BDJ0GA3WNUX-TR [ROHM]
300mA Variable / Fixed Output LDO Regulators; 300毫安可变/固定输出LDO稳压器
| 型号： | BDJ0GA3WNUX-TR |
| 厂家： | 
ROHM |
| 描述： | 300mA Variable / Fixed Output LDO Regulators |
| 文件： | 总23页 (文件大小：612K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
300mA Variable / Fixed Output
LDO Regulators
BDxxGA3WEFJ / BDxxGA3WNUX
●General Description
BDxxGA3WEFJ / BDxxGA3WNUX series devices are LDO regulators with output current capability of 0.3A. It has an output
voltage accuracy of ±1%. Both fixed and variable output voltage devices are available. The variable output voltage can be
varied from 1.5V to 13.0V using external resistors. Various fixed output voltage devices that do not use external resistors
are also available. These LDO regulators are available in HTSOP-J8 / VSON008X2030 package and can be used in wide
variety of digital appliances. It has built-in over current protection to protect the device when output is shorted, 0μA
shutdown mode, and thermal shutdown circuit to protect the device during thermal over-load conditions. These LDO
regulators are usable with ceramic capacitors that enable a smaller layout and longer life.
●Package
HTSOP-J8 (EFJ)
(Typ.)
(Typ.)
(Max.)
●Features
High accuracy reference voltage circuit
4.90mm x 6.00mm x 1.00mm
VSON008X2030 (NUX) 2.00mm x 3.00mm x 0.60mm
Built-in Over Current Protection (OCP)
Built-in Thermal Shut Down circuit (TSD)
Zero µA shutdown mode
●Key Specifications
Input power supply voltage range:
Output voltage range(Variable type):
4.5V to 14.0V
1.5V to 13.0V
Output voltage(Fixed type): 1.5V/1.8V/2.5V/3.0V/3.3V
5.0V/6.0V/7.0V/8.0V/9.0V/10V/12V
Output current:
Shutdown current:
0.3A (Max.)
0μA(Typ.)
Operating temperature range:
-25℃ to +85℃
HTSOP-J8
(EFJ)
VSON008X2030
(NUX)
●Typical Application Circuit
VCC
EN
VO
VCC
EN
VO
COUT
COUT
CIN
CIN
R1
R2
VO_S
FB
GND
FIN
GND
FIN
CIN, COUT : Ceramic Capacitor
Fixed type output voltage
CIN, COUT : Ceramic Capacitor
Variable type output voltage
○Product structure：Silicon monolithic integrated circuit ○This product is not designed to have protection against radioactive rays.
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Ordering Information
B D x x G
A
3 W y y y
-
z z
Part
Output
Input
Voltage
Output Shutdown
Current Mode
Package
Packaging and forming specification
Number voltage
00:Variable G:15V
15:1.5V
A3:0.3A “W”:Included EFJ :HTSOP-J8
NUX:VSON008X2030
E2:Emboss tape reel
(HTSOP-J8)
18:1.8V
25:2.5V
TR:Emboss tape reel
(VSON008X2030)
30:3.0V
33:3.3V
50:5.0V
60:6.0V
70:7.0V
80:8.0V
90:9.0V
J0:10.0V
J2:12.0V
●Line up
Output
Voltage(V)
xx
00
15
18
25
30
33
50
60
70
80
90
J0
J2
Product Name
BD00GA3WNUX-TR
variable
1.5
BD00GA3WEFJ-E2
BD15GA3WEFJ-E2
BD18GA3WEFJ-E2
BD25GA3WEFJ-E2
BD30GA3WEFJ-E2
BD33GA3WEFJ-E2
BD50GA3WEFJ-E2
BD60GA3WEFJ-E2
BD70GA3WEFJ-E2
BD80GA3WEFJ-E2
BD90GA3WEFJ-E2
BDJ0GA3WEFJ-E2
BDJ2GA3WEFJ-E2
BD15GA3WNUX-TR*1
BD18GA3WNUX-TR*1
BD25GA3WNUX-TR*1
BD30GA3WNUX-TR*1
BD33GA3WNUX-TR*1
BD50GA3WNUX-TR*1
BD60GA3WNUX-TR*1
BD70GA3WNUX-TR*1
BD80GA3WNUX-TR*1
BD90GA3WNUX-TR*1
BDJ0GA3WNUX-TR*1
BDJ2GA3WNUX-TR*1
1.8
2.5
3.0
3.3
5.0
6.0
7.0
8.0
9.0
10.0
12.0
*1 under development
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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2/20
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Block Diagram
BD00GA3WEFJ (Variable type output voltage)
VCC
SOFT
START
VO
Figure 1. Block Diagram
●Pin Configuration (TOP VIEW)
1
8
7
6
5
VCC
VO
1
2
3
4
8
7
6
5
VCC
VO
FB
FB
GND
N.C.
