BD9016KV-M_技术文档

Datasheet

Switching Regulator with external FET

3.9 to 30V, 2ch Synchronous Rectification

Step-Down Controller

BD9015KV-M BD9016KV-M

General Description

Key Specifications

Input voltage range:

Output voltage range:

The BD9015KV-M and BD9016KV-M are high perfor-

mance synchronous rectification switching controllers

with wide input range and dual channel output.

The synchronous rectification method comes with high

efficiency making controller ideal for eco-designs(low

power consumption) of numerous electronics.

All channels have enable pins, soft start functionality and

power good outputs. Startup and shutdown can be

controlled independently.

3.9 V to 30 V

0.8 V to 10 V

Accurate voltage reference:±1.5%(-40°C to +105°C)

Switching frequency:

Shutdown current:

250 kHz to 550 kHz

0μA (Typ)

-40°C to + 105 °C

Operating temperature range:

Package

W (Typ) x D (Typ) x H (Max)

VQFP48C

9.00 mm x 9.00 mm x 1.60 mm

An integrated PLL circuit can be synchronized to an

external 250kHz to 600kHz clock signal.

Features

■ N channel MOSFET direct drive

■ Synchronous rectification for increased efficiency

■ Acceptable Low ESR ceramic capacitor at output

■ Integrated PLL circuit for external synchronization;

250kHz to 600kHz

■ Current mode control

■ High side MOSFET current sensing

■ Pre-bias functionality

VQFP48C

■ Independent ON/OFF control for all channels

■ At Max Duty the oscillation frequency is slowed down

to 1/5, reducing the input/output voltage difference.

■ Low voltage and over voltage detection circuit at all

outputs

Applications

■ Car audio, Car navigation

■ LCDTV, PDPTV, DVD, PC, etc..

When the over voltage is detected, the L-side FET is

OFF (BD9015KV-M). The L-side FET is ON

(BD9016KV-M).

Low side FET is ON (BD9016KV-M)

■ Power good indicator pin (PGOOD)

■ Integrated overcurrent protection with self recovery.

Typical Application Circuit

5V/4A

BD9015KV/

BD9016KV

Figure 1. Typical Application Circuit

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

www.rohm.com

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

1/27

TSZ22111・14・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Pin Configuration

(TOP VIEW)

Figure 2. Pin Configuration

Pin No. Symbol

Pin Description

Pin No. Symbol

Function

1

2

3

4

5

6

7

8

BOOT2 Power supply for OUTH2 driver

25

26

27

28

29

30

31

32

PGOOD1 Power good output pin 1

N.C.

CL2

N.C.

Not connected

N.C.

EN1

EN2

N.C.

Not connected

Output 1 ON / OFF pin

Output 2 ON / OFF pin

Not connected

Current detection setting pin 2

Not connected

VCCCL2 Power supply for current detection 2

N.C.

VCC

Not connected

GND Ground pin

Not connected

Power supply pin

N.C.

VCCCL1 Power supply for current detection 1

Oscillation frequency setting / filter

connection pin

External synchronization select pin

9

N.C.

Not connected

33

RT/LPFC

SEL

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

CL1

N.C.

Current detection setting pin 1

Not connected

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

SYNC External synchronization pulse input pin

Power good output pin 2

Not connected

BOOT1 Power supply for OUTH1 driver

OUTH1 High side FET gate pin 1

PGOOD2

N.C.

High side FET source pin 1

SW1

SS2

Soft start time setting pin 2

DGND1 Low side FET source pin 1

OUTL1 Low side FET gate pin 1

VREG5A REG input for FET driver pin

COMP2 Error amp output 2

FB2

N.C.

Error amp input 2

Not connected

N.C.

FB1

Not connected

Error amp input 1

EXTVCC External power supply input pin

N.C. Not connected

VREG5 REG output for FET driver pin

OUTL2 Low side FET gate pin 2

DGND2 Low side FET source pin 2

SW2 High side FET source pin 2

OUTH2 High side FET gate pin 2

COMP1 Error amp output 1

SS1

N.C.

Soft start time setting pin 1

Not connected

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

2/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Block Diagram

42

7

35

34

33

SYNC

PLL

Reg

EN

VREG5 44

BG

UVLO

TSD

OSC

VCCCL2

CL2

5

3

1

8

VCCCL1

OCP2

OCP1

10 CL1

BOOT2

12 BOOT1

13 OUTH1

14 SW1

Set

Reset

Set

Reset

OUTH2 48

SW2 47

DRV

SW

EN2

TSD

UVLO

EN21

TSD

UVLO

VREG5

LOGIC

17 VREG5A

16 OUTL1

15 DGND1

OUTL2 45

DGND2 46

SLOPE

PROTECT

LOGIC

PROTECT

LOGIC

PWM

COMP

PWM

COMP

Err Amp

FB2 40

SS2 38

21 FB1

23 SS1

CLAMP

SCP

TSD

UVLO

COMP2 39

22 COMP1

Q

Set

Reset

OCP2

SCP2

SCP1

OCP1

OCP2

OCP1

36

28

30

27

25

Figure 3. Block Diagram

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

3/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Description of Blocks

(1) Error amplifier

The error amplifier compares the output feedback voltage to the 0.8V reference voltage and provides the comparison result

as COMP voltage, which is used to determine the switching duty cycle. As at startup the soft start is based on the SS pin

voltage, the COMP voltage is limited to the SS voltage.

(2) Oscillator

An internal fixed current source sets the oscillation frequency with the help of a single resistor connected to the RT pin.

The frequency can be set in the range between 250 kHz to 550 kHz by proper selection of the external resistor. The phase

difference between the outputs is 180° to help reduce the input capacitor voltage ripple and power losses.

