BM2P039-Z [ROHM]

PWM type DC/DC converter IC Included 650V MOSFET;


型号：	BM2P039-Z
厂家：	ROHM
描述：	PWM type DC/DC converter IC Included 650V MOSFET
文件：	总22页 (文件大小：1303K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

AC/DC Drivers

PWM type DC/DC converter IC

Included 650V MOSFET

BM2P039

●General

The PWM type DC/DC converter BM2P039 for

●Features

 PWM frequency : 100kHz

AC/DC provides an optimum system for all products

that include an electrical outlet.

 PWM current mode method

 Frequency hopping function

BM2P039 supports both isolated and non-isolated

devices, enabling simpler design of various types of

low-power electrical converters.

 Burst operation when load is light

 Frequency reduction function

 Built-in 650V start circuit

BM2P039 built in a HV starter circuit that tolerates

650V, it contributes to low-power consumption.

With current detection resistors as external devices, a

higher degree of design freedom is achieved.

Switching frequency adopts fixed system. Since

current mode control is utilized, current is restricted in

each cycle and excellent performance is demonstrated

in bandwidth and transient response.

 Built-in 650V switching MOSFET

 VCC pin under voltage protection

 VCC pin overvoltage protection

 SOURCE pin Open protection

 SOURCE pin Short protection

 SOURCE pin Leading-Edge-Blanking function

 Per-cycle over current protection circuit

 Soft start

The switching frequency is 100 kHz. At light load, the

switching frequency is reduced and high efficiency is

achieved.

 Secondary Over current protection circuit

 BR pin AC input low voltage protection

A frequency hopping function is also on chip, which

contributes to low EMI.

●Package

DIP7K: 9.20mm×6.35mm×4.30mm pitch 2.54mm

(Typ)

●Basic Specifications

Operating Power Supply Voltage Range :

VCC: 8.9V to 26.0V

DRAIN: to 650V

Operating Current :

Normal Mode 1.000mA (Typ)

Burst Mode 0.400mA (Typ)

100kHz (Typ)

Oscillation Frequency :

Operating Temperature :

-40 ^oC to +105 ^oC

MOSFET ON Resistance :

2.4Ω (Typ)

●Applications

AC adapters, TV and household appliances (vacuum

cleaners, humidifiers, air cleaners, air conditioners, IH

cooking heaters, rice cookers, etc.)

●Application circuit

FUSE

Diode

Bridge

85^-265Vac

Filter

ERROR

AMP

Figure 1. Application circuit

○Product structure : Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

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●Absolute Maximum Ratings (Ta=25C)

Parameter

Symbol

Rating

Unit

Conditions

Maximum applied voltage 1

Maximum applied voltage 2

Maximum applied voltage 3

Drain current pulse

Vmax1

Vmax2

Vmax3

I_DP

-0.3 to 30

-0.3 to 6.5

650

VCC

SOURCE, FB, BR

DRAIN

5.20

P_W=10usec, Duty cycle=1%

Allowable dissipation

2.00

^oC

Operating temperature range

Maximum junction temperature

Storage temperature range

Topr

-40 to +105

150

Tjmax

Tstr

-55 to +150

(Note) DIP7 : When mounted (on 74.2 mm × 74.2 mm,×1.6 mm thick, glass epoxy on double-layer substrate).

Reduce to 16 mW/C when Ta = 25C or above.

