BM1422AGMV_技术文档

Datasheet

Magnetic Sensor series

3-Axis Digital Magnetometer IC

BM1422AGMV

General Description

Key Specifications

BM1422AGMV is a 3-axis magnetic sensor which

incorporates magneto-impedance (MI) elements to

detect magnetic field and a control IC in a small

package.



Input Voltage Range (AVDD):

1.7V to 3.6V

0.15mA(Typ)

±1200μT(Typ)

0.042μT/LSB(Typ)

1000mT

Input Voltage Range (DVDD):

Operating Current (100SPS):

Magnetic Measurable Range:

Magnetic Sensitivity:

Maximum Exposed Field:

Operating Temperature Range:

Features

-40°C to +85°C



3-axis Magnetic Sensor using MI Elements

I²C Interface

Package

MLGA010V020A

W(Typ) x D(Typ) x H(Max)

2.00mm x 2.00mm x 1.00mm

12bit / 14bit Digital Output

Applications

 Wristwatch

 Mobile phone, Smartphone

Typical Application Circuit

BM1422AGMV

AVDD

MI Sensor

X axis

Regulator

(Internal)

VREG

GND

MI Sensor

Y axis

ADDR

DVDD

MI Sensor

Z axis

Logic

Serial

I/F

SCL

SDA

DRDY

Host

TEST1

TEST2

OPEN

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Contents

General Description........................................................................................................................................................................1

Features..........................................................................................................................................................................................1

Applications ....................................................................................................................................................................................1

Key Specifications...........................................................................................................................................................................1

Package..........................................................................................................................................................................................1

Typical Application Circuit ...............................................................................................................................................................1

Pin Configuration ............................................................................................................................................................................3

Pin Description................................................................................................................................................................................3

Block Diagram ................................................................................................................................................................................4

Absolute Maximum Ratings ............................................................................................................................................................5

Thermal Resistance........................................................................................................................................................................5

Recommended Operating Conditions.............................................................................................................................................5

Electrical Characteristics.................................................................................................................................................................6

Typical Performance Curves...........................................................................................................................................................7

Figure 1. AVDD PowerDown Current ..........................................................................................................................................7

Figure 2. AVDD PowerDown Current ..........................................................................................................................................7

Figure 3. DVDD PowerDown Current..........................................................................................................................................7

Figure 4. DVDD PowerDown Current..........................................................................................................................................7

Figure 5. Average Current during Measurement .........................................................................................................................8

Figure 6. Measurement Time ......................................................................................................................................................8

Figure 7. Output Characteristic ...................................................................................................................................................8

I²C bus Timing Characteristics........................................................................................................................................................9

I²C bus Communication ..................................................................................................................................................................9

I²C bus Slave address ..................................................................................................................................................................10

Register Map ................................................................................................................................................................................10

Control Sequence.........................................................................................................................................................................15

Application Example .....................................................................................................................................................................19

I/O equivalent circuit .....................................................................................................................................................................20

Operational Notes.........................................................................................................................................................................21

Ordering Information.....................................................................................................................................................................23

Marking Diagrams.........................................................................................................................................................................23

Physical Dimension, Tape and Reel Information...........................................................................................................................24

Revision History............................................................................................................................................................................25

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Pin Configuration

1PIN Mark

Bottom View

2

Top View

X-axis

1

3

Z-axis

10

9

4

5

8

7

6

Above arrows indicate North-pole as “+”.

Pin Description

Pin No.

Pin Name

AVDD

GND

Function

Analog circuit power supply^{(Note 1)}

1

2

Ground

3

VREG

TEST1

SDA

Internal regulator output^{(Note 2)}

Test pin^{(Note 3)}

I²C signal data I/O

4

5

6

TEST2

SCL

Test pin^{(Note 3)}

7

I²C signal clock input

Data ready output pin

I²C programmable address bit^{(Note 4)}

Digital circuit power supply^{(Note 5)}

8

DRDY

ADDR

DVDD

9

10

(Note 1) Please place a bypass capacitor between AVDD and GND in the proximity of the terminals.

(Note 2) Please place a bypass capacitor between VREG and GND in the proximity of the terminals.

