BM1R00178F [ROHM]
BM1R00178F是用于二次测输出段的同步整流控制器。内置低功耗高精度分流稳压器,可减少待机功耗。分流稳压器由完全独立芯片构成,因此即使在High Side使用时,也可作为GND基准工作。连续模式工作时,可以不输入一次侧开关同步信号进行动作,有助于进一步节省空间。工作电源电压范围广,为2.7V~32V,可应对各种输出的应用。采用高耐压120V(Max)处理器,可直接监视漏极电压。;型号: | BM1R00178F |
厂家: | ROHM |
描述: | BM1R00178F是用于二次测输出段的同步整流控制器。内置低功耗高精度分流稳压器,可减少待机功耗。分流稳压器由完全独立芯片构成,因此即使在High Side使用时,也可作为GND基准工作。连续模式工作时,可以不输入一次侧开关同步信号进行动作,有助于进一步节省空间。工作电源电压范围广,为2.7V~32V,可应对各种输出的应用。采用高耐压120V(Max)处理器,可直接监视漏极电压。 开关 控制器 稳压器 |
文件: | 总25页 (文件大小:1854K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Built-in Low Consumption and High Accuracy Shunt Regulator
High Efficiency, Low Standby Power and
CCM Corresponding
Secondary Side Synchronous Rectification
Controller IC
BM1R00178F
General Description
Key Specifications
BM1R00178F is synchronous rectification controller to be
used in the secondary side output. It has a built-in low
consumption and high accuracy shunt regulator, which
reduces standby power. Since the shunt regulator is
made up of completely independent chips, it can operate
as a GND reference even when it is used with High Side.
At continuous conduction mode (CCM) operation, further
space saving can be realized when operating without the
input switching synchronizing signal of the primary side.
BM1R00178F also feature a wide operating supply
voltage of 2.7V to 32V for various output applications.
In addition, by adopting the high voltage 120V (Max)
process, it is possible to monitor the drain voltage directly.
Supply Voltage
Circuit Current (No Switching):
DRAIN Monitor Pin Absolute Voltage: 120V(Max)
Operating Temperature Range: -40°C to +105°C
2.7V to 32V
800µA(Typ)
Package
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.20mm x 1.71mm
SOP8
Features
Built-in Low Consumption and High Accuracy Shunt
Regulator, which Reduces Standby Power
Synchronous Rectification FET Layout: High/Low
Side
120V (Max) High Voltage Process DRAIN Monitor Pin
Wide Supply Voltage Range of 2.7V to 32V
Supports Drive Type: PWM, QR and LLC Controller
etc.
Applications
No Input Required on the Primary-Side at CCM
Built-in Over Voltage Protection for SH_IN and
SH_OUT Pin
AC/DC Output Power Conversion Applications:
Charger, Adapter, TV, Rice Cooker, Humidifier, Air
Conditioning, Vacuum Cleaner, etc.
Built-in Thermal Shutdown Function
Typical Application Circuits
D2
M1
CVCC
VOUT
VOUT
CVCC
RDRAIN1
DRAIN
VCC
RDRAIN2
LFB1
DRAIN
VCC
Primary
Controler
D1
SR_GND
D1
SH_IN
+
-
SR_GND
SH_IN
COUT
Primary
Controler
GATE
SH_OUT
SH_GND
+
-
COUT
GATE
SH_OUT
SH_GND
RMAX_TON
R1 C1
MAX_TON
MAX_TON
GND
R1
C1
RMAX_TON
GND
M1
Figure 1. Flyback Application Circuit (Low side FET)
Figure 2. Flyback Application Circuit (High side FET)
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
.
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BM1R00178F
Pin Configuration
(TOP VIEW)
VCC
SH_IN
DRAIN
SR_GND
SH_OUT
SH_GND
GATE
MAX_TON
Pin Description
Pin No.
