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BD9035AEFV-C [ROHM]

BD9035AEFV-C是可在宽输入范围（VIN=3.8~30V）内使用的高耐压升降压开关控制器，可由1个电感线圈生成升降压输出。本IC的开关频率在所有工作温度范围（Ta=-40℃+125℃）内实现了±7％的高精度。此外，采用升降压自动控制方式，与以往的Sepic方式、H桥方式的开关稳压器相比，实现了高效电源。;
BD9035AEFV-C
型号： BD9035AEFV-C
厂家： ROHM    ROHM
描述：

BD9035AEFV-C是可在宽输入范围（VIN=3.8~30V）内使用的高耐压升降压开关控制器，可由1个电感线圈生成升降压输出。本IC的开关频率在所有工作温度范围（Ta=-40℃+125℃）内实现了±7％的高精度。此外，采用升降压自动控制方式，与以往的Sepic方式、H桥方式的开关稳压器相比，实现了高效电源。

开关 控制器 稳压器
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Datasheet  
Controller type switching regulator with high frequency, high accuracy external FET  
Automatically Controlled  
Buck-Boost Switching Regulator  
BD9035AEFV-C  
General Description  
Key Specifications  
The BD9035AEFV-C is a buck-boost switching controller  
with a high withstand voltage and a wide input range  
(VIN=3.8~30V) capable of generating buck-boost output  
with one inductor. The IC has a ±7% high accuracy  
switching frequency for the entire operating temperature  
range (Ta=-40°C~+125°C). Because of the automatically  
controlled buck-boost system the BD9035AEFV-C also  
has a higher efficiency compared to regular switching  
regulators employing Sepic or H-Bridge systems.  
„Input voltage range:  
3.8V to 30V  
(Initial startup is over 4.5V)  
100kHz to 600kHz  
„Oscillation frequency:  
„Reference voltage accuracy:  
„Circuit current at shutdown:  
„Operating temperature range:  
0.8V±1.5%  
0μA (Typ.)  
-40℃ to +125℃  
Features  
Package  
HTSSOP-B24  
W(Typ.) x D(Typ.) x H(Max.)  
7.80mm x 7.60mm x 1.00mm  
„ Power supply voltage: 40V (maximum rating)  
„ Automatically controlled buck-boost system.  
„ ±7% High accuracy switching frequency  
(Ta=-40°C~+125°C).  
„ PLL circuit for external synchronization:  
100kHz~600kHz  
„ Two-stage overcurrent protection through one external  
resistor  
„ Various protection functions  
„ Undervoltage, overvoltage output detection circuit &  
constant output monitor pin (PGOOD)  
„ AEC-Q100 Qualified  
Applications  
„ Automotive micro controller, car audio and navigation  
system, LCD TV, PDP TV, DVD, PC, etc.  
Typical Application Circuit  
Figure 2. Typical application circuit diagram  
○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays  
www.rohm.com  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
1/23  
TSZ22111・14・001  
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BD9035AEFV-C  
Pin Configuration  
(TOP VIEW)  
GND  
TEST  
VDD  
OUTL  
PGND  
N.C.  
CLKOUT  
SYNC  
RT  
SS  
OVPLVL  
FB  
VL  
COMP  
PGOOD  
VREG3  
VREG5  
EN  
N.C.  
OUTH  
N.C.  
VCC  
CL  
VCCCL  
Figure 3. Pin configuration  
Pin Description  
Pin No.  
Symbol  
GND  
TEST  
VDD  
OUTL  
PGND  
N.C.  
Function  
Pin No.  
13  
Symbol  
VCCCL Overcurrent detection setting pin 1  
EN Output ON/OFF pin  
Function  
１
2
Ground pin  
Test pin  
14  
3
NchFET drive supply pin  
NchFET drive pin  
15  
VREG5 5V internal power supply pin  
VREG3 3.5V internal power supply pin  
PGOOD Power good output pin  
COMP Error-amp output pin  
4
16  
5
Power GND pin  
17  
6
Not connected  
18  
7
VL  
PchFET gate clamp pin  
Not connected  
19  
FB  
Feedback pin  
8
N.C.  
20  
OVPLVL Overvoltage detection setting pin  
9
OUTH  
N.C.  
PchFET drive pin  
21  
SS  
RT  
Soft start time setting pin  
Frequency setting pin  
10  
11  
12  
Not connected  
22  
External synchronization pulse  
input pin  
VCC  
CL  
Power supply pin  
23  
SYNC  
Overcurrent detection setting pin 2  
24  
CLKOUT Clock pulse output pin  
www.rohm.com  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
2/23  
TSZ22111・15・001  
Daattaasshheeeett  
BD9035AEFV-C  
Block Diagram  
0.2V  
0.1V  
0.8V  
1.6V  
0.72V  
0.88V  
1.25V  
Figure 4. Block diagram  
www.rohm.com  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
3/23  
TSZ22111・15・001  
Daattaasshheeeett  
BD9035AEFV-C  
Description of Blocks  
■Error amplifier (Error Amp)  
The error amplifier compares the output feedback voltage to the 0.8V reference voltage and provides the comparison result  
as COMP voltage, which is used to determine the switching duty. Because at startup, the soft start is triggered based on the  
soft start voltage, the COMP voltage is limited by the soft start voltage.  
