BDL00A5NUF-C (开发中) [ROHM]
The BDL00A5NUF-C is a linear regulator designed as a low current consumption product for power sup;
| 型号： | BDL00A5NUF-C (开发中) |
| 厂家： | 
ROHM |
| 描述： | The BDL00A5NUF-C is a linear regulator designed as a low current consumption product for power sup |
| 文件： | 总36页 (文件大小：2081K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
For Automotive 20 V Input 500 mA
Adjustable Output LDO Regulators
BDL00A5NUF-C BDL00A5EFJ-C
General Description
Key Specifications
The BDL00A5NUF-C and BDL00A5EFJ-C is a linear
regulator designed as a low current consumption product
for power supplies in various automotive applications.
This product is designed for up to 20 V as an absolute
maximum voltage and to operate until 500 mA for the
output current with low current consumption 30 µA (Typ).
The reference voltage accuracy (ADJ pin voltage
accuracy) is a very high accuracy (Note 1), ±2 %. The output
voltage can be adjusted between 1 V and 17 V by an
external resistive divider connected to the ADJ pin.
The output shutdown function is integrated in the devices.
A logical “HIGH” at the EN Pin turns on the device, and in
the other side, the device is controlled to disable by a
logical “LOW” input to the EN Pin.
◼ Wide Temperature Range (Tj):
◼ Operating Input Range:
◼ Current Consumption:
◼ Shutdown Circuit Current
◼ Output Current Capability:
◼ High ADJ Voltage Accuracy:
◼ Output Voltage:
-40 °C to +150 °C
2.9 V to 18 V
30 µA (Typ)
0 µA (Typ)
500 mA
±2 %
1 V to 17 V
(Note 3) It does not contain the current of external feedback resistance.
Applications
◼ Automotive (Power Train, Body ECU)
◼ Car Infotainment System, etc.
The device features the integrated Over Current Protection
to protect the device from a damage caused by a short-
circuiting or an overload. This product also integrates
Thermal Shutdown Protection to avoid the damage by
overheating.
Package
W (Typ) x D (Typ) x H (Max)
3.0 mm × 3.0 mm × 1.0 mm
4.9 mm × 6.0 mm × 1.0 mm
VSON10FV3030
HTSOP-J8
Furthermore, low ESR ceramic capacitors are sufficiently
applicable for the phase compensation.
(Note 1) The tolerance of feedback resistor is not included.
Features
◼ AEC-Q100 Qualified (Note 2)
◼ Functional Safety Supportive Automotive Products
◼ Output Shutdown Function (EN Function)
◼ Over Current Protection (OCP)
VSON10FV3030
HTSOP-J8
◼ Thermal Shutdown Protection (TSD)
(Note 2) Grade 1
Typical Application Circuit
◼ Components Externally Connected
(Note 4)
Capacitor: 1.0 µF ≤ CIN, 1.0 µF ≤ COUT
Resistor: 10 kΩ ≤ R2 ≤ 200 kΩ (Note 5)
VADJ (Typ): 0.75 V
푉푂푈푇
푅1 = 푅2 (
− ꢀ)
푉
퐴퐷퐽
VIN
VIN
VOUT
VOUT
VOUT
VIN
EN
VIN
CIN
COUT
VIN
CIN
COUT
R1
R2
R1
ADJ
ADJ
EN
VEN
VEN
R2
GND
GND
VSON10FV3030
HTSOP-J8
(Note 4) Electrolytic capacitor, tantalum capacitor and ceramic capacitors can be used. Set capacitor value which do not fall below CIN =1.0 µF,
COUT = 1.0 µF. These values need to consider the temperature characteristics and DC bias characteristics.
(Note 5) The tolerance of feedback resistor is not included in the accuracy of output voltage.
The value of a feedback resistor R2 must be within this range. R1 value is defined by following the formula using the limitation of R1.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
.
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BDL00A5NUF-C BDL00A5EFJ-C
Contents
General Description ......................................................................................................................................................1
Features........................................................................................................................................................................1
Key Specifications ........................................................................................................................................................1
Applications...................................................................................................................................................................1
Package........................................................................................................................................................................1
Typical Application Circuit.............................................................................................................................................1
Pin Configurations ........................................................................................................................................................3
Pin Descriptions............................................................................................................................................................3
Block Diagrams.............................................................................................................................................................4
Description of Blocks ....................................................................................................................................................5
Absolute Maximum Ratings..........................................................................................................................................5
Thermal Resistance......................................................................................................................................................6
Operating Conditions ....................................................................................................................................................6
Electrical Characteristics ..............................................................................................................................................7
LDO Function..............................................................................................................................................................................7
Enable Function ..........................................................................................................................................................................7
Typical Performance Curves 5 V Output ......................................................................................................................8
Typical Performance Curves 3.3 V Output .................................................................................................................14
Measurement Circuit for Typical Performance Curves...............................................................................................18
Application and Implementation..................................................................................................................................19
Selection of External Components............................................................................................................................................19
Input Pin Capacitor................................................................................................................................................................19
Output Pin Capacitor .............................................................................................................................................................19
Typical Application.....................................................................................................................................................................20
Surge Voltage Protection for Linear Regulators ........................................................................................................................21
Positive Surge to the Input.....................................................................................................................................................21
Negative Surge to the Input...................................................................................................................................................21
Reverse Voltage Protection for Linear Regulators ....................................................................................................................21
Protection against Reverse Input/Output Voltage..................................................................................................................21
Protection against Input Reverse Voltage..............................................................................................................................22
Protection against Reverse Output Voltage when Output Connect to an Inductor.................................................................23
