BD82A16MUF-M (开发中) [ROHM]
This IC is a white LED driver for LCD backlight. It has 6ch current drivers for LED drive, making it ideal for high brightness LED drive. LED pin maximum voltage is 50V, making it suitable for driving large LCD panels.What is Nano Cap™?Nano Cap™ is a combination of technologies which allow stable operation even if output capacitance is connected with the range of nF unit.;型号: | BD82A16MUF-M (开发中) |
厂家: | ROHM |
描述: | This IC is a white LED driver for LCD backlight. It has 6ch current drivers for LED drive, making it ideal for high brightness LED drive. LED pin maximum voltage is 50V, making it suitable for driving large LCD panels.What is Nano Cap™?Nano Cap™ is a combination of technologies which allow stable operation even if output capacitance is connected with the range of nF unit. CD |
文件: | 总47页 (文件大小:1516K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Nano CapTM
Datasheet
6ch White LED Driver Built-in Current Driver
BuckBoost DC/DC Converter for Automotive
BD82A16MUF-M
General Description
Key Specifications
This IC is a white LED driver for LCD backlight.
◼ Input Operating Voltage Range:
3.0 V to 48 V
It has 6ch current drivers for LED drive, making it ideal for
high brightness LED drive. LED pin maximum voltage is
50 V, making it suitable for driving large LCD panels.
The dimming is controlled by the PWM signal and can be
set up to 20,000: 1@100 Hz. It also supports analog
dimming, and can accommodate even higher brightness
ranges by combining with PWM dimming. DC/DC
converters can be controlled for BuckBoost applications,
and the input operating voltage range is 3.0 V to 48 V.
◼
Output LED Current Absolute Accuracy:
±5.0 %@80 mA
◼ DC/DC Oscillation Frequency: 200 kHz to 2420 kHz
◼ Operating Temperature:
◼ LED Maximum Current:
◼ LED Maximum Dimming Ratio: 20,000: 1@100 Hz
◼ LED1 to LED6 Pin Maximum Voltage: 50 V
-40 °C to +125 °C
150 mA/ch
Package
VQFN32FBV050
W (Typ) x D (Typ) x H (Max)
5.0 mm x 5.0 mm x 1.0 mm
Features
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
Nano CapTM Integrated(Note 1)
AEC-Q100 Qualified(Note 2)
Functional Safety Supportive Automotive Products
Current Driver for LED Drive 6ch
Current Mode BuckBoost DC/DC Converters
Load Switch (M1) Control Pin
PWM Dimming (20,000: 1@100 Hz, 100 Hz to 25 kHz)
Analog + PWM Mix Dimming Available
Spread Spectrum Function
DC/DC Converter Oscillation Frequency External
Synchronization Function
Applications
◼
◼
◼
◼
◼
Automotive CID (Center Information Display) Panel
Navigation
Cluster Panel
HUD (Head Up Display)
Other Small and Medium Sized LCD Panels for
Automotive
◼
◼
◼
LSI Protect Functions (UVLO, OVP, TSD, OCPL)
LED Anode/Cathode Short Circuit Protection Function
LED Open/Short Protection Function
(Note 1) Nano CapTM is a trademark or a registered trademark of ROHM Co., Ltd. Nano Cap™ is a combination of technologies which allow stable operation
even if output capacitance is connected with the range of nF unit.
(Note 2) Grade 1
Typical Application Circuit
VCC
RCSH
REG50
M1
CVCC
EN
CCP2
D1
32 31 30 29 28 27 26 25
EXP-PAD
EXP-PAD
CREG25
REG25
REG50
RT
VDISC
OVP
24
23
1
2
3
4
5
6
7
8
RBT
M2
CREG50
BOOT 22
OUTH 21
SW 20
ROVP1
L1
ROVP2
D3
RRT
SYNC
PWM
SYNC
PWM
PLSET
COMP
GND
VOUT
CBT
EXP-PAD
RPLSET2
ROUTH
PGND 19
OUTL 18
CSL 17
D2
CPC RPC
RPLSET1
M3
RG
EXP-PAD
EXP-PAD
RCSL
9
10 11 12 13 14 15 16
RDIMSEL2
RDIMSEL1
Figure 1. BuckBoost Application Circuit Diagram
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
○This product is protected by U.S. Patent No.7,235,954, No.7,541,785, No.7,944,189 and No.10,068,511.
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BD82A16MUF-M
Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Typical Application Circuit...............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Pin Configuration ............................................................................................................................................................................3
Pin Descriptions..............................................................................................................................................................................3
Block Diagram ................................................................................................................................................................................5
Description of Blocks ......................................................................................................................................................................6
Absolute Maximum Rating............................................................................................................................................................11
Thermal Resistance......................................................................................................................................................................11
Recommended Operating Conditions...........................................................................................................................................12
Operating Conditions (External Constant Range).........................................................................................................................12
Electrical Characteristics...............................................................................................................................................................13
Typical Performance Curves.........................................................................................................................................................17
Functional Descriptions ................................................................................................................................................................19
PCB Application Circuit Diagram ..................................................................................................................................................35
List of External Components.........................................................................................................................................................36
Power Consumption Calculation Example....................................................................................................................................38
I/O Equivalence Circuit .................................................................................................................................................................39
Operational Notes.........................................................................................................................................................................40
Ordering Information.....................................................................................................................................................................42
Marking Diagram ..........................................................................................................................................................................42
Physical Dimension and Packing Information...............................................................................................................................43
Revision History............................................................................................................................................................................44
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Pin Configuration
(TOP VIEW)
EXP-PAD
EXP-PAD
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
REG25
REG50
RT
VDISC
OVP
BOOT
OUTH
SW
SYNC
PWM
PLSET
COMP
GND
EXP-PAD
PGND
OUTL
CSL
9
10
11
12
13
14
15
16
EXP-PAD
EXP-PAD
Pin Descriptions
Signal
type
(Note 1)
Pin
No.
Pin
Name
Function
Internal reference voltage 1: Used as the reference voltage for the internal circuit and charge
pump.
1
2
3
REG25
REG50
RT
A
A
A
Internal reference voltage 2: Used as the reference voltage for the internal circuit. 5 V is generated
and output by setting the EN pin to High. Connect a capacitance of 2.2 μF for phase compensation.
Resistor connection for oscillation frequency setting: The oscillation frequency (fOSC) of DC/DC
converter can be set by connecting a resistor (RRT) between the RT pin and the GND pin.
External synchronization frequency input / SSCG setting: The internal oscillation frequency can
be externally synchronized by inputting an external clock signal to the SYNC pin before the Self
Diagnosis is completed. When using spread spectrum mode (SSCG), short the SYNC pin and the
REG50 pin beforehand.
4
SYNC
I
PWM dimming signal: The LED current can be controlled according to On Duty of the input PWM
signal.
5
6
PWM
I
Switching pulse number setting: Addition pulse function is provided to stabilize DC/DC converter
output voltage even when PWM Duty is low. The number of switching pulses to be added can be set
by the resistance value connected to the PLSET pin.
PLSET
A
Phase compensation capacitor connection: The reference voltage and LED pin voltage
generated by REF Voltage block are compared and output by Error AMP. Connect a filter for phase
compensation.
7
COMP
A
Small Signal Ground: Use to ground for the external components connected to the REG25,
REG50, RT, PLSET, COMP, ISET, DIMSEL, and OVP pins.
8
9
GND
ISET
A
A
Resistor connection for LED current setting: LED current (ILED) can be set by connecting a
resistor (RISET) between the ISET pin and the GND pin.
DC dimming setting: The point at which PWM dimming and DC dimming are switched can be set
by the resistor connected between the DIMSEL pin and the GND pin. When using only PWM
dimming, short the DIMSEL pin with the GND pin.
10 DIMSEL
A
LED cathode connection 1: Open drain output of the current driver ch1 for LED drive. Connect to
the LED cathode.
11
12
13
LED1
LED2
LED3
P
P
P
LED cathode connection 2: Open drain output of the current driver ch2 for LED drive. Connect to
the LED cathode.
LED cathode connection 3: Open drain output of the current driver ch3 for LED drive. Connect to
the LED cathode.
(Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units P: High current signal susceptible to impedance, including transient current.
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Pin Descriptions – continued
Signal
type
(Note 1)
Pin
No.
Pin
Name
Function
LED cathode connection 4: Open drain output of the current driver ch4 for LED drive. Connect to
the LED cathode.
14
15
16
LED4
LED5
LED6
P
P
P
LED cathode connection 5: Open drain output of the current driver ch5 for LED drive. Connect to
the LED cathode.
LED cathode connection 6: Open drain output of the current driver ch6 for LED drive. Connect to
the LED cathode.
Overcurrent protection detection input: The current flowing through Low side FET (M2) is
converted to voltage by the low side current detection resistor (RCSL) and detected by the CSL pin.
When the overcurrent protection (OCPL) is activated, DC/DC converters are switched OFF.
17
CSL
A
Low side FET gate signal: Switching signal output of DC/DC converter. The OUTL pin should be
connected to Low side FET (M3) gate.
18
19
20
21
22
OUTL
PGND
SW
P
P
P
P
P
Large current ground: Use for ground for external components connected to the CSL and OUTL
pins.
High side FET source signal: Switching signal output of DC/DC converter. The SW pin should be
connected to High side FET (M2) source.
High side FET gate signal: Switching signal output of DC/DC converter. The OUTH pin should be
connected to High side FET (M2) gate.
OUTH
BOOT
High side FET gate Power Supply: A power supply that drives the gate of the High side FET (M2).
Connect the capacitance between the BOOT pin and the SW pin.
Overvoltage protection and short circuit protection detection input: When OVP pin voltage
rises to 1.0 V or more, overvoltage protection (OVP) is activated, and DC/DC converters are
switched OFF. If OVP pin voltage is 0.3 V or less for 13.1 ms, Short Circuit Protection (SCP) is
activated, and both DC/DC converter and the current driver are turned OFF.
23
OVP
A
VOUT discharge: Connects to the output of DC/DC converters. When UVLO, TSD, or SCP
protective operation is performed, or when PWM Low section is monitored and the operation OFF
status is detected, DC/DC output voltage is discharged from the VDISC pin.
24
25
26
VDISC
FAIL
P
O
P
Error output flag: Outputs the status of protective operation from the FAIL pin. Since this pin is
open drain outputs, we recommend pulling them up to the REG50 pin.
Output for driving the load switch gate: This is the signal output for driving the gate of the load
switch. When the input overcurrent protection (OCPH) is activated, the load switch is turned OFF as
LDSW pin voltage = VCC voltage.
LDSW
Input current detection input: The input current is converted to voltage by the input current
detection resistor (RCSH) connected between the VCC-CSH pin, and detected by the CSH pin. Turns
the load switch OFF when the input overcurrent protection is activated.
27
28
29
CSH
VCC
EN
A
P
I
Power supply voltage input: The input operating voltage range is 3.0 V to 48 V, but when the IC is
started, VCC ≥ 5.0 V should be used. The decoupling capacitor (CVCC) between the VCC pin and
the GND pin should be close to the IC pin.
Enable input: The EN pin is turned High to activate the internal circuit. The EN pin is judged as Low
level at 0.5 V or less, and judged as High level at 2.3 V or more. Avoid using a constant two state
input (0.5 V ≤ VEN ≤ 2.3 V).
30
31
CP
P
P
Charge pump output: Connect a capacitance (CCP1) between the CP pin and the PGND pin.
Flying capacitor connection + side: Connect a capacitance (CCP2) between the CPP pin and the
CPM pin.
