BD63847EFV-E2_技术文档

Stepping Motor Driver series

Micro step 36V

Stepping Motor Drivers

BD63843EFV, BD63847EFV

No.12009EAT08

●Description

BD63843EFV / BD63847EFV are stepping motor drivers of 1/16 micro step(sixteenth step) drive. As for its basic function, it

is a low power consumption bipolar PWM constant current-drive driver with power supply rated voltage of 36V and rated

output current (DC) of 1.0A, 2.0A. The input interface is CLK-IN type.

There are step modes of Full step & Half step, Eighth step, Sixteenth step mode by internal DAC (D-A converter), and for

current decay mode, the ratio of FAST DECAY & SLOW DECAY can be freely set, so the optimum control conditions for

every motor can be realized. In addition, being able to drive with one system of power supply makes contribution to the set

design’s getting easy.

●Feature

1) Single power supply input (rated voltage of 36V)

2) Rated output current:(DC) 1.0A, 2.0A

3) Low ON resistance DMOS output

4) CLK-IN drive mode

5) PWM constant current control (other oscillation)

6) Built-in spike noise cancel function (external noise filter is unnecessary)

7) Full step, Half step, Eighth step, Sixteenth step drive

8) Timing free for changing step modes

9) Current decay mode switching function (linearly variable FAST/SLOW DECAY ratio)

10) Normal rotation & reverse rotation switching function

11) Power save function

12) Built-in logic input pull-down resistor

13) Power-on reset function

14) Thermal shutdown circuit (TSD)

15) Over current protection circuit (OCP)

16) Under voltage lock out circuit (UVLO)

17) Over voltage lock out circuit (OVLO)

18) Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

19) Electrostatic discharge: 8kV (HBM specification)

20) Adjacent pins short protection

21) Inverted mounting protection

22) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP-B28 package

23) Pin-compatible line-up (In addition, pin-compatible to BD6387□EFV series)

●Application

PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo

printer, FAX, scanner, mini printer, toy, and robot etc.

www.rohm.com

2012.02 - Rev.A

1/8

Technical Note

BD63843EFV, BD63847EFV

●Absolute maximum ratings (Ta=25°C)

Item

Supply voltage

Symbol

BD63847EFV

BD63843EFV

Unit

V_CC1,2

-0.3~+36.0

V

1

1.45^※

W

Power dissipation

Pd

2

4.70^※

W

Input voltage for control pin

RNF voltage

V_IN

V_RNF

I_OUT

-0.3~+7.0

0.7

V

3

Output current

Output current (peak)^※

2.0^※

2.5^※

1.0^※

1.5^※

A/phase

°C

4

3

I_OUTPEAK

T_opr

Operating temperature range

Storage temperature range

Junction temperature

-25~+85

-55~+150

+150

T_stg

°C

T_jmax

°C

※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C.

※2 4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C.

※3 Do not, however exceed Pd, ASO and Tjmax=150°C.

※4 Pulse width tw≦1ms, duty20%.

●Operating conditions (Ta= -25~+85°C)

Item

Supply voltage

Input voltage for control pin

Symbol

V_CC1,2

V_IN

BD63847EFV

BD63843EFV

Unit

V

19~28

0~5.5

5

Output current

I_OUT

1.7^※

0.7^※

A/相

※5 Do not, however exceed Pd, ASO.

●Electrical characteristics (Unless otherwise specified Ta=25°C, V_CC1,2=24V)

Limit

Item

Symbol

Unit

Condition

Min.

Typ.

Max.

