BD9302FP-E2_技术文档

TECHNICAL NOTE

Single-chip Type with Built-in FET Switching Regulator Series

2-output High-efficiency Step-down

Switching Regulators

with Built-in Power MOSFET

BD9302FP

Description

The BD9302FP is a 2-channel step-down switching regulator controller with a 2.5-MHz, 2-A power switch and available for

2.5-MHz high speed switching operation, which facilitates settings of switching frequency with external resistance, supporting

for a wide input voltage range of 6 to 18 V. Furthermore, due to a low reference voltage of 0.6 V, this BD9302FP is an L/C best

suited to high-voltage input/low-voltage output applications, for example, to step down a voltage from 12 V to 1.2 V.

Features

1) A wide input voltage range of 6 V to 18 V

2) Easy switching frequency setting in the range of 200 k to 2.5 MHz.

3) Two built-in power switches of 0.4 Ω, 2 A.

4) 180˚ phase shift

5) Built-in Under Voltage Lock Out circuit

6) Built-in overcurrent protection circuit

7) Built-in Thermal Shutdown circuit

Use

Power supply for DPS requiring two power sources

ADSL modem/plasma display

Audio devices

Dec. 2008

Absolute maximum ratings (Ta=25˚C)

Item

Symbol

Rating

Unit

V

mW

˚C

A

Power supply voltage

Power dissipation

Vcc

Pd

20

1450*

Operating temperature

Storage temperature

Output current

Topr

Tstg

Io

-

40 ~ +85

-

55 ~ +150

2**

Maximum junction temperature

Tjmax

150

˚C

* Should be derated by 11.6 mW/˚C at Ta=25˚C or more. When mounted on a glass epoxy PCB of 70¥70¥1.6 mm)

** Should not exceed Pd-value.

Recommended operating range (Ta=25˚C)

Limits

Item

Symbol

Unit

Min

Typ

Max

18

Power supply voltage

Output current

Vcc

Io

6

–

12

–

V

A

1.8

100

10

Timing resistance

Oscillation frequency

RT

kΩ

kHz

–

100

Fosc

2500

Electrical characteristics

Electrical characteristics (Unless otherwise specified, Ta=25˚C, Vcc=12 V, RT=10 kΩ)

Limits

Unit

Conditions

Item

Symbol

Min

Typ

Max

[Triangular wave oscillator block]

Oscillation frequency

F^OSC

1800

–

2000

1

kHz

%

RT=10kΩ

2200

–

Frequency variation

FDVO

~ 18V

[Overcurrent protection circuit block]

Overcurrent limit Isw

2

6

*

4

A

[Under-voltage malfunction prevention circuit block]

3.0

3.6

3.3

Upper limit threshold voltage

Lower limit threshold voltage

[Soft start circuit block]

Source current

VtH

VtL

3.3

3.0

V

2.7

6

0.6

1.75

–

Vss=1V

14

5

Isso

ISSI

10

1.7

1.95

–

uA

mA

V

Vss=1V, Vcc=3V

Sink current

2.15

0.3

Clamp voltage

Vcl

Shutdown voltage

VSDWN

V

Vcc=3V

Not designed for radiation resistance.

* Design guarantee (No 100% pre-shipment inspections are conducted.)

2/16

Electrical characteristics

Electrical characteristics (Unless otherwise specified, Ta=25˚C, Vcc=12 V, RT=10 kΩ)

Limits

Unit

Conditions

Item

Symbol

Min

Typ

Max

[Error amplifier block]

Input bias current

I^IB

AV

–

0.4

200

1.95

0.8

1

–

uA

V/V

V

Voltage gain

COMP maximum output voltage

COMP minimum output voltage

Output sink current

VOH

VOL

IOI

1.75

–

I^COMP=

-0.1mA

1.0

4

V

ICOMP=0.1mA

VFB=0.8V

VFB=0.4V

Buffer

1

2

mA

V

– 8

Output source current

Feedback voltage

IOO

VFB

– 4

– 1

0.612

0.588

0.600

[Output block]

–

Ω

Upper-side ON resistance

Low-side ON resistance

OFF current

Ronh

Ronl

IOFF

0.4

2

0.6

3

Io=1A*

Io=20mA*

SW=0V

0.1

mA

0.2

0.4

[Total device]

–

mA

–

Average supply current

ICC

5

RT=1.0V

Not designed for radiation resistance.

