BD8226EFV-E2_技术文档

Datasheet

System Motor Driver Series for CD・DVD Player

4ch System Motor Driver

For Car Audio

BD8226EFV

General Description

Key Specifications

BD8226EFV is a 5-input, 4-output BTL driver

developed for driving Spindle motor (CH1),

Sled/Loading motor (CH2) and the actuator coils

(CH3:Tracking coil, CH4:Focus coil).

■

Power supply voltage

5.5V to 14V

-40°C to +85°C

Operating temperature range

Maximum output amplitude

(V_PREVCC1=V_POWVCC1,2=8V, R_L=8Ω)

CH1,CH2

This IC can be used for CD and DVD applications.

6.0V(Typ)

5.3V(Typ)

Features

CH3,CH4

■

4CH BTL Driver

Has wide dynamic range

Package

W(Typ) D(Typ) H(Max)

7.80mm x 7.60mm x1.00mm

HTSSOP-B24

Built-in thermal shutdown circuit

Separating Vcc into Pre and Power (Power divides

into CH1/2 and CH3/4) can improve efficiency.

Switches CH2 input using Control input terminal

(CNT)

Incorporates mute function using CNT and MUTE

terminals

Built-in variable regulator control

■

Applications

Car Audio

HTSSOP-B24

Typical Application Circuit

DSP

REGOUT

24

23

22

21

IN2-2

20

19

18

17

16

15

14

13

IN1

CNT

IN2-1

BIAS

IN3

IN4

MUTE

PREGND REG(+) REG-B PREVCC

BD8226EFV

POWVCC1 POWGND1 VO1(-) VO1(+)

VO2(-)

5

VO2(+)

6

VO3(-) VO3(+)

VO4(-) VO4(+) POWGND2 POWVCC2

10 11 12

1

2

3

4

7

8

9

SPINDLE

MOTOR

CH1

SLED/LOADING

MOTOR

TRACKING

COIL

FOCUS

COIL

CH4

CH2

CH3

Figure 1. Application Circuit

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Pin Configuration

Pin Description

Pin No.

Symbol

Function

1

2

POWVCC1 CH1,2 power supply terminal

POWGND1 Power GND1

3

4

5

6

7

8

9

VO1(-)

VO1(+)

VO2(-)

VO2(+)

VO3(-)

VO3(+)

VO4(-)

VO4(+)

Driver CH1 negative output

Driver CH1 positive output

Driver CH2 negative output

Driver CH2 positive output

Driver CH3 negative output

Driver CH3 positive output

Driver CH4 negative output

Driver CH4 positive output

(TOP VIEW)

POWVCC1

POWGND1

VO1(-)

1

2

3

4

5

6

7

8

9

24 IN1

23

22

21

CNT

IN2-1

VO1(+)

VO2(-)

IN2-2

20 BIAS

19

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

VO2(+)

VO3(-)

IN3

POWGND2 Power GND2

POWVCC2 CH3,4 power supply terminal

18 IN4

VO3(+)

VO4(-)

17 MUTE

PREVCC

REG-B

REG(+)

PREGND

MUTE

IN4

PRE,REG power supply terminal

Connect to external Tr. Base

Regulator terminal of output feedback

PRE Block and Regulator GND

MUTE terminal

16

15

14

13

PREGND

REG(+)

VO4(+) 10

POWGND2 11

POWVCC2 12

REG-B

PREVCC

CH4 input

IN3

CH3 input

BIAS

BIAS input terminal

CH2-2 input

CH2-1 input

Control input terminal

IN1 input

Figure 2. Pin Configuration

IN2-2

IN2-1

CNT

IN1

Block Diagram

Figure 3. Block Diagram

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Absolute Maximum Ratings (Ta=25°C)

Parameter

Symbol

Rating

15

Unit

V

Power Supply Voltage

Input Terminal Voltage

V_PREVCC,V_POWVCC1, V_POWVCC2

(1)

V_in1

V_PREVCC

1.1⁽²⁾

4.0⁽³⁾

V

Power Dissipation

Pd

W

Operating Temperature Range

Storage Temperature

Topr

Tstg

-40 to +85

-55 to +150

+150

°C

Junction Temperature

Tjmax

(1) Vin1 supplies the following terminals：IN1, CNT, IN2-1, IN2-2, BIAS, IN3, IN4, MUTE, REG(+)

(2) Rated for 70mm×70mm×1.6mm, one layer substrate (back copper foil 0mm×0mm),

Derated by 8.8mW/°C when operating above Ta=25°C.

