequency of the drive output is not same
to the input PWM frequency.
The resolution of input duty is 8bit (256steps). Output PWM resolution is 8bit, output PWM frequency is 50kHz. When
computed duty is less than 2.3%, a driving signal is not output.
PWM
(Internal signal)
High
A1H
Low
High
Controller
Motor Unit
A1L
A2H
Driver
Low
5V (Typ)
High
Protection
Resistor
200kΩ(Typ)
FILTER
Low
PWM
(
)
PWM
High
A2L
Low
Pull-down
Resistor
Complimen
-tary Output
High
OUT1
Low
Motor output ON
: High impedance
High
Low
Figure 18. PWM Input Application
OUT2
Figure 19. Output PWM Operation Timing Chart
2. Input-output Duty Slope Setting (SLP)
Slope properties of input duty and output duty can be set with SLP terminal like Figure 20.
The resolution is 7bit (128 steps).
The voltage of SLP terminal is less than 0.375V (Typ), slope of input-output duty characteristic is fixed to 1. And fixed to 0.5 in
0.375V to 0.75V (Typ) (refer to Figure 21). When slope setting is not set, pull-down SLP terminal or GND short.
Input-output duty slope
(128 steps)
100
2
Slope=0.5
1.5
Slope Setting
1
0.5
Slope=2
0
100
0
0.75
0.375
1.5
2.25
REF
PWM Input Duty [%]
SLP Input Voltage [V]
Figure 20. Properties of Input-output Duty Slope Setting
Figure 21. Relations of SLP Terminal Voltage and
the Input-output Duty Slope Characteristics
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3. Input and Output Duty Properties Adjustment Function (ADJ)
When input duty vs output duty shows the characteristic of the straight line, rotational speed may become the
characteristics that middle duty area swells by the characteristic of fan motor. (Figure 22)
Rotational
Speed
Output
Duty
Input Duty
Figure 22. Properties Curve of Input PWM Duty vs Rotational Speed
This IC reduces duty in the middle duty area and can adjust rotational speed characteristics of the motor with a straight line.
Rotational
Speed
Output
Duty
Input Duty
Figure 23. Properties Curve of Input PWM Duty vs Rotational Speed after Adjusting
The adjustment to reduce duty is performed by ADJ terminal input voltage. The ADJ terminal is input terminal of A/D
converter and the resolution is 8bit. By input 0 of the ADJ terminal, the characteristic of input duty vs. output duty becomes
straight line (no adjustment). The adjustment become maximum by input 256(max), and output duty in input duty 50%
decreases to about 25%.
100
75
50
25
0
0
25
50
75 100
Input Duty [%]
Figure 24. Input Duty vs Output Duty Characteristics
Please set the voltage of ADJ terminal so that motor rotation speed in input duty 50% is on the diagonal which links the
rotation speed of 0% to 100%. IC corrects output duty so that overall rotation speed properties match a straight line.
When it is used together with SLP function, at first ADJ adjustment is performed in slope=1, and please adjust SLP after
adjusting input duty vs. rotation speed property.
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4. Soft Switching Setting
(1)Soft Switching Angle Setting (SSW)
Angle of the soft switching can be set by the input voltage of SSW terminal. When one period of the hall signal is
assumed 360°, the angle of the soft switching can be set from 0° to 90° by the input voltage of SSW terminal (refer to
Figure 25). Resolution of SSW terminal is 128 steps. Operational image is shown in Figure 26.
*Soft switching angle means the section where output duty changes between 0% and setting duty at the timing of output
phase change. To smooth off the current waveform, the coefficient table that duty gradually changes is set inside IC, and
the step is 16.
Angle range of soft switching：0° - Max 90°
HP
Soft switching angle
Angle [°]
HM
(128 steps)
Hall signal 1cyle 360°
90
67.5
45
High
VCOIL1
Low
High
VCOIL2
Low
22.5
Motor
Current
0
0.75
1.5
2.25
VREF
SSW Input Voltage [V]
Soft Switching Angle (Max 90°)
Figure 25. Relations of SSW Terminal
Voltage and the Angle of Soft Switching
Figure 26. Soft Switching Angle
5. Lead Angle Function (LA)
An output phase change for the hall signal is fixed to the angle of lead. When one period of the hall signal is assumed 360°,
lead angle is set about 5.6°. Operational image is shown in Figure 27.
Soft switching; 40°
Lead angle; 5.6° (Fixed value)
HP
HM
Hall signal 1cycle 360°
OUT1
OUT2
Motor
Current
Soft switching angle 40°
Lead angle 5.6°
Figure 27. Lead Angle Operation
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6. Soft Start
Soft start function gradually change drive duty to suppress sound noise and peak current when the motor start up etc. PWM
duty resolution is 8bit (256steps, 0.39% per step). SST terminal sets the step up time of duty increment.
