BM2P053_技术文档

Datasheet

AC/DC Drivers

PWM type DC/DC converter IC

Included 650V MOSFET

BM2PXX3 Series

●General

The PWM type DC/DC converter (BM2PXX3) for

●Features

 PWM frequency : 65kHz

 PWM current mode method

AC/DC provide an optimum system for all products

that include an electrical outlet.

BM2PXX3 supports both isolated and non-isolated

devices, enabling simpler design of various types of

low-power electrical converters.

BM2PXX3 built in a HV starter circuit that tolerates

650V, it contributes to low-power consumption.

With current detection resistors as external devices, a

higher degree of design freedom is achieved. Since

current mode control is utilized, current is restricted in

each cycle and excellent performance is demonstrated

in bandwidth and transient response.

 Burst operation when load is light

 Frequency reduction function

 Built-in 650V start circuit

 Built-in 650V switching MOSFET

 VCC pin under voltage protection

 VCC pin overvoltage protection

 SOURCE pin Open protection

 SOURCE pin Short protection

 SOURCE pin Leading-Edge-Blanking function

 Per-cycle over current protection circuit

 Soft start

The switching frequency is 65 kHz. At light load, the

switching frequency is reduced and high efficiency is

achieved.

A frequency hopping function is also on chip, which

contributes to low EMI.

 Secondary Over current protection circuit

●Package

DIP7

9.20mm×6.35mm×4.30mm pitch 2.54mm

(Typ.) (Typ.) (Typ.) (Typ.)

We can design easily, because BM2PXX3 includes

the switching MOSFET.

●Basic specifications

Operating Power Supply Voltage Range:

VCC 8.9V to 26.0V DRAIN：～650V

Operating Current: Normal Mode

BM2P013: 0.950mA (Typ.)

●Applications

BM2P033: 0.775mA (Typ.)

AC adapters and household appliances (vacuum

cleaners, humidifiers, air cleaners, air conditioners, IH

cooking heaters, rice cookers, etc.)

BM2P053: 0.600mA (Typ.)

BM2P093: 0.500mA (Typ.)

Burst Mode: 0.400mA (Typ.)

Oscillation Frequency:

Operating Temperature:

MOSFET ON Resistance:

65kHz (Typ.)

- 40 ^oC to +10 ^oC

●Line up

BM2P013: 1.4Ω (Typ.)

BM2P033: 2.4Ω (Typ.)

BM2P053: 4.0Ω (Typ.)

BM2P093: 8.5Ω (Typ.)

Product

MOSFET ON Resistor

●Application circuit

1.4Ω

2.4Ω

4.0Ω

BM2P013

BM2P033

BM2P053

BM2P093

+

FUSE

Diode

Bridge

AC

Filter

-

85265Vac

-

8.5Ω

ERROR

AMP

Figure 1．Application circuit

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

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●Absolute Maximum Ratings（Ta=25C）

Parameter

Symbol

Vmax1

Rating

-0.3～30

-0.3～6.5

650

Unit

V

Conditions

Maximum applied voltage 1

Maximum applied voltage 2

Maximum applied voltage 3

VCC

Vmax2

V max3

V

SOURCE, FB

DRAIN

P_W=10us, Duty cycle=1%

(BM2P013)

P_W=10us, Duty cycle=1%

(BM2P033)

P_W=10us, Duty cycle=1%

(BM2P053)

P_W=10us, Duty cycle=1%

(BM2P093)

Drain current pulse

I_DP

10.40

5.20

2.60

A

I_DP

Pd

1.30

2000

A

mW

^oC

Allowable dissipation

Operating

temperature range

MAX junction temperature

Storage

temperature range

Topr

T_JMAX

Tstr

-40 ～ +105

150

^oC

-55 ～ +150

^oC

(Note1) DIP7 : When mounted (on 74.2 mm × 74.2 mm, 1.6 mm thick, glass epoxy on double-layer substrate).

Reduce to 16 mW/C when Ta = 25C or above.