Pin Name
VCC
Function
1
Power supply input
Shunt regulator reference input
2
3
4
5
6
7
8
SH_IN
SH_OUT
SH_GND
MAX_TON
GATE
Shunt regulator power supply / output
Shunt regulator GND
Set maximum on time
Secondary side FET GATE drive
Synchronous rectification GND
Secondary side FET DRAIN monitor
SR_GND
DRAIN
Block Diagram
VOUT
GND
+
-
Primary
Side
Controller
SHUNT
LDO BLOCK
REGULATOR
-
+
DRAIN COMP
-
0.800V
(Typ)
+
PROTECTION BLOCK
・SH_IN_OVP
・SH_OUT_OVP
・TSD
Timer
Auto
Restart
VCCx1.4
SET COMP
-
+
S
Q
-100mV
(Typ)
R
MAX_TON
SR_GND
MAX_TON
BLOCK
RESET COMP
+
-
Compulsion
OFF Time
-6mV
(Typ)
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BM1R00178F
Description of Block
1. SET_COMP Block
Monitors the DRAIN pin voltage, and outputs a signal to turn on the FET if the DRAIN pin voltage is less than or equal to
-100mV (Typ).
2. RESET_COMP Block
Monitors the DRAIN pin voltage and outputs a signal to turn off the FET if the DRAIN pin voltage is more than or equal
to -6mV (Typ).
3. Compulsion OFF Time Block
When the FET is turned OFF due to RESET COMP detection, resonance waveforms appear on the DRAIN pin. To
prevent the resonance waveforms from turning on the FET, an OFF state should be forced for a certain time.
Operation sequence of each block is shown on the figure below.
VOUT
Secondary Side
0V
DRAIN
-6mV
-100mV
-6mV
-6mV
-100mV
-6mV
-100mV
-100mV
SET COMP
0V
ON
ON
RESET
RESET
RESET COMP
0V
0V
ON
OFF
Secondary side
GATE
ON
Compulsion
OFF Time
0V
OFF
Time
OFF
Time
Figure 3. Operation sequence
About Maximum Input Frequency
The Maximum Operating Frequency of the IC depends on the Compulsion OFF Time. For example, BM1R00178F
Compulsion OFF Time is equal to 3.000μs. Considering a variation of 9%, the maximum input frequency is given by the
following:
1
푓푀퐴푋
=
= ꢀꢁ5
[kHz]
(
)
3.000 µ푠 ×1.09
However, because the frequency largely fluctuates depending on the input voltage, load conditions, etc., it will be different
for each application.
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BM1R00178F
Description of Block – continued
4. MAX_TON Block
MAX_TON block sets the maximum ON time. The rising edge whose DRAIN pin voltage is equal to or more than the
output voltage VCC x 1.4 V (Typ) is detected and counting is started. In addition, the synchronous rectification FET will be
forced OFF after the set time has elapsed.
The relationship between the resistance value (RMAX_TON) and set time (tMAX_ON) is described as follows:
푡푀퐴푋_푇푂푁 [ꢂs] × ꢃꢁ [kΩ/ꢂs] = 푅푀퐴푋_푇푂푁 [kΩ]
Calculation Example:
If you want to set the maximum ON time to 10µs, the value of RMAX_TON is as follows:
ꢃꢁ [ꢂs] × ꢃꢁ [kΩ/ꢂs] = ꢃꢁꢁ [kΩ]
However, the formula above is for an ideal approximation only. It is strongly advised that the operation of the actual
application should be verified.
By setting this time, it becomes possible to prevent the simultaneous ON operation of the primary side and the secondary
side in CCM.
The drive sequence in CCM operation is shown in the figure below:
VOUT
(3)
(1)
(1)
+
-
I2
VF
I1
GND
VG1
0V
LFB
RDRAIN2
VG1
VG2
Primary
Side
Controller
RDRAIN1
D1
I1
0A
0A
VDS2
I2
LDO BLOCK
VCC×1.4
DRAIN COMP
-
+
VCCx1.4
-
SET COMP
0V
0V
VDS2
C1 R1
-100mV
-100mV
+
S
Q
-100mV
(Typ)
R
-VF
(6)
MAX_TON
MAX_TON
BLOCK
(4)
RMAX_TON
VG2
tMAX_ON
tMAX_ON
RESET COMP
MAX_TON
timer
+
-
Compulsion
OFF Time
Period allotted for VG1 and VG2
to avoid concurrent ON state
at CCM.
-6mV
(Typ)
(5)
(2)
Figure 4. The drive sequence in CCM operation
(1) Primary side FET = ON. Current I1 flows to the primary side FET. Secondary side drain voltage VDS2 rises.
(2) The VDS2 = VCC×1.4 detects the rise edge of the threshold, MAX_TON timer start.
(3) Primary side FET=OFF. Current I2 flows through the Body Diode of the secondary side FET (OFF state).
(4) Secondary side drain voltage VDS2≤-100mV by current I2, Secondary side FET=ON.
