BD62210AEFV_技术文档

Datasheet

Driver IC for PPC

High Performance, High Reliability

36V 2ch DC Brush Motor Drivers

for PPC's etc.

BD62210AEFV

General Description

Key Specifications

BD62210AEFV is a built-in 2 channel H-bridge motor

driver for 2 DC brush motors or 1 stepper motor. This

driver can facilitate low power consumption by direct

PWM or PWM constant current control. There are built in

protection circuits in this IC. It is possible to output an

abnormal detection signal for Wired-OR that notifies each

protection circuit operation, which contributes to set high

reliability.

 Power Supply Voltage Range:

 Rated Output Current:

 Rated Output Current (Peak):

 Operating Temperature Range:

 Output ON-Resistance:

8 to 28 [V]

1.0 [A]

1.5 [A]

-25 to +85 [°C]

1.90 [Ω] (Typ)

(Total of upper and lower resistors)

Package

W(Typ) x D(Typ)x H(Max)

Features

 Single Power Supply Input (rated voltage of 36V)

 Rated Output Current (peak): 1.0A(1.5A)

 Low ON-Resistance DMOS Output

 Forward, Reverse, Brake, Open

 Power Save Function

 External PWM Control

 PWM Constant Current Control (current limit function)

 Built-in Spike Noise Cancel Function (external noise

filter is unnecessary)

HTSSOP-B28

9.70mm x 6.40mm x 1.00mm

 Driver for 2 DC Brush Motor

 Driver for 1 Stepper motor

 FULL STEP, HALF STEP (driving stepper motor)

 µSTEP Drive by External DAC (driving stepper motor)

 Built-in logic input pull-down resistor

 Cross-conduction Prevention Circuit

 Output detection signal during abnormal states

(Wired-OR)

 Thermal Shutdown Circuit (TSD)

 Over-current Protection Circuit (OCP)

 Under Voltage Lock out Circuit (UVLO)

 Over Voltage Lock out Circuit (OVLO)

 Ghost Supply Prevention (protects against malfunction

when power supply is disconnected)

 Adjacent Pins Short Protection

Figure 1

Typical Application Circuit

GND

PS

9

13

16

17

IN1A

IN1B

15

FAILA

VCC1

IN2A 19

20

7

IN2B

OUT1A

5

2

3

VREF1 11

VREF2 12

OUT1B

 Inverted Mounting Protection

 Microminiature, ultra-thin and high heat-radiation

(exposed metal type) HTSSOP-B28 package

RNF1

RNF1S

4

CR

10

VCC2

22

24

27

26

OUT2A

Application

Plain Paper Copier (PPC), Multi-function Printer, Laser

Printer, Inkjet Printer, Photo Printer, FAX, Mini Printer and

etc.

OUT2B

RNF2

TEST2

18

25

1

14

RNF2S

GND

TEST1

Figure 2. Typical Application Circuit

○Product structure：silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

1/21

TSZ22111・14・001

BD62210AEFV

Pin Configuration

Block Diagram

[TOP VIEW]

28

27

26

1

2

3

4

5

NC

GND

＋

－

15

11

＋

－

1/8

Regulator

RNF1S

OUT1B

RNF1

OUT2B

RNF2

＋

－

12

10

＋

－

1/8

RNF2S

TSD

OCP

Blank time

RNF1S

OUT1A

PWM control

UVLO

OVLO

25 RNF2S

OSC

24

23

OUT2A

NC

6

7

5

2

VCC1

22 VCC2

Forward

Reverse

Brake

16

17

3

4

21

NC

8

NC

Open

GND

9

20 IN2B

19 IN2A

22

Forward

Reverse

Brake

24

27

19

20

CR

10

11

12

13

14

Open

26

25

VREF1

18

17

TEST2

IN1B

13

18

14

VREF2

PS

1,9

IN1A

16

15

TEST1

FAILA

Figure 3. Pin Configuration

Figure 4. Block Diagram

Function

Pin Descriptions

Pin No.

Pin Name

Function

Ground terminal

Pin No.

