BD6235FV-E2 [ROHM]
Brush DC Motor Controller, 0.5A, PDSO24, ROHS COMPLIANT, SSOP-24;
| 型号： | BD6235FV-E2 |
| 厂家： | 
ROHM |
| 描述： | Brush DC Motor Controller, 0.5A, PDSO24, ROHS COMPLIANT, SSOP-24 电动机控制 光电二极管 |
| 文件： | 总17页 (文件大小：1170K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TECHNICAL NOTE
For brush motors
H-bridge drivers
(7V max.)
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
zOverview
These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of
power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow
for PWM signal control, while the integrated VREF voltage control function of previous models offers direct replacement of
deprecated motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design.
zFeatures
1) Built-in, selectable one channel or two channels configuration
2) Low standby current
3) Supports PWM control signal input (20kHz to 100kHz)
4) VREF voltage setting pin enables PWM duty control
5) Cross-conduction prevention circuit
6) Four protection circuits provided: OCP, OVP, TSD and UVLO
zApplications
VCR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals;
car audios; car navigation systems; OA equipments
zLine up matrix
Maximum output current
Rating voltage
Channels
0.5A
1.0A
2.0A
BD6210
HFP / F
BD6211
HFP / F
BD6212
1ch
2ch
HFP / FP
7V
BD6215
FV / FP
BD6216
FP / FM
BD6217
FM
BD6220
HFP / F
BD6221
HFP / F
BD6222
1ch
2ch
1ch
2ch
HFP / FP
18V
36V
BD6225
FV / FP
BD6226
FP / FM
BD6227
FM
BD6230
HFP / F
BD6231
HFP / F
BD6232
HFP / FP
BD6235
FV / FP
BD6236
FP / FM
BD6237
FM
*
Packages; F:SOP8, FV: SSOPB24, HFP:HRP7, FP:HSOP25, FM:HSOPM28
Aug.2007
zAbsolute maximum ratings (Ta=25°C)
Parameter
Symbol
Ratings
Unit
V
Supply voltage
VCC
IOMAX
VIN
7
Output current
0.5 *1 / 1.0 *2 / 2.0 *3
A
All other input pins
Operating temperature
Storage temperature
Power dissipation
Junction temperature
-0.3 ~ VCC
V
TOPR
TSTG
Pd
-40 ~ +85
°C
°C
W
°C
-55 ~ +150
0.687 *4 / 0.98 *5 / 1.4 *6 / 1.45 *7 / 2.2 *8
150
Tjmax
*** Notes: All voltages are with respect to ground.
*1 BD6210 / BD6215. Do not, exceed Pd or ASO.
*2 BD6211 / BD6216. Do not, exceed Pd or ASO.
*3 BD6212 / BD6217. Do not, exceed Pd or ASO.
*4 SOP8 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 5.5mW/°C above 25°C.
*5 SSOPB24 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 7.8mW/°C above 25°C.
*6 HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/°C above 25°C.
*7 HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/°C above 25°C.
*8 HSOPM28 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 17.6mW/°C above 25°C.
zOperating conditions (Ta=25°C)
Parameter
Supply voltage
VREF voltage
Symbol
VCC
Conditions
3.0 ~ 5.5
1.5 ~ 5.5
Unit
V
VREF
V
z Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=VREF=5V)
Limits
Parameter
Supply current
Symbol
Unit
Conditions
Min.
0.4
-
Typ.
0.7
0
Max.
