BD6981FVM [ROHM]
单相全波风扇电机驱动器BD6981FVM通过采用Bi-CDMOS工艺实现了低功耗，通过软开关驱动实现了静音化。内置锁定保护自动恢复电路,无需外置电容器。;
| 型号： | BD6981FVM |
| 厂家： | 
ROHM |
| 描述： | 单相全波风扇电机驱动器BD6981FVM通过采用Bi-CDMOS工艺实现了低功耗，通过软开关驱动实现了静音化。内置锁定保护自动恢复电路,无需外置电容器。 开关 电机 驱动 CD 电容器 风扇 驱动器 |
| 文件： | 总17页 (文件大小：763K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
DC Brushless Motor Drivers for Fans
Standard Single-phase Full wave
Fan Motor Driver
BD6981FVM
Description
This is the summary of application for BD6981FVM. BD6981FVM can drive FAN motor silently by BTL soft switching.
Features
Small package (MSOP8)
Package
MSOP8
W(Typ) x D(Typ) x H(Max)
2.90mm x 4.00mm x 0.90mm
BTL soft switching drive
Constant voltage output for hall element
Lock protection and auto restart
(without external capacitor)
Rotating speed pulse signal (FG) output
Applications
PC, PC peripheral component
(Power supply, VGA card, case FAN etc.)
BD player, Projector etc.
MSOP8
Absolute Maximum Ratings
Parameter
Supply Voltage
Symbol
VCC
Rating
Unit
V
18
Power Dissipation
Pd
0.58(Note 1)
W
Operating Temperature
Storage Temperature
Junction Temperature
Output Voltage
Topr
Tstg
Tjmax
VOMAX
IOMAX
VH
-40 to +105
°C
°C
°C
V
-55 to +150
150
18
Output Current
800(Note 2)
mA
V
Hall Input Voltage
7
FG Signal Output Voltage
FG Signal Output Current
HB Output Current
18
10
10
V
VFG
mA
mA
IFG
IHB
(Note 1) Reduce by 4.68mW/°C over 25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board)
(Note 2) This value is not to exceed Pd.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
.
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BD6981FVM
Recommended Operating Conditions
Parameter
Symbol
VCC
Limit
Unit
V
Operating Supply Voltage Range
Hall Input Voltage Range
2.8 to 16
0.4 to VCC/4
VH
V
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V)
Limit
Parameter
Circuit Current
Symbol
Unit
Conditions
Characteristics
Min.
1.5
Typ.
4
Max.
8
ICC
VHB
VOFS
GIO
mA
V
Figure 1
Hall Bias Voltage
Hall Input Offset
Input-output Gain
IHB=-3mA
Figure 2,3
1.1
0
1.2
-
1.3
±6
mV
dB
-
-
53
55
57
IO=200mA
Upper and Lower total
Output Voltage
VO
0.20
0.45
0.70
V
Figure 4 to 7
FG Hysteresis Voltage
FG Low Voltage
VHYS
VFGL
IFGL
tON
mV
V
Figure 8
Figure 9,10
-
±5
-
±10
0.2
-
±15
0.4
5
IFG=5mA
VFG=18V
FG Leak Current
µA
s
0
Lock Detection ON Time
Lock Detection OFF Time
Lock Detection Time Ratio
Figure 11
Figure 12
-
0.35
2.0
-
0.50
3.0
6
0.65
4.0
-
tOFF
rLD
s
-
rLD = tOFF / tON
Truth Table
H+
H-
L
OUT1
OUT2
FG
H
L
H
L
L
H(Output Tr：OFF)
L(Output Tr：ON)
H
H
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BD6981FVM
Reference Data
1.4
1.3
1.2
1.1
1.0
8
6
105°C
16V
12V
4
25°C
-40°C
2.8V
2
Operating Range
0
0
2
4
6
8
10
0
3
6
9
12
15
18
HB Current, IHB [mA]
Supply Voltage, VCC [V]
Figure 1. Circuit Current
Figure 2. Hall Bias voltage
(Voltage characteristics)
1.4
1.3
1.2
1.1
1.0
2.0
1.6
1.2
0.8
0.4
0.0
2.8V
12V
16V
105°C
25°C
-40°C
0
2
4
6
8
10
0.0
0.2
0.4
0.6
0.8
HB Current, IHB [mA]
Output Current, IO [A]
Figure 4. Output H Voltage
(Voltage Characteristics)
Figure 3. Hall Bias Voltage
(Temperature Characteristics)
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BD6981FVM
