BD63572MUV [ROHM]
BD63572MUV是一款FULL ON驱动、内置2通道H桥的电机驱动器。能够在2.0V至9.0V的电压下工作，并且由于具有低导通电阻DMOS输出和高速开关，实现低功耗。采用小型表面贴装封装，可以支持移动设备和家用电器等各种设备。;
| 型号： | BD63572MUV |
| 厂家： | 
ROHM |
| 描述： | BD63572MUV是一款FULL ON驱动、内置2通道H桥的电机驱动器。能够在2.0V至9.0V的电压下工作，并且由于具有低导通电阻DMOS输出和高速开关，实现低功耗。采用小型表面贴装封装，可以支持移动设备和家用电器等各种设备。 开关 电机 驱动 驱动器 |
| 文件： | 总17页 (文件大小：1184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Drivers for DC Brush Motors
Dual H-Bridge Driver
High-Speed Switching Type
BD63572MUV
General Description
Key Specifications
The BD63572MUV provides a dual H-Bridge motor
driver which features wide range of motor power supply
voltage from 2.0 V to 9.0 V and low power consumption
to switch low ON-Resistance DMOS transistors at high
speed. This small surface mounting package is most
suitable for mobile system, home appliance and various
applications.
Power Supply Voltage Range:
Motor Power Supply Voltage Range: 2.0 V to 9.0 V
Circuit Current (Open Mode):
Stand-by Current:
Control Input Voltage Range:
Logic Input Frequency:
Minimum Logic Input Pulse Width:
Turn On Time:
2.5 V to 3.6 V
740 μA(Typ)
1 μA (Max)
0 V to VCC
1000 kHz(Max)
100 ns(Min)
45 ns(Typ)
Turn Off Time:
45 ns(Typ)
Features
H-Bridge Output Current (DC):
H-Bridge Output Current (Peak):
Output ON-Resistance (Total):
Operating Temperature Range:
-1.0 A to +1.0 A
-2.5 A to +2.5 A
0.40 Ω(Typ)
Low ON-Resistance Power DMOS Output
Charge Pump-less with PDMOS High-Side Driver
Drive Mode Switch Function
Under Voltage Locked Out Protection
and Thermal Shutdown Function
-30 °C to +85 °C
Package
VQFN20PV3535
W(Typ) x D(Typ) x H(Max)
3.50 mm x 3.50 mm x 1.00 mm
Applications
Mobile System
Home Appliance
Amusement System, etc.
VQFN20PV3535
Typical Application Circuit
1 µF to 100 µF
VCC
1 µF to 100 µF
VM
PS
OUT1A
IN1A
IN1B
OUT1B
VM
PWM
OUT2A
OUT2B
IN2A
IN2B
PGND
N.C.
GND
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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Pin Configuration
(TOP VIEW)
20 19 18 17
16
N.C.
IN1B
VCC
GND
IN2A
PGND
OUT1B
PGND
OUT2B
PGND
15
14
13
12
11
1
2
3
4
5
EXP-PAD
8
9
6
7
10
Pin Description
Pin No. Pin Name
Function
Pin No. Pin Name
Function
Small signal ground
1
2
PGND
OUT1B
PGND
OUT2B
PGND
OUT2A
VM
Motor ground
12
13
14
15
16
17
18
19
20
GND
VCC
IN1B
N.C.
H-Bridge output 1B
Motor ground
Power supply
3
Control logic input 1B
Always keep open.
Drive mode logic input
Control logic input 1A
Motor power supply
Motor power supply
H-Bridge output 1A
4
H-Bridge output 2B
Motor ground
5
PWM
IN1A
VM
6
H-Bridge output 2A
Motor power supply
Motor power supply
Power-Saving function
Control logic input 2B
Control logic input 2A
7
8
VM
VM
9
PS
OUT1A
10
11
IN2B
The EXP-PAD of the center connect
to GND Pin.
-
EXP-PAD
IN2A
Block Diagram
VCC
13
PS
9
Power Save
TSD & UVLO
Band Gap
18 19
VM
20
Level Shift
&
Pre Driver
OUT1A
IN1A
IN1B
17
14
H-Bridge
Full ON
Logic
2
OUT1B
PWM
16
7
8
VM
6
Level Shift
&
Pre Driver
OUT2A
OUT2B
H-Bridge
Full ON
IN2A
IN2B
11
10
Logic
4
5
3
1
PGND
15
N.C.
