BD70522GUL_技术文档

Datasheet

Nano Energy^TM

Ultra Low Iq Buck Converter

For Low Power Applications

BD70522GUL

General Description

Key Specifications

The BD70522GUL is a Buck Converter featuring 180nA

quiescent current and supports output current up to

500mA. The Constant ON-Time (COT) control with ULP

(Ultra Low Power) mode provides superior transient

response and extends battery life by providing excellent

light load efficiency below 10µA load range. The output

voltage can be selected from 9 pre-set voltages by VSEL

pins. When the input voltage gets close to the output

voltage, the IC enters 100%ON mode where the

switching operation stops.



Input Voltage Range:

2.5V to 5.5V

1.2V to 3.3V

500mA

180nA (Typ)

50nA (Typ)

Output Voltage Range:

Maximum Output Current:

Operating Quiescent Current:

Standby Current:

Operating Temperature Range:

-40°C to +85°C

Package

VCSP50L1C

W(Typ) x D(Typ) x H(Max)

1.76mm x 1.56mm x 0.57mm

Features



Nano Energy^TM

180nA (Typ) Quiescent Current

Up to 90% Efficiency at 10µA Output Current

Up to 500mA Output Current

9 Selectable Output Voltages

(1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 2.8V, 3.0V, 3.2V, 3.3V)

Power Good Output

100%ON Mode for Low Input Voltage

Discharge Function on VOUT



Applications

 Smoke Detector

 Thermostat

 Portable Devices

 Wearable Devices

 Low-Iq Applications without Standby Switcher

 Energy Harvesting

Typical Application Circuit

L1

2.2μH

VIN

2.5V-5.5V

VOUT

1.2V-3.3V

VIN

LX

COUT

22μF

CIN

10μF

EN

VOUT

VEN

VSEL1

VSEL2

PG

AGND

PGND

VSEL1

VSEL2

VPG

Figure 1. Typical Application Circuit

「Nano Energy^TM」is a trademark of Rohm Co., Ltd.

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Contents

General Description........................................................................................................................................................................1

Features..........................................................................................................................................................................................1

Applications ....................................................................................................................................................................................1

Key Specifications ..........................................................................................................................................................................1

Package..........................................................................................................................................................................................1

Typical Application Circuit...............................................................................................................................................................1

Contents .........................................................................................................................................................................................2

Pin Configuration ............................................................................................................................................................................3

Pin Descriptions..............................................................................................................................................................................3

Block Diagram ................................................................................................................................................................................3

Absolute Maximum Ratings ............................................................................................................................................................4

Thermal Resistance........................................................................................................................................................................4

Recommended Operating Conditions.............................................................................................................................................4

Electrical Characteristics.................................................................................................................................................................4

Electrical Characteristics - continued..............................................................................................................................................5

Detailed Descriptions......................................................................................................................................................................6

Typical Performance Curves...........................................................................................................................................................8

Figure 7-10. Efficiency vs Output Current ...................................................................................................................................8

Figure 11-14. Output Voltage vs Output Current .........................................................................................................................9

Figure 15-18. Switching Frequency vs Output Current .............................................................................................................10

Figure 19-22. Output Ripple Voltage vs Output Current............................................................................................................11

Figure 23-26. Load Transient Response...................................................................................................................................12

Figure 27-30. Line Transient Response ....................................................................................................................................13

Figure 31-34. Line Transient Response ....................................................................................................................................14

Figure 35-36. Startup.................................................................................................................................................................15

Figure 37-38. Shutdown............................................................................................................................................................15

Figure 39-42. Input Voltage Ramp Up/Down.............................................................................................................................16

Timing Chart .................................................................................................................................................................................17

Application Examples ...................................................................................................................................................................18

I/O Equivalence Circuits................................................................................................................................................................19

Operational Notes.........................................................................................................................................................................20

Ordering Information.....................................................................................................................................................................22

Marking Diagram ..........................................................................................................................................................................22

Physical Dimension and Packing Information...............................................................................................................................23

Revision History............................................................................................................................................................................24

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Pin Configuration

1

2

3

PGND

LX

VIN

A

B

C

VOUT

PG

AGND

EN

VSEL2

VSEL1

Top View

Figure 2. Pin Configuration

Pin Descriptions

Pin No.

Pin Name

PGND

LX

Description

A1

Power Ground Pin

A2

Switching Pin. Connect an inductor to this pin.