Power Dissipation .......................................................................................................................................................24
■VSON10FV3030 .....................................................................................................................................................................24
■HTSOP-J8...............................................................................................................................................................................24
Thermal Design...........................................................................................................................................................25
I/O Equivalence Circuit ...............................................................................................................................................27
Operational Notes.......................................................................................................................................................28
1. Reverse Connection of Power Supply...............................................................................................................................28
2. Power Supply Lines...........................................................................................................................................................28
3. Ground Voltage..................................................................................................................................................................28
4. Ground Wiring Pattern.......................................................................................................................................................28
5. Operating Conditions.........................................................................................................................................................28
6. Inrush Current....................................................................................................................................................................28
7. Thermal Consideration ......................................................................................................................................................28
8. Testing on Application Boards............................................................................................................................................28
9. Inter-pin Short and Mounting Errors ..................................................................................................................................28
10. Unused Input Pins .............................................................................................................................................................28
11. Regarding the Input Pin of the IC ......................................................................................................................................29
12. Ceramic Capacitor.............................................................................................................................................................29
13. Thermal Shutdown Protection Circuit (TSD)......................................................................................................................29
14. Over Current Protection Circuit (OCP) ..............................................................................................................................29
15. Enable Pin.........................................................................................................................................................................29
16. Functional Safety...............................................................................................................................................................29
Ordering Information...................................................................................................................................................30
Lineup .........................................................................................................................................................................30
Marking Diagrams.......................................................................................................................................................30
Physical Dimension and Packing Information ............................................................................................................31
Revision History..........................................................................................................................................................33
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Pin Configurations
VSON10FV3030
(TOP VIEW)
HTSOP-J8
(TOP VIEW)
8
7
6
5
10
1
2
3
9
8
7
6
EXP-PAD
4
5
1
2
3
4
BDL00A5EFJ-C
BDL00A5NUF-C
Pin Descriptions
BDL00A5NUF-C
Pin No.
Pin Name
Function
Descriptions
It is necessary to use a capacitor with a capacitance of 1.0 µF (Min) or
higher between the VOUT pin and the GND pin. The detail of a selection
is described in Selection of External Components.
1, 2
VOUT
Output Voltage Pin
Adjustment Pin
For Output Voltage
Ground
Connect an external resistor between the VOUT pin and the ADJ pin
and between the ADJ pin and the GND pin to adjust output voltage.
This is ground pin.
This pin is not connected to the chip. (Note 1)
3
ADJ
4
5
GND
N.C.
-
Control Output
ON / OFF Pin
A logical “HIGH” (VEN ≥ 2.0 V) at the EN pin enables the device
and “LOW” (VEN ≤ 0.4 V) at the EN pin disables the device.
6
EN
7
8
N.C.
N.C.
-
-
This pin is not connected to the chip. (Note 1)
This pin is not connected to the chip. (Note 1)
It is necessary to use a capacitor with a capacitance of 1.0 µF (Min) or
Input Supply Voltage higher between the VIN pin and the GND pin. The detail of a selection
9, 10
VIN
Pin
is described in Selection of External Components. If the inductance of
power supply line is high, adjust input capacitor value.
It is recommended to connect EXP-PAD on the back side to external
ground pattern in order to make heat dissipation better.
EXP-PAD
EXP-PAD
Heat Dissipation
BDL00A5EFJ-C
Pin No.
Pin Name
VOUT
Function
Descriptions
It is necessary to use a capacitor with a capacitance of 1.0 µF (Min) or
higher between the VOUT pin and the GND pin. The detail of a selection
is described in Selection of External Components.
1
Output Voltage Pin
Adjustment Pin
For Output Voltage
Connect an external resistor between the VOUT pin and the ADJ pin
and between the ADJ pin and the GND pin to adjust output voltage.
2
ADJ
3
4
GND
N.C.
Ground
This is ground pin.
This pin is not connected to the chip. (Note 1)
-
Control Output
ON / OFF Pin
A logical “HIGH” (VEN ≥ 2.0 V) at the EN pin enables the device
and “LOW” (VEN ≤ 0.4 V) at the EN pin disables the device.
This pin is not connected to the chip. (Note 1)
This pin is not connected to the chip. (Note 1)
5
EN
6
7
N.C.
N.C.
-
-
It is necessary to use a capacitor with a capacitance of 1.0 µF (Min) or
Input Supply Voltage higher between the VIN pin and the GND pin. The detail of a selection
8
VIN
Pin
is described in Selection of External Components. If the inductance of
power supply line is high, adjust input capacitor value.
It is recommended to connect EXP-PAD on the back side to external
ground pattern in order to make heat dissipation better.
EXP-PAD
EXP-PAD
Heat Dissipation
(Note 1) The N.C. pin can be either left floated or for connect to GND.
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BDL00A5NUF-C BDL00A5EFJ-C
Block Diagrams
VSON10FV3030
HTSOP-J8
VIN (PIN 8)
VOUT (PIN 1)
EN
EN_SIG
EN
OCP
PREREG
N.C. (PIN 7)
EN
VREF
DRIVER
AMP
TSD
DIS-
N.C. (PIN 6)
CHARGE
EN_SIG
ADJ (PIN 2)
GND (PIN 3)
EN (PIN 5)
N.C. (PIN 4)
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BDL00A5NUF-C BDL00A5EFJ-C
Description of Blocks
Block Name
EN
Function
Description of Blocks
A logical “HIGH” (VEN ≥ 2.0 V) at the EN Pin enables the device
and “LOW” (VEN ≤ 0.4 V) at the EN Pin disables the device.
Control Output ON / OFF
Internal Power Supply
PREREG
Power supply for internal circuit.
In case maximum power dissipation is exceeded or the ambient
temperature is higher than the Maximum Junction Temperature,
overheating causes the chip temperature (Tj) to rise. The TSD
protection circuit detects this and forces the output to turn off in order to
protect the device from overheating. (Typ: 175 °C) When the junction
temperature decreases to low, the output turns on automatically.
