BH1749NUC_技术文档

Datasheet

Ambient Light Sensor IC Series

Digital 16bit Serial Output Type

Color Sensor IC

BH1749NUC

General Description

Key Specifications

BH1749NUC is a digital color sensor IC with I²C bus

interface. This IC senses Red, Green, Blue (RGB) and

Infrared and converts them to digital values. The high

sensitivity, wide dynamic range and excellent Ircut

characteristics make it possible for this IC to obtain the

accurate illuminance and color temperature of ambient

light. It is ideal for adjusting LCD backlight of TV, mobile

phone and tablet PC.

■ VCC Voltage Range:

2.3 V to 3.6 V

80 klx (Typ)

190 μA (Typ)

0.8 μA (Typ)

■ Illuminance Detection Range^{(Note 1)}

■ Current Consumption:

:

■ Power Down Current:

■ Operating Temperature Range:

(Note 1) White LED is used.

-40 °C to +85 °C

Package(s)

WSON008X2120

W(Typ) x D(Typ) x H(Max)

2.10 mm x 2.00 mm x 0.6 mm

Features

 Built-in Ircut Filter

 Rejecting 50 Hz / 60 Hz Light Noise

 I²C Bus Interface (f/s mode support)

 It is possible to select 2 type of I²C bus slave address.

 Correspond to 1.8 V Logic Interface

 Resolution 0.0125 lx/count (Typ)

(In highest gain and longest measurement time setting)

Applications

Mobile Phone, Tablet PC, Note PC, Digital Camera

Portable Game Machine, LCD TV

WSON008X2120

Typical Application Circuits

0.1 μA

VCC

PD

ADC

Micro

Controller

PD

SDA

SCL

INT

ADC Logic

+

or

I²C Interface

+

ADC

PD

Baseband

Processor

INT Interface

ADDR

TEST

OSC

POR

GND

○Product structure：Silicon monolithic integrated circuit.

○This product does not include laser transmitter.

○This product has no designed protection against radioactive rays.

○This product does not include optical load.

○This product includes Photo detector, ( Photo Diode ) inside of it.

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Pin Configuration

TOP VIEW

ADDR

VCC

NC

1

2

3

8

7

INT

SDA

GND

6

5

4

TEST

SCL

Pin Description

Pin No.

Pin Name

Function

1

2

3

4

5

6

7

8

ADDR

VCC

GND

TEST

SCL

SDA

INT

I²C bus slave address selector

Power supply^{(Note 1)}

Ground

Test pin (Connect to GND)

I²C bus serial clock

I²C bus serial data

Interrupt

NC

Non connect

(Note 1) Dispose a bypass capacitor as close as possible to the IC

Block Diagram

VCC

ADC

PD

SDA

SCL

INT

ADC Logic

+

I²C Interface

ADC

+

INT Interface

ADDR

TEST

OSC

POR

GND

Description of Blocks

・IRCUT FILTER

Infrared cut filter

・RED, GREEN, BLUE, IR

Red, Green, Blue, Infrared pass filter

・PD

Photodiode

・ADC

Analog-to-Digital Converter for obtaining 16bit digital data.

・ADC Logic + I²C Interface + INT Interface

ADC control logic and I/F logic

・OSC

Clock generator for internal logic

・POR

Power ON Reset. All registers are reset after VCC is supplied.

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Absolute Maximum Ratings (Ta=25 °C)

Parameter

Supply Voltage

Symbol

V_{CC_MR}

V_{IN1_MR}

Rating

Unit

4.5

V

Input Voltage 1 [INT,SCL,SDA]

Input Voltage 2 [ADDR]

-0.3 to +4.5

-0.3 to (V_CC+0.3) or +4.5

whichever is less

V_{IN2_MR}

V

Storage Temperature Range

Tstg

-40 to +100

°C

Maximum Junction Temperature

Tjmax

100

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

WSON008X2120

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

384.2

82

54.2

12

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A(Still-Air).

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70 μm

Thermal Via^{(Note 5)}

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

70 μm

(Note 5) This thermal via connects with the copper pattern of all layers.

Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

Operating Temperature

Supply Voltage

Topr

V_CC

V_IN

-40

2.3

0

+25

2.5

-

+85

3.6

°C

V

Input Voltage [INT,SCL,SDA]

V

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Electrical Characteristics (Unless otherwise specified, VCC=2.5 V, Ta=25 °C, 35 ms mode, x1 gain mode)

Parameter

Current Consumption

Power Down Current

Symbol

I_CC1

Min

Typ

190

0.8

Max

295

1.5

Unit

µA

Conditions

Ev=100 lx^{(Note 1)}

-

Power down mode

No input light

I_CC2

µA

Red Data Count Value

Green Data Count Value

Blue Data Count Value

Ir Data Count Value

D_RED

D_GREEN

D_BLUE

D_IR

60

71

99

70

25

-

82

114

81

count Ev=20 µW/cm^{2(Note 2)}

count Ev=20 µW/cm^{2(Note 3)}

count Ev=20 µW/cm^{2(Note 4)}

count Ev=20 µW/cm^{2(Note 5)}

count No input light

ms

84

59

18

32

Dark Count Value

S_{0_0}

-

3

Measurement Time

t_MT

-

35

-

50

INT Output ‘L’ Voltage

SCL SDA Input ‘H’ Voltage

SCL SDA Input ‘L’ Voltage

SDA Output ‘L’ Voltage

ADDR Input ‘H’ Voltage

ADDR Input ‘L’ Voltage

V_INTL

V_IH

0

0.4

-

V

I_OL=3 mA

1.26

-

V_IL

-

0.54

0.4

-

V_OL

0

-

I_OL=3 mA

V_ADDRH

V_ADDRL

0.7*V_CC

-

0.3*V_CC

(Note 1) White LED is used.

(Note 2) Red LED is used.

(Note 3) Green LED is used.

(Note 4) Blue LED is used.

(Note 5) Infrared LED is used.

Typical Performance Curves

Wavelength [nm]

Figure 1. Ratio vs Wavelength

(Spectral Response)

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I²C Bus Timing Characteristics (Unless otherwise specified VCC=2.5 V, Ta=25 °C)

P: STOP

S: Repeated START

S: START

V_IH

V_IL

V_IH

V_IL

SDA

SCL

V_IL

t_BUF

t_HD;STA

t_SU;DAT

V_IH

V_IL

V_IH

V_IL

t_HIGH

t_LOW

t_HD;STA

t_HD;DAT

t_SU;STA

t_SU;STO

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

SCL Clock Frequency

‘L’ Period of the SCL Clock

‘H’ Period of the SCL Clock

Setup Time for Repeated START

Hold Time for START

Data Setup Time

f_SCL

t_LOW

0

-

400

kHz

µs

ns

µs

1.3

0.6

100

0

-

t_HIGH

t_SU;STA

t_HD;STA

t_SU;DAT

t_HD;DAT

t_SU;STO

t_BUF

Data Hold Time

Setup Time for STOP

0.6

1.3

Bus Free Time between STOP and START

I²C Bus Communication

1. Write Format

(1) Indicate register address

W

0

S

Slave Address

ACK

Register Address

ACK

P

(2) Write data after indicating register address

W

S

Slave Address

ACK

0

Data specified at register

address field

Data specified at register

address field + N

ACK

・・・

ACK

P

2. Read Format

(1) Read data after indicating register address (Master issues restart condition)

W

0

S

Slave Address

ACK

Register Address

ACK

R

1

Data specified at register

address field

Data specified at register

address field + 1

Data specified at register

address field + N

ACK

・・・

ACK

NACK

P

(2) Read data from the specified register

R

1

Data specified at register

address field

S

Slave Address

ACK

Data specified at register

address field + 1

Data specified at register

address field + N

ACK

・・・

ACK

from master to slave

from slave to master

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I²C Bus Slave Address

The slave address is selectable from 2 addresses by ADDR pin.

