BD7281YG-C (新产品) [ROHM]
BD7281YG-C是一款输入输出轨到轨单电路CMOS运算放大器。具有高压摆率、低噪声和低输入偏置电流等特点，因此可用于引擎控制单元、EPS、ABS和传感器放大器等各类车载应用。另外，电路采用了即使输出电容为1nF也不会振荡的电路形式，因此在设计应用产品时无需担心输出电容引起的振荡。什么是Nano Cap™?Nano Cap™是ROHM自有的一种电源技术，利用该技术，即使输出电容低至nF级也能进行稳定控制。;
| 型号： | BD7281YG-C (新产品) |
| 厂家： | 
ROHM |
| 描述： | BD7281YG-C是一款输入输出轨到轨单电路CMOS运算放大器。具有高压摆率、低噪声和低输入偏置电流等特点，因此可用于引擎控制单元、EPS、ABS和传感器放大器等各类车载应用。另外，电路采用了即使输出电容为1nF也不会振荡的电路形式，因此在设计应用产品时无需担心输出电容引起的振荡。什么是Nano Cap™?Nano Cap™是ROHM自有的一种电源技术，利用该技术，即使输出电容低至nF级也能进行稳定控制。 放大器 高压 运算放大器 传感器 |
| 文件： | 总27页 (文件大小：1841K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Nano CapTM
Datasheet
Operational Amplifier
Automotive Low Noise & Rail-to-Rail
Input/Output High Speed CMOS Operational
Amplifiers
BD728xY-C Series
General Description
Key Specifications
This product are Rail-to-Rail Input/Output CMOS
operational amplifiers. These feature high slew rate, low
noise and low input bias current. It is suitable for
automotive requirements such as engine control unit,
electric power steering, anti-lock braking system, sensor
amplifier, and so on.
◼ Input Offset Voltage:
◼ Slew Rate:
◼ Input-referred Noise Voltage Density
f = 1 kHz:
2 mV (Max)
10 V/μs (Typ)
12 nV/√Hz (Typ)
◼ Common-mode Input Voltage Range:
VSS to VDD
Furthermore, this circuit type does not oscillate even with
a capacitance of 1 nF. Set design is possible without
worrying about oscillation due to output capacitance.
◼ Input Bias Current:
◼ Operating Supply Voltage Range
Single Supply:
0.5 pA (Typ)
2.5 V to 5.5 V
Dual Supply:
◼ Operating Temperature Range:
±1.25 V to ±2.75 V
-40 °C to +125 °C
Features
◼ Nano Cap™ Integrated OPAMP
◼ AEC-Q100 Qualified(Note 1)
◼ Low Input-referred Noise Voltage Density
◼ Rail-to-Rail Input/Output
Package
SSOP5
W (Typ) x D (Typ) x H (Max)
2.9 mm x 2.8 mm x 1.25 mm
2.9 mm x 2.8 mm x 1.25 mm
◼ Shutdown Function (BD7280YG-C)
(Note 1) Grade 1
SSOP6
Applications
◼ Engine Control Unit
◼ Electric Power Steering (EPS)
◼ Anti-lock Braking System (ABS)
◼ Automotive Electronics
◼ Sensor Amplifiers
◼ Battery-powered Equipment
◼ Current Monitoring Amplifier
◼ ADC Front Ends, Buffer Amplifier
◼ Photodiode Amplifier
SSOP5
SSOP6
◼ Amplifiers
Typical Application Circuit
RF = 10 kΩ
VDD = +2.5 V
RIN = 100 Ω
푅퐹
VIN
VOUT
푉푂푈푇 = −
푉
퐼푁
푅퐼푁
VSS = -2.5 V
Nano Cap™ is a trademark or a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Pin Configuration
BD7280YG-C (SSOP6)
(TOP VIEW)
Pin No.
1
Pin Name
OUT
Function
1
6
5
4
OUT
VSS
+IN
VDD
Output
(Shutdown mode : Hi-Z)
2
3
4
VSS
+IN
-IN
Negative power supply / Ground
Non-inverting input
Inverting input
2
3
SDNB
-IN
-
+
Shutdown setting
(VSDNB = H : Active mode /
VSDNB = L or OPEN : Shutdown mode)
5
6
SDNB
VDD
Positive power supply
BD7281YG-C (SSOP5)
(TOP VIEW)
1
5
OUT
VSS
+IN
VDD
Pin No.
