BM2P06A1J-Z (开发中) [ROHM]
This series of PWM-type DC/DC converters for AC/DC supplies the optimum system for all products in;
| 型号： | BM2P06A1J-Z (开发中) |
| 厂家： | 
ROHM |
| 描述： | This series of PWM-type DC/DC converters for AC/DC supplies the optimum system for all products in |
| 文件： | 总31页 (文件大小：1295K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
AC/DC Converter
Built-in Switching MOSFET
PWM-type DC/DC Converter IC
BM2P06xxJ-Z series
General Description
Key Specifications
◼ Operating Power Supply Voltage Range:
VCC Pin: 8.9 V to 26.0 V
DRAIN Pin: 730 V (Max)
This series of PWM-type DC/DC converters for AC/DC
supplies the optimum system for all products in which
an outlet is present. It is compatible with both insulated
and non-insulated, and various types of low power
consumption converters can be easily designed.
The built-in 730 V startup circuit contributes to low
power consumption. A highly flexible power supply
design is achieved by externally installing a current
detection resistor for switching. Because of the use of
current mode control, the current is limited every cycle,
providing excellent performance in bandwidth and
excessive response. The switching frequency is fixed at
65 kHz. When turned light load, the frequency is
reduced to achieve high efficiency. Built-in frequency
hopping function contributes to low EMI. Built-in 730 V
switching MOSFET enables easy designing.
◼ Circuit Current (ON) 1:
BM2P06x1J-Z: 0.80 mA (Typ)
BM2P06x3J-Z: 0.60 mA (Typ)
◼ Circuit Current (ON) 2:
◼ Oscillation Frequency 1:
0.30 mA (Typ)
65 kHz (Typ)
◼ Operating Temperature Range: -40 °C to +105 °C
◼ MOSFET ON Resistance:
BM2P06x1J-Z: 1.0 Ω (Typ)
BM2P06x3J-Z: 3.0 Ω (Typ)
Package
DIP7K
W (Typ) x D (Typ) x H (Max)
9.27 mm x 6.35 mm x 8.63 mm
Pitch 2.54 mm
Features
◼ PWM Current Mode Control
◼ Frequency Hopping Function
◼ Burst Operation at Light Load
◼ Frequency Reduction Function
◼ Built-in 730 V Startup Circuit
◼ Built-in 730 V Switching MOSFET
◼ VCC UVLO (Under Voltage Lockout)
◼ VCC OVP (Over Voltage Protection)
◼ SOURCE Pin Open Protection
◼ SOURCE Pin Function of Leading Edge Blanking
◼ Over Current Detection Function per Cycle
◼ Over Current Detection AC Compensation Function
◼ Soft Start Function
Lineup
MOSFET
ON
resistance
VH
UVLO
Product Name
VH OVP
○
○
○
○
BM2P06A1J-Z
BM2P06A3J-Z
BM2P06B1J-Z
BM2P06B3J-Z
1.0 Ω
3.0 Ω
1.0 Ω
3.0 Ω
-
-
○
○
◼ Secondary Over Current Protection Circuit
Output Power (POUT)
POUT (Note 1)
Product Name
AC 85 V to
AC 264 V
30 W
AC 230 V
BM2P06x1J-Z
BM2P06x3J-Z
35 W
30 W
20 W
(Note 1) Output power affects external components and thermal design.
Therefore, it may be smaller than the stated value.
Applications
Major Appliance, Office Automation Equipment, AV
Equipment, other SMPS etc.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Typical Application Circuit
FUSE
AC
Diode
Bridge
Filter
Input
DRAIN
VCC
FB
DRAIN
ERROR
AMP
SOURCE
GND
BR
Pin Configuration
(TOP VIEW)
1
2
7
6
DRAIN
DRAIN
SOURCE
BR
3
4
GND
FB
5
VCC
Pin Descriptions
Pin No.
ESD Diode
VCC GND
Pin Name
I/O
Function
○
○
-
○
○
-
1
2
3
4
5
6
7
SOURCE
BR
GND
FB
VCC
I/O
I
I/O
I/O
I
MOSFET SOURCE pin
BROWNOUT pin
GND pin
Feedback-signal-in pin
Power supply input pin
MOSFET DRAIN pin
MOSFET DRAIN pin
-
-
○
-
-
-
-
DRAIN
DRAIN
I/O
I/O
-
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Block Diagram
VH
VOUT
FUSE
AC
Input
Diode
Bridge
Filter
VCC
DRAIN
6.7
5
VCC UVLO
+
-
Startup
Circuit
4.0 V
Line Reg
VCC OVP
+
-
100 µs
Filter
10 µA
Clamp
Circuit
Internal Block
BR
Brown Out
Detection
2
S
PWM Control
+
DRIVER
R
Q
Burst Control
Internal Reg.
Internal Reg.
