BD9B304QWZ [ROHM]
BD9B304QWZ是内置低导通电阻的功率MOSFET的同步整流降压型开关稳压器。最大可输出3A的电流。采用轻负载时进行低消耗动作的独创恒定时间控制方式，适用于要降低待机功耗的设备。振荡频率高，适用于小型电感。是恒定时间控制DC/DC转换器，具有高速负载响应性能。;
| 型号： | BD9B304QWZ |
| 厂家： | 
ROHM |
| 描述： | BD9B304QWZ是内置低导通电阻的功率MOSFET的同步整流降压型开关稳压器。最大可输出3A的电流。采用轻负载时进行低消耗动作的独创恒定时间控制方式，适用于要降低待机功耗的设备。振荡频率高，适用于小型电感。是恒定时间控制DC/DC转换器，具有高速负载响应性能。 开关 转换器 稳压器 |
| 文件： | 总31页 (文件大小：2078K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
2.7V to 5.5V Input, 3.0A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
BD9B304QWZ
General Description
Key Specifications
BD9B304QWZ is a synchronous buck switching regulator
with built-in low on-resistance power MOSFETs. This IC,
which is capable of providing current up to 3A, features
fast transient response by employing constant on-time
control system. It offers high oscillating frequency at low
inductance. With its original constant on-time control
method which operates low consumption at light load,
this product is ideal for equipment and devices that
demand minimal standby power consumption.
Input Voltage Range:
Output Voltage Range:
Output Current:
Switching Frequency:
High-Side MOSFET ON Resistance: 40mΩ (Typ)
Low-Side MOSFET ON Resistance: 40mΩ (Typ)
2.7V to 5.5V
0.8 V to VIN x 0.8 V
3A (Max)
2MHz/1MHz (Typ)
Standby Current:
0μA (Typ)
Package
UMMP008AZ020
W (Typ) x D (Typ) x H (Max)
2.00mm x 2.00mm x 0.40mm
Features
Single Synchronous Buck DC/DC Converter
Constant On-time Control Suitable to Deep-SLLM
Over Current Protection
Short Circuit Protection
Thermal Shutdown Protection
Under Voltage Lockout Protection
UMMP008AZ020 Package
(Backside Heat Dissipation)
Applications
Step-down Power Supply for DSPs, FPGAs,
Microprocessors, etc.
Laptop PCs/Tablet PCs/Servers
LCD TVs
UMMP008AZ020
Storage Devices (HDDs/SSDs)
Printers, OA Equipment
Distributed Power Supplies, Secondary Power
Supplies
Typical Application Circuit
BD9B304QWZ
VIN
VIN
BOOT
SW
Enable
0.1µF
EN
0.1µF
10µF
VOUT
0.47µH
GND
R2
R1
MODE
FREQ
CFB
22µF 22µF
FB
Figure 1. Application Circuit(MODE=L, FREQ=L)
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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Pin Configuration
(TOP VIEW)
VIN
1
8
GND
E-PAD
EN
BOOT
SW
2
3
4
7
6
5
FB
FREQ
MODE
Figure 2. Pin Configuration
Function
Pin Descriptions
Pin
Name
Pin No.
Power supply terminal for the switching regulator.
1
2
VIN
EN
This terminal supply power to the output stage and control circuit of the switching regulator.
Connecting 0.1µF and 10µF ceramic capacitors are recommended.
Enable terminal. Turning this terminal signal Low (0.8V or lower) forces the device to enter
the shutdown mode. Turning this terminal signal High (2.0V or higher) enables the device.
This terminal must be terminated.
Terminal for bootstrap. Connect a bootstrap capacitor of 0.1 µF between this terminal and
SW terminal. The voltage of this terminal is the gate drive voltage of the High-Side MOSFET.
3
4
BOOT
SW
Switch node. This terminal is connected to the source of the High-Side MOSFET and drain of
the Low-Side MOSFET. Connect a bootstrap capacitor of 0.1 µF between this terminal and
BOOT terminal. In addition, connect an inductor considering the direct current
superimposition characteristic. Use an inductor of 0.47µH at FREQ=L or 1.0µH at FREQ=H.
Terminal for setting switching control mode. Connecting this terminal to VIN forces the device
to operate in the fixed frequency PWM mode. Connecting this terminal to ground enables the
Deep-SLLM control and the mode is automatically switched between the Deep-SLLM control
and fixed frequency PWM mode. Please fix this terminal to VIN or ground.