A3

VIN

Power Supply Input Pin. Connect an input capacitor close to this pin.

Feedback Pin for internal feedback divider network and regulation loop.

This pin is also used for VOUT discharge while EN pin is set to low.

B1

B2

VOUT

AGND

Analog Ground Pin

Enable Pin. This pin must be terminated.

High : Enable

Low : Shutdown

B3

EN

Do not pull up EN terminal higher than VIN voltage.

Power Good Open Drain Output Pin. PG remains low while the VOUT pin voltage

is lower than the threshold voltage. If not used, this pin can be left open.

Do not pull up PG terminal to a voltage which is higher than VIN voltage.

Output Voltage Selection Pins.

C1

C2

C3

PG

These pins have three states :

VSEL2

VSEL1

High = VIN (Connect these pins to VIN directly without pull up resistors)

Low = GND (Connect these pins to GND directly without pull down resistors)

OPEN = No Connection (PCB:C<50pF, R>1Mohm)

The setting of these pins cannot be changed while the IC is operating.

Block Diagram

Ultra Low Power

Reference

VOUT

EN

UVLO

EN

VOUT

Discharge

Soft

Start

Internal

Feedback

Network

VSEL1

VFB

100% ON Mode

Comp

UVLO

Comp

VIN

VSEL2

AGND

VIN

VTH_UVLO

V100TH_REF

Main

Comp

UVLO

Limit

High Side

Main

Ref

Current

Limit Comp

LX

ULP

Comp

Control

Logic

PG

Comp

Zero Cross

Comp

ULP

Ref

Limit

Low Side

VTH_PG

EN

PGND

Current

Limit Comp

Figure 3. Block Diagram

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Absolute Maximum Ratings (Ta=25°C)

Parameter

Symbol

Rating

Unit

Supply Voltage

V_IN

V_LX

-0.3 to +6

-0.3 to V_IN+0.3V

10

V

LX Voltage

EN Voltage

V_EN

V_PG

V_SEL

I_PG

V

PG Voltage

V

VSEL1, 2 Voltage

PG Sink Current

Power Dissipation

Maximum Junction Temperature

Storage Temperature Range

V

mA

Pd

0.592 ^{(Note 1)}

W

°C

Tjmax

Tstg

150

- 55 to + 150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) The derating is 4.74 mW/°C while the device is operating above Ta≧25°C (Mounted on 4-layer 50.0mm x 58.0mm x 1.6mm FR-4 board)

Thermal Resistance

Parameter

Symbol

Thermal Resistance (Typ)

168.8

Unit

VCSP50L1C

Junction to Ambient

θ_JA

°C/W

Layer Number of

Measurement Board

Material

FR-4

Board Size

50.0mm x 58.0mm x 1.6mmt

4 Layers

Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

Supply Voltage^{(Note 2)}

V_IN

I_OUT

L

2.5

-

3.6

-

5.5

500

-

V

Output Current

Inductance^{(Note 3)}

Output Capacitance^{(Note 4)}

mA

µH

µF

°C

-

2.2

22

+25

C_OUT

Topr

10

-40

100

+85

Operating Temperature

(Note 2) Initial startup voltage is over 2.6V (Max)

(Note 3) The effective inductance should be kept in the specified range from 1.5µH to 3.5µH, including the variety of tolerance, temperature, current derating.

(Note 4) The effective capacitance should be kept this specified range including variety of tolerance, temperature, bias voltage derating.

Electrical Characteristics

(Unless otherwise specified V_IN=3.6V Ta=25°C)

Parameter

Circuit Current

Symbol

Min

Typ

Max

Unit

Conditions

Shutdown Current

I_ST

I_Q

-

50

1000

nA

No switching, V_EN= V_IN

V_SEL=V_IN

Include VSEL, EN pin current

Operating Quiescent Current

180

Under Voltage Lockout

UVLO Detection Threshold

UVLO Release Threshold

V_UVLO

2.30

2.40

2.50

2.60

V

V_INfalling

V_INrising

V_UVLORLS

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Electrical Characteristics - continued

(Unless otherwise specified V_IN=3.6V Ta=25°C)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Control

