BD9326EFJ-2E [ROHM]

Simple Step-down Switching Regulators with Built-in Power MOSFET; 简单的降压开关稳压器具有内置功率MOSFET


型号：	BD9326EFJ-2E
厂家：	ROHM
描述：	Simple Step-down Switching Regulators with Built-in Power MOSFET 简单的降压开关稳压器具有内置功率MOSFET 稳压器开关
文件：	总15页 (文件大小：455K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Single-chip Type with Built-in FET Switching Regulators

Simple Step-down

Switching Regulators

with Built-in Power MOSFET

No.10027ECT06

BD9325FJ,BD9326EFJ,BD9327EFJ

●Description

The BD9325FJ, BD9326EFJ and BD9327EFJ are step-down regulators that integrate a low resistance high side N-channel MOSFET.

It achieves 2A / 3A / 4A continuous output current over a wide input supply range.

Current mode operation provides fast transient response and easy phase compensation.

●Features

1) Wide operating INPUT Range 4.75V～18.0V

2) Selectable 2A / 3A / 4A Output Current

3) Selectable 0.16Ω / 0.12Ω / 0.11ΩInternal MOSFET Switch

4) Low ESR Output Ceramic Capacitors are Available

5) Low Stanby Current during Shutdown Mode

6) 380kHz Operating Frequency

7) Feedback voltage 0.9V ±1.5% Accuracy at room temp. (±3.0% for -40℃ to 85℃ temperature range)

8) Protection circuit: UnderVoltage lockout protection circuit

Thermal shutdown circuit

OverCurrent protection circuit

9) SOP-J8 Package for 2A model, HTSOP-J8 Package for 3A, 4A models (with Exposed thermal PAD)

●Applications

Distributed Power System

Pre-Regulator for Linear Regulator

●Line up matrix

LINE-UP

FET ON-RESISTANCE

OUTPUT CURRENT

Package

BD9325FJ

0.16 Ω

BD9326EFJ

0.12 Ω

BD9327EFJ

0.11 Ω

2.0 A

3.0A

4.0 A

SOP-J8

HTSOP-J8

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2010.08 - Rev.C

1/14

Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

●Absolute maximum ratings (Ta = 25°C)

Parameter

Symbol

VIN

Ratings

Unit

Supply Voltage

Switch Voltage

VSW

Pd1

Power Dissipation for HTSOP-J8

Power Dissipation for SOP-J8

Operating Temperature Range

Storage Temperature Range

Junction Temperature

BST Voltage

3760 ^*1

675 ^*2

-40～+85

-55～+150

150

℃

Pd2

Topr

Tstg

Tjmax

VBST

VEN

VSW+7

EN Voltage

All other pins

VOTH

*1 Derating in done 30.08 mW/℃ for operating above Ta≧25℃(Mount on 4-layer 70.0mm×70.0mm×1.6mm board)

*2 Derating in done 5.4 mW/℃ for operating above Ta≧25℃(Mount on 1-layer 70.0mm×70.0mm×1.6mm board)

●Operation Range (Ta= -40～85℃)

Ratings

Parameter

Symbol

Unit

Min

Typ

Max

Supply Voltage

SW Voltage

VIN

4.75

VSW

ISW2

ISW3

ISW4

-0.5

Output current for BD9325FJ

Output current for BD9326EFJ

2**

3**

4**

Output current for BD9327EFJ

** Pd, ASO should not be exceeded

●Electrical characteristics (Unless otherwise specified VIN=12V Ta=25℃)