Pin name

Output signal to detect abnormal

states

1

2

3

GND

OUT1B

RNF1

15

16

17

FAILA

IN1A

IN1B

H bridge output terminal

H bridge control terminal

Connection terminal of resistor

for output current detection

Input terminal of current limit

comparator

4

RNF1S

18

TEST2

Test terminal (Connected to GND)

5

6

7

8

9

OUT1A

NC

H bridge output terminal

No connection

19

20

21

22

23

IN2A

IN2B

NC

H bridge control terminal

No connection

VCC1

NC

Power supply terminal

No connection

VCC2

NC

Power supply terminal

No connection

GND

Ground terminal

Connection terminal of CR

for setting switching frequency

10

CR

24

OUT2A

H bridge output terminal

Input terminal of current limit

comparator

11

12

VREF1

VREF2

Current limit value setting terminal

25

26

RNF2S

RNF2

Connection terminal of resistor

for output current detection

13

14

PS

Power save terminal

27

28

OUT2B

NC

H bridge output terminal

No connection

TEST1

Test terminal (Connected to GND)

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

2/21

TSZ22111・15・001

BD62210AEFV

Absolute Maximum Ratings (Ta=25°C)

Parameter

Supply Voltage

Symbol

Rating

Unit

V_CC1,2

-0.2 to +36.0

1.45 ^{(Note 1)}

4.70 ^{(Note 2)}

-0.2 to +5.5

0.7

1.0 ^{(Note 3)}

1.5 ^{(Note 4)}

-25 to +85

-55 to +150

V

W

Power Dissipation

Pd

W

Input Voltage for Control Pin

RNF Maximum Voltage

Output Current

V_IN

V_RNF

I_OUT

V

A/ch

°C

Output Current (peak)

I_OUTPEAK

Topr

Operating Temperature Range

Storage Temperature Range

Tstg

(Note 1) 70mm×70mm×1.6mm glass epoxy board. Derate by11.6mW/°C when operating above Ta=25°C.

(Note 2) 4-layer recommended board. Derate by 37.6mW/°C when operating above Ta=25°C.

(Note 3) Do not, however exceed Pd, ASO and Tjmax=150°C.

(Note 4)Pulse width tw ≤1ms, duty 20ms

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated

over the absolute maximum ratings.

Recommended Operating Conditions (Ta= -25 to +85°C)

Parameter

Supply Voltage

Maximum Output Current (Continuous)

Symbol

V_CC1,2

I_OUT

Range

Unit

8 to 28

0.7 ^{(Note 5)}

V

A/ch

(Note 5) Do not, however exceed Pd, ASO and Tjmax=150°C.

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

3/21

TSZ22111・15・001

BD62210AEFV

Electrical Characteristics (Unless otherwise specified Ta=25°C, V_CC1.2=24V)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

【Whole】

Circuit Current at Standby

Circuit Current

I_CCST

I_CC

-

10

µA

PS=L

2.5

5.0

mA

PS=H, VREFx=2V

【Control Input】

H Level Input Voltage

L Level Input Voltage

H Level Input Current

L Level Input Current

V_IN2H

V_IN2L

I_IN2H

I_IN2L

2.0

-

V

0.8

100

-

35

-10

50

0

µA

V_IN2=5V

V_IN2=0V

【Output (OUT1A, OUT1B, OUT2A, OUT2B)】

I_OUT=±1.0A

Output ON-Resistance

R_ON

-

1.90

-

2.50

10

Ω

(Sum of upper and lower)

Output Leak Current

【Current Control】

RNFX Input Current

I_LEAK

µA

I_RNF

I_VREF

V_VREF

-80

-2.0

0

-40

-0.1

-

µA

V

RNFx=0V

VREFx Input Current

VREFx=0V

VREFx Input Voltage Range

2.0

Minimum on Time

(Blank Time)

Current Limit

t_ONMIN

V_CTH

0.7

1.5

3.0

µs

V

0.23

0.25

0.27

VREFx=2V

Comparator Threshold

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

4/21

TSZ22111・15・001

BD62210AEFV

Application Information

1. Points to Notice for Terminal Description and PCB Layout

(1) PS/ Power Save Terminal

PS can make circuit into standby state and make motor outputs OPEN.

Please be careful because there is a delay of 40μs (max) before it returns from OFF state to normal state.

PS

L

State

POWER SAVE (STANDBY)

ACTIVE

H

(2) IN1A,I N1B, IN2A, IN2B/ H Bridge Control Terminal

It decides output logic for H bridge.

Input

Output

State

IN1A

IN2A

IN1B

IN2B

OUT1A

OUT2A

OUT1B

OUT2B

PS

L

X

L

X

L

OPEN

POWER SAVE (STANDBY)

STOP

H

OPEN

H

L

H

L

H

L

FORWARD

H

REVERSE

H

BRAKE

X: H or L

(3) TEST1,TEST2/ Terminal for Testing

This is the terminal used at the time of distribution test. Please connect to GND. Please be careful because there is a

possibility of malfunction if it is not connected to GND.

