BM2LC105FJ-C [ROHM]
BM2LC105FJ-C是2ch的车载用低边开关。内置过电流限制电路、过热保护电路、过电压(有源钳位)保护电路、开路检测电路。;型号: | BM2LC105FJ-C |
厂家: | ROHM |
描述: | BM2LC105FJ-C是2ch的车载用低边开关。内置过电流限制电路、过热保护电路、过电压(有源钳位)保护电路、开路检测电路。 开关 |
文件: | 总26页 (文件大小:1970K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Automotive IPD Series
1ch/2ch Low Side Switch IC
BV1LC105FJ-C / BM2LC105FJ-C
Features
■ AEC-Q100 Qualified
Product Summary
(Note1)
■ Built-in overcurrent limiting circuit(OCP)
■ Built-in thermal shutdown circuit(TSD)
■ Built-in active clamp circuit
On-state resistance (Tj =25°C, Typ)
Overcurrent limit (Tj =25°C, Typ)
Output clamp voltage (Min)
105mΩ
6A
42V
■ Built-in Open load detection circuit(OLD) at output off
■ Direct control enabled from CMOS logic IC, etc.
■ Built-in diagnostic(ST) output function
■ On-state resistance RDS(ON)=105mΩ(Typ)
(when VIN5V, Iout=0.8A, Tj25C)
Active clamp energy (Tj =25°C)
150mJ
■ Monolithic power management IC with the control
block (CMOS) and power MOS FET mounted on a
single chip
Package
SOP-J8
W(Typ) x D(Typ) x H(Max)
4.90mm x 6.00mm x 1.65mm
■ Surface mount package SOP-J8
(Note 1) Grade1
General Description
BV1LC105FJ-C is 1ch, BM2LC105FJ-C is 2ch
automotive low side switch IC, which has built-in
overcurrent limiting circuit, thermal shutdown circuit,
overvoltage (active clamp) protection circuit and open
load detection circuit.
Applications
Low side switch for driving resistive, Inductive load,
Capacitive load
Ordering Information
B V 1 L C 1 0 5 F J
C E
2
Packaging and forming specification
C:High-reliability product
E2:Embossed tape and reel
V1:1ch, M2:2ch
On-state Resistance Package
L :Low side SW
C :Self-restart TSD
(Built-in diagnostic(ST)
output function)
105:105mΩ
(Tj=25℃,Typ)
FJ:SOP-J8
Line up
On-state
resistance
(Typ)
Ordering
Information
Total channel
Package
Ordering Information
number
(Typ)
1
2
BV1LC105FJ-CE2
BM2LC105FJ-CE2
105mΩ
6A
SOP-J8
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BV1LC105FJ-C BM2LC105FJ-C
Block Diagrams
1
8
IN1
OUT1
Active Clamp
Circuit
Open Load
Detection
Thermal
Shutdown
Overcurrent
Limiting
Circuit
Circuit
Circuit
2
3
7
6
ST1
N.C.
GND1
N.C.
4
5
N.C.
N.C.
1
8
OUT1
IN1
Active Clamp
Circuit
Open Load
Detection
Thermal
Shutdown
Overcurrent
Limiting
Circuit
Circuit
Circuit
2
3
7
6
ST1
IN2
GND1
OUT2
Active Clamp
Circuit
Open Load
Detection
Thermal
Shutdown
Overcurrent
Limiting
Circuit
Circuit
Circuit
4
5
ST2
GND2
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Pin Configurations
1
2
3
4
8
7
6
5
OUT
GND
N.C.
N.C.
1
2
3
4
8
7
6
5
OUT1
GND1
OUT2
GND2
IN
ST
IN1
ST1
IN2
BV1LC105FJ-C
BM2LC105FJ-C
N.C.
N.C.
ST2
Pin Descriptions
BV1LC105FJ-C
Pin No.
Symbol
IN
Function
1
2
3
4
5
6
7
8
Input pin. Input pin is used to internally connect a pull-down resistor.
ST
Self-diagnostic output pin
N.C pin(Note 1)
N.C pin(Note 1)
N.C pin(Note 1)
N.C pin(Note 1)
GND pin
N.C.
N.C.
N.C.
N.C.
GND
OUT
Output pin
(Note 1) N.C.Pin is recommended to short with GND. N.C.Pin can be open because it isn’t connect it inside of IC.
BM2LC105FJ-C
Pin No.