* Design guarantee (No 100% pre-shipment inspections are conducted.)

Measurement circuit diagram

10pF

Ω

PGND1

COMP1

FB1

SW1L

A

V

30kΩ

SW1

30kΩ

A

V

NULL AMP

100kΩ

+

–

BOOT1

PVcc

5V

RT

V

10kΩ

1000pF

1V

1kΩ

0.6V

1uF

NC

SS1

10K

1000pF

PVcc

A

V

1V

10pF

A

V

30kΩ

A

Vcc

12V

PVcc

SS2

A

V

PVcc

BOOT2

SW2

1V

NC

FB2

5V

NULL AMP

1uF

100kΩ

COMP2

GND

PGND2

+

–

Ω

V

10kΩ

SW2

1kΩ

0.6V

A

V

1000pF

SW2L

Fig. 1 Typical measurement circuit

3/16

Reference characteristics data

0.66

0.65

0.64

0.63

0.62

0.61

0.60

0.59

0.58

0.57

0.56

0.55

0.54

0.53

0.52

0.51

0.50

800

750

700

650

600

550

500

450

400

350

300

250

200

150

100

50

8.0

7.5

7.0

6.5

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

85˚C

-

40˚C

25˚C

0

-

40

-

30

-

20

-

10

0

10 20 30 40 50 60 70 80 85

40

-

30

-

20

-

10

0

10 20 30 40 50 60 70 80 85

0 1 2 3 4 5 6 7 8 9 10 1112 13 1415 16 17 18

INPUT VOLTAGE : VCC [V]

AMBIENT TEMPERATURE : Ta [˚C]

Fig.2

Fig.3

Fig.4

Feedback voltage –

Ambient temperature

Switching frequency –

Ambient temperature

Power supply voltage –

Circuit current

0.80

0.75

0.70

0.65

0.60

0.55

0.50

0.45

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

3.2

3.0

2.8

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

100000

10000

1000

100

10

-

40

-

30

-20

-10

0

10 20 30 40 50 60 70 80 85

-

40

-

30

-20

-10

0

10 20 30 40 50 60 70 80 85

10

100

AMBIENT TEMPERATURE : Ta [˚C]

TIMING RESISTANCE : RT [kΩ]

Fig.5

Fig.6

Fig.7

SW ON resistance –

Ambient temperature

SWL ON resistance –

Ambient temperature

Setting resistance –

Switching frequency

100

90

80

70

60

50

40

30

20

10

2.6

2.5

2.4

2.3

2.2

2.1

2.0

1.9

1.8

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

90

80

70

60

50

40

30

20

10

0

6

7

8

9 10 11 12 13 14 15 16 17 18

200

1000

2000

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8

SWITCHING FREQUENCY : FSW [kHz]

INPUT VOLTAGE : VCC [V]

OUTPUT CURRENT : IO [A]

Fig.8

Fig.9

Fig.10

Switching frequency – MAX Duty Switching frequency – Power supply voltage

Output current – Efficiency

(*) The data shown above represent real values sampled but not guarantee values.

4/16

Reference characteristics data

100

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

100

10

1

0

6

7

8

9

10 11 12 13 14 15 16 17 18

400 600 800 1000 1200 1400 1600 1800 2000 2200 2400

0.01

0.10

1.00

INPUT VOLTAGE : VCC [V]

SWITCHING FREQUENCY : FSW [kHz]

SS CAPACITOR : CSS [μF]

Fig.11

Fig.12

Fig.13

Power supply voltage – Efficiency

Switching frequency – Efficiency

Set capacitance – Delay time

12V

INPUT

OUTPUT

VOLTAGE

CURRENT

2.5V

1.47ms

OUTPUT

VOLTAGE

(AC)

OUTPUT

VOLTAGE

(AC)

OUTPUT

VOLTAGE

Fig.14

Startup waveform

Fig.15

Fig.16

Load transient response No. 1

Load transient response No. 2

Application measurement circuit diagram

100

kΩ

33pF

3300pF

20kΩ

10μH

Vo1=3.3V

10μF

0.1μF

22

kΩ

51kΩ

0.1μF

Vcc

12V

10μF

0.1μF

20kΩ

0.1μF

10μH

10μF

Vo2=1.2V

3300

pF

33

pF

30

kΩ

30kΩ

Fig.17 Application measurement circuit diagram

(*) The data shown above represent real values sampled but not guarantee values.