EN High Level

V_ENH

V_ENL

I_EN

1.1

-

0.3

V

EN Low Level

-

EN Input Current

-

V_IN-0.3

-0.3

-

0

-

1

µA

V

VSEL High Level

V_SELH

V_SELL

I_VSEL

V_IN+0.3

+0.3

1

VSEL Low Level

-

V

VSEL Input Current

0

µA

Power Switch

High-side FET On-Resistance

Low-side FET On-Resistance

High-side FET Switch Current Limit 1

Low-side FET Switch Current Limit

High-side FET Switch Current Limit 2

V_OUTDischarge FET On-Resistance

Power Good Output

R_ONH

R_ONL

-

0.30

0.15

1750

970

0.45

0.23

2275

1260

200

Ω

I_LX=50mA

I_LX=-50mA

I_LIMITH1

I_LIMITL

I_LIMITH2

R_DISCH

1225

680

50

mA

Ω

Peak current of inductor

Bottom current of inductor

100%ON Mode

970

100

I_OUT=-10mA

Power Good Detection Threshold

Power Good Hysteresis

PG Low Level Output Voltage

PG Output Off Leak Current

100% ON Mode Transition

100% ON Mode Detection Threshold

100% ON Mode Release Threshold

Output

V_PGTH

V_PGHYS

V_OLPG

I_OFFPG

-

95

-5

-

%

V

V_OUTrising

I_PG=-1mA

-

-0.3

-

0.3

1

0

µA

V_100THM

V_100THP

100

150

200

250

300

350

mV

V_INfalling, V_IN= V_OUT+ V_100THM

V_INrising, V_IN= V_OUT+ V_100THP

Output Voltage Range

V_OUTRG

V_OACC1

V_OACC2

t_SDELAY

t_SS

1.2

-2.0

-2.5

2.5

-

3.3

2.0

V

%

Refer to Table 1

I_OUT=10mA

Output Voltage Accuracy 1

Output Voltage Accuracy 2

Startup Delay Time

0.0

5.0

3.0

2.5

%

I_OUT=100mA

10.0

6.0

ms

Soft-Start Time

1.5

Table 1. Output Voltage Settings ^{(Note 5)}

VSEL1

V_SET

1.2V

1.5V

1.8V

2.0V

2.5V

2.8V

3.0V

3.2V

3.3V

VSEL2

GND

OPEN

GND

V_IN

OPEN

GND

V_IN

OPEN

V_IN

OPEN

V_IN

OPEN

GND

V_IN

(Note 5) The output voltage is only determined by the states of VSEL1 and VSEL2 during the startup delay.

In order to reduce the current consumption, the output voltage cannot be changed by changing the

states of VSEL1 and VSEL2 after the startup delay.

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Detailed Descriptions

1. Constant ON-Time (COT) Control

The COT control topology supports CCM (Continuous Current Mode) for medium and high load conditions and

DCM (Discontinuous Current Mode) for light load conditions.

The ON-Time is set in proportion to the output voltage (V_OUT), and in inverse proportion to power supply voltage

(V_IN). Therefore, when in CCM, even if V_INor V_OUTsettings changes, the IC always operates in a constant frequency

1MHz (Typ) approximately.

If the load current decreases, the IC enters DCM seamlessly to maintain high efficiency down to very light loads,

and the switching frequency varies approximately linearly with the load current.

2. 100%ON Mode

When V_INgets close to V_OUT, the IC stops switching and starts 100% duty cycle operation. It connects the output to

the input via the inductor and the internal high side MOSFET switch, when V_INfalls below the 100%ON Mode Enter

Threshold (V_100THM). And when V_INincreases and exceeds the 100%ON Mode Release Threshold (V_100THP), the IC

starts to switch again.

V_IN

V_OUT

Soft

100%

Start

MODE

250mV(Typ)

V_100THP

V_100THM

200mV(Typ)

V_PGTH

95%(Typ)

VPGHYS

5%(Typ)

V_UVLORLS

2.5V(Typ)

V_UVLO

2.4V(Typ)

t

PG

① : Soft Start End

① : V_IN①V_100THP

① ’① V_IN①V_100THM

① ① ① ’

① ① ①

①

High

Low

t

Figure 4. 100% ON Mode Transition

3. Ultra Low Power (ULP) Mode

2 comparators are used in this IC for monitoring V_OUT.

One is main comparator (Main Comp) and the other is ULP comparator (ULP Comp).

The transition from normal mode to ULP mode is judged pulse by pulse. While the Main Comp or the ULP Comp

detects the decrease in V_OUT, the LX node switches for one pulse, then becomes high impedance.

If the high impedance state lasts over 8μs, the IC transits from normal mode to ULP mode.

