BD90610UEFJ-C [ROHM]

BD90610UEFJ-C是一款内置高耐压功率MOSFET的开关稳压器，可通过外置电阻灵活设置开关频率。该产品的特点是支持的输入电压范围宽（3.5V ～ 36V，绝对最大额定电压：42V)、工作温度范围宽（-40℃ ～ +125℃），并且可与外部同步输入引脚输入的外部时钟同步工作。本系列产品中的BD90610EFJ-C是为提高生产效率而变更生产线后的型号。在新项目选型时，建议选择该型号。另外，在技术规格书中的保证特性并没有差异。除非另有说明，否则我们还会披露文档和设计模型的 BD90610EFJ-CE2 数据。;


型号：	BD90610UEFJ-C
厂家：	ROHM
描述：	BD90610UEFJ-C是一款内置高耐压功率MOSFET的开关稳压器，可通过外置电阻灵活设置开关频率。该产品的特点是支持的输入电压范围宽（3.5V ～ 36V，绝对最大额定电压：42V)、工作温度范围宽（-40℃ ～ +125℃），并且可与外部同步输入引脚输入的外部时钟同步工作。本系列产品中的BD90610EFJ-C是为提高生产效率而变更生产线后的型号。在新项目选型时，建议选择该型号。另外，在技术规格书中的保证特性并没有差异。除非另有说明，否则我们还会披露文档和设计模型的 BD90610EFJ-CE2 数据。时钟开关生产线稳压器
文件：	总44页 (文件大小：3832K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Input Voltage 3.5 V to 36 V

Output SW Current 4 A / 2.5A / 1.25A

1ch Step-Down Switching Regulator

BD906xx-C series

General Description

Key Specifications

BD906xx-C series is a step-down switching regulator

with integrated POWER MOS FET and have the

capability to withstand high input voltage, providing a free

setting function of operating switching frequency with

external resistor. This switching regulator features a wide

input voltage range (3.5 V to 36 V, Absolute maximum 42

V) and operating temperature range (-40 °C to +125 °C).

Furthermore, an external synchronization input pin

enables synchronous operation with external clock.

 Input Voltage Range :

3.5 V to 36 V

(Initial startup is over 3.9 V)

0.8 V to V_IN

4 A / 2.5 A / 1.25 A (Max)

50 kHz to 600 kHz

 Output Voltage Range :

 Output Switch Current :

 Switching Frequency :

 Reference Voltage Accuracy :±2% (-40 °C to +125 °C)

 Shutdown Circuit Current : 0 µA (Typ)

 Operating Temperature Range(Ta) : -40 °C to +125 °C

Package

W(Typ) x D(Typ) x H(Max)

9.395mm x 10.540mm x 2.005mm

4.90mm x 6.00mm x 1.00mm

Features

HRP7

HTSOP-J8

 AEC-Q100 Qualified ^{(Note 1)}

 Integrated Pch POWER MOS FET

 Low Dropout: 100 % ON Duty Cycle

 External Synchronization Function

 Soft Start Function: 1.38 ms (f_SW= 500 kHz)

 Current Mode Control

 Over Current Protection

 Low Supply Voltage Error Prevention

 Thermal Shut Down Protection

 Short Circuit Protection

 High power HRP7 package mounted

 Compact and High power HTSOP-J8 package

mounted

 Load dump up to 42 V.

HRP7

HTSOP-J8

(Note 1 : Grade 1)

Applications

 Automotive Battery Powered Supplies

(Cluster Panels, Car Multimedia)

 Industrial / Consumer Supplies

 Other electronic equipment

Typical Application Circuit

PVIN

V_O

C_O

V_IN

VIN

Cbulk

C_IN

C_RT

R_RT

V_{EN / SYNC}

EN / SYNC

GND

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

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Lineup

HRP7

BD90640HFP-C

BD90640EFJ-C

4 A

BD90620HFP-C

BD90620EFJ-C

2.5 A

Product

Name

HTSOP-J8

BD90610EFJ-C

1.25 A

Output Switch Current

Input Maximum Ratings

42 V

Input Voltage Range ^{(Note 1)}

POWER MOSFET ON Resistance

3.5 V to 36 V

0.16 Ω (Typ)

6.98 W

HRP7 ^{(Note 2)}

Power

Dissipation

HTSOP-J8 ^{(Note 3)}

3.10 W

(Note 1) Initial startup is over 3.9 V

(Note 2) Reduce by 55.8 mW / °C (Above 25°C),

(JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mmt 4-layer Top copper foil: ROHM recommended footprint + wiring to measure /

2,3 inner layers and Copper foil area on the reverse side of PCB 74.2 mm × 74.2 mm, copper (top & reverse side / inner layers) 70 μm / 35 μm.

Thermal via : pitch 1.2 mm, diameter Φ0.30 mm )

(Note 3) Reduce by 24.8 mW / °C (Above 25°C),

(JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mmt 4-layer Top copper foil: ROHM recommended footprint + wiring to measure /

2,3 inner layers and Copper foil area on the reverse side of PCB 74.2 mm × 74.2 mm, copper (top & reverse side / inner layers) 70 μm / 35 μm.

Thermal via : pitch 1.2 mm, diameter Φ0.30 mm)

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Pin Configuration

(TOP VIEW)

1. VC

1. RT

8. FB

2. VIN

3. FB

7. PVIN

6. VIN

5. VC

2. SW

4. GND

5. RT

FIN

3. EN / SYNC

4. GND

6. SW

7. EN / SYNC

HRP7

HTSOP-J8

Pin Description

Pin No.

Symbol

Function

Pin No

Symbol

Function

Switching Frequency Setting

Resistor Connection

VIN

Error Amp Output

Power Supply Input

Output Voltage Feedback

GND

Switching Output

Enable /

External Clock Input

EN / SYNC

GND

Switching Frequency Setting

Resistor Connection

Error Amp Output

Switching Output

VIN ^{(Note 1)}

PVIN ^{(Note 1)}

Power Supply Input

Output Voltage Feedback

Enable /

External Clock Input

EN / SYNC

FIN

GND

(Note 1) VIN and PVIN must be shorted.

HRP7

HTSOP-J8

Block Diagram

PVIN

UVLO

OCP

UVLO

OCP

VIN

UVLO

OCP

UVLO

OCP

VREF

VREG

VREF

VREG

EN / SYNC

SCP_LATCH

Current

Sense

Current

Sense

SCP_

LATCH

SCP_

LATCH

∑

ꢀ

SLOPE

OSC

SLOPE

OSC

∑

ꢀ

TSD

OCP

TSD

SCP

CUR

_COMP

PWM_LATCH

CUR

_COMP

PWM_LATCH

Pch POWER

MOSFET

Pch POWER

MOSFET

ERROR_AMP

DRV

0.8V

OFF

UVLO

TSD

UVLO

TSD

GND

SOFT_

START

SOFT_

START

OCP

SCP_LATCH

HRP7

HTSOP-J8

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Description of Blocks

1. ERROR_AMP

The ERROR_AMP block is an error amplifier and its inputs are the reference voltage 0.8 V (Typ) and the “FB” pin

voltage. (Refer to recommended examples on p.16 to 17). The output “VC” pin controls the switching duty, the output

voltage is set by “FB” pin with external resistors. Moreover, the external resistor and capacitor are required to COMP pin

as phase compensation circuit (Refer to phase compensation selection method on p.17 to 18).

2. SOFT_START

The function of the SOFT_START block is to prevent the overshoot of the output voltage V_Othrough gradually

increasing the input of the error amplifier when the power supply turns ON, which also results to the gradual increase of

the witching duty. The soft start time is set to 1.38 ms (Typ , f_SW= 500 kHz).

The soft start time is changed by setting of the switching frequency. (Refer to p.18)

3. EN / SYNC

The IC is in normal operation when the voltage on the “EN / SYNC” pin is more than 2.6 V. The IC is shut down when the

voltage on the “EN / SYNC” pin is less than 0.8 V. Furthermore, external synchronization is possible when external clock

are applied to the “EN / SYNC” pin. The switching frequency range of the external synchronization is within ±20 % of the

switching frequency and is limited by the external resistance connected to the RT pin.

ex) When R_RTis 27 kΩ (f = 500 kHz), the switching frequency range of the external synchronization is 400 kHz to 600

kHz.