5/16

Pin assignment

Block diagram

PGND1

COMP1

FB1

1

2

3

4

5

6

25 SW1L

24 SW1

PGND1

COMP1

FB1

1

2

3

25 SW1L

24 SW1

23 SW1

OCP

RT

22 BOOT1

21 PVCC

20 PVCC

0.6V

N.C.

Current

Sense

ERR

+

-

SS1/SDWN

Fin

DRV2

BOOT1

22

SDWN

DRV1

SDWN

Fin

4

5

RT

slope

Set

VCC

SS2/SDWN

N.C.

7

8

Reset

N.C.

+

-

19 PVCC

18 PVCC

17 BOOT2

16 SW2

21 PVCC

20 PVCC

PWM

9

6

7

SS1/SDWN

VCC

FB2

10

11

12

13

COMP2

GND

15 SW2

UVLO

TSD

PGND2

14 SW2L

Internal

Bias

VREF

0.6V

5V

OSC

8

9

19 PVCC

18 PVCC

17 BOOT2

SS2/SDWN

N.C.

SDWN

Set

DRV1

+

-

ERR

Reset

DRV2

10

FB2

SDWN

PWM

+

-

COMP2 11

16 SW2

15 SW2

slope

Current

Sense

OCP

GND 12

PGND2 13

14 SW2L

TOP VIEW

Fig.18 Pin assignment / Block diagram

Pin assignment / functions

Pin No.

Pin name

Function

Pin No.

Pin name

Function

1

2

3

4

5

6

Ground

13

14

15

16

17

18

19

20

21

22

23

24

25

PGND2

SW2L

SW2

Ground

PGND1

COMP1

FB1

Error amplifier output

Error amplifier inverting input

Frequency setting resistor connection

N.C.

Switching output 2 (Low side)

Switching output 2

SW2

Switching output 2

RT

–

BOOT2

Pvcc

Boot capacitor connection

Power supply input

SS1/SDWN

Soft start capacitor connection

(Shutdown at Low)

Pvcc

Power supply input

VCC

7

8

Power supply input

Soft start capacitor connection

(Shutdown at Low)

Pvcc

Power supply input

Pvcc

Power supply input

SS2/SDWN

BOOT1

SW1

Boot capacitor connection

Switching output 1

9

N.C.

–

10

11

12

Error amplifier inverting input

Error amplifier output

Ground

SW1

Switching output 1

FB2

SW1L

Switching output 1 (Low side)

COMP2

GND

6/16

SW1L

SW1

PGND1

33pF

100kΩ

3300

1

2

3

25

24

pF COMP1

OCP

20kΩ

0.6V

10

Current

Sense

μH

ERR

+

-

FB1

RT

23

22

VO : 3.3V

22kΩ

10μF

0.1μF

BOOT1

DRV2

SDWN

DRV1

SDWN

4

5

slope

Set

51kΩ

Reset

N.C.

+

-

PVCC

21

20

PWM

SS1/SDWN

6

7

0.1μF

VCC

PVCC

UVLO

TSD

10

Internal

Bias

VREF

0.6V

VCC

5V

μF

OSC

SS2/SDWN

PVCC

BOOT2

8

9

19

18

17

0.1μF

N.C.