12
GND
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Description of Functions
1. Power-Saving Function
A Power-Saving Function is included, which allows the system to save power when not driving the motor. The voltage
level on the PS Pin should be set high so as to keep the Active Mode. (See the Electrical Characteristics)
2. Motor Control Input
(a) IN1A, IN1B, IN2A and IN2B Pins
Logic level controls the output logic of H-Bridge.
(See the Electrical Characteristics, and I/O Truth Table)
(b) PWM Pin
Logic level sets the IN/IN or EN/IN drive mode.
(See the Electrical Characteristics and I/O Truth Table)
3. VM Pin
Each H-Bridge can be controlled independently. Take into consideration that each VM Pin (Pin No.7, 8, 18 and 19
pins) are short-circuited internally. (See the Block Diagram) Each VM Pins must be shorted on printed circuit board.
4. PGND Pin
Each PGND Pins must be shorted on printed circuit board.
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Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
VM
-0.3 to +4.5
-0.3 to +10.0
-0.3 to VCC+0.3
-1.0 to +1.0 (Note 1)
-2.5 to +2.5 (Note 2)
150
V
V
Motor Power Supply Voltage
Control Input Voltage
VIN
V
H-Bridge Output Current (DC)
H-Bridge Output Current (PEAK)
Maximum Junction Temperature
Storage Temperature Range
IOUT
A
IOUT(PEAK)
Tjmax
Tstg
A
°C
°C
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) ASO and Tj=150 °C should not be exceeded.
(Note 2) PEAK=100 ms (Duty≤10 %). ASO and Tj=150 °C should not be exceeded.
Thermal Resistance(Note 3)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 5)
2s2p(Note 6)
VQFN20PV3535
Junction to Ambient
Junction to Top Characterization Parameter(Note 4)
θJA
181.9
19
50.5
7
°C/W
°C/W
ΨJT
(Note 3) Based on JESD51-2A (Still-Air)
(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 5) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
(Note 6) Using a PCB board based to JESD51-5 , 7.
Thermal Via(Note 7)
Layer Number of
Material
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Measurement Board
Pitch
Diameter
4 Layers
FR-4
1.20 mm
Φ0.30 mm
Top
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 7) This thermal via connects with the copper pattern of all layers.
Recommended Operation Conditions
Parameter
Power Supply Voltage
Symbol
Min
Typ
Max
Unit
VCC
VM
2.5
2.0
0
-
-
-
-
-
-
3.6
9.0
VCC
1000
-
V
V
Motor Power Supply Voltage
Control Input Voltage
VIN
fIN
V
Logic Input Frequency
0
kHz
ns
°C
Minimum Logic Input Pulse Width
Operation Temperature
tIN
100
-30
Topr
+85
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Electrical Characteristics (Unless otherwise specified, VCC=3.0 V, VM=5.0 V, Ta=25 °C)
Parameter
All Circuits
Symbol
Min
Typ
Max
Unit
Conditions
Stand-by Current
ICCST
ICC1
ICC2
ICC3
-
0
1
μA
μA
μA
μA
VPS=0 V
VPS=3 V, Open Mode(Note 8)
VPS=3 V, CW & CCW Mode(Note 8)
VPS=3 V, Short Brake Mode(Note 8)
Circuit Current 1
200
200
300
740
750
770
1150
1150
1200
Circuit Current 2
Circuit Current 3
PS Input (PS)
High-Level Input Voltage
Low-Level Input Voltage
High-Level Input Current
Low-Level Input Current
VPSH
VPSL
IPSH
IPSL
1.85
0
-
-
VCC
0.9
60
V
V
15
-1
30
0
μA
μA
VPS=3 V
VPS=0 V
+1
Control Input (IN=IN1A, IN1B, IN2A, IN2B, PWM)
High-Level Input Voltage
Low-Level Input Voltage
High-Level Input Current
Low-Level Input Current
VINH
VINL
IINH
IINL
1.85
0
-
-
VCC
0.9
60
V
V
15
-1
30
0
μA
μA
VIN=3 V
VIN=0 V
+1
Under Voltage Locked Out (UVLO)
UVLO Voltage VUVLO
FULL ON Type H-Bridge Driver
2.0
-
2.4
V
IOUT=±500 mA,
High & Low-side total Resistance
20 Ω Loading
Output ON-Resistance
Turn On Time
RON
-
0.40
0.60
Ω
tON
-
-
45
45
200
200
ns
ns
Turn Off Time
tOFF
20 Ω Loading
(Note 8) Refer to Table 1.