Pin Name
OUT
VSS
Function
Output
1
2
3
4
5
2
3
Negative power supply / Ground
Non-inverting input
Inverting input
-
+
+IN
-IN
4
-IN
VDD
Positive power supply
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BD728xY-C Series
Block Diagram
BD7280YG-C
VDD
Iref
+IN
+
OUT
AMP
-
-IN
SDNB
VSS
BD7281YG-C
VDD
Iref
+IN
-IN
+
OUT
AMP
-
VSS
Description of Blocks
1. AMP:
This block is a full-swing output operational amplifier with class-AB output circuit and high-precision-Rail-to-Rail
differential input stage.
2. Iref:
This block supplies reference current which is needed to operate AMP block.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage (VDD - VSS
)
VS
VI
7.0
V
V
Input Pin Voltage (+IN, -IN, SDNB)
Input Pin Current (+IN, -IN, SDNB)
Maximum Junction Temperature
Storage Temperature Range
(VSS - 0.3) to (VSS + 7.0)
II
±10
150
mA
°C
°C
Tjmax
Tstg
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operate over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
SSOP5
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
376.5
40
185.4
30
°C/W
°C/W
ΨJT
SSOP6
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
376.5
40
185.4
30
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter
Symbol
Min
2.5
Typ
5.0
Max
5.5
Unit
Single Supply
Dual Supply
Supply Voltage (VDD - VSS
)
VS
V
±1.25
-40
±2.50
+25
±2.75
+125
Operating Temperature
Topr
°C
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Function Explanation
1. Nano Cap™
Nano Cap™ is a combination of technologies which allow stable operation even if output capacitance is connected with
the range of nF unit. This circuit type does not oscillate even with a capacitance of 1 nF. Set design is possible without
worrying about oscillation due to output capacitance.
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Electrical Characteristics
(Unless otherwise specified VS = 5 V, VSS = 0 V, VICM = 2.5 V, RL = 10 kΩ to VICM, VSDNB = VDD, Ta = 25 °C)
Limit
Parameter
Symbol
Unit
Conditions
Min
-
Typ
Max
0.01
1.60
No load, Absolute value
Input Offset Voltage
VIO
mV
No load, Absolute value,
Ta = -40 °C to +125 °C
-
-
-
2
Input Offset Voltage
Temperature Drift
No load, Absolute value,
Ta = -40 °C to +125 °C
ΔVIO/ΔT
0.1
4.0
μV/°C
Input Offset Current
Input Bias Current
IIO
IB
-
-
0
0.5
-
-
-
pA
pA
V
Absolute value
Absolute value
VSS to VDD
Common-mode Input Voltage
Range
VICMR
0
-
5
1.7
-
2.6
2.8
No load, G = 0 dB
Supply Current
IDD
VOH
VOL
mA
mV
mV
No load, G = 0 dB,
Ta = -40 °C to +125 °C
-
-
10
30
VOH = VDD - VOUT
Output Voltage High
Output Voltage Low
VOH = VDD - VOUT
Ta = -40 °C to +125 °C
-
-
-
10
-
50
30
50
-
-
-
Ta = -40 °C to +125 °C
Output Source Current (Note 1)
Output Sink Current (Note 1)
IOH
IOL
25
25
95
75
-
50
50
115
-
mA
mA
VOUT = VSS, Absolute value
-
VOUT = VDD, Absolute value
-
-
Large Signal Voltage Gain
AV
dB
-
Ta = -40 °C to +125 °C
Gain Bandwidth Product
Phase Margin
GBW
θ
7
-
MHz
deg
dB
G = 40 dB, CL = 25 pF
-
65
100
100
10
-
-
G = 40 dB, CL = 25 pF
Common-mode Rejection Ratio CMRR
65
65
-
-
-
Power Supply Rejection Ratio
Slew Rate
PSRR
SR
-
dB
-
-
CL = 100 pF
V/μs
CL = 100 pF,
Ta = -40 °C to +125 °C
5
-
Input-referred Noise Voltage
Density
Vn
-
12
0.001
-
nV/√Hz f = 1 kHz
Total Harmonic Distortion +
Noise
THD+N
-
-
%
VOUT = 4 Vp-p, f = 1 kHz
(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited
continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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Electrical Characteristics - continued
(Unless otherwise specified VS = 5 V, VSS = 0 V, VICM = 2.5 V, RL = 10 kΩ to VICM, VSDNB = VDD, Ta = 25 °C)
Limit
Parameter
Symbol
Unit
Conditions
Min
-
Typ
0.1
Max
1.5
Shutdown Current
IDD_SD
μA
μA
VSDNB = VSS
VSDNB = VDD
SDNB Input Current High
ISDNB_H
-
50
100
SDNB Input Current Low
Turn On Time
ISDNB_L
tON
-
-
-
0
9
-
-
-
μA
μs
μs
VSDNB = VSS
-
-
Turn Off Time
tOFF
0.8
Input Voltage High (Note 1,2)
Output Voltage Low (Note 1,3)
VH
2.5
-
5.0
V
-
VL
0.0
-
0.7
V
-
(Note 1) When the SDNB is not connected, the terminal is pull down to VSS by the IC internal circuit, it will be in the shutdown state.
