BD7602GUL [ROHM]

BD7602GUL是用于向移动设备的近距离无线通信LSI提供电源的LSI。&通过对应sup2;总线协议的2线串行接口进行各LDO的输出控制。将近距离无线通信LSI所需的电源整合在1chip中，实现省空间。;


型号：	BD7602GUL
厂家：	ROHM
描述：	BD7602GUL是用于向移动设备的近距离无线通信LSI提供电源的LSI。&通过对应sup2;总线协议的2线串行接口进行各LDO的输出控制。将近距离无线通信LSI所需的电源整合在1chip中，实现省空间。通信无线
文件：	总25页 (文件大小：1188K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Power Management IC for Cell phone・Smart Phone

Power Management IC for Near Field

Communication LSI

BD7602GUL

Summary

BD7602GUL is a Power Management IC for mobile

Key Parameters

 Input voltage range ：

 Output voltage(LDO1)：

 Output voltage range(LDO2)：

 Output current(LDO1)：

 Output current(LDO2)：

 VBAT operating current：

 Operating temperature range：

2.7V ～ 5.5V

3.0V(Typ)

2.8V ～ 3.3V

100mA(Max)

150mA(Max)

10μA (Typ)

device with NFC IC.

Each LDO output is controlled by 2 line serial interface

which supports I2C Bus protocol.

This helps to save space to integrate all PMIC for NFC

IC.

-35°C ～ +85°C

Features

Low current consumption 10µA (Typ)



PACKAGE

VCSP50L1C

W (Typ) x D (Typ) x H (Max)

1.60mm x 1.60mm x 0.57mm



2 Channel LDO

2.7V UVLO detection

1 Channel GPO

Thermal Shut Down function

2 line serial interface which supports I2C bus

protocol.

USE

 Smart Phones

 Cell Phones

 Mobile device which has NFC IC

VCSP50L1C

Application Schematic

1μF

VBAT

Voltage

Detect

(2.7V)

VOUT1

VOUT2

REFC

LDO1

3.0V

100mA

4.7uF

TSD

LDO2

2.8V～3.3V

150mA

VREF

(IC Internal

Power）

DPREF

DVDD

0.1μF

2.2KΩ

SCL

SDA

I2C

SLAVE

GPO

GND

Figure 1. Application schematic.

○Product structure : Silicon monolithic integrated circuit. ○This product has no designed protection against radioactive rays.

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Pinout Diagram

VOUT1

VBAT

VOUT2

REFC

GND

SCL

SDA

DVDD

VOUT2

GND

GPO

SCL

DVDD

GPO

REFC

SDA

VOUT1

VBAT

Bottom View

Top View

Figure 2. Pinout Diagram

Pin Descriptions

Diode

Terminal

Number

Name

Function

+side

VBAT

-side

GND

SiA1

VOUT1

VBAT

VOUT2

GND

LDO1 OUTPUT

POWER Supply

LDO2 OUTPUT

Ground

VBAT

GPO

GPO OUTPUT

GND

DVDD

REFC

SCL

I2C Serial Interface I/O Power supply

Power for logic circuit.

VBAT

DVDD

I2C serial interface CLK input

I2C serial interface DATA inout

SDA

IC Block Diagram

VBAT

Voltage

Detect

(2.7V)

LDO1

3.0V

100mA

VOUT1

VOUT2

REFC

TSD

LDO2

2.8V～3.3V

150mA

VREF

(IC Internal

Power）

DPREF

DVDD

I2C

SLAVE

SCL

SDA

GPO

GND

Figure 3. Block Diagram

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Block Explanation

The output voltage for LDO1 is 3V (Typ) with an output current capability of 100mA (Max). UVLO Function is released when

the IC starts by turning the power ON (VBAT).

LDO1 turns OFF when UVLO function is enabled.

I2C controller can also be used to turn off the IC. When LDO1 turns off, VOUT1 automatically connects with 100Ω

discharge resistance.

VOUT1 needs 4.7uF external capacitor.

LDO2 has an adjustable output voltage from 2.8V to 3.3V.The initial value is 3V (Typ) with an output current capability of

150mA (Max). UVLO Function is released when the IC starts by turning the power ON (VBAT).

LDO2 turns OFF when UVLO function is enabled.