Also, in case the input/output voltage difference is small, the oscillation frequency is divided 5times from the set value. This

increase the maximum duty cycle time and helps to reduce the input to output voltage drop.

The maximum Duty is determined by the following equation.

T

_OFF: OUTH Minimum OFF time (Max=400ns)

Maximum Duty = ( 1 – ( T_OFF× f_OSC) / 5 ) × 100 [%]

f_OSC:Setting frequency

Also above equation is theory value. The maximum duty may be influenced by PCB layout, FET, inductor, etc. Verification

and confirmation with the actual application is recommended.

(3) Slope

The slope block uses the clock produced by the oscillator to generate a saw-tooth wave and sends this wave to the PWM

comparator.

(4) PWM COMP

The PWM comparator determines the switching duty cycle by comparing the error amplifier COMP voltage, with the

saw-tooth signal from the slope block. The switching duty cycle is limited internally to a fixed maximum duty, and thus

cannot become 100 %.

(5)Driver(DRV, SW LOGIC)

This block receives the switching Duty determined by the PWM COMP block and generates OUTH and OUTL signals which

drive the external FETs.

Also, the minimum ON time of OUTH is designed 250ns at the minimum and the minimum OFF time is designed 400ns at

the maximum.

(6) Reference voltage (VREG5)

This block generates the internal reference voltage: 5 V. VREG5 requires an external capacitor. The FET driver supply input

(VREG5A) also requires a capacitor. A ceramic capacitor with a value of 2 μF or more with low ESR matching the VREG5

and VREG5A pin is recommended.

(7) External synchronization (SYNC, PLL)

The internal oscillator circuit can be synchronized with an external signal applied to the SYNC pin. This is done with the

help of an internal PLL circuit. In this situation the SEL pin must pulled “H”. After applying a clock to the SYNC pin and

pulling the SEL pin “H”, the internal frequency will synchronize with the applied clock frequency. For synchronization, a

clock with a frequency of 250 kHz to 600 kHz and duty of 20 % to 80 % must be used.

Note, the SEL pin should be set to H before the EN pin or it should be set to H after the soft start time.

In case of using external synchronization, a low pass filter is required for the LPF / RT pin.

(8) PGOOD pin

This pin monitors the output voltage (FB voltage). If it is within 8.5 % (typ) of the nominal output voltage, PGOOD output is

“H”. When outside the range of 8.5% the PGOOD output is pulled “L”.

The PGOOD pin is an open drain output so a pull up resistor is required when used.

(9) Overcurrent protection (OCP)

The overcurrent protection is activated when the VCCCL to CL voltage drop reaches or exceeds 90mV.

Once activated the OUTH duty will be limited and the output voltage lowered.

(10) Short circuit protection (SCP)

The short circuit protection is activated after the output voltage (FB voltage) drops below 91.5 % and the overcurrent

protection is detected 256 times (all SW pulses). Also, if the overcurrent protection is activated in a situation where the FB

voltage is equal or less than 0.5 V, this will resemble an output short and the short circuit protection will be activated.

If the short circuit protection is activated, for a period of 1024 cycles of oscillation frequency, the output will be turned off

and the SS and COMP discharged.

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

4/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

(11) Overvoltage protection (OVP)

BD9015KV-M, If the output voltage (FB voltage) rises above 108.5 %, OUTH and OUTL will turn off.

Once the output returns to a normal state the chip will recover. However, in case of light load or if recovery takes time, the

COMP voltage will drop and recovery will be done with the minimum duty cycle, which may lead to undershoot of the output.

In case this undershoot becomes an application problem, the output capacitor should be increased or the phase

compensation RC constant should be adjusted.

BD9016KV-M, If the output voltage (FB voltage) rises above 108.5 %, only OUTH will turn off. OUTL continues to turn on

and L-side FET will discharge the output capacitance. The ON pulse width of OUTL is determined by PWM COMP. If a short

to VCC is considered the countermeasures needed are described in the “Operational Notes” at page 24.

(12) Under voltage lockout circuit (UVLO)

If the VREG5 voltage drops below 3.6 V (typ) the UVLO is activated and the device will shut down.

(13) Thermal shutdown (TSD)

If the chip temperature (Tj) reaches or exceeds ca. 150 °C the output is turned off.

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

5/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Absolute Maximum Ratings

Parameter

Symbol

VCC

Limits

-0.3 to +35 ⁽¹⁾

-0.3 to VCCCL1,2

-1.5 to VCCCL1,2

-0.3 to +40

Unit

V

VCC Voltage

EXTVCC Voltage

VCCCL1, 2 Voltage

CL1, 2 Voltage

EXTVCC

VCCCL1, 2

V_{CL1, 2}

V

V_{SW1, 2}

V

SW1, 2 Voltage

V_{BOOT1, 2}

V_{BOOT1, 2-SW1, 2}

VREG5, 5A

V_{EN1, 2}

V

BOOT1, 2 Voltage

BOOT1, 2 - SW1, 2 Voltage

VREG5, 5A Voltage

EN1, 2 Voltage

V

-0.3 to +7

V

-0.3 to +7 or EXTVCC

-0.3 to EXTVCC

-0.3 to VREG5

-0.3 to +7

V

V_{SS1, 2}

V

SS1, 2 Voltage

V_{FB1, 2}

V

FB1, 2 Voltage

V_{COMP1, 2}

V_{RT / LPFC}

V_{PGOOD1, 2}

V_SEL

V

COMP1,2 Voltage

RT/LPFC Voltage

PGOOD1,2 Voltage

SEL Voltage

V

-0.3 to +7

V_SYNC

V

SYNC Voltage

-0.3 to +7

Pd

W

°C

Power Dissipation

Operating Temperature Range

Storage Temperature Range

Junction Temperature

1.1 ⁽²⁾

Topr

-40 to +105

Tstg

-55 to +150

Tjmax

+150

(1)

(2)

Pd should not be exceeded.

