BD62120AEFJ_技术文档

Datasheet

36V 1ch

DC Brush Motor Drivers

BD62120AEFJ

General Description

Key Specifications

BD62120AEFJ is a built-in 1 channel H-bridge motor

driver for DC brush motors. This driver can facilitate low

power consumption by direct PWM. There are built in

protection circuits in this IC. Each protection circuit

operation contributes to set high reliability.

 Power Supply Voltage Range:

 Rated Output Current:

 Rated Output Current (Peak):

 Operating Temperature Range:

 Output ON-Resistance:

8 to 28 [V]

2.0 [A]

3.0 [A]

-25 to +85 [°C]

0.65 [Ω] (Typ)

(Total of upper and lower resistors)

Features

Package

HTSOP-J8

W(Typ) x D(Typ)x H(Max)

4.90mm x 6.00mm x 1.00mm

 Single Power Supply Input (rated voltage of 36V)

 Rated Output Current (peak) 2.0A(3.0A)

 Low ON-Resistance DMOS Output

 Forward, Reverse, Brake, Open

 External PWM Control

 Driver for DC Brush Motor

 Built-in logic input pull-down resistor

 Cross-conduction Prevention Circuit

 Thermal Shutdown Circuit (TSD)

 Over-current Protection Circuit (OCP)

 Under Voltage Lock out Circuit (UVLO)

 Over Voltage Lock out Circuit (OVLO)

 Ghost Supply Prevention (protects against malfunction

when power supply is disconnected)

 Adjacent Pins Short Protection

 Inverted Mounting Protection

 HTSOP-J8 package

Typical Application Circuit

Application

Plain Paper Copier (PPC), Multi-function Printer,

Laser Printer, Inkjet Printer, Photo Printer, FAX,

Mini Printer and etc.

VCC

OUT1

TEST

IN1

IN2

OUT2

GND

Figure 1. Typical Application Circuit

○Product structure：silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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Pin Configuration

Block Diagram

3

Regulator

GND

1

OUT2

TEST

8

7

6

5

2

3

4

OUT1

VCC

TSD

OCP

IN2

IN1

UVLO

OVLO

GND

3

Forward

Reverse

BRAKE

Open

2

8

5

6

1,4

Figure 2. Pin Configuration

Figure 3. Block Diagram

Pin Descriptions

Pin No.

1

Pin Name

Function

Pin No.

5

Pin name

IN1

Function

GND

OUT1

VCC

Ground terminal

H bridge control terminal

Test terminal (Connected to GND)

H bridge output terminal

2

3

4

H bridge output terminal

Power supply terminal

Ground terminal

6

7

8

IN2

TEST

OUT2

GND

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Absolute Maximum Ratings (Ta=25°C)

Parameter

Symbol

Rating

Unit

V

Supply Voltage

V_CC

Pd

-0.2 to +36.0

0.82 ^{(Note 1)}

Power Dissipation

W

3.75 ^{(Note 2)}

-0.2 to +5.5

2.0 ^{(Note 3)}

3.0 ^{(Note 4)}

-25 to +85

-55 to +150

+150

Input Voltage for Control Pin

Output Current

V_IN

I_OUT

V

A

Output Current (peak)

I_OUTPEAK

Topr

A

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

°C

Tstg

Tjmax

(Note 1) When mounted on 70mm×70mm×1.6mm glass epoxy board. Reduced by 6.56mW/°C when operating above Ta=25°C.

(Note 2) When mounted using 4-layers, reduced by 30.0mW/°C when oprating above Ta=25°C.

(Note 3) Do not, however exceed Pd and Tjmax=150°C.

(Note 4) Pulse width tw ≤1ms, duty 20ms

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated

over the absolute maximum ratings.

Recommended Operating Conditions (Ta= -25 to +85°C)

Parameter

Supply Voltage

Maximum Output Current (Continuous)

Symbol

V_CC

Range

Unit

8 to 28

1.7 ^{(Note 5)}

V

A

I_OUT

(Note 5) Do not, however exceed Pd and Tjmax=150°C.