Limits

Typ

Parameter

Symbol

Unit

Conditions

Min

Max

Error amplifier block

FB input bias current

IFB

0.1

µA

Feedback voltage1

VFB1

VFB2

0.886

0.873

0.900

0.914

0.927

Voltage follower

Feedback voltage2

Ta=-40℃～85℃

SW block – SW

Hi-side FET On-resistance for BD9325FJ

Hi-side FET On-resistance for BD9326EFJ

Hi-side FET On-resistance for BD9327EFJ

Lo-side FET On-resistance

Leak current N-channel

Switch Current Limit for BD9325FJ

Switch Current Limit for BD9326EFJ

Switch Current Limit for BD9327EFJ

Maximum duty cycle

RON2

RON3

0.16

0.12

0.11

Ω

µA

ISW= -0.8A ***

ISW= 0.1A

VIN= 18V, VSW = 0V

***

RON4

RONL

ILEAKN

ILIMIT2

ILIMIT3

ILIMIT4

MDUTY

2.5

3.5

4.5

***

VFB= 0V

General

Enable Sink current

IEN

VEN

VUVLO

VHYS

ISS

1.1

4.05

181

1.18

4.40

0.1

275

1.4

4.75

µA

VEN= 12V

VIN rising

Enable Threshold voltage

Under Voltage Lockout threshold

Under Voltage Lockout Hysteresis

Soft Start Current

kHz

µA

VSS= 0 V

Soft Start Time

TSS

1.6

380

2.1

CSS= 0.1 µF

Operating Frequency

FOSC

ICC

300

460

4.3

170

Circuit Current

VFB= 1.5V, VEN= 12V

VEN= 0V

Quiescent Current

IQUI

*** See the series line-up table below.

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2010.08 - Rev.C

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

●Block diagram

VIN

OSC

VREF

VREG

BST

EN;PULL UP to VIN

OCP

12V

VIN

UVLO

TSD

IBIAS

LVS

DRV

ERR

－

OUTPUT

LOGIC

SLOPE

COMP

PWM

－

Soft Start

GND

Fig.1 Block Diagram

●Typical application circuit

C_PC1

3300pF

R_DW

10k

R_PC

15k

C_SS

0.1μF

R_UP

27k

Thermal Pad

(For BD9326EFJ, BD9327EFJ)

VIN 12V

V^OUT3.3V

10μH

C_VC1

10μF

C_CO1

20μF

Fig.2 Application Circuit

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2010.08 - Rev.C

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

●Block operation

・VREG

A block to generate constant-voltage for DC/DC boosting.

・VREF

A block that generates internal reference voltage of 2.9 V (Typ.).

・TSD/UVLO

TSD (Thermal shutdown)/UVLO (Under Voltage Lockout) protection block. The TSD circuit shuts down IC at 175℃ (Typ.)

The UVLO circuit shuts down the IC when the VCC is Low Voltage.

・Error amp block (ERR)

This is the circuit to compare the reference voltage and the feedback voltage of output voltage. The COMP pin voltage

resulting from this comparison determines the switching duty. At the time of startup, since the soft start is operated by the

SS pin voltage, the COMP pin voltage is limited to the SS pin voltage.

・Oscillator block (OSC)

This block generates the oscillating frequency.

・SLOPE block

This block generates the triangular waveform from the clock created by OSC. Generated triangular waveform is sent to the

PWM comparator.

・PWM block

The COMP pin voltage output by the error amp is compared to the SLOPE block's triangular waveform to determine the

switching duty. Since the switching duty is limited by the maximum duty ratio which is determined internally, it does not

become 100%.

・DRV block

A DC/DC driver block. A signal from the PWM is input to drive the power FETs.

・Soft start circuit

Since the output voltage rises gradually while restricting the current at the time of startup, it is possible to prevent the

output voltage overshoot or the rush current.

●Pin assignment and pin function

Pin No.

Pin name

BST

VIN

Function

High-Side Gate Drive Boost Input

Power Input

Power Switching Output

Ground

GND

Feed Back Input

COMP

Compensation Node

Enable Input

Soft Start Control Input

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2010.08 - Rev.C

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

●Typical performance characteristics (Unless otherwise specified, V_IN= 12V Ta = 25℃)

0.1

0.08

0.06

0.04

0.02

2.5

2.4

2.3

2.2

2.1

160

140

120

100

1.9

1.8

1.7

1.6

1.5

-0.02

-0.04

-0.06

-0.08

-0.1

0.5

1.5

V^FB[V]

VIN : [V]

Fig.3 Circuit Current

(No switching)

Fig.4 Quiescent Current

(IC not active)