(3) Rated for 70mm×70mm×1.6mm, four layer substrate (back copper foil 70mm×70mm),

Derated by 32.0mW/°C when operating above Ta=25°C.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as

short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a

special mode exceeding the absolute maximum ratings.

Recommended Operating Ratings (Ta=-40°C to +85°C)

Parameter

Symbol

V_PREVCC

Min

4.5

Typ

8.0

Max

14

Unit

V

PRE Driver Block Power Supply Voltage⁽⁴⁾

DC Motor Driver Power Supply Voltage⁽⁴⁾

Actuator Driver Power Supply Voltage⁽⁴⁾

V_POWVCC1

V_PREVCC

V

V_POWVCC2

V

(4) Consider power consumption when deciding power supply voltage.

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Electrical Characteristics （Unless otherwise noted, Ta=25°C, V_PREVCC=V_POWVCC1=V_POWVCC2=8V, V_BIAS=1.65V, R_L=8Ω）

Limits

Parameter

Symbol

I_Q

Unit

mA

Conditions

Min

Typ

30

Max

45

Quiescent Dissipation Current

< Driver>

－

No load

Output Offset Voltage (CH1,2)

Output Offset Voltage (CH3,4)

Maximum Output Amplitude (CH1,2)

Maximum Output Amplitude (CH3,4)

Closed-loop Voltage Gain (CH1,2)

Closed-loop Voltage Gain (CH3,4)

MUTE Terminal Low Level Input Voltage

MUTE Terminal High Level Input Voltage

CNT Terminal Low Level Input Voltage

CNT Terminal High Level Input Voltage

LDIN Terminal Voltage (SLED Input)

Internal Bias Voltage

V_OOF12

V_OOF34

V_OM12

V_OM34

G_V12

-100

-50

5.4

4.7

24.0

15.5

－

0

100

50

mV

V

6.0

5.3

25.7

17.5

－

V

27.4

19.5

0.5

－

dB

V

G_V34

V_ML

V_MH

2.0

－

V

V_CNTL

V_CNTH

V_LDIN

V_BIN

－

0.5

－

V

2.0

－

V

0.1

1.65

0.3

1.77

V

CNT=’Low’

CNT=’High’

1.53

V

< Regulator >

Output Voltage

V_REGOUT

V_RL

4.75

-40

5.0

0

5.25

20

V

mV

V

IREG=150mA

Load Regulation

IREG=0mA to 500mA, 5V setting

V_PREVCC=5.5V to 14V, 5V setting

Supply Voltage Regulation

REG(+) Terminal Voltage

-40

20

80

V_VCC

V_REGP

1.19

1.25

1.31

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Application Information

1. Driver Control

The mute function of the driver can be used by switching the MUTE and CNT terminals to High and Low levels.

The table below shows the logic.

INPUT

OUTPUT

MUTE

CNT

H

CH1,3,4

ACTIVE

CH2

H

LD ON

SL ON

L

H

L

MUTE

LD ON

MUTE

SL : SLED LD : LOADING

2. BIAS Drop Mute

If BIAS terminal (Pin 20) voltage becomes 0.7V (Typ) or less, output of all channels turns OFF.

Please set it to a minimum of 1.3V for typical use.

(However, the mute function doesn't work for CH2 when CNT=High. )

3. PREVCC Drop Mute

If PREVCC terminal voltage becomes 3.8V (Typ) or less, output of all channels turns OFF.

If PREVCC terminal voltage becomes 4.0V (Typ) or more, output of all channels turns ON.

4. Thermal shutdown circuit (TSD)

Thermal shutdown circuit is designed to turn off output of all channels when the junction temperature (Tj) reaches 175°C

(Typ) (with 25°C (Typ) hysteresis).

5. Regulator

Output voltage of the regulator (V_REGOUT) is set according to the following expression.

R1 R2

V^REGOUT V^REGP

R2

Please disable the oscillation prevention beforehand, and use the capacitor connected between the regulator output

(V_REGOUT) and PREGND after confirming parameters such as temperature characteristics in actual operation.

The power supply voltage fluctuation described in the Electrical Characteristics is obtained when V_REGOUTis 5V.

Please note that fluctuation bands increase from the described values if V_REGOUTis set to a value bigger than 5V.

PREVCC

BD8226EFV

REGB

Q1

V_REGOUT

R1

R2

C1

REG(+)

1.25V

V

V_REGP

PREGND

Please shorten this as much as possible.