In ULP mode, the Main Comp and the Power Good comparator (PG Comp) are disabled to reduce the current

consumption. And when the ULP Comp detects the decrease in V_OUT, the Main Comp and the PG Comp are

enabled, and the IC transits from ULP mode to normal mode.

8us

normal mode

ULP mode

normal mode

ULP mode

normal mode

Main Comp: ON

PG Comp: ON

Main Comp: OFF

PG Comp: OFF

Main Comp: ON

PG Comp: ON

Main Comp: OFF

PG Comp: OFF

Main Comp: ON

PG Comp: ON

Figure 5. Transition between Normal Mode and ULP Mode

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4. On-Time Extension

The On-Time is extended automatically to get the best transient response in the case of high duty cycle operation.

If the Main Comp Output does not return to high level within Constant On-Time, the On-Time is extended until the

Main Comp Output returns to high, and the maximum On-Time is limited to 16μs.

FB

+

Ramp

Compensator

VREF

Main Comp

Output

On-Time Extension

with delay

LX

Constant

On-Time

shot

IL

Figure 6. On-Time Extension

5. Discharge for VOUT

VOUT pin has a MOSFET for discharge which connects VOUT pin to GND when the IC is in standby state.

(EN=Low or UVLO state or TSD state)

6.

Power Good (PG) Output

PG pin is an open-drain output.

The PG Comp is active when EN pin is set to high and V_INis above the threshold V_UVLORLS

PG pin remains low when the V_OUTis lower than the PG detection threshold (V_PGTH) or during the soft-start time.

PG pin goes to high impedance when V_OUTexceeds V_PGTH

And it is pulled to low level once V_OUTfalls below the PG release threshold (V_PGTH-V_PGHYS).

.

7. Under Voltage Lock Out (UVLO)

UVLO function prevents the malfunction of the internal circuit when V_INis too low.

If V_INfalls lower than 2.4V (Typ), the IC turns off.

In order to prevent from the misdetection of UVLO, it is necessary to set V_INhigher than 2.5V (Typ).

8.

Over Current Limit (OCL)

BD70522GUL employs a bottom inductor current limit function which is achieved by using the low side MOSFET.

Turning on the high side MOSFET is prohibited while the inductor current is higher than the low side OCL (I_LIMITL).

This function keeps the inductor peak current lower than the sum of I_LIMITLand the inductor ripple current.

However, the low side OCL function does not work if the VOUT pin is directly shorted to GND. Thus, a high side

OCL is implemented for such case. The high side MOSFET turns off when the inductor current exceeds the high

side OCL (I_LIMITH1). Furthermore, the peak current is limited to I_LIMITH1×0.67 under the On-Time extension state.

The inductor current is also limited to I_LIMITH2under 100%ON mode, and the high side MOSFET is used to sense the

current in this case.

9.

Thermal Shutdown (TSD)

BD70522GUL stops the switching operation when the device temperature exceeds the TSD detection threshold

130°C (Typ) for protecting the IC from overheat. After the device temperature falls below the TSD release threshold

115°C (Typ), the IC starts the soft-start operation and recovers to the normal operation.

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Typical Performance Curves

(Unless otherwise specified Ta=25°C)

95.0

90.0

85.0

80.0

75.0

70.0

65.0

60.0

55.0

50.0

45.0

95.0

90.0

85.0

80.0

75.0

70.0

65.0

60.0

55.0

50.0

45.0

VIN=2.6V

VIN=3.6V

VIN=4.2V

VIN=5.0V

VIN=5.5V

VIN=2.6V

VIN=3.6V

VIN=4.2V

VIN=5.0V

VIN=5.5V

0.001

0.01

0.1

1

10

100

1000

0.001

0.01

0.1

1

10

100

1000

OutputCurrent: I_OUT[mA]

Figure 7. Efficiency vs Output Current

(V_OUT=1.2V)

Figure 8. Efficiency vs Output Current

(V_OUT=1.8V)

100.0

95.0

90.0

85.0

80.0

75.0

70.0

65.0

60.0

55.0

50.0

100.0

95.0

90.0

85.0

80.0

75.0

70.0

65.0

60.0

55.0

50.0

VIN=2.8V

VIN=3.6V

VIN=4.2V

VIN=5.0V

VIN=5.5V

VIN=4.2V

VIN=5.0V

VIN=5.5V

0.001

0.01

0.1

1

10

100

1000

0.001

0.01

0.1

1

10

100

1000

OutputCurrent: I_OUT[mA]

