BM1P101FJ-E2 [ROHM]

PWM Control type DC/DC converter IC; PWM控制的类型的DC / DC转换器集成电路
BM1P101FJ-E2
型号: BM1P101FJ-E2
厂家: ROHM    ROHM
描述:

PWM Control type DC/DC converter IC
PWM控制的类型的DC / DC转换器集成电路

转换器 稳压器 开关式稳压器或控制器 电源电路 开关式控制器
文件: 总21页 (文件大小:1037K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Datasheet  
AC/DC Drivers  
PWM Control type  
DC/DC converter IC  
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
General  
The PWM type DC/DC converter (BM1Pxxx) for  
Features  
„ PWM frequency : 65kHz, 100kHz  
AC/DC provide an optimum system for all products  
that include an electrical outlet.  
BM1Pxxx supports both isolated and non-isolated  
devices, enabling simpler design of various types of  
low-power electrical converters.  
„ PWM current mode method  
„ Frequency Hopping function  
„ Burst operation / Frequency reduction function  
when load is light  
„ Built-in 650V start circuit  
BM1Pxxx built in a HV starter circuit that tolerates  
650V, it contributes to low-power consumption.  
With switching MOSFET and current detection  
resistors as external devices, a higher degree of  
design freedom is achieved. Since current mode  
control is utilized, current is restricted in each cycle  
and excellent performance is demonstrated in  
bandwidth and transient response.  
„ VCC pin under voltage protection  
„ VCC pin over voltage protection  
„ CS pin Open protection  
„ CS pin Leading-Edge-Blanking function  
„ Per-cycle over current protection circuit  
„ Current protection with AC voltage compensation  
„ Soft start  
„ Secondary Over current protection circuit  
At light load, the switching frequency is reduced and  
high efficiency is achieved.  
A frequency hopping function is also on chip, which  
contributes to low EMI.  
BM1Pxxx has rich protection.  
Package  
SOP-J8 4.90mm×3.90mm ×1.65mm Pitch 1.27mm  
(Typ.) (Typ.) (TYP.) TYP.)  
Basic specifications  
„ Operating Power Supply Voltage Range:  
VCC 8.9V to 26.0V  
VH:  
to 600V  
„ Operating Current:  
Normal Mode0.60mA (Typ.)  
Burst Mode0.35mA(Typ.)  
BM1P06xFJ65kHz(Typ.)  
BM1P10xFJ100kHz(Typ.)  
- 40deg. to +85deg.  
„ Oscillation Frequency:  
„ Operating Temperature:  
Applications  
AC adapters and household appliances (vacuum  
cleaners, humidifiers, air cleaners, air conditioners, IH  
cooking heaters, rice cookers, etc.)  
Application circuit  
Line-Up  
Frequency  
VCCOVP  
BM1P101FJ  
BM1P102FJ  
BM1P061FJ  
BM1P062FJ  
100kHz  
100kHz  
65kHz  
65kHz  
Auto Restart  
Latch  
Auto Restart  
Latch  
Figure 1Application circuit  
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays  
.www.rohm.com  
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1/18  
TSZ2211115001  
Daattaasshheeeett  
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
Absolute Maximum RatingsTa=25°C)  
Parameter  
Maximum voltage 1  
Maximum voltage 2  
Maximum voltage 3  
Maximum voltage 4  
OUT Pin Peak Current  
Allowable dissipation  
Operating  
Symbol  
Vmax1  
Vmax2  
Rating  
Unit  
V
Conditions  
-0.330.0  
-0.36.5  
VCC  
V
CS, FB, ACMONI  
Vmax3  
Vmax4  
IOUT  
-0.315.0  
-0.3650  
±1.0  
V
V
A
mW  
oC  
OUT  
VH  
Pd  
674.9 (Note1)  
When implemented  
Topr  
Tstr  
-40 +85  
temperature range  
Storage  
temperature range  
-55 +150  
oC  
(Note1) When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).  
Reduce to 5.40 mW/°C when Ta = 25°C or above.  