TSD
Thermal Shutdown Protection
VREF
AMP
Internal Reference Voltage
Error Amplifier
Generate the reference voltage.
Compares the ADJ voltage with the reference voltage and controls the
output power transistor via the DRIVER.
DRIVER
Output MOSFET Driver
Drive the output MOSFET
If the output current increases higher than the maximum output current,
it is limited by Over Current Protection in order to protect the device from
a damage caused by an over current. (Typ: 800 mA)
OCP
Over Current Protection
While this block is operating, the output voltage may decrease because
the output current is limited.
If an abnormal state is removed and the output current value returns to
normal, the output voltage also returns to normal state.
Output pin is discharged by the internal resistance when EN = LOW
input or TSD is detected.
DISCHARGE
Output Discharge Function
Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
Input Voltage (Note 1)
VIN
VEN
-0.3 to +20
-0.3 to +20
-0.3 to +20 (≤ VIN + 0.3)
-0.3 to +7
V
V
EN Pin Voltage (Note 2)
VOUT Pin Voltage
VOUT
V
ADJ Pin Voltage
VADJ
V
Junction Temperature Range
Storage Temperature Range
Maximum Junction Temperature
ESD Withstand Voltage (HBM) (Note 3)
ESD Withstand Voltage (CDM) (Note 4)
Tj
-40 to +150
-55 to +150
150
°C
°C
°C
V
Tstg
Tjmax
VESD_HBM
VESD_CDM
±2000
±750
V
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance and power dissipation taken into
consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Do not exceed Tjmax.
(Note 2) The start-up orders of input voltage (VIN) and the VEN do not influence if the voltage is within the operation power supply voltage range.
(Note 3) ESD susceptibility Human Body Model “HBM”; base on ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF).
(Note 4) ESD susceptibility Charged Device Model “CDM”; base on AEC-Q100-011.
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BDL00A5NUF-C BDL00A5EFJ-C
Thermal Resistance
Thermal Resistance (Typ) (Note 1)
Parameter
Symbol
Unit
1s (Note 3)
2s2p (Note 4)
VSON10FV3030
Junction to Ambient
Junction to Top Characterization Parameter (Note 2)
θJA
168.2
20
46.9
9
°C/W
°C/W
ΨJT
HTSOP-J8
Junction to Ambient
Junction to Top Characterization Parameter (Note 2)
θJA
139.0
18
35.6
7
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A (Still-Air). Using BDL00A5NUF-C, BDL00A5EFJ-C chip.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 µm
Footprints and Traces
Layer Number of
Measurement Board
Thermal Via (Note 5)
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
70 µm
Copper Pattern
Thickness
35 µm
Copper Pattern
Thickness
70 µm
Footprints and Traces
74.2 mm x 74.2 mm
74.2 mm x 74.2 mm
(Note 5) This thermal via connects with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern.
Operating Conditions (-40 °C ≤ Tj ≤ +150 °C)
Parameter
Input Voltage(Note 1)
Symbol
Min
Max
Unit
VIN
VIN Start-Up
VOUT
VEN
VOUT (Max) + ΔVd (Max)
18
-
V
V
Start-up Voltage(Note 2)
Output Voltage
2.4
1
17
18
500
200
-
V
EN Pin Voltage
0
V
Output Current
IOUT
0
mA
kΩ
µF
µF
Feedback Resistor ADJ vs GND
Input Capacitor(Note 3) (Note 4)
Output Capacitor(Note 4)
R2
10
1
CIN
COUT
1
100
Output Capacitor Equivalent Series
Resistance
ESR(COUT
Ta
)
-
5
Ω
Operating Temperature
-40
+125
°C
(Note 1) Minimum Input Voltage must be 2.9 V or more.
Consider that the output voltage would be dropped (Dropout voltage ΔVd) by the output current.
(Note 2) In case of VOUT setting 2.4 V or less, VOUT (Min) = 90 % × VOUT (Typ) with VIN = 2.4 V, IOUT = 0 mA.
(Note 3) If the inductance of power supply line is high, adjust input capacitor value.
(Note 4) Set capacitor value which do not fall below the minimum value. This value needs to consider the temperature characteristics and DC bias characteristics.
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BDL00A5NUF-C BDL00A5EFJ-C
Electrical Characteristics
LDO Function
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = VOUT + 1.0 V (Note 1), VEN = 5 V, IOUT = 0 mA,
CIN = 2.2 µF, COUT = 2.2 µF
VOUT setting = 5 V, R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 45 kΩ (30 kΩ + 15 kΩ)
Typical values are defined at Tj = 25 °C, VIN = 6 V
Limits
Parameter
Symbol
ISHUT
Unit
µA
Conditions
Min
Typ
0
Max
1
-
-
VEN = 0 V, Tj = 25 °C
Shutdown Current
0
5
VEN = 0 V, Tj ≤ 125 °C
Tj = 25 °C
-
-
30
35
45
65
VIN = 6 V, IOUT = 0 mA
Tj ≤ 125 °C
Current Consumption(Note 2)
Reference Voltage
µA
V
ICC
VIN = 6 V, IOUT = 0 mA
VOUT + 1.0 V ≤ VIN ≤ 18 V
(VIN ≥ 2.9 V)
0.735
0.750
0.28
-
0.765
-
VADJ
0.1 mA ≤ IOUT ≤ 500 mA
VOUT = 5 V
-
-
VIN = 4.75 V (VOUT × 0.95)
IOUT = 500 mA
Dropout Voltage
V
ΔVd
VOUT = 2.9 V to 17 V
VIN = VOUT × 0.95
IOUT = 500 mA
0.60
f = 1 kHz, VRipple = 0.1 Vrms
IOUT = 100 mA, VIN = 6 V
Ripple Rejection
Line Regulation
Load Regulation
-
-
65
-
dB
%
R.R.