Symbol
IN1
Function
1
2
3
4
5
6
7
8
Input pin 1. Input pin is used to internally connect a pull-down resistor.
ST1
Self-diagnostic output pin 1
IN2
Input pin 2. Input pin is used to internally connect a pull-down resistor.
ST2
Self-diagnostic output pin 2
GND pin 2
GND2
OUT2
GND1
OUT1
Output pin 2
GND pin 1
Output pin 1
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Definition
VBAT
VBAT
RL
IOUT
IST
OUT
VMCU RST
ST
VOUT,VDS
V
ST
IIN
IN GND
VIN
CST
VIN
Figure 1. Definition
Absolute Maximum Ratings (Tj =25°C)
Parameter
Symbol
VDS
Ratings
Unit
Drain-Source voltage in output block
Input voltage
-0.3 to +42 (Note 1)
-0.3 to +7.0
V
V
VIN
Output current (DC)
IOUT(OCP)
VST
3.0(Internally limited) (Note 2)
-0.3 to +7.0
A
Diagnostic output voltage
Diagnostic output current
V
IST
10
mA
Active clamp energy (Single pulse)
Tj(start) = 25°C (Note 3)
EAS(25°C)
150
50
mJ
Active clamp energy (Single pulse)
Tj(start) = 150°C (Note 3) (Note 4)
EAS(150°C)
Operating temperature range
Storage temperature range
Maximum junction temperature
Tj
-40 to +150
-55 to +150
150
°C
°C
°C
Tstg
Tjmax
(Note 1) Please refer to P.21 “Operation Notes”, when is used at less than -0.3V.
(Note 2) Internally limited by the overcurrent limiting circuit.
(Note 3) Maximum Active clamp energy, using single non-repetitive pulse of IAR =1.9A, VBAT = 16V .
1
VBAT
LIAR2 ・ ( 1 -
)
EAS
=
2
VBAT - VOUT(CL)
(Note 4) Not 100% tested.
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Thermal Characteristics (Note 1)
Parameter
Symbol
Ratings
Unit
Conditions
SOP-J8(1ch ON)
(Note 2)
167.9
105.8
85.6
°C / W
°C / W
°C / W
1s
2s
(Note 3)
(Note 4)
Thermal Resistance between channel and ambient temperature
θJA
2s2p
Parameter
Symbol
Ratings
Unit
Conditions
SOP-J8(All ch ON)
(Note 2)
141.5
84.1
67.1
°C / W
°C / W
°C / W
1s
2s
(Note 3)
(Note 4)
Thermal Resistance between channel and ambient temperature
θJA
2s2p
(Note 1) The thermal impedance is based on JESD51 - 2A (Still - Air) standard . It is used the chip of BM2LC105FJ-C
(Note 2) JESD51 - 3 compliance FR4 114.3 mm × 76.2 mm × 1.57 mm 1 layer (1s)
(top layer copper:Rohm recommend land pattern + measurement wiring, copper thickness 2oz)
(Note 3) JESD51 -5 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm
2 layer (2s)
(top layer copper:Rohm recommend land pattern + measurement wiring, bottom layer copper area:74.2 mm × 74.2 mm、
Copper thickness (top and bottom layers) 2 oz)
(Note 4) JESD51 -5 / -7 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm
4 layer (2s2p)
(top layer copper:Rohm recommend land pattern + measurement wiring / 2 layer, 3 layer, bottom layer copper area: 74.2 mm × 74.2 mm,
Copper thickness (top and bottom layers / inner layer) 2 oz / 1oz)
■
PCB layout 1 layer (1s)
Footprint Only
Figure 2. PCB layout 1 layer (1s)
Dimension
Board finish thickness
Board dimension
Value
1.57 mm ± 10%