(5) Elapsed the set time in MAX_TON pin, the secondary side FET = compulsion OFF.
(6) Since the I2 current flows through the Body Diode, VF voltage occurs.
In order to reduce the influence of the switching noise as much as possible, capacitor C1 and resistor R1 in series should
be connected to the MAX_TON pin. It is recommended that the capacitance be about 1000pF and the resistance value
be about 1kΩ. This also serves as phase compensation of MAX_TON pin and therefore should be connected.
For quasi-resonance(QR), LLC application, this function is unnecessary because it basically does not operate in CCM.
The setting method of the MAX_TON pin is invalidated by pulling up to the VCC pin.
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BM1R00178F
Description of Block – continued
5. SHUNT REGULATOR Block
It is a low consumption, high accuracy shunt regulator that controls the AC/DC output voltage. Since it is a built-in
completely separate chip from the synchronous rectification chip, GND insulation is possible. Therefore, if the FET is
placed on the high side, the synchronous rectification application can also make the shunt regulator the secondary side
GND reference. It can also be used as a protection comparator.
6. PROTECTION Block
When protection is detected, the timer starts counting. After completion, drive the photo coupler from the SH_OUT pin to
stop the primary side drive operation.
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BM1R00178F
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
-0.3 to +40(Note 1)
V
V
V
V
V
VMAX_VCC
VMAX_MAX_TON
VMAX_SH_IN
VMAX_SH_OUT
VMAX_GATE
VMAX_DRAIN
Tjmax
VCC Input Voltage
(Note 1)
MAX_TON Output Voltage
SH_IN Input Voltage
-0.3 to +VMAX_VCC
-0.3 to +40(Note 2)
-0.3 to +40(Note 2)
-0.3 to +15.5(Note 1)
SH_OUT Input/Output Voltage
Gate Output Voltage
Drain Input Voltage
120 (Note 1) (Note 3)
+150
V
°C
Maximum Junction Temperature
Storage Temperature
-55 to +150
°C
Tstg
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Reference SR_GND.
(Note 2) Reference SH_GND.
(Note 3) When a negative voltage is applied, current flows through the ESD protection device. This current value is about 6mA or less and will require a current
limiting resistor to the DRAIN pin.
Thermal Resistance (Note 4)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s (Note 6)
2s2p (Note 7)
SOP8
Junction to Ambient
Junction to Top Characterization Parameter (Note 5)
θJA
197.4
21
109.8
19
°C/W
°C/W
ΨJT
(Note 4) Based on JESD51-2A(Still-Air)
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 6) Using a PCB board based on JESD51-3.
(Note 7) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
70µm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70µm
Copper Pattern
Thickness
35µm
Thickness
70µm
Footprints and Traces
74.2mm x 74.2mm
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BM1R00178F
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VCC
Topr
2.7
-40
56
20
+25
-
32
+105
300
2
V
Supply Voltage
°C
kΩ
kΩ
pF
Operating Temperature
MAX_TON RMAX_TON Resistor Range
RMAX_TON
R1
MAX_TON R1
MAX_TON C1
0.5
680
1
C1
1000
2200
Electrical Characteristics (Unless otherwise specified VCC=20V VSH_OUT=20V Ta=25°C)