(4) VCC1,VCC2/ Power Supply Terminal

Motor’s drive current is flowing in it, so please connect it in such a way that the wire is thick & short and has low

impedance. VCC voltage may have great fluctuation, so please connect the bypass capacitor (100uF to 470uF) as

close as possible to the terminal. Adjust in such a way that the VCC voltage is stable. Please increase the

capacitance if needed, especially when large current or motors that have great back electromotive force are used. In

addition, to reduce the power supply’s impedance in wide frequency bandwidth, parallel connection of multi-layered

ceramic capacitor (0.01µF to 0.1µF) is recommended. Extreme care must be observed to make sure that the VCC

voltage does not exceed the rating even for a moment. VCC1 & VCC2 are shorted inside IC, so please be sure to

short VCC1 & VCC2 externally when using. If used without shorting, malfunction or destruction may occur because of

concentration of current routes etc., so please make sure that they are shorted when in use. Moreover, there is a

built-in clamp component in the output terminal to prevent electrostatic destruction. If sudden pulse or surge voltage

of more than the maximum absolute rating is applied, the clamp component operates which can result to destruction.

Please be sure to not exceed the maximum absolute rating. It is effective to mount a Zener diode with maximum

absolute rating. Also, diode is inserted between VCC terminal and GND terminal to prevent electrostatic destruction.

If reverse voltage is applied between VCC terminal and GND terminal, there is a danger of IC destruction so please

be careful.

(5) GND/ Ground Terminal

In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, please

connect it in such a way that the wiring impedance from this terminal is made as low as possible to achieve the

lowest electrical potential no matter what operating state it may be.

(6) OUT1A,OUT1B,OUT2A,OUT2B/ H Bridge Output Terminal

Motor’s drive current is flowing in it, so please connect it in such a way that the wire is thick & short and has low

impedance. It is also effective to add a Schottky diode if output has great positive or negative fluctuation when large

current is applied. For example, a counter electromotive voltage etc. is great. Moreover, there is a built-in clamp

component in the output terminal to prevent electrostatic destruction. If sudden pulse or surge voltage of more than

the maximum absolute rating is applied, the clamp component operates which can result to destruction. Please be

sure to not exceed the maximum absolute rating.

(7) RNF1,RNF2/ Connection Terminal of Resistor for Detecting of Output Current

Please connect the resistor of 0.1Ω to 0.3Ω for current detection between this terminal and GND according to

application circuits (Figure 3,4) and consider the power consumption of the current-detecting resistor. Determine the

resistor in such a way that W=I_OUT²･R[W] does not exceed the power dissipation of the resistor. In addition, please

connect it in such a way that it has low impedance and does not have impedance in common with other GND

patterns. This is because motor’s drive current flows in the pattern through RNF terminal to current-detecting resistor

to GND. Please do not exceed the rating because there is the possibility of circuits’ malfunction etc. if the RNF

voltage has exceeded the maximum rating (0.7V). Moreover, please be careful not to short RNF terminal to GND

because there is the danger that OCP or TSD will operate when large current flows without normal PWM constant

current control.. However, if RNF terminal is open, there is also the possibility of malfunction because output current

does not flow either. Please do not let it open.

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

5/21

TSZ22111・15・001

BD62210AEFV

(8) RNF1S,RNF2S/ Input Terminal of Current Limit Comparator

In this series, RNFS terminal, which is the input terminal of current limit comparator, is independently arranged in

order to decrease the lowering of current-detection accuracy caused by the wire impedance inside the IC of RNF

terminal. Therefore, please make sure to connect RNF terminal and RNFS terminal together when using PWM

constant current control. In addition, in case of interconnection, the lowering of current-detection accuracy caused by

the impedance of board pattern between RNF terminal and the current-detecting resistor can be decreased because

the wires from RNFS terminal is connected near the current-detecting resistor. Moreover, please design the pattern in

such a way that there is no noise spike.

(9) VREF1,VREF2/ Output Current Value-setting Terminal

This is the terminal to set the output current value for PWM constant current control or motor locking.

The output current value can be set by VREF voltage and current-detecting resistor (RNF resistor).

Output current IOUT

[

A

]

=

{

VREF

[

V

]

/8

(

division ratio inside IC

)

}

/ RNF

Ω

[ ]

Please avoid using it with VREF terminal open. If VREF terminal is open, there is possibility of malfunctions as the

setting current increases and a large current flows etc. This is caused by unstable input and increasing VREF voltage.

Please take note of the input voltage range because if voltage of over 2V is applied on VREF terminal, there is also a

danger that large current flows in the output and OCP or TSD will operate. Also, when selecting the resistance value

please take into consideration the outflow current (max 2μA) produced by resistance division. The minimum current,

which can be controlled by VREF voltage, is determined by motor coil’s L & R values and minimum ON time. There is

a minimum ON time in PWM drive.

(10) CR/ Connection terminal of CR for Setting Switching Frequency

This is the terminal to set the switching frequency of the output. Please connect the external C (330pF to 680pF) and

R (10kΩ to 150kΩ) between this terminal and GND. Please refer to page 8.