●Operating Conditions（Ta=25C）

Parameter

Power supply voltage range 1

Power supply voltage range 2

Symbol

V_CC

V_DRAIN

Rating

8.9～26.0

～650

Unit

V

Conditions

VCC pin voltage

DRAIN pin voltage

●Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta = 25C, VCC = 15 V)

Specifications

Standard

Parameter

[MOSFET Block]

Symbol

Unit

Conditions

Minimum

Maximum

Between drain and

source voltage

Drain leak current

V_(BR)DDS

I_DSS

650

-

V

uA

Ω

I_D=1mA / V_GS=0V

-

100

2.0

V_DS=650V / V_GS=0V

I_D=0.25A / V_GS=10V

(BM2P013)

I_D=0.25A / V_GS=10V

(BM2P033)

I_D=0.25A / V_GS=10V

(BM2P053)

I_D=0.25A / V_GS=10V

(BM2P093)

On resistance

R_DS(ON)

1.4

R_DS(ON)

-

2.4

4.0

8.5

3.6

5.5

Ω

12.0

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●Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)

Specifications

Parameter

[Circuit current]

Symbol

Unit

Conditions

Minimum

Standard Maximum

BM2P013, FB=2.0V

( at pulse operation)

BM2P033, FB=2.0V

(at pulse operation)

BM2P053, FB=2.0V

(at pulse operation)

BM2P093, FB=2.0V

(at pulse operation)

Circuit current (ON) 1

I_ON1

I_ON2

700

550

410

350

-

950

775

600

500

400

1200

1050

790

μA

650

Circuit current (ON) 2

500

FB=0.0V(at burst operation)

[VCC protection function]

VCC UVLO voltage 1

VCC UVLO voltage 2

V_UVLO1

V_UVLO2

V_UVLO3

V_OVP1

V_LATCH

V_CHG1

V_CHG2

T_LATCH

T_SD

12.50

7.50

-

26.0

-

7.70

12.00

50

13.50

8.20

5.30

27.5

V_UVLO2-0.5

8.70

13.00

100

14.50

8.90

-

29.0

-

9.70

14.00

150

-

V

us

C

VCC rises

VCC falls

V_UVLO3=V_UVLO1-V_UVLO2

VCC rises

VCC UVLO hysteresis

VCC OVP voltage 1

Latch released VCC voltage

VCC Recharge start voltage

VCC Recharge stop voltage

Latch mask time

Thermal shut down temperature

118

145

[PWM type DCDC driver block]

Oscillation frequency 1

Oscillation frequency 2

Frequency hopping width 1

Hopping fluctuation frequency

Soft start time 1

Soft start time 2

Soft start time 3

Soft start time 4

Maximum duty

F_SW1

F_SW2

F_DEL1

F_CH

T_SS1

T_SS2

T_SS3

T_SS4

D_max

R_FB

60

20

-

65

25

4.0

125

0.50

1.00

2.00

8.00

75.0

30

70

30

-

175

0.70

1.40

2.80

11.20

82.0

37

KHz FB=2.00V

KHz FB=0.40V

KHz FB=2.0V

Hz

ms

%

75

0.30

0.60

1.20

4.80

68.0

23

FB pin pull-up resistance

ΔFB / ΔCS gain

FB burst voltage

kΩ

V/V

Gain

V_BST

-

4.00

0.400

-

0.300

0.500

V

FB falls

FB voltage of

V_DLT

1.100

1.250

1.400

V

starting Frequency reduction mode

FB OLP voltage 1a

FB OLP voltage 1b

FB OLP ON timer

FB OLP Start up timer

FB OLP OFF timer

V_FOLP1A

V_FOLP1B

T_FOLP1

T_FOLP1b

T_FOLP2

2.60

-

40

26

358

2.80

2.60

64

32

512

3.00

-

88

38

666

V

ms

Overload is detected (FB rise)

Overload is detected (FB drop)

[Over current detection block]

Overcurrent detection voltage

V_CS

0.380

0.400

0.100

0.150

0.200

0.300

250

0.420

V

Ton=0us

Overcurrent detection voltage SS1

Overcurrent detection voltage SS2

Overcurrent detection voltage SS3

Overcurrent detection voltage SS4

Leading Edge Blanking Time

V_{CS_SS1}

V_{CS_SS2}

V_{CS_SS3}

V_{CS_SS4}

T_LEB

-

0[ms] ~ Tss1[ms]