Figure 9. Efficiency vs Output Current

(V_OUT=2.5V)

Figure 10. Efficiency vs Output Current

(V_OUT=3.3V)

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Typical Performance Curves - continued

(Unless otherwise specified Ta=25°C)

1.236

1.224

1.212

1.200

1.188

1.176

1.164

1.854

1.836

1.818

1.800

1.782

1.764

1.746

VIN=2.6V

VIN=3.6V

VIN=4.2V

VIN=5.0V

VIN=5.5V

VIN=2.6V

VIN=3.6V

VIN=4.2V

VIN=5.0V

VIN=5.5V

0.001

0.01

0.1

1

10

100

1000

0.001

0.01

0.1

1

10

100

1000

OutputCurrent: I_OUT[mA]

Figure 11. Output Voltage vs Output Current

(Load Regulation, V_OUT=1.2V)

Figure 12. Output Voltage vs Output Current

(Load Regulation, V_OUT=1.8V)

2.575

3.399

2.550

2.525

2.500

2.475

2.450

2.425

3.366

3.333

3.300

3.267

3.234

3.201

VIN=2.8V

VIN=3.6V

VIN=4.2V

VIN=5.0V

VIN=5.5V

VIN=3.6V

VIN=4.2V

VIN=5.0V

VIN=5.5V

0.001

0.01

0.1

1

10

100

1000

0.001

0.01

0.1

1

10

100

1000

OutputCurrent: I_OUT[mA]

Figure 13. Output Voltage vs Output Current

(Load Regulation, V_OUT=2.5V)

Figure 14. Output Voltage vs Output Current

(Load Regulation, V_OUT=3.3V)

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Typical Performance Curves - continued

(Unless otherwise specified Ta=25°C)

1200

1100

1000

900

800

700

600

500

400

300

200

100

0

1200

1100

1000

900

800

700

600

500

400

300

200

100

0

VIN=2.6V

VIN=3.6V

VIN=5.5V

VIN=2.6V

VIN=3.6V

VIN=5.5V

0

100

200

300

400

500

0

100

200

300

400

500

OutputCurrent: I_OUT[mA]

Figure 15. Switching Frequency vs Output Current

(V_OUT=1.2V)

Figure 16. Switching Frequency vs Output Current

(V_OUT=1.8V)

1200

1100

1000

900

800

700

600

500

400

300

1200

1100

1000

900

800

700

600

500

400

300

200

VIN=2.8V

VIN=3.6V

VIN=5.5V

400

100

0

VIN=3.6V

VIN=5.5V

100

0

100

200

300

400

500

0

100

200

300

500

OutputCurrent: I_OUT[mA]

Figure 17. Switching Frequency vs Output Current

(V_OUT=2.5V)

Figure 18. Switching Frequency vs Output Current

(V_OUT=3.3V)

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Typical Performance Curves - continued

(Unless otherwise specified Ta=25°C)

50.0

45.0

40.0

35.0

30.0

25.0

20.0

15.0

10.0

5.0

50.0

45.0

40.0

35.0

30.0

25.0

20.0

15.0

10.0

5.0

VIN=2.6V

VIN=3.6V

VIN=5.5V

VIN=2.6V

VIN=3.6V

VIN=5.5V

0.0

0

100

200

300

400

500

0

100

200

300

400

500

OutputCurrent: I_OUT[mA]

Figure 19. Output Ripple Voltage vs Output Current

(Peak to Peak Output Ripple Voltage, V_OUT=1.2V)

Figure 20. Output Ripple Voltage vs Output Current

(Peak to Peak Output Ripple Voltage, V_OUT=1.8V)

50.0

50

VIN=2.8V

VIN=3.6V

45.0

45

40

VIN=5.5V

40.0

35.0

30.0

25.0

20.0

15.0

10.0

5.0

35

30

25

20

15

10

5

0.0

0

100

200

300

400

500

0

100

200

300

400

500

OutputCurrent: I_OUT[mA]

Figure 21. Output Ripple Voltage vs Output Current

(Peak to Peak Output Ripple Voltage, V_OUT=2.5V)

Figure 22. Output Ripple Voltage vs Output Current

(Peak to Peak Output Ripple Voltage, V_OUT=3.3V)

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Typical Performance Curves - continued

(Unless otherwise specified Ta=25°C)