5
6
MODE
FREQ
Terminal for setting switching frequency. Connecting this terminal to ground makes switching
to operate constant on-time corresponding to 2MHz. Connecting this terminal to VIN makes
switching to operate constant on-time corresponding to 1MHz. Please fix this terminal to VIN
or ground.
An inverting input node for the error amplifier and main comparator.
See page 21 for how to calculate the resistance of the output voltage setting.
7
8
FB
GND
Ground terminal for the output stage of the switching regulator and the control circuit.
A backside heat dissipation exposed pad. Connecting to the internal PCB ground plane by
using multiple vias provides excellent heat dissipation characteristics.
-
E-Pad
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Block Diagram
VIN
1
EN
OCP
SCP
UVLO
2
BOOT
SW
3
4
FB
7
Main
Comparator
On Time
Modulation
Error
Amplifier
Control
Logic
+
VOUT
On Time
Soft Start
DRV
VREF
GND
8
TSD
6
5
FREQ
MODE
Figure 3. Block Diagram
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Description of Blocks
●
VREF
The VREF block generates the internal reference voltage.
●
UVLO
The UVLO block is for under voltage lockout protection. It will shut down the IC when VIN falls to 2.45 V (Typ) or
lower. The threshold voltage has a hysteresis of 100mV (Typ).
●
●
TSD
The TSD block is for thermal protection. The thermal protection circuit shuts down the device when the internal
temperature of IC rises to 175°C (Typ) or higher. Thermal protection circuit resets when the temperature falls. The
circuit has a hysteresis of 25°C (Typ).
Soft Start
The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the
prevention of output voltage overshoot and inrush current. The internal soft start time is set to 1ms typically.
●
●
Control Logic + DRV
This block is a DC/DC driver. A signal from On Time block is applied to drive the MOSFETs.
OCP/SCP
After soft start is completed and in condition where output voltage is below 70% (Typ) of voltage setting, it counts the
number of times of which current flowing in High side FET reaches over current limit. When 512 times is counted, it
stops operation for 1ms (Typ) and re-operates. Counting is reset when output voltage is above 80% (Typ) of voltage
setting or when IC re-operates by EN, UVLO, SCP function.
●
●
Error Amplifier
Error Amplifier adjusts Main Comparator input to make internal reference voltage equal to FB terminal voltage.
Main Comparator
Main comparator compares Error Amplifier output and FB terminal voltage. When FB terminal voltage becomes low, it
outputs High and reports to the On Time block that the output voltage has dropped below control voltage.
●
On Time
This is a block which creates On Time. Requested On Time is created when Main Comparator output becomes High.
On Time is adjusted to restrict frequency change even with I/O voltage change.
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BD9B304QWZ
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Input Voltage
VIN
VEN
-0.3 to +7
-0.3 to +7
-0.3 to +7
-0.3 to +7
-0.3 to +14
-0.3 to +7
-0.3 to +7
-0.3 to VIN + 0.3
3.5
V
V
EN Terminal Voltage
MODE Terminal Voltage
FREQ Terminal Voltage
Voltage from GND to BOOT
Voltage from SW to BOOT
FB Terminal Voltage
VMODE
VFREQ
VBOOT
ΔVBOOT
VFB
V
V
V
V
V
SW Terminal Voltage
Output Current
VSW
V
IOUT
A
Maximum Junction Temperature
Storage Temperature Range
Tjmax
Tstg
150
C
C
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum
junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
UMMP008AZ020
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
376.0
92.0
67.8
18.0
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Material
Thermal Via(Note 5)
Pitch Diameter
Φ0.30mm
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Measurement Board
4 Layers
FR-4
-
Top
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
70μm
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
(Note 5) This thermal via connects with the copper pattern of all layers.