V

TSS1 [ms] ~ TSS2 [ms]

TSS2 [ms] ~ TSS3[ms]

TSS3 [ms] ~ TSS4 [ms]

V

ns

Over current detection AC Voltage

compensation factor

SOURCE pin

K_CS

12

20

28

mV/us

V

V_CSSHT

0.020

0.050

0.080

short protection voltage

[Start circuit block]

Start current 1

Start current 2

I_START1

I_START2

0.100

1.000

0.500

3.000

1.000

6.000

mA

VCC= 0V

VCC=10V

Inflow current from Drain pin

after UVLO released UVLO.

When MOSFET is OFF

OFF current

I_START3

V_SC

-

10

20

uA

V

Start current switching voltage

0.800

1.500

2.100

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●PIN DESCRIPTIONS

Table 1 Pin Description

Function

ESD Diode

VCC GND

NO.

Pin Name

I/O

1

2

3

4

5

6

7

SOURCE

N.C.

I/O

-

MOSFET SOURCE pin

-

○

-

○

-

GND

I/O

I

GND pin

FB

Feedback signal input pin

Power supply input pin

MOSFET DRAIN pin

○

-

VCC

I

-

DRAIN

I/O

-

●I/O Equivalent Circuit Diagram

Figure 2 I/O Equivalent Circuit Diagram

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●Block Diagram

+

FUSE

Diode

Bridge

AC

Filter

-

5

6

7

VCC UVLO

+

-

13.5V

/8.2V

Starter

4.0V

Line Reg

VCC OVP

+

-

100us

Filter

10uA

12V Clamp

Circuit

27.5V

Internal Block

S

R

Q

DRIVER

PWM Control

4.0 V

30k

OLP

-

+

1M

64ms

Timer

4

Current

Limiter

Leading Edge

Blanking

Burst

Comparator

+

-

1

(typ=250ns)

-

+

AC Input

Compensation

Soft Start

PWM

Comparator

MAX

DUTY

-

+

3

Frequency

Hopping

OSC

(65kHz)

+

Slope

Compensation

FeedBack

With

Isolation

Figure 3. Block Diagram

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●Description of Blocks

(1) Start circuit (DRIAN: 6,7pin)

This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.

After starting, consumption power is idling current I_START3（typ=10uA） only.

Reference values of Starting time are shown in Figure-6. When Cvcc=10uF it can start less than 0.1 sec.

+

FUSE

AC

Diode

Bridge

85-265 Vac

-

DRAIN

SW1

VCC

Cvcc

+

-

VCCUVLO

Figure 4. Block diagram of start circuit

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0

5

10

15

20

25

30

35

40

45

50

Cvcc [uF]

Figure 5. Start current vs VCC voltage

* Start current flows from the DRAIN pin

Figure 6. Start time (reference value)

Ex) Consumption power of start circuit only when the Vac=100V

PVH＝100V*√2*10uA=1.41mW

Ex) Consumption power of start circuit only when the Vac=240V

PVH＝240V*√2*10uA=3.38mW

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(2) Start sequences

(Soft start operation, light load operation, and auto recovery operation during overload protection)

Start sequences are shown in Figure 7. See the sections below for detailed descriptions.

VH

VCC=13.5V

VCC(1pin)

VCC=8.2V

Within

32ms

FB OLP ON

64ms

Internal REF

Pull Up

FB(8pin)

Vout

Iout

Over Load

Normal Load

Light LOAD

Burst mode

Switching

stop

Switing

Soft

Start

G H

I

C

E

F

A

B

D

Figure 7. Start sequences Timing Chart

A: Input voltage VH is applied

B: This IC starts operation when VCC pin voltage rises and VCC > VUVLO1 (13.5 V typ).

Switching function starts when other protection functions are judged as normal. Until the secondary output voltage

becomes constant level, VCC voltage drops because of the VCC consumption current.