Please connect the external components to GND in such a way that the interconnection does not have impedance in

common with other GND patterns. In addition, please create the pattern design in such a way to keep such sudden

pulses as square wave etc. away and that there is no noise spike. Please mount the two components of C and R if

PWM constant current control is being used. This is because normal PWM constant current control cannot be used if

CR terminal is open or it is biased externally. When not using PWM constant current control, connect this terminal to

GND.

(11) FAILA/ Fault Signal Output Terminal

FAILA outputs low signal when Over-Current Protection (OCP) or Thermal Shutdown (TSD) operates.

Even if Under Voltage Lock Out (UVLO) or Over Voltage Lock Out (OVLO) operates, FAILA signal doesn’t turn low

(i.e. high).

This terminal is an open drain type, so please set the pull up resistor (5kΩ to 100kΩ) to power supply less than 7V

(i.e. 5V or 3.3V). If not using this terminal, please connect it to GND.

OCP

OFF

ON

TSD

OFF

ON

FAILA

H (OFF)

M (ON)

L (ON)

OFF

ON

(12) NC Terminal

This terminal is unconnected electrically with IC internal circuit.

(13) IC Back Metal

For HTSSOP-B28 package, the metal heat sink is mounted on IC’s back side. It becomes a prerequisite to use this

metal as heat sink so please secure the heat sink area sufficiently by soldering it to the GND plane on the board. Get

as wide GND pattern as possible. Please be careful because the allowable power dissipation as shown in page 14

cannot be attained if the metal heat sink is not connected by solder. Moreover, the back side metal is shorted with IC

chip’s back side and it becomes the GND potential, so there is adanger of malfunction and destruction if it is shorted

with potentials other than GND. Therefore; please do not design patterns other than GND through the IC’s back side.

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

6/21

TSZ22111・15・001

BD62210AEFV

Protection Circuits

(14) Thermal Shutdown (TSD)

This IC has a built-in Thermal Shutdown circuit for thermal protection. When the IC’s chip temperature rises above

175°C (Typ), the motor output becomes OPEN. Also, when the temperature returns to under 150°C (Typ), it

automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be applied

externally, heat overdrive can lead to destruction.

(15) Over-Current Protection (OCP)

This IC has a built in Over-Current Protection circuit as a provision against destruction when the motor outputs are

shorted to each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to

OPEN condition when the regulated threshold current flows for 4μs (typ). It returns with power reactivation or a reset

of the PS terminal. The over-current protection circuit aims to prevent the destruction of the IC only from abnormal

situations such as when motor output is shorted and it is not meant to be used as protection or security for the device.

Therefore, the device should not be designed to make use of the function of this circuit. After OCP operation, if

abnormal situations continues and returned by power reactivation or reset of the PS terminal happens repeatedly,

then OCP operates constantly. The IC may generate heat or otherwise deteriorate. When the L value of the wiring is

great due to the long wiring and the over-current flows, the output terminal voltage increases and the absolute

maximum values may be exceeded. As a result, there is a possibility of destruction. Also, when a current flows, which

is over the output current rating and under the OCP detection current, the IC can heat up to over Tjmax=150°C. This

can deteriorate the IC. Therefore, current which exceeds the output rating should not be applied.

(16) Under Voltage Lock Out (UVLO)

This IC has a built-in Under Voltage Lock Out function to prevent false operation such as IC output during power

supply under voltage. When the applied voltage to the VCC terminal goes under 5V (Typ), the motor output is set to

OPEN. This switching voltage has a 1V (Typ) hysteresis to prevent false operation by noise etc. Please be aware that

this protection circuit does not operate during power save mode.

(17) Over Voltage Lock Out (OVLO)

This IC has a built-in Over Voltage Lock Out function to protect the IC output and the motor during power supply over

voltage. When the applied voltage to the VCC terminal goes over 32V (Typ), the motor output is set to OPEN. This

switching voltage has a 1V (Typ) hysteresis and a 4μs (Typ) mask time to prevent false operation by noise etc.

Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum

value for power supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Please

be aware that this protection circuit does not operate during power save mode.

(18) Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a control signal (IN1A, IN1B, IN2A, IN2B, PS, VREF1, VREF2) is applied when there is no power supplied to the IC,

there is a function which prevents false operation by voltage applied via the electrostatic destruction prevention diode

from the control input terminal to the VCC, to this IC or to another IC’s power supply. Therefore, there is no

malfunction in the circuit even when voltage is supplied to these input terminals while there is no power supply.

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

7/21

TSZ22111・15・001

BD62210AEFV

2. External PWM Control

This series can drive motors by IN1A, IN1B, IN2A, and IN2B input directly from the microcomputer (up to100kHz).