Fig.5 Input Bias Current

0.25

0.2

370

360

350

340

330

320

310

300

0.923

0.913

0.903

0.893

0.883

0.873

BD9325FJ

0.15

0.1

BD9326EFJ

0.05

-40

-20

-40

-20

100

-40

-20

℃

Ta [

]

TEMPERATURE : [C]

Fig.6 Feedback voltage

Fig.7 Hi-Side On-resistance

Fig.8 Operating Frequency

100

BD9326EFJ

VOUT

BD9325FJ

V^SS

V^SW

I^OUT

0.1

0.01

0.2 0.4 0.6 0.8

1.2 1.4 1.6 1.8

0.001

0.01

0.1

C^SS[uF]

Iout [A]

Fig.9 STEP Down Efficiency

(VIN= 12V VOUT= 3.3V L=10µH)

Fig.10 OverCurrent Protection

Fig.11 Soft Start Time

(VOUT is shorted to GND)

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2010.08 - Rev.C

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

VOUT: 100 mV / D

VOUT: 10.0 mV / Div

VOUT-MAX: +100mV

Δ: 10.4 mV

VOUT

VOUT-MIN: -100m V

IOUT: 1.0 A / Div

IOUT

Fig.12 Transient Response

(VIN= 12V VOUT= 3.3V L= 10µH Cout =22µF Iout= 0.2-1.0A )

Fig.13 Output Ripple Voltage

(VIN= 12V VOUT= 3.3V L= 10µH Cout =22µF I out= 1.0A )

VOUT: 10.0 mV / Div

VOUT-MAX: +460mV

VOUT

Δ:11.8 mV

VOUT-MIN: -240mV

IOUT: 1.0 A / Div

IOUT

Fig.15 Output Ripple Voltage

(VIN= 12V VOUT= 3.3V L= 10µH Cout =22µF Iout= 3.0A)

Fig.14 Transient Response

(VIN= 12V VOUT= 3.3V L= 10µH Cout =22µF Iout= 0.2-3.0A)

VOUT

IOUT

EN: 10V / Div

VOUT: 1.0V / Div

IOUT: 1.0 A / Div

Fig.16 Start Up waveform

(VIN= 12V VOUT= 3.3V L= 22µH CSS= 0.1µF Iout= 0A)

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2010.08 - Rev.C

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

●Selecting application components

(1) Output LC constant (Buck Converter)

The inductance L to use for output is decided by the rated current ILR and input current maximum value IOMAX of the

inductance.

VCC

IOMAX + IL

should not reach

the rated value level

ILR

IOMAX mean current

Fig.17

Fig.18

Adjust so that IOMAX + ∆IL does not reach the rated current value ILR. At this time, ∆IL can be obtained by the following

equation.

V_CC

∆IL =

[A]

 (VCC - Vo) 



Set with sufficient margin because the inductance L value may have the dispersion of ± 30%.

For the capacitor C to use for the output, select the capacitor which has the larger value in the ripple voltage VPP

permissible value and the drop voltage permissible value at the time of sudden load change.

Output ripple voltage is decided by the following equation.

∆IL

2Co

V_CC

∆VPP

[V]

∆IL  RESR +



Perform setting so that the voltage is within the permissible ripple voltage range.

For the drop voltage VDR during sudden load change, please perform the rough calculation by the following equation.

∆IL

VDR =

[V]

 10 µs

However, 10μs is the rough calculation value of the DC/DC response speed.

Make Co settings so that these two values will be within the limit values.

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2010.08 - Rev.C

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

(2) Loop Compensation

Choosing compensation capacitor C1 and resistor R3

The example of DC/DC converter application bode plot is shown below. The compensation resistor R3 will set the cross

over frequency FC that decides the stability and response speed of DC/DC converter. So compensation resistor R3 has to

be adjusted to adequate value for good stability and response speed.

The cross over frequency FC can be adjusted by changing the compensation resistor R3 connected to COMP terminal.

The higher cross over frequency achieves good response speed, but less stability. And the lower cross over frequency

shows good stability, but worse response speed.

Usually, the 1/10 of DC/DC converter operating frequency is used for cross over frequency FC. So please decide the

compensation resistor and capacitor using the following formula on setting FC to 1/10 of operating frequency at first.