2
3
4
N.C.
N.C.
EN
N.C.
N.C.
EN
GND
N.C.
(HTSOP-J8)
(VSON008X2030)
●Pin Description
Pin No.
Pin name
Pin Function
1
VO
FB
Output pin
2
Feedback pin
GND pin
3
GND
N.C.
EN
4
No Connection (Connect to GND or leave OPEN)
Enable pin
5
6
N.C.
N.C.
VCC
FIN
No Connection (Connect to GND or leave OPEN)
No Connection (Connect to GND or leave OPEN)
Input pin
7
8
Reverse
Substrate(Connect to GND)
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Block Diagram
BDxxGA3WEFJ (Fixed type output voltage)
VCC
OCP
SOFT
START
VO
EN
TSD
VO_S
GND
Figure 2. Block Diagram
●Pin Configuration (TOP VIEW)
1
2
3
4
8
7
6
5
VCC
VO
1
8
7
6
5
VO
VCC
N.C.
N.C.
EN
VO_S
N.C.
N.C.
EN
2
VO_S
GND
N.C.
3
GND
4
N.C.
(HTSOP-J8)
(VSON008X2030)
●Pin Description
Pin No.
Pin name
Pin Function
1
VO
VO_S
GND
N.C.
EN
Output pin
2
Output voltage monitor pin
GND pin
3
4
No Connection (Connect to GND or leave OPEN)
Enable pin
5
6
N.C.
N.C.
VCC
No Connection (Connect to GND or leave OPEN)
No Connection (Connect to GND or leave OPEN)
Input pin
7
8
Reverse
FIN
Substrate(Connect to GND)
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
VCC
Limits
15.0 *2
Unit
V
Power supply voltage
EN voltage
VEN
15.0
V
HTSOP-J8
Power dissipation
Pd*3
2110 *3
1700*4
mW
VSON008X2030
Pd*4
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
-25 to +85
-55 to +150
+150
℃
℃
℃
Junction Temperature
Tjmax
*2 Not to exceed Pd
*3 Reduced by 16.9mW/℃ for temperature above 25℃. (When mounted on a two-layer glass epoxy board with 70mm×70mm×1.6mm dimension)
*4 Reduced by 13.6mW/℃ for temperature above 25℃. (When mounted on a four-layer glass epoxy board with 114.3mm×76.2mm×1.6mm dimension)
●Recommended Operating Range (Ta=25℃)
Parameter
Input power supply voltage
EN voltage
Symbol
VCC
VEN
VO
Min.
4.5
0.0
1.5
0.0
Max.
14.0
14.0
13.0
0.3
Unit
V
V
Output voltage setting range
Output current
V
IO
A
●Electrical Characteristics (Unless otherwise specified, Ta=25℃, EN=3V, VCC=6V, R1=43kΩ, R2=8.2kΩ)
Parameter
Circuit current at shutdown mode
Bias current
Symbol
ISD
Min.
Typ.
0
Max.
5
Unit
Conditions
-
μA VEN=0V, OFF mode
μA
ICC
-
600
0.5
0.5
0.6
0.800
VO
-
900
1
Line regulation
Reg.I
Reg IO
VCO
-1
%
%
V
VCC=( VO+0.9V )→14.0V
IO=0→0.3A
Load regulation
-1.5
1.5
Minimum dropout Voltage
Output reference voltage(Variable type)
Output voltage(Fixed type)
EN Low voltage
-
0.9
VCC=5V, IO=0.3A
IO=0A
VFB
0.792
0.808
VO×1.01
0.8
V
VO
VO×0.99
V
IO=0A
VEN (Low)
VEN (High)
IEN
0
2.4
1
V
EN High voltage
-
14.0
9
V
EN Bias current
3
µA
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Typical Performance Curves
(Unless otherwise specified, Ta=25℃, EN=3V, VCC=6V, R1=43kΩ, R2=8.2kΩ)
VO
VO
IO
IO
Figure 4.