1.5
10
ICC
ISTBY
VIH
mA
µA
V
Forward / Reverse / Brake
Stand-by
Stand-by current
Input high voltage
2.0
-
-
-
Input low voltage
VIL
-
0.8
100
1.5
1.5
1.0
10
V
Input bias current
IIH
30
0.5
0.5
0.2
-10
20
20
50
1.0
1.0
0.5
0
µA
Ω
VIN=5.0V
Output ON resistance *1
Output ON resistance *2
Output ON resistance *3
VREF bias current
Carrier frequency
RON
RON
RON
IVREF
FPWM
FMAX
IO=0.25A, vertically total
IO=0.5A, vertically total
IO=1.0A, vertically total
VREF=VCC
Ω
Ω
µA
kHz
kHz
25
-
35
VREF=3.75V
Input frequency range
100
FIN / RIN
*1 BD6210 / BD6215
*2 BD6211 / BD6216
*3 BD6212 / BD6217
2/16
z Electrical characteristic curves (Reference data)
1.0
0.8
0.6
0.4
0.2
0.0
8
6
4
2
0
1.5
1.0
-40°C
25°C
85°C
85°C
25°C
-40°C
-40°C
25°C
85°C
0.5
-40°C
25°C
85°C
0.0
-0.5
3
4
5
6
3
4
5
6
1
1.2
1.4
1.6
1.8
2
Supply Voltage: Vcc [V]
Fig.1 Supply current
Supply Voltage: Vcc [V]
Fig.2 Stand-by current
Input Voltage: V [V]
IN
Fig.3 Input threshold voltage
100
80
60
40
20
0
10
1.0
-40°C
25°C
85°C
0.8
0.6
0.4
0.2
0.0
85°C
25°C
-40°C
5
0
-40°C
25°C
85°C
-5
-10
0
1
2
3
4
5
0
1
2
3
4
5
6
0
0.2
0.4
0.6
0.8
1
Input Voltage: V
[V]
REF
Input Voltage: V [V]
IN
Input Voltage: V
/ V
[V]
CC
REF
Fig.4 Input bias current
Fig.5 VREF input bias current
Fig.6 VREF - DUTY
(VCC=5V)
6.0
9.0
6.0
3.0
0.0
35
30
25
20
85°C
25°C
-40°C
-40°C
85°C
25°C
25°C
85°C
-40°C
4.0
2.0
0.0
1.5
2
2.5
3
3.5
6
6.5
7
7.5
8
3
4
5
6
Supply Voltage: V
[V]
CC
Supply Voltage: V
[V]
CC
Supply Voltage: VCC [V]
Fig.7 VCC - Carrier frequency
Fig.8 Under voltage lock out
Fig.9 Over voltage protection
1.5
1.5
1.0
1.5
85°C
25°C
-40°C
85°C
25°C
-40°C
1.0
0.5
1.0
0.5
0.5
0.0
0.0
0.0
-0.5
-0.5
-0.5
125
150
175
200
1.5
2
2.5
3
1
1.5
2
2.5
Junction Temperature: T [°C]
Load Current / Iomax: Normalized
Load Current / Iomax: Normalized
j
Fig.10 Thermal shutdown
Fig.11 Over current protection (H side)
3/16
Fig.12 Over current protection (L side)
z Electrical characteristic curves (Reference data) – Continued
0.4
0.3
0.2
0.1
0
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
85°C
25°C
-40°C
85°C
25°C
-40°C
85°C
25°C
-40°C
0
0.1
0.2
0.3
0.4
0.5
0
0.2
0.4
0.6
0.8
1
0
0.4
0.8
1.2
1.6
2
Output Current: I
[A]
Output Current: I
[A]
Output Current: I
[A]
OUT
OUT
OUT
Fig.13 Output high voltage (0.5A class)
Fig.14 Output high voltage (1A class)
Fig.15 Output high voltage (2A class)
2
2
2
-40°C
25°C
-40°C
25°C
-40°C
25°C
85°C
85°C
85°C
1.5
1.5
1.5
1
0.5
0
1
0.5
0
1
0.5
0
0
0.1
0.2
0.3
0.4
0.5
0
0.2
0.4
0.6
0.8
1
0
0.4
0.8
1.2
1.6
2
Output Current: I
[A]
Output Current: I
[A]
Output Current: I [A]
OUT
OUT
OUT
Fig.16 High side body diode (0.5A class)
Fig.17High side body diode (1A class)
Fig.18 High side body diode (2A class)
0.4
0.8
0.8
85°C
85°C
85°C
25°C
25°C
25°C
-40°C
-40°C
-40°C
0.3
0.6
0.6
0.2
0.1
0
0.4
0.2
0
0.4
0.2
0
0
0.1
0.2
0.3
0.4
0.5