I2C Controller is used to adjust output voltage from 2.8V to 3.3V (8steps). It is also used to turn off the IC.

When LDO2 turns off, VOUT2 automatically connects with 100Ω discharge resistance.

VOUT2 needs 4.7uF external capacitor.

GPO is a logic output pin from register and could be used as enable or disable signal. The register can also set its output to

CMOS type or NMOS type with an output current capability of 3mA.

Initial condition of GPO is disabled or in HI-Z state.

Maximum pull up voltage during NMOS output is equal to V_BAT

I2C SLAVE REGISTER is the function for I2C serial interface. Input voltage level is DVDD.

Voltage Detect for VBAT UVLO is 2.7V (Typ). When UVLO is detected, registers are reset.

Also at this time VREF, LDO1 and LDO2 outputs turn off.

VREF is equal to 2.5V (Typ). It powers the internal circuit and cannot be used externally. UVLO Function is released when

the IC starts by turning power ON (VBAT). When UVLO function is detected, IC turns off.

REFC needs 0.1uF external capacitor.

DPREF is reference voltage for LDO VREF and Voltage Detect.

TSD is for thermal shut down function. This prevents damaging and breaking of IC. When IC„s internal temperature rise up

to a certain temperature, LDO1 and LDO2 are automatically turned off. When temperature goes down, LDO1 and LDO2

automatically return to its normal operation.

In this case, register doesn‟t need to be reset.

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Absolute Maximum Rating(s) (Ta = 25°C)

Parameter

Symbol

Value

Unit

Power Supply (VBAT)

Power Supply (DVDD)

Power Dissipation

V_INVBAT

V_INDVDD

-0.3 ～ +7.0

0.66 ^{(Note 1)}

-35 ～ +85

-55 ～+150

150

°C

Operating Temperature Range

Storage Temperature

Junction Temperature

Other Pin Voltage

Topr

Tstg

Tjmax

V_OTH

-0.3 ～ +7.0

(Note 1) Derate by 5.2mW/℃when operating above Ta=25℃. (Mounted on a ROHM specification board.50mm x 58mm)

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Recommended Operating Condition (Ta= -35°C to +85°C)

Parameter

Power Supply(VBAT)

Power Supply(DVDD)

Symbol

MIN

TYP

MAC

UNIT

V_BAT

2.7

3.6

5.5

V_DVDD

1.70

1.80

3.50

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Electrical Characteristic (Unless otherwise specified, V_BAT=3.6V, V_DVDD=1.8V, Ta=25°C)

Parameter

Circuit Current

Symbol

MIN

TYP

MAX

UNIT

Condition

VBAT Circuit Current(VBAT=3.6V)

VBAT Circuit Current(VBAT=3.1V)

DVDD Circuit Current

Voltage Detector

I_CCBAT

9.5

µA

LDO1,2: No Load

I_CCDVDD

Detect Voltage

V_UVLO

V_UVLOHYS

V_OREF

2.64

2.70

100

2.76

150

Down Sweep

Detect Voltage Hysteresis

VREF Output Voltage

LDO1

2.45

2.50

2.55

Output Voltage

V_OUT1

I_OUT1MAX

ΔV_IS1

2.94

3.00

3.06

I_OUT1= 50mA

Output Max Current

Line Regulation

100

V_BAT=3.3～4.5V, I_OUT1= 50mA

I_OUT1= 1～100mA

Load Regulation

ΔV_LS1

V_BAT=4.2V+0.2Vpp,

I_OUT1= 50mA

fr=120Hz,BW=20～20kHz

PSRR

PSRR1

R_DIS1

Discharge Resistance

LDO2

100

V_BAT=2.5V

Output Voltage

V_OUT2

V_O2RNG

I_OUT2MAX

2.94

2.80

150

3.00

3.06

3.30

I_OUT1= 50mA

Variable Output Voltage

Output Max Current

V_BAT=V_OUT2+0.3V～4.5V,

I_OUT2= 50mA

Line Regulation

Load Regulation

ΔV_IS2

ΔV_LS2

I_OUT2= 1～150mA

V_BAT=4.2V+0.2Vpp,

I_OUT2= 50mA

fr=120Hz,BW=20～20kHz

PSRR

PSRR2

R_DIS2

Discharge resistance

100

V_BAT=2.5V

GPO

0.8×

V_OUT1

0.3+

V_OUT1

Output H Level

V_OHGPO

I_SINKGPO= 3mA

Output L Level

V_OLGPO

V_MXGPON

V_OLGPON

I_LKGPON

-0.3

0.4

V_BAT

0.4

I_SOURCEGPO= 3mA

NMOS output pulled up max voltage

NMOS output L level

-0.3

-1

I_SOURCEGPO= 3mA

NMOS output leak current

I2Cserial interface

µA

Terminal voltage=V_OUT1, 0V

0.75×

V_DVDD

0.3+

V_DVDD

0.25×

V_DVDD

Input H Level (SCL, SDA)