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Input Voltage
VIN
Topr
2.7
-40
0
-
-
-
-
5.5
+85
V
°C
A
Operating Temperature Range
Output Current
IOUT
3
Output Voltage Range
VRANGE
0.8
VIN × 0.8
V
Electrical Characteristics (Unless otherwise specified Ta=25°C, VIN = 5V, VEN = 5V, VMODE = GND)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
VIN Pin
Standby Supply Current
Operating Supply Current
ISTB
ICC
VUVLO1
VUVLO2
-
-
0
10
60
µA
µA
VEN=GND
VFREQ=VIN, IOUT=0mA
Non switching
40
UVLO Detection Threshold Voltage
UVLO Release Threshold Voltage
UVLO Hysteresis
2.35
2.425
50
2.45
2.55
100
2.55
2.7
V
V
VIN falling
VIN rising
VUVLOHYS
200
mV
Enable
EN Input High Level Voltage
EN Input Low Level Voltage
EN Input Current
VENH
VENL
IEN
2.0
GND
-
-
-
VIN
0.8
10
V
V
5
µA
VEN=5V
Reference Voltage, Error Amplifier
FB Terminal Voltage
VFB
IFB
0.792
-
0.8
-
0.808
1
V
FB Input Current
µA
ms
VFB=0.8V
Soft Start Time
tSS
0.5
1.0
2.0
Control
FREQ Input High Level Voltage
FREQ Input Low Level Voltage
MODE Input High Level Voltage
MODE Input Low Level Voltage
VFRQH
VFRQL
VIN-0.3
GND
-
-
-
-
VIN
0.3
VIN
0.3
V
V
V
V
VMODEH
VMODEL
tONT1
VIN-0.3
GND
VOUT=1.2V, VFREQ=GND,
VMODE=VIN
VOUT=1.2V, VFREQ=VIN,
VMODE=VIN
On Time1
On Time2
96
120
240
144
288
ns
ns
tONT2
192
SW
High Side FET On Resistance
Low Side FET On Resistance
High Side Output Leakage Current
Low Side Output Leakage Current
RONH
RONL
ILH
-
-
-
-
40
40
0
80
80
10
10
mΩ
mΩ
µA
VBOOT - VSW=5V
No switching
No switching
ILL
0
µA
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Typical Performance Curves
60
55
50
10
9
8
7
6
5
4
3
2
1
0
45
VIN=5V
40
35
30
VIN=3.3V
25
20
15
10
5
VIN=5V
VIN=3.3V
0
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature[°C]
Temperature[°C]
Figure 4. Operating Supply Current vs Temperature
Figure 5. Standby Supply Current vs Temperature
100
100
MODE=L
MODE=L
90
80
70
60
50
40
30
20
10
0
90
80
70
VOUT=1.0V
VOUT=1.2V
VOUT=1.5 V
VOUT=1.8 V
VOUT=1.0V
VOUT=1.2V
VOUT=1.5 V
VOUT=1.8 V
60
50
MODE=H
MODE=H
40
30
20
10
0
0.001
0.01
0.1
Load Current[A]
1
10
0.001
0.01
0.1
1
10
Load Current[A]
Figure 6. Efficiency vs Load Current
(VIN=5V, L=0.47µH, FREQ=L)
Figure 7. Efficiency vs Load Current
(VIN=5V, L=1.0µH, FREQ=H)
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BD9B304QWZ
Typical Performance Curves - continued
0.808
0.806
0.804
2.6
2.56
2.52
2.48
2.44
2.4
Release
VIN=5V
0.802
0.8
VIN=3.3V
0.798
0.796
0.794
0.792
Detect
0
2.36
-40
-20
20
40
60
80
-40
-20
0
20
40
60
80
Temperature[°C]
Temperature[°C]
Figure 8. FB Terminal Voltage vs Temperature
Figure 9. UVLO Detection Threshold Voltage, UVLO Release
Threshold Voltage vs Temperature
2
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1
7
6
VIN=5V
UP
5
VEN=5V
VIN=3.3V
4
3
2
DOWN
VIN=5V
VIN=3.3V
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature[°C]
Temperature[°C]
Figure 10. EN Threshold Voltage vs Temperature
Figure 11. EN Input Current vs Temperature
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Typical Performance Curves - continued
3.5
3
2.5
2
3
2.5
2
VIN=5V
VIN=5V
VFREQ=5V
VIN=3.3V
1.5
1
1.5
1
0.5
0
0.5
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature[°C]
Temperature[°C]
Figure 12. FREQ Threshold Voltage vs Temperature
Figure 13. FREQ Input Current vs Temperature
3.5
6
VIN=5V
3
VIN=5V
VMODE=5V
5.5
2.5
5
4.5
4
VIN=3.3V
2
1.5
1
3.5
3
0.5
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature[°C]
Temperature[°C]
Figure 14. MODE Threshold Voltage vs Temperature
Figure 15. MODE Input Current vs Temperature
