BM1P10CFJ_技术文档

Datasheet

AC/DC Converter IC

PWM Controller IC for AC/DC Converter

BM1P10CFJ

General Description

Key Specifications

The PWM Controller for AC/DC power supplies provides

an optimal system for all products that include an

electrical outlet. It realizes the high flexibility in power

supply design with external switching MOSFET and

current detection resistor. This IC can make efficiency

high because it has functions such as AC low voltage

protection and X capacitor discharge and operates

frequency reduction and burst operation at light load. In

addition, this IC also has a built-in power save function

and it reduces electric power at no load.

 Operating Power Supply Voltage Range

VCC Pin Voltage:

VH Pin Voltage:

 Current at Switching Operation

 Current at Burst Operation

 Current at Power Save Operation

 Switching Frequency

9.3 V to 55.0 V

650 V (Max)

0.70 mA (Typ)

0.35 mA (Typ)

0.11 mA (Typ)

100 kHz (Typ)

-40 °C to +105 °C

 Operation Temperature Range

Package

SOP-J7S

W (Typ) x D (Typ) x H (Max)

4.9 mm x 6.0 mm x 1.65 mm

Pitch: 1.27 mm (Typ)

This IC has following various protection functions.

Features



AC Low Voltage Protection Function (AC UVLO)

X Capacitor Discharge Function

VCC Pin Low Voltage Protection (VCC UVLO)

PWM Type Current Mode Control

Frequency Reduction Function

Burst Operation at Light Load

Switching Function of Operation Modes

Power Save Function

(Low Consumption Current at no load)

Soft Start Function

Applications



OA Equipment, AC Adapters, Each Household

Applications and Power Supplies for Motor

FB Pin Overload Protection Function (FB OLP)

CS Pin Overload Protection Function (CS OLP)

Switching Function of CS OLP Detection Voltage

CS Pin Over Current Protection Function (CS OCP)

CS Pin Leading Edge Blanking Function

LA/ZT Pin Over Voltage Protection Function

(ZT OVP)



OUT Pin Gate Clamp Circuit

Typical Application Circuit

FUSE

AC

Diode

Bridge

Filter

Input

VCC

VH

OUT

LA/ZT FB

CS GND

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays

.

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Pin Configuration

(TOP VIEW)

1

2

3

4

7

LA/ZT

FB

VH

6

5

CS

VCC

OUT

GND

Pin Descriptions

Pin No.

Pin Name

LA/ZT

FB

Function

Monitor auxiliary winding / Latch stop pin

Feedback signal input pin

1

2

3

4

5

6

7

CS

Primary current detection pin

GND pin

GND

OUT

VCC

VH

External MOSFET drive pin

Power supply input pin

Startup power supply input / AC input voltage monitor pin

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Block Diagram

Fuse

AC

Input

Diode

Bridge

Filter

VCC

VH

7

6

Starter

+

-

+

-

VCC UVLO

4.0 V

Line Reg

Discharge

VCC

RECHARGE

Hi voltage

Clamp Circuit

VH

UVLO

Internal Block

OUT

LA/ZT

LA/ZT OVP

S

R

Q

DRIVER

5

+

-

1

Filter

4.0 V

Min ON

Power

Save

Width

MODE2

PWM Control

+

-

+

-

Start

VO select1

CSOLP

+

-

+

-

4.0 V

Power

Save

VO select2

Leading Edge

Blanking

FBOLP

+

-

FB

3

2

-

OCP

CS

Burst

Comparator

-

Soft Start

AC Input

Compensation

+

1/4

PWM

Comparator

-

MAX

DUTY

+

Slope

Compensation

Frequency

Hopping

+

OSC

GND

4

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Description of Blocks

1

Startup Circuit

This IC has a built-in startup circuit. When the AC input voltage is applied, the VH pin is also applied the voltage.

Then the VCC pin voltage is charged by applied current to the VCC pin through the startup circuit. This charge is

stopped after the VCC pin voltage rises and VCC UVLO is released.

2

AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function

AC UVLO:

At startup, the voltage occurs at the VH pin when the AC input voltage is applied.

The VCC pin waits the detection of AC input voltage remaining applied voltage

until the VH pin peak voltage becomes more than V_INLVPbecause this IC charges

the VCC pin through the startup circuit. During this term, the switching operation

is not operated because AC UVLO operates.

When the VH pin peak voltage becomes more than V_INLVP, AC UVLO is released

and the operation starts. After stop of supplying of the AC input voltage, the IC

stops the switching operation when the status of the VH pin peak voltage ≤ V_INLVP

continues for t_INLVP

.

In addition, when there is no continuous up/down of voltage in the VH pin, it also

stops the switching operation even though the VH pin peak voltage > V_INLVP

.

X Capacitor Discharge Function: When the status of the VH pin peak voltage ≤ V_INLVPcontinues for t_INLVPand the

switching operation is stopped by AC UVLO, X capacitor discharge function starts

to operate.

Fuse

VH

VCC

I_VCC

I_VHCharge

Logic

Startup

Circuit

UVLO

+

-

Recharge

+

Internal

-

Block

Monitor

Timer

t_INLVP

+

-

Logic

(Note 1)

X-Capacitor

Discharge

V_INLVP

(Note 1) The VH pin peak voltage is monitored by this block.