Input L Level (SCL, SDA)

V_IH

V_IL

-0.3

Input Leak Current (SCL, SDA)

Output L Level (SDA)

I_LK

-1

µA

Terminal voltage=V_DVDD, 0V

I_SOURCE= 6mA

V_OL

-0.3

0.4

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Electrical Characteristic (Unless otherwise specified, V_BAT=3.6V, V_DVDD=1.8V, Ta=-35～85°C( Note2))

Parameter

Circuit Current

Symbol

MIN

TYP

MAX

UNIT

Condition

VBAT Circuit Current(VBAT=3.6V)

VBAT Circuit Current(VBAT=3.1V)

DVDD Circuit Current

Voltage Detector

I_CCBAT

9.5

µA

LDO1,2: No Load

I_CCDVDD

Detect Voltage

V_UVLO

V_UVLOHYS

V_OREF

2.6

2.7

100

2.5

2.8

150

2.6

Down Sweep

Detect Voltage Hysteresis

VREF Output Voltage

LDO1

2.4

Output Voltage

V_OUT1

I_OUT1MAX

ΔV_IS1

2.88

3.12

I_OUT1= 50mA

Output Max Current

Line Regulation

100

V_BAT=3.3～4.5V, I_OUT1= 50mA

I_OUT1= 1～100mA

Load Regulation

ΔV_LS1

V_BAT=4.2V+0.2Vpp,

I_OUT1= 50mA

fr=120Hz,BW=20～20kHz

PSRR

PSRR1

R_DIS1

Discharge Resistance

LDO2

100

V_BAT=2.5V

Output Voltage

V_OUT2

V_O2RNG

I_OUT2MAX

2.88

2.8

3.12

3.3

I_OUT1= 50mA

Variable Output Voltage

Output Max Current

150

V_BAT=V_OUT2+0.3V～4.5V,

I_OUT2= 50mA

Line Regulation

Load Regulation

ΔV_IS2

ΔV_LS2

I_OUT2= 1～150mA

V_BAT=4.2V+0.2Vpp,

I_OUT2= 50mA

fr=120Hz,BW=20～20kHz

PSRR

PSRR2

R_DIS2

Discharge resistance

100

V_BAT=2.5V

GPO

0.8×

V_OUT1

0.3+

V_OUT1

Output H Level

V_OHGPO

I_SINKGPO= 3mA

Output L Level

V_OLGPO

V_MXGPON

V_OLGPON

I_LKGPON

-0.3

0.4

V_BAT

0.4

I_SOURCEGPO= 3mA

NMOS output pulled up max voltage

NMOS output L level

-0.3

-1

I_SOURCEGPO= 3mA

NMOS output leak current

I2Cserial interface

µA

Terminal voltage=V_OUT1, 0V

0.75×

V_DVDD

0.3+

V_DVDD

0.25×

V_DVDD

Input H Level (SCL, SDA)

Input L Level (SCL, SDA)

V_IH

V_IL

-0.3

Input Leak Current (SCL, SDA)

Output L Level (SDA)

I_LK

-1

µA

Terminal voltage=V_DVDD, 0V

I_SOURCE= 6mA

V_OL

-0.3

0.4

(Note2)：These are guaranteed by design engineering from -35℃ to 85℃.