Electrical Characteristics (Unless otherwise specified Ta=25°C, V_CC=24V)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

【Whole】

Circuit Current at Standby

Circuit Current

I_CCST

I_CC

-

10

µA

IN1=L, IN2=L

1.4

2.5

mA

IN1=H or IN2=H

【Control Input】

H Level Input Voltage

L Level Input Voltage

H Level Input Current

L Level Input Current

【Output (OUT1, OUT2)】

V_INH

V_INL

I_INH

I_INL

2.0

-

V

0.8

100

-

35

-10

50

0

µA

V_IN=5V

V_IN=0V

I_OUT=±1.5A

Output ON-Resistance

Output Leak Current

R_ON

-

0.65

-

0.85

10

Ω

(Sum of upper and lower)

I_LEAK

µA

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●Points to Notice for Terminal Description and PCB Layout

○ IN1, IN2/ H Bridge Control Terminal

It decides output logic for H bridge.

Input

Output

State

IN1

L

IN2

L

OUT1

OUT2

OPEN

STOP

H

L

H

L

H

L

FORWARD

REVERSE

BRAKE

L

H

○ TEST/ Terminal for Testing

This is the terminal used at the time of distribution test. Please connect to GND. Please be careful because there is a

possibility of malfunction if it is not connected to GND.

○ VCC/ Power Supply Terminal

Motor’s drive current is flowing in it, so please connect it in such a way that the wire is thick & short and has low

impedance. VCC voltage may have great fluctuation, so please connect the bypass capacitor (100uF to 470uF) as

close as possible to the terminal. Adjust in such a way that the VCC voltage is stable. Please increase the

capacitance if needed, especially when large current or motors that have great back electromotive force are used. In

addition, to reduce the power supply’s impedance in wide frequency bandwidth, parallel connection of multi-layered

ceramic capacitor (0.01µF to 0.1µF) is recommended. Extreme care must be observed to make sure that the VCC

voltage does not exceed the rating even for a moment. Moreover, there is a built-in clamp component in the output

terminal to prevent electrostatic destruction. If sudden pulse or surge voltage of more than the maximum absolute

rating is applied, the clamp component operates which can result to destruction. Please be sure to not exceed the

maximum absolute rating. It is effective to mount a Zener diode with maximum absolute rating. Also, diode is inserted

between VCC terminal and GND terminal to prevent electrostatic destruction. If reverse voltage is applied between

VCC terminal and GND terminal, there is a danger of IC destruction so please be careful.

○ GND/ Ground Terminal

In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, please

connect it in such a way that the wiring impedance from this terminal is made as low as possible to achieve the

lowest electrical potential no matter what operating state it may be.

○ OUT1,OUT2/ H Bridge Output Terminal

Motor’s drive current is flowing in it, so please connect it in such a way that the wire is thick & short and has low

impedance. It is also effective to add a Schottky diode if output has great positive or negative fluctuation when large

current is applied. For example, a counter electromotive voltage etc. is great. Moreover, there is a built-in clamp

component in the output terminal to prevent electrostatic destruction. If sudden pulse or surge voltage of more than

the maximum absolute rating is applied, the clamp component operates which can result to destruction. Please be

sure to not exceed the maximum absolute rating.

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●Protection Circuits

○ Thermal Shutdown (TSD)

This IC has a built-in Thermal Shutdown circuit for thermal protection. When the IC’s chip temperature rises above

175°C (Typ), the motor output becomes OPEN. Also, when the temperature returns to under 150°C (Typ), it

automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be applied

externally, heat overdrive can lead to destruction.

○ Over-Current Protection (OCP)

This IC has a built in Over-Current Protection circuit as a provision against destruction when the motor outputs are

shorted to each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to

OPEN condition when the regulated threshold current flows for 4μs (typ). It returns with power reactivation. The

over-current protection circuit aims to prevent the destruction of the IC only from abnormal situations such as when

motor output is shorted and it is not meant to be used as protection or security for the device. Therefore, the device

should not be designed to make use of the function of this circuit. After OCP operation, if abnormal situations

continues and returned by power reactivation or reset of the PS terminal happens repeatedly, then OCP operates

constantly. The IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the long

wiring and the over-current flows, the output terminal voltage increases and the absolute maximum values may be

exceeded. As a result, there is a possibility of destruction. Also, when a current flows, which is over the output current

rating and under the OCP detection current, the IC can heat up to over Tjmax=150°C. This can deteriorate the IC.

Therefore, current which exceeds the output rating should not be applied.