FB2

SDWN

Set

DRV1

+

-

ERR

Reset

DRV2

10

SDWN

30

kΩ

30

kΩ

PWM

33

pF

0.1

μF

10

μH

+

-

COMP2

SW2

SW2L

11

16

15

14

VO : 1.2V

slope

Current

Sense

20

kΩ

10

μF

3300

pF

OCP

GND

12

13

PGND2

Fig.19 Typical application circuit

ü Error amplifier (ERR) block

The ERR block is a circuit used to compare between the 0.6-V reference voltage and the feedback voltage of output

voltage. The COMP voltage, a result of this comparison, determines the switching Duty. Furthermore, soft start function is

activated with the SS voltage while in startup operation. Consequently, the COMP voltage is limited to the SS voltage.

ü Oscillator (OSC) block

The OSC block is a block to determine the switching frequency through the RT pin, which is settable in the range of 100

kHz to 2500 kHz.

ü SLOPE block

The SLOPE block is a block to generate a triangular wave from the clock generated with the OSC and then to transmit the

triangular wave to the PWM comparator.

ü PWM block

The PWM block is used to make comparison between the output COMP voltage of the error amplifier block and the

triangular wave of the SLOPE block, thus determining the switching Duty. The switching duty is limited with the maximum

duty ratio, which is internally determined, and will not reach 100%.

ü Reference voltage (UREF) block

The UREF block is a block to generate a 2.9-V internal reference voltage.

ü Protection circuit (UVLO/TSD) block

The UVLO (Under Voltage Lock Out) circuit is used to shut down the circuit when the voltage falls below approximately 3.3

V, while the TSD (Thermal Shutdown) circuit is used to shut down the circuit at a temperature of 175˚C and reset it at a

temperature of 160˚C.

ü Overcurrent protection circuit (OCP)

This function is used to detect a current passing through the power transistor FET with the CURRENT SENSE and activate

the overcurrent protection when the current reaches approximately 4 A. If the overcurrent protection is activated, switching

will be turned OFF to discharge the SS pin capacitance.

7/16

Timing chart

Startup sequence

Vcc

SS

SW

VOUT

Fig.20 Startup sequence

Normal operation

VdC

SW

Vo

Io

Fig.21 While in normal operation

8/16

External component setting procedure

(1) Setting of output L constant

The coil L used for output is determined according to the rated current ILR and the maximum load current value IOMAX

of the coil.

VCC

IL

Adjust so that (IOMAX + DIL) will

not conflict with the rating.

ILR

IL

Average IOMAX current

VO

L

CO

t

Fig.22

Fig.23

Adjust so that (IOMAX + DIL) will not conflict with the rating. At this time, DIL can be obtained according to the formula

shown below.

1

L

VO

VCC

1

f

Step-down DIL =

,where f: Switching frequency

¥ (VCC – VO) ¥

¥

[A] . . . (1.1)

Furthermore, since the coil L value may also vary by approximately ±30%, set this value with an adequate margin. If the

coil current IL exceeds the rated coil current ILR, the internal IC element may be damaged. It is recommended to make

setting of coil value in the range of 4.7 μF to 100 μF.

(2) Setting of output Co constant

For output capacitor, select the allowable ripple voltage VPP or the allowable drop voltage at a sharp change of load,

whichever larger for the capacitor. The output ripple voltage can be obtained according to the formula shown below.

DIL

2CO

VO

VCC

1

f

Step-down DVPP = DIL

,where f: Switching frequency

¥ RESR +

¥

[V]

Design the component so that this constant will fall within the allowable ripple voltage.

Furthermore, estimate the drop voltage VDR at a sharp change of load according to the formula shown below.

DI

CO

VDR =

¥ 10μsec

[V]

However, 10 μsec will be the estimated value of the DC/DC converter response speed.

Make setting of capacitance with thorough consideration given to the margin so that these two values will fall into the

specified values. It is recommended to make setting of the capacitance in the range of 10 μF to 100 μF. if a short circuit

occurs, an inverse current passes through the parasitic diode to cause damage to the internal circuits. To prevent that,

insert a backflow prevention diode.

9/16

(3) Setting of feedback resistance constant

In order to make settings of feedback resistance, refer to the formula shown. It is recommended to make setting of

resistance in the range of 10 kΩ to 330 kΩ. Setting the resistance to 10 kΩ or less will result in degraded power

efficiency, while setting it to 330 kΩ or more will increase the offset voltage due to the input bias current of 0.4 μA (TYP)

of the internal error amplifier.