Operating ConditionsTa=25°C)  
Parameter  
Symbol  
VCC  
VH  
Rating  
Unit  
V
V
Conditions  
VCC pin voltage  
VH pin voltage  
Power supply voltage range 1  
Power supply voltage range 2  
8.926.0  
80 600  
Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V)  
Specifications  
Parameter  
[Circuit current]  
Symbol  
Unit  
Conditions  
Minimum  
Standard Maximum  
FB=2.0V  
(during pulse operation)  
FB=0.0V  
(during burst operation)  
Circuit current (ON) 1  
Circuit current (ON) 2  
ION1  
ION2  
-
-
600  
350  
850  
450  
µA  
µA  
[VCC protection function]  
VCC UVLO voltage 1  
VUVLO1  
VUVLO2  
VUVLO3  
VCHG1  
12.50  
7.50  
-
13.50  
8.20  
5.30  
8.70  
14.50  
8.90  
-
V
V
V
V
VCC rise  
VCC drop  
BM1P061FJ/BM1P101FJ  
VUVLO3= VUVLO1- VUVLO2  
Start up circuit operation  
voltage  
VCC UVLO voltage 2  
VCC UVLO hysteresis  
VCC Recharge start voltage  
7.70  
9.70  
VCC Recharge stop voltage  
VCC OVP voltage 1  
VCHG2  
VOVP1  
12.00  
26.0  
13.00  
27.5  
14.00  
29.0  
V
V
The stop voltage from VCHG1  
VCC rise  
VCC drop  
BM1P061FJ/BM1P101FJ  
BM1P061FJ/BM1P101FJ  
VCC OVP voltage 2  
VCC OVP hysteresis  
[OUT pin]  
VOVP2  
VOVP3  
23.5  
4.00  
V
V
-
-
OUT Pin High voltage  
VOUTH  
VOUTL  
10.5  
-
12.5  
-
14.5  
1.00  
125  
V
V
IO=-20mA  
IO=+20mA  
OUT Pin Low voltage  
OUT Pin pull down resistance  
[ ACMONI Detector ]  
ACMONI detect voltage1  
ACMONI detect voltage2  
ACMONI hysteresis  
ACMONI Timer  
RPDOUT  
75  
100  
kΩ  
VACMONI1  
VACMONI2  
VACMONI3  
TACMONI1  
0.92  
0.63  
0.20  
180  
1.00  
0.70  
0.30  
256  
1.08  
0.77  
0.40  
330  
V
V
ACMONI rise  
ACMONI drop  
V
mS  
[Start circuit block ]  
Start current 1  
ISTART1  
ISTART2  
ISTART3  
VSC  
0.400  
1.000  
0.700  
3.000  
1.000  
5.000  
mA  
mA  
VCC= 0V  
VCC=10V  
Start current 2  
Inflow current from Drain pin  
after UVLO released UVLO  
OFF current  
-
10  
20  
uA  
V
Start current changing voltage  
0.400  
0.800  
1.400  
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22.NOV.2012.Rev.003  
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TSZ2211115001  
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V)  
Specifications  
Parameter  
Symbol  
Unit  
kHz  
Conditions  
Minimum  
Standard Maximum  
[PWM type DCDC driver block]  
FB=2.00V  
Oscillation frequency 1a  
FSW1a  
60  
65  
70  
average frequency  
BM1P061FJ/BM1P062FJ  
FB=2.00V  
Oscillation frequency 1b  
Oscillation frequency 2  
FSW1b  
FSW2  
FDEL1  
90  
-
100  
25  
110  
kHz  
kHz  
kHz  
average frequency  
BM1P101FJ/BM1P102FJ  
FB=0.40V  
average frequency  
FB=2.00V  
average frequency  
BM1P061FJ/BM1P062FJ  
FB=2.00V  
average frequency  
BM1P101FJ/BM1P102FJ  
-
-
Hopping fluctuation  
frequency range 1  
-
4.0  
Hopping fluctuation  
frequency range 2  
FDEL2  
-
6.0  
-
kHz  
Hopping fluctuation frequency  
Minimum pulse width  
Soft start time 1  
Soft start time 2  
Soft start time 3  
Soft start time 4  
Maximum duty  
FB pin pull-up resistance  
FB / CS gain  
FB burst voltage 1  
FB burst voltage 2  
FCH  
Tmin  
TSS1  
TSS2  
TSS3  
TSS4  
Dmax  
RFB  
75  
-
125  
400  
175  
-
Hz  
ns  
0.30  
0.60  
1.20  
2.40  
68.0  
22  
0.50  
1.00  
2.00  
4.00  
75.0  
30  
4.00  
0.400  
0.450  
0.70  
1.40  
2.80  
5.60  
82.0  
38  
ms  
ms  
ms  
ms  
%
kΩ  
V/V  
V
Gain  
VBST1  
VBST2  
-
-
0.300  
0.350  
0.500  
0.550  