■Oscillator (OSC)  
The oscillation frequency is determined by the RT resistance and the current generated by the pin voltage. The oscillation  
frequency can be set in the range of 100 kHz to 600 kHz.  
■SLOPE  
The slope block uses the clock produced by the oscillator to generate a sawtooth wave and sends this wave to the PWM  
comparator.  
■PWM_BUCK  
The PWM_BUCK comparator determines the switching duty by comparing the output COMP voltage of the error amp, with  
the triangular wave of the SLOPE block.  
■PWM_BOOST  
The PWM_BOOST comparator determines the switching duty by comparing the output voltage of the inverting amplifier, with  
the triangular wave of the SLOPE block.  
■PGOOD pin  
1) Output overvoltage detection (OVP)  
The PGOOD pin monitors the OVPLVL voltage and outputs “H” if the voltage is less than 0.88V (Typ.) and outputs “L”  
if the voltage exceeds 0.88V (Typ.).  
2) Output undervoltage detection (SCP)  
The PGOOD pin monitors the output voltage (FB) and outputs “H” if the output voltage exceeds 90% (Typ.) and  
outputs “L” if the voltage is less than 90% (Typ.).  
Because the PGOOD pin is an open drain output, a pull up resistor should be connected when the pin is used.  
■Overcurrent protection function (OCP_L, OCP_H)  
The overcurrent protection has a two-stage system with a control method as shown below.  
1) OCP low level operations  
In case the inter VCCL-CL pin voltage exceeds 100mV (Typ.) the chip goes into OCP low level operations and the  
OUTH and OUTL pin pulses are limited. Also, in case this pulse limitation status continues for 256clk in a situation  
where the FB pin voltage drops below the undervoltage detection voltage VLOW, the soft start pin capacitor is  
discharged and the output is turned OFF for 8192clk.  
During the 8192clk in which the output is turned OFF the logic of OUTH and OUTL pin changes as follows; OUTH=H  
and OUTL=H. After the 8192clk the chip returns to normal operations and the soft start pin is recharged.  
2) OCP high level operations  
In case the inter VCCL-CL pin voltage exceeds 200mV (Typ.), the chip goes into OCP high level operations, the soft  
start pin capacitor is discharged and the output is turned OFF for 8192clk. During the 8192clk in which the output is  
turned OFF the logic of OUTH and OUTL pin changes as follows; OUTH=H and OUTL=H. After the 8192clk the chip  
returns to normal operations and the soft start pin is recharged.  
Figure 5. Timing chart of two-stage overcurrent protection operations  
www.rohm.com  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
4/23  
TSZ22111・15・001  
Daattaasshheeeett  
BD9035AEFV-C  
■Overvoltage protection function (OVPH)  
In case the OVPLVL pin voltage exceeds 1.25V (Typ.), the soft start pin capacitor is discharged and the output is turned OFF  
for 8192clk. During the 8192clk in which the output is turned OFF the logic of OUTH and OUTL pin changes as follows;  
OUTH=H and OUTL=H. After the 8192clk the chip returns to normal operations and the soft start pin is recharged.  
Figure 6. Overvoltage protection timing chart  
■Soft Start  
The soft start block provides a function to prevent the overshoot of the output voltage Vo through gradually increasing the  
normal rotation input of the error amplifier when power supply turns ON to gradually increase the switching duty. The soft  
start time is set by the charge capacity of the soft start pin capacitor. (Refer to P. 17)  
■Low voltage lockout circuit (UVLO)  
This is a Low Voltage Error Prevention Circuit.  
This prevents internal circuit error during increase of Power supply Voltage and during decline of Power supply Voltage.  
If the VCC drops below 3.4V (typ.), the UVLO is activated and the circuit is shut down.  
■Thermal protection circuit (TSD)  
In order to prevent thermal destruction/thermal runaway of this IC, the TSD block will turn OFF the output when the chip  
temperature reaches approximately 150℃ or more. When the chip temperature falls to a specified level from thermal  
shutdown detection, the output will reset. However, since the TSD is designed to protect the IC, the margin for thermal  
design must be provided to guarantee that the chip junction temperature should be less than 150°C, which is the thermal  
shutdown detection temperature.  
www.rohm.com  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
5/23  
TSZ22111・15・001  
Daattaasshheeeett  
BD9035AEFV-C  
Absolute Maximum Ratings  
Parameter  
Symbol  
VCC  
Limits  
Unit  
V
VCC voltage  
40 *1  
EN voltage  
EN  
VCC  
V
VCCCL voltage  
CL voltage  
VCCCL  
VCL  
VCC  
V
VCCCL  
V
Inter VCC-VL voltage  
VDD voltage  
VCC-VL  
VDD  
13  
V
VCC or 7 (whichever is lower)  
V
VREG3 voltage  
VREG5 voltage  
SS voltage  
VREG3  
VREG5  
SS  
VCC or 7 (whichever is lower)  
V
VCC or 7 (whichever is lower)  
V
VREG3  
VREG3  
VREG3  
VREG3  
VREG3  
VREG3  
4.00  
V
FB voltage  
FB  
V
OVPLVL voltage  
COMP voltage  
OVPLVL  
COMP  
SYNC  
PGOOD  
Pd  
V
V
SYNC voltage  
V
PGOOD voltage  
Power dissipation *2  
Operating temperature range  
Storage temperature range  
Junction temperature  
V
W
ºC  
ºC  
ºC  
Topr  
-40～+125  
-55～+150  
150  
Tstg  
Tjmax  
*1  
*2  
Pd and ASO should not be exceeded.  