Spec
Parameter
Circuit Current
Symbol
Unit
Conditions
Min
Typ
Max
fSW=50kHz at Switching Mode
(GATE=OPEN)
Circuit Current1
ION
0.5
1
2
mA
Circuit Current2
IACT
IOFF
350
18
800
35
1400
60
µA
µA
Switching Stop Mode
VCC=1.9V, UVLO Mode
Circuit Current3
VCC Item
VCC UVLO Threshold Voltage1
VCC UVLO Threshold Voltage2
SR Controller BLOCK
GATE Turn ON Threshold
GATE Turn OFF Threshold
Compulsion OFF Time
MAX_TON BLOCK
VUVLO1
VUVLO2
2.00
1.95
2.30
2.25
2.65
2.60
V
V
VCC Sweep Up
VCC Sweep Down
VGON
VGOFF
tCOFF
-150
-10
-100
-6
-50
-1
mV
mV
µs
VDRAIN=+300mV to -300mV
VDRAIN=-300mV to +300mV
2.730 3.000 3.270
MAX_TON Timer Start Threshold
Voltage
VCC=20V
Pulse Input to DRAIN Pin
VMAX_ON_START
24
28
32
V
RMAX_TON=100kΩ
VCC=3V, VDRAIN=-0.3V↔+7V
MAX_TON Timer
tMAX_ON
9.4
10
10.6
0.56
µs
V
MAX_TON Output Voltage
Drain Monitor BLOCK
Drain Pin Sink Current
Drain Pin Source Current1
Drain Pin Source Current2
Driver BLOCK
VMAX_ON
0.24
0.40
ID_SINK
130
-23
250
-11
-1
550
-5
µA
µA
µA
VDRAIN=120V
VDRAIN=0.1V
VDRAIN=-0.2V
IDRAIN_SO1
IDRAIN_SO2
-3.0
-0.3
GATE Pin High Voltage
VGATE_H1
RHIONR1
RHIONR2
11
12.0
6.0
4.0
1.1
0.9
-
12
23.0
12.0
9.0
2.2
1.8
14
50.0
24.0
18.0
4.4
3.6
-
V
Ω
Ω
Ω
Ω
Ω
ns
ns
VCC=20V
High Side FET ON-Resistance1
High Side FET ON-Resistance2
High Side FET ON-Resistance3
Low Side FET ON-Resistance1
Low Side FET ON-Resistance2
Delay Time GATE Pin Turn ON
Delay Time GATE Pin Turn OFF
VCC=2.7V, IOUT= -10mA
VCC=5.0V, IOUT= -10mA
VCC=10V, IOUT= -10mA
VCC=2.7V, IOUT= +10mA
VCC=5.0V, IOUT= +10mA
VDRAIN=+300mV to -300mV
VDRAIN =-300mV to +300mV
RHIONR3
RLOWONR1
RLOWONR2
tDELAY_ON
tDELAY_OFF
50
100
-
-
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BM1R00178F
Electrical Characteristics - continued
Spec
Typ
Parameter
Shunt Regulator BLOCK
Reference Voltage
Symbol
Unit
Conditions
Min
Max
VSH_OUT=5V
SH_OUT Sink Current=100µA
VSHREF
∆VSHEMP
∆VSHREF1
0.796 0.800 0.804
V
VSH_OUT=5V
SH_OUT Sink Current=100µA
Ta=+25°C to +105°C
Reference Voltage
Changing Ratio by Temperature
-
-
-4
1
-
-
mV
mV
SH_OUT Coefficient
of the Reference Voltage1
VSH_OUT=2.7V to 5V
SH_OUT Sink Current=100µA
SH_OUT Coefficient
of the Reference Voltage2
VSH_OUT=5V to 20V
SH_OUT Sink Current=100µA
∆VSHREF2
-
2
-
mV
µA
Reference Input Current
ISH_IN
-0.2
0.0
+0.2
VSH_IN=2V
SH_OUT Sink Current
=100µA to 300µA
(VSH_OUT=2.7V)
SH_OUT Sink Current
=100µA to 300µA
(VSH_OUT=20V)
Dynamic Impedance1
RSH_OUT1
-
-
0.3
0.2
-
-
Ω
Ω
Dynamic Impedance2
RSH_OUT2
SH_OUT Current at SH_IN=Low
SH_OUT Regulation Current
ISH_OUT
20
1
40
-
75
-
µA
VSH_IN=0V, VSH_OUT=5V
ISH_OUT_REG
mA
VSH_IN=0.85V, VSH_OUT=5V
SH_IN OVP Detection Voltage1
SH_IN OVP Detection Voltage2
SH_OUT OVP Detection Voltage1
SH_OUT OVP Detection Voltage2
VSHI_OVP1
VSHI_OVP2
VSHO_OVP1
VSHO_OVP2
tPROTECTION
V
V
0.90
0.85
32.5
31.5
100
1.00
0.95
35
1.10
1.05
37.5
36.5
300
VSH_IN Sweep Up
VSH_IN Sweep Down
VSH_OUT Sweep Up
VSH_OUT Sweep Down
V
V
34
200
Protection Detect Timer
SH_OUT Pull Down Current
at Protection Detect Mode
µs
IPROTECTION
1.3
2.5
5.0
mA
VSH_IN=0V, VSH_OUT=5V
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BM1R00178F
Typical Performance Curves
1.4