Soft start step up time
(256 steps)
38.4
28.8
19.2
9.6
0
0.75
1.5
2.25
VREF
SST Input Voltage [V]
Figure 28. Relations of SST Terminal Voltage and Soft Start Step Up Time
Duty transition time is
(Difference of current duty and Target duty (output duty after SLP/ADJ calculation)) x (step time)
When soft start time is set for a long time, lock protection may be detected without enough motor torque when motor start up
from 0% duty. Therefore start up duty is set to approximately 20% (50/256).
Input Duty
50%
Input Duty
100%
20%
100%
50%
Output Duty
Output Duty
20%
Soft start section
Soft start section
Start with Input Duty 100%
Start with Input Duty 50%
Figure 29. Soft Start Operation Image from Motor Stop Condition
When SST terminal voltage = REF terminal voltage, and 100% duty is input on motor stop condition, output duty arrives at
100% after progress the time of 38.4ms x (256-50step) = 7.91 seconds
Soft start functions always work when the change of input duty as well as motor start up. In addition, it works when duty goes
down from high duty. Duty step down time is the half of duty step up time.
7. Start Duty Assist
It is the function that enable the motor to start even if drive duty output is low, when the soft start function is not used. When
input duty is within 50% at motor stop condition, 50% duty is output till four times of hall signal change are detected.
Operational image is shown in Figure 30.
FG
Input Duty
10%
50%
Output Duty
50%
10%
Hall detect
0%
Power ON
Figure 30. Start Duty Assist Operation at Input Duty 10%
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8. Standby Function
When PWM terminal input duty is less than 1.5% (input PWM frequency 25kHz), IC shut off the circuit to reduce current
consumption in motor stop state. Because circuit current of IC oneself is cut with the standby mode, and the voltage output
of the REF terminal stops, the power consumption that a hall device uses and the power consumption to use by resistance
for the input setting of the analog-digital converter can be reduced.
This IC processes input duty from PWM terminal through the filter in logic circuit. Therefore the time to shift standby mode
varies according to input PWM duty before inputting PWM=L. When PWM=L is input, relations of the input duty till then and
the time to detect 0% are shown in Figure 32.
0%
detection time
PWM
Standby signal
(Internal signal)
In operation
In operation
PWM
recognition time
1.2ms
Standby state
Figure 31. Standby Detection Time and Recover Time
0% Detection Time [ms]
Figure 32. Input PWM Duty vs 0% Detection Time
*When the soft start time is set, it takes more time to duty fall down except the filter time of Figure 32.
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9. Current Limit
Current limit function turns off the output when the current flow through the motor coil is detected exceeding a set value. The
working current value of the limit is determined by current limit voltage VCL and CS terminal voltage.
In Figure 33, current flow in motor coil is Io, resistor to detect Io is RNF, power consumption of RNF is PR, current limit voltage
VCL=160mV (Typ), current limit value and power consumption of RNF can be calculated below expression. When current limit
function is not used, please short CS terminal to GND.
Io[A] = VCL[V] / RNF[Ω]
= 160[mV] / 0.1[Ω]
= 1.6[A]
PR[W] = VCL[V] x Io[A]
VCC
= 160[mV] x 1.6[A]
= 0.256[W]
M
CS
+
-
Io
RNF
CURRENT
LIMIT COMP
GND
Motor current GND line
GND
IC GND line
Figure 33. Current Limit Setting and GND Line
10. Lock Protection and Automatic Restart
Motor rotation is detected by hall signal period. IC detects motor rotation is stop when the period becomes longer than the
time set up at the internal counter, and IC turns off the output. Lock detection ON time (tON) and lock detection OFF time
(tOFF) are set by the digital counter based on internal oscillator. Therefore the ratio of ON/OFF time is always constant.
Timing chart is shown in Figure 34.
Idring
HM
HP
A1H
A1L
A2H
A2L
tOFF
tOFF
tOFF
tON
tON
tON
OUT1
OUT2
FG
Lock Detect
Lock
Lock Release
Figure 34. Lock Protection Timing Chart
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11. High-speed Detection Protection
When a hall input signal is abnormally fast (more than 1.525kHz, 45,750rpm as 4 pole motor), the lock protection operation
works. When noise is easy to appear in a hall input signal, please put a capacitor between hall input terminals like C1 of
Figure 36.
12. Hall Input Setting
The input voltage of a hall signal is input in "Hall Input Voltage" in P.4 including signal amplitude. In order to detect rotation
of a motor, the amplitude of hall signal more than "Hall Input Hysteresis" is required. Input the hall signal more than
30mVpp at least.
2V
GND
Figure 35. Hall Input Voltage Range
○Reducing the Noise of Hall Signal
Hall element may be affected by VCC noise or the like depending on the wiring pattern of board. In this case, place a
capacitor like C1 in Figure 36. In addition, when wiring from the hall element output to IC hall input is long, noise may be
loaded on wiring. In this case, place a capacitor like C2 in Figure 36.