After that, please measure and adjust the cross over frequency on your set (on the actual application) to meet the enough

response speed and phase-margin.

( i ) Choosing phase compensation resistor R3

Please decide the compensation resistor R3 on following formula.

Compensation Resistor

R3= 5800×COUT×FC×VOUT

[Ω]

Where

COUT : Output capacitor connected to DC/DC output

VOUT : Output voltage

: Desired cross over frequency (38kHz)

( ii ) Choosing phase compensation capacitor C1

The stability of DC/DC converter needs to cancel the phase delay that is from output LC filter by inserting the phase

advance.

The phase advance can be added by the zero on compensation resistor and capacitor.

The LC resonant frequency FLC and the zero on compensation resistor and capacitor are expressed below.

LC resonant frequency

Zero by C1 and R3

FLC=

FZ=

[Hz]

2π√LCOUT

2πC1R3

Please choose C1 to make FZ to 1 / 3 of FLC .

Compensation Capacitor C1=

2πFLCR3

[F]

( iii )The condition of the loop compensation stability

The stability of DC/DC converter is important. To secure the operating stability, please check the loop compensation

has the enough phase-margin. For the condition of loop compensation stability, the phase-delay must be less than

150 degree where Gain is 0 dB. Namely over 30 degree phase-margin is needed.

Lastly after the calculation above, please measure and adjust the phase-margin to secure over 30 degree.

(a)

OUT

Gain [dB]

GBW(b)

COMP

－

＋

F^C

PHASE

90°

－

PHASE MARGIN

180°

－

180

－

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2010.08 - Rev.C

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

(3) Design of Feedback Resistance constant

Set the feedback resistance as shown below.

Reference voltage

R1 + R2

VOUT =

[V]

 Reference Voltage

V_OUT

＋

ERR

－

●Soft Start Function

The buck converter has an adjustable Soft Start function to

prevent high inrush current during start up.

The soft-start time is set by the external capacitor connected to

SS pin.

COMP

2.9V(typ)

ERRAMP

The soft start time is given by;

70k(typ)

Tss [ms] = 16.2・C [µF]

Css

Please confirm the overshoot of the output voltage and inrush

current when deciding the SS capacitor value.

●EN Function

The EN terminal controls IC’s shut down.

Leaving EN terminal open makes IC shutdown.

To start the IC, EN terminal should be connected to VIN or the

other power source output.

VIN

When the EN voltage exceed 1.2V (typ.), the IC start

operating.

66kΩ(typ.)

60kΩ(typ.)

Fig.19 The equivalent internal circuit.

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

●Layout Pattern Consideration

Two high pulsing current flowing loops exist in the buck regulator system.

The first loop, when FET is ON, starts from the input capacitors, to the VIN terminal, to the SW terminal, to the inductor, to the

output capacitors, and then returns to the input capacitor through GND.

The second loop, when FET is OFF, starts from the shotkey diode, to the inductor, to the output capacitor, and then returns to

the shotkey diode through GND.

To reduce the noise and improve the efficiency, please minimize these two loop area.

Especially input capacitor, output capacitor and shotkey diode should be connected to GND plain.

PCB Layout may affect the thermal performance, noise and efficiency greatly. So please take extra care when designing

PCB Layout patterns.

VIN

VOUT

COUT

CIN

FET

Fig.20 Current loop in Buck regulator system

・The thermal Pad on the back side of IC has the great thermal conduction to the chip. So using the GND plain as broad and

wide as possible can help thermal dissipation. And a lot of thermal via for helping the spread of heat to the different layer is

also effective.

・The input capacitors should be connected as close as possible to the VIN terminal.

・Keep sensitive signal traces such as trace connected FB and COMP away from SW pin.

・The inductor, the shot key diode and the output capacitors should be placed close to SW pin as much as possible.

BST

VIN

CIN

VIN

COMP

FET

GND

C^OUT

V^OUT

Fig.21 The example of PCB layout pattern

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2010.08 - Rev.C

10/14

Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

●Operation Notes

1) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may

result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such

damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special

mode where the absolute maximum ratings may be exceeded is anticipated.

2) GND potential

Ensure a minimum GND pin potential in all operating conditions.