If mounted on a standard ROHM 4 layer PCB (copper foil area: 70x70mm) (Standard ROHM PCB size: 70x70x1.6mm)  
Reduce by 32mW for every 1℃ increase. (Above 25℃)  
Recommended Operating Rating(Ta=-40℃～125℃)  
Maximum ratings  
Parameter  
Symbol  
Unit  
Min.  
Max.  
30  
Voltage power supply  
VCC  
FOSC  
FSYNC  
3.8 *3  
100  
V
Oscillation frequency  
600  
600  
kHz  
kHz  
External synchronization frequency  
100  
*3  
Initial startup is over 4.5V  
www.rohm.com  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ22111・15・001  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
6/23  
Daattaasshheeeett  
BD9035AEFV-C  
Electrical Characteristic (unless otherwise specified: Ta=-40~125°C, VCC=12V, EN=5V)  
Limits  
Parameter  
Symbol  
Unit  
Condition  
MIN.  
TYP.  
MAX.  
【Circuit Current】  
Circuit current  
IVCC  
IST  
-
-
7
0
15  
10  
mA  
Circuit current at shutdown  
【EN】  
μA  
EN=0V  
EN pin ON threshold voltage  
EN pin OFF threshold voltage  
EN pull down resistance  
【VREG3】  
VENON  
VENOFF  
REN  
2.5  
-
-
-
-
V
V
0.5  
750  
188  
375  
kΩ  
VREG3 output voltage  
【VREG5】  
VVREG3  
VVREG5  
3.3  
4.5  
3.5  
5.0  
3.7  
5.4  
V
V
VREG5 output voltage  
【UVLO】  
UVLO_VCC detection voltage  
UVLO hysteresis voltage  
【Error amp】  
VUVLO  
3.1  
0.4  
3.4  
0.6  
3.7  
0.8  
V
V
VUVLOHYS  
FB input bias current  
Reference voltage 1  
Reference voltage 2  
【Soft start】  
IFB  
-
0
-
μA  
V
FB=VFB2  
Ta=25 ºC  
VFB1  
VFB2  
0.792  
0.788  
0.800  
0.800  
0.808  
0.812  
V
Ta=-40 ºC～+105 ºC  
Soft start charge current  
【Oscillator】  
ISS  
5
10  
15  
μA  
SS=0.1V  
Oscillation frequency  
FOSC  
FSYNC  
VSYNC  
RSYNC  
DONMAX  
DONMIN  
326  
-
350  
350  
1.8  
250  
-
375  
-
kHz  
kHz  
V
RT=33kΩ  
External synchronization  
frequency  
SYNC=350kHz  
SYNC threshold voltage  
0.5  
125  
80  
-
2.5  
500  
-
SYNC pull down resistance  
SYNC input maximum ON duty  
SYNC input minimum ON duty  
kΩ  
%
SYNC=3V  
-
20  
%
www.rohm.com  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
7/23  
TSZ22111・15・001  
Daattaasshheeeett  
BD9035AEFV-C  
Limits  
TYP.  
Parameter  
Symbol  
Unit  
Condition  
MIN.  
MAX.  
【Driver】  
OUTH pin upper ON resistance  
OUTH pin lower ON resistance  
OUTL pin upper ON resistance  
OUTL pin lower ON resistance  
Boost max duty 1  
RONHH  
RONHL  
-
-
1.7  
3
-
-
-
-
-
-
Ω
Ω
Ω
Ω
%
%
RONLH  
-
24  
22  
92  
-
RONLL  
-
DBSTMAX1  
DBSTMAX2  
-
f=600kHz  
VCC=3.8V  
Boost max duty 2  
60  
【OCP】  
Overcurrent detection CL pin  
voltage 1  
VCL1  
VCL2  
86  
100  
200  
114  
228  
mV  
mV  
Inter VCC-VL voltage  
Inter VCC-VL voltage  
Overcurrent detection CL pin  
voltage 2  
172  
【PGOOD】  
PGOOD pin ON resistance  
PGOOD pin leak current  
RPG  
IPG  
-
0.1  
0
0.4  
1
kΩ  
μA  
V
PGOOD=0.15V,FB=0V  
PGOOD=3.3V,FB=0.8V,  
Ta=-40~+105 ºC  
-
Output overvoltage detection  
voltage  
VOVER  
VLOW  
0.85  
0.70  
0.88  
0.72  
0.91  
0.74  
OVPLVL voltage  
FB voltage  
Output undervoltage detection  
voltage  
V
www.rohm.com  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
8/23  
TSZ22111・15・001  
Daattaasshheeeett  
BD9035AEFV-C  
Typical Performance Curves (unless otherwise specified: Ta=25°C)  
95  
90  
85  
80  
75  
10  
9
8
7
6
5
4
3
2
1
0
f=350kHz  
Vo=6V  
70  
65  
60  
55  
50  
VCC=3.8V  
VCC=6V  
VCC=12V  
0.0  
0.5  
1.0  
1.5  
2.0  
-40 -20  
0
20 40 60 80 100 120  
LOAD CURRENT [A]  
Figure 7. Efficiency  
AMBIENT TEMPERATURE : Ta[℃]  
Figure 8. Circuit current at shutdown vs.  