Transient Response
(0.3→0A)
Figure 3.
Transient Response
(0→0.3A)
Co=1µF
Co=1µF
VEN
VEN
VCC
VCC
VO
VO
Figure 5.
Input sequence 1
Co=1µF
Figure 6.
OFF sequence 1
Co=1µF
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
VEN
VEN
VCC
VCC
VO
VO
Figure 8.
OFF sequence 2
Co=1µF
Figure 7.
Input sequence 2
Co=1µF
Ta[℃]
Ta[℃]
Figure 10.
Ta-ICC
Figure 9.
Ta-VO (IO=0mA)
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
Ta[℃]
Ta[℃]
Figure 11.
Ta-ISD
(VEN=0V)
Figure 12.
Ta-IEN
IO[A]
VCC [V]
Figure 13.
IO-VO
Figure 14.
VCC-ISD
(VEN=0V)
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
VCC [V]
Ta[℃]
Figure 15.
VCC-VO (IO=0mA)
Figure 16.
TSD (IO=0mA)
Ta[℃]
IO [A]
Figure 17.
OCP
Figure 18.
Minimum dropout Voltage1
（VCC=5V、IO=0.3A）
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
IO [A]
IO [A]
Figure 19.
ESR-Io characteristics
Figure 20.
IO-ICC
IO [A]
Figure 21.
PSRR (IO=0mA)
Figure 22.
Minimum dropout Voltage 2
（VCC=4.5V、Ta=25℃）
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
IO [A]
IO [A]
Figure 24.
Minimum dropout Voltage 4
（VCC=8V、Ta=25℃）
Figure 23.
Minimum dropout Voltage 3
（VCC=6V、Ta=25℃）
IO [A]
IO [A]
Figure 25.
Minimum dropout Voltage 5
（VCC=10V、Ta=25℃）
Figure 26.
Minimum dropout Voltage 6
（VCC=12V、Ta=25℃）
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TSZ02201-0R6R0A600180-1-2
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Power Dissipation
◎HTSOP-J8
4.0
⑤3.76W
Measurement condition: mounted on a ROHM board
PCB size: 70mm × 70mm × 1.6mm
(PCB with thermal via)
・Solder the thermal pad to Ground
3.0
① IC only
θj-a=249.5℃/W
④2.11W
② 1-layer（copper foil : 0mm×0mm）
θj-a=153.2℃/W
2.0
③ 2-layer（copper foil : 15mm×15mm）
θj-a=113.6℃/W
④ 2-layer（copper foil : 70mm×70mm）
θj-a=59.2℃/W
⑤ 4-layer（copper foil : 70mm×70mm）
θj-a=33.3℃/W
③1.10W
1.0
②0.82W
①0.50W
0
0
25
50
75
100
125
150
Ambient Temperature : Ta [℃]
◎VSON008X2030
4.0
Measurement condition: mounted on a ROHM board
PCB size: 114.3mm × 76.2mm × 1.6 mm
・Solder the thermal pad to Ground
3.0
① IC only
θj-a=480.8℃/W
② 1-layer（copper foil : 0mm2）
θj-a=223.2℃/W
2.0
④1.80W
③ 4-layer（copper foil : 5655mm2,
4th layer copper foil : thermal land）
θj-a=73.5℃/W
③1.70W
④ 4-layer（copper foil at 2nd, 3rd, 4th layers : 5655mm2）
θj-a=69.4℃/W
1.0
②0.56W
①0.26W
0
0
25
50
75
100
125
150
Ambient Temperature: Ta [℃]
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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12/20
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
As the power consumption increases above the maximum allowable power dissipation of the chip, the temperature across
the chip also increases. When considering thermal design for the regulator, operation should be maintained within the
following conditions:
1. Ambient temperature Ta can be not higher than 85℃.
2. Chip junction temperature (Tj) can be not higher than 150℃.
Chip junction temperature can be determined as follows:
Calculation based on ambient temperature (Ta)
Tj=Ta+θj-a×W
＜Reference values＞
θj-a: HTSOP-J8
153.2℃/W 1-layer PCB(copper foil 0mm×0mm)
113.6℃/W 2-layer PCB(copper foil 15mm×15mm)
59.2℃/W 2-layer PCB(copper foil 70mm×70mm)
33.3℃/W 4-layer PCB (copper foil 70mm×70mm)
PCB size: 70mm×70mm×1.6mm (PCB with thermal via)
θj-a: VSON008X2030
223.2℃/W 1-layer PCB(copper foil 0mm2)
73.5℃/W 4-layer PCB (2nd, 3rd copper foil 5655mm2, 4th layer copper foil : thermal land)
69.4℃/W 4-layer PCB (copper foil 5655mm2)
PCB size: 114.3mm×76.2mm×1.6mm
Most of the heat loss that occurs in the BDxxGA3WEFJ / BDxxGA3WNUX series is generated from the output Pch FET.
Power loss is determined by the voltage drop across VCC-VO and the output current. Be sure to confirm the system’s input
and output voltages, as well as the output current conditions in relation to the power dissipation characteristics of the VCC
and VO in the design. Bearing in mind that the power dissipation may vary substantially depending on the PCB employed, it
is important to consider PCB size based on thermal design and power dissipation characteristics of the chip with the PCB.
Power consumption [W] = Input voltage (VCC) - Output voltage (VO) ×IO(Ave)
Example: Where VCC=5.0V, VO=3.3V, IO (Ave) = 0.1A,
Power consumption [W] = 5.0V - 3.3V ×0.1A
=0.17W
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Input and Output Capacitor
It is recommended that a capacitor is placed near pins between input pin and GND as well as output pin and GND. The
input capacitor becomes more necessary when the power supply impedance is high or when the PCB trace has significant
length. Also, as for a capacitor between output pin and GND, the greater the capacitance, the more stable the output will
be depending on the load and line voltage variations. However, please check the actual functionality of this part by
mounting on a board for the actual application. Ceramic capacitors usually have different thermal and equivalent series
resistance characteristics and may degrade gradually over continued use.
For additional details, please check with the manufacturer and select the best ceramic capacitor for your application.
10
0
Rated Voltage：10V
B1 characteristics
Rated Voltage：10V
B characteristics
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
Rated Voltage：6.3V
B characteristics
Rated Voltage:10V
F characteristics
Rated Voltage：4V
X6S characteristics
0
1
2
3
4
DC Bias Voltage [V]
Ceramic capacitor capacity – DC bias characteristics
(Characteristics example)
●Equivalent Series Resistance ESR (ceramic capacitor etc.)
To prevent oscillation, please attach a capacitor between VO
and GND. Capacitors usually have ESR (Equivalent Series
Resistance). Operation will be stable in ESR-IO range shown in
the right. Ceramic, tantalum and electronic capacitors have
different ESR values, so please be sure to use a capacitor that
operates in the stable operating region shown in the right.
Finally, please evaluate in the actual application.
CO=1μF
ESR – IO characteristics
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Evaluation Board Circuit
C3
C7
8
1
2
3
VCC
N.C.
N.C.
EN
VO
C6
C5
C2
C1
R1
R2
7
FB
VCC
GND
6
5
GND
N.C.
U1
SW1
VO
EN
4
FIN
●Evaluation Board Parts List
Designation Value
Part No.
Company Designation Value
Part No.
Company
R1
R2
R3
R4
R5
R6
C1
43kΩ
8.2kΩ
‐
MCR01PZPZF4302
ROHM
ROHM
‐
C4
C5
C6
C7
C8
C9
C10
‐
1µF
‐
‐
‐
MCR01PZPZF8201
‐
CM105B105K16A
‐
KYOCERA
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
1µF
CM105B105K16A
KYOCERA
‐
‐
BDxxGA3WEFJ /
BDxxGA3WNUX
‐
C2
C3
‐
‐
‐
‐
‐
‐
U1
U2
‐
‐
ROHM
‐
●Board Layout
EN
GND
CIN
(
)
VCC
VIN
R1
R2
COUT
VO
･Input capacitor CIN connected to VCC (VIN) should be placed as close as possible to VCC(VIN) pin and use wide layout.
Output capacitor COUT should also be placed as close as possible to IC pin. In case connected to inner layer GND plane,
please use several through hole.
