BD6735FV-E2 [ROHM]
Dual H-Bridge Driver;
| 型号： | BD6735FV-E2 |
| 厂家： | 
ROHM |
| 描述： | Dual H-Bridge Driver 电动机控制 光电二极管 |
| 文件： | 总16页 (文件大小：1262K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
H-Bridge Drivers for DC Brush Motors
Dual H-Bridge Driver
BD6735FV
General Description
Key Specifications
The BD6735FV provides a dual H-bridge motor driver
which features wide range of motor power supply
voltage from 2.0V to 8.0V and low power consumption to
switch low ON-Resistance DMOS transistors. This small
surface mounting package is most suitable for mobile
system, home appliance and various applications.
Power Supply Voltage Range:
Motor Power Supply Voltage Range: 2.0V to 8.0V
Circuit Current:
Stand-By Current:
Control Input Voltage Range:
Logic Input Frequency:
Minimum Logic Input Pulse Width:
H-Bridge Output Current (DC):
Output ON-Resistance (Total):
Operating Temperature Range:
2.0V to 8.0V
2.0mA(Typ)
1μA (Max)
0V to VCCV
100kHz(Max)
0.5μs(Min)
-1.0A to +1.0A
1.0Ω(Typ)
-30°C to +75°C
Features
Low ON-Resistance Power DMOS Output
Charge Pump for the High-Side DMOS Gates
Drive Mode Switch Function
Under Voltage Locked Out Protection
& Thermal Shut Down Circuit
Package
SSOP-B20
W(Typ) x D(Typ) x H(Max)
6.50mm x 6.40mm x 1.45mm
Applications
Mobile system
Home appliance
Amusement system, etc
SSOP-B20
Typical Application Circuit
Bypass Filter Capacitor for
Power Supply
Power-Saving
H: Active
L: Stand-by
Bypass Filter Capacitor for
Power Supply
1µF to 100µF
VCC
1
PS 20
Power Save
TSD & UVLO
BST
BandGap
1µF to 100µF
5
6
VM
Motor Control Input
OUT1
H bridge
Full ON
IN1A 19
IN1B 18
M
OUT2
Level Shift
&
7
4
Logic
IN2A 17
OUT3
OUT4
Pre Driver
H bridge
Full ON
IN2B 16
3
2
8
PWMEN 15
MGND2
MGND1
Power Save
OSC
Selectable Drive Mode
H : EN/IN
L : IN/IN
Charge Pump
Charge Pump
10
14
13
12
11
9
GND
CPL1
CPL2
CPH1
CPH2
BST
0.1μF
0.1μF
1.0μF
Connecting capacitors between the CPL1 and CPL2, CPH1 and CPH2, and BST and GND
pins generate a BST voltage. Use caution to ensure that the voltage difference between
BST and VM is 3.0V or higher, and that the BST voltage does not exceed the absolute
maximum rating of 15V, especially set the BST voltage direct input.
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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Pin Configuration
(TOP VIEW)
PS
IN1A
IN1B
IN2A
IN2B
1
2
20
19
18
17
16
VCC
MGND2
OUT4
OUT3
VM
3
4
5
PWMEN 15
6
OUT1
OUT2
MGND1
BST
CPL1
CPL2
CPH1
CPH2
14
13
12
11
7
8
9
GND
10
Pin Description
Pin No.
Pin Name
VCC
MGND2 Motor ground 2
Function
Pin No.
Pin Name
CPH2
Function
1
2
Power supply
11
12
13
14
15
16
17
18
19
20
2nd Bucket stage with capacitor 2
2nd Bucket stage with capacitor 1
1st Bucket stage with capacitor 2
1st Bucket stage with capacitor 1
CPH1
3
OUT4
OUT3
VM
H-bridge output 4
H-bridge output 3
Motor power supply
H-bridge output 1
H-bridge output 2
CPL2
4
CPL1
5
PWMEN Drive mode logic input
6
OUT1
OUT2
IN2B
IN2A
IN1B
IN1A
PS
Control logic input 2B
Control logic input 2A
Control logic input 1B
Control logic input 1A
Power-saving function
7
8
MGND1 Motor ground 1
9
BST
Charge pump output with capacitor
Ground
10
GND
Block Diagram
VCC
1
PS 20
Power Save
TSD & UVLO
BST
BandGap
5
6
VM
OUT1
H bridge
Full ON
IN1A 19
IN1B 18
Level Shift
7
4
OUT2
OUT3
Logic
&
IN2A 17
Pre Driver
H bridge
Full ON
IN2B 16
3
2
8
OUT4
PWMEN 15
MGND2
MGND1
Power Save
OSC
Charge Pump
Charge Pump
10
14
13
12
11
9
CPH2
GND
CPL1
CPL2
CPH1
BST
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Description of Blocks
1. Power-Saving Function
A power-saving function is included, which allows the system to save power when not driving the motor. The voltage
level on this pin should be set high so as to keep the operation mode. (See the Electrical Characteristics; p.4/12)
2. Motor Control Input
(a) IN1A, IN1B, IN2A and IN2B Pins
Logic level controls the output logic of H-Bridge.
