BD82021FVJ [ROHM]
BD82021FVJ是USB用1ch小型高边开关IC。;
| 型号： | BD82021FVJ |
| 厂家： | 
ROHM |
| 描述： | BD82021FVJ是USB用1ch小型高边开关IC。 开关 |
| 文件： | 总24页 (文件大小：618K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
1 Channel Compact High Side Switch ICs
1.5A Current Limit High Side Switch ICs
BD82021FVJ
Description
Key Specifications
BD82021FVJ is a Single Channel High Side Switch IC
Input Voltage Range:
ON Resistance: (VIN=5V)
Over Current Threshold:
Standby Current:
2.8V to 5.5V
90mΩ(Typ)
1.5A
employing N-channel power MOSFET with low on
resistance and low supply current for the power supply
line of universal serial bus (USB).
0.01µA (Typ)
This IC has a built-in over current detection circuit,
thermal shutdown circuit, under voltage lockout and
soft start circuits.
Operating Temperature Range:
-40℃ to +85℃
Package
W(Typ) D(Typ) H(Max)
3.00mm x 4.90mm x 1.10mm
Features
TSSOP-B8J
Over-Current Protection：1.5A
Control Input Logic：Active-Low
Output Discharge Function
Reverse Current Protection when Power Switch Off
Thermal Shutdown
Open-Drain Fault Flag Output
Under-Voltage Lockout
OCP Fast Response
Soft-Start Circuit
ESD Protection
UL：File No. E243261
TSSOP-B8J
( MSOP8 Jedec )
IEC 60950-1 CB_scheme: File No.US-18106-UL
Applications
USB hub in consumer appliances, PC,
PC peripheral equipment, and so forth
Typical Application Circuit
5V(Typ)
3.3V
VOUT
GND
IN
OUT
OUT
10kΩ to
+
CI N
100kΩ
CL
-
IN
OUT
EN(/EN) /OC
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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Block Diagram
GND
IN
OUT
OUT
OUT
/OC
Charge
Pump
UVLO
OCD
IN
Gate
Logic
EN(/EN)
TSD
Figure 2. Block Diagram
Pin Configuration
OUT
GND
IN
8
7
6
5
1
2
3
4
OUT
OUT
/OC
Top View
IN
EN(/EN)
Figure 3. Pin Configuration (TOP VIEW)
Pin Descriptions
Pin No.
Symbol
I/O
-
Function
1
GND
IN
Ground
Power supply input
2, 3
4
I
Input terminal to the power switch and power supply input terminal of the internal circuit
Short these pins externally
Enable input
EN, /EN
/OC
I
Active low power on switch
High level input > 2.0V, Low level input < 0.8V
Error flag output
5
O
O
Low when over-current or thermal shutdown is activated
Open drain output
Power switch output
Short these pins externally
6, 7, 8
OUT
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Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Rating
-0.3 to +6.0
-0.3 to +6.0
-0.3 to +6.0
5
Unit
V
IN Supply Voltage
VIN
V/EN
V/OC
I/OC
/EN Input Voltage
/OC Voltage
V
V
/OC Sink Current
OUT Voltage
mA
V
VOUT
Tstg
Pd
-0.3 to +6.0
-55 to +150
587.5 (1)
Storage Temperature
℃
mW
Power Dissipation
(1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 4.7mW per 1℃ above 25℃
Recommended Operating Ratings
Rating
Parameter
Symbol
Unit
Min
2.8
-40
Typ
Max
5.5
IN Operating Voltage
VIN
-
-
V
Operating Temperature
Topr
+85
℃
Electrical Characteristics (VIN= 5V, Ta= 25℃, unless otherwise specified.)