0.08
0.20
Reg.I
VOUT + 1.0 V ≤ VIN ≤ 18 V (Note 3)
-
-
0.3
0.8
%
Reg.L
0.1 mA ≤ IOUT ≤ 500 mA
VOUT + 1.0 V ≤ VIN ≤ 18 V (Note 3)
VOUT = 0 V
Output Short Current
150
400
mA
IOUT(SHORT)
ADJ Input Current(Note 4)
-
-
100
-
nA
°C
IADJ
VADJ = 1 V
Thermal Shutdown
Temperature
151
175
Tj (TSD)
-
(Note 1) VOUT ≤ 1.9 V, VIN = 2.9 V
(Note 2) It does not contain the current of R1 and R2.
(Note 3) VOUT ≤ 1.9 V, 2.9 V ≤ VIN ≤ 18 V
(Note 4) Not all devices are measured for shipment
Enable Function
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = VOUT + 1.0 V (Note 1), VEN = 5 V, IOUT = 0 mA,
CIN = 2.2 µF, COUT = 2.2 µF
VOUT setting = 5 V, R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 45 kΩ (30 kΩ + 15 kΩ)
Typical values are defined at Tj = 25 °C, VIN = 6 V
Limits
Parameter
Symbol
Unit
Conditions
Min
Typ
-
Max
18
EN ON mode Voltage
EN OFF mode Voltage
EN Bias Current
2
0
-
V
V
VENH
VENL
IEN
-
-
-
-
0.4
5.0
1.7
µA
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BDL00A5NUF-C BDL00A5EFJ-C
Typical Performance Curves 5 V Output
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 6 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 45 kΩ (30 kΩ + 15 kΩ)
Figure 1. Circuit Consumption vs Input Voltage
(5 V Output)
Figure 2. Circuit Consumption vs Junction Temperature
(5 V Output)
Figure 3. Ground Current vs Output Current
(5 V Output)
Figure 4. Output Voltage vs Junction Temperature
(5V Output)
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BDL00A5NUF-C BDL00A5EFJ-C
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 6 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 45 kΩ (30 kΩ + 15 kΩ)
Figure 5. Dropout Voltage vs Output Current
(5 V Output, VIN = 4.75 V)
Figure 6. Ripple Rejection vs Frequency
(5 V Output, VRipple = 0.1 Vrms, IOUT = 100 mA)
Figure 7. Output Voltage vs Input Voltage
(5 V Output)
Figure 8. Output Voltage vs Input Voltage
magnification of Figure 7 at low input voltage
(5 V Output)
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BDL00A5NUF-C BDL00A5EFJ-C
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 6 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 45 kΩ (30 kΩ + 15 kΩ)
Figure 9. Output Voltage vs Input Voltage
magnification of Figure 7 at narrow range output voltage
(5 V Output)
Figure 10. Output Voltage vs Output Current
(5 V Output)
Figure 11. Output Voltage vs Output Current
(5 V Output, Over Current Protection)
Figure 12. Shutdown Current vs. Junction Temperature
(5 V Output)
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BDL00A5NUF-C BDL00A5EFJ-C
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 6 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 45 kΩ (30 kΩ + 15 kΩ)
Figure 13. Reference Voltage vs Junction Temperature
Figure 14. Shutdown Current vs Input Voltage
(VEN = 0 V)
Figure 15. Output Voltage vs EN Input Voltage
Figure 16. EN Input Voltage vs Junction Temperature
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BDL00A5NUF-C BDL00A5EFJ-C
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 6 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 45 kΩ (30 kΩ + 15 kΩ)
Figure 17. EN Bias Current vs EN Input Voltage
Figure 18. EN Bias Current vs Junction Temperature
Figure 19. VOUT Discharge Current vs VOUT Input Voltage
(VEN = 0 V)
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Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 6 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 45 kΩ (30 kΩ + 15 kΩ)
Figure 20. EN Startup Waveform
(5 V Output, IOUT = 1 mA, Tj = +25 °C)
Figure 21. EN Shutdown Waveform
(5 V Output, IOUT = 1 mA, Tj = +25°C)
Figure 22. Load Transient 0.1 mA to 100 mA
(5 V Output, Tj = +25 °C)
Figure 23. Load Transient 0.1 mA to 500 mA
(5 V Output, Tj = +25 °C)
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Typical Performance Curves 3.3 V Output
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 4.3 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 75 kΩ
Figure 24. Circuit Consumption vs Input Voltage
(3.3 V Output)
Figure 25. Circuit Consumption vs Junction Temperature
(3.3 V Output)
Figure 26. Ground Current vs Output Current
(3.3 V Output)
Figure 27. Output Voltage vs Junction Temperature
(3.3 V Output)
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Typical Performance Curves 3.3 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 4.3 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 75 kΩ
Figure 28. Dropout Voltage vs Output Current
(3.3 V Output, VIN = 3.135 V)
Figure 29. Ripple Rejection vs Frequency
(3.3 V Output, VRipple = 0.1 Vrms, IOUT = 100 mA)
Figure 30. Output Voltage vs Input Voltage
(3.3 V Output)
Figure 31. Output Voltage vs Input Voltage
magnification of Figure 30 at low input voltage
(3.3 V Output)
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Typical Performance Curves 3.3 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 4.3 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 75 kΩ
Figure 32. Output Voltage vs Input Voltage
magnification of Figure 30 at narrow range output voltage
(3.3 V Output)
Figure 33. Output Voltage vs Output Current
(3.3 V Output)
Figure 34. Output Voltage vs Output Current
(3.3 V Output)
Figure 35. VOUT Discharge Current vs VOUT Input Voltage
(VEN = 0 V)
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Typical Performance Curves 3.3 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 4.3 V, VEN = 5 V, IOUT = 0 mA, CIN = 2.2 µF, COUT = 2.2 µF
R1 = 255 kΩ (180 kΩ + 75kΩ), R2 = 75 kΩ
Figure 36. EN Startup Waveform
Figure 37. EN Shutdown Waveform
(3.3 V Output, IOUT = 1 mA, Tj = +25°C)