1.0
0.8
0.6
0.4
0.2
0.0
2.0
1.6
1.2
0.8
0.4
2.8V
105°C
25°C
12V
16V
-40°C
0.0
0.0
0.2
0.4
0.6
0.8
0.0
0.2
0.4
0.6
0.8
Output Current, IO [A]
Output Current,IO [A]
Figure 5. Output H Voltage
(Temperature Characteristics)
Figure 6. Output L Voltage
(Voltage Characteristics)
20
15
10
5
1.0
0.8
0.6
0.4
0.2
105°C
25°C
105°C
-40°C
25°C
0
Operating Range
-40°C
-5
-40°C
-10
-15
-20
25°C
105°C
0.0
0.0
0
3
6
9
12
15
18
0.2
0.4
0.6
0.8
Supply Voltage, VCC [V]
Output Current,IO [A]
Figure 7. Output L Voltage
(Temperature Characteristics)
Figure 8. FG Hysteresis Voltage
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BD6981FVM
1.0
0.8
0.6
0.4
0.2
1.0
0.8
0.6
0.4
0.2
0.0
105°C
25°C
2.8V
12V
16V
-40°C
0.0
0
2
4
6
8
0
2
4
6
8
FG Current, IFG [mA]
FG Current, IFG [mA]
Figure 9. FG Output Voltage
(Voltage Characteristics)
Figure 10. FG Output Voltage
(Temperature Characteristics)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
1.0
0.8
0.6
-40°C
-40°C
25°C
25°C
105°C
0.4
105°C
0.2
0.0
Operating Range
Operating Range
0
3
6
9
12
15
18
0
3
6
9
12
15
18
Supply Voltage, VCC [V]
Supply Voltage, VCC [V]
Figure 11. Lock Detection ON Time
Figure 12. Lock Detection OFF Time
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BD6981FVM
Block Diagram, Application Circuit and Pin Assignment
Incorporates soft switching
function. Adjust at an
M
optimum value because
gradient of switching of
output waveform depends
OUT2
GND
8
1
on hall element output.
Take a measure against
VCC voltage rise due to
reverse connection of
power supply and back
electromotive force.
OSC
P.7
H+
OUT1
7
Lock
2
TSD
Protection
P.9
HB
3
VCC
6
Hall
Bias
Hall
0Ω to
500Ω
0.1uF
to 1uF
H-
4
FG
5
This is an open drain
output. Connect a pull-up
resistor.
P.10
OSC : Internal reference oscillation circuit
TSD : Thermal shut down(heat rejection circuit)
Pin Description
Pin No.
Pin Name
OUT2
H+
Function
1
2
3
4
5
6
7
8
Motor output 2
Hall input +
HB
Constant voltage output for hall element
Hall input -
H-
FG
Rotational speed pulse output
Power supply pin
VCC
OUT1
GND
Motor output 1
GND
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BD6981FVM
Description of Operations
1) Lock Protection and Automatic Restart
Motor rotation is detected by hall signal. Lock detection ON time (tON) and lock detection OFF time (tOFF) are set by the
digital counter based on internal oscillator. Therefore the ratio of ON/OFF time is always constant. Timing chart is
shown in Figure 13.
Idling
H+
OUT1
tON
tOFF
OUT2
FG
Output Tr OFF
ON
Depends on hall signal
(L in this figure)
Motor
locking detection
Lock
Lock
release
Recovers normal
operation
Figure 13. Lock Protection Timing Chart
2) Soft Switching (silent drive setting)
Input signal to hall amplifier is amplified to produce an output signal.
When the hall element output signal is small, the gradient of switching of output waveform is gentle. When it is large,
the gradient of switching of output waveform is steep. Gain of 55dB (560 times) is provided between input and output,
therefore enter an appropriate hall element output to IC where output waveform swings sufficiently.