●Operating Conditions (Ta=25C)

Parameter

Symbol

Rating

Unit

Conditions

Power supply voltage range 1

Power supply voltage range 2

V_CC

8.9 to 26.0

to 650

VCC pin voltage

V_DRAIN

DRAIN pin voltage

●Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta=25C, VCC=15V)

Specifications

Parameter

Symbol

Unit

Conditions

Minimum

Standard Maximum

[MOSFET Block ]

Between drain and source

voltage

V_(BR)DDS

650

I_D=1mA / V_GS=0V

Drain leak current

On resistance

I_DSS

R_DS(ON)

E_AS

100

3.6

μA

Ω

V_DS=650V / V_GS=0V

I_D=0.25A / V_GS=10V

Design assurance

2.4

400

Avalanche Energy

μJ

Avalanche Energy circuit

E_AS

I_AS

: Avalanche Energy

: Avalanche Current

V_(BR)DSS

V_GS

V_DS

V_DD

: Drain - Source breakdown voltage

: Gate - Source voltage

: Drain - Source voltage

: Power supply voltage

: Coil

R_G

: Gate resistance

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●Electrical Characteristics (Unless otherwise noted, Ta=25C, VCC=15V)

Specifications

Parameter

Symbol

Unit

Conditions

Minimum

Standard Maximum

[ Circuit current ]

Circuit current (ON) 1

Circuit current (ON) 2

[ VCC protection function ]

VCC UVLO voltage 1

VCC UVLO voltage 2

VCC UVLO hysteresis

VCC OVP voltage 1

I_ON1

I_ON2

650

1000

400

1350

500

μA

FB=2.0V (at pulse operation)

FB=0.0V (at burst operation)

V_UVLO1

V_UVLO2

V_UVLO3

V_OVP1

V_OVP2

V_LATCH

V_CHG1

V_CHG2

T_LATCH

TSD

12.50

7.50

26.0

13.50

8.20

5.30

27.5

23.5

14.50

8.90

29.0

μs

C

VCC rises

VCC falls

V_UVLO3= V_UVLO1- V_UVLO2

VCC rises

VCC falls

VCC OVP voltage 2

V_UVLO2-0.5

Latch released VCC voltage

VCC recharge start voltage

VCC recharge stop voltage

Latch mask time

Thermal shut down temperature

[ PWM type DCDC driver block ]

Oscillation frequency 1

Oscillation frequency 2

Frequency hopping width 1

Hopping fluctuation frequency

Minimum pulse width

Soft start time 1

Soft start time 2

Soft start time 3

Soft start time 4

Maximum duty

FB pin pull-up resistance

∆FB / ∆CS gain

FB burst voltage

7.70

12.00

8.70

13.00

100

9.70

14.00

150

172

118

145

F_SW1

F_SW2

F_DEL1

F_CH

Tmin

T_SS1

T_SS2

T_SS3

T_SS4

Dmax

R_FB

0.30

0.60

1.20

4.80

68.0

100

6.0

110

kHz

FB=2.0V

FB=0.4V

FB=2.0V

125

650

0.50

1.00

2.00

8.00

75.0

175

1000

0.70

1.40

2.80

11.20

82.0

kΩ

V/V

Gain

V_BST

4.00

0.400

0.300

0.500

FB falls

FB voltage of starting frequency

reduction mode

V_DLT

1.100

1.250

1.400

FB OLP voltage 1a

FB OLP voltage 1b

FB OLP ON timer

FB OLP Start up timer

V_FOLP1A

V_FOLP1B

T_FOLP1

T_FOLP2

2.60

358

2.80

2.60

512

3.00

666

Overload is detected (FB rise)

Overload is detected (FB drop)

FB OLP OFF timer

[ Over current detection block ]

Overcurrent detection voltage

Overcurrent detection voltage SS1

Overcurrent detection voltage SS2

Overcurrent detection voltage SS3

Overcurrent detection voltage SS4

Leading Edge Blanking Time

V_CS

0.380

0.400

0.100

0.150

0.200

0.300

250

0.420

Ton=0us

V_{CS_SS1}

V_{CS_SS2}

V_{CS_SS3}

V_{CS_SS4}

T_LEB

0 [ms] to T_SS1[ms]

T_SS1[ms] to T_SS2[ms]

T_SS2[ms] to T_SS3[ms]

T_SS3[ms] to T_SS4[ms]

Over current detection AC voltage

compensation factor

K_CS

mV/μs

SOURCE pin short protection voltage

[ Start circuit block ]

Start current 1

V_CSSHT

0.020

0.050

0.080

I_START1

I_START2

0.100

2.600

0.500

3.000

1.000

6.000

VCC=0V

VCC=10V

Start current 2

Input current of DRAIN pin,

when VCC UVLO released.

