BD69060GFT [ROHM]
BD69060GFT是DC无刷风扇电机驱动器系列中内置霍尔元件的5V单相全波风扇电机驱动器。小型封装、基于软开关的静音驱动、减少电池消耗的待机模式等，是适用于笔记本电脑冷却风扇的IC。;
| 型号： | BD69060GFT |
| 厂家： | 
ROHM |
| 描述： | BD69060GFT是DC无刷风扇电机驱动器系列中内置霍尔元件的5V单相全波风扇电机驱动器。小型封装、基于软开关的静音驱动、减少电池消耗的待机模式等，是适用于笔记本电脑冷却风扇的IC。 电池 开关 电机 驱动 电脑 风扇 驱动器 |
| 文件： | 总23页 (文件大小：1676K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
DC Brushless Fan Motor Driver Series
5 V Single-phase Full-wave
Fan Motor Driver
BD69060GFT
General Description
Key Specifications
The BD69060GFT is a 5 V single-phase full-wave Fan
Motor Driver with the built-in hall element. It is part of the
DC brushless Fan Motor Driver series. The BD69060GFT
has a compact package. It has the silent drive by soft
switching and the low battery consumption via its stand-
by function. The BD69060GFT is best used for notebook
PC cooling fans.
Supply Voltage Range:
1.8 V to 5.5 V
Operating Temperature Range: -40 °C to +105 °C
Output Voltage (Upper and Lower Total):
0.16 V(Typ) at 0.2 A
Features
Package
TSSOF6
W(Typ) x D(Typ) x H(Max)
2.90 mm x 3.80 mm x 0.8 mm
Built-in Hall Element
PWM Speed Control
Soft Switching Drive (PWM type)
Start Duty Assist
Stand-by Mode
Quick Start
Lock Protection and Automatic Restart
Rotating Speed Pulse Signal (FG) Output
Compact Package (Flat Lead Package)
Application
For Compact 5 V Fan Such as Notebook PC
Cooling Fan
Typical Application Circuit
1
2
3
FG
VCC
PWM
OUT2
6
5
4
＋
SIG
GND
OUT1
－
PWM
M
Figure 1. Application Circuit
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD69060GFT
Pin Configuration
Block Diagram
(TOP VIEW)
FG
VCC
6
SIGNAL
OUTPUT
FG
GND
1
2
3
6
5
4
VCC
1
OSC
TSD
HALL
ELEMENT
PWM
OUT2
UVLO
VCC
CONTROL
LOGIC
GND
2
PWM
5
OFFSET
CANCEL
FILTER
OUT1
PRE
DRIVER
VCC
OUT1
3
OUT2
4
Pin Description
Pin No.
Pin Name
Function
1
2
3
4
5
6
FG
FG output
Ground
GND
OUT1
OUT2
PWM
VCC
Motor output 1
Motor output 2
PWM input
Power supply
I/O Truth Table
Supply magnetic direction (forward)
Output operation
S
Marking
BHYS
BHYS
N
BREV
BFWD
BREV
BFWD
Magnetic flux density: B
Magnetic flux density: B
Figure 2. Relationship Magnetic Density and Output Operation
Supply Magnetic
PWM
OUT1
OUT2
FG
Direction
S
N
H (OPEN)
H
L
L
L
L
H
L
L
H (OPEN)
Hi-Z
L
S
N
L
L
L
Hi-Z
H; High, L; Low, Hi-Z; High impedance
FG output is open drain type.
Motor State
FG
Rotating
Locking
-
-
Stand-by
Hi-Z
Hi-Z; High impedance
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BD69060GFT
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage
VCC
Tstg
Tj
7
V
°C
°C
V
Storage Temperature Range
Junction Temperature
Motor Output Voltage
Motor Output Current
FG Output Voltage
-55 to +150
150
7
VO
IO
1.0
7
A
VFG
V
FG Output Current
IFG
10
mA
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
TSSOF6
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
357.1
54
188.7
42
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
.