Please set a bypass capacitor of 1.0uF between VREG and GND

(Note 3) Use as Non-Connection (NC).

(Note 4) Please connect to DVDD or GND.

(Note 5) Please place a bypass capacitor between DVDD and GND in the proximity of the terminals.

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Block Diagram

BM1422AGMV

AVDD

MI Sensor

X axis

Regulator

(Internal)

VREG

GND

MI Sensor

Y axis

Circuit for

MI Sensors

PGA

ADC

MI Sensor

Z axis

DVDD

ADDR

Voltage

Adjustment

Thermal

Sensor

Logic

SCL

Serial

I/F

SDA

DRDY

TEST1

TEST2

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Absolute Maximum Ratings (Ta = 25°C)

Parameter

Symbol

Rating

Unit

Supply Voltage (AVDD)

Supply Voltage (DVDD)

Input Voltage

Vdd_a

Vdd_d

Vin

4.5

V

-0.3 to +(Vdd_d+0.3)

-40 to +85

V

Operating Temperature Range

Storage Temperature Range

Maximum Exposed Field

Topr

Tstg

°C

mT

-40 to +125

-1000 to +1000

Mef

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

MLGA010V020A

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

317.3

60

191.5

41

°C/W

Ψ_JT

(Note 1)Based on JESD51-2A(Still-Air)

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4)Using a PCB board based on JESD51-7.

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

4 Layers

FR-4

Top

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

70μm

Recommended Operating Conditions (Ta= -40°C to +85°C)

Parameter

Symbol

Rating

Unit

Supply Voltage (AVDD)

Supply Voltage (DVDD)

I²C Clock Frequency

Vdd_a

Vdd_d

fSCL

+1.7 to +3.6

MAX 400

V

kHz

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Electrical Characteristics (Unless otherwise specified AVDD=1.8V, DVDD=1.8V, GND=0.0V, Ta=25°C)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Current Consumption

Average Current during

Measurement

Idd

Iss

-

150

1.5

300

5

µA

Output Data Rate = 100SPS

ALL Power Down

Stand-by-mode Current

Logic

0.3 *

DVDD

Low-level Input Voltage

High-level Input Voltage

V_IL

V_IH

GND

-

V

0.7 *

DVDD

Low-level Input Current

High-level Input Current

I_IL

-10

0

-

0

µA

V_IL= GND

I_IH

10

V_IH= DVDD

0.2 *

DVDD

Low-level Output Voltage

High-level Output Voltage

V_OL

V_OH

GND

-

V

IL = -0.3mA

IL = 0.3mA

0.8 *

DVDD

Serial Communication

Low-level Input Current

High-level Input Current

I_IL2

I_IH2

-10

0

-

0

µA

V_IL= GND

10

At HiZ, V_IH= DVDD

0.2 *

DVDD

Low-level Output Voltage

V_OL2

GND

-

V

IL = -3mA

Magnetic Sensor

Moving Range

Rm

Ra

-

±300

±1200

0.5

-

µT

Measurable Range^{(Note 1)}

X,Y-axis Linearity^{(Note 2)}

Z-axis Linearity^{(Note 2)}

Output Offset

Lin1

Lin2

Vofs

2

%FS Rm = ±200µT

1.0

2.8

-

0

LSB

Magnetic Field = 0µT

µT/

LSB

Magnetic Sensitivity

Measurement Time

DeltaV

Tms

-

0.042

0.5

-

msec Average 4times

(Note1) Measurable Range: Overall measurable range within which preset operating range can be fit by adjusting appropriate offsets.