(3.3 V Output, IOUT = 1 mA, Tj = +25°C)
Figure 38. Load Transient 0.1 mA to 100 mA
(3.3 V Output, Tj = +25°C)
Figure 39. Load Transient 0.1 mA to 500 mA
(3.3 V Output, Tj = +25°C)
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Measurement Circuit for Typical Performance Curves
VOUT
ADJ
VOUT
ADJ
VIN
EN
VIN
EN
R1
R2
R1
R2
2.2 μF
2.2 μF
IOUT
IOUT
2.2 μF
2.2 μF
GND
GND
Measurement Setup for
Figure 1 to 3, 14, 24 to 26
Measurement Setup for
Figure 4, 7 to 10, 12, 27, 30 to 33
VIN
EN
VOUT
ADJ
VOUT
ADJ
VIN
EN
R1
R2
R1
R2
Vripple
2.2 μF
2.2 μF
2.2 μF
2.2 μF
2.2 μF
IOUT
IOUT
2.2 μF
2.2 μF
2.2 μF
2.2 μF
2.2 μF
GND
GND
Measurement Setup for
Figure 5, 28
Measurement Setup for
Figure 6, 29
VOUT
ADJ
VOUT
ADJ
VIN
EN
VIN
EN
R1
R2
R1
R2
2.2 μF
2.2 μF
GND
GND
Measurement Setup for
Figure 11, 34
Measurement Setup for
Figure 13
VOUT
ADJ
VOUT
ADJ
VIN
EN
VIN
EN
R1
R2
R1
R2
2.2 μF
IOUT
2.2 μF
GND
GND
Measurement Setup for
Figure 15 to 18
Measurement Setup for
Figure 20, 21, 36, 37
VOUT
ADJ
VOUT
ADJ
VIN
EN
VIN
EN
R1
R2
IOUT
2.2 μF
GND
GND
Measurement Setup for
Figure 22, 23, 38, 39
Measurement Setup for
Figure 19, 35
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Application and Implementation
Notice: The following information is given as a reference or hint for the application and the implementation. Therefore, it does
not guarantee its operation on the specific function, accuracy or external components in the application. In the
application, it shall be designed with sufficient margin by enough understanding about characteristics of the external
components, e.g. capacitor, and also by appropriate verification in the actual operating conditions.
Selection of External Components
Input Pin Capacitor
If the battery is placed far from the regulator or the impedance of the input-side is high, higher capacitance is required for
the input capacitor in order to prevent the voltage-drop at the input line. The input capacitor and its capacitance should be
selected depending on the line impedance which is between the input pin and the smoothing filter circuit of the power
supply. At this time, the capacitance value setting is different each application. Generally, the capacitor with capacitance
value of 1.0 µF (Min) with good high frequency characteristic is recommended for this regulator.
In addition, the consideration should be taken as the output pin capacitor, to prevent an influence to the regulator’s
characteristic from the deviation or the variation of the external capacitor’s characteristic. All output capacitors mentioned
above are recommended to have a good DC bias characteristic and a temperature characteristic (approximately ±15 %,
e.g. X7R, X8R) with being satisfied high absolute maximum voltage rating based on EIA standard. These capacitors should
be placed close to the input pin and mounted on the same board side of the regulator not to be influenced by implement
impedance.
Output Pin Capacitor
The output capacitor is mandatory for the regulator in order to realize stable operation. The output capacitor with
capacitance value ≥ 1.0 µF (Min) and ESR up to 5 Ω (Max) must be required between the output pin and the GND pin.
A proper selection of appropriate both the capacitance value and ESR for the output capacitor can improve the transient
behavior of the regulator and can also keep the stability with better regulation loop. The correlation of the output capacitance
value and ESR is shown in the graph on the next page as the output capacitor’s capacitance value and the stability region
for ESR. As described in this graph, this regulator is designed to be stable with ceramic capacitors as of MLCC, with the
capacitance value from 1.0 µF (Min) to 100 µF (Max) and with ESR value within almost 0 Ω to 5 Ω. The frequency range
of ESR can be generally considered as within about 10 kHz to 100 kHz.
Note that the provided the stable area of the capacitance value and ESR in the graph is obtained under a specific set of
conditions which is based on the measurement result in single IC on our board with a resistive load. In the actual
environment, the stability is affected by wire impedance on the board, input power supply impedance and also loads
impedance. Therefore, note that a careful evaluation of the actual application, the actual usage environment and the actual
conditions should be done to confirm the actual stability of the system.
Generally, in the transient event which is caused by the input voltage fluctuation or the load fluctuation beyond the gain
bandwidth of the regulation loop, the transient response ability of the regulator depends on the capacitance value of the
output capacitor. Basically the capacitance value of ≥ 1.0 µF (Min) for the output capacitor is recommended as shown in
the table on Output Capacitance COUT, ESR Available Area. Using bigger capacitance value can be expected to improve
better the transient response ability in a high frequency. Various types of capacitors can be used for the output capacitor
with high capacity which includes electrolytic capacitor, electro-conductive polymer capacitor and tantalum capacitor. Noted
that, depending on the type of capacitors, its characteristics such as ESR (≤ 5 Ω) absolute value range, a temperature
dependency of capacitance value and increased ESR at cold temperature needs to be taken into consideration. When
using capacitor with large ESR (> 5 Ω), note that ceramic capacitor with 1.0 µF (Min) or higher must be connected in parallel
to keep stability. In this case, the total capacitance should be less than 100 µF (Max).