Whole

Circuit current at standby

Circuit current

I_CCST

I_CC

-

1.0

2.5

5.0

mA

PS=L

PS=H, VREF=3V

Control input (CLK, CW_CCW, MODE0, MODE1, ENABLE, PS)

H level input voltage

V_INH

V_INL

I_INH

I_INL

2.0

-

0.8

100

-

V

L level input voltage

H level input current

35

-10

50

0

µA

V_IN=5V

V_IN=0V

L level input current

Output (OUT1A, OUT1B, OUT2A, OUT2B)

I_OUT=1.5A,

Sum of upper and lower

I_OUT=0.5A,

Sum of upper and lower

Output ON resistance (BD63847EFV)

Output ON resistance (BD63843EFV)

R_ON

-

0.85

1.10

Ω

R_ON

-

1.90

-

2.47

10

Ω

Output leak current

Current control

I_LEAK

µA

RNFXS input current

RNFX input current

I_RNFS

I_RNF

-2.0

-40

-0.1

-20

-

µA

V

RNFXS=0V

RNFX=0V

VREF=0V

VREF input current

I_VREF

V_REF

I_MTH

-2.0

0

-0.1

-

VREF input voltage range

MTH input current

3.0

-

-2.0

0

-0.1

-

µA

V

MTH=0V

MTH input voltage range

Minimum on time (Blank time)

Comparator threshold 1

Comparator threshold 2

Comparator threshold 3

V_MTH

t_ONMIN

V_CTH1

V_CTH2

V_CTH3

3.5

1.5

0.630

0.445

0.264

0.3

0.8

µs

V

C=1000pF, R=39kΩ

VREF=3V, 100%

VREF=3V, 70.71%

VREF=3V, 38.27%

0.570

0.403

0.196

0.600

0.424

0.230

V

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2012.02 - Rev.A

2/8

Technical Note

BD63843EFV, BD63847EFV

●Terminal function and Application circuit diagram

Pin No.

Pin name

Function

Pin No.

Pin name

Function

Clock input terminal for advancing the

electrical angle.

Ground terminal

1

2

3

GND

OUT1B

RNF1

15

16

17

CLK

CW_CCW

TEST

H bridge output terminal

Motor rotating direction setting terminal

Connection terminal of resistor for

output current detection

Terminal for testing

(Used by connecting with GND)

Input

comparator

terminal

of

current

limit

Motor excitation mode setting terminal

4

RNF1S

18

MODE0

H bridge output terminal

Non connection

Motor excitation mode setting terminal

Output enable terminal

Non connection

5

6

7

8

9

OUT1A

NC

19

20

21

22

23

MODE1

ENABLE

NC

Power supply terminal

Non connection

VCC1

NC

Power supply terminal

Non connection

VCC2

NC

Ground terminal

GND

Connection terminal of CR for setting

chopping frequency

H bridge output terminal

10

11

12

CR

NC

24

25

26

OUT2A

RNF2S

RNF2

Input terminal of current limit

comparator

Non connection

Connection terminal of resistor for

output current detection

Current decay mode setting terminal

MTH

Output current value setting terminal

Power save terminal

H bridge output terminal

Non connection

13

14

VREF

PS

27

28

OUT2B

NC

Logic input terminal.

Refer to P.5 for detail.

Power save terminal

Refer to P.5 for detail.

Regulator

15

16

18

19

20

CLK

GND

9

CW_CCW

MODE0

Translator

14

PS

RESET

MODE1

UVLO

OVLO

TSD

ENABLE

Bypass capacitor.

Setting range is

＋

－

VREF 13

100uF~470uF(electrolytic)

0.01uF~0.1uF(multilayer ceramic etc.)

Refer to P.6 for detail.

4bit DAC

OCP

Set the output currenet.

Input by resistor divison.

Refer to P.6 for detail.

Be sure to short VCC1 & VCC2.

VCC1

7

OUT1A

＋

－

5

2

RNF1S

RNF2S

Set the chopping frequency.

Setting range is

OUT1B

RNF1

3

4

C:470pF~1500pF

R:10kΩ~200kΩ

＋

－

0.2Ω

100µF

0.1µF

Refer to P.7, 8 for detail.

RNF1S

VCC2

Blank time

PWM control

22

OUT2A

CR

10

24

27

Resistor for current. detecting.

Setting range is

0.1Ω~0.3Ω.

OSC

39kΩ

1000pF

OUT2B

RNF2

26

25

Refer to P.6 for detail.