ADDR

Slave Address

0111000

L

H

0111001

Register MAP^{(Note 1)}

Register

Address

R/W

RW

D7

D6

D5

D4

D3

D2

D1

D0

Register Name

SYSTEM_CONTROL

MODE_CONTROL1

MODE_CONTROL2

SW

INT

0x40

PART ID [5:0]

RESET RESET

MEASUREMENT

MODE [2:0]

0x41

0x42

0

IR GAIN [1:0]

RGB GAIN [1:0]

RGB_

0

VALID

0

EN

0x50

0x51

0x52

0x53

0x54

0x55

0x56

0x57

0x58

0x59

0x5A

0x5B

R

RED_DATA [7:0]

RED_DATA [15:8]

GREEN_DATA [7:0]

GREEN_DATA [15:8]

BLUE_DATA [7:0]

BLUE_DATA [15:8]

RESERVED

RED_DATA

GREEN_DATA

BLUE_DATA

RESERVED

IR_DATA [7:0]

IR_DATA

IR_DATA [15:8]

GREEN2_DATA [7:0]

GREEN2_DATA [15:8]

GREEN2_DATA

INT

STATUS

INT

ENABLE

PERSISTENCE

[1:0]

0x60

0x61

INTERRUPT

RW

0

INT SOURCE [1:0]

0

PERSISTENCE

0

0x62

0x63

0x64

0x65

0x92

RW

R

TH_HIGH [7:0]

TH_HIGH [15:8]

TH_HIGH

TH_LOW [7:0]

TH_LOW

TH_LOW [15:8]

MANUFACTURER_ID [7:0]

MANUFACTURER_ID

(Note 1) Do not write any commands to other addresses except above. Do not write ‘1’ to the field in which value is ‘0’ in above table.

(0x40) SYSTEM_CONTROL

Fields

Function

All registers are reset and this IC is in power down state by software reset.

0 : Software reset is not done.

SW RESET

1 : Software reset is done.

0 : The INT pin status is not changed.

1 : Make the INT Pin status inactive (High impedance)

INT RESET

PART ID

Part ID 0x0D (Read only register)

default value 0x0D

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Register MAP - continued

( 0x41 ) MODE_CONTROL1

Fields

Function

Gain setting for IR Data.

00 : Forbidden to use

01 : x1 gain mode

IR GAIN

10 : Forbidden to use

11 : x32 gain mode

Gain setting for RED, GREEN and BLUE Data.

00 : Forbidden to use

RGB GAIN

01 : x1 gain mode

10 : Forbidden to use

11 : x32 gain mode

000 : Forbidden to use

001 : Forbidden to use

010 : 120 ms mode

011 : 240 ms mode

100 : Forbidden to use

101 : 35ms mode

MEASUREMENT MODE

110 : Forbidden to use

111 : Forbidden to use

Measurement time is specified in Electrical Characteristics.

default value 0x00

( 0x42 ) MODE_CONTROL2

Fields

Function

VALID

Refer to “About VALID Register”

0 : Measurement is inactive and becomes power down.

1 : Measurement is active.

RGB_EN

default value 0x00

default value 0x0000

( 0x50 / 0x51 ) RED_DATA

Fields

Function

RED_DATA [15:0]

RED measurement result

( 0x52 / 0x53 ) GREEN_DATA

Fields

Function

GREEN_DATA [15:0]

GREEN measurement result

( 0x54 / 0x55 ) BLUE_DATA

Fields

Function

BLUE_DATA [15:0]

BLUE measurement result

default value 0x0000

( 0x56 / 0x57 ) RESERVED

( 0x58 / 0x59 ) IR_DATA

Fields

Function

IR_DATA [15:0]

IR measurement result

default value 0x0000

( 0x5A / 0x5B ) GREEN2_DATA

Fields

Function

GREEN2_DATA [15:0]

GREEN2 measurement result

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Register MAP - continued

( 0x60 ) INTERRUPT

Fields

Function

Interrupt status output. (Read only register)

0 : Interrupt signal is inactive

INT STATUS

1 : Interrupt signal is active

INT source select

00 : Red channel

01 : Green channel

10 : Blue channel

11 : Forbidden to use

INT SOURCE

INT ENABLE

0 : The INT pin disable.