8.8 mW / °C reduction when Ta ≥ 25 °C if mounted on a glass epoxy board of 70 mm × 70 mm × 1.6 mm

Recommended Operating Ratings (Ta=25℃)

Parameter Symbol

Limits

3.9 to 30 ⁽¹⁾

3 to VCC

Unit

V

Supply Voltage 1

VCC, EXTVCC

VCCCL1, 2, V_{CL1, 2}

V_{BOOT1, 2 - SW1, 2}

V_O

V

Supply Voltage 2

3.2 to VREG5

0.8 to 10

V

BOOT1,2－SW1,2 Voltage

Output Voltage

V

Oscillation Frequency Range

Synchronous Frequency Range

250 to 550

250 to 600

kHz

f_OSC

f_{SYNC_IN}

(1)

In case of using less than 6V, short VCC, EXTVCC and VREG5.

Note, this is the minimum value after 4.5V or higher has been supplied to the supply pin.

www.rohm.co.jp

TSZ22111・15・001

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

6/27

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Electrical Characteristics

(Unless otherwise specified: Ta=25°C, VCC=12V, EXTVCC=12V, VCCCL1, VCCCL2=12V, V_EN1, V_EN2=5V)

Limits

Parameter

Circuit Current

Symbol

Unit

Conditions

Min.

-

Typ.

Max.

10

I_CC

I_ST

V_ENTH

R_EN

4

mA

μA

V

_EN1, V_EN2= 0 V

Ta = -40 °C to +105 °C

Shutdown Current

EN Pin Threshold Voltage

EN Pin Pull Down Resistor

VREG5

-

0

1

1.00

100

2.15

200

2.70

400

Ta = -40 °C to +105 °C

kΩ

V_EN1, V_EN2= 5 V

VREG5 Output Voltage

UVLO

VREG5

4.7

5.0

5.3

V

I_VREG5= 6 mA

VREG5 SWEEP DOWN

Ta = -40 °C to 105 °C

UVLO Operating Voltage

Hysteresis Voltage

Error Amp Block

FB Pin Source Current

Reference Voltage 1

Reference Voltage 2

Oscillator Block

V_UVLO

3.3

3.6

3.9

V

V_{UVLO_HYS}

200

400

600

mV

VREG5 SWEEP UP

V_FB1, V_FB2= 0.8 V

Ta = -40 °C to +105 °C

I_FB

0

0.13

0.800

1.00

0.808

0.812

μA

V

V_REF

1

2

0.792

0.788

FB1, FB2 pin voltage

Ta = -40 °C to +105 °C

V_REF

V

Oscillation Frequency

f_OSC

270

-

300

500

330

-

kHz

RT = 200 kΩ

RT=200 kΩ

f_{SYNC_IN}= 500 kHz

Ta = -40 °C to +105 °C

External Synchronous Frequency

f_SYNC

SYNC Pin Threshold Voltage

SYNC Pin Pull Down Resistor

SEL Pin Threshold Voltage

SEL Pin Pull Down Resistor

LPFC Charge Current

LPFC Discharge Current

Soft Start Block

V_SYNCTH

R_SYNC

V_SELTH

R_SEL

0.5

125

0.5

125

20

1.8

250

1.8

250

30

2.5

500

2.5

500

40

V

Ta = -40 °C to +105 °C

V_SYNC= 5 V

kΩ

V

Ta = -40 °C to +105 °C

V_SEL= 5 V

kΩ

μA

I_LPFCC

I_LPFCDC

V_{RT / LPFC}= 1 V

20

30

40

V_{RT / LPFC}= 1 V

V

_SS1, V_SS2= 1 V

SS Pin Charge Current

SS Pin Discharge Current

Maximum Voltage

I_SS

5

0.3

2.05

0

10

15

μA

kΩ

V

Ta = -40 °C to +105 °C

V_SS1, V_SS2= 1 V

VCC = 3 V

R_SS

0.5

1.7

V_{SS_MAX}

V_{SS_STB}

2.25

0.01

2.45

0.10

VCC = 3 V

Ta = -40 °C to +105 °C

Standby Voltage

V

* This product is not designed to be radiation-resistant.

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

7/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Electrical Characteristics

(Unless otherwise specified: Ta=25°C, VCC=12V, EXTVCC=12V, VCCCL1, VCCCL2=12V, V_EN1, V_EN2=5V)

Limits

Parameter

Driver Block

Symbol

Unit

Conditions

Min.

Typ.

Max.

OUTH Minimum ON Time

OUTH Minimum OFF Time

OUTH→OUTL Dead Time

OUTL→OUTH Dead Time

OUTH High Side ON Resistor

OUTH Low Side ON Resistor

OUTL High Side ON Resistor

OUTL Low Side ON Resistor

BOOT Pin Current Consumption

Overcurrent Protection Block

CL Pin Threshold Voltage 1

CL Pin Threshold Voltage 2

CL Pin Sink Current

T_ON

-

130

200

35

-

ns

Ω

T_OFF

T_DETHL

T_DETLH

R_{ON_HH}

R_{ON_HL}

R_{ON_LH}

R_{ON_LL}

I_BOOT

35

2.5

1.7

2.5

1.1

1

Ω

V

_BOOT= 17 V

mA

V_SW1, V_SW2= VCCCL

V_CL1

V_CL2

78

75

90

103

105

40

mV

μA

V

Ta = -40°C to +105°C

FB1, FB2 pin voltage

I_CL

7

20

Output Short Detection Voltage

PGOOD Block

V_SHORT

0.45

0.50

0.55

V_FB1, V_FB2= 0 V

Ta = -40 °C to +105 °C

PGOOD ON Resistor

R_PGOOD

I_PGOOD

V_OVER

V_LOW

0.5

-

1.5

0

2.5

1

kΩ

μA

V

_PGOOD= 5 V,

PGOOD Pin Leakage Current

V_FB1,V_FB2= 0.8 V

Ta = -40 °C to +105 °C

Output Overvoltage Detection

Voltage

0.848

0.712

0.868

0.732

0.888

0.752

V

FB1, FB2 pin voltage

Output Low Voltage Detection

Voltage

* This product is not designed to be radiation-resistant.