Decay mode can be SLOW DECAY or FAST DECAY.

SLOW DECAY (forward rotation)

Input

IN1A

IN2A

Output

OUT1A

OUT2A

State

IN1B

IN2B

OUT1B

OUT2B

PS

H

L

H

L

H

L

ON

SLOW DECAY

ON

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (synchronous rectification, forward rotation)

Input

Output

State

IN1A

IN2A

IN1B

IN2B

OUT1A

OUT2A

OUT1B

OUT2B

PS

H

L

H

L

H

L

H

L

ON

FAST DECAY

ON

H

L

H

L

H

L

H

L

FAST DECAY

ON

H

FAST DECAY

SLOW DECAY

OFF to OFF

ON to OFF

OFF to ON

ON to OFF

OFF to ON

M

ON to ON

OFF to ON

Output ON

Current decay

Figure 5. Route of Regenerative Current during Current Decay

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

8/21

TSZ22111・15・001

BD62210AEFV

3. PWM Constant Current Control

This function can limit the peak current or switching current in driving DC brush motor.

In addition, it can drive bipolar stepper motor by PWM constant current control.

(1) Current Control Operation

When the output transistor is turned on, the output current increases which raises the voltage over the current sense

resistor. When the voltage on the RNF pin reaches the voltage value set by the VREF input voltage, the current limit

comparator operates and enters current decay mode. The output is then held OFF for a period of time determined by

the RC time constant connected to the CR pin. The process repeats itself constantly for PWM operation.

(2) Blank Time (Fixed in Internal Circuit)

In order to avoid misdetection of output current due to RNF spikes that may occur when the output turns ON, the IC

employs an automatic current detection-masking period (t_ONMIN1.5µs typ). During this period, the current detection is

disabled immediately after the output transistor is turned on. This allows for constant-current drive without the need

for an external filter.

(3) CR Timer

The CR component connected to the CR pin is repeatedly charged and discharged between the VCRH and VCRL

levels. The CR continues to discharge during this period until it reaches VCRL, at which point the IC output is

switched back ON.

The CR charge time (t_charge) and discharge time (t_discharge) are set by external components, according to the following

formulas. The total of t_chargeand t_dischargeyield the switching period, t_switch

.

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

t_charge

[

s

]

= C⋅R'⋅ R/

(

R'+R

)

⋅In

[

(

V_CR− 0.4

)

/

(

V_CR−1.0

)]

V_CR= V ⋅R/

R'+R

)

where:

V is the internal regulator voltage 5V(typ)

R' is the CR internal impedance 5kΩ(typ)

t_discharge

[

s

]

= C⋅R⋅⋅In

α: See the right graph

[

(

1+ a

)

/0.4

]

200

400

600

800

C [pF]

t_CHOP

[

s = t_charge+ t_discharge

]

Setting range: C (330pF to 680pF), R (10kΩ to 150kΩ)

Spike noise

Output current

Current limit value

0mA

RNF voltage

CR voltage

Current limit value

GND

VCRH(1.0+α typ)

VCRL(0.4V typ)

GND

Switching period t_switch

Figure 6. Timing Chart of CR Voltage, RNF Voltage and Output Current

www.rohm.com

TSZ22111・15・001

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

9/21

BD62210AEFV

4. Control Sequence of Stepper Motor

The following sequence can control the stepper motor by FULL STEP or HALF STEP mode.

Example of control sequence and torque vector

FULL STEP

①

②

③

④

OUT1A

100%

IN1A

IN1B

IN2A

IN2B

4

3

1

2

OUT2A

OUT2B

100%

IOUT(CH1)

IOUT(CH2)

-100%

100%

-100%

OUT1B

IN1A

IN1B

IN2A

IN2B

OUT1A OUT1B OUT2A OUT2B

①

②

③

④

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

Figure 7. FULL STEP Control Sequence

HALF STEP

①

②

③

④

⑤

⑥

⑦

⑧

OUT1A

1

100%

IN1A

IN1B

IN2A

IN2B

8

6

2

OUT2B

OUT2A

7

3

100%

IOUT(CH1)

IOUT(CH2)

4

-100%

100%

5

-100%

OUT1B

IN1A

IN1B

IN2A

IN2B

OUT1A OUT1B OUT2A OUT2B

①

②

③

④

⑤

⑥

⑦

⑧

H

L

H

L

H

L

OPEN

H

L

H

L

OPEN

H

L

H

L

H

L

OPEN

H

L

H

OPEN

L

H

L

OPEN

H

OPEN

L

H

L

H

Figure 8. HALF STEP Control Sequence

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

10/21

TSZ22111・15・001

BD62210AEFV

5. µSTEP Drive for Stepper Motor

Output current of channel 1 and channel 2 can be determined by VREF1, VREF2. Output logic can be done by IN1A,

IN1B, IN2A, IN2B. Therefore, linear voltage input by external DAC to VREF1, VREF2 enables to drive stepper motor in

µSTEP mode.