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta=+105°C
1.2
Ta=+25°C
Ta=+105°C
1.0
0.8
0.6
0.4
0.2
0.0
Ta=+25°C
Ta=-40°C
Ta=-40°C
0
5
10
15
20
25
30
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Supply Voltage : VCC [V]
Supply Voltage : VCC[V]
Figure 5. Circuit Current2 vs Supply Voltage
(Switching Stop Mode)
Figure 6. Circuit Current2 vs Supply Voltage
(Switching Stop Mode VCC Zoom)
80
70
60
50
40
30
20
10
0
50
Ta=+105°C
Ta=+25°C
40
30
20
10
0
Ta=+25°C
Ta=-40°C
Ta=-40°C
Ta=+105°C
0
5
10
15
20
25
30
0
1
2
3
4
5
SH_OUT Voltage : VSH_OUT[V]
SH_OUT Voltage : VSH_OUT[V]
Figure 7. SH_OUT Regulation Current vs SH_OUT Voltage
(VSH_IN=0.85V)
Figure 8. SH_OUT Current at SH_IN=L vs SH_OUT Voltage
(VSH_IN=0V)
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BM1R00178F
Typical Performance Curves - continued
0.820
0.815
11.0
10.8
10.6
10.4
10.2
10.0
9.8
VSH_OUT=20V
VCC=20V
VCC=5V
0.810
0.805
0.800
0.795
0.790
0.785
0.780
VSH_OUT=5V
VCC=3V
VSH_OUT=3V
9.6
9.4
9.2
9.0
-40 -20
0
20
40
60
80 100
-40 -20
0
20
40
60
80 100
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 9. Reference Voltage vs Temperature
Figure 10. MAX_TON Timer vs Temperature
(SH_OUT Sink Current=100µA)
(RMAX_TON=100kΩ, VDRAIN=-0.3V↔+7V)
0
-1
-90
-2
-95
-3
VSH_OUT=3V
VSH_OUT=20V
-4
-5
-100
VSH_OUT=5V
VSH_OUT=20V
-6
VSH_OUT=3V
-7
VSH_OUT=5V
-105
-110
-8
-9
-10
-40 -20
0
20
40
60
80 100
-40 -20
0
20
40
60
80 100
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 11. GATE Turn On Threshold vs Temperature
(DRAIN Sweep Down)
Figure 12. GATE Turn Off Threshold vs Temperature
(DRAIN Sweep Up)
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BM1R00178F
Typical Performance Curves - continued
5000
4000
300
250
200
150
100
50
Ta=+105°C
3000
Ta=+105°C
Ta=+25°C
Ta=+25°C
Ta=-40°C
2000
Ta=-40°C
1000
0
0
740
760
780
800
820
840
860
740
760
780
800
820
840
860
SH_IN Voltage : VSH_IN [mV]
SH_IN Voltage : VSH_IN [mV]
Figure 14. SH_OUT Current vs SH_IN Voltage
(VSH_OUT=5V, ISH_OUT ZOOM UP)
Figure 13. SH_OUT Current vs SH_IN Voltage
(VSH_OUT=5V)
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Timing Chart
The startup sequence is shown below.
DRAIN
2.3V
VOUT(VCC)
VCC=2.3V
0.4V
VCC UVLO
MAX_TON
DRAIN
9COUNT
GATE
Figure 15. Startup Sequence
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Application Examples
VOUT
CVCC
PC1
RDRAIN2
LFB
DRAIN
VCC
RFB1
D1
RDRAIN1
SR_GND
SH_IN
+
-
COUT
CFB1
RFB2
GATE
SH_OUT
SH_GND
CFB2
RMAX_TON
MAX_TON
R1 C1
GND
M1
Figure 16. Flyback Application Circuit
(Low Side FET)
D2
M1
VOUT
CVCC
RFB1
PC1
DRAIN
VCC
+
-
COUT
SR_GND
SH_IN
RFB2 CFB2
CFB1
SH_OUT
SH_GND
GATE
RMAX_TON
MAX_TON
R1 C1
GND
Figure 17. Flyback Application Circuit
(High Side FET)
The built-in shunt regulator block is separated in the IC from the synchronous rectification controller. Therefore, if the FET is
placed on the high side, the synchronous rectification application can also make the shunt regulator the secondary side GND
reference.
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BM1R00178F
Application Examples - continued
M2
N O T _ X A M
E T A G
D N G _ H S
T U O _ H S
LFB2
R
DRAIN3
C
FB3
N I _ H S
C C V
D N G _ R S
N I A R D
R
DRAIN4
D
2
SH_IN pin Shunt regulator is used for OVP.