(MOSFET OFF)

OFF current

I_START3

V_SC

Start current switching voltage

[BR pin function]

0.800

1.500

2.100

BR UVLO detection voltage1

BR UVLO detection voltage 2

BR UVLO hysteresis

BR UVLO detection delay time1

BR UVLO detection delay time2

V_BR1

V_BR2

V_BR3

T_BR1

T_BR2

0.45

0.29

150

0.50

0.35

0.15

100

0.55

0.41

150

350

μs

BR rises

BR falls

V_BR3= V_BR1- V_BR2

BR rises

BR falls

256

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●PIN DESCRIPTIONS

Table 1. Pin Description

Function

ESD Diode

NO.

Pin Name

I/O

VCC

GND

SOURCE

I/O

MOSFET SOURCE pin

Input AC voltage monitor pin

GND pin

○

GND

I/O

○

Feedback signal input pin

Power supply input pin

MOSFET DRAIN pin

○

VCC

DRAIN

I/O

●I/O Equivalent Circuit Diagram

Figure 2. I/O Equivalent Circuit Diagram

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●Block Diagram

Figure 3. Block Diagram

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●Description of Blocks

( 1 ) Start circuit (DRIAN: 6,7pin)

This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.

After starting, consumption power is idling current I_START3(Typ=10μA) only.

Reference values of Starting time are shown in Figure 6. When Cvcc=10μF it can start less than 0.1 sec.

Figure 4. Block diagram of start circuit

ISTART2

ISTART1

ISTART3

Vsc

V^UVLO1

10V

VCC Voltage[V]

Figure 5. Start current vs VCC voltage

Figure 6. Start time (reference value)

* Start current flows from the DRAIN pin

ex) Consumption power of start circuit only when the Vac=100V

PVH＝100V*√2*10uA=1.41mW

ex) Consumption power of start circuit only when the Vac=240V

PVH＝240V*√2*10uA=3.38mW

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( 2 ) Start sequences

(Soft start operation, light load operation, and auto recovery operation during overload protection)

Start sequences are shown in Figure 7. See the sections below for detailed descriptions.

VCC=13.5V

VCC(1pin)

VCC=8.2V

Within

32ms

FB OLP ON

64ms

Internal REF

Pull Up

FB(8pin)

Vout

Iout

Over Load

Normal Load

Light LOAD

Burst mode

Switching

stop

Switing

Soft

Start

G H

Figure 7. Start sequences Timing Chart

A: Input voltage VH is applied.

B: This IC starts operation when VCC pin voltage rises and VCC > V_UVLO1(Typ=13.5V).

Switching function starts when other protection functions are judged as normal.

Then the VCC pin voltage drop because of consumption current of VCC pin. In the case of VCC < V_CHG1(Typ=8.7V),

the VCC recharge circuit operates.

C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.

D: When the switching operation starts, and VOUT rises.

When the output voltage becomes to stable state, VCC voltage also becomes to stable state through auxiliary

winding. Please set the rated voltage within the T_FOLP1bperiod (32msec typ) from VCC voltage > V_UVLO1

E: During a light load, if it reaches FB voltage < V_BST(Typ=0.4V), the IC starts burst operation to keep power

consumption low.

During burst operation, it becomes low-power consumption mode.

F: When the FB Voltage > V_FOLP1A(Typ=2.8V), it becomes a overload operation.

G: When FB pin voltage keeps V_FOLP1A(Typ=2.8V) at or above T_FOLP(Typ=64msec), the overload protection function is

triggered and switching stops 64msec later. If the FB pin voltage becomes FB < V_FOLP1Beven once, the IC’s FB

OLP timer is reset.