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Characteristic Data(Reference Data)

-50

100

Input Voltage : VBAT[V]

Temp : Ta[℃]

Figure 4. Circuit Current VS temperature

Figure 5. Input Current VS Input Voltage

(VBAT=3.6V,Ta=-35℃~85℃)

(VBAT=0V~5.5V,Ta=25℃)

Io=1mA

Io=30mA

Io=50mA

Io=100mA

Io=30mA

Io=50mA

Io=100mA

Input Voltage : VBAT[V]

Figure 6. Output Voltage VS Input Voltage

Figure 7. Output Voltage VS Input Voltage

(VBAT=0V~5.5V,Ta=25℃)

(VBAT=0V~5.5V,Ta=25℃,Vout=2.8V)

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Characteristic Data(Reference Data) -continuance

VOUT2=2.9V

VOUT2=2.95V

Io=1mA

Io=30mA

Io=50mA

Io=100mA

Io=30mA

Io=50mA

Io=100mA

Input Voltage : VBAT[V]

Figure 8. Output Voltage VS Input Voltage

Figure 9. Output Voltage VS Input Voltage

(VBAT=0V~5.5V,Ta=25℃,Vout=2.9V)

(VBAT=0V~5.5V,Ta=25℃,Vout=2.95V)

VOUT2=3.0V

VOUT2=3.05V

Io=1mA

Io=30mA

Io=50mA

Io=100mA

Io=30mA

Io=50mA

Io=100mA

Input Voltage : VBAT[V]

Figure 10. Output Voltage VS Input Voltage

Figure 11. Output Voltage VS Input Voltage

(VBAT=0V~5.5V,Ta=25℃,Vout=3.0V)

(VBAT=0V~5.5V,Ta=25℃,Vout=3.05V)

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Characteristic Data(Reference Data) -continuance

VOUT2=3.2V

VOUT2=3.1V

Io=1mA

Io=30mA

Io=50mA

Io=100mA

Io=50mA

Io=100mA

Input Voltage : VBAT[V]

Figure 12. Output Voltage VS Input Voltage

Figure 13. Output Voltage VS Input Voltage

(VBAT=0V~5.5V,Ta=25℃,Vout=3.1V)

(VBAT=0V~5.5V,Ta=25℃,Vout=3.2V)

VOUT2=3.3V

Io=1mA

Io=30mA

Io=50mA

Io=100mA

Input Volatage : VBAT[V]

Figure 14. Output Voltage VS Input Voltage

(VBAT=0V~5.5V,Ta=25℃,Vout=3.3V)

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Characteristic Data(Reference Data) -continuance

3.4

3.3

3.2

3.1

3.2

VOUT2=3.3V

VOUT2=3.2V

VOUT2=3.1V

VOUT2=3.05V

VOUT2=3.0V

VOUT2=2.95V

VOUT2=2.9V

VOUT2=2.8V

3.1

2.9

2.8

2.9

2.8

2.7

-50

100

Temp : Ta[℃]

-50

100

Temp : Ta[℃]

Figure 15. Output Voltage VS Temperature

Figure 16. Output Voltage VS Temperature

(VBAT=3.6V,Ta=25℃,Io=1mA)

300

250

200

150

100

250

200

150

100

VBAT=3.1V

VBAT=3.3V

VBAT=3.6V

VBAT=3.9V

VBAT=5.5V

VBAT=3.3V

VBAT=3.6V

VBAT=3.9V

VBAT=5.5V

VOUT2 Voltage : VOUT2[V]

VOUT1 Voltage : VOUT1[V]

Figure 17. Output Current VS VOUT1 Voltage

Figure 18. Output Current VS VOUT2 Voltage

(VBAT=3.6V,Ta=25℃)

(VBAT=3.6V,Ta=25℃,VOUT2=3.0V)

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Characteristic Data(Reference Data) -continuance

Io=1mA

Io=50mA

Io=100mA

100

1000

10000

100000

100

1000

10000

100000

Frequency : fR[Hz]

Figure 19. Ripple Rejection VS Frequency

(VBAT=4.2V+0.2Vpp,Cout=4.7μF,fR=120Hz,Ta=25℃)

Figure 20. Ripple Rejection VS Frequency

(VBAT=4.2V+0.2Vpp,Cout=4.7μF,fR=120Hz,Ta=25℃)

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Characteristic Data(Reference Data) -continuance

VBAT:0.5V/Div

VOUT1:20mV/Div

⊿30.83mV

⊿104.17mV

Figure 21. VBAT Response(Rise)

Figure 22. VBAT Response(Fall)

(VBAT=4V→5V,Cout=4.7μF,Ta=25℃,Tf=0.5μs)