4. OSC (Oscillator)

This circuit generates the clock pulses that are input to SLOPE block. The switching frequency is determined by the

current going through the external resistor RT at constant voltage of ca. 0.8V. The switching frequency can be set in the

range between 50 kHz to 600 kHz (Refer to p.16 Figure 13). The output of the OSC block send clock signals to

PWM_LATCH. Moreover the generated pulses of the OSC block are also used as clock of the counter of SS and

SCP_LATCH blocks.

5. SLOPE

This block generates saw tooth waves using the clock generated by the OSC block. The generated saw tooth waves are

combined with the current sense and sent to the CUR_COMP.

6. CUR_COMP (Current Comparator)

The CUR_COMP block compares the signals between the ERROR_AMP and the combined signals from the SLOPE

block and current sense. The output signals are sent to the PWM_LATCH block.

7. PWM_LATCH

The PWM_LATCH block is a LATCH circuit. The OSC block output (set) and CUR_COMP block output (reset) are the

inputs of this block. The PWM_LATCH block outputs PWM signals.

8. TSD (Thermal Shut down)

The TSD block prevents thermal destruction / thermal runaway of the IC by turning OFF the Pch POWER MOSFET

output when the temperature of the chip reaches more than about 175 °C (Typ). When the chip temperature falls to a

specified level, the switching will resume. However, since the TSD is designed to protect the IC, the chip temperature

should be provided with the thermal shutdown detection temperature of less than approximately Tjmax = 150 °C.

9. OCP (Over Current Protection)

OCP is activated when the voltage between the drain and source (on-resistance × load current) of the Pch POWER

MOSFET when it is ON, exceeds the reference voltage which is internally set within the IC. This OCP is a self-return

type. When OCP is activated, the ON duty will be small, and the output voltage will decrease. However, this protection

circuit is only effective in preventing destruction from sudden accident. It does not support the continuous operation of

the protection circuit (e.g. if a load, which significantly exceeds the output current capacitance, is connected).

10. SCP (Short Circuit Protection) and SCP-LATCH

While OCP is activated, and if the output voltage falls below 70 %, SCP will be activated. When SCP is active, the output

will be turned OFF after a period of 1024 pulse. It extends the time that the output is OFF to reduce the average output

current. In addition, during startup of the IC, this feature is masked until it reaches a certain output voltage to prevent the

startup failure.

11. UVLO (Under Voltage Lock-Out)

UVLO is a protection circuit that prevents low voltage malfunction. It prevents malfunction of the internal circuit from

sudden rise and fall of power supply voltage. It monitors the V_INpower supply voltage and the internal regulator voltage.

If V_INis less than the threshold voltage 3.24 V (Typ), the Pch POWER MOSFET output is OFF and the soft-start circuit

will be restarted. This threshold voltage and release voltage have a hysteresis of 280 mV (Typ).

12. DRV (Driver)

This circuit drives the gate electrode of the Pch POWER MOSFET output. It reduces the increase of the Pch POWER

MOSFET’s on-resistance by switching the driving voltage when the power supply voltage drop.

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Input Power Supply Voltage

EN / SYNC Pin Voltage

Symbol

V_IN, PV_IN

Rating

-0.3 to +42

-0.3 to V_IN

-0.3 to +7

6.98

Unit

V_{EN / SYNC}

V_RT, V_VC, V_FB

RT, VC, FB Pin Voltage

HRP7 ^(Note2)

Power Dissipation^(Note1)

HTSOP-J8 ^(Note3)

3.10

Tstg

-55 to +150

150

Storage Temperature Range

°C

Tjmax

Maximum Junction Temperature

(Note 1) Do not however exceed Pd.

(Note 2) Reduce by 55.8 mW / °C, (Above 25°C),

(JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mmt 4-layer Top copper foil: ROHM recommended footprint + wiring to measure /

2,3 inner layers and Copper foil area on the reverse side of PCB 74.2 mm × 74.2 mm, copper (top & reverse side / inner layers) 70 µm / 35 µm.

Thermal via : pitch 1.2 mm, diameter Φ0.30 mm )

(Note 3) Reduce by 24.8 mW / °C, (Above 25°C),

(JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mmt 4-layer Top copper foil: ROHM recommended footprint + wiring to measure /

2,3 inner layers and Copper foil area on the reverse side of PCB 74.2 mm × 74.2 mm, copper (top & reverse side / inner layers) 70 µm / 35 µm.

Thermal via : pitch 1.2 mm, diameter Φ0.30 mm )

Caution: Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction of the

chip. In this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc). Therefore, if any special mode

is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses,

should be considered.

Recommended Operating Conditions

Limit

Parameter

Symbol

Unit

Min

3.5

Max

Operating Power Supply Voltage ^{(Note 1)}

Operating Temperature Range

V_IN,PV_IN

Topr

°C

-40

+125

BD90640HFP/EFJ-C

BD90620HFP/EFJ-C

BD90610EFJ-C

I_SW40

I_SW20

I_SW10

V_O

Output Switch Current ^(Note2)

2.5

1.25

V_IN

Output Voltage

0.8

250

Min ON Pulse Width

T_{ON_MIN}

f_SW

kHz

kΩ

kHz

Switching Frequency

600

330

600

+20

R_RT

Switching Frequency Set Resistance

Synchronous Operation Frequency Range

Synchronous Operation Frequency

External Clock ON Duty

f_SYNC

f_{SYNC_RT}

D_SYNC

C_IN

-20

Capacitance of Input Capacitor

2.4^{(Note 3)}

µF

(Note 1) Initial startup is over 3.9 V.

(Note 2) The Limits include output DC current and output ripple current.

(Note 3) Ceramic capacitor is recommended. The capacitor value including temperature change, DC bias change, and aging change must be larger than

minimum value (Refer to p.15). Also, the IC might not function properly when the PCB layout or the position of the capacitor is not good. Please check

“Notes on the PCB Layout” on page 30.

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Electrical Characteristics (Unless otherwise specified, Ta = - 40 °C to +125 °C, V_IN= 13.2 V, V_{EN / SYNC}= 5 V)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

Whole chip

V_{EN / SYNC}= 0 V,

Ta < 105 °C

I_SDN

I_IN

μA

Shutdown Circuit Current

Circuit Current

2.2

3.3

Io = 0 A, V_FB= 2 V

SW Block

POWER MOSFET ON Resistance

R_ON

0.16

6.4

0.32

I_SW= 30 mA

BD90640HFP / EFJ-C I_SWLIMIT40

BD90620HFP / EFJ-C I_SWLIMIT20

4.0

2.5

1.25

Operating Output

Switch Current Of

Overcurrent

4.3

Protection ^{(Note 1)}

BD90610EFJ-C

I_SWLIMIT10

I_OLK

2.20

V_IN= 36 V,

V_{EN / SYNC}= 0 V,

Output Leak Current

μA

Ta < 105 °C

Error Amp Block

V_REF1

V_REF2

ΔV_REF

I_B

0.792

0.784

0.800

0.5

0.808

0.816

V_VC= V_FB, Ta = 25 °C

V_VC= V_FB

Reference Voltage 1

Reference Voltage 2

Reference Voltage Input

Regulation

3.5 V ≤ V_IN≤ 36 V

Input Bias Current

VC Sink Current

-1.0

-76.5

31.5

135

+1.0

-31.5

76.5

540

μA

V_VC= 1.25 V,

V_FB= 1.3 V

V_VC= 1.25 V,

V_FB= 0.3 V

I_VC= ±10 μA,

V_VC= 1.25 V

I_VCSINK

I_VCSOURCE

G_EA

-54.0

54.0

270

1.38

μA

VC Source Current

Trans Conductance

Soft Start Time

μA

μA / V

T_SS

1.13

1.63

R_RT= 27 kΩ

Current Sense Part

Trans Conductance

OSC Block

G_CS

5.2

A / V

f_SW

450

500

550

kHz

R_RT= 27 kΩ

Switching Frequency

Frequency Input Regulation

Enable / Sync Input Block

Threshold Voltage

SYNC Current

Δf_SW

3.5 V ≤ V_IN≤ 36 V

V_{EN / SYNC}

I_{EN / SYNC}

0.8

1.9

2.6

μA

V_{EN / SYNC}= 5 V

UVLO

UVLO ON Mode Voltage

UVLO OFF Mode Voltage

UVLO Hysteresis

V_{UVLO_ON}

V_{UVLO_OFF}

V_{UVLO_HYS}

3.24

3.52

280

3.50

3.90

(Note 1) The Limit include output DC current and output ripple current.

