BD9478F-XX [ROHM]

PWM pulse Generator for LCD Panels; PWM脉冲发生器,用于LCD面板
BD9478F-XX
型号: BD9478F-XX
厂家: ROHM    ROHM
描述:

PWM pulse Generator for LCD Panels
PWM脉冲发生器,用于LCD面板

脉冲 脉冲发生器 CD
文件: 总15页 (文件大小:725K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BD9478F  
Datasheet  
LED Drivers series for LCD Backlights  
PWM pulse Generator for  
LCD Panels  
BD9478F  
General Description  
Features  
BD9478F is PWM pulse generator for LCD panel. This  
IC compares triangle waveform which is generated  
inside IC and external DC signal, and generates a  
PWM pulse. This PWM pulse is provided to LED driver  
and controls LED grayscale. PWM pulse frequency  
can be synchronized to external signal frequency  
inputted to SYNC terminal. Even if this frequency gets  
out of range, it works in the setting frequency, is  
protected and it always provides stable PWM pulse to  
LED driver.  
The signal that the frequency synchronizes with the  
VSYNC signal is output to PWMOUT.  
The PWM pulse is generated with the DC signal of a  
triangular wave and PDIM generated with the LCT  
capacitor.  
When the VSYNC frequency exceeds the stipulated  
range, it fixes by a set frequency.  
(fSYNC<fPLLtyp*0.35 -> fPLL=0.36*fPLLtyp , fSYNC>  
fPLLtyp*2.75 -> fPLL=2.75*fPLLtyp)  
When VSYNC is a no signal input, the self-oscillation is  
operated by set frequency decided on the CT capacitance.  
When the pulse signal is input to the terminal EXTPWM,  
it shifts automatically to external PWM mode.  
Key Specification  
Operating power supply voltage range: 4.5V to 5.5V  
Free Run frequency:  
Operating Current:  
150Hz (CT=0.01µF)  
2mA (typ.)  
Operating temperature range:  
-40  
to +85  
Package  
SOP-8:  
Pin Pitch:  
W(Typ.) D(Typ.) H(Max.)  
5.00mm x 6.20mm x 1.71mm  
1.27mm  
Applications  
LED backlight of monitor, TV, NOTE PC, etc.  
Typical Application Circuit  
Figure 1. SOP-8  
Figure 2. Typical Application Circuit  
Product structure Silicon monolithic integrated circuit  
This product is not designed protection against radioactive rays  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 14 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
1/12  
Datasheet  
BD9478F  
Absolute maximum ratings (Ta=25  
)
Parameter  
Symbol  
VCC  
Ratings  
7
Unit  
V
Power supply voltage  
Operating Temperature Range  
Storage Temperature Range  
Junction Temperature  
Ta(opr)  
Tstg  
-40 ~ +85  
-55 ~ +150  
150  
°C  
°C  
Tjmax  
Pd  
°C  
Power Dissipation  
689  
1
mW  
*1 Decreases 5.5mW/ at Ta=25 or higher (When mounting a one-layer 70.0mmx70.0mmx1.6mm board)  
Operating Ratings (Ta = 25  
Parameter  
Power supply voltage  
)
Symbol  
VCC  
Range  
Unit  
V
4.5  
5.5  
0.8  
30  
0.040  
FCT  
VSYNC input frequency range  
F_VSYNC  
kHz  
kHz  
EXTPWM input PWM signal frequency range  
F_EXTPWM  
The operating conditions written above are constants of the IC unit. Be careful enough when setting the constant in the actual set.  
FCT is dimming frequency that oscillates itself when VSYNC terminal is input no signal  
External Components Recommended Range  
Item  
Symbol  
CVCC  
CT  
Setting Range  
0.1 ~ 10  
Unit  
µF  
VCC capacitance  
PLL Burst OSC oscillation frequency setting  
capacitance  
0.040  
0.8  
µF  
The operating conditions written above are constants of the IC unit. Be careful enough when setting the constant in the actual set.  
Pin Configuration  
Marking diagram and physical dimension  
8
7
6
5
D9478  
Lot No.  