(See the Electrical Characteristics; p.4/12, and I/O Truth Table; p.6/12)
(b) PWMEN Pin
Logic level sets the IN/IN or EN/IN drive mode.
(See the Electrical Characteristics; p.4/12, and I/O Truth Table; p.6/12)
3. H-Bridge
Each H-bridge can be controlled independently. It is therefore possible to drive the H-bridges simultaneously, as long
as the package thermal tolerances are not exceeded. Because the output transistors consist of power DMOS that
can be controlled the charge pump output VBST, the total ON-Resistance of high and low-side transistor is dependent
on BST voltage VBST
.
4. Charge Pump
The BD6735FV includes charge pump circuit which is used to generate a supply above VM to drive the high-side
DMOS gates. Three external capacitors should be connected between CPL1 and CPL2, CPH1 and CPH2, BST and
GND pin. The voltage difference between BST and VM must be 3.0V or higher where the BST voltage VBST must not
exceed the absolute maximum rating of 15.0V in order to ensure better performance.
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
VM
-0.5 to +10.0
-0.5 to +10.0
-0.5 to +15.0
-0.5 to +VCC+0.5
0.81(Note 1)
-1.0 to +1.0 (Note 2)
-55 to +150
150
V
V
Motor Power Supply Voltage
Charge Pump Step-up Supply Voltage
Control Input Voltage
VBST
VIN
V
V
Power Dissipation
Pd
W
A
H-bridge Output Current (DC)
Storage Temperature Range
Junction Temperature
IOUT
Tstg
Tjmax
°C
°C
(Note 1) Reduced by 6.48mW/°C over 25°C, when mounted on a glass epoxy board (70mm x 70mm x 1.6mm).
(Note 2) Must not exceed Pd, ASO, or Tjmax of 150°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Power Supply Voltage
Symbol
Min
Typ
Max
Unit
2.0
2.0
0
-
-
-
-
-
-
8.0
8.0
VCC
100
-
V
V
VCC
VM
Motor Power Supply Voltage
Control Input Voltage
V
VIN
Logic Input Frequency
0
kHz
μs
°C
FIN
Minimum Logic Input Pulse Width
Operating Temperature Range
0.5
-30
TIN
Topr
+75
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Electrical Characteristics (Unless otherwise specified VCC=5.0V, VM=5.0V, Ta=25°C)
Parameter
All Circuits
Symbol
Min
Typ
Max
Unit
Conditions
Stand-by Current
ICCST
ICC
-
0
1
μA
VPS=0V
Circuit Current
0.5
2.0
4.0
mA
VPS=5V, fIN =100kHz
PS Input (PS)
High-Level Input Voltage
Low-Level Input Voltage
High-Level Input Current
Low-Level Input Current
VPSH
VPSL
IPSH
IPSL
2.0
-0.3
25
-
-
VCC
+0.5
100
+1
V
V
50
0
μA
μA
VPS=5V
VPS=0V
-1
Control Input (IN=IN1A, IN1B, IN2A, IN2B, PWMEN)
High-Level Input Voltage
Low-Level Input Voltage
High-Level Input Current
Low-Level Input Current
UVLO
VINH
VINL
IINH
IINL
2.0
-0.3
25
-
-
VCC
+0.7
100
+1
V
V
50
0
μA
μA
VIN=5V
VIN=0V
-1
UVLO Voltage
VUVLO
1.5
-
-
1.9
V
Full ON Type H-Bridge Driver
Output On-Resistance
RON
1.0
1.35
Ω
IOUT=700mA, High & Low-side total
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Typical Performance Curves (Reference data)
5.0
800
600
400
200
0
Top 75°C
Mid 25°C
Low -30°C
4.0
Operating range
(2.0V to 8.0V)
3.0
2.0
1.0
0.0
Top 75°C
Mid 25°C
Low -30°C
0
2
4
6
8
10
0
200
400
600
800
1000
Power Supply Voltage : VCC [V]
Output Current : IOUT [mA]
Figure 1.