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Typical Performance Curves

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

From Top

Ta = 125 °C

Ta = 25 °C

Ta = -40 °C

From Top

Ta = 125 °C

Ta = 25 °C

Ta = -40 °C

Input Voltage : V_IN[V]

Figure 1. Shutdown Circuit Current vs Input Voltage

Figure 2. Circuit Current vs Input Voltage

0.30

0.25

0.20

From Top

BD90640HFP / EFJ-C

BD90620HFP / EFJ-C

BD90610EFJ-C

0.15

From Top

V_IN= 3.5 V

V_IN= 13.2 V

0.10

0.05

Ta = 25 °C

0.00

-40 -20

20 40 60 80 100 120

Ambient Temperature : Ta [˚C]

Input Voltage : V_IN[V]

Figure 3. POWER MOSFET ON Resistance vs

Ambient Temperature

Figure 4. Switch Current Limit vs Input Voltage

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Typical Performance Curves – continued

5.0

4.0

3.0

2.0

816

812

808

804

800

796

792

788

784

1.0

V_IN= 13.2 V

0.0

-40 -20

20 40 60 80 100 120

-40 -20

20 40 60 80 100 120

Ambient Temperature : Ta [˚C]

Ambient Temperature : Ta[˚C]

Figure 6. Reference Voltage vs Ambient Temperature

Figure 5. Leak Current vs Ambient Temperature

1.63

1.58

1.53

1.48

1.43

1.38

1.33

1.28

1.23

1.0

0.8

0.6

0.4

0.2

0.0

V_IN= 13.2 V

V_FB= 0.8 V

1.18

1.13

R_RT= 27 kΩ

-40 -20

20 40 60 80 100 120

-40 -20

20 40 60 80 100 120

Ambient Temperature : Ta[˚C]

Ambient Temperature : Ta [˚C]

Figure 8. Soft Start Time vs Ambient Temperature

Figure 7. Input Bias Current vs Ambient Temperature

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Typical Performance Curves – continued

550

540

530

520

510

500

490

480

470

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

V_IN= 13.2 V

460

R_RT= 27 kΩ

450

-40 -20

20 40 60 80 100 120

-40 -20

80 100 120

Ambient Temperature : Ta [˚C]

Ambient Temperature : Ta[˚C]

Figure 10. EN / SYNC Threshold Voltage

vs Ambient Temperature

Figure 9. Switching Frequency vs Ambient Temperature

450

100

400

From Top

Ta = 125 °C

350

From Top

V_O= 8.8 V

V_O= 5 V

Ta = 25 °C

Ta = -40 °C

300

V_O= 3.3 V

250

200

150

100

BD90640HFP / EFJ-C I_O<3.79 A

BD90620HFP / EFJ-C I_O<2.29 A

BD90610EFJ-C I_O<1.04 A

V_IN= 13.2 V

f_SW= 500 kHz

Ta = 25 °C

EN / SYNC Voltage : V_{EN / SYNC}[V]

Figure 11. EN / SYNC Current vs EN / SYNC Voltage

Output Current : I_O[A]

Figure 12. Efficiency vs Output Current

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Timing Chart

1. Start Up Operation

VIN

EN / SYNC

Threshold Voltage

EN / SYNC

V_O

Internal slope

2. Over Current Protection Operation

Normal pulse repetition at

the following

Over Current

Detect Level

I_L

V_O

Short Current

Detect Level

V_C

T_SS

Internal SOFT START

T_OFFT_OFF

T_OFF

^＊T_OFF^＊T_SSterminal

Output Voltage

Short to GND

Output Voltage

Short Release

T_OFF= 1024 / f_SW[s]

ex) f_SW= 500 [kHz] , T_OFF= 2.048 [ms]

t_SS= 1.38 [ms] (Typ)

Auto reset

(Soft Start Operation)

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External Synchronization Function

In order to activate the external synchronization function, connect the frequency-setting resistor to the RT pin and then input

a synchronizing signal to the EN / SYNC pin.

The external synchronization operation frequency is limited by the external resistance of R_RTpin. The allowable setting limit

is within ±20 % of the switching frequency.

ex) When R_RTis 27 kΩ (f = 500 kHz), the frequency range of the external synchronization is 400 kHz to 600 kHz.

Furthermore, the pulse wave’s LOW voltage should be under 0.8 V and the HIGH voltage over 2.6 V (when the HIGH voltage

is over 11 V the EN / SYNC input current increases), and the slew rate (rise and fall) under 20 V / µS. The ON Duty of

External clock should be configured between 10 % and 90 %.

The frequency will synchronize with the external clock operation frequency after three external sync pulses is sensed.

V_O

PVIN

C_O

V_IN

VIN

Cbulk

C_IN

C_RT

R_RT

V_{EN / SYNC}

EN / SYNC

GND

Eternal SYNC Sample Circuit

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Selection of Components Externally Connected

Necessary parameters in designing the power supply are as follows:

Parameter

Input Voltage

Symbol

V_IN

Specification Case

6 V to 18 V

Output Voltage

V_O

5 V

Output Ripple Voltage

Input Range

ΔV_PP

I_O

20 mVp-p

Min 1.0 A / Typ 1.5 A / Max 2.0 A

500 kHz

Switching Frequency

Operating Temperature Range

f_SW

Topr

-40 °C to +105 °C

PVIN

V_O

C_O

V_IN

VIN

Cbulk

C_IN

C_RT

R_RT

V_{EN / SYNC}

EN / SYNC

GND

Application Sample Circuit

1. Selection of the inductor L1 value

When the switching regulator supplies current continuously to the load, the LC filter is necessary for the smoothness of

the output voltage. The Inductor ripple current ΔI_Lthat flows to the inductor becomes small when an inductor with a large

inductance value is selected. Consequently, the voltage of the output ripple also becomes small. It is the trade-off

between the size and the cost of the inductor.

The inductance value of the inductor is shown in the following equation:

(푉

−푉표)×푉표

퐼푁(푀푎푥)

퐿 =

[H]

푉

×푓 ×∆ꢀ

푆푊 ꢁ

퐼푁(푀푎푥)

Where:

ꢂ

is the maximum input voltage

ꢀꢃ (ꢄꢅꢆ)

ΔI_Lis set to approximately 30 % of I_O. To avoid discontinuous operation, ΔI_Lshall be set to make SW continuously

pulsing (I_Lkeeps continuously flowing). The condition of the continuous operation is shown in the following equation:

(푉

−푉 )×푉

ꢈ ꢈ

퐼푁(푀푎푥)

ꢇ_푂>

[A]

2×푉

×푓 ×ꢉ

푆푊

퐼푁(푀푎푥)

Where:

ꢇ_푂is the Load Current

I_L

I_O

ΔI_L

I_O

Continuous Operation

Discontinuous Operation

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The smaller the ΔI_L, each the Inductor core loss (iron loss), the loss due to ESR of the output capacitor, and the ΔV_PPwill

be reduced. ΔV_PPis shown in the following equation.

∆ꢀ

ꢁ

∆ꢂ_푃푃= ∆ꢇ_ꢉ× 퐸ꢊ푅 + _{8×퐶 ×푓}

[V]

・・・・・(a)

ꢈ

푆푊

Where:

퐸ꢊ푅 is the equivalent series resistance of output capacitor

ꢋ_푂is the output condenser capacity

Generally, even if ΔI_Lis somewhat large, ΔV_PPof the target is satisfied because the ceramic capacitor has super-low

ESR. In that case, it is also possible to use it by the discontinuous operation. The inductance value can be set small as

an advantage.