1
2
3
4
SOP-8  
Figure 3. Pin Configuration  
Figure 4. Physical Dimension  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
2/12  
Datasheet  
BD9478F  
Electrical Characteristics (Unless otherwise specified, Ta=25  
VCC=5V)  
Limit  
Parameter  
[Whole Device]  
Symbol  
Unit  
Condition  
Min.  
Typ.  
Max.  
PDIM=3V,CT=0.01uF  
VSYNC=EXTPWM=open  
Circuit Current during Operation  
ICC  
2
4
mA  
[UVLO Block]  
Release voltage  
Hysteresis voltage  
[PLL Block]  
VUVLO  
VUHYS  
3.5  
3.8  
4.1  
V
VCC=SWEEP UP  
150  
300  
600  
mV  
VCC=SWEEP DOWN  
Oscillation frequency when VSYNC is  
input no signal  
fCTNS  
VCTH  
142  
150  
158  
Hz  
CT=0.01µF,LPF=0V  
V
V
Triangle wave maximum voltage  
2.70  
0.40  
3.00  
0.50  
3.30  
0.60  
fCT=150Hz  
fCT=150Hz  
Triangle wave minimum voltage  
Synchronous signal abnormal judgment  
voltage, (at High frequency input)  
Synchronous signal normal judgment  
voltage, (at High frequency input)  
Internal RT voltage at Synchronous  
signal, abnormal judgment when High  
frequency input  
Synchronous signal abnormal judgment  
voltage, (at Low frequency input)  
Synchronous signal normal judgment  
voltage, (at Low frequency input)  
Internal RT voltage at Synchronous  
signal, abnormal judgment when High  
frequency input  
VCTL  
CT_SYNC  
_DET1  
CT_SYNC  
_OKH  
2.612  
2.517  
2.750  
2.650  
2.888  
2.783  
V
V
LPF=2.0V→3.0V  
LPF=3.0V→2.0V  
VRTFH  
CT_SYNC  
_DET2  
CT_SYNC  
_OKL  
-
2.750  
0.350  
0.450  
-
V
V
V
LPF=3V  
0.331  
0.414  
0.389  
0.486  
LPF=1.0V→0.1V  
LPF=0.1V→1.0V  
VRTFL  
VINTF  
VRTFI  
-
0.10  
-
0.360  
0.15  
-
0.20  
-
V
V
V
LPF=0.25V  
LPF=1.0V→0.1V  
LPF=0V  
Switch voltage to internal fixed  
frequency  
Internal RT voltage at switched to  
internal fixed, frequency  
0.900  
Input pin (EXTPWM,PDIM,VSYNC)  
Input High level  
VIH  
VIL  
V
V
2.0  
-
20  
Input Low level  
-0.3  
0.5  
-
0.8  
2.0  
Pull down resistance  
Output pin (PWMOUT)  
Output High level  
RIPD  
1.0  
MΩ  
VOH  
VOL  
4.3  
-
4.85  
0.1  
-
V
V
Io=-1mA  
Io=1mA  
Output Low level  
0.5  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
3/12  
Datasheet  
BD9478F  
Pin Descriptions  
Pin No  
Pin Name  
In/Out  
Function  
Rating [V]  
-0.3~7  
-0.3~20  
-0.3~20  
-0.3~20  
-0.3~7  
-0.3~7  
-
1
2
3
4
5
6
7
8
-
In  
Power supply  
VCC  
EXTPWM  
PDIM  
External PWM signal input  
In  
DC signal input for Internal PWM  
Synchronous signal input  
Capacitance pin for VCO  
LPF output for PLL  
In  
VSYNC  
CT  
Out  
In/Out  
-
LPF  
Ground  
GND  
Out  
PWM dimming signal output  
-0.3~7  
PWMOUT  
Pin ESD Type  
VCC  
EXTPWM / VSYNC /PDIM  
CT  
VCC  
CT  
7V  
LPF  
GND  
PWMOUT  
Figure 5. Pin ESD Type  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
4/12  
Datasheet  
BD9478F  
Block Diagram  
Figure 6. Block Diagram  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
5/12  
Datasheet  
BD9478F  
Typical Performance Curve  
Figure 7. Operating Current (ICC) [mA] vs. VCC[V]  
4
Figure 8. frequency fCT[Hz] vs. CT[nF]  
500  
400  
300  
200  
100  
0
3
2
1
0
4.0  
4.5  
5.0  
5.5  
6.0  
0
5
10  
15  
20  
VCC [V]  
CCT [nF]  
Figure 10. PWMOUT jitter [µs] vs. fCT[Hz]  
Figure 9. PWM DUTY [%] vs. PDIM[V]  
4.0  
120  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
100  
80  
60  
40  
20  
0
100  
150  
200  
250  
300  
350  
400  
0
1
2
3
4
fCT [Hz]  
PDIM [V]  
Figure 12. EXTPWM mode waveform  
Figure 11. Start up waveform (Free Run mode)  
VCC  
PDIM  
CT  
PDIM  
EXTPWM  
PWMOUT  
f-200Hz  
CT  
PWMOUT  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
6/12  
Datasheet  
BD9478F  
Pin Function  
Pin 1: VCC  
Power supply pin of the IC. Input range is from 4.5V to 5.5V  
Operation starts at VCC=3.8V TYP. or higher and shuts down at VCC=3.5V(TYP.) or lower.  