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Typical Performance Curves - continued
60
55
50
60
55
50
45
40
35
30
25
20
45
VIN=3.3V
VIN=3.3V
40
35
30
VIN=5V
VIN=5V
25
20
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature[°C]
Temperature[°C]
Figure 16. High Side FET On Resistance vs Temperature
Figure 17. Low Side FET On Resistance vs Temperature
2400
1200
MODE=H
2000
MODE=H
1000
1600
1200
800
600
800
400
VIN=5V
VIN=5V
VOUT=1.2V
FREQ=L
MODE=L
VOUT=1.2V
FREQ=H
MODE=L
400
200
0
0
0
0.5
1
1.5
2
2.5
3
0
0.5
1
1.5
2
2.5
3
Load Current[A]
Load Current[A]
Figure 18. Switching Frequency vs Load Current
Figure 19. Switching Frequency vs Load Current
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Typical Performance Curves - continued
2400
2300
2200
2100
2000
1900
1200
1150
1100
1050
1000
950
VOUT=1.2V
MODE=H
FREQ=H
IOUT=3A
VOUT=1.2V
1800
1700
1600
900
MODE=H
FREQ=L
IOUT=3A
850
800
3
3.5
4
4.5
5
5.5
3
3.5
4
4.5
5
5.5
INPUT Voltage[V]
INPUT Voltage[V]
Figure 20. Switching Frequency vs Input Voltage
Figure 21. Switching Frequency vs Input Voltage
2
1.5
VIN=3.3V
1
VIN=5V
0.5
0
-40
-20
0
20
40
60
80
Temperature[°C]
Figure 22. Soft Start Time vs Temperature
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Typical Performance Curves - continued
VIN 5V/div
EN 5V/div
VOUT 1V/div
SW 5V/div
VIN 5V/div
EN 5V/div
VOUT 1V/div
Time 1ms/div
Time 1ms/div
SW 5V/div
Figure 23. Power ON Waveform (EN=0V to 5V)
(VOUT=1.2V, FREQ=H, RLOAD=0.4Ω)
Figure 24. Power OFF Waveform (EN=5V to 0V)
(VOUT=1.2V, FREQ=H, RLOAD=0.4Ω)
VIN 5V/div
EN 5V/div
VIN 5V/div
EN 5V/div
VOUT 1V/div
SW 5V/div
VOUT 1V/div
SW 5V/div
Time 1ms/div
Time 1ms/div
Figure 25. Power ON Waveform (VIN = EN)
(VOUT=1.2V, FREQ=H, RLOAD=0.4Ω)
Figure 26. Power OFF Waveform (VIN = EN)
(VOUT=1.2V, FREQ=H, RLOAD=0.4Ω)
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Typical Performance Curves - continued
VOUT 20mV/div
VOUT 20mV/div
SW 2V/div
SW 2V/div
Time 1μs/div
Time 1μs/div
Figure 27. Switching Waveform
(VIN=5V, VOUT=1.2V, FREQ=L, IOUT=0.2A)
Figure 28. Switching Waveform
(VIN=5V, VOUT=1.2V, FREQ=L, IOUT=3A)
VOUT 20mV/div
VOUT 20mV/div
SW 2V/div
SW 2V/div
Time 1μs/div
Time 1μs/div
Figure 29. Switching Waveform
(VIN=5V, VOUT=1.2V, FREQ=H, IOUT=0.2A)
Figure 30. Switching Waveform
(VIN=5V, VOUT=1.2V, FREQ=H, IOUT=3A)
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Typical Performance Curves - continued
1
0.8
0.6
0.4
0.2
1
0.8
0.6
0.4
0.2
0
MODE=L
MODE=H
MODE=H
0
-0.2
-0.2
-0.4
-0.6
-0.8
-1
MODE=L
-0.4
-0.6
-0.8
-1
2.5
3
3.5
4
4.5
5
5.5
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
Load Current[A]
3
Input Voltage[V]
Figure 31. Line Regulation
Figure 32. Load Regulation
(VOUT=1.2V, L=1.0μH, FREQ=H)
(VIN=5V, VOUT=1.2V. L=1.0μH, FREQ=H)
VOUT 50mV/div
VOUT 100mV/div
IOUT 1A/div
IOUT 1A/div
Time 1ms/div
Time 1ms/div
Figure 33. Load Transient Response IOUT=0.1A-3A
Figure 34. Load Transient Response IOUT=0A-3A
(VIN=5V, VOUT=1.2V, FREQ=L, MODE=L, COUT=22µF×2)
(VIN=5V, VOUT=1.2V, FREQ=L, MODE=H, COUT=22µF×2)
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BD9B304QWZ
Function Explanations
1. Basic Operation
(1) DC/DC Converter operation
BD9B304QWZ is a synchronous rectifying step-down switching regulator that achieves faster load transient
response by employing constant on-time control system. It utilizes switching operation in PWM (Pulse Width
Modulation) mode for heavier load, while it utilizes Deep-SLLM (Simple Light Load Mode) control for lighter load to
improve efficiency.