VO

Internal reference voltage: 0.6 V

R8

FB

R9

Fig.24

R8+R9

VO=

¥ 0.6 [V]

R9

(4) Setting of oscillation frequency

Connecting a resistor to the RT pin (pin 4) will allow for the setting of triangular wave oscillation frequency. The RT

determines the charge/discharge current to the internal capacitor, with which the frequency varies. Referring to Figure

shown below, make settings of the RT resistor. Recommended setting range is 10 to 100 kΩ. Be noted that any setting

outside of this range may turn OFF switching, thus impairing the operation guarantee.

100000

10000

1000

100

10

100

TIMING RESISTANCE : RT [kΩ]

Fig.25 RT vs. Switching frequency

(5) Setting of soft start time

The soft start function will be required to prevent an excessive increase in the coil current and overshoot of the output

voltage, while in startup operation. Figure below shows the relationship between the capacitor and the soft start time.

Referring to this Figure, make the capacitor setting.

100

10

1

0

0.01

0.10

1.00

SS CAPACITOR : CSS [μF]

Fig.26 SS capacitance vs. Delay time

It is recommended to make setting of capacitance value in the range of 0.01 to 10 μF. Setting the capacitance value to

0.01 μF or less may cause overshoot to the output voltage. If any startup-related function (sequence) of other power

supply is provided, use a high-accuracy product (e.g. ¥ 5R) or the like.

Furthermore, since the soft start time varies with the input voltage, output voltage, load, coil, output capacitor, or else,

be sure to check to be sure this soft start time on the actual system.

10/16

(6) Phase compensation

Phase compensation setting procedure

The phase compensation setting procedure varies with the selection of capacitance used for DC/DC converter

application. In this connection, the following section describes the procedure by classifying into the two types.

Furthermore, the application stability conditions are described in the “Description” section.

1. Application stability conditions

2. For output capacitors having high ESR, such as electrolytic capacitor

3. For output capacitors having low ESR, such as ceramic capacitor or OS-CON

About application stability conditions

The following section shows the stability conditions of negative feedback system.

ü At a 1 (0-dB) gain, the phase delay is 150˚ or less (i.e., the phase margin is 30˚ or more).

Furthermore, since the DC/DC converter application is sampled according to the switching frequency, GBW of the

overall system should be set to 1/10 or less of the switching frequency. The following section summarizes the

targeted characteristics of this application.

ü At a 1 (0-dB) gain, the phase delay is 150˚ or less (i.e., the phase margin is 30˚ or more).

ü The GBW (i.e., frequency at 0-dB gain) for this occasion is 1/10 or less of the switching frequency.

Consequently, in order to upgrade the responsiveness, higher switching frequency should be provided.

A knack for ensuring the stability through the phase compensation is to cancel a secondary phase delay (-180˚)

resulting from LC resonance with a secondary phase lead (i.e., through inserting two phase leads).

Furthermore, the GBW (i.e., frequency at 0-dB gain) is determined according to phase compensation capacitance

to be provided for the error amplifier. Consequently, in order to reduce the GBW, increase the capacitor

capacitance.

(1) Typical (sun) integrator (Low pass filter)

(2) Open loop characteristics of integrator

(a)

-20dB/decade

A

FB

Gain

[dB]

Feed

back

A

R

GBW(b)

0

Phase

[deg]

0

C

-

90˚

-

90

位相マージン

Fig.27

-180˚

-180

Fig.28

1

Point (a) fa=

1.25 [Hz]

2pRCA

1

Point (b) fa= GBW

[Hz]

2pRC

Since the error amplifier is provided with (1) or (2) phase compensation, the low pass filter is applied.

In the case of the DC/DC converter application, the R becomes a parallel resistance of the feedback resistance.

11/16

For output capacitors having high ESR, such as aluminum electrolytic capacitor

For output capacitors having high ESR (i.e., several ohms), the phase compensation setting procedure becomes

comparatively simple. Since the DC/DC converter application has surely a LC resonant circuit attached to the

output, a -180˚ phase-delay occurs in that area. If ESR component is present there, however, a +90˚ phase-lead

occurs to shift the phase delay to -90˚. Since the phase delay is desired to set within 150˚, this is a very effective

method but has a demerit to increase the ripple component of the output voltage.