temperature characteristics  
(Vo=6V, fosc=350 kHz)  
9.0  
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
1.0  
0.9  
0.8  
0.7  
0.6  
-40 -20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
AMBIENT TEMPERATURE : Ta[℃]  
AMBIENT TEMPERATURE : Ta[  
]
℃
Figure 9. Circuit current vs. temperature  
characteristics  
Figure 10. Reference voltage vs.  
temperature characteristics  
www.rohm.com  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
9/23  
TSZ22111・15・001  
Daattaasshheeeett  
BD9035AEFV-C  
Typical Performance Curves (unless otherwise specified: Ta=25°C)  
350  
349  
348  
347  
346  
345  
344  
343  
342  
341  
340  
250  
200  
150  
100  
50  
VCL1  
RT=33kΩ  
VCL2  
0
-40 -20  
0
20  
40  
60  
80  
100  
-40 -20  
0
20  
40  
60  
80 100  
AMBIENT TEMPERATURE : Ta[  
]
℃
AMBIENT TEMPERATURE : Ta[℃]  
Figure 11. Overcurrent detection CL pin voltage  
vs. temperature characteristics  
Figure 12. Oscillating frequency vs. temperature  
characteristics  
11.0  
10.8  
10.6  
10.4  
10.2  
10.0  
9.8  
4.3  
4.2  
4.1  
4.0  
3.9  
3.8  
3.7  
9.6  
Detection voltage(VUVLO)  
3.6  
3.5  
3.4  
Return voltage  
9.4  
9.2  
9.0  
-40 -20  
0
20  
40  
60  
80  
100  
-40 -20  
0
20  
40  
60  
80 100 120  
AMBIENT TEMPERATURE : Ta[℃]  
AMBIENT TEMPERATURE : Ta[℃]  
Figure 13. Soft start charge current vs.  
temperature characteristics  
Figure 14. UVLO detection/return voltage vs.  
temperature characteristics  
www.rohm.com  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ22111・15・001  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
10/23  
Daattaasshheeeett  
BD9035AEFV-C  
2.10  
2.05  
2.00  
1.95  
1.90  
1.85  
1.80  
1.75  
1.70  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
FB=0V  
-40 -20  
0
20  
40  
60  
80 100  
-40 -20  
0
20  
40  
60  
80  
100  
AMBIENT TEMPERATURE : Ta[℃]  
AMBIENT TEMPERATURE : Ta[℃]  
Figure 15. EN threshold voltage vs. temperature  
characteristics  
Figure 16. FB pin bias current vs. temperature  
characteristics  
0.20  
0.18  
0.16  
0.14  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
0.90  
0.85  
0.80  
0.75  
0.70  
VOVER  
VLOW  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20  
40  
60  
80 100  
AMBIENT TEMPERATURE : Ta[℃]  
AMBIENT TEMPERATURE : Ta[℃]  
Figure 17. PGOOD pin ON resistance vs.  
temperature characteristics  
Figure 18. Output overvoltage / undervoltage  
detection voltage vs. temperature characteristics  
www.rohm.com  
TSZ02201-0T1T0AL00110-1-2  
19.Feb.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
11/23  
TSZ22111・15・001  
Daattaasshheeeett  
BD9035AEFV-C  
Application Example  
N.B. There are many factors (PCB, output current, etc.) that can affect the DCDC characteristics.  
Please verify and confirm using practical applications.  
N.B. No connection (N.C) pin should not be connected to any other lines.  
N.B. Be sure to connect the TEST pin to ground.  
N.B. In case the external synchronization function is not used, be sure to connect SYNC pin to ground.  
N.B. This IC is not designed to operate as BOOST or BUCK application with single MOSFET. Be sure to use both M1 & M2.  
N.B. If EN pin is connected to VCC pin, please insert REN 150kΩ between the pins.  
REN  
CVCCA CVCCB  
EN  
VREG3  
VREG5  
VCC  
VCCCL  
CL  
BAT  
CVREG3  
power gnd  
RCL  
M1  
power gnd  
CVREG5  
power gnd  
CVL  
L1  
CLKOUT  
SYNC  
RT  
OUTH  
DB  
Vo  
CVO  
VL  
RRT  
Vo  
DA  
power gnd  
COMP  
FB  
VREG5  
power gnd  
RCO  
CFB  
CCOB  
Vo  
RFBB  
CCOA  
VDD  
RFBC  
M2  
OUTL  
PGND  
CVDD  
RFBA  
ROVB  
ROVA  
OVPLVL  
TEST  
power gnd  
VREG3  
RPGD  
SS  
GND  
PGOOD  
CSS  
An example of parts values：  
In case of VCC=3.8～30V, Vo=5V, Io=0～3A, 350kHz  
Parts No.  