(Note2) Linearity [%FS] = Output Error / Rm = (output – ideal output) / Rm

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Typical Performance Curves

(Unless otherwise specified, Ta25C, AVDD=1.8V, DVDD=1.8V, GND=0.0V)

5

4

3

2

1

0

4

3

2

1

0

1.6

2.1

2.6

3.1

3.6

-50

-25

0

25

50

75

100

AVDD [V]

Ambient Temperature [°C]

Figure 1. AVDD PowerDown Current

Voltage Dependency

Figure 2. AVDD PowerDown Current

Temperature Dependency

5

4

3

2

1

0

5

4

3

2

1

0

-50

-25

0

25

50

75

100

1.6

2.1

2.6

DVDD [V]

3.1

3.6

Ambient Temperature [°C]

Figure 3. DVDD PowerDown Current

Voltage Dependency

Figure 4. DVDD PowerDown Current

Temperature Dependency

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Typical Performance Curves - continued

(Unless otherwise specified, Ta25C, AVDD=1.8V, DVDD=1.8V, GND=0.0V)

0.5

3.0

2.5

0.4

2.0

0.3

1.5

0.2

1.0

0.1

0.5

0.0

0

2

4

6

8

10 12 14 16 18

0

2

4

6

8

10 12 14 16 18

Average Time

Figure 5. Average Current during Measurement

Averaging Dependency (100SPS)

Figure 6. Measurement Time

Averaging Dependency

8000

6000

4000

2000

0

-2000

-4000

-6000

-8000

-300 -200 -100

0

100 200 300

Magnetic Field [uT]

Figure 7. Output Characteristic

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I²C bus Timing Characteristics (Unless otherwise specified DVDD =1.8V, Ta = 25°C)

S : Restart

P : Stop

S : Start

V_IH

V_IL

V_IH

V_IL

SDA

V_IL

t_BUF

t_HD;STA

t_SU;DAT

V_IH

V_IL

V_IH

SCL

V_IL

t_HIGH

t_LOW

t_HD;STA

t_HD;DAT

t_SU;STA

t_SU;STO

Parameter

I²C SCL Clock frequency

Symbol

f_SCL

Min.

0

Typ.

Max.

Units

kHz

µs

Conditions

-

400

I²C ‘L’ Period of the SCL Clock

I²C ‘H’ Period of the SCL Clock

t_LOW

1.3

0.6

-

t_HIGH

µs

I²C Setup Time for Repeated START

Condition

t_SU;STA

t_HD;STA

0.6

-

µs

I²C Hold Time (Repeated) START

Condition

I²C Data Setup Time

t_SU;DAT

t_HD;DAT

t_SU;STO

100

0

-

ns

µs

I²C Data Hold Time

I²C Setup Time for STOP Condition

0.6

I²C Bus Free Time between a STOP and

START Condition

t_BUF

1.3

-

µs

I²C bus Communication

1. Main write format

(1) Indicate register address

W

0

S

Slave Address

ACK

Indicate register address

ACK

P

(2) Write to data register after indicating register address

W

S

Slave Address

ACK

0

Data specified at register

address field

Data specified at register

address field + N

ACK

・・・

ACK

P

2. Main read format

(1) Read data after indicate register address (Master issues restart condition)

W

0

S

Slave Address

ACK

Indicate register address

ACK

R

1

Data specified at register

address field

Data specified at register

address field + 1

Data specified at register

address field + N

ACK

・・・

ACK

NACK

P

(2) Case of read data

Slave Address

R

1

Data specified at register

address field

S

ACK

Data specified at register

address field + 1

Data specified at register

address field + N

ACK

・・・

ACK

from master to slave

from slave to master

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I²C bus Slave address

Selectable I²C Slave Address

( ADDR=L: 0001110, ADDR=H: 0001111 )

Register Map^{(Note 1)}

Address

Register Name

R/W

R

D7

D6

D5

D4

D3

D2

D1

D0

0x0D

INFO [7:0]

INFO

0x0E

0x0F

0x10

0x11

0x12

0x13

0x14

0x15

R

INFO [15:8]

WIA [7:0]

WIA

DATAX [7:0]

DATAX [15:8]

DATAY [7:0]

DATAY [15:8]

DATAZ [7:0]

DATAZ [15:8]

DATAX

DATAY

DATAZ

STA1

RD_

DRDY

OUT_

BIT

0x18

R

0

RST_

LV

0x1B

0x1C

0x1D

CNTL1

CNTL2

CNTL3

AVE_A

RW

PC1

ODR [1:0]