(3) LC resonant circuit

(4) With ESR provided

VCC

L

VO

RESR

C

1

fr=

[Hz]

fr=

[Hz]: Resonance point

[Hz]: Phase lead

2p LC

1

At this resonance point, a -180˚

phase-delay occurs.

fESR=

2pRESRC

A -90˚ phase-delay occurs.

Fig.29

Fig.30

According to changes in phase characteristics due to the ESR, only one phase lead should be inserted. For this

phase lead, select either of the methods shows below.

(5) Insert feedback resistance in the C.

VO

(6) Insert the R3 in integrator.

VO

C2

R3 C2

C1

R1

FB

A

R2

1

Phase lead: fZ=

[Hz]

Phase lead: fZ=

[Hz]

2pC1R1

2pC2R3

Fig.31

Fig.32

For the purpose of canceling the LC resonance, the frequency to insert the phase lead should be set close to the

LC resonant frequency.

For output capacitors having low ESR, such as ceramic capacitor or OS-CON

Unlike the section above, in order to use capacitors having low ESR (i.e., several tens of mW), two phase-leads

should be inserted so that a -180∞ phase-delay due to LC resonance will be observed. Example (7) blow shows a

typical phase compensation procedure.

(7) Phase compensation with secondary phase lead

VO

R3 C2

C1

R1

1

Phase lead: fZ1=

Phase lead: fZ2=

[Hz]

2pR1C1

FB

A

1

R2

2pR3C2

1

LC resonant frequency: fr=

[Hz]

2p LC

Fig.33

For the settings of phase lead frequency, insert both of the phase leads close to the LC resonant frequency.

12/16

Equivalent circuit

VREG

3.FB1

VREG

Vcc

2.COMP1

11.COMP2

10.FB2

1kΩ

20Ω

5kΩ

2.5kΩ

5kΩ

Vcc

6.SS1/SDWN

8.SS2/SDWN

4.RT

VREG

2kΩ

170Ω

50Ω

100kΩ

15.SW2

16.SW2

23.SW1

24.SW1

PVcc

14.SW2L

25.SW1L

PVcc

BOOT

17.BOOT2

22.BOOT1

10Ω

SW

Fig.34 Equivalent circuit

13/16

Cautions on use

1) Absolute maximum ratings

Even though thorough attention is exerted to the quality control of this IC, exceeding the absolute maximum ratings, such

as applied voltage, operating temperature range, etc., can break down the IC. Should the IC break down, it will be

impossible to identify breaking mode such as short circuit mode or an open mode. If any special mode exceeding the

absolute maximum ratings is assumed, consideration should be given to take physical safety measures including use of

fuses, etc.

2) GND potential

GNDMake setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.

3) Thermal design

With consideration given to power dissipation (Pd) in the actual use state, provide the thermal design with an adequate

margin.

4) Short circuit between pins and erroneous mounting

In order to mount ICs on a set printed circuit board, pay thorough attention to the direction and offset of the ICs.

Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering

between pins or between the pin and the power supply or the GND pin, the ICs can break down.

5) Operation in strong electromagnetic field

Be noted that using ICs in the strong electromagnetic field can malfunction them.

6) Inspection with set printed circuit board

On the inspection with the set printed circuit board, if a capacitor is connected to a low-impedance pin, the IC can suffer

stress. Therefore, be sure to discharge from the set printed circuit board by each process. For protection against static

electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage

of the set printed circuit board. Furthermore, in order to connect the jig for the inspection process, be sure to turn OFF

the power supply and then mount the set printed circuit board to the jig. After the completion of the inspection, be sure to

turn OFF the power supply and then dismount the set printed circuit board from the jig.

7) IC pin input

This IC is a monolithic IC, which has P+ isolation and P layer between elements to isolate the elements. P-N junction is

formed with this P layer and the N layer of each element, thus composing a variety of parasitic elements.