Figure 1. Block Diagram of VH Pin and VCC Pin

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2

AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function – continued

t_INLVP

AC input voltage

VH pin voltage

VCC pin voltage

V_UVLO1

V_CHG2

V_CHG1

V_UVLO2

VCC pin current

ON

VCC UVLO

Switching

ON

X capacitor

discharge function

ON

VCC recharge

function

B

A

C

D

E

F

H

I

J

G

Figure 2. Timing Chart of X Capacitor Discharge Function

A: The AC input voltage is turned OFF, the voltage remains behind because X condenser is charged.

B: After t_INLVPfrom A, the switching operation stops. VCC capacitor is discharged because of the VCC pin voltage

> V_CHG1

.

C: When the VCC pin voltage becomes less than V_CHG1, the VCC recharge operation starts.

D: When the VCC pin voltage becomes more than V_CHG2, the VCC recharge operation stops.

E: Same as C.

F: Same as D.

G: Same as C.

H: Same as D.

I: When the VCC pin voltage becomes less than V_CHG1, the VCC recharge function operates. However, the

current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low VH pin

voltage.

J: When the VCC pin voltage becomes less than V_UVLO2, VCC UVLO operates.

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Description of Blocks – continued

3

VCC Pin Protection Function

This IC has VCC UVLO and VCC recharge function at the VCC pin.

Use the ZT OVP connected from an auxiliary winding for over voltage protection in output because this IC does not

have a built-in VCC OVP (Over Voltage Protection). After the latched stop, it is released when the VCC pin voltage

becomes less than V_LATCH

.

3.1 VCC UVLO (Under Voltage Lockout)

This is an auto recovery comparator with a voltage hysteresis. When the VCC pin voltage becomes less than

V_UVLO2, the IC stops the operation. And when the VCC pin voltage becomes more than V_UVLO1, the operation is

restarted.

3.2 VCC Recharge Function

If the VCC pin voltage drops to less than V_CHG1after once the VCC pin becomes more than V_UVLO1and the IC

starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the VH pin

through the startup circuit. When the VCC pin voltage becomes more than V_CHG2, this recharge is stopped.

VH pin voltage

V_INLVP

t_INLVP

AC low voltage

protection

VCC pin voltage

V_UVLO1

V_CHG2

V_CHG1

V_UVLO2

V_LATCH

VCC UVLO

t_LATCH

ZT OVP detection

Latch protection

VCC charge

VCC recharge

function

Switching

B

C D

E

F G

H

I

J K L

M

A

Figure 3. Timing Chart of VCC UVLO and VCC Recharge Function

A: The VH pin is applied voltage and the VCC pin voltage rises.

B: When the VH pin voltage becomes more than V_INLVP, AC UVLO is released.

C: When the VCC pin voltage becomes more than V_UVLO1, the switching operation starts.

D: When the VCC pin voltage becomes less than V_CHG1, the VCC pin is recharged from the VH pin by VCC recharge

function.

E: When the VCC pin voltage becomes more than > V_CHG2, the VCC recharge function is stopped.

F: The output voltage rises and auxiliary winding voltage also does. At this moment, ZT OVP is detected.

G: When the detection of ZT OVP continues for t_LATCH, the switching operation is latched stop.

H: When the VCC pin voltage becomes less than V_CHG1, VCC recharge function operates.

I: When the VCC pin voltage becomes more than V_CHG2, VCC recharge function stops. By the operation of H and I,

the VCC pin voltage is maintained constantly.

J: When the VCC pin voltage becomes less than V_CHG1, the VCC recharge function operates. However, the current

supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low VH pin voltage.

K: When the VCC pin voltage becomes less than V_UVLO2, VCC UVLO operates.

L: When the VCC pin voltage becomes less than V_LATCH, the latch protection is released.

M: The VH pin is applied voltage and the IC operation restarts.

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Description of Blocks – continued

4

DC/DC Driver Block

This IC performs a current mode PWM control and it has the following characteristics.



The switching frequency operates in the range of f_SW3to f_SW1by an internal oscillator. It has a built-in frequency

hopping function and the fluctuation cycle is at random. It makes the EMI low by swaying the switching

frequency within ±6 %.



This IC controls the ON width by detecting the peak current using the CS pin voltage correspond to the FB pin

voltage. The CS pin voltage is restricted to 1/AV_CSof the FB pin voltage.



Maximum duty is fixed at D_MAX.

In the current mode control, a sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a

countermeasure, this IC has a built-in slope compensation circuit.



It has a built-in burst mode and frequency reduction circuit to achieve lower power consumption at light load.

The FB pin is pulled up to the internal power supply by R_FB.

The FB pin voltage is changed by the secondary output voltage. This IC monitors this and changes a switching

operation status.

4.1

Transition of Switching Frequency by FB Pin Voltage

This IC operates the burst operation when the FB pin voltage becomes less than V_BST1at light load.

At the peak load, the frequency rises to f_SW1accompanying with the increase of the FB pin voltage.

mode a:

mode b:

mode c:

mode d:

mode e:

mode f:

Burst Operation

(The intermittent operation starts.)

(It operates in f_SW3

(It reduce the frequency.)