76.2 mm x 114.3 mm
FR4
Board material
Copper thickness (Top layer)
0.070mm (Cu:2oz)
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■
PCB layout 2layers (2s)
Top Layer
Bottom Layer
Cross section
Top Layer
Bottom Layer
Figure 3. PCB layout 2layer (2s)
Dimension
Board finish thickness
Board dimension
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
Board material
Copper thickness (Top/Bottom layers)
0.070mm (Cu + Plating)
■
PCB layout 4layers (2s2p)
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Cross section
Top Layer
2nd/3rd/Bottom Layers
Figure 4. PCB layout 4layer (2s2p)
Dimension
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
Board finish thickness
Board dimension
Board material
Copper thickness (Top/Bottom layers)
Copper thickness (Inner layers)
0.070mm (Cu + Plating)
0.035mm
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■
Transient Thermal Resistance (Single Pulse) 1ch ON
1000
100
10
1
footprint
2s
2s2p
0
0.0001 0.001
0.01
0.1
Pulse time[s]
Figure 5. Transient Thermal Resistance
1
10
100
1000
■
Transient Thermal Resistance (Single Pulse) All ch ON
1000
100
10
1
footprint
2s
2s2p
0
0.0001 0.001
0.01
0.1
1
10
100
1000
Pulse time[s]
Figure 6. Transient Thermal Resistance
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Electrical Characteristics1 (Unless otherwise specified, 40C Tj 150C and VIN3.0V to 5.5V)
Limit
Parameter
Symbol
Unit
Conditions
Min
42
Typ
48
Max
54
Output Clamp Voltage
VOUT(CL)
RDS(ON1)
V
VIN=0V,IOUT=1mA
On-state Resistance1 (at 25 °C)
-
105
200
135
245
60
85
-
130
250
175
315
80
mΩ VIN=5V,IOUT=0.8A,Tj=25°C
mΩ VIN=5V,IOUT=0.8A,Tj=150°C
mΩ VIN=3V,IOUT=0.8A,Tj=25°C
mΩ VIN=3V,IOUT=0.8A,Tj=150°C
μA VIN=0V,VOUT=18V,Tj=25°C
μA VIN=0V,VOUT=18V,Tj=150°C
On-state Resistance1 (at 150 °C) RDS(ON1)
On-state Resistance2 (at 25 °C) RDS(ON2)
On-state Resistance2 (at 150 °C) RDS(ON2)
-
-
-
Leak Current (at 25 °C)
Leak Current (at 150 °C)
Turn-ON TIME1
IOUT(L)
IOUT(L)
tON1
40
50
200
80
VIN=0V to 5V, RL=15Ω, VBAT=12V,
μs
-
Tj=25°C
VIN=5V to 0V, RL=15Ω, VBAT=12V,
Tj=25°C
Turn-OFF TIME1
Turn-ON TIME2
tOFF1
-
-
80
μs
VIN=OPEN to 5V, RL=15Ω, VBAT=12V,
Tj=25°C
tON2
-
-
80
μs
VIN=5V to OPEN, RL=15Ω, VBAT=12V,
Tj=25°C
Turn-OFF TIME2
Slew rate on1
tOFF2
-
μs
-
100
1.2
1.5
1.2
1.5
2.7
250
500
10
VIN=0V to 5V, RL=15Ω, VBAT=12V,
Tj=25°C
SRON1
SROFF1
SRON2
SROFF2
VIN(TH)
IIN(H1)
IIN(H2)
IIN(L)
0.7
1.0
0.7
1.0
-
V/μs
-
VIN=5V to 0V, RL=15Ω, VBAT=12V,
Tj=25°C
Slew rate off1
-
V/μs
VIN=OPEN to 5V, RL=15Ω, VBAT=12V,
Tj=25°C
Slew rate on2
-
-
V/μs
VIN=5V to OPEN, RL=15Ω, VBAT=12V,
Tj=25°C
Slew rate off2
V/μs
V
IOUT=1mA
Input Threshold Voltage
1.5
-
High-level Input Current1
(in normal operation)
125
-
μA VIN=5V
μA VIN=5V
μA VIN=0V
High-level Input Current2
-
(in abnormal operation) (Note1)
Low-level Input Current
0
-10
(Note1) When Thermal Shutdown circuit or Overcurrent Limiting circuit is ON.