0

DRP

0

FS1

0

DREN

0

FORC

E

0

0x40

0x5C

0x5D

0x60

0x61

0x6C

0x6D

0x72

0x73

0x78

0x79

0x90

0x91

0x92

0x93

0x94

0x95

0x9C

0x9D

0x9E

0x9F

RW

W

0

AVE_A [2:0]

0

RSTB_LV [7:0]

RSTB_LV [15:8]

TEMP [7:0]

CNTL4

W

R

TEMP

R

TEMP [15:8]

RW

R

OFF_X [7:0]

OFF_X

OFF_X [15:8]

OFF_Y [7:0]

OFF_Y

OFF_Y [15:8]

OFF_Z [7:0]

OFF_Z

OFF_Z [15:8]

FINEOUTPUTX [7:0]

FINEOUTPUTX [15:8]

FINEOUTPUTY [7:0]

FINEOUTPUTY [15:8]

FINEOUTPUTZ [7:0]

FINEOUTPUTZ [15:8]

GAIN_PARA_X [7:0]

GAIN_PARA_X [15:8]

GAIN_PARA_Y [7:0]

GAIN_PARA_Y [15:8]

FINEOUTPUTX

FINEOUTPUTY

FINEOUTPUTZ

GAIN_PARA_X

GAIN_PARA_Y

R

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0xA0

R

GAIN_PARA_Z [7:0]

GAIN_PARA_Z [15:8]

GAIN_PARA_Z

0xA1

(Note 1) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table.

It is the following conditions to be able to access each register.

Condition

Accessible Register

CNTL1

CNTL4

INFO

Supply Power

WIA

OFF_X,Y,Z

STA1

Supply Power

(CNTL1) PC1=1

(CNTL1) RST_LV=0

(CNTL4) RSTB_LV=1

CNTL2

CNTL3

AVE_A

OFF_X,Y,Z

Supply Power

(CNTL1) PC1=1

DATAX,Y,Z

(CNTL1) RST_LV=0

(CNTL4) RSTB_LV=1

(CNTL3) FORCE=1 after first access

TEMP

FINEOUTPUTX,Y,Z

Supply Power

(CNTL1) PC1=1, FS1=1

(CNTL1) RST_LV=0

(CNTL4) RSTB_LV=1

(CNTL3) FORCE=1 after first access

DATAX,Y,Z

TEMP

FINEOUTPUTX,Y,Z

GAIN_PARA_X,Y,Z

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( 0x0D/0x0E ) Information Register

Fields

Function

INFO [7:0]

Information LSB : 0x01

Information MSB : 0x01

INFO [15:0]

( 0x0F) WIA Register

Fields

Function

WIA [7:0]

Who I am : 0x41

( 0x10/0x11, 0x12/0x13, 0x14/0x15 ) Output Data Register

Fields

DATAX [7:0]

DATAX [15:0]

DATAY [7:0]

DATAY [15:0]

DATAZ [7:0]

DATAZ [15:0]

Xch Output value LSB

Xch Output value MSB

Ych Output value LSB

Ych Output value MSB

Zch Output value LSB

Zch Output value MSB

default value 0xXXXX

signed 16bit -2048d(0xF800) to +2047d(0x07FF) [Register OUT_BIT=0]

-8192d(0xE000) to +8191d(0x1FFF) [Register OUT_BIT=1]

( 0x18 ) Status Register

Fields

Function

This bit is output to the DRDY to inform the preparation status

of the measured data

0 : Not ready NG

1 : Ready OK

RD_DRDY

default value 0x00

( 0x1B ) Control setting1 Register

Fields

Function

Power Control

0 : PowerDown 1 : Active

PC1

OUT_BIT

Output Data bit setting 0 : 12bit Output , 1 : 14bit Output

Logic reset control

RST_LV

0 : Reset release 1 : Reset

Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1

Measurement output data rates

00 : 10Hz , 10 : 20Hz , 01 : 100Hz , 11 : 1kHz

ODR [1:0]

FS1

Measurement mode setting

0 : Continuous mode , 1 : Single mode

default value 0x22

( 0x1C ) Control setting2 Register

Fields

Function

DRDY terminal enable setting

0 : Disable , 1 : Enable

DREN

DRP

DRDY terminal active setting

0 : Low active , 1 : High active

default value 0x04

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( 0x1D ) Control setting3 Register