Pin 2: EXTPWM  
External PWM signal input terminal.  
In case of the following equation, the signal input to EXTPWM is output directly to PWMOUT.  
The equation  
;
f(PLL) < 2 * f(EXTPWM)  
f(EXTPWM) ; frequency of signal input to EXTPWM  
f(PLL) ; frequency of signal that synchronizes with VSYNC signal  
Pin 3: PDIM  
DC signal input terminal to generate internal PWM signal.  
The PWM signal is generated with compare it with a triangular waveform in IC.  
If PDIM input DC level is changed, PWM Duty can be changed.  
PDIM input DC voltage range is from 0.5V to 3.0V. (PWM Duty is changed from 0% to 100%)  
Pin 4: VSYNC  
Synchronous signal input terminal.  
The signal that synchronizes with the frequency of the signal input to VSYNC is generated with PLL.  
A triangular wave is generated based on the frequency of this synchronized signal, and the PWM  
pulse is generated with compare it with the PDIM signal  
Pin 5: CT  
Capacitor connection terminal that decides the oscillation frequency of VCO..  
Please adjust the capacity of CT by the following equation so that the voltage of the terminal LPF  
may become 0.9V when the frequency of the signal that synchronizes is input.  
1.5  
CT =  
[uF]ꢀ  
fPLLtyp[Hz]  
Pin 6: LPF  
Low pass filter connection pin.  
The pulse signal output from Phase Comparator is smoothed by Low path filter, and it inputs to Voltage.  
Controlled Oscillator (VCO).  
Pin 7: GND  
Ground pin of this IC.  
Pin 8: PWMOUT  
PWM signal output pin.  
The PWM signal generated in IC is output.  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
7/12  
Datasheet  
BD9478F  
About Dimming Function  
Burst Frequency Free Run Function  
Because PLL is incorporated, Free Run operation is possible for burst frequency.  
PLL circuit will operate like it synchronizes with the frequency of signal input to VSYNC pin.  
Then, the voltage that is in proportion to the frequency will be generated in LPF pin.  
When LPF pin voltage becomes 0.35V or lower, it will judge the external burst frequency is abnormal and clumps with the  
frequency of fPLLmin. Then, PLL frequency is changed to Free Run frequency. (note1)  
When the burst frequency becomes normal and LPF pin becomes over 0.9V, it will return to the state that synchronizes  
with the burst frequency.(note2)  
In the same way, when LPF pin becomes 2.75V or more, it will clump with the frequency of fPLLmax.  
When the burst frequency becomes normal and LPF2 pin becomes 2.65V or lower, it will return to the state that  
synchronizes with the burst frequency.  
When LPF pin becomes 0.15V or lower, it will judge the external burst frequency is not inputted and switches to the  
frequency of fPLLtyp.(Free Run mode)  
Figure 13.  
Note1  
Note2  
If fVSYNC is less than fPLLmin, the input of VCO is fixed to 0.36V inside IC, and PWM frequency is fixed  
to fPLLmin. However, since it is fVSYNC<fPLLmin, a LPF terminal approaches 0V.  