FB drop  
FB drop  
V
When overload is detected  
(FB rise)  
When overload is detected  
(FB drop)  
FB OLP voltage 1a  
FB OLP voltage 1b  
VFOLP1A  
VFOLP1B  
2.60  
-
2.80  
3.00  
-
V
V
VFOLP2A-0.2  
FB OLP ON timer  
FB OLP Start up timer  
FB OLP OFF timer  
TFOLP  
TFOLP2  
TOLPST  
44  
26  
358  
64  
32  
512  
84  
38  
666  
ms  
ms  
ms  
VCC Pin voltage  
BM1P062FJ/BM1P102FJ  
VCCOVP  
BM1P062FJ/BM1P102FJ  
Latch released VCC voltage  
Latch mask time  
VLATCH  
TLATCH  
-
VUVLO2-0.5  
100  
-
V
50  
200  
us  
[Over current detection block]  
Over current detection voltage  
VCS  
0.380  
-
0.400  
0.100  
0.420  
-
V
V
Ton=0us  
Over current detection  
voltage SS1  
VCS_SS1  
0[ms] ~ Tss1[ms]  
Over current detection  
voltage SS2  
Over current detection  
voltage SS3  
Over current detection  
voltage SS4  
VCS_SS2  
VCS_SS3  
-
-
0.150  
0.200  
-
-
V
V
TSS1 [ms] ~ TSS2 [ms]  
TSS2 [ms] ~ TSS3[ms]  
TSS3 [ms] ~ TSS4 [ms]  
VCS_SS4  
TLEB  
-
-
0.300  
250  
20  
-
-
V
ns  
Leading Edge Blanking Time  
Over current detection AC  
Voltage compensation factor  
KCS  
12  
28  
mV/us  
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22.NOV.2012.Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
3/18  
TSZ2211115001  
Daattaasshheeeett  
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
PIN DESCRIPTIONS  
Table 1. Pin Description  
ESD Diode  
VCC GND  
NO.  
Pin Name  
I/O  
Function  
Comparator input pin  
Feedback signal input pin  
Primary Current sense pin  
GND pin  
External MOSFET driver pin  
Power supply input pin  
Non Connection  
1
2
3
4
5
6
7
8
ACMONI  
FB  
I
I
I
-
-
-
CS  
GND  
OUT  
VCC  
N.C.  
VH  
I/O  
O
I/O  
-
-
I
Starter pin  
-
I/O Equivalent Circuit Diagram  
Figure 2 . I/O Equivalent Circuit Diagram  
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Block Diagram  
Figure 3. Block Diagram  
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
Description of Blocks  
( 1 ) Start circuit (VH Pin : 8pin)  
This IC built in the Start up circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.  
After starting, consumption power is idling current ISTART3typ=10uAonly.  
Reference values of Starting time are shown in Figure-6. When Cvcc=10uF it can start less than 0.1 sec.  
Figure 4. Block diagram of start up circuit  
Figure 5. Start current vs VCC voltage  
* Start up current flows from the DRAIN pin  
Figure 6. Start time( reference value)  
ex) Consumption power of start up circuit only when the Vac=100V  
PVH100V*2*10uA=1.41mW  
ex) Consumption power of start up circuit only when the Vac=240V  
PVH240V*2*10uA=3.38mW  
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22.NOV.2012.Rev.003  
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
(2 ) Start sequences  
(Soft start operation, light load operation, and auto recovery operation during overload protection)  
Start sequences are shown in Figure 7. See the sections below for detailed descriptions.  
VH  
VCC=13.5V  
VCC(1pin)  
VCC=8.2V  
Within  
Within  
64ms  
Within  
64ms  
64ms  
Internal REF  
Pull Up  
FB(8pin)  
Vout  
Iout  
Over Load  
Normal Load  
Light LOAD  
Burst mode  
Switching  
stop  
Switching  
Soft  
Start  
G H  
Figure 7. Start sequences Timing Chart  
I J  
C
E
F
A
B
D
K
A : Input voltage VH is applied  
B : This IC starts operating , when VCC pin voltage rises VCC > VUVLO1 (13.5 V typ).  