(It operates in f_SW2)

Fixed Frequency Operation 1

Frequency Reduction Operation 1

Fixed Frequency Operation 2

Frequency Reduction Operation 2

Fixed Frequency Operation 3

)

(It reduce the frequency.)

(It operates in f_SW1

)

Switching Frequency

mode a

mode b mode c

mode d

mode e

mode f

f_SW1

f_SW2

f_SW3

Switching

OFF

FB pin

voltage

V_BST1V_FBSW2

V_BST2

V_FBSW1

V_FBPK1

V_FBPK2

Figure 4. State Transition of Switching Frequency

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DC/DC Driver Block – continued

4.2

Transition of CS Pin Voltage by FB Pin Voltage

This IC operates as shown below.

mode A: Burst Operation

mode B: Normal Load Operation (The CS pin voltage changes corresponding to the FB pin voltage.)

mode C: CS Overload Operation (Latched stop is operated by CS OLP when this status lasts for t_CSOLP.

mode D: FB Overload Operation (The peak voltage is restricted to V_OCP1

Latched stop is operated by FB OLP when this status lasts for t_FBOLP.)

)

.

CS Pin Voltage

mode A

mode D

mode B

mode C

(Note)

V_OCP

V_CSOLP

Switching

OFF

FB pin

voltage

V_BST1

V_BST2

(Note) V_OCPmeans V_OCP1to V_OCP3and this depends on AC voltage compensation function or operation modes.

V_CSOLPmeans V_CSOLP1to V_CSOLP5and this depends on Value of R_CSS

.

Figure 5. State Transition of CS Pin Voltage by FB Pin Voltage

4.3

Switch Function of Operation Modes

This IC switches the operation modes by detecting the output voltage at the LA/ZT pin. It contributes to

reduction of standby electric power by the three operation modes they correspond to normal, light and no load.

At startup, this IC starts the operation from operation mode 1.

Table 1. Operation Modes

Operation Mode

Load Status

Normal Load

Light Load

No Load

Range of LA/ZT pin high voltage

1

2

3

>V_ZT2

V_ZT1to V_ZT2

<V_ZT1

Operation Mode 1

(Normal operation)

LA/ZT pin high voltage ≤ V_ZT2

(continued t_ZTD

)

LA/ZT pin high voltage > V_ZT2

(continued t_ZTD

)

Operation Mode 2

(Light load operation)

FB pin voltage > V_FBDET

(continued t_FBON

)

LA/ZT pin high voltage < V_ZT1

(continued t_ZTD

)

LA/ZT pin high voltage ≥ V_ZT1

(continued t_ZTD

)

Operation Mode 3

(No load operation)

Figure 6. Transition of Operation Mode

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4.3

Switch Function of Operation Modes – continued

The operation modes are switched by detecting the LA/ZT pin voltage shown as Figure 6.

When the FB pin voltage > V_FBDETin operation mode 1, however, the operation modes are not switched even if

the status of the LA/ZT pin voltage ≤ V_ZT2continues for t_ZTD

.

In addition, when the status of the FB pin voltage > V_FBDETcontinues for t_FBONin operation mode 2 and 3, the IC

interprets the load status is changed and the operation mode shifts to 1.

4.3.1 Setting of the LA/ZT Pin Voltage

V_ZT1is calculated by the formula below.

Set the LA/ZT pin voltage using the output voltage V_OUTby adjusting the resistor value of R_ZT1and R_ZT2

.

푉푎 = 푁푑 ÷ 푁푠 × (푉_푂푈푇− 푉푓)

푉

= 푅_푍푇2÷ (푅_푍푇1+ 푅_푍푇2) × 푉푎

[V]

푍푇1

푉푎

푁푠

푁푑

푉푓

푅_푍푇1

푅_푍푇2

is the voltage of auxiliary winding.

is the number of wind in the secondary side.

is the number of wind in the auxiliary winding.

is the forward voltage of secondary diode.

is the upper resistor value of auxiliary winding.

is the lower resistor value of auxiliary winding.

Vf

V_OUT

Ns

Va

Nd

VCC

VH

OUT

LA/ZT FB CS GND

R_ZT1

R_ZT2

Figure 7. Items Positions Used in Setting Output Voltage

4.3.2 Setting of Operation Modes

Each operation mode works as shown the table below.

In operation mode 3, it is achieved to reduce the maximum electric power consumption by the increase of

primary peak current and reduction of IC’s current consumption.

Table 2. States of Each Operation Modes

Operation Mode 1

Operation Mode 2

Operation Mode 3

Over Current Detected Voltage

Current Consumption

V_OCP1to V_OCP2

Normal

AV_CS

V_OCP1to V_OCP2

Normal

V_OCP3

Power Save

AV_CS/Ka

Power Save

t_MIN1

Voltage Gain (FB pin / CS pin)

Burst Operation

AV_CS/Ka

Normal

t_MIN1

Minimum ON Width

t_MIN2

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4.3

Switch Function of Operation Modes – continued

4.3.3 Burst Mode at Each Operation Mode

4.3.3.1 Operation Mode 1

When the FB pin voltage becomes less than V_BST1, the switching operation stops. When the FB

pin voltage becomes more than V_BST2, the switching operation restarts.

4.3.3.2 Operation Mode 2

The FB pin voltage becomes less than < V_BST1, the switching operation stops. When the FB pin

voltage becomes more than V_BST2, the switching operation restarts.