(VBAT=5V→4V,Cout=4.7μF,Ta=25℃,Tf=0.5μs)

VBAT:0.5V/Div

VOUT2:20mV/Div

⊿112.50mV

⊿30.00mV

Figure 23. VBAT Response(Rise)

Figure 24. VBAT Response(Fall)

(VBAT=4V→5V,Cout=4.7μF,Ta=25℃,Tf=0.5μs)

(VBAT=5V→4V,Cout=4.7μF,Ta=25℃,Tf=0.5μs)

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Characteristic Data(Reference Data) -continuance

IVOUT1 5mA/Div

VOUT1 100mV/Div

⊿36.00mV

⊿32.00mV

Figure 25. Load Response(Rise)

Figure 26. Load Response(Fall)

(VBAT=3.6V,Cout=4.7μF,Ta=25℃,Iout=1mA→10mA,Tr=0.5μs)

(VBAT=3.6V,Cout=4.7μF,Ta=25℃,Iout=10mA→1mA,Tf=0.5μs)

IVOUT2 5mA/Div

VOUT2 100mV/Div

⊿32.00mV

⊿30.00mV

Figure 27. Load Response(Rise)

Figure 28. Load Response(Fall)

(VBAT=3.6V,Cout=4.7μF,Ta=25℃,Iout=1mA→10mA,Tr=0.5μs)

(VBAT=3.6V,Cout=4.7μF,Ta=25℃,Iout=10mA→1mA,Tf=0.5μs)

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Characteristic Data(Reference Data) -continuance

IVOUT1 5mA/Div

VOUT1 100mV/Div

⊿82mV

⊿78mV

Figure 29. Load Response(Rise)

Figure 30. Load Response(Fall)

(VBAT=3.6V,Cout=4.7μTa=25℃,F,Iout=50mA→100mA,Tr=0.5μs)

(VBAT=3.6V,Cout=4.7μF,Ta=25℃,Iout=100mA→50mA,Tf=0.5μs)

IVOUT2 50mA/Div

VOUT2 100mV/Div

⊿80mV

⊿82mV

Figure 31. Load Response(Rise)

Figure 32. Load Response(Fall)

(VBAT=3.6V,Cout=4.7μF,Ta=25℃,Iout=50mA→100mA,Tr=0.5μs)

(VBAT=3.6V,Cout=4.7μF,Ta=25℃,Iout=100mA→50mA,Tf=0.5μs)

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Characteristic Data(Reference Data) -continuance

VBAT 2.0V/Div

VOUT1 2.0V/Div

VOUT2 2.0V/Div

152mA

164mA

IVBAT 100A/Div

Figure 33. Rush Current

Figure 34. Rush Current

(VBAT=3.6V, LDO_EN=L→H ,Cout=4.7μF,Ta=25℃)

(VBAT=3.6V,LDO_EN=L→H Cout=4.7μF,Ta=25℃)

3.5

2.5

1.5

0.5

2.5

2.7

2.9

3.1

Input Voltage : VBAT[V]

Figure 35. Output Voltage VS Input Voltage

(VBAT=3.6V,Ta=25℃)

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Characteristic Data(Reference Data) -continuance

300

200

100

2.8

2.6

Source Current : ISOURCEGPO[mA]

SinkCurrent : ISINKGPO[mA]

Figure 36. Output Voltage VS Source Current(CMOS Output)

Figure 37. Output Voltage VS Sink Current(CMOS Output)

(VBAT=3.6V,Ta=25℃)

300

200

100

SinkCurrent : ISINKGPO[mA]

Figure 38. Output Voltage VS Sink Current(NMOS Output)

(VBAT=3.6V,Ta=25℃)

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I2C Interface Timing Specification

BD7602GUL has 2 line serial interface which supports I2C Bus protocol.