CPP
Flying capacitor connection - side: Connect a capacitance (CCP2) between the CPP pin and the
CPM pin.
32
CPM
P
The center EXP-PAD should be connected to the board ground.
EXP-
PAD
-
-
The center EXP-PAD and corner EXP-PAD are shorted inside the packaging.
(Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units, O: Output signal to other units, P: High current signal susceptible to
impedance, including transient current.
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Block Diagram
VCC
CSH
LDSW
VOUT
Discharge
EN
VDISC
BOOT
LDSW
Driver
VREF
REG50
REG25
PROTECT
OUTH
SW
PROTECT
Additional
Pulse
DC/DC
Control
LOGIC
PLSET
RT
REG50
OSC
SLOPE
+
OUTL
PGND
CSL
-
SSCG
PWM
COMP
SYNC
COMP
Error
AMP
-
-
+
LED1
LED2
LED3
LED4
LED5
LED6
Soft
Start
LDSW
Driver
Minimum
Channel
Selector
PROTECT
UVLO
DC/DC
Control
LOGIC
ꢀꢀꢀꢀꢀꢀꢀFAIL
TSD
SCP
OCPH
FAIL
ISET SCP
OCPL
OVP
OPEN Det
SHORT Det
TW
OVP
Current
Driver
Internal
CLK
REF
Voltage
CP
PWM
Dimming
Control
DIMSEL
ISET
CPP
ISET
CH5 CH6
CH1 CH2 CH3 CH4
Charge
Pump
CPM
CP
Current Driver
GND
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BD82A16MUF-M
Description of Blocks
Unless otherwise stated, the value in the sentence is the typical value.
1 VREF
Internal reference voltage circuit. By setting the EN pin to High, 5 V is generated and output to the REG50 pin. REG50
voltage is used as the power supply for the internal circuit. Also, this is used to fix each input pin to High voltage outside
the IC. Connect CREG50 = 2.2 μF to the REG50 pin as the capacitance for the phase compensation. Note that if CREG50 is
not connected, unstable operation such as oscillation will occur.
2 LDSW Driver
Input overcurrent protection circuit. If the voltage between the VCC-CSH pin is 0.2 V or more and continues for 10 μs or
more, the input overcurrent protection is activated, and the load switch (M1) is turned OFF as LDSW pin voltage = VCC
voltage. Then, after 13.1 ms elapses, the load switch is turned ON. At this time, if the voltage between VCC-CSH is 0.2 V
or more, the load switch is turned OFF again. If the voltage between VCC-CSH is 0.2 V or less, Self Diagnosis is performed
and restarted. For Self Diagnosis, refer to "3 Startup Characteristics and Effective Section of Each Protection Function".
The FAIL pin goes Low when the input overcurrent protection is detected.
3 VOUT Discharge
Output voltage discharge circuit. The LEDs may flicker if activated with charges remaining on VOUT. Therefore, VOUT
must be discharged at startup. Discharge times may be prolonged only by discharge paths such as the resistor for OVP
setting, so an output voltage discharge circuit (VOUT discharge function) is provided. Residual charges in the output are
discharged when DC/DC converters are turned OFF (when the EN falls or the protective function is activated).
4 OSC (Oscillator)
Oscillation frequency generator. The oscillation frequency (fOSC) of DC/DC converter can be set by connecting a resistor
for oscillation frequency setting (RRT) between the RT pin and ground. In addition, the oscillation frequency of DC/DC
converter can be externally synchronized by inputting the external synchronization frequency (fSYNC) to the SYNC pin. Input
the clock signal to be input from the SYNC pin before the Self Diagnosis is completed. For Self Diagnosis, refer to "3 Startup
Characteristics and Effective Section of Each Protection Function".
5 SSCG (Spread Spectrum Clock Generator)
Spread spectrum circuit. The spread spectrum function (SSCG) is activated by shorting the SYNC pin and the REG50 pin.
Noise peaks can be reduced by periodically changing the oscillation frequency by SSCG. The fluctuation range of the
frequency due to SSCG is from 100 % to 92 % of the set oscillation frequency. The oscillation frequency fluctuation cycle
is 128/set oscillation frequency.
6 SLOPE
This circuit generates a saw wave that serves as the source of the switching pulse of DC/DC converter. SLOPE output
signal and COMP pin voltage are compared and a switching pulse is generated.
7 Minimum Channel Selector
Selector circuit for detecting LED pin voltages. Selects the lowest pin voltage among LED1 to LED6 pin voltages and input
it in Error AMP.
8 Error AMP (Error Amplifier)
This is an error amplifier that takes the smallest values of the LED1 to LED6 pin voltage and LED control voltage as inputs.
Phase compensation can be set by connecting a resistor and a capacitor to the COMP pin.
9 Soft Start
Soft start circuit for DC/DC converters. This function is used to suppress a steep increase in the coil current at startup and
an overshoot in the output voltage. Controls the change in switching Duty by limiting the rising edge of the output of Error
AMP (COMP pin voltage).
10 PWM COMP (PWM Comparator)
This comparator compares COMP pin voltage, which is the output of Error AMP, with SLOPE output signal. Controls the
duty of the switching pulse of DC/DC converter.
11 Additional Pulse
This circuit adds switching pulses for DC/DC converters. With the Additional pulse function, the LED current can be supplied
stably even when the PWM dimming ratio decreases.
12 DC/DC Control LOGIC
This circuit generates the final logic of Low side FET gate signal output from the OUTL pin.
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Description of Blocks - continued
13 Internal CLK
This circuit generates the internal reference clock. It is a clock of 20 MHz and used as a counter or sampling frequency.
14 Dimming Control
This circuit controls the dimming ratio during PWM dimming. PWM dimming and DC dimming can be automatically switched
PWM dimming and DC dimming can be automatically switched and controlled by applying a voltage (resistor division of
REG50) to the DIMSEL pin. This provides both minute dimming (PWM dimming) at low brightness levels and support for
high brightness ranges (DC dimming).
15 Charge Pump
Charge pump circuit. The charge pump output voltage is used for the output drive voltage of the current driver, and can
output a stable LED current even when the VCC input voltage is low. By connecting the capacitance (CCP1) between the
CP pin and ground and the capacitance (CCP2) between the CPP-CPM pin, a voltage twice the REG25 pin voltage can be
output from the CP pin. 10 μF is recommended for CCP1 and 2.2 μF is recommended for CCP2. When the charge pump
function is not used, do not connect capacitance between the CPP-CPM pin and short-circuit the CP pin with the REG50
pin.
16 Current Driver / ISET
Current driver circuit for lighting the LED. The LED current can be set by connecting a resistor to the ISET pin.
17 PROTECT
Outputs the status of protective operation from the FAIL pin. Since this pin are open drain outputs, connect them to the
REG50 pin with resistors. If the protection status is not monitored, turn the FAIL pin to OPEN or connect to the GND pin.
17.1 UVLO (Under Voltage Lockout)
Under Voltage Lockout. When the VCC is 2.8 V or less or the REG50 pin voltage is 2.7 V or less, Under Voltage
Lockout (UVLO) is activated, and the load switch (M1), DC/DC converter, and current driver turn OFF. When VCC
becomes 3.2 V or more and the REG50 pin voltage becomes 3.1 V or more, UVLO is released and the IC restarts
from Self Diagnosis. When a UVLO is detected, the outputs of the FAIL pin do not change. When the FAIL pin is
pulled up to REG50, FAIL pin voltage will also drop as REG50 decreases.
17.2 TSDLED (Thermal Shutdown for Current Driver)
This is a temperature protection circuit that monitors the vicinity of the current driver on the chip. Prevents chip
temperature from rising due to abnormal output current. When the chip temperature rises to 175 °C or more, the
temperature protection circuit (TSDLED) is activated, the load switch (M1), DC/DC converter, and current driver are
turned OFF, and the FAIL pin is turned Low. When the chip temperature falls 150 °C or less, TSDLED is released,
the IC restarts from Self Diagnosis, and the FAIL pin returns to High.
17.3 TSDREG (Thermal Shutdown for REG50)
This is a temperature protection circuit that monitors the vicinity of the REG50 pin on the chip. Prevents chip
temperature rising due to the REG50 pin failure. When the chip temperature rises to 175 °C or more, the temperature
protection circuit (TSDREG) is activated, and REG50 pin voltage, load switch (M1), DC/DC converter, and current
driver turn OFF. When the FAIL pin is pulled up to the REG50 pin, FAIL pin voltage drop as REG50 pin voltage is
turned OFF, and the FAIL pin is output to the Low level. When the FAIL pin is pulled up to an external power supply,
the FAIL pin is output to High. When the chip temperature falls 150 °C or less, TSDREG is released and the IC
restarts from Self Diagnosis.
17.4 TW (Thermal Warning)
Thermal Warning Circuit. When the chip temperature rises to 140 °C or more, the Thermal Warning Circuit (TW)
activates and the FAIL pin goes Low. When the chip temperature falls 130 °C or less, the TW is released and the
FAIL pin returns to High.
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17. PROTECT – continued
17.5 OCPL (Over Current Protection for Low side)
The voltage is detected by the low side current detection resistor (RCSL) for the current flowing through Low side FET
(M2). When CSL pin voltage rises to 0.3 V or more, the overcurrent protection (OCPL) is activated and only the
switching of DC/DC converter is stopped. If CSL pin voltage falls less than 0.3 V, the overcurrent protection is
released and switching resumes. When the OCPL is detected, the outputs of the FAIL pin do not change.
17.6 OVP (Over Voltage Protection)
Output overvoltage protection circuit. When OVP pin voltage (resistor division of DC/DC converter output voltage)
becomes 1.0 V or more, the output overvoltage protection circuit (OVP) activates and only the switching of DC/DC
converter is stopped. When OVP pin voltage falls 0.95 V or less, OVP is released. The FAIL pin goes Low when
OVP is detected.
17.7 OPEN Det (LED Open Detection)
LED open protection circuit. When any of LED1 to LED6 pin voltages is 0.3 V or less and OVP pin voltage is 1.0 V
or more, the LED open protection (OPEN Det) is activated and the current driver is latched OFF only for the
corresponding LED column. LED open protection is released when VEN = Low or UVLO is detected. When LED open
is detected, the FAIL pin goes Low.
17.8 SHORT Det (LED Short Detection)
LED short protection circuit. When LED pin voltage is higher than the threshold for 13.1 ms, the LED short protection
(SHORT Det) is activated and the current driver is latched OFF only for the corresponding LED column. The counter
is reset when LED pin voltage does not satisfy the detection condition prior to the LED short protection being activated.
The short detection threshold is 4.5 V. LED short protection is released when VEN = Low or a UVLO is detected.
Counters of 13.1 ms are counted up only when Duty of LED current is ON. Therefore, the duration until LED short
protection is detected varies depending on the input PWM Duty and PWM-DC dimming switching point. The FAIL
pin goes Low when LED short is detected. LED short protection is detectable when ON pulse width of the LED current
is 20 μs or more.
17.9 SCP (Short Circuit Protection)
Short Circuit Protection circuit. If any of the LED1 to LED6 pin is 0.3 V or less or OVP pin voltage is 0.3 V or less for
13.1 ms, the Short Circuit Protection (SCP) is activated, and the load switch (M1), DC/DC converter, and current
driver turn OFF. However, the counters are reset when each pin voltage no longer satisfies the requirement prior to
the SCP is activating. The SCP is released when VEN = Low or a UVLO is detected. When SCP is detected, the FAIL
pin goes Low.