(Note 2) SDNB input voltage that activates the IC.
(Note 3) SDNB input voltage that shutdown the IC.
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Typical Performance Curves
VSS = 0 V
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0
2.5
2.0
1.5
Ta = +125 °C
VS = 5.5 V
VS = 5.0 V
VS = 2.5 V
Ta = +25 °C
Ta = -40 °C
1.0
0.5
0.0
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient Temperature
20
16
12
8
20
16
12
8
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
4
4
0
0
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Ambient Temperature: Ta [°C]
Supply Voltage: VS [V]
Figure 3. Output Voltage High vs Supply Voltage
(RL = 10 kΩ)
Figure 4. Output Voltage High vs Ambient Temperature
(VS = 5 V, RL = 10 kΩ)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
20
16
12
8
20
16
Ta = +125 °C
12
Ta = +25 °C
8
Ta = -40 °C
4
4
0
0
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Ambient Temperature: Ta [°C]
Supply Voltage: VS [V]
Figure 5. Output Voltage Low vs Supply Voltage
(RL = 10 kΩ)
Figure 6. Output Voltage Low vs Ambient Temperature
(VS = 5 V, RL = 10 kΩ)
80
70
60
80
70
Ta = -40 °C
60
Ta = -40 °C
50
50
Ta = +25 °C
40
40
Ta = +25 °C
Ta = +125 °C
30
30
Ta = +125 °C
20
10
0
20
10
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
Figure 7. Output Source Current vs Output Voltage
(VS = 5 V)
Figure 8. Output Sink Current vs Output Voltage
(VS = 5 V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
500
400
300
200
100
0
500
400
300
VS = 5.5 V
200
Ta = +125 °C
VS = 5.0 V
100
0
Ta = +25 °C
Ta = -40 °C
-100
-200
-300
-400
-500
-100
-200
-300
-400
-500
VS = 2.5 V
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 9. Input Offset Voltage vs Supply Voltage
Figure 10. Input Offset Voltage vs Ambient Temperature
5.0
150
140
Ta = -40 °C
4.0
3.0
Ta = +25 °C
130
2.0
1.0
0.0
Ta = +125 °C
120
110
Ta = +125 °C
-1.0
Ta = +25 °C
Ta = -40 °C
-2.0
-3.0
-4.0
-5.0
100
90
80
2
3
4
5
6
-1
0
1
2
3
4
5
6
Supply Voltage: VS [V]
Common-mode Input Voltage: VICM [V]
Figure 11. Input Offset Voltage vs Common-mode Input
Figure 12. Large Signal Voltage Gain vs Supply Voltage
(RL = 10 kΩ)
Voltage
(VS = 5 V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
150
140
160
140
120
100
80
Ta = +125 °C
130
Ta = +25 °C
VS = 5.5 V
VS = 5.0 V
120
Ta = -40 °C
110
60
VS = 2.5 V
100
40
90
80
20
0
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Ambient Temperature: Ta [°C]
Supply Voltage: VS [V]
Figure 13. Large Signal Voltage Gain vs Ambient
Temperature
Figure 14. Common-mode Rejection Ratio vs Supply Voltage
160
140
200
180
160
140
120
100
80
VS = 5.5 V
120
VS = 5.0 V
100
80
VS = 2.5 V
60
40
20
0
60
40
20
0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [°C]
Ambient Temperature: Ta [°C]
Figure 15. Common-mode Rejection Ratio vs Ambient
Temperature
Figure 16. Power Supply Rejection Ratio vs Ambient
Temperature
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
1500
1200
900
600
300
0
40
35
30
25
20
15
10
5
0
10
100
1000
10000
100000
-50 -25
0
25
50
75 100 125 150
Frequency: f [Hz]
Ambient Temperature: Ta [°C]
Figure 17. Input Bias Current vs Ambient Temperature
(VS = 5 V)
Figure 18. Input-referred Noise Voltage Density vs
Frequency
(VS = 5 V)
25
25
20
15
10
5
Fall
20
Fall
15
10
Rise
Rise
5
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [°C]
Supply Voltage: VS [V]
Figure 19. Slew Rate vs Supply Voltage
Figure 20. Slew Rate vs Ambient Temperature
(VS = 5 V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
12
11
10
9
90
80
70
60
50
40
30
20
10
0
8
VS = 2.5 V
VS = 5.5 V
7
6
VS = 5.0 V
5
4
3
-50 -25
0
25
50
75 100 125 150
10
100
1000
Ambient Temperature: Ta [°C]
Load Capacitance: CL [pF]
Figure 21. Gain Bandwidth Product vs Ambient Temperature
Figure 22. Phase Margin vs Load Capacitance
(VS = 5 V, RF = 10 kΩ, G = 40 dB)
80
180
135
90
Phase
Input
60
40
Gain
Output
20
45
0
100
1k
10k
100k
1M
10M 100M
Time [1 μs/div]
Frequency: f [Hz]