In addition, the same consideration should be taken as the input pin capacitor, to prevent an influence to the regulator’s
characteristic from the deviation or the variation of the external capacitor’s characteristic. All output capacitors mentioned
above are recommended to have a good DC bias characteristic and a temperature characteristic (approximately ±15 %,
e.g. X7R, X8R) with being satisfied high absolute maximum voltage rating based on EIA standard. These capacitors should
be placed close to the output pin and mounted on the same board side of the regulator not to be influenced by implement
impedance.
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Output Pin Capacitor - continued
Figure 40. Output Capacitance COUT, ESR Available Area
(-40 °C ≤ Tj ≤ +150 °C, 2.9 V ≤ VIN ≤ 18 V, VEN = 5 V, IOUT = 0 mA to 500 mA)
Typical Application
Parameter
Symbol
IOUT
COUT
VIN
Reference Value for Application
IOUT ≤ 500 mA
2.2 µF
VOUT + 1.0 V
2.2 µF
Output Current Range
Output Capacitor
Input Voltage
Input Capacitor (Note 1)
CIN
(Note 1) If the inductance of power supply line is high, adjust input capacitor value.
To avoid any malfunctions by input voltage drop of power supply line, consider to adjust the impedance of power supply line
to small as much as possible.
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Application and Implementation - continued
Surge Voltage Protection for Linear Regulators
The following shows some helpful tips to protect ICs from possible inputting surge voltage which exceeds absolute
maximum ratings.
Positive Surge to the Input
If there is any potential risk that positive surges higher than absolute maximum ratings, (e.g.) 20 V, is applied to the
input, a Zener Diode should be inserted between the VIN pin and the GND to protect the device as shown in Figure
41.
VIN
VOUT
GND
VIN
VOUT
COUT
D1
CIN
Figure 41. Surges Higher than Absolute Maximum Ratings is Applied to the Input
Negative Surge to the Input
If there is any potential risk that negative surges below the absolute maximum ratings, (e.g.) -0.3 V, is applied to the
input, a schottky Diode should be inserted between the VIN and the GND to protect the device as shown in Figure
42.
VIN
VOUT
GND
VIN
VOUT
COUT
D1
CIN
Figure 42. Surges Lower than -0.3 V is Applied to the Input
Reverse Voltage Protection for Linear Regulators
A linear regulator which is one of the integrated circuit (IC) operates normally in the condition that the input voltage is
higher than the output voltage. However, it is possible to happen the abnormal situation in specific conditions which is
the output voltage becomes higher than the input voltage. A reverse polarity connection between the input and the output
might be occurred or a certain inductor component can also cause a polarity reverse conditions. If the countermeasure
is not implemented, it may cause damage to the IC. The following shows some helpful tips to protect ICs from the reverse
voltage occasion.
Protection against Reverse Input/Output Voltage
In the case that MOSFET is used for the pass transistor, a parasitic body diode between the drain-source generally
exists. If the output voltage becomes higher than the input voltage and if its voltage difference exceeds VF of the body
diode, a reverse current flows from the output to the input through the body diode as shown in Figure 43. The current
flows in the parasitic body diode is not limited in the protection circuit because it is the parasitic element, therefore
too much reverse current may cause damage to degrade or destroy the semiconductor elements of the regulator.
IR
VOUT
VIN
Error
AMP.
VREF
Figure43. Reverse Current Path in a MOS Linear Regulator
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Protection against Reverse Input/Output Voltage – continued
An effective solution for this problem is to implement an external bypass diode in order to prevent the reverse current
flow inside the IC as shown in Figure 44. Especially in applications where the output voltage setting is high and a
large output capacitor is connected, be sure to consider countermeasures for large reverse current values. Note that
the bypass diode must be turned on prior to the internal body diode of the IC. This external bypass diode should be
chosen as being lower forward voltage VF than the internal body diode. It should to be selected a diode which has a
rated reverse voltage greater than the IC’s input maximum voltage and also which has a rated forward current greater
than the anticipated reverse current in the actual application.
D1
VIN
VOUT
GND
VIN
VOUT
COUT
CIN
Figure44. Bypass Diode for Reverse Current Diversion
A schottky barrier diode which has a characteristic of low forward voltage (VF) can meet to the requirement for the
external diode to protect the IC from the reverse current. However, it also has a characteristic that the leakage (IR)
caused by the reverse voltage is bigger than other diodes. Therefore, it should be taken into the consideration to
choose it because if IR is large, it may cause increase of the current consumption, or raise of the output voltage in the
light-load current condition. IR characteristic of schottky diode has positive temperature characteristic, which the
details shall be checked with the datasheet of the products, and the careful confirmation of behavior in the actual
application is mandatory.
Even in the condition when the input/output voltage is inverted, if the VIN pin is open as shown in Figure 45, or if the
VIN pin becomes high-impedance condition as designed in the system, it cannot damage or degrade the parasitic
element. It's because a reverse current via the pass transistor becomes extremely low. In this case, therefore, the
protection external diode is not necessary.
ON→OFF
IBIAS
VIN
VOUT
GND
VOUT
COUT
VIN
CIN
Figure45. Open VIN
Protection against Input Reverse Voltage
When the input of the IC is connected to the power supply, accidentally if plus and minus are routed in reverse, or if
there is a possibility that the input may become lower than the GND pin, it may cause to destroy the IC because a
large current passes via the internal electrostatic breakdown prevention diode between the VIN pin and the GND
pin inside the IC as shown in Figure 46.
The simplest solution to avoid this problem is to connect a schottky barrier diode or a rectifier diode in series to the
power supply line as shown in Figure 47. However, it increases a power loss calculated as VF x ICC, and it also causes
the voltage drop by a forward voltage VF at the supply voltage while normal operation.