1 M
30 k
OLP
FB
OLP
Timer
-
+
4
Current
Limiter
+
-
Leading Edge
Blanking
SOURCE
Burst
Comparator
1
-
+
Rs
AC Voltage
compensation
Soft Start
PWM
Comparator
MAX
-
DUTY
+
GND
3
Frequency
Hopping
+
OSC
Slope
Compensation
FeedBack
With
Isolation
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Description of Blocks
1. Startup Circuit (DRAIN: pin 6, pin 7)
This IC has a built-in startup circuit. Therefore, low standby power and high-speed startup are possible.
The current consumption after startup is only OFF current ISTART3
.
Figure 3 shows the startup time reference. When CVCC = 10 μF, it can be started at 0.1 s or less.
FUSE
AC
Input
Diode
Bridge
Filter
DRAIN
Startup
Circuit
SW1
VCC
CVCC
+
-
VCC UVLO
Figure 1. Block Diagram of Startup Circuit
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
ISTART2
ISTART1
ISTART3
0
5
10
15
20
25
30
35
40
45
50
CVCC [μF]
0 VSC
10 V
VCC Pin Voltage [V]
VUVLO1
Figure 2. Startup Current vs VCC Pin Voltage
Figure 3. Startup Time vs CVCC
Startup current is the current from the DRAIN pin.
e.g.) When Vac = 100 V, power consumed by startup circuit alone
푷푽푯 = ퟏퟎퟎ 푽 × √ퟐ × ퟏퟎ 흁푨 = ퟏ. ퟒퟏ 풎푾
e.g.) When Vac = 240 V, power consumed by startup circuit alone
푷푽푯 = ퟐퟒퟎ 푽 × √ퟐ × ퟏퟎ 흁푨 = ퟑ. ퟑퟗ 풎푾
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Description of Blocks – continued
2. Startup Sequence
The startup sequence is shown in Figure 4. Details are described in each chapter.
VH
(Input Voltage)
VUVLO1
VCHG2
VCHG1
VUVLO2
VCC Pin
Voltage
Within
tFOLP1
tFOLP2
tFOLP1
tFOLP1
Internal REF
Pull Up
FB Pin
Voltage
VFOLP1
VFOLP2
VBST1
Over
Load
Over
Load
Output Voltage
Output Current
Normal
Load
Light
Load
Burst mode
Switching
stop
Switching
GH
I
C
E
F
A
B
D
J
Figure 4. Startup Sequences Timing Chart
A: Input voltage VH is applied.
B: When the VCC pin voltage rises and the VCC pin voltage > VUVLO1, the IC starts operating. When it is judged that
other protection functions are normal, switching operation starts. The VCC pin voltage drops depending on the VCC
pin current consumed until the secondary output voltage rises above a certain level from the start of startup.
Therefore, set it so that the VCC pin voltage > VUVLO2 until switching starts.
C: It has the soft start function to limit the over current detection value so that excessive voltage rise, and current rise
do not occur.
D: When switching operation starts, output voltage rises. After switching starts, set the output voltage so that it
becomes the specified voltage within tFOLP1
E: When light load and the FB pin voltage < VBST1, it is burst operation to reduce power consumption.
F: Overload operation when the FB pin voltage > VFOLP1
.
.
G: If the FB pin voltage > VFOLP1 continues for tFOLP1, the overload protector stops switching for the duration of tFOLP2
When the FB pin voltage < VFOLP2, the IC-internal timer tFOLP1 is reset.
.
H: The VCC pin voltage rises due to the recharging operation when the VCC pin voltage < VCHG1. Also, when the VCC
pin voltage > VCHG2, the recharge operation is stopped.
I: After tFOLP2 has elapsed, switching starts with the soft start function.
J: Same as G.
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Description of Blocks – continued
3. VCC Pin Protective Function
This IC has a built-in VCC UVLO, VCC OVP, and a VCC recharge function that operates when the VCC pin voltage drops.
The VCC recharge function charges a higher voltage line than the startup circuit to stabilize the secondary output voltage
when the VCC pin voltage drops.
(1) VCC UVLO / VCC OVP Function
VCC UVLO and VCC OVP are auto recovery comparators with voltage-hysteresis.
VH
(Input Voltage)
tPROT
VOVP1
VOVP2
VUVLO1
VCHG2
VCC Pin
Voltage
VCHG1
VUVLO2
ON
ON
VCC UVLO
OFF
Function
ON
VCC OVP
Function
OFF
OFF
ON
OFF
ON
ON
ON
VCC Charge
Function
OFF
Switching
OFF
A
B C
D
E
F
G
H
A
Figure 5. VCC UVLO / VCC OVP Timing Chart
A: The VCC pin voltage starts rising after the input voltage VH is applied.
B: The VCC pin voltage > VUVLO1, VCC UVLO function is released and switching operation starts.