DA  
Value  
Parts No.  
L1  
Value  
RB225NS-40  
RB225NS-40  
RSJ250P10  
RSJ450N04  
13.33m  
10μ (TDK SLF series)  
100μ(16V)  
2.2k  
DB  
CVO  
M1  
RCO  
M2  
RFBA  
RFBB  
RFBC  
ROVA  
ROVB  
CCOA  
CCOB  
CFB  
15.6k  
RCL  
82k  
REN  
150k  
330  
RRT  
33k  
15.6k  
RPGD  
CVDD  
CVL  
47k  
82k  
1μ (10V)  
0.015μ (10V)  
100p (10V)  
680p (10V)  
0.1μ (50V)  
2.2μ (50V)  
220μ (50V)  
0.47μ (10V)  
0.47μ (10V)  
0.047μ (10V)  
CVCCA  
CVCCB  
CVREG3  
CVREG5  
CSS  
Directions for pattern layout of PCB  
1) Design the wirings shown by heavy lines as short as possible.  
2) Place the input ceramic capacitor CVCCA, CVCCB as close to the M1 as possible.  
3) Place the RRT as close to the GND pin as possible.  
4) Place the RFBA and RFBB as close to the FB pin as possible and provide the shortest wiring from the FB pin.  
5) Place the ROVA and ROVB as close to the OVPLVL pin as possible and provide the shortest wiring from the OVPLVL pin.  
6) Place the RFBA, RFBB, ROVA, and ROVB as far away from the L as possible.  
7) Separate power GND and signal GND so that SW noise doesn’t affect the signal GND.  
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The control of automatic buck-boost system  
The following shows the switching state of three control modes.  
(1) Buck mode (VCC>>Vo)  
In case the input voltage is high compared to the output voltage, the chip  
will go into buck mode, resulting OUTH to repeatedly switch between H  
and L and that the OUTL will go to L (=OFF). This operation is the same as  
that of standard step-down switching regulators.  
switching  
L
OUTH  
Below, the OUTH and OUTL waveforms are shown.  
OUTL  
IL  
VCC × Dpon = Vo  
(eq.1)  
Figure 19.  
(2) Buck-Boost mode (VCC≒Vo)  
In case the input voltage is close to the output voltage, the chip will go into buck-boost mode, resulting both the OUTH and  
OUTL to repeatedly switch between H and L. Concerning the OUTH, OUTL timing, the chip internally controls where the  
following sequence is upheld; when OUTH: H Æ L, OUTL: H Æ L.  
Shown below are the OUTH and OUTL waveforms.  
②
VCC < Vo  
①
VCC > Vo  
OUTH  
switching  
switching  
OUTH  
switching  
switching  
OUTL  
IL  
OUTL  
IL  
Figure 20.  
Figure 21.  
※The timing excludes the SW delay  
The relationship between ON duty of PMOS (Dpon), ON duty of NMOS (Dnon), VCC and Vo is shown in the following  
equation.  
VCC × Dpon / (1-Dnon) = Vo  
(eq.2)  
The formula for calculation of Dpon and Dnon are shown in P.15.  
(3) Boost mode (VCC<<Vo)  
In case the input voltage is low compared to the output voltage, the chip  
will go into boost mode, resulting OUTH to go to L (=ON) and OUTL will  
repeatedly switch between H and L. This operation is the same as that of  
standard step-up switching regulators.  
Below, the OUTH and OUTL waveforms are shown  
Vo × (1-Dnon) = VCC  
(eq.3)  
Figure 22.  
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(4) Mode transfer voltage and duty control  
Vo, the gain of the inverting amplifier and the cross duty determines the transfer voltage at buck to buck-boost mode and  
buck-boost to boost mode. The general description is shown below.  
The duty of OUTH is controlled by output of error amp (COMP) and SLOPE voltage.  
Also, OUTL duty is controlled by the output voltage of the inverting amplifier in chip (BOOSTCOMP) and SLOPE voltage.  
In case VCC = Vo, because COMP voltage becomes equal to BOOSTCOMP voltage, OUTH and OUTL switch  
simultaneously.  
VCC=Vo  
(Typ.)  
COMP  
100%  
Cross duty  
85%(Typ.)  
SLOPE  
0%  
BOOSTCOMP  
Buck  
Buck-Boost  
Boost  
Figure 23. Buck-Boost operation controlled by COMP, BOOSTCOMP and SLOPE voltage  
ON duty of PMOS in this condition is called the cross duty (Dx = 0.85, Typ.). Dpon and Dnon can be calculated by the  
following equation, assuming the gain of the inverting amplifier as A (1.5, Typ.).  