(H+)-(H-)
OUT1
Figure 14. Relation between Hall Element Output Amplitude and Output Waveform
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BD6981FVM
3) Hall Input Setting
VCC
VCC/4V
0.4V
GND
Figure 15. Hall Input Voltage Range
Adjust the value of R1 in Figure 16 so that the input voltage of a hall signal is input in "Hall Input Voltage Range"
including signal amplitude.
In order to detect rotation of a motor, the amplitude of hall signal more than “FG hysteresis voltage” is required. Please
input the hall signal of at least 30mVpp.
○Reducing the Noise of Hall Signal
Hall element may be affected by VCC noise or the like depending on the wiring pattern of board. In this case, place
a capacitor like C1 in Figure 16. In addition, when wiring from the hall element output to IC hall input is long, noise
may be loaded on wiring. In this case, place a capacitor like C2 in Figure 16.
H-
H+
HB
C2
C1
RH
R1
Hall element
Bias current
= HB / (RH+ R1)
Figure 16. Application near of Hall Signal
Equivalent Circuit
1) Hall Input
2) Motor Output
VCC
1kΩ
1kΩ
1kΩ
H+,H-
OUT1
OUT2
1kΩ
GND
3) HB Output
4) FG Output
FG
HB
50kΩ
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BD6981FVM
Safety Measure
1) Reverse Connection Protection Diode
Reverse connection of power results in IC destruction as shown in Figure 17. When reverse connection is possible,
reverse connection protection diode must be added between power supply and VCC.
Reverse power connection
VCC
After reverse connection
destruction prevention
VCC
In normal energization
VCC
Circuit
block
Each
pin
Circuit
block
Each
pin
Circuit
block
Each
pin
GND
GND
GND
Internal circuit impedance high
Large current flows
Thermal destruction
No destruction
amperage small
Figure 17. Flow of Current when Power is Connected Reversely
2) Measure against VCC Voltage Rise by Back Electromotive Force
Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse
connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power
supply.
ON
ON
ON
Phase
switching
ON
Figure 18. VCC Voltage Rise by Back Electromotive Force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place
(A) Capacitor or (B) Zener diode between VCC and GND. It necessary, add both (C).
(A) Capacitor
(B) Zener Diode
ON
ON
ON
ON
(C) Capacitor and Zener Diode
ON
ON
Figure 19. Measure against VCC Voltage Rise
9/14
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BD6981FVM
3) Problem of GND Line PWM Switching
Do not perform PWM switching of GND line because GND potential cannot be kept to a minimum.
VCC
Motor
Driver
Controller
M
GND
PWM input
Prohibited
Figure 20. GND Line PWM Switching Prohibited
4) FG Output
FG output is an open drain and requires pull-up resistor. The IC can be protected by adding resistor R1. An excess of
absolute maximum rating, when FG output pin is directly connected to power supply, could damage the IC.
VCC
Pull-up
resistor
FG
Protection
Resistor R1
Connector
of board
Figure 21. Protection of FG Pin
Thermal Derating Curve
Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja.
Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,
wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured
at a specified condition. Figure 22 shows a thermal derating curve.
Pd(W)
0.7
0.6
0.58
0.5
0.4
0.3
0.2
0.1
0
25
50
75 100 105 125
150
Ta(°C)
*
Reduce by 4.68 mW/°C over 25°C.
(70.0mm x 70.0mm x 1.6mm glass epoxy board)
Figure 22. Thermal Derating Curve
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BD6981FVM
Operational Notes
1.
2.
3.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
5.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD6981FVM
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 23. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD6981FVM
Ordering Information
B D 6 9 8 1 F V M -
GTR
Part Number
Package
FVM: MSOP8
Packaging and forming specification
G: Halogen free
TR: Embossed tape and reel
Marking Diagram
MSOP8
(TOP VIEW)
Ｄ ６ ９
１
８
Lot No.
1PIN MARK
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BD6981FVM
Physical Dimension, Tape and Reel Information
Package Name
MSOP8
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Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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