Fields

Function

AD start measurement trigger at continuous mode (FS1=0)

and single mode (FS1=1)

1: Start measurement

※Register is automatic clear “0” after write data “1”

※Write data “0” is invalid

FORCE

※If write data “1” on measurement way, restart measurement

default value 0x00

( 0x40 ) Average time Register

Fields

Function

Average Time

AVE_A

000:4times, 001:1times, 010:2times, 011:8times, 100:16times

default value 0x00

( 0x5C/0x5D ) Control setting4 Register

Fields

Function

RSTB_LV [7:0]

Reserved (ignore write data)

RSTB_LV=1 by write access (ignore write data)

Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1

RSTB_LV=0 by write PC1(CNTL1)=0

RSTB_LV [15:8]

default value 0x04

( 0x60/0x61 ) Temperature value Register

Fields

Function

TEMP [7:0]

Temperature value LSB

Temperature value MSB

TEMP [15:8]

default value 0xXXXX

unsigned 16bit 0d(0x0000) to +4095d(0x0FFF) [Register OUT_BIT=0]

0d(0x0000) to +16383d(0x3FFF) [Register OUT_BIT=1]

( 0x6C/0x6D, 0x72/0x73, 0x78/0x79 ) Output Data Register

Fields

Function

OFF_X [7:0]

OFF_X [15:8]

OFF_Y [7:0]

OFF_Y [15:8]

OFF_Z [7:0]

OFF_Z [15:8]

Xch Offset value

Reserved Write ”00000000”

Ych Offset value

Reserved Write ”00000000”

Zch Offset value

Reserved Write ”00000000”

default value 0x30

unsigned 8bit 1d(0x01) to +95d(0x5F)

( 0x90/0x91, 0x92/0x93, 0x94/0x95 ) Fine output Register

Fields

Function

FINEOUTPUTX [7:0]

FINEOUTPUTX [15:0]

FINEOUTPUTY [7:0]

FINEOUTPUTY [15:0]

FINEOUTPUTZ [7:0]

FINEOUTPUTZ [15:0]

DATAX value per OFF_X LSB

DATAX value per OFF_X MSB

DATAY value per OFF_Y LSB

DATAY value per OFF_Y MSB

DATAZ value per OFF_Z LSB

DATAZ value per OFF_Z MSB

default value 0xXXXX

unsigned 16bit 0d(0x0000) to +16383d(0x3FFF)

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( 0x9C/0x9D, 0x9E/0x9F, 0xA0/0xA1 ) Axis interference Register

Fields

Function

GAIN_PARA_X [7:0]

GAIN_PARA_X [15:0]

GAIN_PARA_Y [7:0]

GAIN_PARA_Y [15:0]

GAIN_PARA_Z [7:0]

GAIN_PARA_Z [15:0]

Axis interference Xch to Zch

Axis interference Xch to Ych

Axis interference Ych to Zch

Axis interference Ych to Xch

Axis interference Zch to Ych

Axis interference Zch to Xch

default value 0xXX

unsigned 8bit 0d(0x00) to +255d(0xFF)

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Control Sequence

1. Control Sequence

1.1 Power supply start-up sequence

The order of starting up the power supplies of AVDD and DVDD is arbitrary, when they are supplied from different

sources. Please do the command control by I²C after all powers are supplied.

1.7V

AVDD, DVDD

> 0.1ms

I2C

command

Address：1Bh

Data[7] = 1

command

Address：5Ch, 5Dh

Data：00h

command

> 1ms

1.2 Power supply end sequence

AVDD, DVDD

1.7V

0.4V

> 0ms

> 1ms

I2C

command

Address：1Bh

Data[7] = 0

Data[5] = 1

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2. Measurement sequence

There are the following two kinds of measurement modes

Continuous Mode

Single Mode

BM1422AGMV is measured at specified cycle (ODR=10,20,100,1kHz) at the cycle.

BM1422AGMV is measured by the measurement request from the host.

