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BD7LS32G-C

更新时间：2024-10-30 05:36:17

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描述：BD7LS32G-C是适用于车载应用的Single 2-input OR gate。可保证在1.65V到5.5V的电源电压下工作。具备output tolerant电路，可在断电时防止电流从连接对象流入，保护输出电路。

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BD7LS32G-C 概述

BD7LS32G-C是适用于车载应用的Single 2-input OR gate。可保证在1.65V到5.5V的电源电压下工作。具备output tolerant电路，可在断电时防止电流从连接对象流入，保护输出电路。

BD7LS32G-C 数据手册

通过下载BD7LS32G-C数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。

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Datasheet

General Purpose CMOS Logic IC

Automotive Single 2-input OR gate

BD7LS32G-C

General Description

Key Specifications

The BD7LS32G-C is a Single 2-input OR gate and

qualified for automotive applications. This is designed

for 1.65 V to 5.5 V power supply voltage operation.

When it is power down, the Output Tolerant circuit

protects the output circuit from the back flow current

through the connected system.

◼ Supply Voltage Range:

◼ Low Current Consumption (I_CC):

◼ Operating Temperature Range:-40 °C to +125 °C

◼ Max Propagation Delay Time:

◼ Output Drive Capability:

1.65 V to 5.5 V

10 μA (Max)

12.0 ns (@3.0 V)

±24 mA (@3.0 V)

Package

SSOP5

W(Typ) x D (Typ) x H (Max)

Features

2.9 mm x 2.8 mm x 1.25 mm

◼ AEC-Q100 Qualified^{(Note 1)}

➢ 4000 V Human-body Model

➢ 1000 V Charged-device Model

◼ Low Power Consumption

◼ 5.5 V Tolerant Inputs

◼ Output Tolerant Supports Partial Power Down Mode

Operation

◼ Package SSOP5 is Similar to SOT-23-5(JEDEC)

(Note 1) Grade 1

SSOP5

Applications

◼

Automotive

Pin Configuration and Logic Diagram

Pin Descriptions

Truth Table

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

Rating

Unit

Supply Voltage Range

V_CC

V_IN

-0.5 to +6.5

-50

Input Voltage Range

Input Diode Current (V_IN< 0)

Output Diode Current (V_O< 0)

Output Current

I_IK

°C

I_OK

-50

I_O

±50

VCC-GND Current

I_CC

±50

Maximum Junction Temperature

Tjmax

+150

Storage Temperature Range

Tstg

-55 to +150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open

circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in

case the IC is operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration

of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into

consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note

Thermal

Resistance

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

SSOP5

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

376.5

185.4

°C/W

Ψ_JT

Layer Number of

Material

Board Size

114.3 mm x 76.2 mm x 1.57 mmt

Measurement Board

Single

FR-4

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

4 Layers

Material

Board Size

FR-4

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

74.2 mm x 74.2 mm

Thickness

70 μm

Footprints and Traces

(Note 1) Based on JESD51-2A (Still-Air).

74.2 mm x 74.2 mm

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the

outside surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-7.

Recommended Operating Conditions

Parameter

Symbol

Min

1.65

1.5

Typ

Max

5.5

V_CC

Unit

Conditions

Operating

Supply Voltage

V_CC

Data Retention Only

Input Voltage

V_IN

V_O

Output Voltage

V_CC= 1.65 V to 1.95 V

V_CC= 2.3 V to 2.7 V

V_CC= 3.0 V to 3.6 V

V_CC= 4.5 V to 5.5 V

Input Transition Rise or Fall

Rate

Δt/Δv

ns/V

Operating Temperature

Topr

-40

+125

°C

(Note) The recommended operating conditions are the range where operation is guaranteed. If this ranges are exceeded, operation is not guaranteed

even within the absolute maximum ratings. Unused inputs must be tied to either V_CCor GND.