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

8/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Typical Performance Curves

10

9

8

7

6

5

4

3

2

1

0

100

90

Upper: 5V output

Below: 3.3V output

80

70

60

50

40

30

20

10

0

VCC = 12 V

FOSC = 350 kHz

Ta = 25°C

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

LOAD CURRENT : [A]

0

10

20

30

INPUT VOLTAGE : VIN[V]

Figure 4. Efficiency

Figure 5. Shutdown Current

808

806

804

802

800

798

796

794

792

10

8

6

4

2

0

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

AMBIENT TEMPERATURE : Ta[°C]

AMBIENT TEMPERATURE : Ta[℃]

Figure 6. Curcuit Current

Figure 7. Reference Voltage vs. Temperature

Characteristics

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

9/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Typical Performance Curves

330

320

310

300

290

280

270

100

95

RT = 200 kΩ

90

85

80

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

AMBIENT TEMPERATURE : Ta[℃]

Figure 8. CL Pin Threshold Voltage vs.

Temperature Characteristics

Figure 9. Frequency vs. Temperature

Characteristics

15

14

13

12

11

10

9

4.3

4.2

4.1

4.0

3.9

3.8

3.7

3.6

3.5

3.4

3.3

Return voltage

Operation voltage

8

7

6

5

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

AMBIENT TEMPERATURE : Ta[℃]

Figure 10. SS Charge Current vs. Temperature

Characteristics

Figure 11. UVLO Operation/Return Voltage vs.

Temperature Characteristics

www.rohm.co.jp

TSZ22111・15・001

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

10/27

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Typical Performance Curves

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.3

0.2

0.1

0.0

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

AMBIENT TEMPERATURE : Ta[°C]

AMBIENT TEMPERATURE : Ta[℃]

Figure 12. EN Threshold Voltage vs. Temperature

Characteristics

Figure 13. FB Pin Source Current vs.

Temperature Characteristics

1.0

0.9

0.8

0.7

0.6

3.0

2.5

2.0

1.5

1.0

0.5

0.0

Overvoltage detection

Low voltage detection

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

AMBIENT TEMPERATURE : Ta[℃]

AMBIENT TEMPERATURE : Ta[°C]

AMBIENT TEMPERATURE : Ta[℃]

Figure 14. PGOOD Pin ON Resistance vs.

Temperature Characteristics

Figure 15. Output Overvoltage / Low Voltage

Detection Voltage vs. Temperature Characteristics

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

11/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Timing Chart

Startup operations

Protection operations

VCC

EN

UVLO off(typ:4.0V)

VREG5

SS

COMP

OUTH

OUTL

Vo setting voltage×91.5%

Vo

PGOOD

Figure 16. Startup Operations Timing Chart

Figure 17. Protection Operations Timing Chart

Pre-bias function

Figure 18. Pre-bias Functionality Timing Chart

www.rohm.co.jp

TSZ22111・15・001

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

12/27

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Selection of External Components

(1)Setting the output L value

The coil value significantly influences the output ripple current. As shown in the

following equation, the larger the coil, and the higher the switching frequency, the lower

the ripple current.

ΔI_L

（VCC - V_O）× V_O

ΔI_L=

[A]

L × VCC × f

1/f

VCC

The optimal output ripple current setting is ca. 30% of the maximum output current.

I_L

L

I_O

ΔI_L= 0.3×I_Omax [A]

（VCC - V_O）× V_O

V_O

L =

[H]

ΔI_L× VCC × f

C_O

（ΔI_L：output ripple current, f：switching frequency）

Figure 19. Output Ripple Current

Outputting a current in excess of the coil current rating will cause magnetic saturation of the coil and will decrease efficiency. It is

recommended to allow for sufficient margin to ensure that the peak current does not exceed the coil current rating.

Use low resistance (DCR, ACR) coils to minimize coil loss and increase efficiency.

(2)Setting the output capacitor Co value

Select the output capacitor with consideration to acceptable ripple voltage (Vpp).

The following equation is used to determine the output ripple voltage.

ΔI_L

V_O

1

f

ΔV_PP= ΔI_L× R_ESR

+

×

[V]

Note. f：switching frequency

C_O

VCC

The output Co setting needs to be kept within the allowable ripple voltage range. Allow for a sufficient voltage output margin in

establishing the capacitor rating. Low ESR capacitors enable a lower output ripple voltage. Also, to meet the requirement for setting the

output startup time parameter within the soft start time range, take the conditions described in the following capacitance equation for

output capacitors into consideration.

T_SS× (I_LIMIT- I_O)

V_O

T_SS：soft start time

_LIMIT：over current detection limit

C_O

≤

I

Note: non-optimal capacitance values may cause startup problems. Especially in cases of extremely large capacitance values, the

possibility exists that the inrush current at startup will activate the overcurrent protection, thus not starting the output. Therefore, verification

and conformation with the actual application is recommended.