DC Characteristics
Limit
Parameter
Operating Current
Symbol
Unit
Condition
Min
Typ
95
0.01
-
Max
135
1
-
-
IDD
ISTB
µA
µA
V
V/EN = 0V, VOUT = open
V/EN = 5V, VOUT = open
High input
Standby Current
V/ENH
V/ENL
I/EN
2.0
-
-
/EN Input Voltage
-
0.8
+1
115
1
V
Low input
/EN Input Leakage
On Resistance
-1
-
0.01
90
-
µA
mΩ
µA
V/EN = 0V or 5V
IOUT = 1.0A
RON
IREV
Reverse Leak Current
-
VOUT = 5.5V, VIN = 0V
Current Load Slew rate
100A/s
Over-Current Threshold
ITH
1.1
1.5
2.0
A
VOUT=0V
Short Circuit Output Current
ISC
0.7
1.0
1.4
A
CL=100µF
RMS
Output Discharge Resistance
/OC Output Low Voltage
/OC Output Leak Current
RDISC
V/OC
-
-
75
-
150
0.4
1
Ω
V
IOUT = 1mA, V/EN = 5V
I/OC = 1mA
V/OC = 5V
IL/OC
-
0.01
µA
VTUVH
VTUVL
2.0
2.3
2.2
2.5
2.4
V
V
VIN increasing
VIN decreasing
UVLO Threshold
1.9
AC Characteristics
Parameter
Limit
Typ
0.4
0.6
2
Symbol
Unit
Condition
Min
Max
10
Output Rise Time
Output Turn-on Time
Output Fall Time
tON1
tON2
tOFF1
tOFF2
t/OC
-
-
ms
ms
µs
20
RL=10Ω
-
20
Output Turn-off Time
/OC Delay Time
-
4
40
µs
5
12
20
ms
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Measurement Circuit
VIN
VIN
VIN
10kΩ
A
A
1µF
1µF
GND
IN
OUT
OUT
OUT
GND
OUT
OUT
OUT
IN
IN
IN
RL
EN(/EN) /OC
EN(/EN) /OC
VEN(V/EN
)
VEN(V/EN)
Operating Current
VIN
/EN, Input Voltage, Output Rise/Fall Time
VIN
VIN
A
I/OC
A
10kΩ
※10µF
1µF
1µF
GND
IN
OUT
OUT
OUT
GND
IN
OUT
OUT
OUT
IN
IN
CL
IOUT
EN(/EN) /OC
EN(/EN) /OC
VEN(V/EN
)
VEN(V/EN
)
On Resistance, Over-Current Protection
※Use capacitance of more than 10uF at
output short test by using external supply.
/OC Output Low Voltage
Figure 4. Measurement Circuit
Timing Diagram
TOFF1
TON1
90%
90%
VOUT
10%
10%
TOFF2
TON2
V/EN
50%
50%
Figure 5. Output Rise/Fall Time
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Typical Performance Curves
140
140
120
100
80
VIN=5.0V
Ta=25°C
120
100
80
60
40
20
0
60
40
20
0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN [V]
Ambient Temperature ; Ta[°C]
Figure 6. Operating Current
EN Enable
Figure 7. Operating Current
EN Enable
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
VIN=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN [V]
Ambient Temperature ; Ta[°C]
Figure 8. Standby Current
EN Disable
Figure 9. Standby Current
EN Disable
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Typical Performance Curves - continued
2.0
2.0
1.5
1.0
0.5
0.0
VIN=5.0V
Low to High
High to Low
Ta=25°C
1.5
Low to High
High to Low
1.0
0.5
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN [V]
Figure 10. /EN Input Voltage
Ambient Temperature ; Ta[°C]
Figure 11. /EN Input Voltage
200
150
100
50
200
150
100
50
Ta=25°C
VIN=5.0V
0
0
-50
0
50
100
2
3
4
5
6
Supply Voltage : VIN [V]
Ambient Temperature ; Ta[°C]
Figure 13. On Resistance
Figure 12. On Resistance
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Typical Performance Curves - continued
3.0
2.5
2.0
1.5
1.0
3.0
VIN=5.0V
Ta=25°C
2.5
2.0
1.5
1.0
-50
0
50
100
2
3
4
5
6
Ambient Temperature ; Ta[°C]
Supply Voltage : VIN [V]
Figure 14. Over-Current Threshold
Figure 15. Over-Current Threshold
100
80
60
40
20
0
100
VIN=5.0V
Ta=25°C
80
60
40
20
0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN [V]
Figure 16. /OC Output Low Voltage
Ambient Temperature ; Ta[°C]
Figure 17. /OC Output Low Voltage
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Typical Performance Curves - continued
2.5
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
2.4
VIN=5.0V
VTUVH
2.3
VTUVL
2.2
2.1
2.0
-50
0
50
100
-50
0
50
100
Ambient Temperature ; Ta[°C]
Ambient Temperature ; Ta[°C]
Figure 18. UVLO Threshold
Figure 19. UVLO Hysteresis Voltage
5.0
4.0
3.0
2.0
1.0
0.0
5.0
Ta=25°C
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN [V]
Ambient Temperature ; Ta[°C]
Figure 21. Output Rise Time
Figure 20. Output Rise Time
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Typical Performance Curves - continued
5.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
-50
0
50
100
2
3
4
5
6
Supply Voltage : VIN [V]
Ambient Temperature ; Ta[°C]
Figure 23. Output Turn-on Time
Figure 22. Output Turn-on Time
5.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN [V]
Figure 24. Output Fall Time