Droop=137.5mV

Overshoot=66.9mV

Droop=113.9mV

Overshoot=65.1mV

V_OUT

I_OUT

Figure 23. Load Transient Response

Figure 24. Load Transient Response

(V_IN=3.6V, V_OUT=1.2V, I_OUT=1uA⇔500mA, t_r=t_f=1μs)

(V_IN=3.6V, V_OUT=1.8V, I_OUT=1uA⇔500mA, t_r=t_f=1μs)

Droop=174.9mV

Overshoot=85.6mV

Droop=260.2mV

Overshoot=88.1mV

V_OUT

I_OUT

Figure 25. Load Transient Response

Figure 26. Load Transient Response

(V_IN=3.6V, V_OUT=2.5V, I_OUT=1uA⇔500mA, t_r=t_f=1μs)

(V_IN=3.6V, V_OUT=3.3V, I_OUT=1uA⇔500mA, t_r=t_f=1μs)

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Typical Performance Curves - continued

(Unless otherwise specified Ta=25°C)

V_IN

Droop=30.4mV

Overshoot=29.6mV

Droop=22.0mV

Overshoot=22.8mV

V_OUT

Figure 27. Line Transient Response

Figure 28. Line Transient Response

(V_IN=2.6V⇔5.5V, t_r=t_f=48μs, V_OUT=1.2V, I_OUT=1mA)

(V_IN=2.6V⇔5.5V, t_r=t_f=48μs, V_OUT=1.2V, I_OUT=500mA)

V_IN

Droop=32.8mV

Overshoot=30.4mV

Droop=18.8mV

Overshoot=20.0mV

V_OUT

Figure 29. Line Transient Response

Figure 30. Line Transient Response

(V_IN=2.6V⇔5.5V, t_r=t_f=48μs, V_OUT=1.8V, I_OUT=1mA)

(V_IN=2.6V⇔5.5V, t_r=t_f=48μs, V_OUT=1.8V, I_OUT=500mA)

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Typical Performance Curves - continued

(Unless otherwise specified Ta=25°C)

Droop=54.0mV

Overshoot=48.4mV

V_IN

Droop=20.0mV

Overshoot=28.0mV

V_OUT

Figure 31. Line Transient Response

Figure 32. Line Transient Response

(V_IN=2.8V⇔5.5V, t_r=t_f=45μs, V_OUT=2.5V, I_OUT=1mA)

(V_IN=2.8V⇔5.5V, t_r=t_f=45μs, V_OUT=2.5V, I_OUT=500mA)

Droop=50.8mV

V_IN

Droop=24.4mV

Overshoot=30.4mV

Overshoot=48.4mV

V_OUT

Figure 33. Line Transient Response

Figure 34. Line Transient Response

(V_IN=3.7V⇔5.5V, t_r=t_f=30μs, V_OUT=3.3V, I_OUT=1mA)

(V_IN=3.7V⇔5.5V, t_r=t_f=30μs, V_OUT=3.3V, I_OUT=500mA)

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Typical Performance Curves - continued

(Unless otherwise specified Ta=25°C)

V_EN

V_LX

V_PG

V_EN

V_LX

V_PG

t_SDELAY=4.50ms

t_SS=2.54ms

t_SDELAY=4.51ms

t_SS=2.57ms

V_OUT

Figure 35. Startup

(V_IN=3.6V, V_OUT=2.5V, I_OUT=0mA, EN=0→V_IN)

Figure 36. Startup

(V_IN=3.6V, V_OUT=2.5V, I_OUT=500mA, EN=0→V_IN)

V_EN

V_OUT

t_SD=134.2us

t_SD=2.45ms

(50%EN→20%V_OUT

)

(50%EN→20%V_OUT

)

Figure 37. Shutdown

(V_IN=3.6V, V_OUT=2.5V, I_OUT=0mA, EN=V_IN→0)

Figure 38. Shutdown

(V_IN=3.6V, V_OUT=2.5V, I_OUT=500mA, EN=V_IN→0)

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Typical Performance Curves - continued

(Unless otherwise specified Ta=25°C)

V_PG

V_IN

V_PG

V_IN

V_OUT

V_LX

Figure 39. Input Voltage Ramp Up/Down

Figure 40. Input Voltage Ramp Up/Down

(V_IN=0V⇔5.0 V, V_OUT=1.2V, I_OUT=500mA, PG=VOUT)