○ Under Voltage Lock Out (UVLO)

This IC has a built-in Under Voltage Lock Out function to prevent false operation such as IC output during power

supply under voltage. When the applied voltage to the VCC terminal goes under 5V (Typ), the motor output is set to

OPEN. This switching voltage has a 1V (Typ) hysteresis to prevent false operation by noise etc.

○ Over Voltage Lock Out (OVLO)

This IC has a built-in Over Voltage Lock Out function to protect the IC output and the motor during power supply over

voltage. When the applied voltage to the VCC terminal goes over 32V (Typ), the motor output is set to OPEN. This

switching voltage has a 1V (Typ) hysteresis and a 4μs (Typ) mask time to prevent false operation by noise etc.

Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum

value for power supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded.

○

Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a control signal (IN1, IN2) is applied when there is no power supplied to the IC, there is a function which prevents

false operation by voltage applied via the electrostatic destruction prevention diode from the control input terminal to

the VCC, to this IC or to another IC’s power supply. Therefore, there is no malfunction in the circuit even when

voltage is supplied to these input terminals while there is no power supply.

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●External PWM Control

This series can drive motors by IN1and IN2 input directly from the microcomputer.

Decay mode can be SLOW DECAY or FAST DECAY.

SLOW DECAY (forward rotation)

Input

Output

State

IN1

H

IN2

L

OUT1

OUT2

H

L

ON

SLOW DECAY

ON

H

L

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (synchronous rectification, forward rotation)

Input Output

State

IN1

H

IN2

L

OUT1

OUT2

H

L

H

L

ON

FAST DECAY

ON

L

H

L

H

L

H

L

H

L

FAST DECAY

ON

H

FAST DECAY

SLOW DECAY

OFF to OFF

OFF to ON

ON to OFF

OFF to ON

M

ON to ON

OFF to ON

Output ON

Current decay

Figure 4. Route of Regenerative Current during Current Decay

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●Power dissipation

Please confirm that the IC’s chip temperature Tj is not over 150℃, while considering the IC’s power consumption (W),

package power (Pd) and ambient temperature (Ta). When Tj=150℃ is exceeded the functions as a semiconductor do not

operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration

and eventually destruction of the IC. Tjmax=150℃ must be strictly obeyed under all circumstances.

○Thermal Calculation

The IC’s consumed power can be estimated roughly with the power supply voltage (V_CC), circuit current (I_CC), output

ON-Resistance (R_ONH, R_ONL) and motor output current value (I_OUT).

The calculation method during external PWM drive, SLOW DECAY, driving is shown here:

Consumed power of the Vcc[W] = Vcc[V]･I_CC[A] ･･･････①

Consumed power of the output DMOS[W] = (R_ONH[Ω] + R_ONL[Ω])･I_OUT[A]²･on_duty[%]/100

During output ON

+ (2･R_ONL[Ω])･I_OUT[A]²･(100 - on_duty[%])/100 ･･･････②

During current decay

However, on duty: PWM on duty [%]

Upper P-Channel DMOS

ON-Resistance R_ONH[Ω] (Typ) ON-Resistance R_ONL[Ω] (Typ)

0.4 0.25

Lower N-Channel DMOS

Model Number

BD62120AEFJ

Consumed total power of IC W_total [W] = ① + ②

Junction temperature T_j= Ta[°C] + θ_ja[°C/W]･W_total [W]

However, the thermal resistance value θja [°C/W] differs significantly depending on circuit board conditions. Refer to the

Power Dissipation curve. Also, we are taking measurements of thermal resistance value θja of the actual boards used.

Please feel free to contact our salesman. The calculated values above are only theoretical. For actual thermal design,

please perform sufficient thermal evaluation for the application board used, and create the thermal design with enough

margin to not exceed Tjmax=150°C. Although not normally used, if the IC is to be used under specific or strict heat

conditions, please consider attaching an external Schottky diode between the motor output terminal and GND to

decrease heat from the IC.

○Temperature Monitoring

There is a way to directly measure the approximate chip temperature by using the TEST terminal. However, temperature

monitor using TEST terminal is only for evaluation and experimenting, and must not be used in actual usage conditions.

TEST terminal has a protection diode to prevent electrostatic discharge. The temperature may be monitored using this

protection diode.

(1) Measure the terminal voltage when a current of I_DIODE=50μA flows from the TEST terminal to the GND, without

supplying VCC to the IC. This measurement is the V_Fvoltage inside the diode.