Ambient Temperature ; Ta[°C]
Figure 25. Output Fall Time
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Typical Performance Curves - continued
10.0
10.0
8.0
6.0
4.0
2.0
0.0
Ta=25°C
8.0
VIN=5.0V
6.0
4.0
2.0
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN [V]
Figure 26. Output Turn-off Time
Ambient Temperature ; Ta[°C]
Figure 27. Output Turn-off Time
20
15
10
5
20
18
16
14
12
10
Ta=25°C
VIN=5.0V
-50
0
50
100
2
3
4
5
6
Ambient Temperature ; Ta[°C]
Figure 29. /OC Delay Time
Supply Voltage : VIN [V]
Figure 28. /OC Delay Time
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Typical Performance Curves - continued
200
150
100
50
200
Ta=25°C
VIN=5.0V
150
100
50
0
0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN [V]
Ambient Temperature ; Ta[°C]
Figure 30. Discharge On Resistance
Figure 31. Discharge On Resistance
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Typical Wave Forms（BD82021FVJ）
V/EN
(5V/div.)
V/EN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IIN
(0.5A /div.)
IIN
VIN=5V
RL=10Ω
VIN=5V
RL=10Ω
(0.5A/div.)
TIME(0.5ms/div.)
Figure 32. Output Rise Characteristic
TIME(1µs/div.)
Figure 33. Output Fall Characteristic
V/EN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
CL=220µF
CL=100µF
CL=47µF
IIN
(1.0A/div.)
IIN
(0.5A/div.)
VIN=5V
RL=10Ω
VIN=5V
CL=100µF
TIME(1ms/div.)
Figure 34. Inrush Current Response
TIME(5ms/div.)
Figure 35. Over-Current Response
Ramped Load
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Typical Wave Forms（BD82021FVJ）
V/EN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IIN
IIN
(1.0A/div.)
(1.0A/div.)
VIN=5V
VIN=5V
TIME(5ms/div.)
Figure 37. Over-Current Response
1ΩLoad Connected at Enable
TIME(20ms/div.)
Figure 36. Over-Current Response
Enable to Shortcircuit
VIN
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IIN
IIN
(0.5A/div.)
(0.5A/div.)
RL=10Ω
RL=10Ω
TIME(10ms/div.)
Figure 38. UVLO Response
Increasing VIN
TIME(10ms/div.)
Figure 39. UVLO Response
Decreasing VIN
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Typical Application Circuit
5V(Typ.)
IN
Regulator
OUT
VBUS
GND
IN
OUT
OUT
10kΩ to
100kΩ
D+
USB
+
-
IN
C
CL
Controller
D-
IN
OUT
/OC
GND
EN(/EN)
Figure 40. Typical Application Circuit
Application Information
When excessive current flows due to output short-circuit or overload ringing occurs because of inductance between power
source line and IC. This may cause bad effects on IC operations. In order to avoid this case, connect a bypass capacitor
CIN across IN terminal and GND terminal of IC. 1µF or higher is recommended. In order to decrease voltage fluctuations of
power source line to IC, connect a low ESR capacitor in parallel with CIN. 10µF to 100µF or higher is recommended.
Pull up /OC output via resistance value of 10kΩ to 100kΩ.
Set up a value for CL which satisfies the application.
This system connection diagram does not guarantee operation as the intended application.
When using the circuit with changes to the external circuit values, make sure to leave an adequate margin for external
components including static and transitional characteristics as well as the design tolerances of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal
is also used as power source input to internal control circuit.
When the switch is turned on from /EN control input, the IN terminal and OUT terminal are connected by a 90mΩ(Typ)
switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of the IN
terminal, current flows from OUT terminal to IN terminal.
Since the parasitic diode between the drain and the source of switch MOSFET is canceled current flow from OUT to IN is
prevented during off state.
2. Thermal Shutdown Circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature reaches
beyond 130℃(Typ) during the condition of over current detection, thermal shutdown circuit operates and turns power
switch off and outputs an error flag (/OC). Then, when the junction temperature decreases below 120℃(Typ), power
switch is turned on and error flag (/OC) is cancelled. Unless the cause of the increase of the chip’s temperature is
removed or the output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (/EN signal is active).