H: If the VCC voltage drops to VCC < V_UVLO2(Typ=7.7V) or below, restart is executed.

I: The IC’s circuit current is reduced and the VCC pin value rises. (Same as B)

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( 3 ) VCC pin protection function

BM2P039 built in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage protection

function VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC

voltage. VCC UVLO and VCC OVP monitor VCC pin and prevent VCC pin from destroying switching MOSFET at

abnormal voltage.

VCC charge function stabilizes the secondary output voltage by charging from the high voltage line by start circuit at

dropping the VCC voltage.

( 3-1 ) VCC UVLO ／ VCC OVP function

VCC UVLO and VCC OVP are auto recovery protections. And they have voltage hysteresis. Refer to the operation

Figure 8. Switching is stopped by the VCCOVP function when VCC pin voltage > Vovp1 (Typ=27.5V), and switching is

restart when VCC pin voltage < Vovp2 (Typ=23.5V)

Figure 8. VCC UVLO / OVP Timing Chart

A: When voltage is applied to the DRAIN pin, VCC pin voltage starts rising.

B: When the VCC pin is more than V_UVLO, the VCC UVLO function is released and DC/DC operation starts

C: When the VCC pin is less than V_CHG1, VCC charge function operates and the VCC voltage rises.

D: When the VCC pin is more than V_CHG2,VCC charge function is stopped.

E: The condition the VCC pin is more than V_OVP1continues for T_LATCH(Typ=100usec), the switching operation is

stopped by the VCCOVP function.

F: When the VCC pin less than V_OVP2, the switching operation restarts.

G: The high voltage line VH drops.

H: Same as C.

I: Same as D.

J: When the VCC pin is less than V_UVLO2, the switching operation is stopped by the VCC UVLO function.

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( 3-2 ) VCC Charge function

If the VCC pin drops to V_CHC1after once the VCC pin becomes more than V_UVLO1and the IC starts to operate, the VCC

charge function operates. At that time, the VCC pin is charged from DRAIN pin through start circuit. By this operation,

BM2P039 doesn’t occur to start failure. When the VCC pin voltage raises to V_CHG2or above, charge is stopped.

The operations are shown in Figure 9.

V_UVLO1

V_CHG2

VCC

V_CHG1

V_UVLO2

Switching

VH charge

charge

OUTPUT

voltage

B C D E

F G H

Figure 9. Charge operation VCC pin charge operation

A: DRAIN pin voltage raises and the VCC pin starts to be charged by the VCC charge function.

B: When the VCC pin is more than V_UVLO1, the VCC UVLO function releases and VCC charge function stops.

Then the DC/DC operation starts.

C: When DC/DC operation starts, the VCC voltage drops because the output voltage is low.

D: When the VCC pin is less than V_CHG1, the VCC recharge function operates and VCC pin voltage rises.

E: When the VCC pin is more than V_CHG2, VCC recharge function stops.

F: When the VCC pin is less than V_CHG1, VCC recharge function operates and VCC pin voltage rises.

G: When the VCC pin is more than V_CHG2, VCC recharge function stops.

H: After starting of the output voltage finished, VCC is charged by the auxiliary winding and VCC pin stabilizes.

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( 4 ) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)

BM2P039 performs current mode PWM control. An internal oscillator sets a fixed switching frequency (100 kHz Typ).

BM2P039 is integrated switching frequency hopping function which changes the switching frequency to fluctuate as

shown in Figure 10 below.

The fluctuation cycle is 125 Hz typ.

Switching Frequency

[kHz]

500us

106.0

104.5

103.0

101.5

100.0

98.5

97.0

95.5

94.0

125 Hz(8ms)

Time

Figure 10. Frequency hopping function

Max duty cycle is fixed as 75% (Typ) and MIN pulse width is fixed as 650 nsec (Typ).

With current mode control, when the duty cycle exceeds 50%, sub harmonic oscillation may occur.