Generally, since the schottky barrier diode has lower VF, so it contributes to rather smaller power loss than rectifier
diodes. If IC has load currents, the required input current to the IC is also bigger. In this case, this external diode
generates heat more, therefore select a diode with enough margin in power dissipation. On the other hand, a reverse
current passes this diode in the reverse connection condition, however, it is negligible because its small amount.
VIN
VOUT
COUT
GND
VIN
VOUT
D1
-
VIN
VOUT
GND
VOUT
COUT
VIN
GND
CIN
CIN
+
GND
Figure46. Current Path in Reverse Input Connection
Figure47. Protection against Reverse Polarity 1
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Protection against Input Reverse Voltage - continued
Figure 48 shows a circuit in which a P-channel MOSFET is connected in series to the power. The body diode (parasitic
element) is located in the drain-source junction area of the MOSFET. The drop voltage in a forward connection is
calculated from the on state resistance of the MOSFET and the output current IO. It is smaller than the drop voltage
by the diode as shown in Figure 48 and results in less of a power loss. No current flows in a reverse connection where
the MOSFET remains off in Figure 48.
If the gate-source voltage exceeds maximum rating of MOSFET gate-source junction with derating curve in
consideration, reduce the gate-source junction voltage by connecting resistor voltage divider as shown in Figure 49.
Q1
VIN
Q1
VOUT
COUT
VIN
VOUT
GND
VIN
VOUT
COUT
VIN
VOUT
GND
R1
CIN
R2
CIN
Figure48. Protection against Reverse Polarity 2
Figure 49. Protection against Reverse Polarity 3
Protection against Reverse Output Voltage when Output Connect to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground at the
moment that the output voltage is turned off. IC integrates ESD protection diodes between the IC output and ground
pins. A large current may flow in such condition finally resulting on destruction of the IC. To prevent this situation,
connect a schottky barrier diode in parallel to the integrated diodes as shown in Figure 50.
Further, if a long wire is in use for the connection between the output pin of the IC and the load, confirm that the
negative voltage is not generated at the VOUT pin when the output voltage is turned off by observation of the
waveform on an oscilloscope, since it is possible that the load becomes inductive. An additional diode is required for
a motor load that is affected by its counter electromotive force, as it produces an electrical current in a similar way.
VOUT
VIN
VIN
VOUT
GND
D1
CIN
XLL
COUT
GND
GND
Figure 50. Current Path in Inductive Load (Output: Off)
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Power Dissipation
■VSON10FV3030
(1) : 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR-4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Top copper foil: ROHM recommended footprint
+ wiring to measure, 70 µm. copper.
(2) : 4-layer PCB
(Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm)
Board material: FR-4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Top copper foil: ROHM recommended footprint
+ wiring to measure, 70 µm. copper.
2 inner layers copper foil area of PCB:
74.2 mm x 74.2 mm, 35 µm. copper.
Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm, 70 µm. copper.
Condition (1) : θJA = 168.2 °C/W, ΨJT (top center) = 20 °C/W
Condition (2) : θJA = 46.9 °C/W, ΨJT (top center) = 9 °C/W
Figure 51. Power Dissipation Graph (VSON10FV3030)
■HTSOP-J8
(1) : 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR-4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Top copper foil: ROHM recommended footprint
+ wiring to measure, 70 µm. copper.
(2) : 4-layer PCB
(Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm)
Board material: FR-4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Top copper foil: ROHM recommended footprint
+ wiring to measure, 70 µm. copper.
2 inner layers copper foil area of PCB:
74.2 mm x 74.2 mm, 35 µm. copper.
Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm, 70 µm. copper.
Condition (1) : θJA = 139.0 °C/W, ΨJT (top center) = 18 °C/W
Condition (2) : θJA = 35.6 °C/W, ΨJT (top center) = 7 °C/W
Figure 52. Power Dissipation Graph (HTSOP-J8)
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Thermal Design
This product exposes a frame on the back side of the package for thermal efficiency improvement. The power consumption
of the IC is decided by the dropout voltage condition, the load current and the current consumption. Refer to power dissipation
curves illustrated in Figure 51 and Figure 52 when using the IC in an environment of Ta ≥ 25 °C. Even if the ambient
temperature Ta is at 25 °C, chip junction temperature (Tj) can be very high depending on the input voltage and the load
current. Consider the design to be Tj ≤ Tjmax = 150 °C in whole operating temperature range.
Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase
of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on
recommended PCB and measurement condition by JEDEC standard. Therefore, need to be careful because it might be
different from the actual use condition. Verify the application and allow sufficient margins in the thermal design by the following
method to calculate the junction temperature Tj. Tj can be calculated by either of the two following methods.
1. The following method is used to calculate the junction temperature Tj with ambient temperature Ta.
ꢁ푗 = ꢁ푎 + 푃퐶 × 휃퐽퐴 [°C]
Where:
Tj
is the Junction Temperature
Ta is the Ambient Temperature
is the Power Consumption
PC
θJA is the Thermal Resistance (Junction to Ambient)
2. The following method is also used to calculate the junction temperature Tj with top center of case’s (mold) temperature TT.