3) Setting of heat

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Pin short and mistake fitting

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in

damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the

presence of a foreign object may result in damage to the IC.

5) Actions in strong magnetic field

Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.

6) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.

Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure,

and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or

removing it from a jig or fixture during the inspection process.

7) Ground wiring patterns

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the

GND wiring patterns of any external components.

8) Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of

parasitic elements.

For example, when the resistors and transistors are connected to the pins as shown in Fig.22 , a parasitic diode or a

transistor operates by inverting the pin voltage and GND voltage.

The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result

of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC

malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will

trigger the operation of parasitic elements such as by the application of voltages lower than the GND (P substrate) voltage

to input and output pins.

Resistor

Transistor (NPN)

(Pin B)

(Pin A)

(Pin B)

GND

P+

Parasitic

elements

P+

(Pin A)

P substrate

GND

Parasitic elements

GND

Parasitic

elements

Parasitic elements

GND

Fig.22 Example of a Simple Monolithic IC Architecture

9) Overcurrent protection circuits

An overcurrent protection circuit designed according to the output current is incorporated for the prevention of IC damage

that may result in the event of load shorting. This protection circuit is effective in preventing damage due to sudden and

unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or

transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capacity has negative

characteristics to temperatures.

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

10) Thermal shutdown circuit (TSD)

This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the

specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power

dissipation limits, the attendant rise in the chip's junction temperature Tj will trigger the TSD circuit to turn off all output

power elements. Operation of the TSD circuit presumes that the

IC's absolute maximum ratings have been exceeded. Application designs should never make use of the TSD circuit.

11) Testing on application boards

At the time of inspection of the installation boards, when the capacitor is connected to the pin with low impedance, be sure

to discharge electricity per process because it may load stresses to the IC. Always turn the IC's power supply off before

connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as

an antistatic measure, and use similar caution when transporting or storing the IC.

●I/O Equivalent Circuit Diagram

1.BST

3.SW

5.FB

VIN

REG

6.COMP

7.EN

8.SS

VIN

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2010.08 - Rev.C

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

●Power Dissipation

HTSOP-J8 Package

On 70  70  1.6 mm glass epoxy PCB

(1) 1-layer board (Backside copper foil area 0 mm  0 mm)

(2) 2-layer board (Backside copper foil area 15 mm  15 mm)

(3) 2-layer board (Backside copper foil area 70 mm  70 mm)

(4) 4-layer board (Backside copper foil area 70 mm  70 mm)

4000

3000

(4)3760mW

(3)2110mW

(2)1100mW

2000

1000

(1)820mW

100

125 150

AMBIENT TEMPERATURE: Ta [°C]

SOP-J8 Package

4000

On 70  70  1.6 mm glass epoxy PCB

(1) 1-layer board (Backside copper foil area 0 mm  0 mm)

3000

2000

1000

(1)675mW

100

125 150

AMBIENT TEMPERATURE: Ta [°C]

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Technical Note

BD9325FJ, BD9326EFJ, BD9327EFJ

●Ordering part number

Part No.

9325

Package

FJ : SOP-J8

Packaging and forming specification

E2: Embossed tape and reel

9326

EFJ : HTSOP-J8

9327

SOP-J8

4.9 0.2

(MAX 5.25 include BURR)

Tape

Embossed carrier tape

2500pcs

6°

4°

−4°

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

0.545

0.2 0.1

1.27

0.42 0.1

Direction of feed

1pin

0.1

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

HTSOP-J8

4.9 0.1

(MAX 5.25 include BURR)

Tape

Embossed carrier tape

(3.2)

Quantity

2500pcs

4°

−4

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1PIN MARK

+0.05

-0.03

0.545

0.17

1.27

+0.05

0.42

0.08

0.04

0.08

Direction of feed

1pin

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

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2010.08 - Rev.C

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consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

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"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

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The Products speciﬁed in this document are intended to be used with general-use electronic

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While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

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The Products are not designed or manufactured to be used with any equipment, device or

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such special purpose, please contact a ROHM sales representative before purchasing.

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be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

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R1010

BD9326EFJ-2E [ROHM]

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