DC/DC converters also attempt to output a higher voltage because the grounded LED pin voltage (lowest LED pin
voltage) is controlled to be VLEDCTL. Depending on the power supply voltage and load conditions, the OVP pin may
become 1.0 V or more prior to the SCP being activated, and the LED open protection may be activated first. In this
case, the current driver will be turned OFF only in the grounded LED pin, but the LEDs will remain lighting with the
current control lost because of a short circuit as well. Even when LED open protection is detected, the FAIL pin goes
Low. Abnormality can be detected by monitoring this.
17.10 OCPH (Over Current Protection for High side) / LDSW Driver
Input overcurrent protection circuit. If a condition in which the voltage between the VCC-CSH pin is 0.2 V or more
continues for 10 μs or more, the input overcurrent protection (OCPH) is activated, and the load switch (M1), DC/DC
converter, and current driver turn OFF. Then, after 13.1 ms elapses, the load switch is turned ON. At this time, if the
voltage between VCC-CSH is 0.2 V or more, the load switch, DC/DC converter, and current driver are turned OFF
again. If the voltage between VCC-CSH is less than 0.2 V, Self Diagnosis is performed and restarted. For Self
Diagnosis, refer to "3 Startup Characteristics and Effective Section of Each Protection Function". When the input
overcurrent protection is detected, the FAIL pin goes Low.
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BD82A16MUF-M
17 PROTECT – continued
17.11 ISET Pin Fault Protection (ISET-GND Short Circuit Protection)
ISET pin fault protection circuit. When the resistance value connected to the ISET pin becomes 1 kΩ or less, ISET
error protection is activated, and the load switch (M1), DC/DC converter, and current driver are turned OFF. When
the resistor connected to the ISET pin becomes 15 kΩ or more, ISET error protection is released, and the load switch
(M1), DC/DC converter, and current driver turn ON. When ISET-GND short protection is detected, the FAIL pin goes
Low.
17.12 OVP Pin Fault Protection
OVP pin fault protection circuit. If OVP pin voltage is 2.3 V or more or 0.2 V or less or VDISC pin voltage is 47.5 V
or more in the Self Diagnosis status after the EN pin starts, OPEN/SHORT error of the resistor connected to OVP is
detected and OVP pin fault protection is activated. At this time, the load switch (M1), DC/DC converter, and current
driver turn OFF. When VEN = Low or a UVLO is detected, OVP pin fault protection is released. When OVP pin fault
protection is detected, the FAIL pin is set to Low.
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BD82A16MUF-M
Description of Blocks - continued
Detect Conditions and Operation at Detection of Each Protection Function (All values in the table are typical values)
Detect Operation
Detect Condition
No.
1
Function
Load
Switch Switching
DC/DC Current
FAIL
(Note 1)
[Detect]
[Release]
Driver
OFF
VCC ≥ 3.2 V
and
Under Voltage
VCC ≤ 2.8 V
OFF
OFF
High
Low
Lockout
(UVLO)
or VREG50 ≤ 2.7 V
VREG50 ≥ 3.1 V
Thermal
2
3
4
5
6
OFF
OFF
OFF
OFF
OFF
OFF
Shutdown
(TSDLED)
Thermal
Shutdown(Note 2)
(TSDREG)
Tj ≥ 175 °C
Tj ≥ 175 °C
Tj ≤ 150 °C
Tj ≤ 150 °C
Low
(Note 2)
Thermal
Warning
(TW)
ON
ON
ON
ON
OFF
OFF
ON
ON
ON
Tj ≥ 140 °C
VCSL ≥ 0.3 V
VOVP ≥ 1.0 V
Tj ≤ 130 °C
VCSL < 0.3 V
VOVP ≤ 0.95 V
Low
High
Low
Overcurrent
Protection
(OCPL)
Overvoltage
Protection
(OVP)
Detects
VEN = Low
or
LED Open
Protection
(OPEN Det)
Detect
LED
Pin OFF
VLEDn ≤ 0.3 V
and VOVP ≥ 1.0 V(Note 6)
Latch
Low
7
8
9
ON
ON
ON
ON
UVLO
Detects
VEN = Low
or
Detects
VLEDn ≥ 4.5 V
for 13.1 ms or more(Note 3)(Note 6)
Detect
LED
Pin OFF
LED Short
Latch
Low
Protection
(SHORT Det)
UVLO
Detects
VEN = Low
or
Detects
Short Circuit
Latch
Low
OFF
OFF
OFF
VLEDn ≤ 0.3 V or VOVP ≤ 0.3 V
for 13.1 ms or more(Note 6)
Protection
(SCP)(Note 4)
UVLO
Input
Detects
VCC-VCSH
< 0.2 V
OFF
OFF
Overcurrent
10
11
OFF
OFF
VCC-VCSH ≥ 0.2 V
for 10 μs or more
Low
Low
(Note 5)
(Note 5)
Protection
(OCPH)(Note 4)
ISET Pin
OFF
OFF
OFF
OFF
Fault Protection
(ISET SCP)
RISET ≤ 1.0 kΩ
RISET ≥ 15 kΩ
At Self Diagnosis
VOVP ≥ 2.3 V
Detects
VEN = Low
or
OVP Pin
Latch
Low
OFF
12
Fault Protection
or VOVP ≤ 0.2 V
or VVDISC ≥ 47.5 V
UVLO
(Note 1) When the EN pin is Low, if FAIL is pulled up to the REG50 pin, FAIL = Low. When FAIL is pulled up to an external power supply, FAIL = High.
(Note 2) Thermal shutdown (TSDREG) detects heat generation in the event of the REG50 pin failure and turns all circuit OFF, including the REG50 pin. When FAIL
is pulled up to the REG50 pin, FAIL = Low. When FAIL is pulled up to an external power supply, FAIL = High.
(Note 3) LED pin voltage of at least 1ch shall be less than VLEDCTL(Min) x 1.1. When LED pin voltages of all channels are 1.4 V or more, the LED short protection does
not operate. In addition, since the 13.1 ms counter is counted up only when Duty of the LED current is ON, the time until SHORT Det is detected varies
depending on PWM Duty.
(Note 4) When Short Circuit Protection (SCP) and input overcurrent protection (OCPH) are detected at the same time, the operation of input overcurrent protection
takes precedence.
(Note 5) When 13.1 ms elapses after the load switch is turned OFF, the load switch turns ON. At this time, when the voltage between VCC-CSH ≥ 0.2 V, the load
switch is turned OFF again. When the voltage between VCC-CSH < 0.2 V, Self Diagnosis is performed and restarted. For Self Diagnosis, refer to "3 Startup
Characteristics and Effective Section of Each Protection Function".
(Note 6) n = 1 to 6
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BD82A16MUF-M
Absolute Maximum Rating (Ta = 25 °C)
Parameter
Symbol
VOVP, VVDISC, VLDSW, VCSH, VCC
VBOOT, VOUTH
Rating
Unit
V
OVP, VDISC, LDSW, CSH, VCC Pin Voltage
BOOT, OUTH pin voltage
-0.3 to +50
-0.3 to +55
-0.3 to +7.0
V
Voltage Between VCC-LDSW Pin
VCC - VLDSW
V
LED1, LED2, LED3,
VLED1, VLED2, VLED3,
-0.3 to +50
V
LED4, LED5, LED6 Pin Voltage
RT, PLSET, COMP, ISET, DIMSEL,
CSL, OUTL Pin Voltage
VLED4, VLED5, VLED6
VRT, VPLSET, VCOMP, VISET
VDIMSEL, VCSL, VOUTL
,
-0.3 to VREG50
-0.3 to +7.0
-0.3 to +7.0
V
V
V
REG25, REG50 Pin Voltage
VREG25, VREG50
SYNC, PWM, FAIL,
VSYNC, VPWM, VFAIL,
EN, CP, CPP, CPM Pin Voltage
VEN, VCP, VCPP, VCPM
Storage Temperature Range
Tstg
-55 to +150
150
°C
°C
Maximum Junction Temperature
Tjmax
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
VQFN32FBV050
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
97.3
10.0
30.7
7.0
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A (Still-Air). The BD82A16MUF-M chip is used.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Thermal Via(Note 5)
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connect with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern.
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BD82A16MUF-M
Recommended Operating Conditions
Operating Range
Parameter
Symbol
Unit
Min
3.0
200
0.1
Max
48
Power Supply Voltage(Note 1)
VCC
fOSC
V
DC/DC Oscillation Frequency Range
PWM Frequency Range(Note 2)
2420
25
kHz
kHz
fPWM
External Synchronized
Frequency Range(Note 3)
External Synchronized
Pulse Duty Range(Note 4)
Higher of 200
or fOSC x 0.8
Lower of 2420
or fOSC
fSYNC
kHz
%
fSDUTY
40
60
LED Current Setting Range(Note 5)
ILED
50
150
mA
°C
Operating Temperature
Topr
-40
+125
(Note 1) When IC are started, VCC ≥ 5.0 V should be set.
VCC (Min) = 3.0 V is the minimum value of VCC that can operate the IC alone. The minimum value of power supply voltage that can be set varies depending
on the connected LED load and external components.
(Note 2) Generally, flickering of LEDs is easier to see when the dimming frequency is set lower than 100 Hz. Check with the actual application evaluation.
(Note 3) When the external synchronization function is not used, connect the SYNC pin to the REG50 pin (SSCG = ON) or connect to the GND pin (SSCG = OFF)
or OPEN (SSCG = OFF).
(Note 4) When using the external synchronous function, switching from the external synchronous state to the internal oscillation frequency is not possible during
stable operation.
(Note 5) The amount of current per channel. Set the LED current so that the maximum junction temperature (Tjmax) is not exceeded.
Operating Conditions (External Constant Range)
Operating Range
Parameter
Symbol
Unit
Min
0.10
1.0
Typ
0.22
2.2
31.2
33.3
-
Max
0.47
4.7
50.0
45.0
-
REG25 Capacitance
CREG25
CREG50
RISET
RRT
μF
μF
kΩ
kΩ
μF
μF
μF
μF
μF
kΩ
kΩ
REG50 Capacitance
LED Current Setting Resistor
Oscillation Frequency Setting Resistor
Input Capacitance 1
18.0
4.0
CVCC
1(Note 6)
10(Note 6)
20(Note 6)
4.7
(Note 7)
Input Capacitance 2
CINVCC
CVOUT
CCP1
-
-
Output Capacitance
-
100
20.0
4.7
20
Charge Pump Capacitance 1
Charge Pump Capacitance 2
Resistor for the OVP Pin Setting (Low Side)
Resistor for the OVP Pin Setting (High Side)
10.0
2.2
-
CCP2
1.0
ROVP1
ROVP2
10
300
-
800
Resistor for Unused Channels Setting
(Low Side)(Note 8)
RLED1
10
20
30
kΩ
Resistor for Unused Channels Setting
(High Side)(Note 8)
RLED2
40
100
180
kΩ
(Note 6) Set the capacitance so that it does not fall below the minimum value in consideration of temperature characteristics, DC bias characteristics, etc.
(Note 7) CINVCC means the sum of CIN and CVCC. If a capacity of 10 μF or more is connected to CVCC, the capacity of CIN is not required.
(Note 8) The ratio of RLED1 to RLED2 should be between 1:4 and 1:6.