Table 1. I2C slave address

R/W

1/0

Figure 39. I2C interface Timing

(Unless otherwise specified, V_BAT=3.6V, V_DVDD=1.8V, Ta=25°C)

Parameter

Symbol

MIN

TYP

MAX

UNIT

Condition

SCL Clock Frequency

START Hold time

f_SCL

400

kHz

µs

t_HD:STA

t_LOW

0.6

1.3

0.6

0.0

100

0.6

SCL of “L” time

SCL of “H” time

t_HIGH

Data input hold time

Data input setup time

STOP condition setup time

t_HD:DAT

t_SU:DAT

t_SU:STO

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Table 2.Register Map

name

ICREV

Address

R/W

INIT

00h

01h

02h

03h

04h

09h

03h

00h

DEVICE [2:0]

CHIPREV [2:0]

LDO2_EN LDO1_EN

LDO2_VOUT [2:0]

LDOCNT

R/W

LDO2ADJ

GPOCNT

GPOMODE

REG_GPO

GPO_EN

Reserved

GPO_SEL

name

ICREV

Address

00h

R/W

INIT

09h

DEVICE [2:0]

CHIPREV [2:0]

Bit[5:3]: DEVICE [2:0]

DEVICE Name Notification

001: BD7602GUL (Initial Value)

CHIP Revision Notification

001: DS1 (Initial Value)

Bit[2:0]: CHIPREV [2:0]

name

LDOCNT

Address

01h

R/W

INIT

03h

LDO2_EN LDO1_EN

Bit[1]: LDO2_EN

LDO2 Output ON/OFF Control

0: OFF

1: ON (Initial Value)

LDO1 Output ON/OFF Control

0: OFF

Bit[0]: LDO1_EN

1: ON (Initial Value)

name

LDO2ADJ

Address

02h

R/W

INIT

03h

LDO2_VOUT [2:0]

Bit[2:0]: LDO2_VOUT [2:0] LDO2 Output Voltage set

“

000: 2.80V

001: 2.90V

010: 2.95V

011: 3.00V (Initial Value)

100: 3.05V

101: 3.10V

110: 3.20V

111: 3.30V

name

GPOCNT

Address

03h

R/W

INIT

00h

REG_GPO

GPO_EN

Bit[1]: GPO_EN

GPO Enable/Disable Control

0: Disable (Hi-Z) (Initial Value)

1: Enable (Output Type and Output Voltage follow data of address 04h)

GPO Output Control

Bit[0]: REG_GPO

0: Low Output (Initial Value)

1: High Output (CMOS Output), Hi-Z (NMOS Output)

name

GPOMODE

Address

04h

R/W

INIT

00h

Reserved

GPO_SEL

Bit[1]: Reserved

Reserved Register （no any function）

In case of writing address 04h, note to set this bit to “0”.

Bit[0]: GPO_SEL

GPO Output Type

0: CMOS Output (Initial Value)

1: NMOS Output

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Timing Chart

2.8V

2.7V

VBAT(External input)

VBATUVLO(Internal signal)

VREF

2.3V (Reference)

DVDD(External input)

W/R Disable

W/R Enable

W/R Disable

I2C Access

LDO1 Output

GPO Input

500µsec

W/R Disable

Initial: Hi-Z

W/R Operation

Write Data

W/R Disable

Initial: Hi-Z

GPO Output

Figure 40. Timing Chart

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC‟s power

supply terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Thermal Consideration

Should by any chance the power dissipation (Pd) rating be exceeded, the rise in temperature of the chip may result in

deterioration of its properties. The absolute maximum rating of the Pd stated in this specification is when the IC is

mounted on a 1.64mm x 1.64mm x 0.57mm glass epoxy board. In case the absolute maximum rating has been

exceeded, increase the board size and copper area to prevent exceeding the Pd rating.

5. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

6. Rush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC‟s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

9. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

10. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to

the power supply or ground line.

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 41.Example of monolithic IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Save Operating Range

When using this IC, set output transistor not to exceed absolute maximum range or ASO.

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC‟s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn off all output pins. When the Tj falls below the

TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage

15. Over Current Protection circuit

Because output has an Over Current Protection (OCP) circuit that operates in accordance with the rated output

capacity, IC is protected from breakage or possible damage when the load becomes shorted. This protection circuit is

also effective in preventing damage to the IC in case of sudden and unexpected current surges only and not for its

continuous protection.

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Ordering Name information

B D 7

2 G U

E 2

Name of Product

Package

Packing、forming specification

GUL: VCSP50L1C

E2: reel type emboss taping

Package Dimensions

Unit: mm

< Tape and Reel Information >

Tape

Embossed carrier tape

3000pcs

Direction of feed E2

Quantity

The direction is the pin 1 of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

1234

Direction of feed

1pin

Reel

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD7602GUL [ROHM]

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