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BD69060GFT
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VCC
VPWM
fPWM
Topr
1.8
0
5.0
-
5.5
5.5
V
V
PWM Input Voltage
PWM Input Frequency
Operating Temperature Range
5
25
-
50
kHz
°C
+105
-40
Electrical Characteristics (Unless otherwise specified VCC=5 V Ta=25 °C)
Typical
Performance
Curves
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
ICC1
ICC2
-
-
-
3
5
50
-
mA
µA
PWM=OPEN
PWM=GND
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
-
Circuit Current 1
25
Circuit Current 2 (Stand-by Mode)
Magnetic Switch Point (Forward)
Magnetic Switch Point (Reverse)
Magnetic Hysteresis
BFWD
+1.5
mT
BREV
BHYS
-
-
-1.5
3.0
-
mT
mT
5.0
PWM Input High Level
VPWMH
VPWML
2.5
0
-
-
VCC
0.8
V
V
-
PWM Input Low Level
Io=200 mA
(Upper and
Lower total)
VO
-
0.16
0.24
V
Figure 8 to 13
Motor Output Voltage
FG Output Low Voltage
FG Output Leak Current
Lock Detection ON Time
Lock Detection OFF Time
VFGL
IFGL
-
-
-
-
0.4
5
V
IFG=5 mA
VFG=7 V
Figure 14,15
Figure 16
Figure 17
Figure 18
µA
tON
0.35
3.5
0.50
5.0
0.65
6.5
s
s
tOFF
About current items, define the inflow current to the IC as a positive notation.
.
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BD69060GFT
Typical Performance Curves
(Reference Data)
5.0
4.0
3.0
2.0
1.0
50
40
30
20
10
0
Supply Voltage Range
Ta=+105 °C
Ta=-40 °C
Ta=+25 °C
Ta=+25 °C
Ta=+105 °C
Ta=-40 °C
Supply Voltage Range
0.0
1
2
3
4
5
6
1
2
3
4
5
6
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Figure 3. Circuit Current vs Supply Voltage
Figure 4. Circuit Current vs Supply Voltage
(Stand-by Mode)
2.5
2.5
2.0
1.5
2.0
1.5
Supply Voltage Range
Ta=+105 °C
1.0
1.0
Ta=+25 °C
Ta=-40 °C
0.5
0.5
0.0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-0.5
-1.0
-1.5
-2.0
-2.5
Ta=-40 °C
Ta=+25 °C
Ta=+105 °C
Supply Voltage Range
1
2
3
4
5
6
1
2
3
4
5
6
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Figure 5. Magnetic Switch Point (Forward) vs Supply Voltage
Figure 6. Magnetic Switch Point (Reverse) vs Supply Voltage
.
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BD69060GFT
Typical Performance Curves - continued
(Reference Data)
5.0
4.0
3.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta=+105 °C
Ta=+25 °C
Ta=+105 °C
Ta=+25 °C
2.0
1.0
0.0
Ta=-40 °C
Ta=-40 °C
Supply Voltage Range
1
2
3
4
5
6
0.0
0.2
0.4
0.6
0.8
1.0
Supply Voltage: VCC [V]
Motor Output Source Current: IO [A]
Figure 7. Magnetic Hysteresis vs Supply Voltage
Figure 8. Motor Output High Voltage vs
Motor Output Source Current
(VCC=5.0 V)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
VCC=1.8 V
0.8
0.6
Ta=+105 °C
Ta=+25 °C
VCC=5.0 V
0.4
VCC=5.5 V
0.2
Ta=-40 °C
0.0
0.0
0.2
0.4
0.6
0.8
1.0
0.0
0.2
0.4
0.6
0.8
1.0
Motor Output Sink Current: IO [A]
Motor Output Source Current: IO [A]
Figure 9. Motor Output High Voltage vs
Motor Output Source Current
(Ta=25 °C)
Figure 10. Motor Output Low Voltage vs
Motor Output Sink Current
(VCC=5.0 V)
.
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BD69060GFT
Typical Performance Curves - continued
(Reference Data)
1.2
1.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta=+105 °C
Ta=+25 °C
VCC=1.8 V
0.8
0.6
0.4
0.2
0.0
VCC=5.0 V
Ta=-40 °C
VCC=5.5 V
0.0
0.2
0.4
0.6
0.8
1.0
0.0
0.2
0.4
0.6
0.8
1.0
Motor Output Current: IO [A]
Motor Output Sink Current: IO [A]
Figure 11. Motor Output Low Voltage vs
Motor Output Sink Current
(Ta=25 °C)
Figure 12. Motor Output Voltage vs Motor Output Current
(Upper and Lower total) (VCC=5.0 V)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.5
0.4
0.3
VCC=1.8 V VCC=5.0 V
VCC=5.5 V
0.2
Ta=+105 °C
Ta=+25 °C
0.1
Ta=-40 °C
0.0
0.0
0.2
0.4
0.6
0.8
1.0
0
2
4
6
8
10
FG Sink Current: IFG [mA]
Motor Output Current: IO [A]
Figure 13. Motor Output Voltage vs Motor Output Current
(Upper and Lower total)(Ta=25 °C)
Figure 14. FG Output Low Voltage vs FG Sink Current
(VCC=5.0 V)
.