VCC recharge function start if VCC voltage < VCHG1 （8.7V typ）C : With the soft start function, over current limit value

is restricted to prevent any excessive rise in voltage or current.

D: When the switching operation starts, VOUT rises.

The output voltage become to stable state, VCC voltage also become to stable state through auxiliary winding.

Please set the rated voltage within the TFOLP1b period (32ms typ) from VCC voltage > VUVLO1.

E: During a light load, if it reaches FB voltage < VBST (= 0.4Vtyp), the IC starts burst operation to keep power consumption

low.

During burst operation, it becomes low-power consumption mode.

F : When the FB Voltage＞VFOLP1A（=2.8V typ）, it becomes a overload operation.

G: When FB pin voltage keeps VFOLP1A (= 2.8V typ) at or above T FOLP (64ms typ), the overload protection function is

triggered and switching stops 64mS later. If the FB pin voltage becomes FB<VFOLP1B even once, the IC’s FB OLP

timer is

reset.

H : If the VCC voltage drops to VCC < VUVLO2 (7.7Vtyp) or below, restart is executed.

I: The IC’s circuit current is reduced and the VCC pin value rises. (Same as B)

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(3) VCC pin protection function

BM2PXX3 built in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage protection

function VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC

voltage.VCC UVLO and VCC OVP monitor VCC pin and prevent VCC pin from destroying switching MOSFET at

abnormal voltage.

VCC charge function stabilizes the secondary output voltage by charging from the high voltage line by start circuit at

dropping the VCC voltage.

(3-1) VCC UVLO ／ VCC OVP function

VCCUVLO is auto recovery protection. VCCOVP is latch protection. Refer to the operation figure-8.

VCCOVP built in mask time TLATCH（typ=100us）.By this function, this IC masks pin generated surge etc.

This function operates detection in case of continuing VCC pin voltage > VOVP （typ=27.5V） .

Figure 8. VCC UVLO / OVP Timing Chart

A: DRAIN voltage input, VCC pin voltage starts rising.

B: VCC>Vuvlo1, DC/DC operation starts

C: VCC< V_CHG1, VCC charge function operates and the VCC voltage rises.

D: VCC > V_CHG2,VCC charge function is stopped.

E: VCC > V_OVP1,function is detected

F: VCC > V_OVP1,continues T_LATCH(typ =100us), switching is stopped by the VCCOVP function.

G: VH is OPEN.VCC Voltage is fall.

H: Same as C.

I: Same as D.

J: VCC<Vuvlo2, Switching is stopped by the VCC UVLO function

K: VCC< V_latch, released from latch

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（3-2）VCC Charge function

After VCC charge function operates once the VCC pin >VUVLO1 and the DC/DC operation starts then the VCC pin

voltage drops to <VCHG1. At that time the VCC pin is charged from DRAIN pin through start circuit.

By this operation, BM2PXX3 doesn’t occur to start failure.

When VCC pin voltage rises to VCC >VCHG2, charge is stopped. The operations are shown in figure 9.

VH

V_UVLO1

V_CHG2

VCC

V_CHG1

V_UVLO2

Switching

VH charge

charge

OUTPUT

voltage

A

B C D E

F G H

Figure 9. Charge operation VCC pin charge operation

A: DRAIN pin voltage rises, charge starts to VCC pin by the VCC charge function.

B: VCC > V_UVLO1,VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.

C: When DC/DC operation starts, the VCC voltage drops.

D: VCC < V_CHG1,VCC recharge function and VCC pin voltage rises.

E: VCC > V_CHG2,VCC recharge function stops.

F: VCC < V_CHG1,VCC recharge function operates and VCC pin voltage rises.

G: VCC > V_CHG1,VCC recharge function stops.

H: After start of output voltage finished, VCC is charged by the auxiliary winding VCC pin stabilizes.

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(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)

BM2PXX3 is current mode PWM control.

An internal oscillator sets a fixed switching frequency (65 kHz typ).

BM2PXX3 is integrated switching frequency hopping function which changes the switching frequency to fluctuate as

shown in Figure 11 below.