Switching function starts when other protection functions are judged as normal.  
Between the secondary output voltage become constant level, because the VCC pin consumption current causes the VCC  
value to drop, IC should set to start switching until VCC<VUVLO2 (8.2V typ).  
C : With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.  
D : When the switching operation starts, VOUT rises.  
Once the output voltage starts, set the rated voltage within the TFOLP2 period (32ms typ).  
E : When there is a light load it reaches FB voltage < VBST (= 0.4Vtyp, burst operation is used to keep power consumption  
down.  
During burst operation, it becomes low-power consumption mode.  
F : When the FB VoltageVFOLP1A=2.8V.typ, it becomes a overload  
G: When FB pin voltage keeps VFOLP1A (= 2.8V typ) at or above T FOLP (32 ms typ), the overload protection function is  
triggered and switching stops. During the TFOLP period (32ms typ) if the FB pin voltage becomes FB<VFOLP1B even once,  
the IC’s internal timer is reset.  
H : If the VCC voltage drops to VCC < VUVLO2 (7.7Vtyp) or below, restart is executed.  
I : The IC’s circuit current is reduced and the VCC pin value rises. (Same as B)  
J : Same as F  
K : Same as G  
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22.NOV.2012.Rev.003  
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
(3) VCC pin protection function  
BM1Pxxx built in VCCUVLO (Under Voltage Lock Out), VCC OVP (Over Voltage Protection) and VCC charge function that  
operates in case of dropping the VCC voltage.  
This function monitors VCC pin and prevent VCC pin from destroying switching MOSFET at abnormal voltage.  
VCC charge function stabilizes the secondary output voltage to be charged from the high voltage line by start circuit when  
dropping the VCC voltage.  
(3-1) VCC UVLO VCC OVP function  
VCCUVLO is auto recovery comparator. BM1Pxx1 series have auto recovery type VCCOVP that has voltage hysteresis.  
BM1Pxx2 series has latch type VCCOVP.  
Refer to the operation figure-8.  
VCCOVP operates detection in case of continuing VCC pin voltage > VOVP1 typ=27.5V.  
This function built in mask time TLATCHtyp=100us.By this function, this IC masks pin generated surge etc. (please refer to  
section (7))  
Vp  
VCCuvlo1  
VCCCHG2  
VCCCHG1  
VCCuvlo2  
Vlatch  
ON  
ON  
OFF  
OFF  
ON  
OFF  
ON  
OFF  
ON  
ON  
ON  
ON  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
L : Normal  
H : Latch  
TLATCH  
A
B
G
H
I
E
F
J K  
A
C D  
Figure 8. VCC UVLO / OVP Timing Chart  
A:The VH pin voltage input, the VCC pin voltage starts rising.  
B:VCC>Vuvlo1, the DC/DC operation starts  
C:VCC > VOVP1 , the VCCOVP function is detected.  
D:VCC > VOVP1 continues TLATCH(typ =100us), switching is stopped by the VCCOVP function (LATCH MODE) .  
E:VCC< VCHG1, the VCC charge function operates and the VCC voltage is rise.  
F:VCC > VCHG2, the VCC charge function is stopped.  
G:Same as E.  
H:Same as F.  
I: The VH pin is OPEN. The VCC Voltage is fall.  
J: VCC<Vuvlo2, the DC/DC operation stops  
K: VCC<VLATCH,, the LATCH function is reset.  
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3-2VCC Charge function  
The VCC charge function operates once the VCC pin >VUVLO1 and the DC/DC operation starts then the VCC pin voltage  
drops to <VCHG1. At that time the VCC pin is charged from the VH pin through the start up circuit.  
By this operation, BM1Pxxx doesn’t occur to start failure.  
The VCC pin voltage is rise, then VCC >VCHG2, charge is stopped. The operations are shown in figure 9.  
VH  
VUVLO1  
VCHG2  
VCC  
VCHG1  
VUVLO2  
Switching  
VH charge  
charge  
charge  
charge  
charge  
OUTPUT  
voltage  
A
B C D E  
F G H  
Figure 9. Charge operation VCC pin charge operation  
A:The VH pin voltage rises, the charge starts to the VCC pin by the VCC charge function.  
B:VCC > VUVLO1, the VCC UVLO function releases, the VCC charge function stops, the DC/DC operation starts.  