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Electrical Characteristics2 (Unless otherwise specified, 40C Tj 150C and VIN3.0V to 5.5V)
Limit
Parameter
Symbol
Unit
Conditions
Min
3
Typ
6
Max
9
Overcurrent Detection Current
Open Load Detection Voltage
ST Output On Voltage1
IOCP
VOPEN
VST(ON1)
VST(ON2)
IST(L1)
IST(L2)
TSTDET
TSTREL
T j d
A
V
VIN=5V, VBAT=12V, Tj=25°C
VIN=0V
1.5
-
0.2
0.2
-
4.5
0.5
0.5
20
20
30
30
-
V
VIN=5V,IST=1mA
-
ST Output On Voltage2
V
VIN=0V,VOUT=4.5V,IST=0.5mA
VIN=5V,VST=5V
-
ST Output Leak Current1
-
μA
μA
μs
μs
°C
°C
°C
ST Output Leak Current2
-
-
VIN=0V,VOUT=1.5V,VST=5V
VIN=0V,VOUT=5V to 1V,
VMCU=5V,RST=10kΩ,CST=10pF
ST Output Delay Time Detect
ST Output Delay Time Release
TSD Detection Temperature (Note 2)
TSD Release Temperature (Note 2)
3
-
-
VIN=0V,VOUT=1V to 5V,
VMCU=5V,RST=10kΩ,CST=10pF
3
150
135
-
175
-
VIN=5V
VIN=5V
VIN=5V
T j r
-
TSD Hysteresis (Note 2)
Tj⊿HYS
15
-
(Note 2) Not 100% tested.
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BV1LC105FJ-C BM2LC105FJ-C
Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V)
54
52
50
48
46
44
42
140
130
120
110
100
90
80
-40
0
40
80
120
150
3
4
5
6
7
Input voltage: VIN [V]
Junction Temperature: Tj[℃]
Figure 7. Output clamp voltage vs. Junction Temperature
Figure 8. On-state Resistance vs. Input voltage
320
280
240
200
160
120
80
90
80
70
60
50
40
30
20
10
0
VIN=3V
VIN=5V
40
-40
0
40
80
120
150
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 10. Leak Current vs. Junction Temperature
Figure 9. On-state Resistance
vs. Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued
120
100
80
60
40
20
0
100
80
60
40
20
0
3
4
5
6
7
3
4
5
6
7
Input voltage: VIN [V]
Input voltage: VIN [V]
Figure 11. Turn-ON TIME1 vs. Input voltage
Figure 12. Turn-OFF TIME1 vs. Input voltage
80
60
40
20
0
100
80
60
40
20
0
-40
0
40
80
120
150
-40
0
40
Junction Temperature: Tj[℃]
Figure 13. Turn-ON TIME1 vs. Junction Temperature
80
120
150
Junction Temperature: Tj[℃]
Figure 14. Turn-OFF TIME1 vs. Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued
1.2
1.0
0.8
0.6
0.4
0.2
1.5
1.3
1.1
0.9
0.7
0.5
3
4
5
6
7
3
4
5
6
7
Input voltage: VIN [V]
Input voltage: VIN [V]
Figure 15. Slew rate on1 vs. Input voltage
Figure 16. Slew rate off1 vs. Input voltage
1.2
1.0
0.8
0.6
0.4
0.2
1.5
1.3
1.1
0.9
0.7
0.5
150
-40
0
40
80
120
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 17. Slew rate on1 vs. Junction Temperature
Figure 18. Slew rate off1 vs. Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued
2.7
2.3
1.9
1.5
1.1
200
150
100
50
VIN(TH) High
VIN(TH)Low
0
-40
0
40
Junction Temperature: Tj[℃]
Figure 19. Input voltage vs. Junction Temperature
80
120
3
4
5
6
7
150
Input voltage: VIN [V]
Figure 20. High-level input current1 (in normal operation)
vs. Input voltage
200
150
100
50
8
7
6
5
4
IN=3V
3
IN=4V
2
1
0
IN=5V
IN=6V
IN=7V
0
-40
0
40
80
120
150
0
2
4
6
8
10
12
Junction Temperature: Tj[℃]
Output voltage: VOUT [V]
Figure 21. High-level input current1 (in normal
operation) vs. Junction Temperature
Figure 22. Overcurrent detection current
vs. Output voltage
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Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued
8
7
6
5
4
3
2
1
0
5
4
3
2
1
0
150
-40
0
40
80
120
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 23. Overcurrent detection current
vs. Junction Temperature
Figure 24. Open Load Detection Voltage
vs. junction temperature
0.5
0.4
0.3
0.2
0.1
0.0
0.5
0.4
0.3
0.2
0.1
0.0
-40
0
40
80
120
150
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 25. ST Output On Voltage1