Dnon = 1 – Dx + A (Dpon – Dx)  
Dnon = 1.5Dpon – 1.125  
(eq.4)  
(※)  
From eq.3, eq.4 and Dpon=1, the input voltage at transition between buck-boost and boost mode is calculated by following;  
VCC = {Dx – A (1 – Dx)} Vo  
VCC = 0.625×Vo  
(※)  
Also, from eq.1, eq.4 and Dnon=1, the input voltage at transition between buck-boost and buck mode is calculated by  
following;  
VCC = Vo×A / {(1 + A)Dx – 1}  
VCC = 1.333×Vo  
(※)  
※in case of A=1.5(Typ.) and Dx=0.85(Typ.)  
88  
87  
86  
85  
84  
83  
82  
81  
Be sure to confirm Dx and A values under the actual application because  
these parameters vary depending on conditions of use and parts.  
Dx varies with oscillating frequency shown in Fig.24.  
In addition, ‘A’ value can be calculated by Δdnon/Δdpon.  
PMOS: RSD080P05  
NMOS: RSD150N06  
0
100 200 300 400 500 600 700 800  
Frequency[kHz]  
Figure 24. Cross duty vs. frequency  
characteristics  
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Selection of Components Externally Connected  
(1)Setting the output L value  
The coil value significantly influences the output ripple current. Thus, as seen in bellow, the larger the coil, and the higher  
the switching frequency, the lower the drop in ripple current. The optimal output ripple current setting is 30% of maximum  
current.  
Buck mode  
Buck-Boost mode  
VCC < Vo  
Boost mode  
VCC > Vo  
ꢀ
_
ΔIL：ripple current, I L：average coil current, f：oscillating frequency  
Dpon：PMOS ON duty = Vo×Dx (1+A) / (VCC+A×Vo)  
=2.13×Vo / (Vcc+1.5×Vo) (Typ.)  
Dnoff：NMOS ON duty = (1+A)×Dx – A×Dpon  
=2.13 – 1.5×Dpon (Typ.)  
An output current in excess of the coil current rating will cause magnetic saturation to the coil and decrease efficiency.  
The following equation shows the peak current ILMAX assuming the efficiency as η.  
It is recommended to provide a sufficient margin to ensure that the peak current does not exceed the coil current rating.  
ΔΙL  
1
⎛
⎜
⎞
⎟
ΙLMAX  
=
Ι +  
L
η
2
⎝
⎠
Use low resistance (DCR, ACR) coils to minimize coil loss and increase efficiency.  
(2)Setting the output Co value  
Select output capacitor with consideration to the ripple voltage (ΔVp-p) tolerance. The following equation is used to  
determine the output ripple voltage.  
Buck mode  
Boost mode  
The output Co setting needo be kept within the allowable ripple voltage range.  
Allow for a sufficient voltage output margin in establishing the capacitor rating. Low ESR capacitors provide a lower output  
ripple voltage. Because the output startup time needs to be set within the soft start time, please take the conditions  
described in the flowing equation also in consideration when selecting the value of the output capacitor.  
TSS × (Ilimit – Io)  
Vo  
TSS：Soft start time  
Co ≦  
Ilimit：Over current detection value  
N.B. Non-optimal capacitance values may cause startup problems. Especially in cases of extremely large capacitance  
values, the possibility exists that the inrush current at startup will activate the overcurrent protection, thus not starting the  
output. Therefore, verification and conformation with the actual application is recommended.  
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(3)Setting the input capacitor (Cin)  
The input capacitor serves to lower the output impedance of the power source  
connected to the input pin (VCC, VCCCL).  
Increased power supply output impedance can cause input voltage (VCC)  
instability and may negatively impact oscillation and ripple rejection  
characteristics. Therefore, it is necessary to place the input capacitor in close  
proximity to the MOSFET and PGND pin.  
VCC  
Cin  
Select a low-ESR capacitor with little change in capacitance due to  
L
Vo  
temperature change and with a sufficiently large ripple current.  
The ripple current IRMS is determined by the following equation:  
Co  
Vo（VCC - Vo）  
IRMS = Io ×  
[A]  
VCC  
Figure 25.  
Also, be certain to ascertain the operating temperature, load range and  
MOSFET conditions for the application in which the capacitor will be used,  
since capacitor performance is heavily dependent on the application’s input  
power characteristics, substrate wiring and MOSFET gate drain capacity.  
(4)Setting the output voltage  
The output voltage is determined by the equation below. Select a combination of R1 and R2 to obtain the required voltage.  
Note that a small resistance value leads to a drop in power efficiency and that a large resistance value leads, due to the error  
amp output drain current to an increase of the offset voltage.  
Vo  
0.8V  
RFBA + RFBB  
Vo = 0.8×  
RFBB  
RFBA  
FB  
RFBA  
Figure 26.  
(5)Setting the oscillation frequency  
The internal oscillation frequency setting is possible with the corresponding value of resistor connected to RT pin.  
The setting range is 100kHz to 600kHz. The correlation between the resistance value and the oscillation frequency is shown  
in the table below.  