(3)Setting the input capacitor (C_IN)

The input capacitor serves to lower the output impedance of the power source

connected to the input pin (VCC,VCCCL,EXTVCC). Increased power supply output

impedance can cause input voltage (VCC) instability and may negatively impact

oscillation and ripple rejection characteristics. Therefore, it is necessary to place an

input capacitor in close proximity to the VCC and GND pins. Select a low ESR

capacitor with the required ripple current capacity and the capability to withstand

temperature changes without wide tolerance fluctuations. The ripple current I_RMSis

determined by the following equation.

VCC

C_IN

L

I_O

V_O

C_O

V_O（VCC - V_O）

I_RMS= I_O

×

[A]

VCC

Figure 20. Input Capacitor

Also, be certain to ascertain the operating temperature, load range and MOSFET

conditions for the application in which the capacitor will be used since capacitor

performance is heavily dependent on the application’s power supply characteristics,

PCB wiring pattern and MOSFET gate-drain capacity.

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

13/27

TSZ22111・15・001

22 .JUL.2013 Rev.001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

(4)Setting the output voltage (V_O)

The output voltage is determined by the equation below. Select a combination of R1 and R2 to obtain the required voltage.

Note that a small resistor value leads to a drop in power efficiency and that a large resistor value leads to an increase of the offset voltage

due to FB pin source current of 0.13µA(Typ).

R1 + R2

V_O= 0.8 ×

R2

Figure 21. Setting the Output Voltage

(5)Setting the oscillation frequency (f_OSC

)

The setting of the internal oscillation frequency is possible by use of the resistor value connecter to RT.

The setting range is 250kHz to 550kHz. The correlation between the resistor value and the oscillation frequency is as shown in the table

and Figure 22. below.

Setting a resistor outside the range shown below may cause the switching to stop after witch operation is no longer guaranteed.

Note that in case the input/output voltage difference is small, the oscillation frequency is divided by 5, reducing the output voltage drop.

The detail behavior is described in the description of Oscillator on page 4.

700

600

RT Resistor

180kꢀ

Oscillation Frequency

250kHz

500

400

300

200

100

200kꢀ

300kHz

220kꢀ

350kHz

240kꢀ

400kHz

270kꢀ

480kHz

300kꢀ

550kHz

150

200

250

300

350

RT RESITANCE[k

]

Ω

Figure 22. RT resistor vs. oscillation frequency

(6)Setting the soft start time (T_SS)

The soft start function is necessary to prevent inrush of coil current and output voltage overshoot at startup. The Figure 23. shows the

relation between soft start time and capacitance, which can be calculated by using the equation.

10

1

0.8V(Typ) × C_SS

T_SS

=

[sec]

0.1

0.01

I

_SS（10μA (Typ)）

0.1

SS CAPACITANCE[µF]

Figure 23. Capacitance vs. Soft Start Time

Capacitance values between 0.01µF and 0.1µF are recommended. There is a possibility that an overshoot is generated in

the output due to the phase compensation, output capacitor, etc. Therefore, verification and confirmation with the actual

application is recommended. Use high accuracy components (X5R) when implementing sequential startups involving other

power sources.

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

14/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

(7)Setting the overcurrent detection value (I_LIMIT

)

When the peak of the current in the coil exceeds the overcurrent detection value, overcurrent protection is activated. The detection value

is determined by the resistor R_CSconnected between VCCCL and CL and the CL pin threshold voltage (Typ：90mV). It can be calculated

using the formula below.

VCC

VCCCL

90mV

R_CS

IL

R_CS

Overcurrent

I_LIMIT

=

[A]

CL

I_L

L

V_O

C_O

Figure 24. Setting the Overcurrent

Detection Value

Figure 25. The Point of Detecting

Overcurrent

When the overcurrent protection is activated, the output duty is limited to prevent an increase in output current. The overcurrent protection

is an auto-recovery type; when the output load returns to normal state, the output duty and output voltage also return to the normal state.

The voltage generated by the overcurrent detection resistor provides feedback to the internal SLOPE and is also used in determining the

switching duty. To prevent sub-harmonic oscillation at time of high duty cycles, the equation below needs to be satisfied.

V_O× R_CS× Duty

≤ 0.09

L× f_OSC

In case the equation above is not satisfied, revise the constants or settings.

(8)Selecting MOSFET

FET used Nch MOS

・V_DS> VCC

・V_GSM1> V_BOOT-SW

・V_GSM2> VREG5

VCC

V_DS

・Allowable current > output current + ripple current

※ Value higher than the overcurrent protection value is

recommended

I_L

L

I_O

V_GSM1

V_GSM2

V_O

※Select a low ON resistance MOSFET for high efficiency

V_DS

C_O

※Note

In case the input capacitance of the output FET is extremely large,

the possibility exists that the efficiency decreases due to the

shortening a dead time of the upper and lower output FET. For the

input capacitance of the output FET, a value of 1200pF or lower is

recommended. As these characteristics are influenced by the PCB

layout and the type of the components verification and

confirmation with the actual application is recommended.

Figure 26. Selecting MOSFET

(9)Selecting Schottky barrier diode

VCC

・Reverse voltage V_R> VCC

・Allowable current > output current + ripple current

※ Value higher than the over current protection value is

recommended.

I_L

L

I_O

V_O

C_O

※Select a diode with a low forward voltage and fast recovery for

high efficiency.

V_R

Figure 27. Selecting Schottky Barrier Diode

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

15/27

TSZ22111・15・001

22 .JUL.2013 Rev.001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

(10)Setting the phase compensation circuit

Negative feed back stability conditions are as follows.