It contributes to the miniaturization of the application because of the lower rated current, smaller inductor is possible if

the inductance value is small. The disadvantages are the increase in core losses in the inductor, the decrease in

maximum output current, and the deterioration of the response. When other capacitors (electrolytic capacitor, tantalum

capacitor, and electro conductive polymer etc.) are used for output capacitor C_O, check the ESR from the manufacturer's

data sheet and determine the ΔI_Lto fit within the acceptable range of ΔV_PP. Especially in the case of electrolytic

capacitor, because the capacity decrease at the low temperature is remarkable, ΔV_PPincreases. When using capacitor

at the low temperature, it is necessary to note this.

The maximum output electric current is limited to the overcurrent protection working current as shown in the following

equation.

ꢇ_{푂(ꢄꢅꢆ)}= ꢇ_{ꢌꢍꢉꢀꢄꢀ푇(ꢄ푖푛)}ꢎ ^∆ꢀ[A]

ꢁ

Where:

ꢇ_{푂(ꢄꢅꢆ)}is the maximum output current

ꢇ_{ꢌꢍꢉꢀꢄꢀ푇(ꢄ푖푛)}is the OCP operation current (Min)

I_{SWLIMIT (Min)}

I_O

I_L

I_Lpeak

In current mode control, when the IC is operating in ON Duty ≥ 50 % and in the condition of continuous operation,The

sub-harmonic oscillation may happen. The slope compensation circuit is integrated into the IC in order to prevent

sub-harmonic oscillation. The sub-harmonic oscillation depends on the rate of increase of output switch current. If the

inductor value is too small, the sub-harmonic oscillation may happen. And if the inductor value is too large, the feedback

loop may not achieve stability. The inductor value which prevents sub-harmonic oscillation is shown in the following

equation.

−푉

퐿 ≥ _2(1−퐷)× 푅푠 × ^푉

[H]

2D−1

ꢈ

퐼푁 (푀ꢏꢐ)

푚

ꢂ_푂

ꢑ =

ꢂ

ꢀꢃ(ꢄ푖푛)

ꢒ = 6 × ꢓ × ꢔ0^−ꢕ

ꢌꢍ

Where:

ꢖ is the switching pulse ON Duty.

푅_ꢌis the coefficient of current sense(4.0 µA / A)

ꢒ is the slope of slope compensation current

The shielded type (closed magnetic circuit type) is the recommended type of inductor. Open magnetic circuit type can

be used for low cost applications if noise issues are not concerned. But in this case, an influence other parts by

magnetic field radiation is considered. An enough space layout between each parts should be noted.

For ferrite core inductor type, please note that magnetic saturation may occur. It is necessary not to saturate the core in

all cases. Precautions must be taken into account on the given provisions of the current rating because it differs

according to each manufacturer.

Please confirm the rated current at the maximum ambient temperature of the application to the manufacturer.

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Selection of Components Externally Connected – continued

2. Selection of output Capacitor C_O

The output capacitor is selected on the basis of ESR that is required from the equation (a). ΔV_PPcan be reduced by

using a capacitor with a small ESR. The ceramic capacitor is the best option that meets this requirement. The ceramic

capacitor contributes to the size reduction of the application because it has small ESR. Please confirm frequency

characteristic of ESR from the datasheet of the manufacturer, and consider ESR value is low in the switching frequency

being used. It is necessary to consider the ceramic capacitor because the DC biasing characteristic is remarkable. For

the voltage rating of the ceramic capacitor, twice or more than the maximum output voltage is usually required. By

selecting these high voltages rating, it is possible to reduce the influence of DC bias characteristics. Moreover, in order

to maintain good temperature characteristics, the one with the characteristic of X7R or more is recommended. Because

the voltage rating of a mass ceramic capacitor is low, the selection becomes difficult in the application with high output

voltage. In that case, please select electrolytic capacitor. Please consider having a voltage rating of 1.2 times or more of

the output voltage when using electrolytic capacitor. Electrolytic capacitors have a high voltage rating, large capacity,

small amount of DC biasing characteristic, and are generally cheap. Because main failure mode is OPEN, it is effective

to use electrolytic capacitor for applications when reliability is required such as in-vehicle. But there are disadvantages

such as, ESR is relatively high, and decreases capacitance value at low temperatures. In this case, please take note

that ΔV_PPmay increase at low temperature conditions. Moreover, consider the lifetime characteristic of this capacitor

because there is a possibility for it to dry up.

A tantalum capacitor and a conductive polymer hybrid capacitor have excellent temperature characteristic unlike an

electrolytic capacitor. Moreover, as these ESR is smaller than an electrolytic capacitor, a ripple voltage is relatively-small

over wide temperature range. The design is facilitated because there is little DC bias characteristic like an electrolytic

capacitor. Normally, for voltage rating, a tantalum capacitor is selected twice the output voltage, and for conductive

polymer hybrid capacitor is selected 1.2 times more than the output voltage. The disadvantage of a tantalum capacitor is

that the failure mode is SHORT, and the breakdown voltage is low. It is not generally selected in the application that

reliability such as in automotive is demanded. The failure mode of an electro conductive polymer hybrid capacitor is

OPEN. Though it is effective for reliability, the disadvantage is generally expensive.

In case of Pch step-down switching regulator, when the input voltage decreases and the voltage between input and

output becomes small, switching pulse begin to skip before the Pch MOSFET completely turns on. Because of this the

output ripple voltage may increase. To improve performance in this condition, following is recommended:

1. To use low ESR capacitor like ceramic or conductive polymer hybrid capacitor.

2. Higher value of capacitance.

These capacitors are rated in ripple current. The RMS values of the ripple current that can be obtained in the following

equation must not exceed the ratings ripple current.

∆ꢀ

ꢁ

ꢇ_{퐶푂(ꢗꢄꢌ)}

[A]

√

Where:

ꢇ_{퐶푂(ꢗꢄꢌ)}is the value of the ripple electric current

In addition, total value of capacitance with output line C_o(Max), respect to C_O, choose capacitance value less than the

value obtained by the following equation.

푇

×(ꢀ

−ꢀ

)

ꢈ푆ꢘ퐴ꢙꢘ 푀푎푥

푆푆(푀ꢏꢐ)

ꢈꢁ퐼푀퐼ꢘ(푀ꢏꢐ)

(

ꢋ_{푂(ꢄꢅꢆ)}

[F]

푉

ꢈ

Where:

ꢇ_{ꢌꢍꢉꢀꢄꢀ푇(ꢄ푖푛)}is the OCP operation switch current (Min)

is the Soft Start Time (Min)

ꢚ

ꢌꢌ(ꢄ푖푛)

ꢇ_{ꢌꢍꢌ푇ꢛꢗ푇(ꢄꢅꢆ)}is the maximum output current during startup

The startup failure may happen when the limits from the above-mentioned are exceeded. Especially if the capacitance

value is extremely large, over-current protection may be activated by the inrush current at startup, and the output does

not start. Please confirm this on the actual application. For stable transient response, the loop is dependent on the C_O.

Please select after confirming the setting of the phase compensation circuit.

Also, in case of large changing input voltage and load current, select the capacitance in accordance with verifying that

the actual application meets with the required specification.

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Selection of Components Externally Connected – continued

3. Selection of capacitor C_IN/ Cbulk input

The input capacitor is usually required for two types of decoupling: capacitors C_INand bulk capacitors Cbulk. Ceramic

capacitors with values more than 2.4 µF are necessary for the decoupling capacitor. Ceramic capacitors are effective by

being placed as close as possible to the VIN pin. Voltage rating is recommended to more than 1.2 times the maximum

input voltage, or twice the normal input voltage. The capacitor value including temperature change, DC bias change, and

aging change must be larger than minimum value. Also, the IC might not function properly when the PCB layout or the

position of the capacitor is not good. Please check “Notes on the PCB Layout” on page 24.

The bulk capacitor is option. The bulk capacitor prevents the decrease in the line voltage and serves a backup power

supply to keep the input potential constant. The low ESR electrolytic capacitor with large capacity is suitable for the bulk

capacitor. It is necessary to select the best capacitance value as per set of application. n that case, please consider not to

exceed the rated ripple current of the capacitor.

The RMS value of the input ripple electric current is obtained in the following equation.