・FB pin has comparatively high impedance and can be affected by noise, so floating capacitance should be small as
possible. Please be careful of this during layout.
・Please make GND pattern wide enough to handle the power dissipation of the chip.
・For output voltage setting (BD00GA3WEFJ / BD00GA3WNUX)
Output voltage can be set by FB pin voltage（0.800V typ.）and external resistance R1, R2.
R1+R2
VO = VFB×
R2
（The use of resistors with R1+R2=1k to 90kΩ is recommended）
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TSZ22111･15･001
Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●I/O Equivalent Circuits (Variable type : BD00GA3WEFJ)
8pin (VCC) / 1pin (VO)
2pin (FB)
5pin (EN)
2pin (FB)
8pin (VCC
)
5pin (EN)
2MΩ
1MΩ
1pin (VO)
●I/O Equivalent Circuits (Fixed type : BDxxGA3WEFJ)
8pin (VCC) / 1pin (VO) 2pin (VO_S
)
5pin (EN)
8pin (VCC
)
5pin (EN)
2pin (VO_S
)
2MΩ
1MΩ
1pin (VO)
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Operational Notes
(1). Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
(2). Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
(3). Power supply lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
(4). Ground voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that
no pins are at a voltage below the ground pin at any time, even during transient condition.
(5). Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd)
in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd)
Package Power dissipation
Power dissipation
: Pd (W)=(Tjmax－Ta)/θja
: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
(6). Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the
pins.
(7). Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(8). Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
(9). Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its
operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this
function will always be activated.
TSD ON Temperature[℃] (typ.)
Hysteresis Temperature [℃] (typ.)
BDxxGA3WEFJ / BDxxGA3WNUX
(10). Testing on application boards
175
15
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
© 2012 ROHM Co., Ltd. All rights reserved.
17/20
TSZ22111･15･001
Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
(11). Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resi
Transistor
Pin A
Pin B
Pin B
B
C
E
Pin A
B
C
E
N
P+
P+
P+
N
N
P+
P
Parasitic
element
N
P
N
N
P substrate
P substrate
Parasitic
element
GND
GND
GND
GND
Parasitic element
Parasitic element
Example of monolithic IC structure
Other adjacent elements
(12). Ground Wiring Pattern.
When using both small-signal and large-current ground traces, the two ground traces should be routed separately
but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The power supply and ground lines must be as short and thick as possible to
reduce line impedance.
Status of this document
The Japanese version of this document is the official specification. If there are any differences in the translated version of this
document then official version takes priority.
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
© 2012 ROHM Co., Ltd. All rights reserved.
18/20
TSZ22111･15･001
Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Physical Dimension Tape and Reel Information
HTSOP-J8
<Tape and Reel information>
4.9 0.1
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
2500pcs
(3.2)
+
Quantity
6
°
°
4°
−4
8
7
2
6
3
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
4
1PIN MARK
+0.05
-0.03
0.545
0.17
S
1.27
+0.05
0.42
0.08
-
0.04
M
0.08
S
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
VSON008X2030
<Tape and Reel information>
2.0 0.1
Tape
Embossed carrier tape
Quantity
4000pcs
TR
1PIN MARK
Direction
of feed
S
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
0.08
S
1.5 0.1
0.5
C0.25
1
4
8
5
0.25
Direction of feed
1pin
+0.05
−0.04
0.25
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
(Unit : mm)
●Marking Diagram
HTSOP-J8 (TOP VIEW)
VSON008X2030 (TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
x
x
x x G A 3 W
G
A
3
1PIN MARK
1PIN MARK
www.rohm.com
TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
© 2012 ROHM Co., Ltd. All rights reserved.
19/20
TSZ22111･15･001
Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Revision History
Date
Revision
Changes
20.July.2012
03.Dec.2012
001
002
New Release
Improved the English translation and added Package Lineup
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TSZ02201-0R6R0A600180-1-2
03.Dec.2012.Rev.002
© 2012 ROHM Co., Ltd. All rights reserved.
20/20
TSZ22111･15･001
Daattaasshheeeett
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3) Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4) The Products are not subject to radiation-proof design.
5) Please verify and confirm characteristics of the final or mounted products in using the Products.
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8) Confirm that operation temperature is within the specified range described in the product specification.
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2) You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5) The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
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