0
0.2
0.4
0.6
0.8
1
0
0.4
0.8
1.2
1.6
2
Output Current: I
[A]
Output Current: I
[A]
Output Current: I [A]
OUT
OUT
OUT
Fig.19 Output low voltage (0.5A class)
Fig.20 Output low voltage (1A class)
Fig.21 Output low voltage (2A class)
2
2
2
-40°C
-40°C
-40°C
25°C
25°C
25°C
85°C
85°C
85°C
1.5
1.5
1.5
1
0.5
0
1
0.5
0
1
0.5
0
0
0.1
0.2
0.3
0.4
0.5
0
0.2
0.4
0.6
0.8
1
0
0.4
0.8
1.2
1.6
2
Output Current: I
[A]
Output Current: I
[A]
Output Current: I [A]
OUT
OUT
OUT
Fig.22 Low side body diode (0.5A class)
Fig.23 Low side body diode (1A class)
Fig.24 Low side body diode (2A class)
4/16
z Block diagram and pin configuration
BD6210F / BD6211F
VREF
6
DUTY
PROTECT
Table 1 BD6210/11F
3
2
VCC
VCC
Pin
1
Name
OUT1
VCC
VCC
FIN
Function
Driver output
FIN
RIN
4
5
CTRL
2
Power supply
3
Power supply
8
GND
1
7
4
Control input (forward)
Control input (reverse)
Duty setting pin
Driver output
OUT1
OUT2
5
RIN
Fig.25 BD6210F / BD6211F
6
VREF
OUT2
GND
7
OUT1
VCC
VCC
FIN
GND
OUT2
VREF
RIN
8
Ground
Fig.26 SOP8
BD6210HFP / BD6211HFP / BD6212HFP
VREF
DUTY
PROTECT
1
Table 2 BD6210/11/12HFP
VCC
GND
7
4
Pin
1
Name
VREF
OUT1
FIN
Function
FIN
RIN
3
5
Duty setting pin
Driver output
CTRL
2
3
Control input (forward)
Ground
FIN
2
6
4
GND
RIN
GND
OUT1
OUT2
5
Control input (reverse)
Driver output
Fig.27 BD6210/11/12HFP
6
OUT2
VCC
GND
7
Power supply
Ground
FIN
Fig.28 HRP7
5/16
z Block diagram and pin configuration – Continued
BD6212FP
Table 3 BD6212FP
Name Function
Pin
1,2
6
VREF
DUTY
PROTECT
17
VCC
VCC
21
OUT1
GND
RNF
OUT2
VREF
RIN
Driver output
22
23
Small signal ground
Power stage ground
Driver output
FIN
RIN
20
19
7,8
12,13
17
CTRL
7
8
RNF
Duty setting pin
Control input (reverse)
Control input (forward)
Power supply
6
FIN
1
2
12 13
OUT2
GND
GND
OUT1
19
20
FIN
Fig.29 BD6212FP
21
VCC
VCC
GND
OUT1
NC
NC
22,23
FIN
Power supply
OUT1
NC
VCC
VCC
VCC
FIN
NC
Ground
NC
GND
Note: All pins not described above are NC pins.
GND
GND
RNF
RNF
NC
RIN
NC
NC
VREF
NC
NC
OUT2
OUT2
NC
NC
Fig.30 HSOP25
BD6215FV
Table 4 BD6215FV
Pin
1
Name
OUT1A
RNFA
OUT2A
GND
Function
Driver output
VREFA
DUTY
PROTECT
8
VCC
VCC
23
24
3
Power stage ground
Driver output
FINA
RINA
10
9
5
OUT1A
OUT2A
1
5
CTRL
7
Small signal ground
Duty setting pin
8
VREFA
RINA
GND
RNFA
19
20
3
9
Control input (reverse)
Control input (forward)
Power supply
VREFB
DUTY
PROTECT
VCC
VCC
11
12
10
11
12
13
15
17
19
20
21
22
23
24
FINA
VCC
FINB
RINB
22
21
VCC
Power supply
OUT1B
OUT2B
13
17
CTRL
OUT1B
RNFB
OUT2B
GND
Driver output
Power stage ground
Driver output
GND
RNFB
7
15
Small signal ground
Duty setting pin
Fig. 31 BD6215FV
VREFB
RINB
OUT1A
NC
RNFA
NC
OUT2A
NC
GND
VREFA
RINA
FINA
VCC
VCC
VCC
FINB
RINB
VREFB
GND
NC
OUT2B
NC
RNFB
Control input (reverse)
Control input (forward)
Power supply
FINB
VCC
VCC
Power supply
Note: All pins not described above are NC pins.