푉 ×(푉 −푉 )

ꢜ

ꢈ

퐼푁

ꢈ

ꢇ_{퐶ꢀꢃ(ꢗꢄꢌ)}= ꢇ_{푂(ꢄꢛ푋)}

∙

[A]

푉

퐼푁

Where:

ꢇ_{퐶ꢀꢃ(ꢗꢄꢌ)}is the RMS value of the input ripple electric current

In addition, in automotive and other applications requiring high reliability, it is recommended that capacitors are connected

in parallel to accommodate a multiple of electrolytic capacitors to minimize the chances of drying up. It is recommended by

making it into two series + two parallel structures to decrease the risk of ceramic capacitor destruction due to short circuit

conditions. The line has been improved to the summary respectively by 1pack in each capacitor manufacturer and

confirms two series and two parallel structures to each manufacturer.

When impedance on the input side is high because of wiring from the power supply to VIN is long, etc., and then high

capacitance is needed. In actual conditions, it is necessary to verify that there is no problem when IC operation turns off or

overshoot the output due to the change in V_INat transient response.

4. Selection of output voltage setting registance R1, R2

Output voltage is governed by the following equation.

ꢂ_푂= 0.ꢝ × ^ꢗ1ꢞꢗ2[V]

ꢗ2

Please set feedback resistor R2 below 30 kΩ to reduce the error margin by the bias current. In addition, since power

efficiency is reduced with a small R1 + R2, please set the current flowing through the feedback resistor to be small as

possible than the output current I_O.

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Selection of Components Externally Connected – continued

5. Selection of the schottky barrier diode D1

The schottky barrier diode that has small forward voltage and short reverse recovery time is used for D1. The important

parameters for the selection of the schottky barrier diode are the average rectified current and direct current

inverse-direction voltage. Average rectified current I_{F (AVG)}is obtained in the following equation:

푉

−푉

ꢈ

퐼푁(푀퐴ꢟ)

ꢇ_{퐹(ꢛ푉퐺)}= ꢇ_{푂(ꢄꢛ푋)}

[A]

푉

퐼푁(푀퐴ꢟ)

Where:

ꢇ_{퐹(ꢛ푉ꢠ)}is the average rectified current

The absolute maximum rating of the schottky barrier diode rectified current average is more than 1.2 times I_F(AVG)and

the absolute maximum rating of the DC reverse voltage is greater than or equal to 1.2 times the maximum input voltage.

The loss of D1 is obtained in the following equation:

푉

)

^ꢈ× ꢂꢣ [W]

(

퐼푁 푀퐴ꢟ ꢢ

ꢡ_퐷푖= ꢇ_{푂(ꢄꢛ푋)}

푉

퐼푁(푀퐴ꢟ)

Where:

ꢂꢣ is the forward voltage in ꢇ_{푂(ꢄꢛ푋)}condition

Selecting a diode that has small forward voltage, and short reverse recovery time is highly effective. Please select a diode

with 0.65 V Max of forward voltage. Please note that there is possibility of internal element destruction when a diode with a

larger VF than this is used. Because the reverse recovery time of the schottky barrier diode is so short, that it is possible to

disregard, the switching loss can be disregarded. When it is necessary for the diode to endure the state of output

short-circuit, power dissipation ratings and the heat radiation ability are needed to be considered. The rated current that is

required is about 1.5 times the overcurrent detection value.

6. Selection of the switching frequency setting resistance R_RT,C_RT

The internal switching frequency can be set by connecting a resistor between RT and GND.

The range that can be set is 50 kHz to 600 kHz, and the relation between resistance and the switching frequency is decided as

shown in the figure below. When setting beyond this range, there is a possibility that there is no oscillation and IC operation cannot

be guaranteed.

C_RTis required to stabilize switching frequency. Typical capacitance value is 100pF. Actually, the changes in the frequency

characteristic are greatly affected by the type and the condition (temperature, etc.) of parts that are used, the wire

routing and layout of the PCB.

700

R_RT[kΩ]

f_SW[kHz]

599

555

500

455

418

386

359

329

303

281

258

235

216

197

182

165

R_RT[kΩ]

100

110

f_SW[kHz]

151

139

128

119

104

98.

600

500

400

300

200

100

120

130

150

160

180

200

220

240

270

300

330

100

200

300

400

500

Switching Frequency Setting

Resistance : R_RT[kΩ]

Figure 13. Switching Frequency

vs Switching Frequency Setting Resistance

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7. Selection of the phase compensation circuit R3, C1, C2

A good high frequency response performance is achieved by setting the 0 dB crossing frequency, fc, (frequency at 0 dB

gain) high. However, you need to be aware of the trade-off correlation between speed and stability. Moreover, DC / DC

converter application is sampled by switching frequency, so the gain of this switching frequency must be suppressed. It

is necessary to set the 0 dB crossing frequency to 1 / 10 or less of the switching frequency. In summary, target these

characteristics as follows:

・When the 0 dB crossing frequency, fc, phase lag is less than or equal to 135 ˚(More than 45 ˚ phase margin).

・0 dB crossing frequency, fc, is 1 / 10 times or less of the switching frequency. To improve the responsiveness, higher

the phase compensation is set by the capacitor and resistor which are connected in series to the VC pin.

Achieving stability by using the phase compensation is done by cancelling the f_P1and f_P2(error amp pole and

power stage pole) of the regulation loop by use of f_Z1. f_P1, f_P2and f_Z1are determined in the following equations.

ꢓ =

[Hz]

푍1

2휋×ꢗ3×퐶1

ꢓ =

푃1

2휋×퐶 ×ꢗ

ꢈ

퐺

ꢤ퐴

ꢓ =

푃2

[Hz]

2휋×퐶1×ꢛ

ꢥ

Also, by inserting a capacitor in C2, phase lead f_Z2can be added.

ꢓ =

푍2

[Hz]

2휋×ꢗ1×퐶2

Where:

푅_푂is the resistance assumed actual load[Ω] = Output Voltage[V] / Output Current[A]、

ꢦ_ꢠꢛis the Error Amp trans conductance (270 µA / V)

ꢧ_푉is the Error Amp Voltage Gain (78 dB)

C_O

R_O

ERROR_AMP

V_REF

Setting Phase Compensation Circuit

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Selection of Components Externally Connected – continued

By setting zero and pole settings to suitable position, stable frequency characteristic can be achieved. The typical

setting of f_Z1,f_Z2is as below.

1. f_Z1setting is to cancel f_P1.

For instance, application which load current is 500 mA ~ 3.5 A, typical setting of F_Z1,F_P1setting in Application

Examples1 (P.19) is as below.

0.5 × ꢓ ≤ ꢓ ≤ 5 × ꢓ

푝1

푍1

(f_P1＝362 Hz [I_O=500 mA], 2.53 kHz [I_O=3.5 A] f_Z1=1.69 kHz)

2. f_Z2setting is to shift the 0 dB crossing frequency to higher frequency or to improvephase margin near the 0 dB

crossing frequency.

Typical setting of F_Z2,F_P1inApplication Examples3 (P.23) is as below.

0.5 × ꢓ

≤ ꢓ ≤ ꢨ × ꢓ

푍2 푧푒푟표

푧푒푟표

(f_ZERO＝31.6 kHz [I_O=400 mA] f_Z2=20.6 kHz)

Actually, the changes in the frequency characteristic are greatly affected by the type and the condition (temperature,

etc.) of parts that are used, the wire routing and layout of the PCB.

Please confirm stability and responsiveness in actual equipment.

To check the actual frequency characteristics, use a FRA or a gain-phase analyzer. Moreover, the method of observing

the degree of change by the loading response can be performed when these measuring instruments are not available.

The phase margin degree is said to be low when there are lots of variation quantities after the output is made to change

under no load to maximum load. It can also be observed that the phase margin degree is low when there is a lot of

ringing frequencies after the transition of no load to maximum load, usually two times or more ringing than the standard.

However, a quantitative phase margin degree cannot be confirmed.

Maximum load

Load

I_O

Inadequate phase margin

Output voltage

V_O

Adequate phase margin.

Measurement of Load Response

8. Setting of soft start time (T_SS)

The soft start function is necessary to prevent inrush of coil current and output voltage overshoot at startup.