C:When DC/DC operation starts, the VCC voltage drops.  
D:VCC < VCHG1, the VCC recharge function operates.  
E:VCC > VCHG2, the VCC recharge function stops.  
F:VCC < VCHG1, the VCC recharge function operates.  
G:VCC < VCHG1, the VCC recharge function stops.  
H:After a start of output voltage finished, the VCC Pin is charged by the auxiliary winding, then VCC pin stabilizes.  
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TSZ02201-0F2F0A200090-1-2  
22.NOV.2012.Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
9/18  
TSZ2211115001  
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
( 4 ) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)  
BM1Pxxx is a current mode PWM control.  
An internal oscillator sets a fixed switching frequency.  
BM1Pxxx is integrated the hopping function of the switching frequency which changes the switching frequency to fluctuate  
as shown in Figure 10.  
The fluctuation cycle is 125 Hz typ.  
Figure 10-1. hopping function (BM1P06x series)  
Figure 10-2. hopping function (BM1P10x series)  
Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ).  
With the current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur.  
As a countermeasure to this, BM1Pxxx is built in slope compensation circuits.  
BM1Pxxx is built in the burst mode circuit and the frequency reduction circuit to achieve low power consumption, when the  
load is light.  
The FB pin is pull up by RFB (30 ktyp).  
The FB pin voltage is changed by secondary output voltage (secondary load power).  
To monitor the FB pin, the burst mode operation and the frequency detection is operated.  
Figure 11 shows the FB voltage, the switching frequency and the DC/DC operation  
mode1 : the burst operation  
mode2: the frequency reduction operation. (reduce the max frequency)  
mode3 : the fixed frequency operation.(operate at the max frequency)  
mode4 : the over load operation.(detect the over load state and stop the pulse operation)  
Figure-11-1. Switching operation state  
(BM1P06x series)  
Figure-11-2. Switching operation state  
(BM1P10x series)  
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TSZ02201-0F2F0A200090-1-2  
22.NOV.2012.Rev.003  
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
(5) Over Current limiter  
BM1Pxxx is built in the Over Current limiter per cycle. If the CS pin is over a certain voltage, the switching is stopped. It is  
also built in the AC voltage compensation function. The function is rise over the current limiter level by time to compensate  
AC voltage.  
Shown in figure-12,13,14  
Figure 12. No AC voltage compensation function  
Figure 13.buit-in AC compensation voltage  
The primary peak current is decided as the formula below.  
The primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay  
Vcs the over current limiter voltage  
Rs the current detection resistance  
Vdc the input DC voltage  
Lp the Primary inductance  
Tdelaythe delay time after the detection of the over current limiter  
Figure 14. Over current limiter voltage  
6L.E.B blanking period  
When the driver MOSFET is turned ON, a surge current occurs at capacitor components and the drive current.  
Therefore, because of rising the CS pin voltage temporarily, the detection errors may occur in the over current limiter  
circuit. To prevent detection errors, when the OUT pin is switched from high to low, the CS signal is masked for 250 ns by  
the on-chip LEB (Leading Edge Blanking) function. This blanking function reduces CS pin noise filter for the noise that  
occurs when the OUT pin is switched from high to low.  
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TSZ02201-0F2F0A200090-1-2  
22.NOV.2012.Rev.003  
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11/18  
TSZ2211115001  
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(7) CS pin (1pin) open protection  
If the CS pin becomes OPEN, other IC may be damaged.  
To prevent this damage, BM1Pxxx built in the OPEN protection circuitauto recovery protection.  
(8) Output over load protection function FB OLP Comparator)  
The output overload protection monitors the secondary output load status at the FB pin.  
This function stops a switching when an overload occurs. When there is an overload, the output voltage is dropped and the  
photo coupler current becomes zero, so the FB pin voltage is rised.  
When the FB pin voltage > VFOLP1A (2.8 V typ) continuously for the period TFOLP2 (32 ms typ), it is judged as an overload and  
stops switching.  
When the FB pin > FVFOLP1A (2.8 V typ), if the voltage goes lower than VFOLP1B (2.6V typ) during the period TFOLP2 (32 ms typ),  
the overload protection timer is reset. The switching operation is performed during this period TFOLP2 (32ms typ)  
At startup, the FB voltage is pulled up to the IC’s internal voltage, so the operation starts at a voltage of VFOLP1A (2.8 V typ)  
or above. Therefore, at startup the FB voltage must be set to go to VFOLP1B (2.6 Vtyp) or below during the period TFOLP1 (32  
ms typ), and the secondary output voltage’s start time must be set within the period TFOLP2 (32 ms typ) following startup of  
the IC.  