Then, it is set to LPF<0.15V, and it shifts to Free Run mode and PWM frequency is set to fPLLtyp.  
In order to shift to PLL mode, it is necessary to input bigger frequency than Free Run frequency into VSYNC.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
8/12  
Datasheet  
BD9478F  
Figure 14.  
Free Run Operation Explanation  
For example, if you set CT=0.01uF (At this time, fPLLtyp is adjusted to 150 Hz.) and f(VSYNC)=180Hz,  
the LPF pin voltage becomes 1.2V.  
The built-in VCO is proportional to the LPF pin voltage.  
If VSYNC is inputted to low frequency and it becomes LPF<0.35V (at this time, f<58Hz),it will clump at fPLLmin=58Hz.  
However, since it is fVSYNC<fPLLmin, a LPF terminal approaches 0V.  
Then, it is set to LPF<0.15V, and it shifts to Free Run mode and PWM frequency is set to fPLLtyp.  
(at this time, f=150Hz).If fSYNC is larger than fPLLtyp, PWM frequency will return to the frequency that  
synchronizes with f(VSYNC).  
If VSYNC is inputted high frequency and it becomes LPF>2.75V (at this time, f>343Hz),it will clump at fPLLmax=343Hz.  
When synchronous signal is not inputted to VSYNC terminal, LPF voltage decreases and then it becomes  
LPF<0.15V (at this time, f<19Hz), it oscillates typical frequency (at this time, f=150Hz).  
Note: Please set f(VSYNC) frequency to satisfy the following equations when you start up PLL mode.  
And then, please change f(VSYNC) frequency.  
f(VSYNC) > fPLLtyp , fPLLtyp = 1.5/(CT[uF]) [Hz]  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
9/12  
Datasheet  
BD9478F  
Dimming Signal Automatic Selection Function  
In this IC, even if either PWM dimming signal or DC dimming signal is inputted into the DUTY pin, it is automatically  
distinguished as DC or PWM in the IC.  
By detecting 4 cycles of the PWM signal within the 8 cycles of the burst frequency in the IC, it will switch automatically  
to PWM dimming.  
Therefore, set the burst frequency in the IC as follows:  
(Burst Frequency in the IC(same fSYNC))  
2 X (Externally inputted PWM signal (fEXTPWM))  
Also, if you do not detect 4 cycles of the PWM signal within the 8 cycles of the burst frequency after switching to PWM  
dimming, it will automatically switch to DC dimming.  
When (Burst Frequency in the IC)  
2 X (Externally inputted PWM signal)  
Burst frequency in the IC  
Burst FF output in the IC  
Burst frequency 8 cycles  
Externally inputted PWM signal  
Output dimming signal  
PWM signal 4 cycles  
Output comparator of  
PWM dimming output  
triangle wave and PWM signal  
Figure 15.  
When (Burst Frequency in the IC )  
2 X (Externally inputted PWM signal)  
Burst frequency in the IC  
Burst FF output in the IC  
Burst frequency 8 cycles  
PWM signal 4 cycles  
External PWM signal  
Burst dimming signal  
Output comparator of  
triangle wave and PWM signal  
Figure 16.  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
10/12  
Datasheet  
BD9478F  
Operational Notes  
1.) Although the quality of this product has been tightly controlled, deterioration or even destruction may occur if the absolute maximum  
ratings, such as for applied pressure and operational temperature range, are exceeded. Furthermore, we are unable to assume short  
or open mode destruction conditions. If special modes which exceed the absolute maximum ratings are expected, physical safely  
precautions such as fuses should be considered.  
2.) The IC can destruct from reverse connection of the power supply connector. Precautions, such as inserting a diode between t  
he external power supply and IC power terminal, should be taken as protection against reverse connection destruction.  
3.) When attaching to the printed substrate, pay special attention to the direction and proper placement of the IC. If the IC is att  
ached incorrectly, it may be destroyed.  
Destruction can also occur when there is a short, which can be caused by foreign objects entering between outputs or an output and the  
power GND.  