In operation mode 2, the IC lowers the voltage gain and increases the primary peak current by

1.33 times. And the minimum ON width is switched to t_MIN2

.

These functions reduce the

number of switching and burst frequency and cut down the switching loss.

4.3.3.3 Operation Mode 3

In operation mode 3, the IC lowers the voltage gain and increases the primary peak current by

1.33 times. These functions reduce the number of switching and burst frequency and cut down

the switching loss.

Load status

No load

Heavy load

1

3

Operation mode

Output Voltage

_(Note)V_OUT1

V_OUT3

FB pin voltage

V_FBDET

t_FBON

V_BST2

V_BST1

t_REC

t_FBOFF

t_REC

t_FBOFF

Switching

A

BC

D

E

F

(Note) V_OUT1and V_OUT3means the output voltage at Operation Mode 1 and Operation Mode 3.

Figure 8. In Case of Load Increase at Operation Mode 3

A:

When the FB pin voltage becomes less than V_BST1, the switching operation is stopped. For

t_FBOFFfrom this stop, the IC’s current consumption is restricted to I_SAVEby the power save

function.

B:

C:

After t_FBOFFfrom A, the timer of burst release recovery time starts to operate.

After t_RECfrom B, when the FB pin voltage become more than V_BST2, the switching

operation restarts.

D:

E:

The setting of the output voltage is switched V_OUT3to V_OUT1in the secondary side.

After restarting the switching operation, when the FB pin voltage becomes more than

V_FBDET, the operation mode switching detection timer 2 starts to work.

The status of the FB pin voltage > V_FBDETlasts more than t_FBON, the operation mode shifts to

1. (The timer is reset if the FB pin voltage becomes V_FBDETor less within t_FBON, and the

F:

switching operation stops again for t_FBOFFif the FB pin voltage becomes less than V_BST1

)

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DC/DC Driver Block – continued

4.4

Soft Start Function

At startup, this function controls the over current detection voltage in order to prevent any excessive voltage or

current rising. This IC enables the soft start operation by changing the over current detection voltage with time.

CS pin voltage

SS1

SS2

V_OCP1to V_OCP3

x 0.640

V_OCP1to V_OCP3

x 0.375

Time

[ms]

t_SS1

t_SS2

Figure 9. Soft Start Function

4.5

FB OLP (Overload Protection)

This IC is latched off when status that the FB pin voltage > V_FBOLP1lasts for t_FBOLP

.

When the FB pin voltage becomes less than V_FBOLP2, the detection timer t_FBOLPis released.

CS pin voltage

(Note)

V_OCP

Output Voltage

FB pin voltage

V_FBOLP1

V_FBOLP2

t_FBOLP

FB overload

detectecd

Switching

Latched off

(Note) V_OCPmeans V_OCP1to V_OCP3and this depends on AC voltage compensation function or operation modes.

Figure 10. FB Overload Protection Function

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DC/DC Driver Block – continued

4.6

CS Pin Protection Function

This IC has a built-in CS OLP and CS OCP in the CS pin.

Table 3. Operation Status of CS Pin Protection Functions

Function

CS OLP

Load Status at Operation to Protect

Detection Voltage

Operation to Protect

IC is latched off

CS pin peak voltage >

V_CSOLP1to V_CSOLP5(for t_CSOLP)

Over the rated load

(Without lowing

of the output voltage)

(set by the external resistor

at the CS pin)

CS pin peak voltage >

V_OCP1to V_OCP3

Over the peak load

(Lowing the output voltage)

CS OCP

Turned off by pulse

(Changed by AC voltage

compensation function

at operation mode 1 and 2)

4.6.1 CS OLP (Overload Protection)

This IC has a built-in overload protection function correspond to rated load.

When the status of the CS pin peak voltage > V_CSOLP1to V_CSOLP5lasts for t_CSOLP, this IC is latched off. It is not

turned off by pulse per pulse. In addition, the overload detection voltage can be switched by the value of

the external resistor R_CSSat the CS pin.

This IC monitors the voltage occurred in the CS pin after t_SETfrom the release of VCC UVLO and switches

the V_CSOLP1to V_CSOLP5as shown in Table 4. For t_SET, the CS pin is pulled up by R_CS2in the internal

reference voltage.

Table 4. Detection Voltage

Detection

R_CSS(kΩ)

VCC

VH

OUT

Voltage

V_CSOLP1

V_CSOLP2

V_CSOLP3

V_CSOLP4

V_CSOLP5

0.0 to 1.0

2.0 to 2.4

4.7 to 5.6

10.0 to 12.0

20.0 or above

LA/ZT FB

CS GND

R_CSS

Figure 11. Position of R_CSS

CS pin voltage

(Note)

V

CSOLP

t_CSOLP

CS overload

detectecd

Switching

Latched off

(Note) V_CSOLPmeans V_CSOLP1to V_CSOLP5and this depends on Value of R_CSS

.