NC
VCC
OUT1B
Fig. 32 SSOPB24
6/16
z Block diagram and pin configuration – Continued
BD6215FP, BD6216FP/FM
Table 5 BD6215FP / BD6216FP
Pin
1
Name
OUT1A
RNFA
OUT2A
GND
Function
Driver output
VREFA
DUTY
PROTECT
9
VCC
VCC
24
25
3
Power stage ground
Driver output
6
FINA
RINA
11
10
OUT1A
OUT2A
1
6
CTRL
8
Small signal ground
Duty setting pin
Control input (reverse)
Control input (forward)
Power supply
9
VREFA
RINA
GND
RNFA
20
21
3
10
11
12
13
14
16
19
20
21
22
23
24
25
FIN
VREFB
DUTY
PROTECT
FINA
VCC
VCC
12
13
VCC
VCC
Power supply
FINB
RINB
23
22
OUT1B
OUT2B
14
19
CTRL
OUT1B
RNFB
OUT2B
GND
Driver output
Power stage ground
Driver output
GND
RNFB
8
16
FIN
Small signal ground
Duty setting pin
Control input (reverse)
Control input (forward)
Power supply
GND
VREFB
RINB
Fig. 33 BD6215FP, BD6216FP
FINB
OUT1A
NC
RNFA
NC
NC
OUT2A
VCC
VCC
FINB
RINB
VREFB
GND
VCC
VCC
Power supply
GND
GND
GND
Ground
NC
GND
VREFA
RINA
FINA
VCC
VCC
OUT2B
NC
Note: All pins not described above are NC pins.
NC
RNFB
NC
OUT1B
Table 6 BD6216FM
Pin
1
Name
OUT1A
RNFA
OUT2A
GND
Function
Driver output
Fig. 34 HSOP25
3
Power stage ground
Driver output
6
8
Small signal ground
Duty setting pin
Control input (reverse)
Control input (forward)
Power supply
9
VREFA
RINA
OUT1A
VCC
NC
RNFA
NC
NC
10
11
12
14
15
17
20
22
23
24
25
26
28
FIN
VCC
FINB
RINB
VREFB
GND
NC
OUT2A
NC
FINA
VCC
VCC
Power supply
GND
GND
OUT1B
RNFB
OUT2B
GND
Driver output
GND
VREFA
RINA
FINA
VCC
NC
Power stage ground
Driver output
OUT2B
NC
NC
RNFB
NC
NC
VCC
Small signal ground
Duty setting pin
Control input (reverse)
Control input (forward)
Power supply
OUT1B
VREFB
RINB
Fig. 35 HSOPM28
FINB
VCC
VCC
Power supply
GND
Ground
Note: All pins not described above are NC pins.
7/16
z Block diagram and pin configuration – Continued
BD6217FM
Table 7 BD6217FM
Pin
1,2
3,4
6,7
8
Name
OUT1A
RNF A
OUT2A
GND
Function
VREFA
DUTY
PROTECT
VCC
VCC
9
26
Driver output
27
28
Power stage ground
Driver output
1
2
FINA
RINA
11
10
OUT1A
OUT2A
CTRL
6
7
Small signal ground
Duty setting pin
Control input (reverse)
Control input (forward)
Power supply
9
VREFA
RINA
GND
22
23
3
4
RNFA
VCC
VCC
10
VREFB
DUTY
PROTECT
12
11
FINA
13
14
12
VCC
13,14
15,16
17,18
20,21
22
VCC
Power supply
15
16
FINB
RINB
25
24
OUT1B
OUT2B
CTRL
OUT1B
RNFB
OUT2B
GND
Driver output
20
21
Power stage ground
Driver output
GND
8
17
18
RNFB
Small signal ground
Duty setting pin
Control input (reverse)
Control input (forward)
Power supply
FIN
GND
23
VREFB
RINB
24
Fig. 36 BD6217FM
25
FINB
26
VCC
OUT1A
VCC
27,28
FIN
VCC
Power supply
OUT1A
RNFA
RNFA
NC
VCC
VCC
FINB
RINB
VREFB
GND
GND
Ground
OUT2A
OUT2A
Note: All pins not described above are NC pins.