T_SSwill be changed by setting the switching frequency.

The production tolerance of T_SSis ±18.1%.T_SScan be calculated by using the equation.

ꢕ9ꢩ.8

ꢚ =

ꢌꢌ

[s]

푓ꢪ푤

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Application Examples1

Parameter

Product Name

Symbol

Specification case

BD90640HFP / EFJ-C

6 V to 18 V

V_IN

Input Voltage

V_O

5 V

Output Voltage

ΔV_PP

I_O

20 mVp-p

Output Ripple Voltage

Output Current

Min 1.0 A / Typ 1.5 A / Max 2.0 A

500 kHz

f_SW

Switching Frequency

Operating Temperature

Topr

-40 °C ~ +105 °C

Specification Example 1

V_O

PVIN

VIN

R100

C_O

V_IN

Cbulk

C_IN

C_RT

R_RT

V_{EN / SYNC}

EN / SYNC

GND

Reference Circuit 1

Package

1608

Parameters

Part name (series)

MCR03 series

Type

Manufacturer

43 kΩ, 1 %, 1 / 10 W

8.2 kΩ, 1 %, 1 / 10 W

20 kΩ, 1 %, 1 / 10 W

SHORT

Chip resistor

ROHM

R100

R_RT

27 kΩ, 1 %, 1 / 10 W

4700 pF, R, 50 V

OPEN

1608

MCR03 series

GCM series

Chip resistor

Ceramic capacitor

ROHM

Murata

100 pF, CH, 50 V

4.7 μF, X7R, 50 V

C_RT

C_IN

1608

3225

GCM series

CD series

Ceramic capacitor

Murata

C_O

44 μF (22 μF, X7R, 16 V × 2)

220 μF, 50 V

Cbulk

Electrolytic capacitor NICHICON

L1 W 9.7 x H 3.8 x L 10 mm³

15 μH

CLF10040T-150M-H

RB095BM-40FH

Inductor

TDK

CPD

Average I = 6 A Max

Schottky Diode

ROHM

Parts List 1

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Characteristic Data (Application Examples 1)

100

Tektronix DPO5054

V_O10 mV / div＠AC

0.0

0.5

1.0

1.5

2.0

Output Current : I_O[A]

Figure 15. Output Ripple Voltage 1

(V_IN= 13.2 V, I_O= 1.5 A, 1 μs / div)

Figure 14. Efficiency vs Output Current

(Conversion Efficiency 1 V_IN= 13.2 V)

Tektronix DPO5054

FRA5087

V_O50 mV / div＠AC

Phase

Gain

I_O200 mA / div＠DC offset 1.5A

Figure 16. Frequency Characteristic 1

(V_IN= 13. 2 V, I_O= 1.5 A)

Figure 17. Load Response 1

(V_IN= 13.2 V, I_O= 1.5 A → 2.0 A, 200 μs / div)

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Application Examples 2

Parameter

Product Name

Symbol

Specification case

BD90620HFP / EFJ-C

6 V to 18 V

Input Voltage

V_IN

5 V

Output Voltage

V_O

20 mVp-p

Output Ripple Voltage

Output Current

ΔV_PP

I_O

Min 0.4 A / Typ 0.8 A / Max 1.5 A

500 kHz

Switching Frequency

Operating Temperature

f_SW

-40 °C ~ +105°C

Topr

Specification Example 2

V_O

PVIN

VIN

R100

C_O

V_IN

Cbulk

C_IN

C_RT

R_RT

V_{EN / SYNC}

EN / SYNC

GND

Reference Circuit 2

Package

1608

Parameters

Part name (series)

MCR03 series

Type

Manufacturer

43 kΩ, 1 %, 1 / 10 W

8.2 kΩ, 1 %, 1 / 10 W

20 kΩ, 1 %, 1 / 10 W

SHORT

Chip resistor

ROHM

R100

R_RT

27 kΩ, 1 %, 1 / 10 W

4700 pF, R, 50 V

OPEN

1608

MCR03 series

GCM series

Chip resistor

Ceramic capacitor

ROHM

Murata

100 pF, CH, 50 V

4.7 μF, X7R, 50 V

C_RT

C_IN

1608

3225

GCM series

CD series

Ceramic capacitor

Murata

C_O

44 μF (22 μF, X7R, 16 V × 2)

220 μF, 50 V

Cbulk

Electrolytic capacitor NICHICON

L1 W 9.7 x H 3.8 x L 10 mm³

22 μH

CLF10040T-220M-H

RB095BM-40FH

Inductor

TDK

CPD

Average I = 6 A Max

Schottky Diode

ROHM

Parts List 2

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Characteristic Data (Application Examples 2)

100

Tektronix DPO5054

V_O10 mV / div＠AC

0.0

0.5

1.0

1.5

Output Current : I_O[A]

Figure 18. Efficiency vs Output Current

(Conversion Efficiency 2 V_IN= 13.2 V)

Figure 19. Output Ripple Voltage 2

(V_IN= 13.2 V, I_O= 0.8 A, 1 μs / div)

Tektronix DPO5054

FRA5087

V_O50 mV / div＠AC

Phase

Gain

I_O200 mA / div＠DC

Figure 20. Frequency Characteristic 2

(V_IN= 13.2 V, I_O= 0.8 A)

Figure 21. Load ResponseResponse 2

(V_IN= 13.2 V, I_O= 0.8 A → 1.5 A, 200 μs / div)

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Application Examples 3

Parameter

Product Name

Symbol

Specification case

BD90610EFJ-C

6 V to 18 V

Input Voltage

V_IN

5 V

Output Voltage

V_O

20 mVp-p

Output Ripple Voltage

Output Current

ΔV_PP

I_O

Min 0.1 A / Typ 0.4 A / Max 0.8 A

500 kHz

Switching Frequency

Operating Temperature

f_SW

-40 °C ~ +105°C

Topr

Specification Example 3

V_O

PVIN

VIN

R100

C_O

V_IN

Cbulk

C_IN

C_RT

R_RT

V_{EN / SYNC}

EN / SYNC

GND

Reference Circuit 3

Package

1608

Parameters

43 kΩ, 1 %, 1 / 10 W

8.2 kΩ, 1 %, 1 / 10 W

33 kΩ, 1 %, 1 / 10 W

SHORT

Part name (series)

MCR03 series

Type

Manufacturer

ROHM

Chip resistor

R100

R_RT

27 kΩ, 1 %, 1 / 10 W

10000 pF, R, 50 V

180pF,CH,50V

1608

3225

MCR03 series

GCM series

CD series

Chip resistor

ROHM

Murata

Ceramic capacitor

100 pF, CH, 50 V

4.7 μF, X7R, 50 V

C_RT

C_IN

C_O

44 μF (22 μF, X7R, 16 V × 2)

220 μF, 50 V

Cbulk

Electrolytic capacitor NICHICON

L1 W 9.7 x H 3.8 x L 10 mm³

100 μH

CLF10040T-101M-H

RB055L-40TF

Inductor

TDK

PMDS

Average I = 3 A Max

Schottky Diode

ROHM

Parts List 3

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Characteristic Data (Application Examples 3)

100

Tektronix DPO5054

V_O10 mV / div＠AC

0.0

0.2

0.4

0.6

0.8

Output Current : I_O[A]

Figure 23. Output Ripple Voltage 3

(V_IN= 13.2 V, I_O= 0.4 A, 1 μs / div)

Figure 22. Efficiency vs Output Current

(Conversion Efficiency 3 V_IN= 13.2 V)

Tektronix DPO5054

FRA5087

V_O50 mV / div＠

Phase

Gain

I_O200 mA / div＠DC

Figure 24. Frequency Characteristic 3

(V_IN= 13.2 V, I_O= 0.4 A)

Figure 25. Load Response 3

(V_IN= 13.2 V, I_O= 0.4 A → 0.8 A, 200 μs / div)