(Power Off)

・Supply AVDD and DVDD voltage

Power Down

・Send “Logic OFF” command

・Send “Logic ON” command

Ready

・Finish Measurement @ Single mode

・Send “Select Single mode” command

@ continuous mode

・Send Setting Command

・Send “Measurement Start” Command

Measurment

2.1 Continuous Mode

BM1422AGMV

Host

(Send command example) Case of 12bit Output Data

Start

Register Name

CNTL1

Address

0x1B

0x5C

0x5D

0x1C

0x6C

0x72

0x78

0x1D

0x10

0x11

Data

0x80

0x00

0x0C

offx_dat

offy_dat

offz_dat

0x40

Supply Power

Step1

Step2

Step3

Step4

POR

CNTL4

Power Down

CNTL2

OFF_X

OFF_Y

OFF_Z

CNTL3

Write CNTL1 : PC1=1, RST_LV=0

Write CNTL1 : ODR=00

Step1

Step2

Write CNTL1 : FS1=0

Write CNTL4 : RSTB_LV=1

Active

DATAX

DATAY

DATAZ

Read

Timer=10SPS

0x12

0x13

0x14

0x15

Step5

Continuous Mode

Write CNTL2 : DREN=1

DREN=1

Write OFF_X : offx_dat (*1)

Write OFF_Y : offy_dat (*1)

Write OFF_Z : offz_dat (*1)

Step3

Step4

Write CNTL3 : FORCE=1

(Send command example) Case of 14bit Output Data

Register Name

CNTL1

Address

0x1B

0x5C

0x5D

0x1C

0x6C

0x72

0x78

0x1D

0x10

0x11

Data

0xC0

0x00

0x0C

offx_dat

offy_dat

offz_dat

0x40

Measurement(x,y,z)

DRDY High

Does DRDY output

the rising edge?

Step1

Step2

Step3

Step4

CNTL4

No

CNTL2

OFF_X

OFF_Y

OFF_Z

CNTL3

Yes

Step5

Read DATAX, Y, Z

DRDY Low

Timer (wait)

DATAX

DATAY

DATAZ

Read

0x12

0x13

0x14

0x15

Step5

(*1) The value is obtained at offset adjustment.

If not obtained yet, then skip.

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2.2 Single Mode

BM1422AGMV

Host

Start

(Send command example) Case of 12bit Output Data

Start

Register Name

CNTL1

Address

0x1B

0x5C

0x5D

0x1C

0x6C

0x72

0x78

0x1D

0x10

0x11

Data

0x82

0x00

0x0C

offx_dat

offy_dat

offz_dat

0x40

Supply Power

POR

Step1

Step2

Step3

Step4

CNTL4

Power Down

CNTL2

OFF_X

OFF_Y

OFF_Z

CNTL3

Write CNTL1 : PC1=1, RST_LV=0

Write CNTL4 : RSTB_LV=1

Step1

Step2

Active

Write CNTL2 : DREN=1

DREN=1

DATAX

DATAY

DATAZ

Read

Write OFF_X : offx_dat (*1)

Write OFF_Y : offy_dat (*1)

Write OFF_Z : offz_dat (*1)

0x12

0x13

0x14

0x15

Step3

Step4

Step5

Write CNTL3 : FORCE=1

Measurement(x,y,z)

DRDY High

Does DRDY output

the rising edge?

(Send command example) Case of 14bit Output Data

No

Register Name

CNTL1

Address

0x1B

0x5C

0x5D

0x1C

0x6C

0x72

0x78

0x1D

0x10

0x11

Data

0xC2

0x00

0x0C

offx_dat

offy_dat

offz_dat

0x40

Yes

Step5

Read DATAX, Y, Z

Step1

Step2

Step3

Step4

CNTL4

DRDY Low

CNTL2

OFF_X

OFF_Y

OFF_Z

CNTL3

(*1) The value is obtained at offset adjustment.

If not obtained yet, then skip.

DATAX

DATAY

DATAZ

Read

0x12

0x13

0x14

0x15

Step5

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3. Offset Adjustment

Offset adjustment sequence make the output value around zero under the normal magnetic environment.