C
VCC2
PC2
RSH_OUT3
VOUT
For QR, LLC application, this function is
unnecessary because it basically does not operate
in CCM. The setting method of the MAX_TON pin is
invalidated by pulling up to the VCC pin.
C
VCC1
PC1
DRAIN
SR_GND
GATE
VCC
R
FB1
FB2
SH_IN
+
-
COUT
CFB1
R
SH_OUT
SH_GND
CFB2
MAX_TON
Shunt regulator used in feedback operation
L
FB1
GND
M1
Figure 18. Resonant half-bridge application circuit
Regarding Protection Applications
The built-in shunt regulator is high voltage, low current consumption and high accuracy, and also suitable as a comparator
for protection application. On the above LLC application, the shunt regulator is used as an overvoltage protection circuit.
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BM1R00178F
Selection of Components Externally Connected
1. MAX_TON Pin Setting
A resistance value which is connected to the MAX_TON pin is used to set the timer to force the GATE output OFF. (For
detailed operation, please see "Description of Block Operation / MAX_TON Block")
Set timer is proportional to the resistance value which can be set in the range of 56kΩ to 300kΩ. This IC is capable of
an accuracy of 10μs ± 6% at 100kΩ. However, accuracy deteriorates as the resistance value gets further away from
100kΩ. For example, 5.6µs ±0.9µs at 56kΩ, 30µs ±4.5µs at 300kΩ. (See graph below)
34.5µ
30µ
tP
25.5µ
Jitter
G1
Set the MAX_TON timer so that
the FET of the primary side (G1)
and the secondary side (G2) is not
simultaneously ON
10.6µ
10.0µ
9.4µ
G2
6.5µ
5.6µ
4.7µ
tMAX_ON
MAX_TON
timer
56k
100k
300k
MAX_TON Resistor(RMAX_TON) [Ω]
Figure 20. Primary FET and secondary FET
Sequence at CCM
Figure 19. MAX_TON Timer vs MAX_TON Resistor
To prevent destruction due to surge current in CCM, set the MAX_TON timer before turning on the primary side FET (G1)
to forcibly OFF the secondary side FET (G2). Including such variations, select a resistance value of MAX_TON Pin
(RMAX_TON) so that the MAX_ON timer setting time is less than one cycle in the primary side (tP > tMAX_ON).
ꢄ
10×10
푅푀퐴푋_푇푂푁
<
[kΩ]
ꢅ1+훥ꢆ
+훥ꢌ+훥ꢍ
ꢎ×ꢅꢍ
+ꢍ
ꢎ
퐽퐼ꢏꢏ퐸ꢐ
ꢇꢈꢉ_ꢊꢋ
ꢇꢈꢉ
ꢇꢈꢉ
Frequency Variation Ratio
Maximum Frequency Value
where:
fMAX is the primary side of the maximum frequency [kHz]
∆fMAX is the primary side of the maximum frequency accuracy [%]
fJITTER is the primary side of the jitter frequency [kHz]
∆tMAX_ON is Secondary side MAX_TON timer time accuracy [%]
∆R is Secondary side MAX_TON When the connection resistance accuracy [%]
2. Calculation Example
ꢄ
10×10
푅푀퐴푋_푇푂푁
<
= ꢒ2.ꢓ7
)
1+0.06+0.01+0.0ꢑ × 100+8
[kΩ]
(
)
(
fMAX is the primary side of the maximum frequency 100[kHz]
∆fMAX is the primary side of the maximum frequency accuracy 5[%]
fJITTER is the primary side of the jitter frequency 8[kHz]
∆tMAX_ON is Secondary side MAX_TON timer time accuracy 6[%]
∆R is Secondary side MAX_TON When the connection resistance accuracy 1[%]
With these conditions, MAX_TON Resistor(RMAX_TON) should be set to 82kΩ or less. In addition, it is recommended that
the temperature characteristics of each component should also be taken into account.