① Deep-SLLM Control
② PWM Control
Output Current [A]
Figure 35. Efficiency (Deep-SLLM Control and PWM Control)
②PWM Control Waveform
①
Deep-SLLM Control Waveform
VOUT
VOUT
20mV/div
20mV/div
SW
SW
2.0V/div
2.0V/div
Figure 36. Switching Waveform at Deep-SLLM Control
(VIN =5.0V, VOUT=1.2V, IOUT=200mA, FREQ=H)
Figure 37. Switching Waveform at PWM Control
(VIN=5.0V, VOUT=1.2V, IOUT=3A, FREQ=H)
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(2) Enable Control
The IC shutdown can be controlled by the voltage applied to the EN terminal. When VEN reaches 2.0 V(Min), the
internal circuit is activated and the IC starts up. To enable shutdown control with the EN terminal, the shutdown
interval (Low level interval of EN) must be set to 100 µs or longer. Startup by EN must be at the same time or after
the input of power supply voltage.
VEN
EN terminal
VENH
VENL
0
t
VOUT
Output setting voltage
0
t
Soft start 1ms
(Typ)
Figure 38. Start Up and Shut Down with Enable
(3) Soft Start
When EN terminal is turned High, Soft Start operates and output voltage gradually rises. With the Soft Start Function,
over shoot of output voltage and rush current can be prevented. Rising time of output voltage is 1ms(Typ).
EN
VOUT
0.8V×90%
1ms(Typ)
0.8V
FB
Figure 39. Soft Start Timing Chart
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2. Protection
The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them
for continuous protective operation.
(1) Over Current Protection (OCP) / Short Circuit Protection (SCP)
Setting of Over current protection is 5.5A (Typ). When OCP is triggered, over current protection is realized by
restricting On / Off Duty of current flowing in upper MOSFET by each switching cycle. Also, if Over current protection
operates 512 cycles in a condition where FB terminal voltage reaches below 70% of internal reference voltage, Short
Circuit protection (SCP) operates and stops switching for 1ms(Typ) before it initiates restart. However, during startup,
Short circuit protection will not operate even if the IC is still in the SCP condition.
Table 1. Over Current Protection / Short Circuit Protection Function
Over current
protection
Short circuit
protection
EN terminal
Startup
While start up
Startup completed
＊
Valid
Valid
Invalid
Valid
More than 2.0V
Less than 0.8V
Invalid
Invalid
1ms(Typ)
VOUT
FB
70%
High side
MOSFET gate
Low side
MOSFET gate
OCP threshold
Coil current
Inside IC
OCP signal
512 Cycle
Figure 40. Short Circuit Protection (SCP) Timing Chart
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(2) Under Voltage Lockout Protection (UVLO)
The Under Voltage Lockout Protection circuit monitors the VIN terminal voltage.
The operation enters standby when the VIN terminal voltage is 2.45V (Typ) or lower.
The operation starts when the VIN terminal voltage is 2.55V (Typ) or higher.
VIN
0V
UVLO OFF
hys
UVLO ON
VOUT
Soft start
FB terminal
High side
MOSFET gate
Low side
MOSFET gate
Normal operation
UVLO
Normal operation
Figure 41. UVLO Timing Chart
(3) Thermal Shutdown
When the chip temperature exceeds Tj=175C(Typ), the DC/DC converter output is stopped. Thermal protection
circuit resets when the temperature falls. The circuit has a hysteresis of 25°C (Typ). The thermal shutdown circuit is
intended for shutting down the IC from thermal runaway in an abnormal state with the temperature exceeding
Tjmax=150C. It is not meant to protect or guarantee the soundness of the application. Do not use the function of
this circuit for application protection design.