Settings outside of this range can lead to a switching stop and consequentially operations cannot be guaranteed.  
700  
600  
RT resistance  
18.7kΩ  
20kΩ  
Oscillation frequency  
600kHz  
500  
400  
300  
200  
100  
0
550kHz  
22.5 kΩ  
24kΩ  
500kHz  
470kHz  
27kΩ  
424kHz  
28.5kΩ  
30kΩ  
400kHz  
384kHz  
33kΩ  
350kHz  
47kΩ  
250kHz  
62kΩ  
192kHz  
91kΩ  
133kHz  
120kΩ  
100kHz  
0
20  
40  
60  
80  
100  
120  
140  
RT RESITANCE ：RRT[kΩ]  
Figure 27. RT resistance vs. oscillation frequency  
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(6)Setting the soft start time  
The soft start function is necessary to prevent inrush of coil current and output voltage overshoot at startup. The figure below  
shows the relation between soft start delay time and capacitance, which can be calculated by using the equation to the right  
of the figure.  
Figure 29. Soft start time TSS  
0.8 [V] (Typ.) × CSS [μF]  
TSS =  
[sec]  
ISS [μA] (Typ.：10μA)  
Figure 28. Soft Start capacitance vs. delay time  
Capacitance values between 0.01μF and 0.1μF are recommended. There is a possibility that an overshoot is generated in  
the output due to the phase constant, output capacitance, etc. Therefore, verification and confirmation with the actual  
application is recommended. Use high accuracy components (e.g. x5R) when implementing sequential startups involving  
other power sources.  
(7)MOSFET selection  
•
PchMOS used for step-down FET  
VDS maximum rating > VCC  
o
o
VGS maximum rating > Lower value of 13V or VCC  
N.B. The voltage between VCC-VL is kept at 10.3V(Typ.), 13V(Max.).  
o
Allowable current > Coil peak current ILMAX  
N.B. A value above the overcurrent protection setting is  
recommended.  
N.B Selecting a low ON resistance is conducive to achieving  
a high efficiency.  
Figure 30  
•
NchMOS used for step-up FET  
VDS maximum rating > VO  
o
o
o
VGS maximum rating > VDD  
Allowable current > Coil peak current ILMAX  
N.B. A value above the overcurrent protection setting is  
recommended.  
VCC  
N.B Selecting a low ON resistance is conducive to achieving  
a high efficiency.  
(8)Schottky barrier diode selection  
Vo  
•
•
Reverse voltage VR > VCC  
Allowable current > Coil peak current ILMAX  
N.B. A value above the overcurrent protection setting is  
recommended.  
VR  
N.B. Selecting a diode with a low forward voltage and fast  
recovery is conducive to achieving a high efficiency.  
Figure 31  
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(9) Setting the phase compensation  
The phase compensation is set by the capacitors and resistors connected in parallel to COMP and FB pin, and RFBB. At first,  
it is easier to achieve stability at any power supply and load condition by adjusting values at the lowest voltage power supply  
and maximum load. Non-optimum values can cause unstable output, like oscillation.  
Assuming RFBB>>RFBC and CCOA>>CCOB, each phase compensation elements make phase delay fp1and fp2, phase  
lead fz1 and fz2, which can be determined by the formulas below.  
1
1
fp1 =  
fz1 =  
fp2 =  
fz2 =  
2π×CFB×RFBC  
2π×CCOB×RCO  
1
1
2π×CFB×RFBB  
2π×CCOA×RCO  
This setting is obtained by using a simplified calculation; therefore, adjustment on the actual application may be required.  
Also as these characteristics are influenced by the substrate layout, load conditions, etc., verification and confirmation with  
the actual application at time of mass production design is recommended.  
(10)Switching pulse jitter and split  
VCC  
Depending on the type of external FET and diode there may be jitter and  
VcccL  
split in the switching pulse. In case this jitter and split becomes a problem  
please use the following countermeasures.  
CL  
• Add a resistor to the OUTH gate of the step-down FET.  
OUTH  
• Add a resistor to the OUTL gate of the step-up FET.  
Vo  
However, as these characteristics are influenced by the substrate pattern,  
used FET, etc., verification and confirmation with the  
OUTL  
actual application is recommended.  
Figure 32.  
(11)Measurement of the open loop of the DC/DC converter  
To measure the open loop of the DC/DC converter, use the gain phase analyzer or FRA to measure the frequency  
characteristics.  
VO  
<Procedure>  
DC/DC converter  
controller  
①
②
①
1. Check to ensure output causes no oscillation at the maximum  
load in closed loop.  
RL  
+
+
②
Vm  
2. Isolate  
①
and  
②
and insert Vm (with amplitude of  
approximately. 100mVpp).  
Figure 33.  
3. Measure (probe) the oscillation of ① to that of ②.  
Thermal derating characteristics  
70mm×70mm×1.6mm, occupied copper foil is less than 3%, glass  
epoxy substrate, the board and the back exposure heat radiation board  
part of package are connected with solder.  