Figure 12. CS Pin Overload Protection

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4.6

CS Pin Protection Function – continued

4.6.2 CS OCP (Over Current Protection)

This IC has a built-in over current protection function per switching cycles. This function stops the switching

operation if the CS pin peak voltage becomes more than V_OCP1to V_OCP3

. It also has a built-in AC voltage

compensation function. This function compensates the dependent on AC voltage by making V_OCP1to V_OCP3

increase with time. V_OCP1to V_OCP3is also changed by the operation modes.

f_SW1

ON

Switching

(AC100 V)

Switching

(AC100 V)

OFF

ON

Switching

(AC240 V)

Switching

(AC240 V)

I_PEAK(AC)

V_DC= 240 V

I_PEAK(AC)

V_DC= 240 V

V_DC= 100 V

(Note)

compensated

V_OCP

(Note)

constant

V_OCP

Primary

Peak Current

t_DELAYt_DELAY

t_DELAY

(Note) V_OCPmeans V_OCP1to V_OCP3and this depends on AC voltage compensation function or operation modes.

Figure 13. Without the Compensation Function

Figure 14. With the Compensation Function

4.6.2.1 AC Voltage Compensation Function

The dependent on AC voltage of primary peak current is compensated by changing the over

current detection voltage of the CS pin with time. The primary peak current entering overload

mode is calculated using the formula below.

퐼_푃퐸퐴퐾= 푉_푂퐶푃1÷ 푅푠 + 푉_퐷퐶÷ 퐿푝 × 푡_{퐷퐸ꢀ퐴푌}

[A]

퐼_푃퐸퐴퐾

푉_푂퐶푃1

푅푠

푉_퐷퐶

퐿푝

is the primary peak current.

is the over current detection voltage V_OCP1

is the current detection resistor.

is the input DC voltage.

.

is the value of primary coil inductor.

푡_{퐷퐸ꢀ퐴푌}is the delay time after the over current detection.

The over current detection voltage is set by t_ONin the range of V_OCP1to V_OCP2

Calculated the over current detection voltage with the approximation below.

.

푉_푂퐶푃= −0.0ꢁ04 × 푡_푂ꢂ²+ 0.ꢁ03ꢃ × 푡_푂ꢂ+ 0.36[V]

푉_푂퐶푃

푡_푂ꢂ

:

is the over current detection voltage set by 푡_푂ꢂ

is the ON time.

CS pin voltage

V_OCP2

V_OCP1

ON Time [µs]

10.0

0.0

Figure 15. State Transition of Over Current Detection Voltage by Time

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4.6

CS Pin Protection Function – continued

4.6.3 Leading Edge Blanking Function

Normally, when the MOSFET for switching is turned ON, surge current is generated at each capacitor

component and drive current and so on. At this time, detection errors may occur in the over current

protection function because the CS pin voltage rises temporary. To prevent these errors, Leading Edge

Blanking function is built in this IC. This function masks the CS pin voltage for t_LEBfrom the switch of the OUT

pin voltage low to high.

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Description of Blocks – continued

5

ZT OVP (Over Voltage Protection)

The LA/ZT pin has two built-in latch type over voltage protection function which are the pulse detection and DC

detection.

5.1

DC Detection

When the status that the LA/ZT pin voltage > V_ZTLlasts for more than t_LATCH, the switching operation is latched

off.

V_ZTL

Pulse

LA/ZT pin voltage

>t_LATCH

≤t_LATCH

ZT over voltage

detectecd

Latched off

Switching

A

B

C

D

Figure 16. LA/ZT Pin Over Voltage Protection (DC Detection)

A:

B:

C:

D:

When the LA/ZT pin voltage becomes more than V_ZTL, ZT OVP detection timer t_LATCHstarts to operate.

The timer is reset because the LA/ZT pin voltage becomes V_ZTLor less within t_LATCH

When the LA/ZT pin voltage becomes more than V_ZTL, ZT OVP detection timer t_LATCHstarts to operate.

When the status of the LA/ZT pin voltage > V_ZTLlasts for more than t_LATCH, the switching operation is

latched off.

.

5.2

Pulse Detection

This IC is latched off when it passes from the three consecutive detections of the LA/ZT pin voltage pulse > V_ZTL

for t_LATCH

.

The IC does not detect the LA/ZT pin voltage for this term because it has a built-in ZT OVP detection

mask timer t_ZTMKcorresponding the surge at the turn on of the LA/ZT pin voltage.

OUT pin voltage

V_ZTL

LA/ZT pin voltage

t_ZTMK

ZT over voltage

comparator

1

2

3

t_LATCH

ZT over voltage

detectecd

Latched off

Switching

A

B

C

D

Figure 17. LA/ZT Pin Over Voltage Protection (Pulse Detection)

A: When the OUT pin is turned OFF, the LA/ZT pin becomes high voltage. The LA/ZT pin voltage becomes

more than V_ZTLmomentary, however, ZT OVP is not detected because it is within t_ZTMKfrom reaching high

voltage.

B: When the LA/ZT pin voltage > V_ZTLis detected after t_ZTMKfrom reaching high voltage, ZT OVP is detected.

C: When the three consecutive voltage pulse of the LA/ZT pin voltage > V_ZTLis detected, ZT OVP detection

timer t_LATCHstarts to operate.

D: When it passes from C for t_LATCH, the switching operation is latched off.

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Description of Blocks – continued

6

OUT Pin Gate Clamp Circuit

The high level of the OUT pin is clamped to V_OUTHto prevent the gate voltage of external MOSFET from being

damaged. The OUT pin is pulled down by R_PDOUTin the inside.