As a countermeasure to this, BM2P039 is built in slope compensation circuits.

BM2P039 is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption.

FB pin is pulled up by R_FB(30k Ω Typ).FB pin voltage is changed by secondary output voltage (secondary load power).

FB pin is monitored, burst mode operation and frequency detection start.

Figure 11 shows the FB voltage, and switching frequency, DCDC operation.

・mode1 : Burst operation

・mode2 : Frequency reduction operation

・mode3 : Fixed frequency operation (operate at the max frequency)

・mode4 : Over load operation (detect the over load state and stop the pulse operation)

Switching

Frequency

[kHz]

mode2

mode1

mode3

mode4

100kHz

25kHz

0.40V

1.25V

2.00V

2.80V

FB [V]

Figure 11. Switching operation state changes by FB pin voltage

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( 5 ) Over current limiter

BM2P039 is built in over current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching is stopped. It

is also built in AC voltage compensation function. This is the function which compensates the maximum power as the

AC voltage’s change by increasing over current limiter with time.

Shown in Figure 12, 13 and14.

Figure 12. No AC voltage compensation function

Figure 13. Built-in AC compensation voltage

Primary peak current is decided as the formula below.

Primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay

Vcs: Over current limiter voltage internal IC, Rs: Current detection resistance, Vdc: Input DC voltage,

Lp: Primary inductance, Tdelay: delay time after detection of over current limiter

Figure 14. Over current limiter voltage

( 6 ) L.E.B. period

When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current.

Therefore, because SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter

circuit. To prevent this detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for

250nsec by the on-chip L.E.B. (Leading Edge Blanking) function.

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( 7 ) SOURCE pin short protection function

When the SOURCE pin is shorted, BM2P039 is over heat.

BM2P039 built in short protection function to prevent destroying.

( 8 ) SOURCE pin open protection

If the SOURCE pin becomes OPEN, BM2P039 may be damaged.

To prevent to be damaged, BM2P039 built in OPEN protection circuit (auto recovery protection).

( 9 ) Output over load protection function (FB OLP Comparator)

The output overload protection function monitors the secondary output load status at the FB pin, and stops switching

when an overload occurs.

In case of overload, the output voltage is reduced and current no longer flows to the photo coupler, so the FB pin

voltage rises. When the status that FB pin voltage is more than V_FOLP1A(Typ=2.8V) continues for the period T_FOLP1

(Typ=64msec), it is judged as an overload and stops switching. When the FB pin > V_FOLP1A(Typ=2.8V), if the voltage

goes lower than V_FOLP1B(Typ=2.6V) during the period T_FOLP1(Typ=64msec), the overload protection timer is reset. The

switching operation is performed during this period T_FOLP1(Typ=64msec).

At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of V_FOLP1A(Typ=2.8V)

or above. Therefore, at startup the FB voltage must be set to go to V_FOLP1B(Typ=2.6V) or below during the period

_FOLP1(Typ=64msec), and the secondary output voltage’s start time must be set within the period T_FOLP1(Typ=64msec)

following startup of the IC.

Recovery from the once detection of FBOLP, after the period T_FOLP2(Typ=512msec).

FOLP1A

charge

512ms

charge

64ms

Switching

512ms

UVLO 1

CHG 2

CHG1

VCC

UVLO 2

C D

G H

Figure 15. Over load protection (Auto recovery)

A: The FBOLP comparator detects over load because the FB pin is more than V_FOLP1A

B: If the State of A continues for the period T_FOLP1(Typ=64msec), switching is stopped after T _FOLP1(Typ=64msec) from

FB OLP detection.

C: While switching stops by the over load protection function, if the VCC pin voltage drops and VCC pin voltage

reaches V_CHG1or above, the VCC charge function operates so the VCC pin voltage rises.

D: VCC charge function stops when the VCC pin voltage becomes more than V_CHG2

E: If T_FOLP2(Typ=512msec) go on from B point, the switching function starts on soft start.