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Application Examples 4

Parameter

Product Name

Symbol

Specification case

BD90640HFP / EFJ-C

3.5 V to 18 V

Input Voltage

V_IN

Output Voltage

V_O

3.3 V

Output Ripple Voltage

Output Current

ΔV_PP

I_O

20 mVp-p

Min 1.0 A / Typ 1.5 A / Max 2.0A

500 kHz

Switching Frequency

Operating Temperature

f_SW

Topr

-40 °C ~ +125°C

Specification Example 4

V_O

PVIN

R100

C_O

V_IN

VIN

Cbulk

C_IN

C_RT

R_RT

V_{EN / SYNC}

EN / SYNC

GND

Reference Circuit 4

Package

1608

Parameters

Part name (series)

MCR03 series

Type

Manufacturer

ROHM

47 kΩ, 1 %, 1 / 10 W

15 kΩ, 1 %, 1 / 10 W

10 kΩ, 1 %, 1 / 10 W

SHORT

Chip resistor

R100

R_RT

27 kΩ, 1 %, 1 / 10 W

6800 pF, R, 50 V

OPEN

1608

MCR03 series

GCM series

Chip resistor

ROHM

Murata

Ceramic capacitor

100 pF, CH, 50 V

4.7 μF, X7R, 50 V

C_RT

C_IN

1608

3225

GCM series

CZ series

Ceramic capacitor

Murata

C_O

44 μF (22 μF, X7R, 16 V × 2)

220 μF,35 V × 2

Cbulk

Electrolytic capacitor NICHICON

L1 W 9.7 x H 3.8 x L 10 mm³

15 μH

CLF10040T-150M-D

RB095BM-40FH

Inductor

TDK

CPD

Average I = 6 A Max

Schottky Diode

ROHM

Parts List 4

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Characteristic Data (Application Examples 4)

100

Tektronix DPO5054

V_O10 mV / div＠AC

0.0

0.5

1.0

1.5

2.0

Output Current : I_O[A]

Figure 26. Efficiency vs Output Current

(Conversion Efficiency 4 V_IN= 13.2 V)

Figure 27. Output Ripple Voltage 4

(V_IN= 13.2 V, I_O= 1.5 A, 1 μs / div)

FRA5087

Tektronix DPO5054

V_O50 mV / div＠AC

Phase

Gain

I_O200 mA / div＠DC offset

Figure 28. Frequency Characteristic 4

(V_IN= 13.2 V, I_O= 1.5 A)

Figure 29. Load Response 4

(V_IN= 13.2 V, I_O= 1.5 A → 2.0 A, 200 μs / div)

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Application Examples 5

Parameter

Product Name

Symbol

Specification case

BD90640HFP / EFJ-C

9 V to 18 V

Input Voltage

V_IN

8.8 V

Output Voltage

V_O

100 mVp-p

Output Ripple Voltage

Output Current

ΔV_PP

I_O

Min 1.0 A / Typ 1.5 A / Max 2.0 A

500 kHz

Switching Frequency

Operating Temperature

f_SW

-40 °C ~ +125°C

Topr

Specification Example 5

V_O

PVIN

R100

C_O

V_IN

VIN

Cbulk

C_IN

C_RT

R_RT

V_{EN / SYNC}

EN / SYNC

GND

Reference Circuit 5

Package

Parameters

Part name (series)

MCR03 series

Type

Manufacturer

ROHM

1608

51 kΩ, 1 %, 1 / 10 W

5.1 kΩ, 1 %, 1 / 10 W

91 kΩ, 1 %, 1 / 10 W

SHORT

Chip resistor

R100

R_RT

27 kΩ, 1 %, 1 / 10 W

10000 pF, R, 50 V

OPEN

1608

MCR03 series

GCM series

Chip resistor

ROHM

Murata

Ceramic capacitor

100 pF, CH, 50 V

4.7 μF, X7R, 50 V

270 μF, 25 V

C_RT

C_IN

1608

3225

GCM series

HVP series

CZ series

Ceramic capacitor

Hybrid capacitor

Murata

SUNCON

C_O

Cbulk

220 μF, 35 V × 2

22 μH

Electrolytic capacitor NICHICON

L1 W 9.7 x H 3.8 x L 10 mm³

CLF10040T-220M-D

RB095BM-40FH

Inductor

TDK

CPD

Average I = 6 A Max

Schottky Diode

ROHM

Parts List 5

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Characteristic Data (Application Examples 5)

100

Tektronix DPO5054

V_O10 mV / div＠AC

0.0

0.5

1.0

1.5

2.0

Output Current : I_O[A]

Figure 31. Output Ripple Voltage 5

(V_IN= 13.2 V, I_O= 1.5 A, 1 μs / div)

Figure 30. Efficiency vs Output Current

(Conversion5 Efficiency V_IN= 13.2 V)

FRA5087

Tektronix DPO5054

V_O50 mV / div＠AC

Phase

Gain

I_O200 mA / div＠DC offset

Figure 32. Frequency Characteristic 5

(V_IN= 13.2 V, I_O= 1.5 A)

Figure 33. Load Response 5

(V_IN= 13.2 V, I_O= 1.5 A → 2.0 A, 500 μs / div)

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Automotive Power Supply Line Circuit

Reverse-touching

protection Diode

BATTERY

LINE

VIN

BD906xx-C series

TVS

π type filter

Figure 34. Filter Circuit

The input filter circuit for EMC measures is depicted in the above Figure 34.

The π type filters are the third order LC filters. When the decoupling capacitor for high frequency is insufficient, it uses π

type filters. An excellent characteristic can be performed as EMI filter by a large attenuation characteristic.

Components for π type filter shall be closely-placed.

TVS (Transient Voltage Suppressors) are used for the first protection of the in automotive power supply line. Because it is

necessary to endure high energy when the load is connected, a general zener diode is insufficient. The following are

recommended. To protect it when the power supply such as BATTERY is accidentally connected in reverse, reverse polarity

protection diode is needed.

Device

Part name (series)

CLF series

Manufacturer

TDK

Device

TVS

Part name (series)

SM8 series

Manufacturer

Vishay

XAL series

Coilcraft

S3A thru S3M series

Vishay

CJ series / CZ series

NICHICON

Parts of Automotive Power Supply Line Circuit

Recommended Parts Manufacturer List

Shown below is the list of the recommended parts manufacturers for reference.

Type

Electrolytic capacitor

Ceramic capacitor

Inductor

Manufacturer

NICHICON

Murata

URL

www.nichicon.com

www.murata.com

www.global.tdk.com

www.coilcraft.com

www.sumida.com

www.vishay.com

www.rohm.com

TDK

Inductor

Coilcraft

SUMIDA

Vishay

Inductor

Diode

Diode / Resistor

ROHM

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Directions for Pattern Layout of PCB

GND

R100

V_IN

V_O

Cbulk

C_O1

C_O2

C_IN2 C_IN1

R_RT

C_RT

Exposed die pad is needed to be connected to GND.

Application Circuit (HRP7)

R100

1.RT

C_RT

8.FB

R_RT

V_IN

V_O

2.SW

7.PVIN

6.VIN

5.VC

C_O1 C_O2

C_IN1 C_IN2

Cbulk

3.EN / SYNC

4.GND

Exposed die pad is needed to be connected to GND.

Application Circuit (HTSOP-J8)

1. Arrange the wirings of the wide lines, shown above, as short as possible in a broad pattern.

2. Locate the input ceramic capacitor C_INas close to the VIN - GND pin as possible.

3. Locate R_RTas close to the RT pin as possible.

4. Locate R1 and R2 as close to the FB pin as possible, and provide the shortest wiring from the R1 and R2 to the FB pin.

5. Locate R1 and R2 as far away from the L1 as possible.

6. Separate Power GND (schottky diode, I/O capacitor`s GND) and Signal GND (R_T, VC), so that switching noise does not

have an effect on SIGNAL GND at all.

7. The feedback frequency characteristics (phase margin) can be measured using FRA by inserting a resistor at the

location of R100. However, this should be shorted during normal operation. R100 is option pattern for measuring the

feedback frequency characteristics.

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Reference layout pattern

HRP7

EN /

SYNC

EN/

SYNC

PGND

GND

C_O

C_O2

VIN

C_IN

VIN

C_IN

Cbulk

PGND

Top Layer

Bottom Layer

HTSOP-J8

VIN

PGND

Cbulk

C_O1

C_O2

R_RT

C_RT

PVIN

VIN

C_IN

GND

EN /

SYNC

EN/

SYNC

Top Layer

Bottom Layer

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Power Dissipation

For thermal design, be sure to operate the IC within the following conditions.