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Application Example
VIN
BD9B304QWZ
VIN
EN
GND
FB
C1
C2
BOOT
SW
FREQ
MODE
C8
L1
VOUT
C5
C6
R2
C10
R1
Figure 42. Application Circuit
Table 2. Recommended Component Values (VIN=5V, FREQ=H)
VOUT
Part No.
1.0V
Company
Part name
1.2V
150kΩ
75kΩ
10μF
1.5V
180kΩ
160kΩ
10μF
1.8V
120kΩ
150kΩ
10μF
R1
300kΩ
ROHM
ROHM
Murata
Murata
Murata
Murata
Murata
MCR01MZPDxxxx
MCR01MZPDxxxx
R2
75kΩ
10μF
C1(Note 1)
C2(Note 2)
C5,C6
C8(Note 3)
C10
GRM21BB31A106ME18
GRM155B11A104MA01D
GRM21BB30J226ME38L
GRM155B11A104MA01D
GRM15 series
0.1μF
22μF
0.1μF
22μF
0.1μF
22μF
0.1μF
22μF
0.1μF
120pF
0.1μF
120pF
0.1μF
150pF
0.1μF
180pF
FDSD0420
DFE252012C
L1
1.0μH
1.0μH
1.0μH
1.0μH
TOKO
Table 3. Recommended Component Values (VIN=5V, FREQ=L)
VOUT
Part No.
Company
Part name
1.0V
300kΩ
75kΩ
10μF
1.2V
150kΩ
75kΩ
10μF
1.5V
180kΩ
160kΩ
10μF
1.8V
120kΩ
150kΩ
10μF
R1
ROHM
ROHM
Murata
Murata
Murata
Murata
Murata
MCR01MZPDxxxx
MCR01MZPDxxxx
R2
C1(Note 1)
C2(Note 2)
C5,C6
C8(Note 3)
C10
GRM21BB31A106ME18
GRM155B11A104MA01D
GRM21BB30J226ME38L
GRM155B11A104MA01D
GRM15 series
0.1μF
22μF
0.1μF
22μF
0.1μF
22μF
0.1μF
22μF
0.1μF
100pF
0.1μF
100pF
0.1μF
100pF
0.1μF
120pF
FDSD0420
DFE252012C
L1
0.47μH
0.47μH
0.47μH
0.47μH
TOKO
(Note 1) For capacitance of input capacitor take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no
less than 4.7μF
(Note 2) Connect a 0.1μF ceramic capacitor near to VIN terminal as much as possible.
(Note 3) For capacitance of bootstrap capacitor take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value
to no less than 0.047μF.
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Selection of Components Externally Connected
About the application except the recommendation, please contact us.
1. Output LC Filter Constant
In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the
output voltage. Use inductors of values 0.47µH at FREQ=L or 1.0µH at FREQ=H.
VIN
IL
Inductor saturation current > IOUTMAX +ΔIL /2
L
VOUT
IOUT
ΔIL
Driver
Average inductor current
COUT
t
Figure 43. Waveform of current through inductor
Figure 44. Output LC filter circuit
Inductor ripple current ΔIL
1
ΔIL =VOUT × (VIN -VOUT ) ×
= 912
mA
VIN × fSW × L
where
V
IN 5
OUT 1.2
μH
MHz
V
V
V
L 1.0
f
sw 1
(SwitchingFrequency)
The saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor
ripple current ∆IL.
The output capacitor COUT affects the output ripple voltage characteristics. The output capacitor COUT must satisfy the
required ripple voltage characteristics.
The output ripple voltage can be represented by the following equation.
1
ΔVRPL = ΔIL × (RESR
+
)
V
8 × COUT × fSW
where
RESR is theEquivalentSeriesResistance(ESR)of the outputcapacitor.
* The capacitor rating must allow a sufficient margin with respect to the output voltage.
The output ripple voltage is decreased with a smaller ESR.
Considering temperature and DC bias characteristics, please use ceramic capacitor of about 22µF to 47µF.
* Be careful of total capacitance value, when additional capacitor CLOAD is connected in addition to output capacitor COUT
Use maximum additional capacitor CLOAD (Max) which satisfies the following condition.
.
Maximumstarting inductor ripple current ILSTART < Over Current limit 3.7[A](min)
Maximum starting inductor ripple current ILSTART can be expressed using the following equation.
ΔIL
I LSTART = Maximum starting output current(IOMAX ) + Charge current to output capacitor(ICAP ) +
2
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Charge current to output capacitor ICAP can be expressed using the following equation.
