BH6174GUL [ROHM]

Power Supply Support Circuit, Adjustable, 7 Channel, PBGA25, WLCSP-25;


型号：	BH6174GUL
厂家：	ROHM
描述：	Power Supply Support Circuit, Adjustable, 7 Channel, PBGA25, WLCSP-25
文件：	总5页 (文件大小：148K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1/4

Structure

Product

Silicon Monolithic Integrated Circuit

Power Management LSI for MultiMedia LSI on Cellular

Type

BH6174GUL

・2ch 600mA, high efficiency Step-down Converter. (16 steps adjustable VO by I C)

Functions

・5-ch 300mA, CMOS-type LDOs. Power-Save mode supported. (16 steps adjustable VO by I C)

・LDO and Step-down converter Power ON/OFF control enabled by I2C interface or external pin

・I C compatible Interface. (Device address is “1001111”)

・Discharge resistance selectable for power-down sequence ramp speed control

・Wafer Level CSP package(2.8mm×2.8mm) for space-constrained applications

・0.5mm thin package to meet ultra-thin design requirements

・Step-down Converter output loop back available for LDO power supply (LDO3,4)

Absolute Maximum Ratings（Ta=25C）

Parameter

Symbol

Rating

6.0

Unit

Maximum Supply Voltage (VBAT1,VBAT2, PBAT)

Maximum Supply Voltage (PBAT1, PBAT2)

Maximum Supply Voltage (VIN34)

Maximum Supply Voltage (DVDD)

VBATMAX

VPBATMAX

V34MAX

6.0

VDVDDMAX

4.5

Maximum Input Voltage 1

(LX1, FB1, LX2, FB2, OUT1, OUT2, OUT3, OUT4, OUT5,

VINMAX1

VBAT + 0.3

Maximum Input Voltage 2(NRST, CLK, DATA)

VINMAX2

DVDD + 0.3

960*¹

℃

Power Dissipation

Operating Temperature Range

Storage Temperature Range

Topr

-35 ～+85

-55 ～ +125

Tstg

℃

*1 This is the allowable loss of when it is mounted on a ROHM specification board 50mm×58mm.

When a substrate is implemented, the allowable loss varies from the size and material of the substrate.

To use at temperature higher than 25C, derate 9.6mV per 1C.

Recommended Operating Conditions (Ta=25C)

Parameter

Symbol

VBAT

Range

Unit

VBAT1, 2 Voltage

PBAT1, 2 Voltage

VIN34 Voltage

DVDD Voltage

2.60 ~ 5.50

1.70 ~ 5.50

1.70 ~ 3.60

VPBAT

V34

VDVDD

*2 Whenever the VBAT or PBAT or VIN34 voltage is under the LDO or SWREG output voltage,

the LDO and SWREG output is not guaranteed to meet its published specifications.

*3 VIN34 Power Supply can be externally connected to the VBAT and PBAT Power Supply when necessary.

*4 The DVDD Voltage must be under the Battery Voltage VBAT, PBAT at any times.

* This product is not especially designed to be protected from radioactivity.

REV. B

2/4

● Overview Dimensions

● Ball Descriptions

1PIN MARK

Lot No.

Ball No.

PIN Name

DATA

CLK

VBAT1

VIN34

PBAT1

LX1

H6174

PGND1

FB1

NRST

OUT1

OUT2

OUT3

OUT4

OUT5

REFC

ENALL

PBAT2

LX2

2.8±0.05

0.06

25-φ0.25±0.05

0.05 A B

PGND2

FB2

DVDD

GND

TEST1

TEST2

VBAT2

(φ0.15) INDEX POST

（UNIT : mm）

0.4±0.05

P=0.5×4

● Block Diagram

DVDD

DATA

CLK

I2C IF

LDO1

PBAT1

LX1

NRST

SWREG1

0.80-2.40V

init 1.00V

OUT1

1.00-3.30V

5mA/300mA

300mA

PGND1

FB1

ENALL

OUT2

init 2.60V

300mA

600mA

init 1.01V

LDO2

1.00-3.30V

5mA/300mA

PBAT2

VIN34

OUT3

init 3.00V

300mA

LX2

SWREG2

0.80-2.40V

LDO3

1.00-3.30V

5mA/300mA

PGND2

FB2

init 1.80V

300mA

600mA

init 1.00V

OUT4

OUT5

LDO4

1.00-3.30V

5mA/300mA

REFC

REF

TSD

init 3.30V

300mA

LDO5

1.00-3.30V

5mA/300mA

TEST1

TEST2

REV. B

3/4

Electrical Characteristics (Unless otherwise specified, Ta=25C, VBAT1=VBAT2=PBAT=VIN34=3.6V, DVDD=2.6V)

Parameter

Symbol

Min.

Typ.

Max.