VCC

High Voltage

Clamp

MOSFET

OUT

POUT

PRE

Driver

R_PDOUT

NOUT

FB

LA/ZT

CS

Figure 18. Positions of External MOSFET and R_PDOUT

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Description of Blocks – continued

7

Operation Mode of Protection Functions

The operation modes of each protection function are shown in Table 5

Table 5. Operation Modes of Protection Functions

AC UVLO

VCC UVLO

FB OLP

Detection

Conditions

VCC pin voltage < V_UVLO2

(at voltage falling)

FB pin voltage > V_FOLP1

(at voltage rising)

VH pin peak voltage ≤ V_INLVP

Release

Conditions

VCC pin voltage > V_UVLO1

(at voltage rising)

VH pin peak voltage > V_INLVP

VCC pin voltage < V_LATCH

Detection Timer

t_INLVP

t_FBOLP

–

(Reset

Conditions)

(VH pin peak voltage > V_INLVP

)

(FB pin voltage < V_FOLP2)

Release Timer

–

(Reset

Conditions)

Auto Recovery

or

Latch

Auto Recovery

CS OLP

Auto Recovery

Latch

ZT OVP

Detection

Conditions

CS pin peak voltage > V_CSOLP

(V_CSOLPis set by R_CSS

ZT pin peak voltage > V_ZTL

)

Release

Conditions

VCC pin voltage < V_LATCH

Detection Timer

t_CSOLP

t_LATCH

(CS pin peak voltage ≤ V_CSOLP

)

(ZT pin peak voltage < V_ZTL)

(Reset Conditions)

Release Timer

–

(Reset Conditions)

Auto Recovery

or

Latch

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

Rating

to +6.5

Unit

Condition

LA/ZT pin ^{(Note 1)}

Maximum Applied Voltage 1

Maximum Applied Voltage 2

Maximum Applied Voltage 3

Maximum Applied Voltage 4

Maximum Applied Voltage 5

Maximum Applied Voltage 6

LA/ZT Pin Maximum Source Current

LA/ZT Pin Maximum Sink Current

OUT Pin Maximum Source Current

OUT Pin Maximum Sink Current

Power Dissipation

V_MAX1

V_MAX2

V_MAX3

V_MAX4

V_MAX5

V_MAX6

I_SZT1

V

-0.3 to +6.5

-0.3 to +15

-0.3 to +58

-0.3 to +650

+1.0

FB pin

V

CS pin

OUT pin

VCC pin

VH pin

V

mA

A

I_SZT2

-4.0

I_SOOUT

I_SKOUT

Pd

0.20

1.00

A

(Note 2)

0.68

W

°C

Maximum Junction Temperature

Tjmax

150

Storage Temperature Range

Tstg

-55 to +150

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1)

(Note 2)

Need to use the LA/ZT pin voltage within the range of LA/ZT Pin Maximum Source Current and LA/ZT Pin Maximum Sink Current.

At mounted on a glass epoxy single layer PCB (114.3 mm x 76.2 mm x 1.57 mm). Derate by 5.4 mW/°C if the IC is used in the ambient

temperature Ta 25 °C or above.

Thermal Dissipation

Make the thermal design so that the IC operates in the following conditions.

(Because the following temperature is guarantee value, it is necessary to consider margin.)

1. The ambient temperature Ta must be 105 °C or less.

2. The IC’s loss must be the power dissipation Pd or less.

The thermal abatement characteristic is as follows.

(At mounting on a glass epoxy single layer PCB which size is 114.3 mm x 76.2 mm x 1.57 mm)

1.0

0.8

0.6

0.4

0.2

0.0

0

25

50

75

100

125

150

Ta [ºC]

Figure 19. SOP-J7S Thermal Dissipation Characteristic

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Recommended Operating Condition

Parameter

Symbol

Min

Typ

Max

Unit

VCC Pin Power Supply Range

VH Pin Power Supply Range

VCC Pin Capacitor

V_CC

V_H

9.3

-

55.0

300 ^{(Note 2)}

-

V

C_VCC

R_VH

Topr

4.7

-

µF

kΩ

°C

VH Pin Resistor

2.0

Operating Temperature

-40

+105

(Note 2) The recommendation maximum operating voltage shows AC 300 V which is the input AC voltage in the application.

Apply the input AC voltage which is full-wave-rectified to the VH pin.

Electrical Characteristics

(Unless otherwise noted, Ta = 25 °C, V_CC= 15 V)

Parameter

Circuit Current

Symbol

Min

Typ

Max

Unit

Condition

Current at Switching Operation

Current at Burst Operation

Current at Power Save Operation

Current at Latched Stop

I_ON1

I_ON2

I_SAVE

I_LATCH

0.20

0.04

0.10

0.70

0.35

0.11

0.22

1.30

0.50

0.16

0.35

mA

FB pin voltage = 2.0 V

FB pin voltage = 0.3 V

Operation Mode 3

Startup Circuit Block and VH Pin Protection Function

Startup Current

I_START1

I_START2

V_INLVP

t_INLVP

8.0

5

15.0

12

25.0

20

mA

µA

V

V_CC= 10 V, V_H= 100 V

V_H= 100 V

VH Pin OFF Current

AC UVLO Detection Voltage

AC UVLO Stop Timer

83

99

115

195

105

150

ms

VCC Pin Protection Function

VCC UVLO Release Voltage

VCC UVLO Detection Voltage

VCC UVLO Hysteresis

V_UVLO1

V_UVLO2

V_UVLO3

V_CHG1

V_CHG2

V_LATCH

12.50

7.90

-

13.50

8.60

14.50

9.30

-

V

At VCC pin voltage rising

At VCC pin voltage falling

V_UVLO3= V_UVLO1- V_UVLO2

4.90

VCC Recharge Start Voltage

VCC Recharge Stop Voltage

Latch Release Voltage

8.60

9.40

-

9.30

10.00

11.00

-

10.20

V_UVLO2– 1.0

VCC pin voltage

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Electrical Characteristics – continued