Q1：PNP Transistor 2SB1188 Rank Q

C1:Electrolytic capacitor Rubycon YK 25V10µF

Figure 4. Regulator Block Diagram

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6. Input Sequence

Figure 5. Input sequence

Please use the below formula to determine the power supply voltage and the voltage for each input terminal.

PREVCC ≧ POWVCC1, POWVCC2, BIAS, MUTE, CNT, IN1, IN2-1, IN2-2, IN3, IN4

There is no special rule for power-up sequence if inputs are within the range of the above formula.

It is not recommended that terminal voltage for BIAS, MUTE, CNT, IN1, IN2-1, IN2-2, IN3, and IN4 exceed PREVCC

voltage.

If these voltages exceed PREVCC, overcurrent is generated in the internal ESD protection diode. (refer to Figure 6)

Figure 6. Internal Circuit Current

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Typical Application Circuit

REGOUT

C1

PREGND

TRACKING IN FOCUS IN MUTE

R2

R1

Q1

SLED / LOADING

Control

SLED IN LOADING IN

SPINDLE IN

24

23

22

21

20

19

18

17

16

15

14

13

REG(+)

IN1

CNT

IN2-1

IN2-2

BIAS

IN3

IN4

MUTE

PREGND

REG-B

PREVCC

Back exposed to dissipate heat on board

POWERGND

POWVCC1 POWGND1

VO1(-)

3

VO1(+)

4

VO2(-)

5

VO2(+)

6

VO3(-)

7

VO3(+)

8

VO4(-)

9

VO4(+)

10

POWGND2

11

POWVCC2

12

1

2

M

SPINDLE

CH1

SLED / LOADING

CH2

TRACKING

CH3

FOCUS

CH4

POWERGND POWERGND

Figure 7. Typical Application Circuit

Channel Example

CH1

SPINDLE

CH2

CH3

CH4

SLED/LOADING

TRACKING

FOCUS

External Part List

Component Name

Component Value

Product Name

Manufacturer

Rubycon

Rohm

C1

Q1

R1

R2

10μF

Rank Q

33kΩ

11kΩ

YK25V Series

2SB1188

MCR03 Series

Rohm

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Power Dissipation

(4) 4.0W

(3) 2.8W

(2) 1.7W

(1) 1.1W

Figure 8. Power Dissipation

Board size : 70mm×70mm×1.6mm

The board and the back exposure heat radiation board part of package are connected with solder.

Board (1): 1 layer board (copper foil 0mm × 0mm)

Board (2): 2 layer board (copper foil 15mm × 15mm)

Board (3): 2 layer board (copper foil 70mm × 70mm)

Board (4): 4 layer board (copper foil 70mm × 70mm)

Board (1) : θja = 113.6 °C/W

Board (2) : θja = 73.5 °C/W

Board (3) : θja = 44.6 °C/W

Board (4) : θja = 31.3 °C/W

For Ta=85℃:

Board (1) : Pd =0.57W

Board (2) : Pd =0.88W

Board (3) : Pd =1.46W

Board (4) : Pd =2.08W

CAUTION: Pd depends on the number of the PCB layers and area. Pd values are determined through measurement.

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Terminal Equivalent Circuit (with typical resistance and capacitance values)

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Application Board Schematic

Figure 9. PCB Schematic

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Application Board Pattern

Figure 10. Top Silkscreen Overlay

Figure 11. Top Layer

Figure 12. Bottom Silkscreen Overlay

Figure 13. Bottom Layer

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Operational Notes

1.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply terminals.

2.

Power Supply Lines

Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply

lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting

the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of

temperature and aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go

below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages

going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors

and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line

impedance.

5.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6.

7.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

Rush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

8.

9.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to

many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge

deposited in between pins during assembly to name a few.

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Operational Notes - continued

11. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to

the power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 14. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

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Ordering Information

B D 8

2

6 E F V

-

E 2

Packaging and forming specification

Product name

Package

EFV : HTSSOP-B24

E2: Embossed tape and reel

(HTSSOP-B24)

Marking Diagram

HTSSOP-B24 (TOP VIEW)

Part Number Marking

LOT Number

D 8 2 2 6 E F V

PIN 1 MARK

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Physical Dimension, Tape and Reel Information

Package Name

HTSSOP-B24

Tape

Embossed carrier tape (with dry pack)

Quantity

2000pcs

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Revision History

Date

Revision

002

Changes

3.JUL.2013

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

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Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD8226EFV-E2
厂家：	ROHM
描述：	CD Motor Driver, 驱动 CD 接口集成电路
文件：	总19页 (文件大小：919K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD8226EFV-E2 [ROHM]

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