F: If T_FOLP1b(Typ=64msec) go on from E point to continues an overload condition (FB > V_FOLP1A)_,the switching function

stops.

G: While the switching stops, VCC pin voltage drops to V_CHG1or below. Then the VCC charge function operates and

VCC pin voltage rises.

H: If the VCC pin voltage becomes over V_CHG2by the VCC charge function, the VCC charge function operation stops.

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( 10 ) Input voltage protection function

This IC has BR-UVLO function to monitor input voltage. By monitoring input voltage, it can be prevented from breaking

of IC. AC voltage and DC voltage can be monitored by BR pin.

FUSE

Diode

Bridge

Diode

Bridge

Filter

85 265Vac

ERROR

AMP

ERROR

AMP

RBR1

RBR2

RBR1

RBR2

Figure 16(a). AC voltage monitor setting

Figure 16(b). DC voltage monitor setting

BR UVLO function can protect the breaking of IC when input voltage is low.

●Operation mode of protection circuit

Operation mode of protection functions are shown in Table 2.

Table 2. Operation mode of protection circuit

Operation mode

Function

VCC Under Voltage Locked Out

VCC Over Voltage Protection

TSD

Auto recovery

Latch (with 100usec timer)

FB Over Limited Protection

SOURCE Open Protection

BR UVLO

Auto recovery (with 64msec timer)

Auto recovery

Auto recovery (with 256msec timer)

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●Sequence

The sequence diagram is show in Figure 17.

In all condition, the operations transit OFF Mode If the VCC voltage becomes less than 8.2V.

OFF MODE

Soft Start1

Soft Start2

Soft Start3

SOURCE OPEN

(Pulse Stop)

BR UVLO

(Pulse Stop)

Soft Start4

FBOLP

OFF TIMER

(512ms)

LATCH OFF MODE

(Pulse Stop)

Normal MODE

OLP MODE

(Pulse Stop)

PULSE OFF

VCC OVP

(Pulse Stop)

Burst MODE & Low Power MODE

*Pulse OFF

Figure 17. The sequence diagram

●Thermal loss

The thermal design should set operation for the following conditions.

(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)

1. The ambient temperature Ta must be 105 ^oC or less.

2. The IC’s loss must be within the allowable dissipation Pd.

The thermal abatement characteristics are as follows.

(PCB: 74.2 mm × 74.2mm × 1.6 mm, mounted on glass epoxy double-layer substrate.)

3000

2500

2000

1500

1000

500

100

125

150

Ta[℃]

Figure 18. DIP7K Thermal Abatement Characteristics

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●Ordering Model Name Selection

B M 2

Product name

●Physical Dimension Tape and Reel Information

DIP7K

Container

Quantity

Tube

2000pcs

Direction of feed Direction of products is fixed in a container tube

Order quantity needs to be multiple of the minimum quantity.

∗

●Making Diagram

DIP7K

Part Number Marking

LOT Number

BM2P039

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TSZ02201-0F1F0A200150-1-2

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 19. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be

powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the

OFF state even if the TJ falls below the TSD threshold.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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date

Rev. No.

001

Revision Point

New Release

2015.10.14

P.3

P.10

P.1

P.2

P.3

P.6

Minimum pulse width, Standard 400ns → 650ns

MIN pulse width is fixed as 400 nsec → 650 nsec

DIP7→DIP7K

002

2016.1.20

Avalanche Energy addition

Thermal shut down temperature max value addition

Maximum value of Minimum pulse width addition

Start current 2 specification change

Start time point data addition

003

2016.4.5

P.14 DIP7→DIP7K

P.15 Ordering Model Name Selection

P.15 DIP7→DIP7K

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

BM2P039 - Web Page

Part Number

Package

BM2P039

DIP7

Unit Quantity

2000

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

2000

Tube

inquiry

Yes

BM2P039-Z [ROHM]

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