For example, as shown in Fig. 35, if the resistor and the transistor is connected with the pin respectively,

When GND>(Pin A) for the resistor or GND>(Pin B) for the transistor (NPN), P-N junction will operate as a parasitic

diode.

For the transistor (NPN), when GND>(Pin B), the parasitic NPN transistor will operate with the N layer of other

element in the proximity of the said parasitic diode.

In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the

parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the

IC. Therefore, pay thorough attention not to handle the input pins such as to apply to the input pins a voltage lower than

the GND (P layer) so that any parasitic element will operate.

Transistor (NPN)

B

Resistor

(Pin A)

(Pin B)

C

E

GND

N

P

+

P⁺

+

P

+

P

N

P layer

GND

Parasitic element

GND

P layer

Parasitic element

(Pin B)

(Pin A)

Parasitic element

B

C

E

GND

Parasitic element

Fig.35 Typical simple construction of monolithic IC

14/16

8) Ground wiring pattern

Bypass diode

If small-signal GND and large-current GND are provided, It will be

recommended to separate the large-current GND pattern from the

small-signal GND pattern and establish a single ground at the reference

point of the set PCB so that resistance to the wiring pattern and voltage

fluctuations due to a large current will cause no fluctuations in voltages of

the small-signal GND. Pay attention not to cause fluctuations in the GND

wiring pattern of external parts as well.

Backflow prevention diode

VCC

Output pin

9) On the application shown on the right, if the VCC and each output voltage

are inverted, for example, if the VCC is short-circuited to the Ground with

external diode charged, internal circuits or elements may be damaged. To

avoid that, use the output pin capacitor in the range of 10 to 100 μF.

Furthermore, in order to use a capacitor of 100 μF or more, it is

recommended to insert a backflow prevention diode or a bypass diode

between the output and VCC.

Fig.36 Typical bypass diode application

10) Overcurrent protection circuit

Output has a built-in overcurrent protection circuit according to the current capability, which prevents the destruction of

the IC at short-circuiting of load. However, this protection circuit is only effective to prevent destruction due to a sudden

accident but does not support for the continuous operation of the protection circuit or use in transition. Furthermore,

since the current capability has characteristic negative to temperature, give consideration to the thermal design.

11) Temperature protection circuit

This IC has a built-in temperature protection circuit to prevent the thermal destruction of the IC. As described above, be

sure to use this IC within the power dissipation range. Should a condition exceeding the power dissipation range

continues, the chip temperature Tj will rise to activate the temperature protection circuit, thus turning OFF the output

power element. Then, when the tip temperature Tj falls, the circuit will be automatically reset.

Furthermore, since the temperature protection circuit is activated under the condition exceeding the absolute maximum

ratings, NEVER attempt to use the temperature protection circuit for set design or else.

12) Input capacitor

In order to derate a peak noise, which occurs while in switching operation, be sure to insert a capacitor (ceramic

capacitor) having a low ESR of 10 to 100 μF as close to the pin as possible between the VCC and Ground.

Power dissipation

1500

1250

1000

750

500

250

0

25

50

75

100

125

150

Ambient temperature : Ta [˚C]

Fig.37 Thermal derating characteristics

15/16

Selection of order type

B D 9 3 0 2 F P - E 2

Product name

Package/Forming specifications

Package specifications

HSOP25

13.6

±0.2

Package style

Embossed carrier tape

2.75±

0.1

Q’ty per package 2000 pcs

25

14

13

Packaging

direction

E2

(When holding a reel by left hand and pulling out the tape by

right hand, No. 1 pin appears in the upper left of the reel.)

1

0.25±0.1

1.95±0.1

0.1

0.8

Pulling-out side

No. 1 pin

0.36±0.1

Reel

(Unit : mm)

* Please place an order for this IC in multiplies of the quantity per package.

The contents described herein are correct as of December,2008

Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD9302FP-E2
厂家：	ROHM
描述：	Dual Switching Controller, Voltage-mode, 2A, 2500kHz Switching Freq-Max, PDSO25, LEAD FREE, HSOP-25 开关光电二极管
文件：	总19页 (文件大小：899K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD9302FP-E2 [ROHM]

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