(COUT +C LOAD ) ×VOUT
t SS
ICAP
=
A
For example, given VIN= 5V, VOUT= 1.2V, L= 1.0µH, switching frequency fSW = 800kHz(Min), Output capacitor COUT= 44µF,
Soft Start time tSS= 0.5ms(Min), and load current during soft start IOSS= 3A, maximum CLOAD can be computed using the
following equation.
(3.7 - IOSS - ΔI L /2)× t SS
CLOAD(max)<
- COUT 10.2
μF
VOUT
* CLOAD has an effect on the stability of the DC/DC converter.
To ensure the stability of the DC/DC converter, make sure that a sufficient phase margin is provided.
2. Output Voltage Setting
The output voltage value can be set by the feedback resistance ratio.
For stable operation, use feedback resistance R2 more than 20kΩ.
VOUT
R1 + R2
VOUT
=
× 0.8
V
R1
R2
R1
Error Amplifier
0.8
OUT - 0.8
R1 =
× R2
Ω
FB
V
0.8V
0.8
V
VOUT ( VIN 0.8)
V
Figure 45. Feedback Resistor Circuit
3. FB Capacitor
Generally, in fixed ON time control, sufficient ripple voltage in FB voltage is needed to operate comparator stably.
Regarding this IC, by injecting ripple voltage to FB voltage inside IC it is designed to correspond to low ESR output
capacitor. Please set the FB capacitor within the range of the following expression to inject an appropriate ripple.
VOUT
VIN
VOUT
VIN
fSW × 3.3 × 103
VOUT × (1-
)
VOUT × (1-
)
< C FB <
F
fSW × 7.65 × 103
V
IN :InputVoltage
OUT :OutputVoltage
SW :SwitchingFrequency
V
V
V
f
Hz
4. Bootstrap Capacitor
Connect a 0.1µF ceramic capacitor between SW terminal and BOOT terminal.
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PCB Layout Design
In the step-down DC/DC converter, a large pulse current flows into two loops. The first loop is the one into which the current
flows when the High-Side FET is turned ON. The flow starts from the input capacitor CIN, runs through the FET, inductor L
and output capacitor COUT and back to GND of CIN via GND of COUT. The second loop is the one into which the current flows
when the Low-Side FET is turned on. The flow starts from the Low-Side FET, runs through the inductor L and output
capacitor COUT and back to GND of the Low-Side FET via GND of COUT. Route these two loops as thick and as short as
possible to allow noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors
directly to the GND plane. The PCB layout has a great influence on all of the heat generation, noise and efficiency
characteristics.
VIN
VOUT
L
MOS FET
CIN
COUT
Figure 46. Current Loop of Buck Converter
Accordingly, design the PCB layout considering the following points.
Connect an input capacitor as close as possible to the IC VIN terminal and GND terminal on the same plane as the
IC.
If there is any unused area on the PCB, provide a copper foil plane for the GND node to assist heat dissipation from
the IC and the surrounding components.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the coil pattern as
thick and as short as possible.
Provide lines connected to FB far from the SW nodes.
Place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input.
GND
Input Bypass
Capacitor
(0.1μF)
Output Capacitor
Input Bulk
Capacitor
(10μF)
Output Inductor
VIN
VOUT
Backside Heat Dissipation
Exposed Pad
Enable Control
Bootstrap Capacitor
Signal VIA
Thermal VIA
Bottom Layer Line
Figure 47. Example of PCB Layout
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I/O Equivalence Circuits
2. EN
3. BOOT
VIN
VIN
Internal
circuits
EN
BOOT
SW
4. SW
VIN
5. MODE
BOOT
Internal
circuits
MODE
SW
6. FREQ
7. FB
VIN
Internal
circuits
FREQ
10kΩ
FB
Please refer to page6 for electrical characteristics of internal circuits.
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go
below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages
going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors
and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD9B304QWZ
Operational Notes – continued
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 48. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all
within the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
16. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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Ordering Information
B D 9 B 3 0 4 Q W Z -
E 2
Part Number
Package
UMMP008AZ020
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
UMMP008AZ020 (TOP VIEW)
Part Number Marking
LOT Number
D 9 B
3 0 4
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
UMMP008AZ020
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Revision History
Date
Revision
Changes
-
001
002
Not Release
New Release
07.Feb.2017
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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