C: The VCC pin voltage < VCHG1, VCC recharge function operates and the VCC pin voltage rises.
D: The VCC pin voltage > VCHG2, VCC recharge function stops.
E: When the VCC pin voltage > VOVP1 status continues for tPROT, the switching operation is stopped by VCC OVP function.
F: The VCC pin voltage < VOVP2, switching operation resumes.
G: VH will be open and the VCC pin voltage will drop.
H: The VCC pin voltage < VUVLO2, VCC UVLO function is operated and switching operation stops.
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3. VCC Pin Protective Function – continued
(2) VCC Recharge Function
This IC has a built-in VCC recharge function.
Once the VCC pin voltage > VUVLO1 and the IC starts, then when the VCC pin voltage < VCHG1, the VCC recharge
function operates. At this time, the VCC pin is charged from the DRAIN pin through startup circuit. This operation
does not cause VCC startup failure.
When the VCC pin voltage is charged and the VCC pin voltage > VCHG2, charging ends. This operation is shown in
Figure 6.
VH
(Input Voltage)
VUVLO1
VCHG2
VCC Pin
Voltage
VCHG1
VUVLO2
Switching
charge
charge
charge
charge
VH charge
Output Voltage
A
B
C
D
E
F
G
H
Figure 6. VCC Pin Recharge Operation
A: The DRAIN pin voltage rises and the VCC pin is charged by the VCC recharge function.
B: The VCC pin voltage > VUVLO1, VCC UVLO function is deactivated, the VCC recharge function is deactivated, and
switching operation begins.
C: At startup, the VCC pin voltage drops due to the low output voltage.
D: The VCC pin voltage < VCHG1, the VCC recharge function operates to increase the VCC pin voltage.
E: The VCC pin voltage > VCHG2, VCC recharge function is disabled.
F: The VCC pin voltage < VCHG1, the VCC recharge function operates to increase the VCC pin voltage.
G: The VCC pin voltage > VCHG2, VCC recharge function is disabled.
H: Output voltage finishes startup and is charged to the VCC pin from the secondary winding, and the VCC pin voltage
is stabilized.
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Description of Blocks – continued
4. DC/DC Drivers
This IC performs current mode PWM control.
The switching frequency is fixed by the internal oscillator.
Built-in switching frequency hopping function.
The Max DUTY = DMAX and Minimum ON Width = tMIN are fixed.
In current mode control, subharmonic oscillation may occur if DUTY cycling exceeds 50 %.
This slope compensation as a countermeasure protection circuits.
A burst mode circuit and a frequency reduction circuit are built-in to achieve low power consumption during light load.
The FB pin is pulled up to the internal power supply by RFB
.
The FB pin voltage changes depending on the secondary output voltage (secondary load power).
The FB pin voltage is monitored, and the switching operation status is switched.
Figure 7 shows the FB pin voltage and DC/DC switching operation status.
mode 1: Burst operation
mode 2: Frequency fixed operation (operates in fSW2.)
mode 3: Frequency-reduction operation (Reduces fSW1.)
mode 4: Fixed-frequency operation (operates in fSW1
)
mode 5: Overload operation (pulse operation stop, intermittent operation)
Switching
Frequency
[kHz]
mode 2
mode 3
mode 4
mode 1
mode 5
fSW1
fSW2
Pulse OFF
FB Pin Voltage
[V]
VDLT1
VDLT2
VFOLP1
VBST1/VBST2
Figure 7. Switching Operation State Changes by FB Pin Voltage
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Description of Blocks – continued
5. Over Current Detection Function
Built-in over current detection function for each switching cycle.
Switching is stopped when the SOURCE pin exceeds a certain voltage.
It has a built-in AC compensation function. This function is a compensation function that increases the over current
detection level over time.
It is shown in Figure 8 to 10.
fSW1
fSW1
ON
ON
Switching
(AC100 V)
Switching
(AC100 V)
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
Switching
(AC240 V)
Switching
(AC240 V)
OFF
IPEAK (AC)
VDC = 240 V
IPEAK (AC)
VDC = 240 V
VDC = 100 V
VDC = 100 V
compensated
IPEAK(DC)
constant
IPEAK (DC)
Primary
Peak Current
Primary
Peak Current
tDELAY
tDELAY
tDELAY tDELAY
Figure 8. No AC Voltage Compensation Function
Figure 9. Built-in AC Compensation Voltage
The primary peak current entering the overload mode is determined by the following equation.