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BD69060GFT
Typical Performance Curves - continued
(Reference Data)
5.0
4.0
3.0
2.0
1.0
0.0
-1.0
0.5
0.4
0.3
Supply Voltage Range
VCC=1.8 V
0.2
0.1
0.0
Ta=+105 °C
Ta=+25 °C
Ta=-40 °C
VCC=5.0 V
VCC=5.5 V
1
2
3
4
5
6
0
2
4
6
8
10
FG Sink Current: IFG [mA]
Supply Voltage: VCC [V]
Figure 15. FG Output Low Voltage vs FG Sink Current
(Ta=25 °C)
Figure 16. FG Output Leak Current vs Supply Voltage
(VFG=7.0 V)
1.0
0.8
10
8
0.6
6
Ta=-40 °C
Ta=-40 °C
Ta=+105 °C
Ta=+105 °C
4
0.4
0.2
0.0
Ta=+25 °C
Ta=+25 °C
2
Supply Voltage Range
Supply Voltage Range
0
1
2
3
4
5
6
1
2
3
4
5
6
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Figure 17. Lock Detection ON Time vs Supply Voltage
Figure 18. Lock Detection OFF Time vs Supply Voltage
.
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BD69060GFT
Application Information Example (Constant Values for Reference)
1. PWM Input Application
This is an example of the application to control the rotational speed by the external PWM input.
Consider protection against
voltage rise due to reverse
connection of the power supply
and the back electromotive force
Protection for the FG
(open drain)
FG
1
VCC
6
SIGNAL
OUTPUT
FG
OSC
TSD
＋
0 Ω to 10 kΩ
0 Ω to 4.7 Ω
1 μF to 10 μF
The by-pass capacitor
Place it as close as
possible to the VCC pin
HALL
ELEMENT
UVLO
VCC
CONTROL
LOGIC
GND
2
PWM
5
OFFSET
CANCEL
FILTER
－
PWM
PRE
DRIVER
The resistance to protect the
PWM pin
The capacitor to remove a
noise
VCC
OUT1
3
OUT2
4
M
Figure 19. PWM Input Application
Substrate Design Note
(a) The IC power, motor outputs and the ground lines are wired as thick as possible.
(b) The by-pass capacitor and the Zener diode are placed as close as possible to the VCC pin.
.
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BD69060GFT
Functional Descriptions
1. PWM Speed Control
The rotation speed of the motor can be changed depending on the PWM input duty to the PWM pin. When the PWM pin
is open, the PWM input duty becomes 100 % (the PWM pin is pulled up to the VCC pin with the internal resistor of 200
kΩ (Typ)). But the PWM controls by the open collector/drain which use only the internal resistor is prohibited. Because
the resistor value is big, the PWM input signal becomes dull and cannot input the expected PWM duty into the IC.
The characteristic of the PWM input/output duty is shown as Figure 20.
100
80
60
40
20
0
0
20
PWM Input Duty [%]
Figure 20. PWM Output Duty vs PWM Input Duty
40
60
80 100
2. Soft Switching Drive(PWM type)
The soft switching drive is a function that the output duty changes between 0 % and the PWM output duty at the timing
of the output phase change. To smooth off the current waveform, the coefficient table that the output duty gradually
changes is set inside the IC. When one period of the FG signal is assumed 360°, the section of the soft switching is
about 60° (Typ). As shown in Figure 21, this IC is controlled same the section of the soft switching with various magnetic
waveforms, such as the rectangular wave, the trapezoidal wave and the sine wave. The output PWM frequency is 50
kHz (Typ). Hence, the input PWM frequency is not equal to the output PWM frequency.
S pole
+/-0 mT
N pole
S pole
+/-0 mT
N pole
Rotor
Rotor
Magnet
Magnet
FG period 360°
FG period 360°
High
Low
High
Low
FG
FG
: High impedance
: High impedance
High
High
OUT1
OUT2
OUT1
OUT2
Low
Low
High
High
Low
0 A
Low
0 A
Motor
Motor
Current
Current
60°
60°
60°
60°
Soft switching width
Soft switching width
(a) Case 1: Trapezoidal wave
(b) Case 2: Sine wave
Figure 21. PWM Soft-switching Drive Waveform
.