Mix decay

control

0.2Ω

MTH 12

RNF2S

GND

Set the current decay mode.

①SLOW DECAY

⇒Connect to GND.

TEST

17

1

②MIX DECAY

⇒Input by resistor divison.

Refer to P.7, 9 for detail.

Resistor for current. detecting.

Setting range is

0.1Ω~0.3Ω.

Terminal for testing.

Connect to GND.

Refer to P.6 for detail.

Fig.1 Block diagram & Application circuit diagram

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2012.02 - Rev.A

3/8

Technical Note

BD63843EFV, BD63847EFV

●Points to notice for terminal description

○CLK/Clock input terminal for advancing the electrical angle

CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input.Motor’s misstep will occur if

noise is picked up at the CLK terminal, so please design the pattern in such a way that there is no noise plunging.

○MODE0,MODE1/Motor excitation mode setting terminal

Set the step mode.

MODE0

MODE1

Step mode

Full step

Half step

1/8 step

L

H

L

H

1/16 step

○CW_CCW /Motor rotating direction setting terminal

Set the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the change in

setting

CW_CCW

Rotating direction

L

Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)

Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s current)

H

○ENABLE/Output enable terminal

Turn off forcibly all the output transistors (motor output is open).

At ENABLE=L, electrical angle or operating mode is maintained even if CLK is inputted.

If step modes are changed during ENABLE=L, new step mode is carried out at ENABLE=L to H

ENABLE

Motor output

OPEN (electrical angle maintained)

ACTIVE

L

H

○PS/Power save terminal

PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized)

and electrical angle is initialized.

Please be careful because there is a delay of 40µs(max.) before it is returned from standby state to normal state and the

motor output becomes ACTIVE

PS

State

Standby state (RESET)

ACTIVE

L

H

The electrical angle (initial electrical angle) of each step mode immediately after RESET is as follows

Step mode

Full step

Half step

1/8 step

Initial electrical angle

45°

1/16 step

●Protection Circuits

○Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175°C

(Typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150°C (Typ.), it automatically returns

to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive

can lead to destruction.

○Over Current Protection (OCP)

This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted

each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition

when the regulated threshold current flows for 4µs (Typ.). It returns with power reactivation or a reset of the PS terminal.

The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor

output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to

take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power

reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly and the IC may generate heat

or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over current has

flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there

is a possibility of destruction. Also, when current which is over the output current rating and under the OCP detection

current flows, the IC can heat up to over Tjmax=150°C and can deteriorate, so current which exceeds the output rating

should not be applied.

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2012.02 - Rev.A

4/8

Technical Note

BD63843EFV, BD63847EFV

○Under Voltage Lock Out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under

voltage. When the applied voltage to the VCC terminal goes under 15V (Typ.), the motor output is set to OPEN. This

switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this circuit does

not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates during CLK-IN drive

mode.

○Over Voltage Lock Out (OVLO)

This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage.

When the applied voltage to the VCC terminal goes over 32V (Typ.), the motor output is set to OPEN. This switching

voltage has a 1V (Typ.) hysteresis and a 4µs (Typ.) mask time to prevent false operation by noise etc. Although this over

voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power supply

voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be aware that this circuit does

not operate during power save mode.

○Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a signal (logic input, VREF, MTH) is input when there is no power supplied to this IC, there is a function which prevents

the false operation by voltage supplied via the electrostatic destruction prevention diode from these input terminals to the

VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even when voltage is

supplied to these input terminals while there is no power supply.

●Thermal derating curve

HTSSOP-B28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the

back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power

dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a

possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is

recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this

product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation

efficiency.

Measurement machine：TH156（Kuwano Electric）

Measurement condition：ROHM board

Board size：70mm*70mm*1.6mm

(With through holes on the board)

The exposed metal of the backside is connected to the board with solder.