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BD82A16MUF-M
Electrical Characteristics
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)
Standard Value
Unit
V
Conditions
Parameter
VCC Voltage at Startup
Operating VCC Voltage(Note 1)
Circuit Current
Symbol
VCC_start
VCC_active
ICC
Min
5.0
Typ
Max
48.0
12.0
12.0
-
V
3.0
48.0
20
VEN = 5 V, VSYNC = 0 V,
VPWM = 0 V, CVCC = 10 μF,
RRT = OPEN, RISET = OPEN
-
-
mA
μA
Standby Current
IST
0
20
VEN = Low
[REGURATOR]
IREG50 = 5 mA load,
Reference Voltage
VREG50
4.5
5.0
5.5
V
CREG50 = 2.2 μF
[DC/DC Converter]
OUTH Pin High Side ON Resistor
OUTH Pin Low Side ON Resistor
OUTL Pin High Side ON Resistor
OUTL Pin Low Side ON Resistor
LED Control Voltage 1
RONHH
RONHL
2.5
0.8
5.0
2.5
10.0
5.5
Ω
Ω
Ω
Ω
V
V
IOUTH = 10 mA load
IOUTH = 10 mA input
IOUTL = 10 mA load
IOUTL = 10 mA input
RISET = 50 kΩ
RONLH
3.7
7.5
15.0
5.0
RONLL
1.2
2.5
VLEDCTL1
VLEDCTL2
0.4
0.5
0.6
LED Control Voltage 2
0.68
0.83
0.98
RISET = 18 kΩ
RISET = 18 kΩ,
COMP Sink Current
ICOMPSINK
170
250
330
μA
μA
VCOMP = 1.0 V,
VLEDn = 1.5 V (n = 1 to 6)
RISET = 18 kΩ,
COMP Source Current
ICOMPSOURCE
-330
-250
-170
VCOMP = 1.0 V,
VLEDn = 0.0 V (n = 1 to 6)
Oscillation Frequency 1
Oscillation Frequency 2
Max Duty(Note 2)(Note 3)
fOSC1
fOSC2
DUTY_MAX
tSWOFF
kHz
kHz
%
RRT = 33.3 kΩ
RRT = 4.0 kΩ
RRT = 33.3 kΩ
RRT = 33.3 kΩ
270
1980
96.5
-
300
2200
98.0
67
330
2420
-
Switching OFF Time(Note 3)
[Charge Pump]
130
ns
Charge Pump Frequency
fCP
250.0
4.5
312.5
5.0
375.0
5.5
kHz
V
CCP2 = 2.2 μF
CCP1 = 10 μF, CCP2 = 2.2 μF,
Charge Pump Output Voltage
VCP
VREG50 = 3.0 V
(Note 1) The minimum value of 3.0 V for VCC is the minimum value of VCC that can operate the IC alone. The minimum value of power supply voltage that can be
set varies depending on the connected LED load and external components.
(Note 2) For the switching Duty required for applications, refer to the 2.13 Switching Duty Required for Applications.
(Note 3) Max Duty can be calculated using (1-tSWOFF) x fOSC
.
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BD82A16MUF-M
Electrical Characteristics – continued
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)
Standard Value
Typ
Parameter
[PROTECT]
Symbol
Unit
Conditions
Min
Max
UVLO Release Voltage (VCC)
UVLO Detect Voltage (VCC)
UVLO Release Voltage (REG50)
UVLO Detect Voltage (REG50)
OCP Detect Voltage
VUVLOVCC1
VUVLOVCC2
VUVLOREG1
VUVLOREG2
VOCPL
3.00
2.65
2.90
2.55
0.27
0.17
4.4
3.20
2.80
3.10
2.70
0.30
0.20
5.4
3.40
2.95
3.30
2.85
0.33
0.23
6.4
V
V
V
V
V
V
V
V
V
VCC: Sweep up
VCC: Sweep down
VREG50: Sweep up
VREG50: Sweep down
VCSL: Sweep up
Input OCP Detect Voltage
VOCPH
VCC-VCSH: Sweep down
LDSW Operation Voltage
at Input OCP Release
VCSH = VCC
VCC-VLDSW
VLDSW
OVP Detect Voltage 1
VOVP1
0.95
0.03
1.00
0.05
1.05
0.07
VOVP = Sweep up
VOVP = Sweep down
VVDISC = Sweep up
OVP Detect Voltage 1
Hysteresis Width
OVP Detect Voltage 2
(VDISC Pin)
VOVP1HYS
VOVP2
45
47
49
V
V
VLEDn = Sweep down
(n = 1 to 6),
VOVP > 2.0 V
LED Open Protection Detect
Voltage
VOPEN
0.2
0.3
0.4
LED Anode SCP Detect Voltage
LED Cathode SCP Detect Voltage
VSCP1
VSCP2
tSCP1
0.2
0.2
10.5
10.5
4.2
10.5
-
0.3
0.3
13.1
13.1
4.5
13.1
-
0.4
0.4
V
V
VOVP = Sweep down
VLEDn = Sweep down
(n = 1 to 6)
LED Anode SCP Detect
Delay Time
15.7
15.7
4.8
ms
ms
V
LED Cathode SCP Detect
Delay Time
tSCP2
LED Short Protection Detect
Voltage
VLEDn = Sweep up
(n = 1 to 6)
VSHORT
tSHORT
RFAIL
LED Short Protection Detect
Delay Time
PWM = 100 %
DIMSEL = GND
15.7
2.0
ms
kΩ
FAIL Pin ON Resistor
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BD82A16MUF-M
Electrical Characteristics – continued
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)
Standard Value
Typ
Parameter
[Current Driver]
Symbol
Unit
Conditions
Min
Max
RISET = 31.2 kΩ,
(Note 3)
LED Current Absolute Variation 1
ILEDn
76.0
80.0
-
84.0
3.0
-
mA
%
PWM = 100 %(Note 2)
LED Current Relative Variation
1(Note 1)
RISET = 31.2 kΩ,
PWM = 100 %(Note 2)
ILEDREL
0
-
ISET-GND
Resistor
Short
Protection
RISETLIM
1.0
kΩ
DIMSEL = GND
fPWM = 100 Hz to 25 kHz,
ILEDn = 50 mA to 150 mA
(n = 1 to 6)
PWM Dimming Minimum Pulse
Width
tPWMMIN
0.5
-
-
μs
PWM Dimming Frequency
PWM Low Section Detect Time
[PLSET Pin]
fPWM
0.1
-
25.0
15.7
kHz
ms
tPWML
10.5
13.1
VREG50
x 0.10
VREG50
x 0.30
VREG50
x 0.50
VREG50
x 0.70
VREG50
x 0.90
VREG50
x 0.15
VREG50
x 0.35
VREG50
x 0.55
VREG50
x 0.75
No Additional Pulse Setting Voltage
VPLSET0
VPLSET2
VPLSET4
VPLSET8
VPLSET12
IPLSET
GND
V
V
VREG50
x 0.25
VREG50
x 0.45
VREG50
x 0.65
VREG50
x 0.85
Additional 2 Pulse Setting Voltage
Additional 4 Pulse Setting Voltage
Additional 8 Pulse Setting Voltage
Additional 12 Pulse Setting Voltage
PLSET Pin Inrush Current
V
V
VREG50
+1
V
-1
0
µA
[DIMSEL Pin]
Setting Voltage for PWM Dimming
only
VREG50
x 0.10
VREG50
x 0.30
VREG50
x 0.70
VREG50
x 0.90
VREG50
x 0.15
VREG50
x 0.35
VREG50
x 0.75
VDIMSEL1
VDIMSEL2
VDIMSEL3
VDIMSEL4
IDIMSEL
GND
V
V
PWM-DC Switching 12.5 %
Setting Voltage
VREG50
x 0.25
VREG50
x 0.65
VREG50
x 0.85
PWM-DC Switching 25 %
Setting Voltage
V
PWM-DC Switching 50 %
Setting Voltage
VREG50
+1
V
DIMSEL Pin Inrush Current
-1
0
µA
(Note 1) ILEDREL = (Maximum value of ILED1 to ILED6 - Minimum value of ILED1 to ILED6) / (Maximum value of ILED1 to ILED6 + Minimum value of ILED1 to ILED6) x 100
(Note 2) When PWM Duty is lower than 100 %, it is larger than the variation described.
(Note 3) n = 1 to 6
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BD82A16MUF-M
Electrical Characteristics – continued
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)
Standard Value
Typ
Parameter
Symbol
Unit
Conditions
Min
Max
[EN Pin]
Input High Voltage (EN)
Input Low Voltage (EN)
VINH1
VINL1
RIN1
2.3
-
-
-
-
V
V
0.5
150
Input Resistor (EN)
50
100
kΩ
VEN = 5 V
[PWM, SYNC Pin]
Input High Voltage (PWM, SYNC)
Input Low Voltage (PWM, SYNC)
Input Resistor (PWM, SYNC)
VINH2
VINL2
RIN2
2.3
-
-
-
-
V
V
0.5
150
50
100
kΩ
VPWM = 5 V, VSYNC = 5 V
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BD82A16MUF-M
Typical Performance Curves
(Reference data, unless otherwise specified VCC = 12 V)
20
5.5
5.4
5.3
5.2
5.1
5.0
4.9
4.8
4.7
4.6
4.5
Ta = -40 ˚C
16
Ta = +25 ˚C
Ta = +125 ˚C
12
8
4
0
-40 -20
0
20 40 60 80 100 120
3
12
21
30
39
48
Temperature : Ta [°C]
Power Supply Voltage : VCC [V]
Figure 2. Circuit Current vs Power Supply Voltage
Figure 3. Reference Voltage vs Temperature
330
320
310
300
290
280
270
2.42
2.38
2.34
2.30
2.26
2.22
2.18
2.14
2.10
2.06
2.02
1.98
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 4. Oscillation Frequency 1 vs Temperature
Figure 5. Oscillation Frequency 2 vs Temperature
(RRT = 33.3 kΩ)
(RRT = 4.0 kΩ)
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BD82A16MUF-M
Typical Performance Curves – continued
(Reference data, unless otherwise specified VCC = 12 V)
90
80
70
60
50
40
30
20
10
82.4
82.0
81.6
81.2
80.8
80.4
80.0
79.6
79.2
78.8
78.4
78.0
77.6
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
-40 -20
0
20 40 60 80 100 120
LED Voltage : VLEDn [V]
Temperature : Ta [°C]
Figure 6. LED Current vs LED Voltage
Figure 7. LED Current vs Temperature
(Ta = 25 °C, RISET = 31.2 kΩ, n = 1 to 6)
(RISET = 31.2 kΩ, n = 1 to 6)
100
95
90
85
80
75
70
100
95
90
85
80
75
70
50
60
70
80
90 100 110 120
50
60
70
80
90 100 110 120
LED Current : ILEDn [mA/ch]
LED Current : ILEDn [mA/ch]
Figure 8. Efficiency 1 vs LED Current
(Ta = 25 °C, RRT = 33.3 kΩ, n = 1 to 6,
Figure 9. Efficiency 2 vs LED Current
(Ta = 25 °C, RRT = 4.0 kΩ, n = 1 to 6,
Number of LED Series = 12, Number of LED Parallel = 6)
Number of LED Series = 12, Number of LED Parallel = 6)
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BD82A16MUF-M
Functional Descriptions
1 Current Driver
This model has a built-in 6ch current driver. The LED current setting range per channel is 50 mA to 138 mA, and the LED
current can be adjusted by the resistance value between the ISET pin and GND.
1.1 How to Set LED Current
1.3 LED Pin Handling of Unused Channels
1.4 PWM Low Section Detect Function
1.5 When Setting the LED Current Above 150 mA
1.2 Dimming Control of LED Current
1.2.1 When Using only PWM Dimming
1.2.2 When Switching Between PWM Dimming and
DC Dimming Automatically
1.1 How to Set LED Current
The LED current ILED can be calculated using the following equation.