Recovery from the once detection of FBOLP, after the period TFOLP2 (512 ms typ)  
Figure 15. Over load protection (Auto recovery)  
A: The FBOLP comparator detects over load for FB>VFOLP1A  
B: States of A continuously for the period TFOLP2 (32 ms typ), it is judged as an overload and stops switching.  
C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage reaches  
< VCHG , the VCC charge function operates so the VCC pin voltage rises.  
D: VCC charge function stops when VCC pin voltage > VCHG2  
E: If TOLPST typ =512msgo on from B point, Switching function starts on soft start.  
F: If TFOLP2typ=32msgo on from E point to continues a overload condition (FB>VFOLP1A), Switching function stops at F  
point.  
G: While switching stops VCC pin voltage drops to < VCHG1, VCC charge function operates and VCC pin voltage rises.  
H: If VCC pin (1pin) voltage becomes over VCHG2 by the VCC charge function, VCC charge function operation stops  
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TSZ02201-0F2F0A200090-1-2  
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
(9) OUT Pin Voltage clamper  
BM1Pxxx has a gate clamper function. It set the OUT pin high voltage to VOUTHtyp=12.5V.  
It prevents the damage for MOSFET gate by the rising of VCC pin (6pin) voltage. (Shown in Figure16)  
Figure 16. OUT pin 5pinBlock Diagram  
( 10 ) ACMONI Function  
Brownout function is built inside BM1PXXX. Brownout function means that DC/DC action will stop when input AC  
voltage is low. Application example is shown in Figure 17. Input voltage is divided by resistance and input into ACMONI  
terminal. If voltage of ACMONI terminal exceeds VACMONI1 (1.0V typ), circuit will detect normal status and start to execute  
DC/DC action. After DC/DC action and voltage of ACMONI terminal is lower than VACMONI20.7V typ, TACMONI(typ.256ms)  
later, DC/DC action becomes OFF.  
Figure 17. Application circuit  
* If brownout function is not used, please set voltage value within the range of VACMONI(1.0Vtyp)5.0V.  
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TSZ02201-0F2F0A200090-1-2  
22.NOV.2012.Rev.003  
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13/18  
TSZ2211115001  
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
Operation mode of protection circuit  
Operation mode of protection functions are shown in table2.  
Table 2. Operation mode of protection circuit  
Function  
Operation mode  
VCC Under Voltage Locked Out  
VCC Over Voltage Protection  
Auto recovery  
BM1Pxx1 series : Auto recovery with 100us Timer)  
BM1Pxx2 series : Latch with 100us Timer)  
FB Over Limited Protection  
CS Open Protection  
Auto recoverywith 32ms timer)  
Auto recovery  
Sequence  
The sequence diagram is show in Figure 18 and Figure19  
All condition transits OFF Mode VCC<8.2V  
Figure 18. The sequence diagram (BM1PXX1 Series)  
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TSZ02201-0F2F0A200090-1-2  
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
OFF MODE  
Soft Start1  
Soft Start2  
Soft Start3  
Soft Start4  
CS OPEN MODE  
( Pulse Stop)  
LATCH OFF MODE  
( Pulse Stop)  
Normal MODE  
OLP MODE  
( Pulse Stop)  
Burst & Low Power MODE  
Figure 19. The sequence diagram(BM1PXX2 Series)  
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© 2012 ROHM Co., Ltd. All rights reserved.  
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15/18  
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Thermal loss  
The thermal design should set operation for the following conditions.  
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)  
1. The ambient temperature Ta must be 85 or less.  
2. The IC’s loss must be within the allowable dissipation Pd.  
The thermal abatement characteristics are as follows.  
(PCB: 70 mm × 70 mm × 1.6 mm, mounted on glass epoxy substrate)  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
0
25  
50  
75  
100  
125  
150  
Ta[]  
Figure 20. Thermal Abatement Characteristics  
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TSZ02201-0F2F0A200090-1-2  
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© 2012 ROHM Co., Ltd. All rights reserved.  