4.) Because there is a return of current regenerated by back EMF of the external coil, the capacity value should be determined af  
ter confirming that there are no problems with characteristics such as capacity loss at low temperatures with electrolysis conde  
nsers, for example by placing a condenser between the power supply and GND as a route for the regenerated current.  
5.) The potential of the GND pin should be at the minimum potential during all operation status  
6.) Heat design should consider power dissipation (Pd) during actual use and margins should be set with plenty of room.  
7.) Exercise caution when operating in strong magnet fields, as errors can occur.  
8.) When using this IC, it should be configured so that the output Tr should not exceed absolute maximum ratings and ASO. Wit  
h CMOS ICs and ICs which have multiple power sources, there is a chance of rush current flowing momentarily, so exercise c  
aution with power supply coupling capacity, power supply and width of GND pattern wiring and its layout.  
9.) This IC has a built-in Temperature Protection Circuit (TSD circuit). The temperature protection circuit (TSD circuit) is only to cut  
off the IC from thermal runaway, and has not been designed to protect or guarantee the IC. Therefore, the user should not  
plan to activate this circuit with continued operation in mind.  
10.) If a condenser is connected to a pin with low impedance when inspecting the set substrate, stress may be placed on the IC,  
so there should be a discharge after each process. Furthermore, when connecting a jig for the inspection process, the power  
must first be turned OFF before connection and inspection, and turned OFF again before removal.  
11.) This IC is a monolithic IC, and between each element there is a P+ isolation and P substrate for element separation.  
There is a P-N junction formed between this P-layer and each element’s N-layer, which makes up various parasitic elements.  
For example, when resistance and transistor are connected with a terminal as in figure 15:  
When GND>(terminal A) at the resistance, or GND>(terminal B) at the transistor (NPN), the P-N junction operates as a parasitic  
diode.  
Also, when GND>(terminal B) at the transistor, a parasitic NPN transistor operates by the N-layer of other elements close to the  
aforementioned parasitic diode.  
With the IC’s configuration, the production of parasitic elements by the relationships of the electrical potentials is inevitable. The operation  
of the parasitic elements can also interfere with the circuit operation, leading to malfunction and even destruction. Therefore, uses which  
cause the parasitic elements to operate, such as applying voltage to the input terminal which is lower than the GND (P-substrate), should  
be avoided.  
Transistor (NPN)  
B
Resistor  
(Pin A)  
E
C
(Pin B)  
GND  
N
N
P
P
P
P
P
P
N
N
N
N
N
P substrate  
P substrate  
GND  
Parasitic element  
GND  
Parasitic element  
(Pin B)  
C
E
(Pin A)  
B
Parasitic element  
Adjacent other elements  
GND  
Figure 17. Example of Simple Structure of Monolithic IC  
Parasitic  
Status of this document  
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference  
to help reading the formal version.  
If there are any differences in translation version of this document formal version takes priority  
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© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
11/12  
Datasheet  
BD9478F  
Ordering Information  
B D 9 4 7 8 F  
-
XX  
Part Number  
Package  
F:SOP  
Packaging and forming specification  
XX: Please confirm the formal name  
to our sales.  
Physical Dimension Tape and Reel Information  
SOP8  
<Tape and Reel information>  
5.0 0.2  
(MAX 5.35 include BURR)  
Tape  
Embossed carrier tape  
2500pcs  
+
6
°
°
4
°
4  
Quantity  
8
7
6
5
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
1
2
3
4
0.595  
+0.1  
-0.05  
0.17  
S
0.1  
S
1.27  
Direction of feed  
1pin  
0.42 0.1  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
(Unit : mm)  
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TSZ22111 15 001  
TSZ02201-0F1F0C100010-1-2  
24. Jul.2012 Rev.002  
12/12  
Daattaasshheeeett  
Notice  
General Precaution  
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representative.  
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[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4) The Products are not subject to radiation-proof design.  
5) Please verify and confirm characteristics of the final or mounted products in using the Products.  
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8) Confirm that operation temperature is within the specified range described in the product specification.  
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precaution for Mounting / Circuit board design  
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Precautions Regarding Application Examples and External Circuits  
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2) You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1) All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Other Precaution  
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
5) The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  

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