퐼퐿퐸퐷 = 2.5 × 106/푅ꢀ푆퐸푇
[mA]
RISET represents the resistance value that is connected between the ISET pin and the GND pin. A resistor of 18 kΩ to 50
kΩ is recommended for RISET
.
When RISET ≤ 1.0 kΩ, ISET pin short protection is activated and the output of the LED current is stopped.
ILED vs RISET
Resistance Setting Example
150
LED Current
RISET
[kΩ]
Value
[mA]
140
130
50.0
31.2
25.0
20.8
18.0
50
80
120
110
100
90
100
120
138
80
70
60
50
18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50
RISET [kΩ]
Figure 10. ILED vs RISET
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BD82A16MUF-M
1 Current Driver – continued
1.2 Dimming Control of LED Current
The LED current can be controlled by On Duty of the pulse signal (input PWM signal) input to the PWM pin from the outside
of the IC. Changing the input PWM frequency is prohibited because it may cause operation failure. When using, DC
dimming, the input PWM signal is sampled synchronously with the IC Internal CLK = 20 MHz (Typ).
Sampling of Input PWM Signal (Synchronization with IC Internal CLK) or Not
Sampling of PWM Signal
Use only PWM Dimming
Use PWM Dimming and DC
Dimming
Without Synchronization
Synchronized with IC Internal CLK
To prevent flickering due to sampling, if the input PWM pulse width changes within ±2 CLK of the IC Internal CLK, the
change will not be reflected. In the example shown below, even if the input PWM width changes within the range of A,
since the sampled input PWM signal changes within ±2 CLK, the change is not reflected.
A
Input PWM
from External IC
50 ns (Typ)
IC Internal CLK
+2 CLK
PWM Signal
after Sampling
-2 CLK
Figure 11. Section That Does Not Accept Changes in Input PWM Width
Also, if PWM = High is detected for twice the PWM period, the IC recognizes that PWM = 100 % is input, and the LED
current is always ON.
The current dimming control can be selected from the following two methods.
1.2.1 When Using only PWM Dimming
When using only PWM dimming, short the DIMSEL pin with GND pin. The LED current can be controlled according to
On Duty of the input PWM signal. However, in the area where the LED current ON time is less than 0.5 μs or OFF time
is less than 0.5 μs, the pulse time is shorter than the PWM dimming minimum pulse width, so it cannot be used regularly.
It is okay to use this area transiently, so it is also possible to set PWM Duty = 0 % and 100 %. The step width of the input
PWM Duty should be 0.25 μs or more. If the step width of the input PWM Duty is less than 0.25 μs, the LEDs may flicker.
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BD82A16MUF-M
1.2 Dimming Control of LED Current – continued
1.2.2 When Switching Between PWM Dimming and DC Dimming Automatically
Dimming control can be performed by automatically switching between PWM dimming and DC dimming. The point for
switching between PWM dimming and DC dimming is selected from three types: 50 %, 25 %, or 12.5 %. The point at
which PWM dimming and DC dimming are switched can be set using DIMSEL pin voltages as shown in the table below.
If the switching point for PWM-DC dimming is 12.5 %, Duty of the output LED current is 8 times the input PWM Duty, 4
times for 25 %, and 2 times for 50 %.
When the LED current ON time is less than 0.5 μs or the OFF time is less than 0.5 μs, the pulse time is shorter than the
PWM dimming minimum pulse width, and therefore it cannot be used regularly. For example, if the switching point for
PWM-DC dimming is 12.5 % and the PWM frequency is 200 Hz, the operation may become unstable if a PWM Duty
within 625 μs ±0.5 μs (the range where the ON time of the LED current is less than 0.5 μs) is constantly input. There is
no problem with using this area transiently.
PWM-DC Dimming Switching Point Setting
IC
REG50
Resistance Example
PWM-DC
RDIMSEL2
Dimming
Switching
Point
RDIMSEL1
RDIMSEL2
DIMSEL
Dimming
Control
Current
Driver
PWM Dimming
only
RDIMSEL1
DIMSEL-GND Shorting
LED1
~
LED6
39 kΩ
91 kΩ
91 kΩ
39 kΩ
12.5 %
25 %
PWM
DIMSEL-REG50 Shorting
50 %
Figure 12. How to Set PWM-DC Dimming Switching Point
LED Current
LED Current
LED Current
(When "No DC dimming" is set to 1)
(When "No DC dimming" is set to 1)
(When "No DC dimming" is set to 1)
1
1
1
PWM Dimming
PWM Dimming
PWM Dimming
0.5
DC
Dimming
0.25
0
DC Dimming
DC Dimming
0.125
0
0
Input PWM
Duty [%]
Input PWM
Duty [%]
Input PWM
Duty [%]
50
100
50
100
50
100
Switch at 50 %
Switch at 25 %
Switch at 12.5 %
Figure 13. PWM-DC Dimming Switching Points 50 %, 25 %, and 12.5 %
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BD82A16MUF-M
1 Current Driver – continued
1.3 LED Pin Handling of Unused Channels
This model has six built-in constant current circuits.
By setting the PWM pin to High, current can be supplied to the LED
pin and LED current can be set by inserting a resistor between the
ISET pin and the GND pin.
The LED current setting that can be supplied per row is 50 mA to
150 mA.
For unused channels, pull up the LED pin (LED1 to LED6) to
REG50 with 100 kΩ and pull down to GND with 20 kΩ.
To select unused channels definitely, the capacitance value to be
connected to the LED pin should be 470 pF or less.
REG50
100 kΩ
20 kΩ
LED6
LED5
LED4
LED3
LED2
LED1
Figure 14. To Set LED6 to Unused
1.4 PWM Low Section Detect Function
The Low section of PWM input is counted in VEN = High status. When PWM Low section reaches 13.1 ms, operation is
regarded as OFF state, and DC/DC output voltage is discharged from the VDISC pin. When the PWM input is turned High,
switching operation is restarted.
1.5 When Setting the LED Current Above 150 mA
LED1 to LED6 pins can be used in bundles.
For example, as shown in the figure on the right, if LED1, LED2,
LED3, LED4, LED5, and LED6 are shorted, 6 times the current set
by the ISET pin can be passed.
LED6
LED5
LED4
LED3
LED2
LED1
Figure 15. Application Example When the LED Pin Is Shorted
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BD82A16MUF-M
Functional Descriptions – continued
2 DC/DC Converters
Detects the lowest voltage among LED1 to LED6 pin voltages (LED cathode voltages) in Minimum Channel Selector block
and inputs it to Error AMP. The reference voltage of Error AMP is generated in REF Voltage block based on RISET resistance
value, which becomes LED pin control voltage. The output of Error AMP is compared with the output of SLOPE block by
PWM COMP block. A switching signal is output to the OUTL pin through DC/DC Control LOGIC.
2.1 LED Pin Control Voltage VLEDCTL
2.2 VCC Input Voltage and Series Number of LED
Elements
2.9 Additional Pulse Function
2.10 External Synchronization / Spread Spectrum
Function (SSCG)
2.3 LED Variation and Series Number
2.4 Overvoltage Protection Function OVP
2.5 DC/DC Converter Oscillation Frequency fOSC
2.6 Setting the low side current detection resistor (RCSL
2.7 Setting the Coil Constant
2.11 LSDET Function
2.12 VOUT Discharge Function
2.13 Switching Duty Rquired for Applications
2.14 Fluctuation of LED urrent due to ripple voltage
during PWM dimming
)
2.8 Setting the high side current detection resistor
(RCSH
)
2.1 LED Pin Control Voltage VLEDCTL
The relation between LED pin control voltage (VLEDCTL) and RISET resistance is shown in the table below.
Relation Between LED Pin Control Voltage (VLEDCTL
and RISET
)
VLEDCTL
[V]
LED Pin Control Voltage VLEDCTL
RISET [kΩ]
0.83
[V]
50.0
31.2
25.0
20.8
18.0
0.50
0.50
0.60
0.72
0.83
0.50
18.0
(138 mA/ch)
31.2
(80 mA/ch)
50.0
(50 mA/ch)
RISET [kΩ]
(LED current
setting value)
Figure 16. Relation Between LED Pin Control Voltage (VLEDCTL) and RISET
2.2 VCC Input Voltage and Series Number of LED Elements
To drive the boost DC/DC converter, the LED elements must be selected so that the output voltage (VOUT) is higher than
the input voltage (VCC).
푉퐶퐶 : Input voltage
푉푂푈ꢁ: DC/DC converter output voltage
푉퐶퐶(
푉퐶퐶(
< 푉푂푈ꢁ
(푀ꢀ푁)
)
)
푀퐴푋
푀퐴푋
ꢂ
푉푓
: Number of LED series
: LED Vf voltage
< ꢂ × 푉푓
+ 푉
퐿퐸퐷ꢃ푇퐿 (푀ꢀ푁)
(푀ꢀ푁)
푉퐿퐸퐷ꢃ푇퐿: LED control voltage
Select the number of LED series and Vf characteristics that satisfy
the above equation.
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BD82A16MUF-M
2 DC/DC Converters – continued
2.3 LED Variation and Series Number
When operating multiple LED outputs, the LED anode voltages in each channel are commonly connected to DC/DC
converter output VOUT. LED pin voltage (LED cathode voltage) in the channels where the Vf voltage of the LED is highest
is lowest, and this is controlled to be VLEDCTL. Therefore, other LED pin outputs have higher voltages by Vf variation. Select
the number of LED series and Vf characteristics so that the LED short protection does not malfunction.
ꢂ × ꢄ푉푓
) − 푉푓
)ꢅ < 푉
) − 푉
퐿퐸퐷ꢃ푇퐿 (푀퐴푋)
푉
푆퐻ꢆꢇ푇
: LED short protection voltage
(
(
(
푀퐴푋
푀ꢀ푁
푆퐻ꢆꢇ푇 푀ꢀ푁
The short detection threshold becomes 4.5 V. Refer to 17.8 SHORT Det (LED Short Detection) for details.
2.4 Overvoltage Protection Function OVP
Inputs the resistor division of the output voltage VOUT in the
OVP pin.
VOUT
When OVP pin voltage rises to 1.0 V or more, overvoltage
protection is activated. Switching of DC/DC converter is turned
OFF. After that, OVP is released when the OVP pin voltage
drops to 0.95 V.
ROVP2
OVP
The setting range of ROVP1 is 10 kΩ to 20 kΩ, and it is
recommended to set the OVP pin voltage within the range of
0.6 V to 0.8 V.
Also, the VOUT voltage during OVP detection should not
exceed 45 V, which is the minimum value of overvoltage
protection detect voltage 2 (VDISC pin).
+
ꢀ
-
ROVP1
1.00 V/0.95 V
Figure 17. OVP Peripheral Circuit Diagram
OVP Pin Voltage Setting Sample
{(
)
}
푉푂푈ꢁꢆꢈ푃 = 푅ꢆꢈ푃ꢉ + 푅ꢆꢈ푃ꢊ ∕ 푅ꢆꢈ푃ꢉ × 1.05 < 45
[V]
푉푂푈ꢁꢆꢈ푃
: DC/DC converter output voltage (VOUT) during overvoltage protection operation
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BD82A16MUF-M
2 DC/DC Converters – continued
2.5 DC/DC Converter Oscillation Frequency fOSC
The oscillation frequency (fOSC) of DC/DC converter can be set by connecting a RRT between the RT pin and the GND. The
oscillation frequency of DC/DC converter is generated by the OSC-block. Set the resistor of RRT referring to the data and
theoretical formula below.