vs. junction temperature
Figure 26. ST Output On Voltage2
vs. junction temperature
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Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued
0.30
0.25
0.20
0.15
0.10
0.05
0.00
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
0
40
80
120
-40
0
40
80
120
150
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 27. ST Output Leak Current1
vs. junction temperature
Figure 28. ST Output Leak Current2
vs. junction temperature
5
4
3
2
1
0
5
4
3
2
1
0
-40
0
40
80
120
-40
0
40
80
120
150
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 29. ST Output Delay Time Release
vs. junction temperature
Figure 30. ST Output Delay Time
vs. junction temperature
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Measurement circuit for Typical Performance Curves
RDS(ON)
IOUT = 0.8A
IOUT = 1mA
= VOUT/IOUT
OUT
OUT
ST
IN
ST
V
V
IN
GND
GND
VIN
Measurement Circuit for Figure 8,9
Measurement Circuit for Figure 7
RL = 15Ω
A
VOUT = 18V
VBAT = 12V
OUT
OUT
ST
ST
Monitor
IN
IN
GND
0V to 5V
GND
Monitor
or
5V to 0V
Measurement Circuit for
Figure 11, 12, 13, 14, 15, 16, 17, 18
Measurement Circuit for Figure 10
RL = 15Ω
VBAT = 12V
VBAT = 12V
RL = 15Ω
OUT
OUT
ST
ST
V
A
IN
IN
GND
GND
V
VIN
VIN
Measurement Circuit for Figure 19
Measurement Circuit for Figure 20, 21
A
VOUT
OUT
OUT
10kΩ
ST
ST
V
5V
IN
IN
GND
GND
VIN
Measurement Circuit for Figure 22, 23
Measurement Circuit for Figure 24
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TSZ22111・14・001
BV1LC105FJ-C BM2LC105FJ-C
Measurement circuit for Typical Performance Curves – continued
VOUT = 4.5V
12V
OUT
OUT
GND
ST
ST
IN
IOUT = 0.5mA
IST = 1mA
V
V
IN
GND
VIN
Measurement Circuit for Figure 26
Measurement Circuit for Figure 25
VOUT= 1.5V
OUT
GND
OUT
A
ST
IN
A
ST
VST= 5V
5V
IN
GND
VIN
Measurement Circuit for Figure 28
Measurement Circuit for Figure 27
1V to 5V
or
5V to 1V
OUT
10kΩ
ST
5V
Monitor
Monitor
10pF
IN
GND
Measurement Circuit for Figure 29, 30
I/O Pin Truth Table
Operating
Status
Input
Signal
Output
Level
ST
Level
L
H
L
H
L
H
L
Normal
L
H
Overcurrent
Load open
H
L
Clamp
L
L
L
H
H
L
H
L
H
H
Over
Temperature
H
L
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TSZ22111・14・001
BV1LC105FJ-C BM2LC105FJ-C
Timing Chart
VIN[V]
VIN
VIN(TH)
0
t
t
VOUT[V]
VOUT(CL)
VOUT
VBAT
IOUT x RDS(ON)
0
IOUT[A]
VBAT
ZL + RDS(ON)
IOUT
0
t
Figure 31. Inductive Load Operation
VIN[V]
tr ≤ 0.1[μs]
tf ≤ 0.1[μs]
5V
VIN
90%
10%
0
t
VOUT[V]
tON[μs]
tOFF[μs]
≈12V
≈ 0V
90%
VOUT
10%
0
t
SROFF[V/μs]
SRON[V/μs]
Figure 32. Switching Time
VIN[V]
VIN[V]
VIN
VIN
VIN=0V
VIN=0V
0
0
t
t
VOUT[V]
VOUT[V]
5V
1V
5V
1V
4.5V
VOUT
VOUT
1.5V
0
0
t
t
VST[V]
VST[V]
TSTDET
TSTREL
≈5V
≈0V
5V
≈5V
≈0V
VST
VST
2.5V
2.5V
0
0
t
t
Figure 33. ST Output Delay Time
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22.Sep.2017 Rev.002
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BV1LC105FJ-C BM2LC105FJ-C
Marking Diagram
BV1LC105FJ-C
BM2LC105FJ-C
SOP-J8(TOP VIEW)
SOP-J8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
1 L C 1 0
2 L C 1 0
LOT Number
1PIN MARK
1PIN MARK
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TSZ22111・14・001
BV1LC105FJ-C BM2LC105FJ-C
Physical Dimension, Tape and Reel Information
Package Name
SOP-J8
Tape and Reel information
Embossed carrier tape
Tape
Quantity
2500pcs
E2
Direction
of Feed
The direction is the 1pin of product is at the upper left when you
hold reel on the left hand and pull out the tape on the right hand
Direction of Feed
1pin
※Order quantity need to be multiple of minimum quantity.