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BD69060GFT
Functional Descriptions - continued
3. Start Duty Assist
The start duty assist can secure a constant starting torque even at the low input duty.
The IC is driven by a constant output duty (DOHL; Typ 50 %) until detection of motor rotation from startup.
When the output ON duty is less than 50 % (Typ), the start duty assist function operates under the following conditions:
(1) Power ON
(2) Automatic Restart after Lock Protection
(3) Quick Start
ON
DOH Motor Output ON Duty [%]
Power
100
OFF
DOHL (Typ 50 %)
100 %
Motor
Output ON
Duty
50 %
Input duty
0 %
50
DOHL (Typ 50 %)
Power ON
Detect of Motor Rotation
: Startup Duty Assist
Input PWM Duty [%]
0
50
100
Figure 22. I/O Duty Characteristic at Start Duty Assist
Figure 23. Timing Chart of Power ON
4. Stand-by Mode and Quick Start
When the BD69060GFT detects that the input PWM duty is 0 %, the internal state changes to the stand-by mode. The
circuit current during the stand-by mode is specified at the parameter of the Circuit Current 2 in the electrical
characteristics. And when the PWM signal is input while the stand-by mode, the motor can restart immediately after 10
ms (Typ) of startup time without being affected by the lock protection function. (Quick Start)
Timing chart of the stand-by mode and the quick start is shown as Figure 24.
PWM
Quick Start
(Motor Start)
0 % Detection Time:
t0 ms
IC Internal
Stand-by Signal
ON
OFF
OFF
HALL Amplifier Gain Select Time:
10 ms (Typ)
Figure 24. Timing Chart of Stand-by Mode and Quick Start
The PWM pin has a built-in digital low pass filter. The detection time of the input PWM duty 0 % (t0) varies depending
on the input PWM duty just before input 0 %. Relationship between the input PWM duty (frequency is 25 kHz) just
before input 0 % and 0 % detection time is shown as Figure 25.
100
80
60
40
20
0
0
10
20
30
0 % Detection Time: t0 [ms]
Figure 25. PWM Input Duty (25 kHz) vs 0 % Detection Time
.
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BD69060GFT
Functional Descriptions - continued
5. Lock Protection and Automatic Restart
The motor rotation is detected by the hall signal, while the lock detection ON time (tON) and the lock detection OFF time
(tOFF) are set by the IC internal counter. Timing chart is shown as Figure 26.
Motor Idling
Magnetic
S
N
S
N
S
N
S
N
S
N
S
N
S
Field
Direction
tOFF (Typ 5.0 s)
tOFF
tOFF
tON (Typ 0.5 s)
tON
tON
High
OUT1
OUT2
FG
Low
High
Low
High
Low
Instruction
Torque
Motor
Output ON
Duty
0 %
: High Impedance
Motor Lock Lock Detection
Lock Release
Figure 26. Timing Chart of Lock Protection
.
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BD69060GFT
Safety Measures
1. Reverse Connection Protection Diode
The reverse connection of the power results in the IC destruction as shown in Figure 27. When the reverse connection
is possible, the reverse connection protection diode must be added between the power supply and the VCC pin.
After reverse connection
In normal energization
Reverse power connection
VCC
Destruction prevention
VCC
VCC
Circuit
Block
Circuit
Block
Circuit
Block
GND
GND
GND
Internal circuit impedance is high
Large current flows
No destruction
Amperage is small
Thermal destruction
Figure 27. Flow of Current When the Power is Connected Reversely
2. Protection against VCC Voltage Rise by Back Electromotive Force
The back electromotive force (Back EMF) generates
regenerative current to the power supply. However,
when the reverse connection protection diode is
connected to the power supply line as shown in
Figure 28, the VCC voltage rises because the diode
prevents current flow to the power supply.
ON
Phase
Switching
ON
When the absolute maximum rated voltage may be
exceeded due to the voltage rise by the back
electromotive force, place a (A) capacitor or (B)
Zener diode between the VCC pin and the GND pin
for regenerative current path as shown in Figure 29.
If further measures are necessary, use measures of
(A) and (B) together like as (C). The capacitor and
the resistor can be used to have better voltage surge
protection like as (D).
ON
ON
Figure 28. VCC Voltage Rise by Back Electromotive
(A) Capacitor
(B) Zener Diode
(C) Capacitor & Zener Diode
(D) Capacitor & Resistor
ON
ON
ON
ON
ON
ON
ON
ON
Figure 29. Measure Against VCC and Motor Driving Outputs Voltage
3. PWM Switching of GND Line
Do not perform the PWM switching of the GND line because the GND pin potential cannot be kept to a minimum.