7
(
)
푓
ꢆ푆ꢃ
= 10 ∕ 푅ꢇ푇 × 훼
[kHz]
푓
: Oscillation frequency of DC/DC converters
ꢆ푆ꢃ
107 : Constants determined internally by the circuit
푅ꢇ푇 : RT pin connecting resistor
훼
: Correction factor
For the relation between fOSC and RRT, refer to fOSC vs RRT below. Note that operation cannot be guaranteed if fOSC setting
value exceeds the recommended range of 200 kHz to 2420 kHz.
Example Resistance Value for fOSC Setting
fOSC vs RRT
2400
RRT [kΩ]
45.0
α
2200
2000
1800
1600
1400
1200
1000
800
1.004
1.000
0.985
0.958
0.888
33.3
20.0
10.0
4.0
600
400
200
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44
RT [kΩ]
R
Figure 18. fOSC vs RRT
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BD82A16MUF-M
2 DC/DC Converters – continued
2.6 Setting the low side current detection resistor (RCSL
)
The low side current detection resistor (RCSL) allows to set the overcurrent protection detection current. Set to satisfy the
following formula.
⁄
퐼ꢆꢃ푃퐿(푀ꢀ푁) = 푉ꢆꢃ푃퐿(푀ꢀ푁) 푅ꢃ푆퐿 > 퐼퐿(푀퐴푋)
퐼ꢆꢃ푃퐿(푀ꢀ푁) : Overcurrent protection detection current minimum value
푉ꢆꢃ푃퐿(푀ꢀ푁) : Overcurrent protection detection voltage minimum value (0.27 V)
푅ꢃ푆퐿
퐼퐿(푀퐴푋)
: CSL pin connection resistance
: Coil peak current maxmum value
2.7 Setting the Coil Constant
To ensure stable operation of DC/DC converters, the following conditions are recommended for the coil inductance value.
9
⁄
푅ꢇ푇 × 푅ꢃ푆퐿 × ꢄ푉푂푈ꢁ(푀퐴푋) − 푉퐶퐶( )ꢅ ꢋ ≤ 5.1ꢌ × 10
푀ꢀ푁
푅ꢇ푇
: RT pin connecting resistor
: CSL pin connecting resistor
: DC/DC converter output voltage
: Input voltage
푅ꢃ푆퐿
푉푂푈ꢁ
푉퐶퐶
ꢋ
: Inductance value
Lowering the value on the left side increases stability, but decreases responsiveness.
Take the dispersion of inductance value into consideration and set it with sufficient margin.
2.8 Setting the high side current detection resistor (RCSH
)
The high side current detection resistor (RCSH) allows to set the input overcurrent protection detection current. Set to satisfy
the following formula.
⁄
⁄
푅ꢃ푆퐿
퐼ꢆꢃ푃퐻(푀ꢀ푁) = 푉ꢆꢃ푃퐻(푀ꢀ푁) 푅ꢃ푆퐻 > 퐼ꢆꢃ푃퐿 푀퐴푋 = 푉
(
)
ꢆꢃ푃퐿(푀퐴푋)
퐼ꢆꢃ푃퐻(푀ꢀ푁) : Input overcurrent protection detection current minimum value
푉ꢆꢃ푃퐻(푀ꢀ푁) : Input overcurrent protection detection voltage minimum value (0.17 V)
푅ꢃ푆퐻 : CSH pin connection resistance
퐼ꢆꢃ푃퐿(푀퐴푋) : Overcurrent protection detection current maxmum value
푉ꢆꢃ푃퐿(푀퐴푋) : Overcurrent protection detection voltage maxmum value (0.33 V)
푅ꢃ푆퐿
: CSL pin connection resistance
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BD82A16MUF-M
2 DC/DC Converters – continued
2.9 Additional Pulse Function
A pulse addition function is provided to output a stable DC/DC converter output voltage and LED current even when PWM
Duty is low. The output voltage can be held by outputting additional switching of several pulses after the falling edge of the
PWM input signal, and the LED can be turned on normally.
PWM
Additional
Pulse
OUTL
VOUT
VOUT Hold
ILED
Stable LED Current
Figure 19. Pulse Addition Function
The number of switching pulses to be added is set by the resistance value connected to the PLSET pin. As shown in the
figure below, it can connect RPLSET1, RPLSET2 and set the number of switching pulses to be added by the resistance ratio.
Examples of resistance values are shown in the table below.
Example of Resistance Value
When Setting Additional Pulse Number
Number of
RPLSET1
RPLSET2
Additional
Pulses
REG50
PLSET
RPLSET2
PLSET-GND Shorting
0 Pulse
2 Pulses
4 Pulses
8 Pulses
12 Pulses
DC/DC
Control
LOGIC
Additional Pulse
Output
39 kΩ
100 kΩ
91 kΩ
91 kΩ
100 kΩ
39 kΩ
OUTL
RPLSET1
PLSET-REG50 Shorting
Figure 20. Additional Pulse Number Setting Method
The setting of the number of switching pulses to be added is performed immediately after the EN pin voltage is turned on
and prior to starting. It is not possible to change the setting of the number of switching pulses to be added after startup.
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BD82A16MUF-M
2 DC/DC Converters – continued
2.10 External Synchronization / Spread Spectrum Function (SSCG)
Three switching modes can be selected according to the voltage input to the SYNC pin. The input to the SYNC pin must
precede the input to the EN pin.
Mode
1
2
VSYNC
GND or OPEN
VREG50
DC/DC Switching Frequency
Fixed Frequency Mode Determined by RRT
Spread Spectrum Mode of the Frequency
Determined by RRT
3
Pulse Input
Mode to Synchronize with the Frequency Input to
the SYNC Pin
Mode 1: When the SYNC pin is GND or OPEN, the DC/DC converter switches at a fixed frequency determined by the RRT
.
Mode 2: By shorting the SYNC pin and the REG50 pin, operation in spread spectrum mode (SSCG) is enabled. Noise
peaks can be reduced by periodically changing the oscillation frequency by SSCG. The fluctuation range of the frequency
due to SSCG is -8 % of the set oscillation frequency from the set oscillation frequency. The oscillation frequency fluctuation
cycle (tSSCG) is 128 / set oscillation frequency. Note that operating SSCG may change noise levels other than the oscillation
frequency.
VCC
VEN
VSYNC
VPWM
1.0 V
PWM = High Detection
Self Diagnosis
Pre-boost
VOVP
VOUTL
Δf = -8 % (Typ)
fOSC
tSSCG = 128/fOSC (Typ)
Figure 21. Spread Spectrum Function Timing Chart
훥푓 : Fluctuation range of the oscillation frequency by SSCG
: DC/DC oscillation frequency
훥푓 = 푓 × 0.08
ꢆ푆ꢃ
푓
ꢆ푆ꢃ
푡푆푆ꢃ퐺: Modulating period of the oscillation frequency by SSCG
128
푡푆푆ꢃ퐺
=
푓
ꢆ푆ꢃ
The amount of noise reduction during SSCG S [dB] can be roughly estimated by the following equation.
ꢉ
f = fOSC × 0.08
ꢍ = −10 × 푙표푔 ꢎꢏ×ꢐ
[dB]
[dB]
ꢑꢑꢒꢓ
ꢏ
/ꢉꢊꢕ
ꢔꢑꢒ
ꢍ = −10 × 푙표푔 ꢏ
S[dB]
×ꢖ.ꢖꢕ
ꢔꢑꢒ
ꢍ = 10
[dB]
When not using SSCG function, short the SYNC pin and the GND pin.
SSCG function cannot be turned ON/OFF during operation.
Frequency
Band
fOSC × 0.92
fOSC
Figure 22. Spread Spectrum Function
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2.10 External Synchronization / Spread Spectrum Function (SSCG) – continued
Mode 3: By inputting an external clock signal to the SYNC pin, the internal oscillation frequency can be externally
synchronized. Input the clock signal to SYNC pin before the Self Diagnosis is completed. (For Self Diagnosis, refer to "3
Startup Characteristics and Effective Section of Each Protection Function")
Internal oscillation and external synchronization cannot be switched on the way. Operation may become unstable. When
using external synchronization, SSCG cannot be used.
2.11 LSDET Function
LSDET
OFF
LSDET
ON
LSDET
OFF
When the lowest LED pin voltage among the LED pins exceeds
1.5 V (Typ), the DC/DC converter is turned OFF and the COMP
voltage is held.
DC/DC converter resumes switching when the lowest LED pin
voltage drops VLEDCTL x 1.1 or less.
VPWM
LSDET function is intended to reduce the voltage quickly when
the output is over boosted. It also prevents the LEDs from
flickering by restarting the switching of DC/DC converters just
before returning to normal operation. LSDET function is enabled
only when Duty of the LED current is ON. The following is an
example when LED6 becomes open.
ꢇ
VOUTL
ꢄ
VCOMP
ꢁ
1.0 V
①
The LED6 pin is open and LED6 pin voltage is 0.3 V (Typ) or
ꢅ
ꢂ
less. (Ⓐ)
VOVP
DC/DC converter output begins to boost LED6 pin voltage
further. In conjunction with this, OVP pin voltage also rises.
(Ⓑ)
VLED1
to
VLED5
②
When OVP pin voltage reaches 1.0 V (Ⓒ) due to the boost
ꢆ
VLEDCTL
VLEDCTL x 1.1
of DC/DC converter, the LED open protection is activated.
When the LED open protection is activated, the LED6 pin
that was open is pulled up to REG50 pin voltage VREG50
REG50 Pull Up (VREG50
)
inside the IC. (Ⓓ)
LSDET function operates because LED6 pin voltage, which
is the lowest LED pin voltage among the LED pins, exceeds
ꢃ
VLED6
VLEDCTL
1.5 V (Typ)
0.3 V (Typ)
ꢀ
1.5 V (Typ). (Ⓓ)
LSDET function turns OFF DC/DC converters and holds
LED6
Open
LED6
Open
Detection
COMP voltage. (Ⓔ)
DC/DC converter turns OFF, the output voltage drops, and
OVP pin voltage also drops. (Ⓕ)
ILED1
to
ILED5
③
④
When the lowest LED pin voltage is VLEDCTL x 1.1 (Typ) or
ILED6
less (Ⓖ) the DC/DC converters resume switching. (Ⓗ)
Figure 23. LSDET Function When LEDs Are Open
2.12 VOUT Discharge Function
The LEDs may flicker if activated with charges remaining on VOUT. Therefore, discharging of VOUT is required at startup.
However, discharging of the charge may take a long time only by the discharge path such as the resistor for OVP setting.
Therefore, an output voltage discharging circuit (VOUT discharge function) is provided in this model. When DC/DC circuit
is OFF (when EN pin voltage falls or PWM Low section is detected), residual charges in the output are discharged. The
discharge time tDISC is expressed by the following equation.
푡퐷ꢀ푆ꢃ = 3 × 퐶ꢆꢗ푇 × 푉푂푈ꢁ [s]
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BD82A16MUF-M
2 DC/DC converters – continued
2.13 Switching Duty Required for Applications
As an application of DC/DC converters, the switching duty required for stable operation can be roughly estimated by the
following equations.