3. Over-Current Detection (OCD)
The over-current detection circuit (OCD) limits current (ISC) and outputs error flag (/OC) when current flowing in each
switch MOSFET exceeds a specified value. There are three cases when the OCD circuit is activated. The OCD operates
when the switch is on (/EN signal is active).
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(1) When the switch is turned on while the output is in short-circuit status, the switch gets in current limit status
immediately.
(2) When the output short-circuits or when high current load is connected while the switch is on, very large current
will flow until the over-current limit circuit reacts. When this happens, the over-current limit circuit is activated
and the current limitation is carried out.
(3) When the output current increases gradually, current limitation does not work until the output current exceeds
the over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until VIN exceeds 2.3V(Typ). If VIN drops below 2.2V(Typ) while the
switch is still on, then the UVLO will shut off the power switch. UVLO has a hysteresis of 100mV(Typ).
Under-voltage lockout circuit works when the switch is on (/EN signal is active).
5. Error Flag (/OC) Output
Error flag output is an N-MOS open drain output. Upon detection of over current or thermal shutdown, the output level
becomes low.
Over-current detection has a delay filter. This delay filter prevents current detection flags from being sent during
instantaneous events such as surge current due to switching or hot plug.
V/EN
Output shortcircuit
Thermal shut down
VOUT
IOUT
V/OC
delay
Figure 41. Over-Current Detection, Thermal Shutdown Timing
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Power Dissipation
The power dissipation depends on output load, ambient temperature and PCB layout. The devices have current capacity of
1.0A respectively. Power dissipation can be calculated using the output current and the RON of the power switch as below.
2
Pd = RON x IOUT
The derating curve is shown below
TSSOP-B8J
(MSOP-8 JEDEC standard)
1200
1000
800
600
400
200
0
962mw
758mw
587.5mw
4 layer board mounting
2 layer board mounting
1 layer board mounting
0
25
50
75
100
125
150
Ambient Temperature ; Ta[°C]
Note: IC is Mounted on 70mmx70mmx1.6mm glass-epoxy PCB. Derating is 4.7mW/℃ above Ta=25℃.
Figure 42. Power Dissipation Curve (Pd-Ta Curve)
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I/O Equivalent Circuit
Symbol
Pin No.
Equivalent Circuit
EN(/EN)
4
EN
(/EN)
/OC
/OC
5
OUT
6,7,8
OUT
Operational Notes
1. Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all
destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit
protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum
ratings.
2. Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
3. Reverse Connection of Power Supply Connector
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
4. Power Supply Line
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
5. GND Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
6. Short Circuit between Terminals and Erroneous Mounting
Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
7. Operation in Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
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BD82021FVJ
8. Inspection with Set PCB
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from electro static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9. Input Terminals
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the GND voltage should be avoided. Furthermore, do not apply a voltage to the input terminals when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input terminals have
voltages within the values specified in the electrical characteristics of this IC..
10. Ground Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
11. External Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do not
use the IC in conditions where this function will always be activated.
13. Thermal Design
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-0E3E0H300460-1-2
18.SEP.2013 Rev.002
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BD82021FVJ
Ordering Information
B D
8
2
0
2
1
F
V
J
- E
2
Part No.
Part No.
Package
FVJ : TSSOP-B8J
(MSOP-8 JEDEC)
Packaging and forming specification
E2: Embossed tape and reel
Lineup
Over-Current Threshold
Control Logic
Part Number
BD82021FVJ
1.5A
Active- Low
Marking Diagram
TSSOP-B8J(TOP VIEW)
Part Number
BD82021FVJ
Marking
Part Number Marking
LOT Number
021
D 8 2
1PIN MARK
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-0E3E0H300460-1-2
18.SEP.2013 Rev.002
19/21
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BD82021FVJ
Physical Dimension, Tape and Reel Information
Package Name
TSSOP-B8J
<Tape and Reel information>
Tape
Embossed carrier tape
2500pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
Direction of feed
1pin
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-0E3E0H300460-1-2
18.SEP.2013 Rev.002
20/21
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BD82021FVJ
Revision History
Date
Revision
Changes
2.APR.2013
18.SEP.2013
001
002
New Release
Revised derating of Power Dissipation
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© 2013 ROHM Co., Ltd. All rights reserved.
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TSZ02201-0E3E0H300460-1-2
18.SEP.2013 Rev.002
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
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