・At time of unity gain (0dB) the phase delay should be 135˚ or less. (i.e. the phase margin is 45˚ or higher)

Also, the crossover frequency (frequency of 0dB) of the whole system is set to 1/10 of less of the switching frequency

because DC/DC converter applications are sampled by the switching frequency.

In summary, the characteristics that the application target is as follows.

・At time of unity gain (0dB), the phase delay should be 135˚ or less. (i.e. the phase margin is 45˚ or higher)

・fc is less than 1/10 of switching frequency

The response is determined by the limitation of fc. Therefore, the switching frequency is required to high in order to

increase the response.

The phase compensation is set by the capacitor and resistor which are connected in series to the COMP pin.

Achieving stability by using the phase compensation is done by cancelling the fp1 and fp2 (error amp pole and power stage

pole) of the regulation loop by use of fz1. fp1, fp2 and fz1 are determined in the following equations.

g_m

fp1 =

fp2 =

2π× C1 × A_V

1

2π× C_O× R_LOAD

1

fz1 =

2π× C1 × R1

Also, by inserting a capacitor in C2, phase lead fz2 can

be added.

1

fz2 =

Figure 28. Setting Phase Compensation Circuit

2π× C2 × R2

In the formula above, g_mis the error amp transconductance (400μA/V) and A_Vis the error amp voltage gain (200V/V).

This setting is obtained by using a simplified calculation, therefore, adjustment on the actual application may be required.

Also as these characteristics are influenced by the PCB layout, load conditions, etc. verification and confirmation with the

actual application at time of mass production design is recommended.

(11)Setting the BOOT pin serial resistors (R_BOOT

)

By connecting resistors to the BOOT pin, it becomes possible to

adjust the turn on delay and rise time at switching. Placing the

resistors also allows for the adjustment of the upper and lower FET

dead time and is effective as noise countermeasure at time of

switching.

VREG5

BOOT

SW

I_BOOT

I_CHARGE

C_BOOT

R_BOOT

As shown in Figure 29., place the resistor at R_BOOTso as not to

limit the charge current I_CHARGEof the capacitor C_BOOTfor the BOOT

pin boost. In case the resistor R_BOOTis large, the possibility exists

that voltage drop is generated between the BOOT pin voltage

is no longer guaranteed. Therefore set R_BOOTto no higher than 10ꢀ.

Figure 29. Setting the BOOT pin Serial Resistors

(12)Concerning switching pulse jitter and split

There are cases in which, when the switching pulse duty is at ca.

50%, it is influenced by the other switching pulse resulting in jitter

or split (small duty and large duty are alternately output) on/off the

switching output. If the jitter and split cause a problem take the

steps listed below.

(a) Serially place resister R_CLto pin CL

(b) Place resister R_OUTLto the lower gate.

Generally, the jitter and split are suppressed with R_CLresister of

200ꢀ to 300ꢀ and R_OUTLresister of 4.7ꢀ to 10ꢀ.

However, as these characteristics are influenced by the PCB

layout, used FET, etc. Verification and confirmation with the actual

application is recommended.

Figure 30. Measures of Jitter and Split

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

16/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Frequency Characteristic Evaluation

The DC/DC converter’s frequency characteristics (phase margin, gain margin) can be measured by using a gain-phase

analyzer or FRA.

1．Confirm that output does not oscillate in a closed loop with maximum

load.

2．Isolate ① and ② and insert Vm (amplitude of ca. 20mVpp to

100mVpp).

3．Measure (probe) the oscillation of ①to that of ②.

The phase margin can also be measured with the load responsiveness.

Maximum

load

Measure the variation in output voltage when instantaneously changing

Output load

the load from no load to maximum load. If ringing occurs, the phase

margin is insufficient. If no ringing occurs, the phase margin is sufficient.

The actual phase margin can not be measured.

0

Phase margin is insufficient

Output voltage

Phase margin is enough

t

Figure 31. Measurement of Frequency Characteristic

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

17/27

TSZ22111・15・001

22 .JUL.2013 Rev.001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Application circuit example

※Application circuit is same both BD9015KV-M and BD9016KV-M

Parameter

Input voltage

Symbol

VCC

Spec example

6V to 28V

5V / 4A

V_O1 / I_O1

V_O2 / I_O2

ΔV_PP

Output voltage/ current

3.3V /4A

Output ripple voltage

Switching frequency

Operating temp. range

20mVp-p

f_OSC

350kHz

Ta

-40°C to 105°C

R_CS3

R_CS4

R_CS2

R_CS1

C_IN1 C_IN2

C_IN3 C_IN4

C_IN5

D3

D4

R_CL2

R_BOOT2

R_CL1

R_BOOT1

C_BOOT1

C_BOOT2

L1

L2

R_OUTL1

R_OUTL2

D1

D2

C_O1 C_O

2

C_O

3

C_O4 C_O

5

C_O6

M1

M2

BD9015KV/

BD9016KV

C1

R1

C3

R4

C_VREG5A

C_VREG5

C_IN6

R3

R6

R2

R5

C2 C_SS1

C_SS2C4

C5

RT

R7

R_PGOOD1

R_PGOOD2

※D1 and D2 are optional. If you use D1 and

D2, efficiency increases from 1% to 3%.