IN1A

IN1B

IN2A

IN2B

VREF1

VREF2

OUT(ch1)

OUT(ch2)

Figure 9. µSTEP Control Sequence and Output Current

6. Power Dissipation

Please confirm that the IC’s chip temperature Tj is not over 150°C. Consider the IC’s power consumption (W), package

power (Pd) and ambient temperature (Ta). When Tj=150°C is exceeded, the functions as a semiconductor do not

operate and problems such as parasitic and leaks occur. Constant use under these conditions leads to deterioration and

eventually destruction of the IC. Tjmax=150°C must be strictly obeyed under all circumstances.

(1) Thermal Calculation

The IC’s consumed power can be estimated roughly with the power supply voltage (V_CC), circuit current (I_CC), output

ON-Resistance (R_ONH, R_ONL) and motor output current value (I_OUT).

The calculation method during external PWM drive, SLOW DECAY, driving channel 1 only is shown here:

When using both channel 1 and channel 2, calculate for each H bridge.

･･･････①

Consumed power of the V_CC

[

W

]

= V_CC

[

V

]

⋅I_CC

[ ]

A

(

RONH

[

Ω

]

+ RONL

[

Ω

]

)

⋅ IOUT

[

A

]

²⋅on _ duty

%

[ ]

/100

Consumed power of the output DMOS

[

W =

]

During output ON

2

(

2⋅RONL

[

Ω

]

)

⋅ IOUT

[

A

]

⋅

(

100 − on _ duty

%

[ ]

/100

)

･･･②

During current decay

However, on duty: PWM on duty [%]

Upper P-Channel DMOS

ON-Resistance R_ONH[Ω] (Typ)

Lower N-Channel DMOS

ON-Resistance R_ONL[Ω] (Typ)

Model Number

BD62210AEFV

1.25

0.65

Consumed total power of IC W_total [W] = ① + ②

Junction temperature Tj = Ta °C + θja °C/ W ⋅ W _ total

[

]

[

]

[

W

]

However, the thermal resistance value θja [°C/W] differs significantly depending on circuit board conditions. Refer to the

Power Dissipation curve on page 14. Also, we are taking measurements of thermal resistance value θja of the actual

boards used. Please feel free to contact our salesman. The calculated values above are only theoretical. For actual

thermal design, please perform sufficient thermal evaluation for the application board used, and create the thermal design

with enough margin to not exceed Tjmax=150°C. Although not normally used, if the IC is to be used under specific or

strict heat conditions, please consider attaching an external Schottky diode between the motor output terminal and GND

to decrease heat from the IC.

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

11/21

TSZ22111・15・001

BD62210AEFV

(2) Temperature Monitoring

There is a way to directly measure the approximate chip temperature by using the TEST2 terminal. However,

temperature monitor using TEST2 terminal is only for evaluation and experimenting, and must not be used in actual

usage conditions. TEST2 terminal has a protection diode to prevent electrostatic discharge. The temperature may be

monitored using this protection diode.

(a) Measure the terminal voltage when a current of I_DIODE=50μA flows from the TEST2 terminal to the GND, without

supplying VCC to the IC. This measurement is the V_Fvoltage inside the diode.

(b) Measure the temperature characteristics of this terminal voltage. (V_Fhas a linear negative temperature factor

against the temperature.) With the results of these temperature characteristics, chip temperature may be

calibrated from the TEST terminal voltage.

(c) Supply VCC, confirm the TEST2 terminal voltage while running the motor, and the chip temperature can be

approximated from the results of (b).

VCC

-Vf [mV]

Circuitry

TEST2

Circuitry

I_DIODE

V

25

150 Chip temperature Tj [°C]

Figure 10. Model Diagram for Measuring Chip Temperature

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

12/21

TSZ22111・15・001

BD62210AEFV

7. Application Circuit Diagram

(1) Constant Voltage Control or External PWM Control

3.3V or 5.0V

When using the fault output function

⇒Pull up resistor 5kΩ to 100kΩ.

When not using the fault output

function

10kΩ

FAILA

VREF1

＋

－

15

11

＋

－

1/8

Regulator

⇒Connect to GND.

Refer to page 5.

RNF1S

VREF2

＋

－

12

10

＋

－

1/8

RNF2S

TSD

OCP

Blank time

PWM control

UVLO

OVLO

CR

Control input terminal.

Input PWM signal (~100kHz) at

external PWM control.