Figure 23. Voltage Gain, Phase vs Frequency
(VS = 5 V)
Figure 24. Large-Signal Step Response
(VS = 5 V, G = 0 dB, RL = 10 kΩ, CL = 100 pF)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
20
16
12
8
2.0
1.6
1.2
0.8
0.4
0.0
4
0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temparature: Ta [°C]
Ambient Temperature: Ta [°C]
Figure 25. Turn On Time vs Temperature
(VS = 5 V)
Figure 26. Turn Off Time vs Temperature
(VS = 5 V)
0.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VS = 5.5 V
0.4
0.3
0.2
0.1
0.0
VS = 5.0 V
VS = 2.5 V
-50 -25
0
25
50
75 100 125 150
0.5
1.0
1.5
2.0
SDNB Voltage: VSDNB [V]
Ambient Temperature: Ta [°C]
Figure 27. Shutdown Current vs Temperature
(VS = 5 V)
Figure 28. Output Voltage vs SDNB Voltage
(VICM = VS/2, G = 0 dB)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
3.0
2.0
1.0
0.0
0
1
2
3
4
5
SDNB Voltage: VSDNB [V]
Figure 29. Supply Current vs SDNB Voltage
(VS = 5 V, VICM = 2.5V, G = 0 dB)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Application Examples
○Voltage Follower
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage due to high input impedance
and low output impedance. Computation for output
voltage is shown below.
VDD
VOUT
푉푂푈푇 = 푉
퐼푁
VIN
VSS
Figure 30. Voltage Follower Circuit
○Inverting Amplifier
RF
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain which depends on the ratio of RIN and RF,
and then it outputs phase-inverted voltage. The output
voltage is shown in the next expression.
VDD
RIN
VIN
푅퐹
VOUT
푉푂푈푇 = −
푉
퐼푁
푅퐼푁
This circuit has input impedance equal to RIN.
VSS
Figure 31. Inverting Amplifier Circuit
○Non-inverting Amplifier
RIN
RF
For non-inverting amplifier, input voltage (VIN) is amplified
by a voltage gain, which depends on the ratio of RIN and
RF. The output voltage (VOUT) is in-phase with the input
voltage and is shown in the next expression.
VDD
푅퐹
푉푂푈푇 = (1 +
) 푉
퐼푁
VOUT
푅퐼푁
VIN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
VSS
Figure 32. Non-inverting Amplifier Circuit
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BD728xY-C Series
I/O Equivalence Circuits
○BD7280YG-C
Pin No.
Pin Name
Pin Description
Equivalence Circuit
6
1
OUT
Output
1
2
3
4
+IN
-IN
3, 4
Input
2
5
5
SDNB
Shutdown Input
100 kΩ (Typ)
2
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BD728xY-C Series
I/O Equivalence Circuits– continued
○BD7281YG-C
Pin No.
Pin Name
Pin Description
Equivalence Circuit
5
1
OUT
Output
1
2
3
4
+IN
-IN
3, 4
Input
2
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BD728xY-C Series
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD728xY-C Series
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 33. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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BD728xY-C Series
Ordering Information
B D 7 2 8 x Y G
-
C T R
Product Rank
Package
G: SSOP5, SSOP6
Part Number
0: Single Op-Amp with Shutdown
function
C: for Automotive applications
Packaging and forming specification
TR: Embossed tape and reel
1: Single Op-Amp
Lineup
Orderable Part
Number
Number of Channels
Package
Single (Shutdown function)
Single
SSOP6
SSOP5
Reel of 3000
Reel of 3000
BD7280YG-CTR
BD7281YG-CTR
Marking Diagram
SSOP5 (TOP VIEW)
SSOP6 (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
Pin 1 Mark
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BD728xY-C Series
Physical Dimension and Packing Information
Package Name
SSOP5
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BD728xY-C Series
Physical Dimension and Packing Information - continued
Package Name
SSOP6
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29.Nov.2022 Rev.002
© 2022 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BD728xY-C Series
Revision History
Date
Revision
001
Changes
08.Apr.2022
29.Nov.2022
New Release
Add Lineup
002
Change limit notation, etc.
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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