GND
GND
GND
VREFA
RINA
FINA
OUT2B
OUT2B
NC
RNFB
RNFB
OUT1B
OUT1B
VCC
VCC
VCC
Fig. 37 HSOPM28
8/16
zFunctional descriptions
1) Operation modes
Table 8 Logic table
FIN
RIN
VREF
X
OUT1
OUT2
Hi-Z*
L
Operation
a
b
c
d
e
f
L
H
L
L
Hi-Z*
Stand-by (idling)
VCC
VCC
X
H
L
L
Forward (OUT1 > OUT2)
Reverse (OUT1 < OUT2)
Brake (stop)
L
H
H
H
H
L
________
PWM
PWM
L
L
VCC
VCC
Option
Option
H
Forward (PWM control)
Reverse (PWM control)
Forward (VREF control)
Reverse (VREF control)
________
PWM
PWM
L
H
________
PWM
g
h
H
H
________
PWM
L
H
H
* Hi-Z is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.
X : Don’t care
a) Stand-by mode
Stand-by operates independently of the VREF pin voltage. In stand-by mode, all internal circuits are turned off,
including the output power transistors. Motor output goes to high impedance. If the motor is running at the switch to
stand-by mode, the system enters an idling state because of the body diodes. However, when the system switches
to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least
50µs before shutting down all circuits.
b) Forward mode
This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. For
operation in this mode, connect the VREF pin with VCC pin.
c) Reverse mode
This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. For
operation in this mode, connect the VREF pin with VCC pin.
d) Brake mode
This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode
because the internal control circuit is operating in the brake mode. Please switch to the stand-by mode (rather than
the brake mode) to save power and reduce consumption.
OFF
OFF
OFF ON
OFF OFF
OFF OFF
ON OFF
OFF ON
OFF
ON
M
M
M
M
ON
ON
a) Stand-by mode
b) Forward mode
c) Reverse mode
d) Brake mode
Fig.38 Four basic operations (output stage)
9/16
e) f) PWM control mode
The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN
pin or the RIN pin. In this mode, the high side output is fixed and the low side output does the switching,
corresponding to the input signal. The switching operates by the output state toggling between "L" and "Hi-Z".
The PWM frequency can be input in the range between 20kHz and 100kHz. Note that control may not be attained
by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. Also,
circuit operation may not respond correctly when the input signal is higher than 100kHz. To operate in this mode,
connect the VREF pin with VCC pin. In addition, establish a current path for the recovery current from the motor, by
connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.
ON
OFF
ON
ON
OFF
OFF
M
M
OFF
OFF
Control input : H
Control input : L
Fig.39 PWM control operation (output stage)
FIN
RIN
OUT1
OUT2
Fig.40 PWM control operation (timing chart)
g) h) VREF control mode
The built-in VREF-switching on duty conversion circuit provides switching duty corresponding to the voltage of the
VREF pin and the VCC voltage. The function offers the same level of control as the high voltage output setting
function in previous models. The on duty is shown by the following equation.
DUTY ≈ VREF [V] / VCC [V]
For example, if VCC voltage is 5V and VREF pin voltage is 3.75V, the switching on duty is about 75 percent.
However, please note that the switching on duty might be limited by the range of VREF pin voltage (Refer to the
operating conditions, shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the
switching operation is the same as it is the PWM control modes. When operating in this mode, do not input the
PWM signal to the FIN and RIN pins. In addition, establish a current path for the recovery current from the motor,
by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.
VCC
VREF
0
FIN
RIN
OUT1
OUT2
Fig.41 VREF control operation (timing chart)
10/16
2) Cross-conduction protection circuit
In the full bridge output stage, when the upper and lower transistors are turned on at the same time, and this condition
exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to
ground, resulting in a loss. This circuit protects against the rush current by providing a dead time (about 400ns,
nominal) at the transition.
3) Output protection circuits
a) Under voltage lock out (UVLO) circuit
To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage
malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 2.3V (nominal)
or below, the controller forces all driver outputs to high impedance. When the voltage rises to 2.5V (nominal) or
above, the UVLO circuit ends the lockout operation and returns the chip to normal operation.
b) Over voltage protection (OVP) circuit
When the power supply voltage exceeds 7.3V (nominal), the controller forces all driver outputs to high impedance.
The OVP circuit is released and its operation ends when the voltage drops back to 6.8V (nominal) or below. This
protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is
asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this
circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.
c) Thermal shutdown (TSD) circuit
The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175°C
nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is
provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the
preset temperature (150°C nominal). Thus, it is a self-returning type circuit.
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is
activated, and do not operate the IC in an environment where activation of the circuit is assumed.
d) Over current protection (OCP) circuit
To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit
monitors the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an
over current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC
returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this
circuit works independently for each channel.
Threshold
Iout
0
CTRL Input
Internal status
Monitor / Timer
ON
mon.