After measuring the following parameter, HOST should save it in memory, and it needs to be set

after applying power supply to BM1422AGMV.

Parameter

offx_dat

offy_dat

offz_dat

Description

Adjusted value of Xch offset

Adjusted value of Ych offset

Adjusted value of Zch offset

BM1422AGMV

Host

Start

(Send command example) Case of 12bit Output Data

Supply Power

Register Name

CNTL1

Address

0x1B

0x5C

0x5D

0x1C

0x6C

0x1D

0x10

Data

0x82

0x00

POR

Step1

Power Down

CNTL4

0x00

Write CNTL1 : PC1=1, RST_LV=0

Write CNTL4 : RSTB_LV=1

Step2

Step3

Step4

CNTL2

OFF_X

CNTL3

0x0C

wk_dat

0x40

Step1

Step2

Active

Write CNTL2 : DREN=1

Step5

Step6

DATAX

OFF_X

Read

0x11

0x6C

DREN=1

offx_dat

diff_x = 9999

wk_dat = 1

(Send command example) Case of 14bit Output Data

Write OFF_X : wk_dat

Write CNTL3 : FORCE=1

Step3

Step4

Register Name

CNTL1

Address

0x1B

0x5C

0x5D

0x1C

0x6C

0x1D

0x10

Data

0xC2

0x00

Step1

Measurement(x,y,z)

CNTL4

0x00

DRDY rising edge

Read DATAX

Step2

Step3

Step4

CNTL2

OFF_X

CNTL3

0x0C

wk_dat

0x40

Step5

If(diff_x > abs(DATAX)) then

offx_dat = wk_dat;

diff_x = abs(DATAX);

End if

Step5

Step6

DATAX

OFF_X

Read

0x11

0x6C

offx_dat

wk_dat = wk_dat + 1

Yes

wk_dat < 96

No

Write OFF_X : offx_dat

Step6

End

Write only Xch offset adjustment

Ych and Zch should also be performed

When OFF_X, OFF_Y, OFF_Z are changed in the same magnetic field environment, the change directions of

the output are as follows

OFF_X,Y,Z +

OFF_X,Y,Z -

X axis

Y axis

Z axis

-

+

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Application Example

1.0uF

BM1422AGMV

AVDD

MI Sensor

X axis

Regulator

(Internal)

VREG

GND

MI Sensor

Y axis

ADDR

DVDD

0.01uF

MI Sensor

Z axis

Logic

Serial

I/F

SCL

SDA

DRDY

Host

TEST1

TEST2

OPEN

(Note) Sensor property may change due to around magnetic parts. We recommend calibrating

the sensitivity and origin point of magnetic sensors after mounting.

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I/O equivalent circuit

Pin name

Equivalent Circuit Diagram

Pin name

Equivalent Circuit Diagram

SCL

SDA

DVDD

DRDY

TEST1

VREG

ADDR

DVDD

TEST2

DVDD

AVDD

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size

and copper area to prevent exceeding the Pd rating.

6.

7.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

8.

9.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

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BM1422AGMV

Operational Notes – continued

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The

operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical

damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an

input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins

when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the

input pins have voltages within the values specified in the electrical characteristics of this IC.

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Absolute Maximum Ratings

Operate the IC such that the output voltage, output current, and power dissipation are all within the Absolute

Maximum Ratings.

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BM1422AGMV

Ordering Information

B M 1

4

2

2 A G M V -

Z E 2

Part Number

Package

GMV:MLGA010V020A

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagrams

MLGA010V020A

(TOP VIEW)

1PIN MARK

Part Number Marking

A D

LOT Number

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Physical Dimension, Tape and Reel Information

Package Name

MLGA010V020A

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BM1422AGMV

Revision History

Date

Revision

001

Changes

17.Oct.2016

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BM1422AGMV
厂家：	ROHM
描述：	BM1422AGMV是将用于3个方向磁感应的各MI传感器和其控制用IC集成至小型封装的磁传感器。*由于用途受限，因此可能没有库存。传感器
文件：	总28页 (文件大小：1260K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM1422AGMV [ROHM]

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