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Use-related cautions  
(1) Absolute maximum ratings  
Damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are  
exceeded, and since the type of damage (short, open circuit, etc.) cannot be determined, in cases where a particular  
mode that may exceed the absolute maximum ratings is considered, use of a physical safety measure such as a  
fuse should be investigated.  
(2) Power supply and ground lines  
In the board pattern design, power supply and ground lines should be routed so as to achieve low impedance. If there  
are multiple power supply and ground lines, be careful with regard to interference caused by common impedance in  
the routing pattern. With regard to ground lines in particular, be careful regarding the separation of large current routes  
and small signal routes, including the external circuits. Also, with regard to all of the LSI’s power supply pins, in  
addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be  
problems such as capacitance losses at low temperature, so check thoroughly as to whether there are any problems  
with the characteristics of the capacitor to be used before determining constants.  
(3) Ground potential  
The ground pin’s potential should be set to the minimum potential in relation to the operation mode.  
(4) Pin shorting and attachment errors  
When attaching ICs to the set board, be careful to avoid errors in the IC’s orientation or position. If such attachment  
errors occur, the IC may become damaged. Also, damage may occur if foreign matter gets between pins, between a pin  
and a power supply line, or between ground lines.  
(5) Operation in strong magnetic fields  
Note with caution that these products may become damaged when used in a strong magnetic field.  
(6) Input pins  
In IC structures, parasitic elements are inevitably formed according to the relation to potential. When parasitic  
elements are active, they can interfere with circuit operations, can cause operation faults, and can even result in damage.  
Accordingly, be careful to avoid use methods that enable parasitic elements to become active, such as when a voltage  
that is lower than the ground voltage is applied to an input pin. Also, do not apply voltage to an input pin when there is no  
power supply voltage being applied to the IC. In fact, even if a power supply voltage is being applied, the voltage applied  
to each input pin should be either below the power supply voltage or within the guaranteed values in the electrical  
characteristics.  
(7) External capacitors  
When a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal  
capacitance due to current bias and capacitance fluctuation due to temperature and the like before determining  
constants.  
(8) Thermal design  
The thermal design should fully consider allowable dissipation (Pd) under actual use conditions.  
Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO.  
(9) Rush current  
In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned ON,  
so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND pattern  
wires, and how they are laid out.  
(10) Handling of test pins and unused pins  
Test pins and unused pins should be handled so as not to cause problems in actual use conditions, according to the  
descriptions in the function manual, application notes, etc. Contact us regarding pins that are not described.  
(11) Document contents  
Documents such as application notes are design documents used when designing applications, and as such their  
contents are not guaranteed. Before finalizing an application, perform a thorough study and evaluation, including for  
external parts.  
Status of this document  
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference  
to help reading the formal version.  
If there are any differences in translation version of this document formal version takes priority.  
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22.NOV.2012.Rev.003  
TSZ2211115001  
Daattaasshheeeett  
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ  
Ordering Information  
X F  
J
B M 1 P X X  
-
E 2  
Package  
Product name  
Packaging and  
FJ  
: SOP-J8  
forming specification  
E2: Embossed tape and reel  
Physical Dimension Tape and Reel Information  
SOP-J8  
<Tape and Reel information>  
4.9 0.2  
(MAX 5.25 include BURR)  
Tape  
Embossed carrier tape  
+
6°  
4°  
4°  
Quantity  
2500pcs  
8
1
7
2
6
3
5
4
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
0.545  
0.2 0.1  
S
1.27  
0.42 0.1  
Direction of feed  
1pin  
0.1  
S
Reel  
(Unit : mm)  
Order quantity needs to be multiple of the minimum quantity.  
Marking Diagram  
Line-Up  
Product name (BM1PXXXFJ)  
BM1P101FJ  
BM1P102FJ  
BM1P061FJ  
BM1P062FJ  
1PXXX  
LOT No.  
1PIN MARK  
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Notice  
General Precaution  
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2) All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
Precaution on using ROHM Products  
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3) Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4) The Products are not subject to radiation-proof design.  
5) Please verify and confirm characteristics of the final or mounted products in using the Products.  
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8) Confirm that operation temperature is within the specified range described in the product specification.  
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precaution for Mounting / Circuit board design  
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Precautions Regarding Application Examples and External Circuits  
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2) You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1) All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  
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Other Precaution  
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
5) The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - Rev.003  
© 2012 ROHM Co., Ltd. All rights reserved.  

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