5.0

4.70W

3.30W

4

3

Board①：1-layer board (Copper foil on the back 0mm)

Board②：2-layer board (Copper foil on the back 15mm*15mm)

Board③：2-layer board (Copper foil on the back 70mm*70mm)

Board④：4-layer board (Copper foil on the back 70mm*70mm)

4.0

3.0

2.0

1.0

Board①：θ_ja=86.2°C W

Board②：θ_ja=67.6°C W

Board③：θ_ja=37.9°C W

Board④：θ_ja=26.6°C W

1.85W

1.45W

2

1

0

25

50

75 85 100

125

150

Ambient temperature:Ta[C]

Fig.2 HTSSOP-B28 Thermal derating curve

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2012.02 - Rev.A

5/8

Technical Note

BD63843EFV, BD63847EFV

●Usage Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If

any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,

such as fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply

lines. An external direction diode can be added.

(3) Power supply Lines

As return of current regenerated by back EMF of FET output happens, take steps such as putting capacitor between

power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each

property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the

connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage

on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute

maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp

diode between the power supply and GND pins.

(4) GND Potential

The potential of GND pin must be minimum potential in all operating conditions.

(5) Metal on the backside (Define the side where product markings are printed as front)

The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that

there is a possibility of malfunction or destruction if it is shorted with any potential other than GND.

(6) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

This IC exposes the metal on the backside of package. Note that this part is assumed to use after providing heat

dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation

pattern not only on the board surface but also the backside.

(7) Inter-pin shorts and mounting errors

When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper

attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be

caused by foreign matter entering between outputs or an output and the power supply or GND.

(8) Operation in a strong electric field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

(9) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(10) Thermal shutdown circuit

The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C, and higher,

coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal

operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect

peripheral equipment.

TSD on temperature [°C] (Typ.)

175

Hysteresis temperature [°C] (Typ.)

25

(11) Inspection of the application board

During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility

that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a

measure again electrostatic discharge, it should be earthed during the assembly process and special care should be

taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power

supply should first be turned off and then removed before the inspection.

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2012.02 - Rev.A

6/8

Technical Note

BD63843EFV, BD63847EFV

(12) Input terminal of IC

This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.

This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.

For example, when the resistance and transistor are connected to the terminal as shown in figure 3,

○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),

the P-N junction operates as a parasitic diode.

○Also, when GND＞(Terminal B) at the transistor (NPN)

The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned

parasitic diode.

Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The

operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.

Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage

that is lower than the GND (P substrate) to the input terminal.

Resistor

Transistor (NPN)

Pin A

Pin B

C

B

E

Pin A

C

E

B

N

P⁺

N

P⁺

P

N

P⁺

N

P⁺

N

Parasitic

element

Parasitic

element

P substrate

GND

Parasitic element

Other adjacent elements

Fig. 3 Pattern diagram of parasitic element

(13) Ground Wiring Pattern

When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern of any external components, either.

(14) TEST pin

Be sure to connect TEST pin to GND.

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2012.02 - Rev.A

7/8

Technical Note

BD63843EFV, BD63847EFV

●Ordering part number

E F

V

B D 6 3 8 4 3

-

E 2

パッケージ

EFV=HTSSOP-B28

包装、フォーミング仕様

形名

E2: リール状エンボステーピング

HTSSOP-B28

9.7 0.1

(MAX 10.05 include BURR)

Tape

Embossed carrier tape (with dry pack)

(5.5)

+

6

−4

°

Quantity

2500pcs

4°

28

15

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

14

+0.05

1PIN MARK

0.625

0.17

-

0.03

S

0.08

S

M

0.65

+0.05

Direction of feed

1pin

0.24

-

0.04

0.08

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

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2012.02 - Rev.A

8/8

Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD63847EFV-E2
厂家：	ROHM
描述：	Stepper Motor Controller, 2.5A, BIPolar, PDSO28, ROHS COMPLIANT, HTSSOP-28 电动机控制光电二极管
文件：	总11页 (文件大小：389K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63847EFV-E2 [ROHM]

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