(Unless otherwise noted, Ta = 25 °C, V_CC= 15 V)

Parameter

Symbol

Min

Typ

Max

Unit

Condition

DC/DC Driver Block

Switching Frequency 1

f_SW1

f_SW2

111

90

18

-

130

100

28

149

110

38

-

kHz

Switching Frequency 2

Switching Frequency 3

f_SW3

Voltage Gain (FB Pin / CS Pin)

Voltage Gain Shift Factor

AV_CS

Ka

4.0

V/V Operation Mode 1

V/V Operation Mode 2, 3

%

-

1.33

75

-

Maximum Duty

D_MAX

V_BST1

V_BST2

V_FBSW1

V_FBSW2

V_FBPK1

V_FBPK2

t_LEB

67

0.350

-

83

0.450

-

FB Pin Burst Voltage 1

0.400

0.450

1.35

1.15

3.0

V

At the FB pin voltage falling

At the FB pin voltage rising

FB Pin Burst Voltage 2

Frequency Reduction Start FB Pin Voltage

Frequency Reduction Stop FB Pin Voltage

Peak Load Frequency Rising Start Voltage

Peak Load Frequency Rising Stop Voltage

CS Pin Leading Edge Blanking Time

CS Pin Pulled up Resistor 1

CS Pin Pulled up Resistor 2

FB Pin Pulled up Resistor

1.15

0.95

2.8

3.0

-

1.55

1.35

3.2

3.4

-

V

3.2

V

0.300

1.0

µs

R_CS1

R_CS2

R_FB

0.7

14

24

-

1.3

26

36

-

MΩ At Normal Operation

20

kΩ

µs

At Startup

30

Minimum ON Width 1

t_MIN1

0.40

2.0

Operation Mode 1, 3

Operation Mode 2

Minimum ON Width 2

t_MIN2

1.5

2.5

DC/DC Driver Block (Switch Function of Operation Modes)

Switching Operation Mode

V_ZT1

0.60

1.80

0.64

3.15

1.72

8.0

0.70

2.00

0.70

4.50

2.30

10.0

100

0.80

2.20

0.76

5.85

2.88

12.0

200

V

LA/ZT Pin Voltage 1

Switching Operation Mode

V_ZT2

LA/ZT Pin Voltage 2

Switching Operation Mode

V_FBDET

FB Pin Voltage

Switching Operation Mode

t_ZTD

ms LA/ZT pin voltage

Detection Timer 1

Switching Operation Mode

t_FBON

ms FB pin voltage

Detection Timer 2

Stop Timer at Burst Operation

t_FBOFF

t_REC

ms

µs

Recovery Timer

at Burst Operation Released

50

DC/ DC Driver Block (Soft Start Function)

Soft Start Time 1

Soft Start Time 2

t_SS1

0.66

2.76

1.10

4.60

1.54

6.40

ms

DC/ DC Driver Block (FB Pin Overload Protection Function)

FB OLP Detection Voltage

FB OLP Release Voltage

FB OLP Detection Timer

V_FBOLP1

V_FBOLP2

t_FBOLP

3.20

3.00

234

3.40

3.20

300

3.60

3.40

366

V

ms

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Electrical Characteristics – continued

(Unless otherwise noted, Ta = 25 °C, V_CC= 15 V)

Parameter

Symbol

Min

Typ

Max

Unit

Condition

DC/ DC Driver Block (CS Pin Overload Protection Function)

CS OLP Detection Voltage 1

CS OLP Detection Voltage 2

CS OLP Detection Voltage 3

CS OLP Detection Voltage 4

CS OLP Detection Voltage 5

CS OLP Detection Timer

V_CSOLP1

V_CSOLP2

V_CSOLP3

V_CSOLP4

V_CSOLP5

t_CSOLP

0.320

0.370

0.415

0.460

0.510

1063

0.350

0.400

0.450

0.500

0.550

1450

0.380

0.430

0.485

0.540

0.590

1836

V

R_CSS= 0 to 1.0 kΩ

R_CSS= 2.0 to 2.4 kΩ

R_CSS= 4.7 to 5.6 kΩ

R_CSS= 10 to 12 kΩ

R_CSS= 20 kΩ or more

V

ms

CS OLP Detection Voltage

Setting Time

t_SET

150

300

450

µs

DC/ DC Driver Block (CS Pin Over Current Protection Function)

CS OCP Detection Voltage 1

CS OCP Detection Voltage 2

CS OCP Detection Voltage 3

V_OCP1

V_OCP2

V_OCP3

0.330

-

0.350

0.620

0.200

0.370

-

V

t_ON= 0 µs (Operation Mode1, 2)

t_ON= 10 µs (Operation Mode 1, 2)