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Typical Performance Curves (Reference Data)
3.0
2.0
1.0
0.0
5.0
Top +85 °C
Mid +25 °C
Low -30 °C
Top +85 °C
Mid +25 °C
Low -30 °C
4.0
3.0
Operating Range
(2.5 V to 3.6 V)
Operating Range
(2.5 V to 3.6 V)
2.0
1.0
0.0
0
1
2
3
4
0
1
2
3
4
Power Supply Voltage : VCC [V]
Power Supply Voltage : VCC [V]
Figure 1. Stand-by Current vs Power Supply Voltage
(Stand-by Mode)
Figure 2. Circuit Current vs Power Supply Voltage
(Open Mode)
500
500
Top +85 °C
Mid +25 °C
Low -30 °C
Top +85 °C
Mid +25 °C
Low -30 °C
400
400
300
200
100
0
300
200
100
0
0
200
400
600
800
1000
0
200
400
600
800
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
Figure 3. Output VDSH vs Output Current
Figure 4. Output VDSL vs Output Current
(Output ON-Resistance on high-side, VM=5 V, VCC=3 V)
(Output ON-Resistance on low-side, VM=5 V, VCC=3 V)
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Typical Performance Curves (Reference Data) - continued
1.0
0.5
0.4
0.3
0.2
0.1
0.0
Top +85 °C
Mid +25 °C
Low -30 °C
Top +85 °C
Mid +25 °C
Low -30 °C
0.8
0.6
Operating Range
(2.0 V to 9.0 V)
Operating Range
(2.0 V to 9.0 V)
0.4
0.2
0.0
0
2
4
6
8
10
0
2
4
6
8
10
Motor Power SupplyVoltage : VM [V]
Motor Power SupplyVoltage : VM [V]
Figure 5.Output ON-Resistance High-side vs Motor Power
Supply Voltage
Figure 6. Output ON-Resistance Low-side vs Motor Power
Supply Voltage
(Output ON-Resistance on High-side VM Dependency,
VCC=3 V)
(Output ON-Resistance on Low-side VM Dependency,
VCC=3 V)
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Timing Chart
Table 1. I/O Truth Table
INPUT
IN1A /
OUTPUT
OUT1B /
OUT2B
Input Mode
EN/IN
IN1B /
IN2B
OUT1A /
OUT2A
PS(Note 9)
PWM
Output Mode(Note 10)
IN2A
L
X
L
L
H
L
L
Short Brake
CW
H
H
H
L
L
H
Z
L
H
L
CCW
H
L
Z
H
L
Open
H
L
L
CW
IN/IN
-
L
H
H
X
H
L
CCW
H
X
L
Short Brake
Open
X
Z
Z
L: Low, H: High, X: Don’t care, Z: Hi impedance
(Note 9) PS=High: Active Mode, PS=Low: Stand-by Mode
(Note 10) CW: Current flows from OUTxA to OUTxB, CCW: Current flows from OUTxB to OUTxA (x=1,2)
1.85 V
tIN
tIN
1.4 V
0.9 V
Control Input
tON
tON
tOFF
tOFF
+100 %
0 %
+50 %
+50 %
Motor Current
-50 %
-50 %
-100 %
Figure 7. Input-Output AC Characteristic 1
1.85 V
1.4 V
0.9 V
Control Input
Motor Current
tIN
tON
tOFF
100 %
50 %
0 %
Figure 8. Input-Output AC Characteristic 2
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Application Example
1 µF to 100 µF
VCC
1µ F to 100 µF
VM
PS
OUT1A
IN1A
IN1B
OUT1B
VM
PWM
OUT2A
OUT2B
IN2A
IN2B
PGND
N.C.
GND
Selection of Components Externally Connected
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including static and transitional characteristics as well as dispersion of the IC.
I/O Equivalence Circuits
PS
IN1A, IN1B, IN2A, IN2B, PWM
VM, PGND, OUTxA, OUTxB (x=1,2)
VM
75 kΩ
10 kΩ
OUTxA
OUTxB
100 kΩ
100 kΩ
PGND
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal(GND) and large-current ground(PGND) traces, the two ground traces should be routed
separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So, unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 9. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all
within the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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Ordering Information
B D
6
3
5
7
2 M U V
-
E2
Package
MUV:VQFN20PV3535
Package and forming specification
E2: Embossed tape and reel
Marking Diagram
VQFN20PV3535 (TOP VIEW)
Part Number Marking
B D 6 3 5
7 2 M U V
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
VQFN20PV3535
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Revision History
Date
Revision
001
Changes
07.Dec.2017
25.Jan.2019
New Release
Change Physical Dimension and Packing Information
002
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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