OSC

Bypass capacitor.

Setting range is

100µF to 470µF (electrolytic)

0.01µF to 0.1µF(multilayer ceramic

etc.)

Refer to page 4 for detail.

VCC1

Refer to page 4 for detail.

Be sure to short VCC1 & VCC2.

7

OUT1A

5

2

M

Forward

Reverse

Brake

16

OUT1B

RNF1

IN1A

3

4

IN1B 17

100µF

0.1µF

Open

RNF1S

VCC2

Power save terminal

Refer to page 4 for detail.

22

Forward

Reverse

Brake

OUT2A

19

24

27

IN2A

IN2B 20

OUT2B

RNF2

Open

26

25

PS 13

Terminal for testing

Connect to GND.

TEST2

RNF2S

GND

18

14

1,9

TEST1

Figure 11. Block Diagram & Application Circuit Diagram

(a) Input/Output table

PS

Input

IN1A

IN2A

Output

OUT1A

OUT2A

State

IN1B

IN2B

OUT1B

OUT2B

L

X

L

X

L

OPEN

POWER SAVE (STANDBY)

STOP

H

OPEN

H

L

H

L

H

L

FORWARD

H

REVERSE

H

BRAKE

X: H or L

(b) Example of external PWM control sequence

SLOW DECAY (forward rotation)

Input

Output

State

IN1A

IN2A

IN1B

IN2B

OUT1A

OUT2A

OUT1B

OUT2B

PS

H

L

H

L

H

L

ON

SLOW DECAY

ON

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (forward rotation)

Input

Output

State

IN1A

IN2A

IN1B

IN2B

OUT1A

OUT2A

OUT1B

OUT2B

PS

H

L

H

L

H

L

H

L

ON

FAST DECAY

ON

H

L

H

L

H

L

H

L

FAST DECAY

ON

H

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

13/21

TSZ22111・15・001

BD62210AEFV

(2) PWM Constant Current Control

Sets the current limit value.

Input range: 0V to 2V

Refer to page 5 for detail.

When using the fault output function

⇒Pull up resistor 5kΩ to 100kΩ.

When not using the fault output

function

⇒Connect to GND.

Refer to page 5.

3.3V or 5.0V

4.7kΩ

3.3V or 5.0V

10kΩ

FAILA

VREF1

VREF2

3.3V or 5.0V

4.7kΩ

＋

－

11

12

15

＋

－

Regulator

1/8

RNF1S

＋

－

＋

－

1/8

1.2kΩ

RNF2S

TSD

OCP

Blank time

PWM control

UVLO

OVLO

CR

10

OSC

Bypass capacitor.

Setting range is

470pF

82kΩ

100µF to 470µF(electrolytic)

0.01uF to 0.1µF(multilayer ceramic

etc.)

VCC1

7

Refer to page 4 for detail.

Be sure to short VCC1 & VCC2.

OUT1A

Sets the switching frequency.

Setting range is

5

2

M

Forward

Reverse

Brake

C:330pF to 680pF

R:10kΩ to 150kΩ

OUT1B

RNF1

16

17

IN1A

IN1B

3

4

Refer to page 5, 8 for detail.

0.2Ω

100µF

0.1µF

Open

RNF1S

VCC2

22

Current

resistor.

detection

setting

Forward

Reverse

Brake

OUT2A

19

24

27

IN2A

0.1Ω to 0.3Ω

Refer to page 4, 5 for detail.

M

Control logic input terminal.

Refer to page 4.

IN2B 20

OUT2B

RNF2

Open

26

25

PS 13

0.2Ω

TEST2

18

RNF2S

GND

Current

resistor

detection

setting

Power save terminal

Refer to page 4 for detail.

14

1,9

0.1Ω to 0.3Ω

Refer to page 4, 5 for detail.

TEST1

Figure 12. Application Circuit Diagram of

Constant Voltage Control or External PWM Control

Terminal for testing

Connect to GND.

(a) Input/Output table

Input

Output

State

IN1A

IN2A

IN1B

IN2B

OUT1A

OUT2A

OUT1B

OUT2B

PS

L

X

L

X

L

OPEN

POWER SAVE (STANDBY)

STOP

H

OPEN

H

L

H

L

H

L

FORWARD

H

REVERSE

H

BRAKE

X: H or L

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

14/21

TSZ22111・15・001

BD62210AEFV

I/O Equivalent Circuits

VCC

Circuitry

RNF1S

RNF2S

VREF1

VREF2

500Ω

5kΩ

10kΩ

Control

input

100kΩ

VCC

VREG(internal regulator)

VCC

OUT1B

OUT2B

OUT1A

OUT2A

5kΩ

CR

10kΩ

RNF1, RNF2

Circuitry

5kΩ

FAILA

Figure 14. I/O Equivalent Circuits

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

15/21

TSZ22111・15・001

BD62210AEFV

Operation Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital

and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.

Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the

capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on

the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the

IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of

connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power

supply or ground line.

www.rohm.com

TSZ02201-0P2P0B301470-1-2

16/21

TSZ22111・15・001

21.Jun.2016 Rev.001

BD62210AEFV

Operation Notes – continued

12. Regarding Input Pins of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or

transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 15. Example of Monolithic IC Structure

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation

(ASO).

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature

(Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold,

the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

15. Over-Current Protection Circuit (OCP)

This IC has a built-in over-current protection circuit that activates when the output is accidentally shorted. However, it is

strongly advised not to subject the IC to prolonged shorting of the output.

16. Operation Under Strong Electromagnetic Field (BD62210AEFV)

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

17. The Back Side of the IC Package (Define the side where product markings are printed as front) (BD62210AEFV)

There is an exposed central pad on the back side of the IC package. Please mount by footprint dimensions described in the

Jisso Information for WSOF5. Connect it to ground. If it is not connected to ground, there is a possibility that the device

malfunctions or a large current is generated.

18. TEST Terminal (BD62210AEFV)

Be sure to connect TEST pin to GND.

www.rohm.com

TSZ02201-0P2P0B301470-1-2

17/21

TSZ22111・15・001

21.Jun.2016 Rev.001

BD62210AEFV

Power Dissipation

HTSSOP-B28

HTSSOP-B28 has exposed metal on the back. It is possible to dissipate heat using the through holes in the back of board

as well as the surfaces with large areas of copper foil heat dissipation patterns which greatly increases power dissipation.

The back metal is shorted to the back side of the IC chip, being a GND potential, therefore there is a possibility for

malfunction if it is shorted with any potential other than GND. It should be avoided. Also, it is recommended that the back

metal is soldered onto the GND. Please note that it has been assumed that this product will be used in the condition

wherein this back metal has undergone heat dissipation treatment to increase heat dissipation efficiency.

Measurement machine：TH156 (Kuwano Electric)

Measurement condition：ROHM board

Board size：70mm*70mm*1.6mm

(With through holes on the board)

The exposed metal of the backside is connected to the board with

solder.

5.0

4.0

3.0

2.0

1.0

4.70W

3.30W

4

3

Board①：1-layer board (Copper foil on the back 0mm)

Board②：2-layer board (Copper foil on the back 15mm*15mm)

Board③：2-layer board (Copper foil on the back 70mm*70mm)

Board④：4-layer board (Copper foil on the back 70mm*70mm)

Board①：θja=86.2°C/W

Board②：θ_ja=67.6°C/W /W

Board③：θja=37.9°C/W

Board④：θja=26.6°C/W

1.85W

1.45W

2

1

0

25

50

75 85 100

125

150

Ambient Temperature : Ta [°C]

Figure 13. HTSSOP-B28 Power Dissipation

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

18/21

TSZ22111・15・001

BD62210AEFV

Selecting a model name when ordering

E F V

B D 6 2 2 1 0 A

-

E 2

Package type

EFV

Packing, Forming specification

E2: Reel-wound embossed taping

ROHM Model

:

HTSSOP-B28

● Marking Diagram

HTSSOP-B28 (TOP VIEW)

Part Number Marking

LOT Number

B D 6 2 2 1 0 A E F

1PIN MARK

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

19/21

TSZ22111・15・001

BD62210AEFV

Physical Dimension, Tape and Reel Information

Package Name

HTSSOP-B28

www.rohm.com

TSZ22111・15・001

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

20/21

BD62210AEFV

Revision History

Date

Revision

001

Changes

21.Jun.2016

New Release

www.rohm.com

TSZ02201-0P2P0B301470-1-2

21.Jun.2016 Rev.001

21/21

TSZ22111・15・001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD62210AEFV
厂家：	ROHM
描述：	BD62210AEFV是能驱动2个DC有刷电机或1个双极型步进电机驱动器的含2个电路的H桥电机驱动器。通过直接PWM驱动或恒流PWM控制可实现高效率驱动。内置各种保护电路，可输出通知各种保护电路动作的支持Wired-Or的异常检出信号，有利于实现组件的高可靠性。电机驱动驱动器
文件：	总24页 (文件大小：1589K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD62210AEFV [ROHM]

相关型号：

BD62210AEFV-E2

BD6221F

BD6221F-E2

BD6221FP-E2

BD6221HFP

BD6221HFP-TR

BD6222

BD62220AEFV

BD62220AEFV-E2

BD62221MUV

BD62222HFP

BD62222HFP-TR