Unit

Condition

●Circuit Current

LDO1~5=OFF, SWREG1, 2=OFF,

NRST=L, DVDD=0V

VIN34=VBAT external connection

LDO1~5=OFF, SWREG1, 2=OFF,

NRST=H, DVDD=2.6V

VBAT Circuit Current 1 (OFF)

IQVB1

IQVB2

0.05

0.1

0.4

0.7

0.8

1.4

A

VBAT Circuit Current 2 (Standby)

VIN34=VBAT external connection

LDO1~5=ON (no load, initial voltage)

SWREG1,2=ON (no load、initial voltage)

NRST=H, DVDD=2.6V

VIN34=VBAT external connection

SWREG1, 2 PWM/PFMAUTO MODE

VBAT Circuit Current 3 (Active)

IQVB3

IQVD1

110

220

330

A

●DVDD Quiescent Current

DVDD Quiescent Current 1 (OFF)

LDO1~5=OFF, SWREG1, 2=OFF,

NRST=L, DVDD=2.6V

VIN34=VBAT external connection

Electrical Characteristics (Unless otherwise specified, Ta=25C, VBAT1=VBAT2=PBAT=VIN34=3.6V, DVDD=2.6V)

Parameter

Symbol

Min.

Typ.

Max.

Unit

Condition

●Logic pin character

DVDD*

0.7

DVDD+

0.3

Input “H” level

VIH1

Pin voltage: DVDD

NRST

(CMOS input)

DVDD*

0.3

Input “L” level

“H” Input current

Input “H” level

VIL1

IIC1

-0.3

0.3

A

Pin voltage: 0 V

Pin voltage: 2.6V

VBAT+

0.3

VIH2

1.44

ENALL

(NMOS input)

Input “L” level

VIL2

IIC2

-0.3

-1

0.4

Input leak current

A

●Digital characteristics (Digital pins: CLK and DATA)

DVDD*

0.7

DVDD+

0.3

Input "H" level

VIH3

DVDD*

0.3

A

Input "L" level

Input leak current

VIL3

IIC3

-0.3

-1

Pin voltage: DVDD

IOL=6mA

DATAoutput "L" level voltage

VOL

0.4

●SWREGs

SWREG1

SWREG2

Output Voltage

VOSW1I

VOSW2I

0.9797

0.970

1.01

1.00

1.0403

1.030

initial value, Io=100mA, PWM MODE

●LDOs

LDO1

LDO2

LDO3

LDO4

LDO5

Output voltage

VOM1

VOM2

VOM3

VOM4

VOM5

0.97

2.522

2.91

1.764

3.201

1.00

2.60

3.00

1.80

3.30

1.03

2.678

3.09

1.836

3.399

initial value, Io=5mA

REV. B

4/4

●Use-related Cautions

(1)Absolute maximum ratings

If applied voltage (VBAT1, VBAT2, PBAT1, PBAT2, VIN34, DVDD), operating temperature range (Toper), or other absolute maximum ratings are exceeded, there is a

risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded are assumed,

consider applying fuses or other physical safety measures.

(2) Recommended operating range

This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it is those that are guaranteed under the

conditions for each parameter. Even when these are within the recommended operating range, voltage and temperature characteristics are indicated.

(3) Reverse connection of power supply connector

There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse connection, take measures such as externally

placing a diode between the power supply and the power supply pin of the LSI.

(4) Power supply lines

In the design of the board pattern, make power supply and GND line wiring low impedance.

When doing so, although the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and analog power supply

pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns. Similarly take pattern design into account for

GND lines as well.

Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND pins, when using electrolytic capacitors,

determine constants upon adequately confirming that capacitance loss occurring at low temperatures is not a problem for various characteristics of the capacitors used.

(5) GND voltage

Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm that there are no pins for which the potential

becomes less than a GND by actually including transition phenomena.

(6) Shorts between pins and misinstallation

When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is installed erroneously, there is a risk of LSI

damage. There also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or GND.

(7) Operation in strong magnetic fields

Be careful when using the LSI in a strong magnetic field, since it may malfunction.

(8) Inspection in set board

When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to low impedance LSI pins, be sure to discharge for each

process. Moreover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and remove

it after turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the assembly process and take appropriate care in

transport and storage.

(9) Input pins

Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements operate, they give rise to interference with circuit

operation and may be the cause of malfunctions as well as damage. Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other

ways such that parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the LSI. Furthermore,

when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within the guaranteed values of electrical

characteristics.

(10) Ground wiring pattern

When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND pattern and small signal GND pattern and

provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause

the small signal GND voltage to change. Take care that the GND wiring pattern of externally attached components also does not change.

(11) Externally attached capacitors

When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the rated capacitance due to DC bias and

capacitance change due to factors such as temperature.

(12) Thermal shutdown circuit (TSD)

When the junction temperature reaches the defined value, the thermal shutdown circuit operates and turns the switch OFF. The thermal shutdown circuit, which is

aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI

with this circuit operating or use the LSI assuming its operation.

(13) Thermal design

Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use.

(14) Rush Current

Extra care must be taken on power coupling, power, ground line impedance, and PCB design while excess amount of rush current might instantly flow through the

power line when powering-up a LSI which is equipped with several power supplies, depending on on/off sequence, and ramp delays.

REV. B

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

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The Products speciﬁed in this document are intended to be used with general-use electronic

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nication devices, electronic appliances and amusement devices).

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While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

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The Products are not designed or manufactured to be used with any equipment, device or

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R1120

BH6174GUL [ROHM]

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