4. Protection of Input Pin and Output Pin
Misconnecting of the external connector from the motor PCB or plugging and unplugging the hot connector may cause
damage to the IC by the rush current or the over voltage surge.
About the input pin and the output pin except the VCC pin and the GND pin, please take measures such as using the
protection resistor so that the IC is not affected by the over voltage or the over current as shown in Figure 31.
Motor PCB
＋
IC
Protection
Resistor
Protection
Resistor
PWM
FG
Motor
Driver
Controller
PWM
M
GND
PWM Input
Prohibition
－
FG
Figure 30. Prohibition of the GND Line PWM Switching
Figure 31. Protection of the PWM Pin and the FG pin
.
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BD69060GFT
Power Consumption
1
Current Path
The current pathways that relates to the driver IC are following, and shown as Figure 32.
(1) Circuit Current(ICC
)
(2) Motor Current (IM)
(3) FG Output Sink Current (IFG
)
ICC
FG
VCC
6
SIGNAL
OUTPUT
FG
1
OSC
TSD
＋
IM
IFG
HALL
ELEMENT
UVLO
VCC
CONTROL
LOGIC
GND
2
PWM
5
OFFSET
CANCEL
FILTER
－
PWM
PRE
DRIVER
VCC
OUT1
3
OUT2
4
M
Figure 32. Current Paths of the IC
2
Calculation of Power Consumption
(1) Circuit Current (ICC
)
푃푊퐴 = 푉퐶퐶[V] × 퐼퐶퐶[A]
[W] (ICC Current does not include IM)
(ex.) 푉퐶퐶 = 5.0 V, 퐼퐶퐶 = 2.5 mA
푃푊퐴 = 5.0 × 2.5 = 12.5 mW
(2) Motor Driving Current (IM)
The VOH is the output saturation voltage of the OUT1 or the OUT2 high side, the VOL is the other low side voltage,
(
)
푃푊퐵 = 푉푂퐻[V]+푉푂퐿[V] × 퐼푀[A]
[W]
(ex.) 푉푂퐻 = 0.08 V, 푉푂퐿 = 0.08 V, 퐼푀 = 200 mA
(
)
푃푊퐵 = 0.08 + 0.08 × 200 = 32.0 mW
(3) FG Output Sink Current (IFG
)
푃푊퐶 = 푉퐹퐺[V] × 퐼퐹퐺[A]
[W]
(ex.) 푉퐹퐺 = 0.05 V, 퐼퐹퐺 = 5.0 mA
푃푊퐶 = 0.05 × 5.0 = 0.25 mW
The power consumption of the driver IC totaled the above (1) to (3) is the following.
푃 = 푃푊퐴 + 푃푊퐵 + 푃푊퐶
[W]
(ex.) 푃 = 12.5 + 32.0 + 0.25 = 44.75 mW
.
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BD69060GFT
I/O Equivalence Circuit (Resistance Values are Typical)
1. Supply voltage, Ground
2. PWM signal input
VCC
VCC
VCC
GND
200 kΩ
10 kΩ
PWM
3. FG output
4. Motor outputs
VCC
FG
OUT1
OUT2
Hall Position (Reference data)
2.9 ± 0.1
MAX 3.25 (Including BURR)
1.45
1.00
0.75 ± 0.05
0.20
6
5
4
(Reference data)
HALL position
(Reference data）
1
2
3
+0.05
HALL position
(Reference data）
0.13
ｰ0.04
.
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BD69060GFT
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due
to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground
will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as
motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.
The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-
pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
.
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BD69060GFT
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 33. Example of Monolithic IC Structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
.
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BD69060GFT
Ordering Information
B D 6
9
0
6
0 G F T
-
T L
Part Number
Package
GFT: TSSOF6
Packaging and forming specification
TL: Embossed tape and reel
Marking Diagram
TSSOF6(TOP VIEW)
LOT Number
Part Number Marking
Pin 1 Mark
.
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BD69060GFT
Physical Dimension and Packing Information
Package Name
TSSOF6
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
TL
Direction
of feed
(The direction is the 1pin of product is at the upper right when you
hold reel on the left hand and you pull out the tape on the right hand.)
.
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BD69060GFT
Revision History
Date
Revision
001
Changes
18.Apr.2018
New Release
.
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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