HTSSOP-B24  
4.5  
④4.00W  
4.0  
3.5  
①1 layer board (copper foil 0mm × 0mm)  
θja＝113.6℃/W  
③2.80W  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
②2 layer board (copper foil 15mm × 15mm)  
θja＝73.5℃/W  
②1.70W  
①1.10W  
③2 layer board (copper foil 70mm × 70mm)  
θja＝44.6℃/W  
④4 layer board (copper foil 70mm × 70mm)  
θja＝31.3℃/W  
CAUTION: Pd depends on number of the PCB layer and area.  
This value is measurement value, but not guaranteed value.  
0
25  
50  
75 100 125 150 175  
A MBIENT TEMPERA TURE : Ta[  
]
℃
Figure 34. Thermal derating characteristics  
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I/O equivalence circuits  
VDD  
OUTL  
PGND  
GND  
VCC  
EN  
GND  
VREG3  
VREG3  
COMP  
FB  
10k  
1.5p  
VCC  
VREG3  
VCCCL  
RT  
CL  
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Operational Notes  
1) Absolute maximum ratings  
Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in  
damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage  
(e.g. short circuit, open circuit, etc.). Therefore, if any special mode is being considered with values expected to exceed  
the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered.  
2) GND electric potential  
Keep the GND terminal potential at the lowest (minimum) potential under any operating condition.  
3) Thermal design  
Use a thermal design that allows for a sufficient margin with regard to the power dissipation of the actual operating  
situation.  
4) Inter-pin shorting and mounting errors  
Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in  
damaging the IC. Also, shorts caused by dust entering between the output, input and GND pin may result in damaging  
the IC.  
5) Operation in strong electromagnetic fields  
Use caution when operating in the presence of strong electromagnetic fields, as this may cause the IC to malfunction.  
6) Common impedance  
With regard to the wiring of the power supply and of the ground, take sufficient care to decrease the common impedance  
and to make the ripple as small as possible (by making the wiring as wide and short as possible, reducing ripple by L, C,  
etc.).  
7) Thermal shutdown (TSD)  
Temperature Protect Circuit (TSD Circuit) is built-in in this IC. As for the Temperature Protect Circuit (TSD Circuit),  
because it a circuit that aims to block the IC from insistent careless runs, it is not aimed for protection and guarantee of  
IC. Therefore, please do not assume the continuing use after operation of this circuit and the Temperature Protect  
Circuit operation.  
8) Rush current at power ON  
With CMOS Ics and Ics featuring multiple power supplies the possibility exists of an instantaneous current rush when  
the power is turned ON. Therefore, attention should be given to the power coupling capacitance and power and ground  
wiring width and route.  
9) Power input at shutdown  
If VCC starts up rapidly at shutdown (EN=OFF), VREG3 voltage may be output and this may cause the IC to  
malfunction. Therefore, set the rise time of VCC to under 40V/ms.  
10) About IC Pin Input  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a  
parasitic diode or transistor. Relations between each potential may form as shown in the example below, where a  
resistor and transistor are connected to a pin:  
zWith the resistor, when GND> Pin A, and with the transistor (NPN), when GND>Pin B:  
The P-N junction operates as a parasitic diode.  
zWith the transistor (NPN), when GND> Pin B:  
The P-N junction operates as a parasitic transistor by interacting with the N layers of elements in proximity to the  
parasitic diode described above.  
Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between  
circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not employ  
any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (P  
substrate) GND  
Resistor  
Transistor (NPN)  
B
(Pin A)  
(Pin B)  
C
E
(Pin B)  
(Pin A)  
C
E
B
P
P
P+  
P+  
P+  
P+  
Parasitic element  
N
N
N
P
N
N
GND  
Parasitic element  
GND  
P-Substrate  
GND  
Parasitic element  
Parasitic element  
Figure 35.  
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11) About TEST pin  
Note that the TEST pin will go into test mode that masks protection functions when supplied with voltage. Be sure to  
connect TEST pin to ground.  
12) About VREG3, VREG5 pin  
VREG3 and VREG5 output pins are designed to supply power only into this IC. Thus, it is not recommended to use  
them for other purposes.  
Ordering Information  
B D  
9
0
3
5
A
E
F
V
-
C E 2  
Parts Number  
Package  
EFV: HTSSOP-B24  
Product Rank  
C: for Automotive  
Packaging specification  
E2: Embossed tape and reel  
Marking Diagram  
HTSSOP-B24 (TOP VIEW)  
Part Number Marking  
LOT Number  
B D 9 0 3 5 A  
1PIN MARK  
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Physical Dimension, Tape and Reel Information  
Package Name  
HTSSOP-B24  
<Tape and Reel information>  
Tape  
Embossed carrier tape (with dry pack)  
Quantity  
2000pcs  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
Direction of feed  
1pin  
Reel  
O rder quantity needs to be multiple of the minimum quantity.  
∗
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Revision History  
Date  
Revision  
001  
Change log  
New version created.  
2013.7.30  
Added the term about AEC-Q100. (P.1)  
Replaced “Physical Dimension, Tape and Reel Information” with new format. (P.22)  
2014.2.19  
002  
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Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHM’s Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASSⅢ  
CLASSⅣ  
CLASSⅡb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  

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