Operation Mode 3

0.180

0.220

LA/ZT Pin Protection Function Block

ZT OVP Detection Voltage

ZT OVP Detection Timer

V_ZTL

t_LATCH

t_ZTMK

4.50

75

-

4.70

150

4.90

250

-

V

µs

ZT OVP Detection Mask Timer

0.40

OUT Pin Gate Clamp Circuit Block

OUT Pin Clamp Voltage

OUT Pin Nch MOS R_ON

V_OUTH

R_NOUT

R_PDOUT

10.50

12.50

4.8

14.50

8.0

V

Ω

V_CC= 15 V

-

OUT Pin Pulled down Resistor

70

100

130

kΩ

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Typical Performance Curves

(Reference Data)

1.60

1.40

1.20

1.00

0.80

0.60

0.40

0.20

0.00

0.6

0.5

0.4

0.3

0.2

0.1

0.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 20. Current at Switching Operation vs Temperature

Figure 21. Current at Burst Operation vs Temperature

0.20

0.15

0.10

0.05

0.00

250

200

150

100

50

0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 22. Current at Power Save Operation vs Temperature

Figure 23. AC UVLO Stop Timer vs Temperature

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Typical Performance Curves – continued

(Reference Data)

18.0

17.0

16.0

15.0

14.0

13.0

12.0

11.0

10.0

12.0

11.0

10.0

9.0

8.0

7.0

6.0

5.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 24. VCC UVLO Detection Voltage vs Temperature

Figure 25. VCC UVLO Release Voltage vs Temperature

150

140

130

120

110

100

120.0

110.0

100.0

90.0

80.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 26. Switching Frequency 1 vs Temperature

Figure 27. Switching Frequency 2 vs Temperature

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Typical Performance Curves – continued

(Reference Data)

50.0

40.0

30.0

20.0

10.0

90

85

80

75

70

65

60

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 28. Switching Frequency 3 vs Temperature

Figure 29. Maximum Duty vs Temperature

0.50

0.45

0.40

0.35

0.30

1.6

1.5

1.4

1.3

1.2

1.1

1.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 30. FB Pin Burst Voltage 1 vs Temperature

Figure 31. Frequency Reduction Start

FB Pin Voltage vs Temperature

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Typical Performance Curves – continued

(Reference Data)

1.40

1.35

1.30

1.25

1.20

1.15

1.10

1.05

1.00

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 32. Frequency Reduction Stop

FB Pin Voltage vs Temperature

Figure 33. Minimum ON Width 1 vs Temperature

2.5

2.4

2.3

2.2

2.1

2.0

1.9

1.8

1.7

1.6

1.5

14.0

13.0

12.0

11.0

10.0

9.0

8.0

7.0

6.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 34. Minimum ON Width 2 vs Temperature

Figure 35. Stop Timer at Burst Operation vs Temperature

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Typical Performance Curves – continued

(Reference Data)

0.40

0.39

0.38

0.37

0.36

0.35

0.34

0.33

0.32

0.31

0.30

0.40

0.39

0.38

0.37

0.36

0.35

0.34

0.33

0.32

0.31

0.30

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 36. CS OLP Detection Voltage 1 vs Temperature

Figure 37. CS OCP Detection Voltage 1 vs Temperature

15.0

14.5

14.0

13.5

13.0

12.5

12.0

11.5

11.0

10.5

10.0

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 38. OUT Pin Clamp Voltage vs Temperature

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I/O Equivalence Circuit

7

VH

-

6

VCC

5

OUT

VCC

VH

Starter

OUT

-

Voltage

Detect

GND

1

LA/ZT

2

FB

3

CS

Internal Ref.

4

GND

Internal Ref.

CS

FB

LA/ZT

GND

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately

but connected to a single ground at the reference point of the application board to avoid fluctuations in the

small-signal ground caused by large currents. Also ensure that the ground traces of external components do not

cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line

impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the

electrical characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions

during transport and storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result

in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N

junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or

transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 39. Example of IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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BM1P10CFJ

Ordering Information

B M 1 P

1

0 C F

J

-

E 2

Packing and forming specification

E2: Embossed tape and reel

Marking Diagram

SOP-J7S (TOP VIEW)

Part Number Marking

LOT Number

1 P 1 0 C

Pin 1 Mark

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TSZ22111 • 15 • 001

BM1P10CFJ

Physical Dimension and Packing Information

Package Name

SOP-J7S

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BM1P10CFJ

Revision History

Date

Rev.

001

Changes

New Release

03.Feb.2020

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TSZ22111 • 15 • 001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BM1P10CFJ
厂家：	ROHM
描述：	本IC作为AC/DC电源用PWM控制器，为所有带有插口的产品提供优良的系统。通过外接开关MOSFET及电流检测电阻，可实现高自由度的电源设计。内置有AC低电压保护功能和X电容器放电功能，在轻负载时可降低频率、启动脉冲串，实现高效率。此外，还内置有节电功能，可降低无负载时的耗电。本IC配备后述的各种保护功能。开关控制器脉冲电容器
文件：	总35页 (文件大小：1557K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM1P10CFJ [ROHM]

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