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BM1R00178F
I/O Equivalence Circuits
Pin 1: VCC / Pin 6: GATE / Pin 7: SR_GND
Pin 8: DRAIN
Internal
REG
1.VCC
8.DRAIN
SR
6.GATE
block
7.SR_GND
7.SR_GND
Pin 2: SH_IN / Pin 3: SH_OUT / Pin 4: SH_GND
Pin 5: MAX_TON
1.VCC
Internal
REG
3.SH_OUT
2.SH_IN
4.SH_GND
5.MAX_TON
7.SR_GND
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Notes on the Layout
VOUT
(5)
(1)
C
VCC
PC1
(6)
(2)
DRAIN
VCC
FB1
R
SR_GND
SH_IN
+
-
OUT
C
CFB1
RFB2
SH_OUT
GATE
CFB2
MAX_TON
R
SH_GND
MAX_TON
(5)
R1
C1
M1
(3)
L
FB1
(8)
Rsnb
Csnb
GND
(7)
(4)
Figure 21. Flyback Application Circuit
(Low Side FET)
(1) VCC line may malfunction under the influence of switching noise.
Therefore, it is recommended to insert a capacitor CVCC between the VCC and SR_GND pin.
(2) SH_IN pin is a high impedance line. To avoid crosstalk, electrical wiring should be as short as possible and not in parallel
with the switching line.
(3) MAX_TON pin has a 0.4V output. Therefore, there is a possibility that compulsion OFF time may be affected by the
switching operation, we recommend connecting RMAX_TON, R1, C1 just before MAX_TON pin output as much as possible
and connecting to SR_GND pin with independent wiring as much as possible. It is also recommended to use an
independent electrical wiring in connection with SR_GND pin.
(4) The synchronous rectification controller IC must accurately monitor the VDS generated in the FET. Accordingly, the
electrical wiring between the DRAIN to DRAIN and SR_GND to SOURCE of the IC and FET respectively should be
connected independently.
(5) The feedback resistors of VOUT are recommended to be connected to the GND of the output with an independent
electrical wiring.
(6) The DRAIN pin is a switching line. Use a narrow wiring and connect as short as possible.
(7) Use an independent wiring if connecting a snubber circuit between the DS of the FET. The connection of the transformer
output and the SOURCE of the FET should be thick and short as possible.
(8) Due to the DRAIN pin detects the small voltage, a malfunction which the switch turns ON/OFF caused by the surge
voltage may occur. So that, the filters such as the ferrite bead are recommended for alleviating the surge voltage.
Configuration example(Note 8)
:
LFB1 (a ferrite bead for suppressing the surge voltage): MMZ1608S202ATA00(TDK)
D1 (a schottky barrier diode): RB751G-40(ROHM)
RDRAIN1 (a filter resistor for the FET turn off): 0.3kΩ to 2kΩ
RDRAIN2 (a current limiting resistor to the DRAIN pin): 150Ω
(Note 8) The value is not a guaranteed value, but for reference. Please choose the optimum values of the components after sufficient evaluations based on the
actual application.
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BM1R00178F
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 22. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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BM1R00178F
Ordering Information
B M 1 R 0
0
1
7
8
F
-
E 2
Part Number
Package
F:SOP8
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP8(TOP VIEW)
Part Number Marking
LOT Number
0 0 1 7 8
Pin 1 Mark
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BM1R00178F
Physical Dimension and Packing Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT: mm)
PKG: SOP8
Drawing No.: EX112-5001-1
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Revision History
Date
Revision
001
Changes
06.Feb.2018
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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本产品是可以高精度输出AC电压过零检测结果的IC。不再需要以往应用中所需的光电耦合器和外置元器件,可以大大减少元器件数量,并可实现小型、高可靠性的电源应用。此外,与以往的光耦控制方式相比,还有助于显着降低待机功耗。
ROHM
BM1Z101FJ
本产品是检测交流电压过零时序和高精度输出二极管整流后的DC电压的IC。无需以往用途中所需的光电耦合器和外接零部件,大幅度减少了部件个数,可实现小型、高可靠性的电源应用。而且,与以往的光电耦合器控制相比,有助于大幅度降低待机功耗。通过采用独有的系统,既适用于通常整流,也适用于二倍整流。
ROHM
BM1Z102FJ
本产品是检测交流电压过零时序和高精度输出二极管整流后的DC电压的IC。无需以往用途中所需的光电耦合器和外接零部件,大幅度减少了部件个数,可实现小型、高可靠性的电源应用。而且,与以往的光电耦合器控制相比,有助于大幅度降低待机功耗。
ROHM
BM1Z103FJ
本产品是检测交流电压过零时序和高精度输出二极管整流后的DC电压的IC。无需以往用途中所需的光电耦合器和外接零部件,大幅度减少了部件个数,可实现小型、高可靠性的电源应用。而且,与以往的光电耦合器控制相比,有助于大幅度降低待机功耗。
ROHM
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