OFF
ON
off timer
Fig.42 Over current protection (timing chart)
11/16
z Thermal design
1.5
10.0
8.0
6.0
4.0
2.0
0.0
1.5
1.0
0.5
0.0
i) Package only (copper foil:10.5mm x 10.5mm)
ii) 2 layers PCB(copper foil:15mmx 15mm)
iii) 2 layers PCB(copper foil::70mm x 70mm)
iv) 4 layers PCB(copper foil:70mmx 70mm)
i) Package only
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mmFR4 glass-epoxy board)
ii) Mounted on ROHM standard PCB
(70mm x 70mmx 1.6mm FR4 glass-epoxy board)
iv) 7.3W
iii) 5.5W
1.0
0.5
0.0
ii) 0.976W
ii) 0.687W
i) 0.562W
i) 0.787W
ii) 2.3W
i) 1.4W
25
0
25
50
75
100
125
150
0
25
50
75
100
125
150
0
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
AMBIENT TEMPERATURE [°C]
AMBIENT TEMPERATURE [°C]
Fig.43 Thermal derating curve
(SOP8)
Fig.44 Thermal derating curve
(SSOPB24)
Fig.45 Thermal derating curve
(HRP7)
3
2
1
0
3
2
1
0
i) Package only
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
Table 9 Thermal resistance
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
ii) 2.20W
Package
SOP8
θ
j-a [°C/W]
182
i) 1.80W
ii) 1.45W
SSOPB24
HRP7
122
89.3
i) 0.85W
HSOP25
HSOP28
86.2
56.8
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Mounted on a 70mmx70mmx1.6mm FR4 glass-epoxy
AMBIENT TEMPERATURE [°C]
AMBIENT TEMPERATURE [°C]
board with less than 3% copper foil.
Fig.46 Thermal derating curve
(HSOP25)
Fig.47 Thermal derating curve
(HSOPM28)
Thermal design needs to meet the following operating conditions.
In creating the thermal design, sufficient margin must be provided to guarantee the temperature conditions below.
1. The ambient temperature Ta must be 85°C or below
2. The junction temperature Tj must be 150°C or below
The junction temperature Tj can be determined using the following equation.
Tj ≈ Ta +θ j-a x Pc [°C]
The power consumption Pc can be determined using the following equation. Refer to page 4 about VON(H) and VF(H)
.
Pc ≈ (IOUT2 x RON) x (VREF / VCC) + IOUT x (VON(H) + VF(H)) x (1 - VREF / VCC) + VCC x ICC [W]
Example using the BD6211F
Conditions: Ta=50°C, VCC=VREF=5V, Iout=0.1A.
The power consumption of the IC and the junction temperature are as follows:
Pc ≈ 0.12 x 1.0 + 5 x 0.7m = 13.5mW
Tj ≈ 50 + 182 x 13.5m = 52.5 [°C]
Where the Tjmax parameter is 150°C and the derating is set to 80 percents, the maximum ambient temperature
Tamax is determined as follows.
Ta ≤ Tjmax x 0.8 -θ j-a x Pc ≈ 115 [°C]
In this example, thermal design can be considered satisfactory (meaning that there are no problems in thermal design),
since the system meets the operating temperature conditions.
12/16
zInterfaces
VCC
VCC
VCC
VCC
VREF
100k
100k
10k
FIN
RIN
OUT1
OUT2
OUT1
OUT2
GND
RNF
GND
Fig.48 FIN / RIN
Fig.49 VREF
Fig.50 OUT1 / OUT2
Fig.51 OUT1 / OUT2
(SOP8/HRP7)
(SSOPB24/HSOP25/HSOPM28)
zNOTES FOR USE
1) Absolute maximum ratings
Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating.
Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important
to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is
to be implemented.
2) Connecting the power supply connector backward
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply lines, such as adding an external direction diode.
3) Power supply lines
Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path
by inserting capacitors across the power supply and GND. In this case, it is important to conclusively confirm that none
of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at low temperatures
- occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the
regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product,
including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation,
physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and
GND.
4) Electrical potential at GND
Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to
determine whether there is any terminal that provides voltage below GND, including the voltage during transient
phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s
reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that
voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the
same way, care must be taken to avoid changes in the GND wire pattern in any external connected component.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error, or if pins are shorted together.
7) Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with
electromagnetic fields.