Reel
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BV1LC105FJ-C BM2LC105FJ-C
Operational Notes
1. Grounding Interconnection Pattern
When a small-signal ground and a high-current ground are used, it is recommended to isolate the high-current
grounding interconnection pattern and the small-signal grounding interconnection pattern and establish a single
ground at the reference point of a set so that voltage changes due to the resistance and high current of patterned
interconnects will not cause any changes in the small-signal ground voltage. Pay careful attention to prevent changes
in the interconnection pattern of ground for external components.
The ground lines must be as short and thick as possible to reduce line impedance.
2. Thermal Consideration
The amount of heat generated depends on the On-state resistance and Output current.
Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature
increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this
specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application
and allow sufficient margins in the thermal design.
3. Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit
protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
4. Inspections on Set Board
If a capacitor is connected to a low-impedance pin in order to conduct inspections of the IC on a set board, stress may
apply to the IC. To avoid that, be sure to discharge the capacitor in each process. In addition, to connect or disconnect
the IC to or from a jig in the testing process, be sure to turn OFF the power supply prior to connecting the IC, and
disconnect it from the jig only after turning OFF the power supply. Furthermore, in order to protect the IC from static
electricity, establish a ground for the IC assembly process and pay utmost attention to transport and store the IC.
5. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
6. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
7. Thermal Shutdown Circuit
IC has a built-in thermal shutdown circuit as an overheat-protection measure. The circuit is designed to turn OFF
output when the temperature of the IC chip exceeds 175C (Typ) and return the IC to the normal operation when the
temperature falls below 160C (Typ).
The thermal shutdown circuit is a circuit absolutely intended to protect the IC from thermal runaway, not intended to
protect or guarantee the IC. Consequently, do not operate the IC based on the subsequent continuous use or
operation of the circuit.
8. Overcurrent Limiting Circuit
IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used
in applications characterized by continuous operation or transitioning of the protection circuit.
9. Overvoltage (Active Clamp) Protection Function
IC has a built-in overvoltage protection function in order for the IC to absorb counter-electromotive force energy
generated when inductive load is turned OFF. Since the input voltage is clamped at 0V. When the active clamp circuit
is activated, the thermal shutdown circuit is disabled.
10. Counter-electromotive Force
Fully ensure that the counter-electromotive force presents no problems in the operation of the IC.
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Operational Notes – continued
11. Negative Current of Output
When supply a negative current from OUT(DRAIN) terminal in the state that supplied the voltage to IN terminal. The
current pass from IN terminal to OUT(DRAIN) terminal through a parasitic transistor and voltage of IN terminal
descend as shown in Figure 34 and Figure 35.
As shown in Figure 34 power MOS is turned on, set the OUT(DRAIN) terminal is more than -0.3V. Because a
negative current may be passed to OUT(DRAIN) terminal from a power supply of the connection of the IN terminal
(MCU, and so on).
As shown in Figure 35 power MOS is turned off, add a restriction resistance higher than 330 Ω to IN terminal.
Because a negative current may be passed to DRAIN terminal from GND of the connection of the IN terminal.
The restriction resistance value, set up in consideration of the voltage descent caused by the IN terminal current.
MCU
GND
(SOURCE)
330Ω
IN
N+
N+
N+
N+
N+
P+
P-
P-
Parasitic Element
N-epi
N+sub
OUT
(DRAIN)
Figure 34. Negative current path (when power MOS is turned on)
MCU
GND
(SOURCE)
330Ω
IN
N+
N+
N+
N+
N+
P+
P-
P-
Parasitic Element
N-epi
N+sub
OUT
(DRAIN)
Figure 35. Negative current path (when power MOS is turned off)
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TSZ22111・14・001
BV1LC105FJ-C BM2LC105FJ-C
Revision History
Date
Revision
001
Changes
23.Mar.2017
New Release
P1 Line up was corrected.
P1 General Description was corrected.
P2 Block Dagrams was corrected.
P9 Electrical Characteristics ST Output Delay Time Detect and ST Output Delay
Time Release conditions were corrected.
22.Sep.2017
002
P17 Measurement Circuit for Figjre 29, 30 was corrected.
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TSZ22111・14・001
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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