The fluctuation cycle is 125 Hz typ.

Switching Frequency

[kHz]

500us

69

68

67

66

65

64

63

62

61

125 Hz(8ms)

Time

Figure 10. Frequency hopping function

Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ).

With current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur.

As a countermeasure to this, BM2PXX3 is built in slope compensation circuits.

BM2PXX3 is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption, when the load

is light.

FB pin is pull up by R_FB(30 kΩ typ).

FB pin voltage is changed by secondary output voltage (secondary load power).

FB pin is monitored, burst mode operation and frequency detection start.

Figure 11 shows the FB voltage, and switching frequency, DCDC operation

・mode1 : Burst operation

・mode2: Frequency reduction operation.

・mode3 : Fixed frequency operation.(operate at the max frequency)

・mode4 : Over load operation.(detect the over load state and stop the pulse operation)

Figure 11. Switching operation state changes by FB pin voltage

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(5) Over Current limiter

BM2PXX3 is built in Over Current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching is

stopped. It is also built in AC voltage compensation function. This is the function which compensates the maximum

power as the AC voltage’s change by increasing over current limiter with time.

Shown in figure-12, 13, and 14.

Figure 12. No AC voltage compensation function

Figure13. Built-in AC compensation voltage

Primary peak current is decided as the formula below.

Primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay

Vcs：Over current limiter voltage internal IC, Rs：Current detection resistance, Vdc input DC voltage, Lp：Primary

inductance,

Tdelay：delay time after detection of over current limiter

Figure 14. Over current limiter voltage

（6）L.E.B period

When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current.

Therefore, because SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter

circuit.

To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the

on-chip LEB (Leading Edge Blanking) function.

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(7) SOURCE pin (1pin) short protection function

When the SOURCE pin (1pin) is shorted, BM2PXX3 is over heat.

BM2PXX3 built in short protection function to prevent destroying.

(8) SOURCE pin (1pin) open protection

If the SOURCE pin becomes OPEN, BM2PXX3 may be damaged.

To prevent to be damaged, BM2PXX3 built in OPEN protection circuit（auto recovery protection）.

(9) Output over load protection function （FB OLP Comparator）

The output overload protection function monitors the secondary output load status at the FB pin, and stops switching

when an overload occurs. In case of an overload, the output voltage is reduced and current no longer flows to the

photo coupler, so the FB pin voltage rises.

When the FB pin voltage > V_FOLP1A(2.8 V typ) continuously for the period T_FOLP1(64ms typ), it is judged as an overload

and stops switching.

When the FB pin > V_FOLP1A(2.8 V typ), if the voltage goes lower than V_FOLP1B(2.6V typ) during the period T_FOLP1(64ms

typ), the overload protection timer is reset. The switching operation is performed during this period T_FOLP1(64ms typ).

At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of V_FOLP1A(2.8 V typ)

or above. Therefore, at startup the FB voltage must be set to go to V_FOLP1B(2.6 V typ) or below during the period T_FOLP1

(64ms typ), and the secondary output voltage’s start time must be set within the period T_FOLP1(64ms typ) following

startup of the IC.

Recovery from the once detection of FBOLP, after the period T_FOLP2(512 ms typ)

FOLP1A

V

FB

VH

charge

512ms

charge

512ms

64ms

Switching

UVLO 1

V

CHG 2

V

CHG1

V

VCC

UVLO 2

V

B

C D

E

F

G H

A

Figure 15. Over load protection (Auto recovery)

A: The FBOLP comparator detects over load for FB>V_FOLP1A

B: If the State of A continues for the period TFOLP1 (64ms typ), it is judged as an overload and stops switching after

64ms.

C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage reaches

< V_CHG1, the VCC charge function operates so the VCC pin voltage rises.

D: VCC charge function stops when VCC pin voltage > V_CHG2

E: If T_FOLP2（typ =512ms） go on from B point, Switching function starts on soft start.

F: If T_FOLP1(64ms typ) go on from E point to continues an overload condition (FB>V_FOLP1A),Switching function stops at F

point.