Figure 32. Reference circuit

Tektronix MSO5204

NF FRA5087

Tektronix MSO5204

100

90

80

70

60

50

40

30

20

10

0

Phase

I_O1 : 2.0A/div @ DC

Gain

V_O1 : 300mV/div @ AC

V_O1 : 10mV/div @ AC

VCC=12V

3 4

2.0us/div

100µs/div

VCC=12V

I_O1=2.0A

VCC=12V

I_O1=4.0A

VCC=12V

0

1

2

I_O1 Step 0A to 4.0A

OUTPUT CURRENT:Io[A]

Figure 34. Output Ripple

voltage（V_O1=5V）

Figure 36. Load Response

Figure 33. Efficiency

Figure 35. Frequency

Characteristic（V_O1=5V）

（V_O1=5V）

Tektronix MSO5204

NF FRA5087

Tektronix MSO5204

100

90

80

70

60

50

40

30

20

10

0

Phase

I_O2 : 2.0A/div @ DC

Gain

V_O2 : 200mV/div @ AC

V_O2 : 10mV/div @ AC

2.0us/div

VCC=12V

3 4

100µs/div

VCC=12V

I_O2=2.0A

VCC=12V

I_O2=4.0A

VCC=12V

I_O2 Step 0A to 4.0A

0

1

2

OUTPUT CURRENT:Io[A]

Figure 38. Output Ripple

Figure 37. Efficiency

Figure 39. Frequency

Figure 40. Load Response

voltage（V_O2=3.3V）

（V_O2=3.3V）

Characteristic（V_O2=3.3V）

（V_O2=3.3V）

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

18/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

No

R1

Package

1005

Parameters

43kΩ,1%,1/16W

8.2kΩ,1%,1/16W

5.6kΩ,1%,1/16W

47kΩ,1%,1/16W

15kΩ,1%,1/16W

3.9kΩ,1%,1/16W

1kΩ,1%,1/16W

220kΩ,1%,1/16W

300Ω,1%,1/16W

10Ω,1%,1/16W

4.7Ω,1%,1/16W

100kΩ,1%,1/16W

20mΩ,1%,1/3W

100pF,CH,50V

4700pF,R,50V

Part Name(series)

MCR01 Series

UCR10 Series

GCM Series

RB050L-40

Type

Chip resistor

Chip resister

Chip resistor

Ceramic

Manufacturer

ROHM

R2

1005

R3

1005

ROHM

R4

1005

ROHM

R5

1005

ROHM

R6

1005

ROHM

R7

1005

ROHM

RT

1005

ROHM

R_CL1

R_CL2

R_BOOT1

R_BOOT2

R_OUTL1

R_OUTL2

R_PGOOD1

R_PGOOD2

1005

ROHM

1005

ROHM

1005

ROHM

1005

ROHM

1005

ROHM

1005

ROHM

1005

ROHM

1005

ROHM

R_CS

1

2

3

4

2012

ROHM

2012

ROHM

2012

ROHM

2012

ROHM

C1

C2

1005

MURATA

ROHM

1005

Ceramic

100pF,CH,50V

6800pF,R,50V

C3

1005

Ceramic

C4

1005

Ceramic

4700pF,R,50V

C5

1005

Ceramic

0.1uF,R,16V

C_SS1

C_SS2

C_BOOT1

C_BOOT2

C_VREG5A

C_VREG5

C_IN1

C_IN2

C_IN3

C_IN4

C_IN5

C_IN6

C_O1

C_O2

C_O3

C_O4

C_O5

C_O6

D1

1005

Ceramic

0.1uF,R,16V

1005

Ceramic

0.1uF,R,16V

1005

Ceramic

0.1uF,R,16V

1005

Ceramic

1uF,X7R,16V

1608

Ceramic

1uF,X7R,16V

1608

Ceramic

4.7uF,X7R,50V

1uF,X7R,50V

3225

Ceramic

3225

Ceramic

3225

Ceramic

3225

Ceramic

3216

Ceramic

1uF,X7R,50V

3216

Ceramic

22uF,X7R,16V

AVERAGE I = 3A MAX

AVERAGE I = 1A MAX

Drain Current = 9A MAX

10µH

3225

Ceramic

3225

Ceramic

3225

Ceramic

3225

Ceramic

3225

Ceramic

3225

Ceramic

PMDS

PMDU

SOP8

6.36 x 3.56 x 6.1mm

Schottky Diode

Transistor

Coil

D2

RB050L-40

ROHM

D3

RB160M-40

SP8K4

ROHM

D4

ROHM

M1

ROHM

M2

SP8K4

ROHM

L1

XAL6060 Series

Coilcraft

10µH

L2

Coil

※These setting values are the reference. As these characteristics may be influenced by the PCB layout pattern, used

components, etc. Verification and confirmation with the actual application is recommended.

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

19/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Input filter

Figure 41. Filter circuit

For reference, lists the input filter circuits for EMC measure to Figure 41..

The π type filter is 3^rdorder LC filter. This is used when it is not sufficient to use only the decoupling capacitor.

The π type filter can behave good performance as EMC filter by large attenuation characteristic.

TVS(Transient Voltage Suppressors) is used for primary protection of automotive battery power supply line.

The general zener diode is insufficient because it is necessary to tolerate the high energy of load dump condition.

The TVS is in below list is recommended. The reverse polarity diode is required for protection when the power supply,

such as battery, is connected in reverse by mistake.

No

L

Part Name(series)

XAL Series

Manufacturer

Coilcraft

CLF Series

TDK

C

CD Series

NICHICON

VISHAY

UD Series

TVS

D

SM8 Series

S3A thru S3M series

VISHAY

Recommendation Parts Vender List

Show recommendation parts vender below.