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Electrical Characteristics

(Unless otherwise specified V_CC= 1.65 V to 5.5 V and Ta = -40 °C to +125 °C)

Conditions

Parameter

Symbol

Min

Typ

Max

Unit

V_CC

Input “H” Voltage

Input “L” Voltage

V_IH

V_IL

V_CC× 0.7

1.65 V to 5.5 V -

V_CC× 0.3

1.65 V to 5.5 V -

V_CC- 0.1

1.65 V to 5.5 V I_OH= -100 μA

1.2

1.8

2.3

2.1

3.4

1.65 V

2.3 V

3.0 V

4.5 V

I_OH= -4 mA

I_OH= -8 mA

I_OH= -16 mA

I_OH= -24 mA

I_OH= -32 mA

Output “H” Voltage

V_OH

0.10

0.45

0.40

0.60

0.90

1.00

±2

1.65 V to 5.5 V I_OL= 100 μA

1.65 V

2.3 V

I_OL= 4 mA

I_OL= 8 mA

Output “L” Voltage

Input Current

V_OL

3.0 V

I_OL= 16 mA

I_OL= 24 mA

I_OL= 32 mA

V_IN= 5.5 V or GND

3.0 V

4.5 V

I_IN

μA

0 V to 5.5 V

Power Off

I_OFF

0 V

V_INor V_O= 5.5 V

Output Pin Current

Quiescent Supply

Current

I_CC

ΔI_CC

C_I

μA

1.65 V to 5.5 V -

One Input:

Supply Current

Increase

V_CC- 0.6 V

600

3.0 V to 5.5 V

3.3 V

Other Inputs:

V_CCor GND

V_IN= V_CCor GND

Ta = 25 °C

Input Capacitance

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Switching Characteristics

(Unless otherwise specified V_CC= 1.65 V to 5.5 V and Ta = -40 °C to +125 °C)

Conditions

FROM

Parameter

Symbol

Min

Typ

Max

Unit

(Input) (Output)

V_CC

1.4

0.6

0.5

15.0

13.0

12.0

10.0

1.65 V to 1.95 V

2.3 V to 2.7 V

3.0 V to 3.6 V

4.5 V to 5.5 V

Propagation

Delay Time

t_PLH

t_PHL

A or B

f = 10 MHz,

Ta = 25 °C

f = 10 MHz,

Ta = 25 °C

3.3 V

5.0 V

Power

Dissipation

Capacitance

C_PD

Parameter Measurement Conditions

Measurement Circuit and Timing Chart

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Typical Performance Curves

Figure 1. Propagation Delay Time: t_PLHvs Supply

Figure 2. Propagation Delay Time: t_PLHvs Ambient

Temperature: Ta

Voltage: V_CC

(Ta = 25 °C)

(V_CC= 3.3 V)

Figure 3. Propagation Delay Time: t_PHLvs Supply

Figure 4. Propagation Delay Time: t_PHLvs Ambient

Temperature: Ta

Voltage: V_CC

(Ta = 25 °C)

(V_CC= 3.3 V)

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity

when connecting the power supply, such as mounting an external diode between the power supply and the IC’s

power supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to

ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when

using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed

separately but connected to a single ground at the reference point of the application board to avoid fluctuations

in the small-signal ground caused by large currents. Also ensure that the ground traces of external components

do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce

line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the

electrical characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current

may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than

one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of

ground wiring, and routing of connections.

7. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power

supply should always be turned off completely before connecting or removing it from the test setup during the

inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar

precautions during transport and storage.

9. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may

result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply

and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very

humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The

small charge acquired in this way is enough to produce a significant effect on the conduction through the

transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be

connected to the power supply or ground line.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep

them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements,

creating a parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P

substrate) should be avoided.

Example of Monolithic IC Structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

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Ordering Information

B D 7 L S 3 2 G

C T L

Package

Product Rank

G: SSOP5

C: for Automotive

Packaging and forming specification

TL: Embossed tape and reel

Marking Diagram

SSOP5 (TOP VIEW)

Part Number Marking

LOT Number

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Physical Dimension and Packing Information

Package Name

SSOP5

Packing Information

Packing Form

Quantity

Embossed carrier tape

3000 pcs

Direction of feed

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Revision History

Date

Revision

001

Changes

21.Apr.2020

New Release

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

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H2S, NH3, SO2, and NO2

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[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

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When disposing Products please dispose them properly using an authorized industry waste company.

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1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

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consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

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