1 : The INT pin enable.

default value 0x00

( 0x61 ) PERSISTENCE

Fields

Function

Interrupt persistence setting.

00 : Interrupt status becomes active at each measurement end.

01 : Interrupt status is updated at each measurement end.

PERSISTENCE

10 : Interrupt status is updated if 4 consecutive threshold judgments are the same.

11 : Interrupt status is updated if 8 consecutive threshold judgments are the same.

default value 0x01

( 0x62 / 0x63 ) TH_HIGH

Fields

Function

TH_ HIGH [15:0]

Interrupt threshold upper level

Interrupt threshold lower level

MANUFACTURER ID : 0xE0

default value 0xFFFF

default value 0x0000

( 0x64 / 0x65 ) TH_LOW

Fields

TH_LOW [15:0]

( 0x92 ) MANUFACTURER ID

Fields

MANUFACTURER ID

About VALID Register

VALID register is measurement data update flag. It turns to ‘1’, when measurement data is updated.

It is cleared and turns to ‘0’ by changing register setup or reading VALID register.

(Setting change target registers are 0x41, 0x42, 0x60, 0x61, 0x62, 0x63, 0x64, 0x65.)

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Interrupt Function

Interrupt function compares the measurement result selected from RGB data by INT SOURCE register to preset interrupt

threshold level. If measurement result is outside of two threshold level, it outputs ‘L’. This IC uses two threshold level (upper

and lower). Interrupt threshold is defined at TH_HIGH register and TH_LOW register.

The INT pin is inactive (High impedance) when VCC is supplied.

To clear interrupt

1) Writing INT reset command

2) Reading INTERRUPT register

3) Writing to the registers (0x41, 0x42, 0x60, 0x61, 0x62, 0x63, 0x64, 0x65)

4) Writing software reset command

Ex: Interrupt behavior example

Interrupt becomes inactive.

Ex: Master writes “Interrupt reset” command.

INT Pin

persistence=1

H

L

H

persistence=4

L

DATA

(selected from RGB)

Interrupt threshold upper level

Sequential measurement results

Interrupt threshold lower level

time

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Power Supply Sequence

ALL register of this IC is reset when supplying VCC.

There are some notes about power up and down sequence as shown below.

(1) Power ON Time: t₁

2 ms period is necessary to activate this IC after VCC becomes more than or equal to 2.3 V from less than or equal to

0.4 V.

(2) Power OFF time: t₂

The period when VCC is less than or equal to 0.4 V is necessary for more than or equal to 1 ms before supplying power

to this IC.

2.3 V

VCC

0.4 V

t₁

t₂

This IC

Active^{(Note 1)}

Undefined Behavior

Active

(Note 1) ”Active” state is that this IC works and accepts I²C bus access correctly.

Optical Design for the Device

Top View

2.00 mm

1.00 mm

0.41 mm

1.05 mm

2.10 mm

PD area;(0.60 mm x 0.60 mm)

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I/O Equivalence Circuit

Pin Name

Equivalence Circuit

VCC

ADDR

VCC

TEST

SCL

SDA

INT

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 2. Example of monolithic IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

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Ordering Information

B H 1 7 4 9 N U C -

E 2

Part Number

Package

Packaging and forming specification

NUC : WSON008X2120 E2: Embossed tape and reel

Marking Diagram

WSON008X2120(TOP VIEW)

Part Number Marking

PIN 1 MARK

A

H

LOT Number

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Physical Dimension and Packing Information

Package Name

WSON008X2120

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Revision History

Date

Revision

Changes

12.Sep.2017

20.Dec.2017

001

002

New Release

VALID function addition.

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BH1749NUC
厂家：	ROHM
描述：	BH1749NUC是适用于I²C bus接口的数字颜色传感器IC。检测光的色彩模式(RGB)和红外光，将其转换为数字数据。具有高灵敏度、大检测范围、优异的红外光去除特性，因此可轻松、高精度地获取环境光线的照度和颜色温度。适用于根据环境光的照度、颜色温度调整TV、手机、平板电脑等液晶背光的应用。手机电脑电视传感器
文件：	总19页 (文件大小：1587K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BH1749NUC [ROHM]

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