(2) Measure the temperature characteristics of this terminal voltage. (V_Fhas a linear negative temperature factor against

the temperature.) With the results of these temperature characteristics, chip temperature may be calibrated from the

TEST terminal voltage.

(3) Supply VCC, confirm the TEST terminal voltage while running the motor, and the chip temperature can be

approximated from the results of (2).

-Vf [mV]

TEST

Circuitry

I_DIODE

V

25

150 Chip temperature Tj [°C]

Figure 5. Model Diagram for Measuring Chip Temperature

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●Application Circuit Diagram

GND

4

Bypass capacitor.

Setting range is

TSD

OCP

100µF to 470µF (electrolytic)

0.01µF to 0.1µF(multilayer ceramic etc.)

Refer to page 4 for detail.

UVLO

OVLO

Control input terminal.

Input PWM signal at external

PWM control.

VCC

Refer to page 6 for detail.

3

OUT1

100µF

0.1µF

2

8

M

Forward

Reverse

BRAKE

Open

5

6

OUT2

GND

IN1

IN2

1

Terminal for testing

Connect to GND.

TEST

7

Figure 6. Block Diagram & Application Circuit Diagram

Constant Voltage Control or External PWM Control

○ Input/Output table

IN1

Input

Output

State

IN2

L

OUT1

OUT2

L

H

L

OPEN

STOP

L

H

L

H

L

FORWARD

REVERSE

BRAKE

H

○ Example of external PWM control sequence

SLOW DECAY (forward rotation)

Input

Output

State

ON

IN1

H

IN2

L

OUT1

OUT2

H

L

H

L

SLOW DECAY

ON

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (forward rotation)

Input

Output

State

IN1

H

IN2

OUT1

OUT2

L

H

L

H

L

H

L

ON

FAST DECAY

ON

L

H

L

H

L

H

L

FAST DECAY

ON

H

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I/O Equivalent Circuits

VCC

10kΩ

OUT1

OUT2

Control

input

100kΩ

GND

Circuitry

Figure 7. I/O Equivalent Circuits

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may

result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the

board size and copper area to prevent exceeding the maximum junction temperature rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

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Operational Notes – continued

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 8. Example of monolithic IC structure

13. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls

below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

14. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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●Power Dissipation

○HTSOP-J8 Package

HTSOP-J8 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the

back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power

dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a possibility

for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is recommended that the

back metal is soldered onto the GND to short. Please note that it has been assumed that this product will be used in the

condition of this back metal performed heat dissipation treatment for increasing heat dissipation efficiency.

Measurement machine：TH156 (Kuwano Electric)

Measurement condition：ROHM board

Board size：70mm x 70mm x 1.6mm

(With through holes on the board)

4.0

3.0

2.0

1.0

3.75W

2.11W

4

Board ①: 1-layer board (Copper foil : 0mm x 0mm)

Board ②: 2-layer board (Copper foil : 15mm x 15mm)

Board ③: 2-layer board (Copper foil : 70mm x 70mm)

Board ④: 4-layer board (Copper foil : 70mm x 70mm)

Board ①: θ_ja=153.2°C/W

Board ②: θ_ja=113.6°C/W

Board ③: θ_ja=59.2°C/W

Board ④: θ_ja=33.3°C/W

3

2

1.10W

0.82W

1

0

25

50

75 85 100

125

150

Ambient Temperature:Ta[°C]

Figure 9. HTSOP-J8 Power Dissipation

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Ordering Information

A E F

J

B D 6 2 1 2 0

-

E 2

Part number

Packaging and forming specification

E2: Reel-wound embossed taping

Package type

EFJ

:HTSOP-J8

Marking Diagram

HTSOP-J8(TOP VIEW)

Part Number Marking

6 2 1 2 0 A

LOT Number

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

HTSOP-J8

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Revision History

Date

Revision

001

Changes

21.Jun.2017

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD62120AEFJ
厂家：	ROHM
描述：	BD62120AEFJ是能驱动DC有刷电机的含1个电路的H桥电机驱动器。通过直接PWM驱动可实现高效率驱动。内置各种保护电路，有利于实现组件的高可靠性。电机驱动驱动器
文件：	总18页 (文件大小：1231K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD62120AEFJ [ROHM]

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