BD6971FS_11 [ROHM]
Silicon Monolithic Integrated Circuit; 硅单片集成电路
| 型号： | BD6971FS_11 |
| 厂家： | 
ROHM |
| 描述： | Silicon Monolithic Integrated Circuit |
| 文件： | 总5页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1/4
STRUCTURE
PRODUCT SERIES
TYPE
Silicon Monolithic Integrated Circuit
Single-Phase Full-Wave Motor Driver for Fan Motor
ＢＤ６９７１ＦＳ
FEATURES
Speed controllable by DC/PWM input
Current limit circuit
PWM soft switching drive
〇ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Vcc
Limit
Unit
V
Supply voltage
20
Power dissipation
Pd
Topr
Tstg
Iomax
IFG
VFG
IREF
IHB
812.5＊
-40 to +100
-55 to +150
1.0＊＊
mW
°C
°C
A
mA
V
mA
mA
V
Operating temperature
Storage temperature
Output current
FG output current
FG output voltage
10
20
5
5
7
REF current ability
HB current ability
Input voltage(H+, H-, TH, MIN, CS)
Junction temperature
＊Reduce by 6.5mW/°C over Ta=25°C.
VIN
Tjmax
150
°C
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
＊＊This value is not to exceed Pd.
〇OPERATING CONDITIONS
Symbol
Vcc
Parameter
Operating supply voltage range
Limit
Unit
V
V
3.5 to 17.0
0 to Vcc-2.0
0 to 7.0
less than Vcc=9.0V
more than Vcc=9.0V
Hall input voltage range
VH
V
TH input voltage range
MIN input voltage range
VTH
VMIN
0 to VREF
0 to VREF
V
V
＊This product is not designed for production against radioactive rays.
REV. B
2/4
〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25°C, Vcc=12V)
Limit
Typ.
5
9
-13
Symbol
Parameter
Circuit current
Hall input hysteresis +
Hall input hysteresis -
Unit
Conditions
Min.
3
4
Max.
8
16
-8
Icc
VHYS+
VHYS-
mA
mV
mV
-18
Io=200mA,
Upper and Lower total
Output voltage
VO
-
0.6
0.9
V
Lock detection ON time
Lock detection OFF time
FG output low voltage
FG output leak current
OSC low voltage
OSC high voltage
OSC charge current
OSC discharge current
TON
TOFF
VFGL
0.3
3.0
-
0.5
5.0
0.15
-
1.0
2.5
-8
0.7
7.0
0.3
10
1.2
2.7
-4
s
s
V
IFG =2mA
IFGL
-
μA VFG=17V
V
V
μA
μA
VOSCL
VOSCH
ICOSC
IDOSC
0.8
2.3
-16
4
8
16
VTH=VREF×0.222
Output ON Duty 1
Output ON Duty 2
Output ON Duty 3
DUTY1
DUTY2
DUTY3
75
45
15
80
50
20
85
55
25
%
%
%
OUT1-OUT2=1kΩ,
COSC=100pF
VTH=VREF×0.294
OUT1-OUT2=1kΩ,
COSC=100pF
VTH=VREF×0.367
OUT1-OUT2=1kΩ,
COSC=100pF
REF voltage
VREF
VHB
VCL
ITH
IMIN
ICS
5.8
1.10
280
-
-
-
6.0
1.3
310
-
-
-
6.2
1.5
340
0.2
0.2
0.2
V
V
mV
μA
μA
μA
IREF =-2mA
IHB =-2mA
Hall bias voltage
Current limit voltage
TH bias current
MIN bias current
CS bias current
REV. B
3/4
〇PACKAGE OUTLINES
6.6 0.2
16
9
BD6971
1
8
0.15 0.1
0.1
Lot No.
0.8
0.36 0.1
SSOP-A16 (UNIT:mm)
〇BLOCK DIAGRAM
〇TERMINAL NAME
Terminal
name
FG
FG
GND
16
PIN No.
SIGNAL
OUTPUT
QUICK
START
TSD
OSC
１
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
H-
OSC
15
H-
HB
H+
CS
SOFT
SWITCH
LOCK
2
PROTECTION
MINPWM
COMP
+
-
HB
MIN
14
HB
3
N.C.
OUT2
RNF
N.C.
OUT1
Vcc
REF
TH
MIN
OSC
GND
THPWM
COMP
HALL
COMP
+
-
H+
TH
13
+
-
4
CURRENT
LIMIT
VCL
COMP
CONTROL
LOGIC
+
-
CS
REF
12
REF
5
N.C.
6
Vcc
11
PRE DRIVER
OUT2
7
OUT1
10
RNF
8
N.C.
9
REV. B
4/4
〇CAUTIONS ON USE
1) Absolute maximum ratings
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down
the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will
expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An
external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor
between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem
before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low
temperatures)
4) GND potential
It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor.
The potential of GND terminal must be minimum potential in all operating conditions, except that the levels of the motor outputs
terminals are under GND level by the back electromotive force of the motor coil. Also ensure that all terminals except GND and motor
output terminals do not fall below GND voltage including transient characteristics. Malfunction may possibly occur depending on use
condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or
if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175°C (typ.) and has a hysteresis width
of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always
discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig
or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when
transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single
ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents
do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external
components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the
current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below
100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied
to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual
interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic
element is actuated.
REV. B
Notice
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illustrate the standard usage and operations of the Products. The peripheral conditions must
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However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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R1120
A
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