HM
HP
REF
C2
R1
Bias current
＝VREF/ (R1 + RH)
C1
RH
Hall Element
Figure 36. Application near of Hall Signal
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I/O Equivalent Circuit
1. Hall signal input
2. PWM signal input
5V (Typ)
5V (Typ)
200kΩ
1kΩ
HP
HM
PWM
3. Current sensing
4. A/D converter input
SSW
SST
ADJ
SLP
1kΩ
CS
5. Reference voltage output
6. FG signal output
VCC
FG
REF
7. High side output
8. Low side output
VCC
5V (Typ)
A1H
A2H
A1L
A2L
Vcc-5V
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Safety Measure
1. Reverse Connection Protection Diode
Reverse connection of power results in IC destruction as shown in Figure 37. When reverse connection is possible, reverse
connection protection diode must be added between power supply and VCC.
After reverse connection
In normal energization
Reverse power connection
VCC
destruction prevention
VCC
VCC
Circuit
Block
Circuit
Block
Circuit
Block
I/O
I/O
I/O
GND
GND
GND
Internal circuit impedance is high
Large current flows
No destruction
Amperage small
Thermal destruction
Figure 37. Flow of Current When Power is Connected Reversely
2. Problem of GND Line PWM Switching
Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.
VCC
Motor
Driver
Controller
M
GND
PWM Input
Prohibited
Figure 38. GND Line PWM Switching Prohibited
3. External Connecting Terminal
Missconnecting of external connector from motor PCB, or hotplug of the connector, it may cause damage to IC by rush
current or over voltage surge.
About the input/output terminal except VCC/GND line, please take measures such as protection resistor so that IC is not
affected by over voltage or excess current.
MOTOR PCB
＋
VCC
IC
Protection
Resistor
Protection
Resistor
PWM
PWM
FG
GND
—
SIG
Figure 39. Protection of PWM/FG terminal
18/24
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Power Dissipation
1. Power Dissipation
Power dissipation indicates the power that can be consumed by IC at Ta=25°C. IC is heated when it consumes power, and
the temperature of IC chip becomes higher than ambient temperature. The temperature that can be allowed by IC chip into
the package is the absolute maximum rating of the junction temperature. And it depends on circuit configuration,
manufacturing process, etc. Power dissipation is determined by this maximum junction temperature, thermal resistance of
mounting condition, and ambient temperature. Therefore, when the power dissipation exceeds the absolute maximum rating,
the operating temperature range is not a guarantee. The maximum junction temperature is in general equal to the maximum
value in the storage temperature range.
2. Thermal Resistance
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. Thermal resistance from the
chip junction to the ambient is represented in θJA [°C/W], and thermal characterization parameter from junction to the top
center of the outside surface of the component package is represented in ΨJT [°C/W]. Thermal resistance is divide into the
package part and the substrate part. Thermal resistance in the package part depends on the composition materials such as
the mold resins and the lead frames. On the other hand, thermal resistance in the substrate part depends on the substrate
heat dissipation capability of the material, the size, and the copper foil area etc. Therefore, thermal resistance can be
decreased by the heat radiation measures like installing a heat sink etc. in the mounting substrate.
The thermal resistance model is shown in Figure 40, and equation is shown below.
Ambient temperature: Ta[°C]
θJA = (Tj – Ta) / P [°C/W]
Package outside surface (top center)
temperature: Tt[°C]
ΨJT = (Tj – Tt) / P [°C/W]
θ
JA[°C/W]
where:
θJA is the thermal resistance from junction
to ambient [°C/W]
Junction temperature: Tj[°C]
Ψ
JT[°C/W]
ΨJT is the thermal characterization parameter from
junction to the top center of the outside surface of the
component package [°C/W]
Tj is the junction temperature [°C]
Ta is the ambient temperature [°C]
Tt is the package outside surface (top center)
temperature [°C]
Mounting Substrate
Figure 40. Thermal Resistance Model of Surface Mount
P is the power consumption [W]
Even if it uses the same package, θJA and ΨJT are changed depending on the chip size, power consumption, and the
measurement environments of the ambient temperature, the mounting condition, and the wind velocity, etc.
3. Thermal De-rating Curve
Thermal de-rating curve indicates the power that can be consumed by the IC with reference to ambient temperature. Power
that can be consumed by IC begins to attenuate at ambient temperature 25°C, and becomes 0W at the maximum junction
temperature 150°C. The inclination is reduced by the reciprocal of thermal resistance θja. The thermal de-rating curve under
a condition of thermal resistance (P.3) is shown in Figure 41.
1.0
0.8
-1/θJA = -7.04mW/°C
0.6
0.4
Operating temperature range
0.2
0.0
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 41. Power Dissipation vs Ambient Temperature
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Operational Notes
1.
2.
3.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
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Operational Notes – continued
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 42. Example of thic IC uctur
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown (TSD) Circuit
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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Ordering Information
B D 6 1 2 5 1 F V -
E 2
Part Number
Package
FV: SSOP-B16
Package and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B16
(TOP VIEW)
6 1 2 5 1
Part Number
LOT Number
1PIN Mark
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Physical Dimension Tape and Reel Information
Package Name
SSOP-B16
<Tape and Reel information>
Tape
Embossed carrier tape
2500pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
Direction of feed
1pin
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
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Revision History
Date
Revision
001
Changes
12.Oct.2017
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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