G: While switching stops VCC pin voltage drops to < V_CHG1,VCC charge function operates and VCC pin voltage rises.

H: If VCC pin (1pin) voltage becomes over V_CHG2by the VCC charge function, VCC charge function operation stops.

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●Operation mode of protection circuit

Operation mode of protection functions are shown in table2.

Table2 Operation mode of protection circuit

Function

Operation mode

VCC Under Voltage Locked Out

VCC Over Voltage Protection

TSD

Auto recovery

Latch（with 100us timer）

FB Over Limited Protection

SOURCE Open Protection

Auto recovery（with 64ms timer）

Auto recovery

●Sequence

The sequence diagram is show in Fig 16.

All condition transits OFF Mode VCC<8.2V

VCC<8.2V

ALL MODE

OFF MODE

VCC>13.5V

Soft Start 1

Time>0.5ms

Soft Start 2

Time>1.0ms

Soft Start3

Time>2.0ms

VCC<7.7V

Soft Start 4

SOURCE OPEN

(Pulse Stop )

Time>8.0ms

NORMAL

FBOLP

OFF TIMER

(512ms)

OPEN

VCC>27.5V

Temp>145℃

LATCH OFF MODE

(Pulse Stop)

Normal MODE

FB>2.80V

FB<0.40V

FB>0.40V

FB>2.80V

(64ms)

FB<2.60V

OLP MODE

(Pulse Stop)

PULSE OFF

Burst MODE

(Pulse OFF )

Figure 16. The sequence diagram

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● Thermal loss

The thermal design should set operation for the following conditions.

(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)

1. The ambient temperature Ta must be 105℃ or less.

2. The IC’s loss must be within the allowable dissipation Pd.

The thermal abatement characteristics are as follows.

(PCB: 74.2 mm × 74.2mm × 1.6 mm, mounted on glass epoxy substrate)

3000

2500

2000

1500

1000

500

0

25

50

75

100

125

150

Ta[℃]

Figure 17. DIP7 Thermal Abatement Characteristics

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BM2PXX3 Series

●Ordering Information

3

B M 2 P X X

-

Package

None: DIP7

Product

name

Packaging and forming specification

None: Tube

●Physical Dimension Tape and Reel Information

DIP7

Container

Quantity

Tube

2000pcs

Direction of feed Direction of products is fixed in a container tube

Order quantity needs to be multiple of the minimum quantity.

∗

●Making Diagram

●Line-Up

DIP7

Product name (BM2PXX3)

7

6

5

BM2P013

BM2P033

BM2P053

BM2P093

Part Number Marking

LOT Number

2PXX3

1

2

3

4

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BM2PXX3 Series

Operational Notes

1.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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BM2PXX3 Series

Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 18. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation

should always be within the IC’s power dissipation rating. If however the rating is exceeded for a

continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn

OFF all output pins. The IC should be powered down and turned ON again to resume normal

operation because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the

TSD threshold.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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date

Rev. No.

Revision Point

001

New Release

2012.07.19

P7 An explanation for Figure7

P8 An explanation for VCC_UVLO/VCC_OVP function

An explanation for Figure8

P11 An explanation for Over Current limiter

P12 An explanation for Output over load protection function

An explanation for Figure15

P13 Table2

P13 Figure16

005

2013.11.18

2015.05.15

2015.09.24

P13 Operation mode of protection circuit

P13 Sequence

006

007

P7 An explanation of Start sequence

P8 An explanation of VCC pin protection function

P8 An explanation of VCC UVLO / VCC OVP function

P9 An explanation of VCC Charge function

P11 An explanation of Over Current Limiter

P12 An explanation of Output over load protection function

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.001

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.001

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

Buy

BM2P013 - Web Page

Distribution Inventory

Part Number

Package

BM2P013

DIP7

Unit Quantity

2000

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

Taping

inquiry

Yes


型号：	BM2P053
厂家：	ROHM
描述：	PWM type DC/DC converter IC Included 650V MOSFET
文件：	总22页 (文件大小：1011K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM2P053 [ROHM]

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