(Since the temperatures described hereunder are all guaranteed temperatures, take margin into account.)

1. The ambient temperature Ta is to be 125 °C or less.

2. The chip junction temperature Tj is to be 150 °C or less.

The chip junction temperature Tj can be considered in the following two patterns:

①

②

To obtain Tj from the package surface center temperature Tt in actual use

ꢚ푗 = ꢚ푡 + 휓_퐽푇× ꢫ

To obtain Tj from the ambient temperature Ta

ꢚ푗 = ꢚꢬ + 휃푗ꢬ × ꢫ

＜Reference Value＞ HRP7

＜Reference Value＞ HTSOP-J8

θjc

Top : 22 °C / W

Top : 44 °C / W

Bottom : 2 °C / W

θja

Bottom : 14 °C / W

θja

95.3 °C / W 1-layer PCB

17.9 °C / W 4-layer PCB

ψ_JT

189.4 °C / W 1-layer PCB

40.3 °C / W 4-layer PCB

ψ_JT

5 °C / W 1-layer PCB

1 °C / W 4-layer PCB

PCB Size 114.3 mm x 76.2 mm x 1.60 mmt

21°C / W 1-layer PCB

5°C / W 4-layer PCB

PCB Size 114.3 mmx76.2 mm x 1.60 mmt

The heat loss W of the IC can be obtained by the formula shown below:

ꢂ_푂

ꢔ

( )

+ ꢂ × ꢇ_ꢀꢃ+ × ꢚꢭ + ꢚꢓ × ꢂ × ꢇ_푂× ꢓ푠ꢮ

ꢀꢃ ꢀꢃ

ꢫ = 푅_ON× ꢇ_푂

ꢂ

ꢀꢃ

ꢨ

Where:

R_ONis the ON Resistance of IC (Refer to page 7) [Ω]

I_Ois the Load Current [A]

V_Ois the Output Voltage [V]

V_INis the Input Voltage [V]

I_INis the Circuit Current (Refer to page 7) [A]

Tr is the Switching Rise Time [s] (Typ:17ns)

Tf is the Switching Fall Time [s] (Typ:17ns)

fsw is the Switching Frequency [Hz]

(17 ns)

①

V_IN

①푅_푂ꢃ× ꢇ_푂

ꢔ

SW wave form

ꢔ

ꢚ

② × (ꢚꢭ + ꢚꢓ) × ꢂ × ꢇ_푂×

ꢀꢃ

ꢨ

GND

= ꢚꢭ × ꢂ × ꢇ_푂× ꢓ푠ꢮ

ꢀꢃ

fsw

②

SW Wave Form

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Thermal reduction characteristics

HRP7

7.0

①IC mounted on ROHM standard board based on JEDEC51-3

1 - layer PCB

Board materials : FR-4

Board size : 114.3 mm × 76.2 mm × 1.57 mmt

Top copper foil : footprint + wiring to measure, 70 μm copper.

6.0

②6.98 W

5.0

4.0

3.0

2.0

②IC mounted on ROHM standard board based on JEDEC51-5,7

4 - layer PCB

Board materials : FR-4

Board size : 114.3 mm × 76.2 mm × 1.60 mmt

Thermal via : pitch 1.20 mm, diameter Φ0.30 mm

Top copper foil : footprint + wiring to measure, 70 μm copper.

2 inner layers copper foil : 74.2 mm × 74.2 mm, 35um copper.

Reverse copper foil : 74.2 mm × 74.2 mm, 70um copper.

1.0

①1.31 W

0.0

75 100 125 150

Condition① : θja = 95.3 °C / W

Condition② : θja = 17.9 °C / W

Ambient Temperature : [˚C]

Figure 35. Power Dissipation vs Ambient Temperature

(Thermal Reduction Characteristics (HRP7) )

HTSOP-J8

①IC mounted on ROHM standard board based on JEDEC51-3

1 - layer PCB

Board materials : FR-4

Board size : 114.3 mm × 76.2 mm × 1.57 mmt

Top copper foil : footprint + wiring to measure, 70 μm copper.

7.0

6.0

5.0

4.0

②IC mounted on ROHM standard board based on JEDEC51-5,7

4 - layer PCB

②3.10 W

3.0

2.0

Board materials : FR-4

Board size : 114.3 mm × 76.2 mm × 1.60 mmt

Thermal via : pitch 1.20 mm, diameter Φ0.30 mm

Top copper foil : footprint + wiring to measure, 70 μm copper.

2 inner layers copper foil : 74.2 mm × 74.2 mm, 35um copper.

Reverse copper foil : 74.2 mm × 74.2 mm, 70um copper.

①0.66 W

1.0

0.0

Condition① : θja = 189.4 °C / W

Condition② : θja = 40.3 °C / W

25 50 75 100 125 150

Ambient Temperature : [˚C]

Figure 36. Power Dissipation vs Ambient Temperature

(Thermal Reduction Characteristics (HTSOP-J8) )

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I/O Equivalent Circuit

VIN

Internal

Supply

Internal

Supply

Internal

Supply

30kΩ

VIN

1kΩ

30kΩ

1kΩ

4MΩ

VIN

Internal

Supply

PVIN

Internal

Supply

VIN

200kΩ

30kΩ

10kΩ

30kΩ

EN / SYNC

VIN

1333kΩ

400kΩ

EN / SYNC

100kΩ

200kΩ

185kΩ

250kΩ

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

Ground Voltage

Ensure that no pins are at a potential below the ground pin at any time, even during transient condition. However, pins

that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to

back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will

not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as

motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd rating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 37. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

17. Disturbance light

In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due

to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip

from being exposed to light.

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Ordering Information

- C

Package

HFP : HRP7

EFJ : HTSOP-J8

Product Rank

C : for Automotive

Tape and Reel Information

TR : Reel type embossed taping

E2 : Reel type embossed taping

Product

Name

Output Switch Current

90640 : 4 A

90620 : 2.5 A

90610 : 1.25 A

Marking Diagram

HRP7 (TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

Output Switch Current

4 A

BD90640HFP

BD90620HFP

2.5 A

1PIN MARK

HTSOP-J8 (TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

D90640

Output Switch Current

4 A

2.5 A

1.25 A

D90620

D90610

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

HRP7

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Physical Dimension, Tape and Reel Information

Package Name

HTSOP-J8

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TSZ22111・15・001

TSZ02201-0T1T0AL00130-1-2

15.Sep.2015 Rev.005

39/40

BD906xx-C series

Revision History

Date

Revision

Changes

New Release

6.Jan.2014

001

P.4 Description of OCP remove sentence “Furthermore ~”

P.6 Operating Output Switch Current Of Overcurrent Protection symbol change I_SWLIMIT

P.18 Parts List D1 Package change “PMDS”

7.Apr.2014

002

P.19 Parts List C2 change “open”

P.21 About Directions for Pattern Layout of PCB

⑥ change “～and Signal GND (R_T, VC,),～”

HRP Package version addition

P.5 Recommended Operating Conditions：Capacitance of Input Capacitor addition

P.17 Setting Phase Compensation Circuit：Change SBD symbol

P.28 I/O Equivalent Circuit：Change MOS symbol

17.Oct.2014

21.Nov.2014

003

004

The whole : Changing format

Power Dissipation Note : additional detail of board condition

Selection of the switching frequency setting : additional setting C_RT

Selection of the phase compensation circuit : additional settings to suitable position of the phase

compensation

15.Sep.2015

005

Marking diagram [HRP7] : delete “BD90610HFP” .

www.rohm.com

TSZ02201-0T1T0AL00130-1-2

15.Sep.2015 Rev.005

40/40

TSZ22111・15・001

Daattaasshheeeett

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.001

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.001

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

Buy

BD90610EFJ-C - Web Page

Distribution Inventory

Part Number

Package

Unit Quantity

BD90610EFJ-C

HTSOP-J8

2500

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

2500

Taping

inquiry

Yes

BD90610UEFJ-C [ROHM]

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