Figure 2.
Circuit Current vs Power Supply Voltage
(Operation Mode)
Output VDS vs Power Output Current
(Output On-Resistance on high-side, VM=5V, VCC=5V)
800
600
400
200
0
Top 75°C
Mid 25°C
Low -30°C
0
200
400
600
800
1000
Output Current : IOUT [mA]
Figure 3.
Output VDS vs Power Output Current
(Output On-Resistance on low-side, VM=5V, VCC=5V)
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Timing Chart
Table 1. I/O Truth Table
INPUT
PWM IN1A/2A IN1B/2B
OUTPUT
Input Mode
PS(Note 3)
OUT1/3
Output Mode(Note 4)
Short Brake
CW
OUT2/4
L
H
H
L
X
L
L
H
L
L
L
EN/IN
H
H
L
H
Z
L
CCW
H
L
Z
H
L
Open
H
L
L
CW
IN/IN
-
L
H
H
X
H
L
CCW
H
X
L
Short Brake
Open
X
Z
Z
L: Low, H: High, X: Don’t care, Z: Hi impedance
(Note 3)PS=High: Operation Mode, PS=Low: Stand-by Mode
(Note 4)CW: Current flows from OUT1 to OUT2 and OUT3 to OUT4, CCW: Current flows from OUT2 to OUT1 and OUT4 to OUT3
Application Example
Bypass Filter Capacitor for
Power Supply
Power-Saving
H: Active
L: Stand-by
Bypass Filter Capacitor for
Power Supply
1µF to 100µF
VCC
1
PS 20
Power Save
TSD & UVLO
BST
BandGap
1µF to 100µF
5
6
VM
Motor Control Input
OUT1
OUT2
IN1A 19
IN1B 18
H bridge
Full ON
M
Level Shift
7
4
Logic
&
IN2A 17
OUT3
OUT4
Pre Driver
H bridge
Full ON
IN2B 16
3
2
8
PWMEN 15
MGND2
MGND1
Power Save
OSC
Selectable Drive Mode
H : EN/IN
L : IN/IN
Charge Pump
Charge Pump
10
14
13
12
11
9
GND
CPL1
CPL2
CPH1
CPH2
BST
0.1μF
0.1μF
1.0μF
Connecting capacitors between the CPL1 and CPL2, CPH1 and CPH2, and BST and GND
pins generate a BST voltage. Use caution to ensure that the voltage difference between
BST and VM is 3.0V or higher, and that the BST voltage does not exceed the absolute
maximum rating of 15V, especially set the BST voltage direct input.
Selection of Components Externally Connected
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including static and transitional characteristics as well as dispersion of the IC.
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Power Dissipation
1.0
0.81W
0.8
0.6
0.4
0.2
0.0
0.49W
75°C
75 100
0
25
50
125
150
Ambient Temperature : Ta [°C]
Figure 4.
Power Dissipation vs Ambient Temperature
I/O Equivalent Circuits
PS
IN1A, IN1B, IN2A, IN2B, PWMEN
VM, MGND1, MGND2, OUT1 to OUT4
VM
VCC
VCC
70kΩ
VCC
10kΩ
100kΩ
100kΩ
OUT1, 3
OUT2, 4
VCC
3.33kΩ
275kΩ
MGND1, 2
CPH1, CPL1
BST, CPH2, CPL2
Inside REG
VM
BST
CPH2
CPL2
VM
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal(GND) and large-current ground(MGND) traces, the two ground traces should be routed
separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 5.
Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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Ordering Information
B D
6
7
3
5
F
V
-
E 2
Packaging and forming specification
E2: Embossed tape and reel
Package
FV : SSOP-B20
Part Number
Marking Diagram
SSOP-B20 (TOP VIEW)
Part Number Marking
LOT Number
B D 6 7 3 5
1PIN MARK
Part Number Marking
Package
SSOP-B20
Orderable Part Number
BD6735
BD6735FV-E2
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Physical Dimension, Tape and Reel Information
Package Name
SSOP-B20
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BD6735FV
Revision History
Date
Revision
001
Changes
09.Dec.2015
New Release
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Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
Buy
BD6735FV - Web Page
Distribution Inventory
Part Number
Package
Unit Quantity
BD6735FV
SSOP-B20
2500
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
2500
Taping
inquiry
Yes
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