(
) (
)
ꢍ푊ꢘ푈ꢁ푌 = 푉ꢆꢗ푇 + 푉푓 − 푉퐶퐶 / 푉ꢆꢗ푇 + 푉푓 − 푉ꢘ푀ꢊ
퐷ꢉ
퐷ꢉ
ꢍ푊ꢘ푈ꢁ푌 : Required switching Duty
푉ꢆꢗ푇
: DC/DC converter output voltage
: Vf voltage of the boosting diode (D1)
: Input voltage
푉푓
퐷ꢉ
푉퐶퐶
푉ꢘ푀ꢊ
: Drain voltage when FET (M2) for boosting is ON
The above values are approximate values. The switching Duty actually required depends on the characteristics and
operating conditions of the application components. Finally, check the actual operation.
2.14 Fluctuation of LED current due to ripple voltage during PWM dimming
During PWM dimming, the LED current does not flow and the LED pin voltage (VLED) becomes high in the PWM = Low
section, and the VLED is controlled by the VLEDCTL in the PWM = High section.Depending on the settings of external
components such as the LED current setting and the capacity of the output capacitor, the VLED may undershoot at the
start of PWM. Due to this undershoot, the LED current may drop momentarily as shown in the figure below. When the
LED current setting value of each CH is 65 mA or more, it is recommended that the undershoot amount (ΔVdrop) of VLED
at PWM = High is 50 mV or less. However, even if the LED current drops momentarily due to undershoot, the LED may
not appear to flicker. Be sure to evaluate on the actual board and check from a visual point of view.
PWM
VLED
LED pin
Control voltage
(VLEDCTL
)
undershoot
(ΔVdrop)
50 mV
ILED
Figure 24. VLED and ILED timing chart during PWM dimming
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BD82A16MUF-M
Functional Descriptions - continued
3 Startup Characteristics and Effective Section of Each Protection Function
3.1 When PWM Duty Is 100 %
The timing chart at startup and the effective section of each protection function are shown in the figure below.
①
②
Power ON: Input EN voltage after the VCC voltage is input.
Self Diagnosis: Determines the channels to be used, sets the number of additional pulses, and sets PWM/DC dimming,
etc. Self Diagnosis is completed after 13.1 ms (Typ), and the diagnostic status is latched.
PWM signal detection: When PWM = High has elapsed 13.1 ms, it recognizes that PWM = 100 % and begins the
startup.
Pre-boost(Note 1): Outputs switching until the OVP pin voltage reaches 1.0 V and boosting is performed.
Stable operation transition section: DC/DC switching is turned OFF. The output voltage of DC/DC converter drops
according to the LED current.
③
④
⑤
⑥
Stable state: When LED voltage (the lowest voltage in LED1 to LED6) drops to LED control voltage x 1.1, DC/DC
converter switches again.
(Note 1) Because a higher switching Duty is required than stable state, Pre-boost may not be completed depending on operating conditions and component
conditions. Contact us for details.
VCC
①
VEN
3.1 V (Typ)
(UVLO Release)
VREG50
VDIMSEL
0 V (PWM DImming Only)
VPWM
ꢀ⑤ Stable
Operation
Transition
Section
③ PWM Signal
Detection
13.1 ms
④ Pre-boost
⑥ Stable State
② Self Diagnosis
13.1 ms (Typ)
・Determination of CH
to use
・Setting the number
of additional pulse
・PWM/DC dimming
setting
VOVP
1.0 V
・OVP pin fault
detection
VOUTH
VOUTL
ILED
LED Setting Current Output Section
LED Control Voltage × 1.1
VLED
LED Control Voltage
During Self Diagnosis
FAIL is Low
VFAIL
DC/DC Converter Operating Section
Current Driver Operating Section
Under Voltage Lockout (UVLO) Effective when EN = High
Thermal ShutDown (TSD) Effective when EN = High
Thermal Warning (TW) Effective when EN = High
Overcurrent Protection (OCPL) Effective when UVLO is released
Overvoltage Protection (OVP) Effective when UVLO is released
Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is released
Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released
ISET-GND Short Protection / FAIL Flag Effective when pre-boost starts
LED Open Protection / FAIL Flag Effective when pre-boost is complete
LED Short Protection / FAIL Flag Effective when pre-boost is complete
Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is complete
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BD82A16MUF-M
3 Startup Characteristics and Effective Section of Each Protection Function – continued
3.2 When Using only PWM Dimming
The timing chart at startup and the effective section of each protection function when only PWM dimming is used are shown
in the figure below.
①
②
Power ON: Input EN voltage after the VCC voltage is input.
Self Diagnosis: Determines the channels to be used, sets the number of additional pulses, and sets PWM/DC dimming,
etc. Self Diagnosis is completed after 13.1 ms (Typ), and the diagnostic status is latched.
PWM signal detection: Begins the startup at the first rising edge of PWM.
Pre-boost(Note 1): Regardless of On Duty of PWM, switching is output until OVP pin voltage reaches 1.0 V, and boosting
is performed.
③
④
⑤
⑥
Stable operation transition section: DC/DC switching is turned OFF. The output voltage of DC/DC converter drops
according to the LED current.
Stable state: When LED voltage (the lowest voltage in LED1 to LED6) drops to LED control voltage x 1.1, DC/DC
converter switches again.
(Note 1) Because a higher switching Duty is required than stable state, Pre-boost may not be completed depending on operating conditions and component
conditions. Contact us for details.
VCC
①
VEN
3.1 V (Typ)
(UVLO Release)
VREG50
VDIMSEL
0 V (PWM Dimming Only)
VPWM
ꢀ⑤ Stable Operation Transition Section
④ Pre-boost
⑥ Stable State
② Self Diagnosis
③ PWM
Signal
Detection
13.1 ms (Typ)
・Determination of CH
to use
・Setting the number
of additional pulse
・PWM/DC dimming
setting
VOVP
1.0 V
・OVP pin fault detection
VOUTH
VOUTL
ILED
LED Setting Current Output Section
LED Control Voltage × 1.1
VLED
LED Control Voltage
During Self Diagnosis
FAIL is Low
VFAIL
DC/DC Converter Operating Section
Current Driver Operating Section
Under Voltage Lockout (UVLO) Effective when EN = High
Thermal ShutDown (TSD) Effective when EN = High
Thermal Warning (TW) Effective when EN = High
Overcurrent Protection (OCPL) Effective when UVLO is released
Overvoltage Protection (OVP) Effective when UVLO is released
Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is released
Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released
ISET-GND Short Protection / FAIL Flag Effective when pre-boost starts
LED Open Protection / FAIL Flag Effective when pre-boost is complete
LED Short Protection / FAIL Flag Effective when pre-boost is complete
Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is complete
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BD82A16MUF-M
3 Startup Characteristics and Effective Section of Each Protection Function – continued
3.3 When Switching Between PWM Dimming and DC Dimming
The timing chart at startup and the effective section of each protection function when switching between PWM dimming
and DC dimming are shown in the figure below.
①
②
Power ON: Input EN voltage after the VCC voltage is input.
Self Diagnosis: Determines the channels to be used, sets the number of additional pulses, and sets PWM/DC dimming,
etc. Self Diagnosis is completed after 13.1 ms (Typ), and the diagnostic status is latched.
PWM signal detection: Begins the startup at the fourth rising edge of PWM after Self Diagnosis.
Pre-boost(Note 1): Regardless of On Duty of PWM, switching is output until OVP pin voltage reaches 1.0 V, and boosting
is performed.
③
④
⑤
⑥
Stable operation transition section: DC/DC switching is turned OFF. The output voltage of DC/DC converter drops
according to the LED current.
Stable state: When LED voltage (the lowest voltage in LED1 to LED6) drops to LED control voltage x 1.1, DC/DC
converter switches again.
(Note 1) Because a higher switching Duty is required than stable state, Pre-boost may not be completed depending on operating conditions and component
conditions. Contact us for details.
VCC
①
VEN
3.1 V (Typ)
(UVLO Release)
VREG50
VDIMSEL
VPWM
REG50*RDIMSEL1/(RDIMSEL1+RDIMSEL2
(PWM+DC Dimming)
)
(1)ꢀꢀ
(2)ꢀꢀꢀ
(3)ꢀꢀꢀ
(4)
③ PWM Signal Detection
After Self Diagnosis, pre-boost starts at the fourth
rising edge of PWM
②
Self Diagnosis
④ Pre-boost
⑥ Stable State
ꢀ⑤ Stable Operation Transition Section
13.1 ms (Typ)
・Determination of CH
to use
・Setting the number
of additional pulse
・PWM/DC dimming
setting
VOVP
1.0 V
・OVP pin fault detection
VOUTH
VOUTL
ILED
LED Setting Current Output Section
LED Control Voltage × 1.1
VLED
LED Control Voltage
During Self Diagnosis
FAIL is Low
VFAIL
DC/DC Converter Operating Section
Current Driver Operating Section
Under Voltage Lockout (UVLO) Effective when EN = High
Thermal ShutDown (TSD) Effective when EN = High
Thermal Warning (TW) Effective when EN = High
Overcurrent Protection (OCPL) Effective when UVLO is released
Overvoltage Protection (OVP) Effective when UVLO is released
Overvoltage Protection (OVP) FAIL Flag
Effective when LSDET is released
Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released
ISET-GND Short Protection / FAIL Flag Effective when pre-boost starts
LED Open Protection / FAIL Flag Effective when pre-boost is complete
LED Short Protection / FAIL Flag Effective when pre-boost is complete
Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is complete
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BD82A16MUF-M
3 Startup Characteristics and Effective Section of Each Protection Function – continued
3.4 Timing Chart When Stopped (When Pulling Up FAIL to REG50)
The figure below shows the timing chart when stopped (EN = Low) when FAIL is pulled up to REG50.
VCC
VEN
After EN = Low, VREG50 gradually decreases
The time to decrease is determined by the
VREG50
external capacitance (CREG50
)
When REG50 deacreases to a voltage at which
the internal circuit does not operate,
FAIL becomes High and decreases
as REG50 decreases
FAIL is Low
while REG50 is decreasing
VFAIL
After VEN = Low, the VREG50 will gradually decrease. The time to decrease depends on the value of the capacitance
(CREG50) connected to REG50. Immediately after VEN = Low, the operation inside the IC is turned OFF and VFAIL = Low
are output. While the VREG50 is still high enough, VFAIL = Low will continue to be output, but when VREG50 decreases to a
level where Low of VFAIL cannot be output, VFAIL = High. After that, VFAIL decreases as VREG50 decreases
3.5 Timing Chart When Stopped (When Pulling Up FAIL to an External Power Supply)
The figure below shows the timing chart when stopped (EN = Low) when FAIL is pulled up to an external power supply.
VCC
VEN
After EN = Low, VREG50 gradually decreases
The time to decrease is determined by the
VREG50
external capacitance (CREG50
)
FAIL is Low
while REG50 is decreasing
VFAIL
When REG50 deacreases to a voltage at
which the internal circuit does not operate,
FAIL becomes High
After VEN = Low, the VREG50 will gradually decrease. The time to decrease depends on the value of the capacitance
(CREG50) connected to REG50. Immediately after VEN = Low, the operation inside the IC is turned OFF and VFAIL = Low
are output. While the VREG50 is still high enough, VFAIL = Low will continue to be output, but when VREG50 decreases to a
level where Low of VFAIL cannot be output, VFAIL = High.