(V_IN=0V⇔5.0V, V_OUT=1.8V, I_OUT=500mA, PG=VOUT)

V_PG

V_IN

V_PG

V_IN

100%ON Mode

Operation

100%ON Mode

Operation

V_OUT

V_LX

Figure 41. Input Voltage Ramp Up/Down

Figure 42. Input Voltage Ramp Up/Down

(V_IN=0V⇔5.0V, V_OUT=2.5V, I_OUT=500mA, PG=VOUT)

(V_IN=0V⇔5.0V, V_OUT=3.3V, I_OUT=500mA, PG=VOUT)

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Timing Chart

After BD70522GUL is enabled, the internal reference voltage is booted up.

When the startup delay time t_SDELAYhas expired, the switching is started by the soft-start operation, and the output

voltage is ramped up to the set voltage (VOUTSET) which is determined by the states of VSEL1 and VSEL2 during the

startup delay in normal operation.

V

EN

LX

V

OUTSET

VOUT

tSDELAY

tSS

Figure 43. Timing Chart

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Application Examples

L1

V_IN

2.2μH

V_OUT

VIN

LX

VOUT

PG

C_OUT

C_IN

EN

10μF

22μF

V_EN

VSEL1

VSEL2

V_PG

AGND

PGND

Figure 44. Application Example (V_OUT=1.2V)

L1

V_IN

2.2μH

V_OUT

VIN

LX

VOUT

PG

C_OUT

C_IN

EN

10μF

22μF

V_EN

VSEL1

VSEL2

V_PG

AGND

PGND

Figure 45. Application Example (V_OUT=1.8V)

L1

V_IN

2.2μH

V_OUT

VIN

LX

VOUT

PG

C_OUT

C_IN

EN

10μF

22μF

V_EN

VSEL1

VSEL2

V_PG

AGND

PGND

Figure 46. Application Example (V_OUT=2.5V)

L1

V_IN

2.2μH

V_OUT

VIN

LX

VOUT

PG

C_OUT

C_IN

EN

10μF

22μF

V_EN

VSEL1

VSEL2

V_PG

AGND

PGND

Figure 47. Application Example (V_OUT=3.3V)

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I/O Equivalence Circuits

A1: PGND, A2: LX, A3: VIN, B2: AGND

B1: VOUT

VIN

VOUT

LX

PGND

AGND

B3: EN

C1: PG

VIN

EN

VIN

PG

C2: VSEL2, C3: VSEL1

VIN

VSEL2, VSEL1

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure xx. Example of monolithic IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all

within the Area of Safe Operation (ASO).

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

16. Disturbance Light

In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics

may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures

that will prevent the chip from being exposed to light.

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Ordering Information

B D 7 0 5 2 2 G U L - E 2

Part Number

Package

Packaging and forming specification

E2: Embossed tape and reel

GUL: VCSP50L1C

Marking Diagram

VCSP50L1C (TOP VIEW)

1PIN MARK

Part Number Marking

LOT Number

0 5 2 2

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Physical Dimension and Packing Information

Package Name

VCSP50L1C

< Tape and Reel Information >

Tape

Embossed carrier tape

Quantity

3,000pcs/Reel

E2

Direction of feed

The direction is the pin 1 of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

1234

Direction of feed

1pin

Reel

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Revision History

Date

Revision

001

Changes

10.Aug.2017

New Release

Corrected the limits of “I_LIMITL” and “I_LIMITH2” in Electrical Characteristics.

Improved the description of OCL.

21.Aug.2017

002

Improved Figure 5, Marking Diagram.

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD70522GUL
厂家：	ROHM
描述：	BD70522GUL是一个降压转换器，具有180nA静态电流，支持高达500mA的输出电流。ULP（超低功率）模式的恒定开启时间（COT）控制提供了卓越的瞬态响应，并通过在10μA负载范围内提供卓越的轻载效率延长了电池寿命。输出电压可以通过VSEL引脚从9个预设电压中选择。当输入电压接近输出电压时，集成电路进入100%接通模式，开关操作停止。日本碍子株式会社的芯片型陶瓷二次电池“EnerCera®”与ROHM电源IC的超低静态电流技术“Nano Energy™”相结合，助力实现免维护物联网设备，构建超高效蓄电单元。EnerCera® × Nano Energy™ Collaboration Page 电池开关转换器
文件：	总27页 (文件大小：2651K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD70522GUL [ROHM]

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