13/16
8) ASO - Area of Safety Operation
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
9) Built-in thermal shutdown (TSD) circuit
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated,
and do not operate the IC in an environment where activation of the circuit is assumed.
10) Capacitor between output and GND
In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or
GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor
smaller than 1µF between output and GND.
11) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress.
Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before
connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps
as an antistatic measure. Use similar precaution when transporting or storing the IC.
12) Switching noise
When the operation mode is in PWM control or VREF control, PWM switching noise may effects to the control input
pins and cause IC malfunctions. In this case, insert a pulled down resistor (10kΩ is recommended) between each
control input pin and ground.
13) Regarding the input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them
isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods
by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.
Resistor
Transistor (NPN)
B
Pin A
Pin B
Pin B
C
E
Pin A
B
C
E
N
N
N
P+
P+
P+
P+
N
P
P
Parasitic
element
N
N
Parasitic
element
P substrate
P substrate
GND
GND
GND
GND
Parasitic element
Parasitic element
Other adjacent elements
Appendix: Example of monolithic IC structure
zOrdering part number
B
D
6
2
X
X
-
ROHM part
number
Type
Package
Packaging spec.
1X: 7V max.
2X: 18V max.
3X: 36V max.
F: SOP8
E2: Embossed taping
(SOP8/SSOPB24
/HSOP25/HSOPM28)
TR: Embossed taping
(HRP7)
FV: SSOPB24
FP: HSOP25
FM: HSOPM28
HFP: HRP7
X0: 1ch/0.5A X5: 2ch/0.5A
X1: 1ch/1A X6: 2ch/1A
X2: 1ch/2A X7: 2ch/2A
14/16
SOP8
<Dimension>
<Tape and reel information>
Tape
Embossed carrier tape
2500pcs
Quantity
Direction
of feed
E2
5.0 0.2
8
5
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper left-hand side.)
1
4
0.15 0.1
0.1
1.27
0.4 0.1
Direction of feed
1Pin
Reel
(Unit:mm)
※Orders should be placed in multiples of package quantity.
SSOP-B24
<Dimension>
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2000pcs
7.8 0.2
Direction
of feed
E2
24
13
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper left-hand side.)
1
12
0.15 0.1
0.1
0.65
0.22 0.1
Direction of feed
1pin
Reel
(Unit:mm)
※Orders should be placed in multiples of package quantity.
HSOP25
<Dimension>
<Tape and reel information>
Tape
Embossed carrier tape
Quantity
2000pcs
13.6 0.2
2.75 0.1
E2
Direction
of feed
25
14
13
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper left-hand side.)
1
0.25 0.1
1.95 0.1
0.8
0.1
0.36 0.1
Direction of feed
1Pin
Reel
(Unit:mm)
※Orders should be placed in multiples of package quantity.
HSOP-M28
<Dimension>
<Tape and reel information>
Tape
Embossed carrier tape
Quantity
1500pcs
18.5 0.2
28
15
14
E2
Direction
of feed
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper left-hand side.)
1
0.25 0.1
5.15 0.1
0.8
0.35 0.1
0.1 S
M
0.08
16.0 0.2
Direction of feed
1Pin
Reel
(Unit:mm)
※Orders should be placed in multiples of package quantity.
15/16
HRP7
<Dimension>
<Tape and reel information>
9.395 0.125
(MAX 9.745 include BURR)
8.82 – 0.1
Tape
Embossed carrier tape
1.905 0.1
(5.59)
Quantity
2000pcs
Direction
of feed
TR
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper right-hand side.)
1
2
3
4
5
6
7
0.8875
+
5.5
4.5
0.27
-
4.5
+
-
0.1
0.05
x
x
x x
x
x
x x
x
x
x x
x
x
x x
x
x
x x
x x x x
S
1.27
0.73 0.1
S
1pin
Direction of feed
0.08
Reel
(Unit:mm)
※Orders should be placed in multiples of package quantity.
Catalog NO.05N000A '05.4 ROHM C 3000 TSU
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact your nearest sales office.
THE AMERICAS / EUPOPE / ASIA / JAPAN
ROHM Customer Support System
Contact us : webmaster@ rohm.co.jp
www.rohm.com
TEL : +81-75-311-2121
FAX : +81-75-315-0172
Copyright © 2007 ROHM CO.,LTD.
21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan
Appendix1-Rev2.0
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