ꢁ푗 = ꢁ푇 + 푃퐶 × 훹 [°C]
퐽푇
Where:
Tj
TT
PC
is the Junction Temperature
is the Top Center of Case’s (mold) Temperature
is the Power consumption
ΨJT is the Thermal Resistance (Junction to Top Center of Case)
3. The following method is used to calculate the power consumption Pc (W).
푃푐 = ꢂ푉 − 푉푂푈푇ꢃ × ꢄ푂푈푇 + 푉 × ꢄ퐶퐶 [W]
퐼푁
퐼푁
Where:
PC
is the Power Consumption
VIN is the Input Voltage
VOUT is the Output Voltage
IOUT is the Load Current
ICC is the Current Consumption
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Thermal Design – continued
Calculation Example (VSON10FV3030)
If VIN = 6.0 V, VOUT = 5.0 V, IOUT = 250 mA, ICC = 104 µA (the Current Consumption at IOUT = 250 mA), the power
consumption Pc can be calculated as follows:
푃퐶 = ꢂ푉 − 푉푂푈푇ꢃ × ꢄ푂푈푇 + 푉 × ꢄ퐶퐶
퐼푁
퐼푁
ꢂ
ꢃ
= 6.0 푉 – 5.0 푉 × ꢅ50 푚ꢆ + 6.0 푉 × ꢀ04 휇ꢆ
= 0.ꢅ5 푊
At the maximum ambient temperature Tamax = 85 °C,
the thermal impedance (Junction to Ambient) θJA = 46.9 °C/W (4-layer PCB)
ꢁ푗 = ꢁ푎푚푎푥 + 푃퐶 × 휃퐽퐴
= 85 °ꢇ + 0.ꢅ5 푊 × 46.9 °ꢇ/푊
= 96.7 °ꢇ
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 20 °C/W (1-layer PCB)
ꢁ푗 = ꢁ푇 + 푃퐶 × 훹
퐽푇
= ꢀ00 °ꢇ + 0.ꢅ5 푊 × ꢅ0 °ꢇ/푊
= ꢀ05.0 °ꢇ
If it is difficult to ensure the margin by the calculations above, it is recommended to expand the copper foil area of the
board, increasing the layer and thermal via between thermal land pad for optimum thermal performance.
Calculation Example (HTSOP-J8)
If VIN = 6.0 V, VOUT = 5.0 V, IOUT = 250 mA, ICC = 104 µA (the Current Consumption at IOUT = 250 mA), the power
consumption Pc can be calculated as follows:
푃퐶 = ꢂ푉 − 푉푂푈푇ꢃ × ꢄ푂푈푇 + 푉 × ꢄ퐶퐶
퐼푁
퐼푁
ꢂ
ꢃ
= 6.0 푉 – 5.0 푉 × ꢅ50 푚ꢆ + 6.0 푉 × ꢀ04 휇ꢆ
= 0.ꢅ5 푊
At the maximum ambient temperature Tamax = 85 °C,
the thermal impedance (Junction to Ambient) θJA = 35.6 °C/W (4-layer PCB)
ꢁ푗 = ꢁ푎푚푎푥 + 푃퐶 × 휃퐽퐴
= 85 °ꢇ + 0.ꢅ5 푊 × 35.6 °ꢇ/푊
= 93.9 °ꢇ
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 18 °C/W (1-layer PCB)
ꢁ푗 = ꢁ푇 + 푃퐶 × 훹
퐽푇
= ꢀ00 °ꢇ + 0.ꢅ5 푊 × ꢀ8 °ꢇ/푊
= ꢀ04.5 °ꢇ
If it is difficult to ensure the margin by the calculations above, it is recommended to expand the copper foil area of the
board, increasing the layer and thermal via between thermal land pad for optimum thermal performance.
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I/O Equivalence Circuit
VIN Pin
EN Pin(Note 1)
VIN
EN
0.3 MΩ
1.3 MΩ
10 kΩ
Internal
Circuit
1.35 MΩ
ADJ Pin(Note 1)
VOUT Pin(Note 1)
VIN
VIN
VIN
1 kΩ
100 Ω
100 Ω
15 kΩ
500 kΩ
5 MΩ
VOUT
ADJ
8.4 kΩ
4 kΩ
(Note 1) Resistance value is Typical.
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Thermal Consideration
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin
should be allowed in the thermal design. On the reverse side of the package this product has an exposed heat pad for
improving the heat dissipation. The amount of heat generation depends on the voltage difference between the input
and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat
does not exceed the Pd rating. If Junction temperature is over Tjmax (=150 °C), IC characteristics may be worse due
to rising chip temperature. Heat resistance in specification is measurement under PCB condition and environment
recommended in JEDEC. Ensure that heat resistance in specification is different from actual environment.
8.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example, (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 53. Example of Monolithic IC Structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Thermal Shutdown Protection Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
15. Enable Pin
The EN pin is for controlling ON/OFF the output voltage. Do not make voltage level of chip enable keep floating level,
or between VENH and VENL. Otherwise, the output voltage would be unstable or indefinite.
16. Functional Safety
“ISO 26262 Process Compliant to Support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet
“Functional Safety Supportive Automotive Products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the
functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
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Ordering Information
B D L
x
x A 5
x
x
x
-
C
x
x
Output
Voltage
00:
Output Current Package
Product Rank
C: for Automotive
Packaging and Forming
NUF: VSON10FV3030
EFJ: HTSOP-J8
A5: 500 mA
Adjustable
Specification
E2: Embossed Tape and Reel
Lineup
Output Current
Output Voltage
Adjustable
Package
Ordering
Capability
VSON10FV3030
HTSOP-J8
BDL00A5NUF-CE2
BDL00A5EFJ-CE2
500 mA
Marking Diagrams
BDL00A5NUF-C
VSON10FV3030 (TOP VIEW)
Part Number Marking
D L 0
0 A 5
LOT Number
Pin 1 Mark
BDL00A5EFJ-C
HTSOP-J8 (TOP VIEW)
Part Number Marking
D L 0 0 A 5
LOT Number
Pin 1 Mark
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Daattaasshheeeett
BDL00A5NUF-C BDL00A5EFJ-C
Physical Dimension and Packing Information
Package Name
VSON10FV3030
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Physical Dimension and Packing Information – continued
Package Name
HTSOP-J8
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Revision History
Date
Revision
001
Changes
05.Dec.2022
New Release
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
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Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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