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BD82A16MUF-M
PCB Application Circuit Diagram
VCC
RCSH
M1
B+
CB1
CB2
L1 CVCC1
CVCC2
CVCC3
CIN1
CIN2
REN2
REN1
B-
VREG
RFAIL
FAIL
CP
CCP1
CCP2
32 31 30 29 28 27 26 25
EXP-PAD
EXP-PAD
REG50
REG25
CREG25
1
2
3
4
5
6
7
8
REG25
24
23
22
21
VDISC
REG50
RT
OVP
BOOT
OUTH
RRT
RBT
CREG50
COVP
ROVP1 ROVP2
D2
M2
VOUT
+
SYNC
PWM
SYNC
PWM
PLSET
COMP
GND
CBT
EXP-PAD
PLSET
SW 20
RPLSET2
L2
D1
PGND
OUTL
19
18
RG
RSNB2 CSNB2
RSNB1
M3
RPLSET1
CPC2
RPC
CSL 17
RCS
CSNB1
CPC1
CCS
RCSL
EXP-PAD
EXP-PAD
9
10 11 12 13 14 15 16
VOUT
RISET
CLED1U
CLED2U
CLED3U
CLED4U
CLED5U
CLED6U
DIMSEL
RDIMSEL2
LED6
LED5
LED4
LED3
LED2
LED1
RDIMSEL1
CLED1D
CLED2D
CLED3D
CLED4D
CLED5D
CLED6D
Place RRT closest to the RT pin and do not add capacitance.
Place RISET closest to the ISET pin and do not add capacitance.
Place CVCC3, CREG50, CREG25 decoupling capacitors as close as possible to the IC pin.
A large current may flow through PGND, so lower the impedance.
Be careful that the ISET pin, the RT pin and the COMP pin do not get noisy.
The PWM pin, the OUTL pin, the SYNC pin and the LED1 pin to the LED6 pin are switched. Be careful not to affect the
peripheral patterns.
The wires from the OUTH pin, OUTL pin and the CSL pin to the components should be the shortest and minimum
impedance.
There is a heat dissipation PAD on the back side of the package. Solder the heat dissipation PAD to the ground of the
board.
For noise reduction, consider the shortest and minimum impedance board layout for the buck loop (VCC → RCSH → M1 →
M2 → D1 → PGND → GND → CVCC3 → VCC) and the boost loop (D2 → COUT → PGND → RCSL → M3 → D2).
Inserting RG can reduce ringing, but larger RG may be less efficient. When using it, carefully evaluate it and determine the
resistance value.
Both ends of RCSH and RCSL should be wired as short as possible. Longer wires may lead to false detection of input
overcurrent protection (OCPH) or overcurrent protection (OCPL) due to inductance components.
Connect VOUT to the anode of the LED panel as short as possible. Depending on the parasitic inductance component, the
LED current may become unstable.
The connection from the LED1 pin to the LED6 pin to the cathode of the LED panel should be as short as possible.
Depending on the parasitic inductance component, the LED current may become unstable.
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BD82A16MUF-M
List of External Components
Serial No.
Component Name
Component Value
Product Name
Manufacturer
-
-
-
1
CB1
CB2
-
2
-
-
3
L1
-
-
-
-
-
-
4
CVCC1
CVCC2
CVCC3
REN1
-
5
-
-
6
0.1 μF
-
GCM155R71H104KE37
murata
-
7
-
8
REN2
-
-
LTR18 Series
RD3L140SPFRA
GCM32EC71H106KA03
-
-
9
RCSH
M1
33 mΩ
-
Rohm
Rohm
murata
-
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
C IN1
10 μF
-
C IN2
M2
-
RD3L080SNFRA
RB088LAM-60TF
-
Rohm
Rohm
-
D1
-
RBT
SHORT
0.1 μF
10 μH
-
CBT
GCM155R71H104KE02
CLF10060NIT-100M-D
RD3L080SNFRA
LTR18 Series
murata
TDK
Rohm
Rohm
Rohm
murata
murata
-
L2
M3
RCSL
68 mΩ
-
D2
RB088LAM-60TF
GCM155R71H103KA55
GCM155R71H104KE02
-
COUT1
COUT2
COUT3
COUT4
COUT5
CREG25
CREG50
RRT
0.01 μF
0.1 μF
-
-
-
-
22 µF
0.22 μF
2.2 μF
33 kΩ
100 kΩ
100 kΩ
51 Ω
1 μF
-
GYA1H220MCQ1GS
GCM155R71C224KE02
GCM188C71A225KE01
MCR01 Series
nichicon
murata
murata
Rohm
Rohm
Rohm
Rohm
murata
-
RPLSET1
RPLSET2
RPC
MCR01 Series
MCR01 Series
MCR01 Series
CPC1
GCM188R71C105KA49
-
CPC2
RISET
RDIMSEL1
RDIMSEL2
CLED1D
CLED2D
CLED3D
CLED4D
CLED5D
CLED6D
33 kΩ
SHORT
OPEN
470 pF
470 pF
470 pF
MCR01 Series
Rohm
-
-
-
-
GCM155R11H471KA01
GCM155R11H471KA01
GCM155R11H471KA01
GCM155R11H471KA01
GCM155R11H471KA01
GCM155R11H471KA01
murata
murata
murata
murata
murata
murata
470 pF
470 pF
470 pF
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BD82A16MUF-M
List of External Components – continued
Serial No.
Component Name
CLED1U
CLED2U
CLED3U
CLED4U
CLED5U
CLED6U
RCS
Component Value
Product Name
Manufacturer
43
-
-
-
44
-
-
-
45
-
-
-
46
-
-
-
47
-
-
-
48
-
-
-
49
Short
-
-
50
CCS
-
-
-
51
RG
10 Ω
MCR01 Series
Rohm
52
ROVP1
ROVP2
COVP
10 kΩ
MCR01 Series
Rohm
53
360 kΩ
MCR01 Series
Rohm
54
-
-
-
55
RFAIL
100 kΩ
MCR01 Series
Rohm
56
CCP1
10 μF
GCM32EC71H106KA03
murata
57
CCP2
2.2 μF
GCM188C71A225KE01
murata
58
RSNB1
CSNB1
RSNB2
CSNB2
-
-
-
-
-
-
-
-
-
-
-
-
59
60
61
Note: The component constants vary depending on the operating conditions and the load used.
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BD82A16MUF-M
Power Consumption Calculation Example
ꢙꢃ = 퐼ꢃꢃ × 푉퐶퐶
(1) Circuit power
+퐶ꢀ푆푆ꢉ × 푉ꢇ퐸퐺ꢚꢖ × 푓 × 푉ꢇ퐸퐺ꢚꢖ
(2) High side FET drive stage power
ꢆ푆ꢃ
+퐶ꢀ푆푆ꢊ × 푉ꢇ퐸퐺ꢚꢖ × 푓 × 푉ꢇ퐸퐺ꢚꢖ
(3) Low side FET drive stage power
(4) Current driver power
ꢆ푆ꢃ
(
)
+{푉 × ꢛ + ∆푉푓 × ꢛ − 1 } × 퐼퐿퐸퐷
퐿퐸퐷
ꢙꢃ
퐼ꢃꢃ
: IC power consumption
: Circuit current
푉퐶퐶 : Power supply voltage
퐶ꢀ푆푆ꢉ : High side FET gate capacitance
퐶ꢀ푆푆ꢊ : Low side FET gate capacitance
푉ꢇ퐸퐺ꢚꢖ: REG50 Voltage
푓
푉
퐿퐸퐷
: Oscillation Frequency
: LED control voltage
ꢆ푆ꢃ
ꢛ
: Number of LED Parallels
∆푉푓 : LED Vf variation per row
퐼퐿퐸퐷 : LED output current
<Calculation Example>
Assuming ICC = 10 mA, VCC = 12 V, CISS1 = 2000 pF, CISS2 = 2000 pF, VREG50 = 5 V, fOSC = 2200 kHz, VLED = 0.83 V, ILED
= 150 mA, M = 6 columns and ΔVf = 0.2 V,
ꢙ푐 = 10 푚ꢜ × 12 푉
+2000 푝퐹 × 5 푉 × 2200 푘ꢝ푧 × 5 푉
+2000 푝퐹 × 5 푉 × 2200 푘ꢝ푧 × 5 푉
{
(
)}
+ 0.83 푉 × ꢌ푐ℎ + 0.2 푉 × ꢌ푐ℎ − 1 × 150 푚ꢜ = 1.23ꢞ
[W]
From thermal resistance θja = 30.7 °C/W, the maximum calorific value ΔtMAX can be estimated by the following equation.
훥푡푀퐴푋 = ꢙ푐 × 휃푗푎 = 1.23ꢞ 푊 × 30.ꢞ = 38.0
[°C]
When the ambient temperature is 85 °C, the maximum chip temperature tCMAX is:
푡ꢃ푀퐴푋 = 85 ℃ + 38.0 ℃ = 123.0 [°C]
Make sure that tCMAX calculated here is less than Tjmax = 150 °C.
The above is a simple calculation example only. The value of thermal resistance varies depending on the actual board
conditions and layout. Please check it as a guide for thermal design.
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BD82A16MUF-M
I/O Equivalence Circuit
1.REG25
2.REG50
3.RT
4.SYNC
VCC
VCC
REG50
10 kΩ
SYNC
GND
REG25
REG50
RT
100 kΩ
10 kΩ
GND
GND
GND
5.PWM
6.PLSET
7.COMP
8.GND, 19.PGND
10 kΩ
REG50
PLSET
GND
PGND
GND
10 kΩ
100 kΩ
10 kΩ
PWM
GND
COMP
GND
400 Ω
9.ISET
10.DIMSEL
11 - 16.LED1 - LED6
17.CSL
REG50
REG50
REG50
DIMSEL
GND
REG50
ISET
20 kΩ
10 kΩ
LED1
LED2
LED3
LED4
LED5
LED6
12 kΩ
10 kΩ
10 kΩ
10 kΩ
CSL
GND
2 Ω
GND
GND
18.OUTL
20.SW
21.OUTH, 22.BOOT
REG50
BOOT
REG50
SW
OUTL
PGND
1 kΩ
OUTH
PGND
100 kΩ
100 kΩ
SW
24.VDISC
23.OVP
25.FAIL
26.LDSW
REG50
VDISC
VCC
LDSW
GND
1 kΩ
10 kΩ
10 kΩ
FAIL
2 MΩ
1.2
MΩ
OVP
2 MΩ
50 kΩ
GND
31.9
kΩ
2 MΩ
GND
GND
27.CSH
29.EN
30.CP, 31.CPP
32.CPM
CP
REG25
CPM
VCC
EN
VCC
CSH
GND
1 pF
25 kΩ
CPP
7 kΩ
100 kΩ
REG25
GND
GND
GND
Note: All values are Typ values.
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BD82A16MUF-M
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD82A16MUF-M
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 25. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
14. Functional Safety
“ISO 26262 Process Compliant to Support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.
“Functional Safety Supportive Automotive Products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the
functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
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BD82A16MUF-M
Ordering Information
B D 8 2 A 1 6 M U F
-
M E 2
Package
MUF: VQFN32FBV050
Product rank
M: for Automotive
Packaging and forming specifications
E2: Embossed tape and reel
Marking Diagram
VQFN32FBV050 (TOP VIEW)
B D 8 2 A
1 6 M U F
Part Number Marking
LOT Number
Pin 1 Mark
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BD82A16MUF-M
Physical Dimension and Packing Information
Package Name
VQFN32FBV050
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BD82A16MUF-M
Revision History
Date
Revision
001
Changes
New Release
05.Jul.2022
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号:
BD82A26MUF-M (新产品)
该IC是一款适用于LCD背光的白色LED驱动器,内置6通道的LED驱动用电流驱动器,非常适合用来驱动高亮度LED。由于LED引脚支持的最大电压为50V,因此适合用来驱动大型LCD显示器。什么是Nano Cap™?Nano Cap™是ROHM自有的一种电源技术,利用该技术,即使输出电容低至nF级也能进行稳定控制。
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