No

C

L

Type

Manufacturer

URL

Electrolytic Capacitor

Ceramic Capacitor

Coils

NICHICON

MURATA

Coilcraft

TDK

www.nichicon.com

www.murata.com

www.coilcraft.com

www.global.tdk.com

www.sumida.com

www.vishay.com

www.rohm.com

L

Coils

L

Coils

Sumida

VISHAY

ROHM

D

Diodes

Diodes/Resister

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

20/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Power Dissipation

VQFP48C

1.2

1

② 1.10W

0.8

0.6

0.4

0.2

0

① 0.75W

0

25

50

75

100

125

150

AMBIENT TEMPERATURE: Ta(

)

(°C)

℃

①：IC Unit

②：IC mounted on ROHM standard board

（Glass epoxy board of 70mm×70mm×1.6mm）

Figure 42. Thermal derating characteristic

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

21/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

I/O equivalence circuits

VCCCL1/VCCCL2

VREG5

BOOT1

/BOOT2

SYNC

SEL

OUTH1

/OUTH2

SW1

/SW2

VREG5

3V

SS

FB1

/FB2

EXTVCC

VREG5

VREG5A

EXTVCC

EN1

/EN2

www.rohm.co.jp

TSZ22111・15・001

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

22/27

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Operational Notes

1) Absolute maximum ratings

Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in

damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage

(e.g. short circuit, open circuit, etc). Therefore, if any special mode is being considered with values expected to exceed

the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered.

2) GND electric potential

Keep the GND pin potential at the lowest (minimum) potential under any operating condition. Furthermore, excluding

the SW pin, the voltage of all pin should never drop below that of GND. In case there is a pin with a voltage lower than

GND implement countermeasures such as using a bypass route.

3) Power dissipation

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. Therefore allow for sufficient margins to ensure use within the power

dissipation rating.

4) Input power supply

Concerning the input pins VCC, VCCCL and EXTVCC, the layout pattern should be as short as possible and free from

electrical interferences.

5) Electrical characteristics

The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply

voltage and external components. Transient characteristics should be sufficiently verified.

6) Thermal shutdown (TSD)

This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation

should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction

temperature(Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below the

TSD threshold the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

7) Inter-pin shorting and mounting errors

Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in

damaging the IC. Also, shorts caused by dust entering between the output, input and GND pin may result in damaging

the IC.

8) In some applications, the VCC and pin potential might be reversed, possibly resulting in circuit internal damage or

damage to the elements. For example, while the external capacitor is charged, the VCC shorts to the GND. For the

VREG5 output pin use a capacitor with a capacitance with less than 100μF. We also recommend using reverse polarity

diodes in series or a bypass diode between all pins and the VCC pin.

9) Operation in strong electromagnetic fields

Use caution when operating in the presence of strong electromagnetic fields, as this may cause the IC to malfunction.

10) In applications where the output pin is connected to a large inductive load, a counter-EMF ( electromotive force) might

occur at startup or shutdown. A diode should be added for protection.

11) Testing on application boards

The IC needs to be discharged after each test process as, while using the application board for testing, connecting a

capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the

assembly setup is grounded and take sufficient caution with transportation and storage. Also, make sure to turn off the

power supply when connecting and disconnecting the inspection equipment.

12) GND wiring pattern

When both a small-signal GND and a high current GND are present, single-point grounding (at the set standard point)

is recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage

changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal

GND. Similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component GND.

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

23/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

13) SS pin

Note that the SS pin will go into test mode when supplied with 5V or more.

14) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a

parasitic diode or transistor. Relations between each potential may form as shown in the example below, where a

resistor and transistor are connected to a pin:

○

With the resistor, when GND＞Pin A, and with the transistor(NPN), when GND＞Pin B:

The P-N junction operates as a parasitic diode

With the transistor (NPN), when GND＞Pin B:

The P-N junction operates as a parasitic transistor by interacting with the N layers of elements in proximity to the

parasitic diode described above

Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between

circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not

employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than

the (P substrate) GND.

The structure example of the IC

15) Vo short to VCC (BD9016KV-M)

When the over voltage protection is activated by supplying voltage to Vo from externally, for instance Vo is shorted to

VCC in application, the large current may appear in coil and L-side FET since the output capacitor is discharged by the

over voltage protection. A reverse protection diode should be added for protection.

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

24/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Ordering Information

B D 9 0 1

x

K V

-

M E 2

Part Number

BD9015KV or BD9016KV

Package

KV: VQFP48C

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

VQFP48C (TOP VIEW)

Part Number Marking

LOT Number

Part Number

BD9015KV-M

BD9016KV-M

Marking

BD9015KV

BD9016KV

1PIN MARK

www.rohm.co.jp

TSZ22111・15・001

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

25/27

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Physical Dimension Tape and Reel Information

Package Name

VQFP48C

1PIN MARK

Tape

Embossed carrier tape

1500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

26/27

TSZ22111・15・001

Daattaasshheeeett

BD9015KV-M BD9016KV-M

Revision History

Date

Revision

001

Changes

New Release

22.Jul.2013

www.rohm.co.jp

TSZ02201-0T1T0PB00040-1-2

22 .JUL.2013 Rev.001

27/27

TSZ22111・15・001

Daattaasshheeeett

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - SS

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - SS

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

Buy

BD9015KV-M - Web Page

Distribution Inventory

Part Number

Package

Unit Quantity

BD9015KV-M

VQFP48C

1500

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

1500

Taping

inquiry

Yes


型号：	BD9016KV-M
厂家：	ROHM
描述：	BD9016KV-M是可在宽输入范围使用的双输出同步整流开关控制器。可通过同步整流方式实现高效率，有助于所有电子设备的环保设计（低功耗化）。各输出具有EN端子、软启动功能、POWER GOOD功能，可独立控制上升沿／下降沿。此外，内置PLL电路，可与250kHz to 600kHz的外部时钟同步。电子时钟开关控制器软启动
文件：	总31页 (文件大小：1414K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD9016KV-M [ROHM]

相关型号：

BD9016KV-ME2

BD9018KV

BD901A

BD901AF

BD901AJ

BD901C

BD901D1

BD901L

BD901N

BD901S

BD901T

BD901U