푽푺푶푼푹푪푬 푽푫푪
푰푷푬푨푲
=
+
× 풕푫푬푳푨풀
[A]
푹풔
푳풑
where:
푉
is the over current detection voltage inside the IC
푆푂푈푅퐶퐸
ꢀ푠 is the current sensing resistor
푉퐷ꢁ is the input DC voltage
퐿푝 is the primary transformer L value
푡퐷ꢂ퐿퐴푌 is the delay time after over current detection
Figure 10 shows the amount of AC compensation for the over current detection voltage. Over time in the ON time, the over
current limiter level increases from VOCP1 to VOCP2. VOCP1 is the lower limit of AC correction, and VOCP2 is the upper limit
of AC compensation
Over Current Detection
Voltage
[V]
VOCP2
20 mV/µs
VOCP1
0
tON [µs]
8.5
10
Figure 10. Over Current Detection Voltage
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Description of Blocks – continued
6. Leading Edge Blanking Time
Surge current is generated by capacitive components, drive current, etc. when MOSFET for driving turns on. At this time,
the SOURCE pin voltage rises temporarily, which may cause the over current detection circuit to detect incorrectly. To
prevent false positives, the Leading Edge Blanking function is built-in. This function masks the SOURCE pin voltage for
250 ns after the DRAIN pin switches from H to L built-in.
7. SOURCE Pin Open Protection
If the SOURCE pin becomes open, excessive heat may be applied to the IC due to noises, etc., and the IC may be
damaged.
An open protection circuit is built-in to prevent damage. (Auto recovery)
8. FB OLP (Overload Protection)
FB OLP is a function that monitors the load status of the secondary output with the FB pin voltage and stops switching
when it is overloaded.
In an overload condition, the output voltage drops, so that no current flows to the photocoupler, and the FB pin voltage
rises.
If the FB pin voltage > VFOLP1 status lasts for tFOLP1, it is judged to be overloaded and switching is stopped. If the FB pin
voltage drops below VFOLP2 during tFOLP1 from the FB pin voltage > VFOLP1, the overload protection timer is reset. Switching
is performed during tFOLP1. At startup, the FB pin is pulled up with a resistor to the internal voltage of the IC. Therefore, the
IC operates from a voltage higher than VFOLP1. Therefore, be sure to set the startup time so that the FB pin voltage is less
than or equal to VFOLP2 value within tFOLP1 period during startup.
Recovery from detection of FB OLP is after tFOLP2
.
9. VH Under Voltage Protective Function (VH UVLO)
When AC voltage is not supplied and VH becomes low voltage and the BR pin voltage < VINLVP1, switching is stopped after
tINLVP
.
When VH rises and the BR pin voltage > VINLVP2, restart occurs due to soft start operation.
10. VH High-voltage Protective Function (VH OVP: BM2P06BxJ-Z only)
Switching is stopped when VH becomes high voltage and the BR pin voltage > VINOVP1
If VH decreases and the BR pin voltage < VINOVP2, the system restarts.
.
11. Soft Start Function
This function controls the over current detection voltage in order to prevent any excessive voltage or current rising at
startup. This IC enables the soft start operation by changing the over current detection voltage with time.
Over Current
Detection Voltage
Nomal
SS1
SS2
VOCP1 or VOCP2
VOCP_SS2
VOCP_SS1
tSS1
tSS2
Time
Figure 11. Soft Start Function
12. Dynamic Over Current Detection Function
This IC has a built-in dynamic over current detection function.
In the case that the SOURCE pin voltage exceeds the VDOC two times consecutively, it stops the switching operation a
certain period of time.
Figure 12. Dynamic Over Current Detection
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Description of Blocks – continued
13. Operation Mode of Protection Function
Table 1 shows the operation modes of the protective functions.
Table 1. Operation Modes of Protection Functions
VH OVP
(BM2P06BxJ-Z only)
VH UVLO
VCC UVLO
VCC OVP
BR pin voltage
< VINLVP1
BR pin voltage
> VINOVP1
VCC pin voltage
< VUVLO2
VCC pin voltage
> VOVP1
Detection Condition
Release Conditions
BR pin voltage
> VINLVP2
BR pin voltage
< VINOVP2
VCC pin voltage
> VUVLO1
VCC pin voltage
< VOVP2
Detection Timer
tINLVP
tINOVP
tPROT
(BR pin voltage
(BR pin voltage
–
(VCC pin voltage
(Reset Condition)
> VINLVP2
)
< VINOVP2
)
< VOVP2)
Auto Recovery
or
Latch
Auto recovery
Auto recovery
FB OLP
Auto recovery
Auto recovery
Over Current
Detection
TSD
SOURCE pin voltage
> VOCP1 or VOCP2
FB pin voltage
> VFOLP1
Detection Condition
Release Conditions
Tj > TSD1
Each cycle
Expiration of tFOLP2
Tj < TSD2
Detection Timer
tFOLP1
(FB pin voltage
tPROT
(Tj < TSD2
-
)
(Reset Condition)
< VFOLP2)
Auto Recovery
or
Auto recovery
Auto recovery
Auto recovery
Latch
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Thermal Dissipation
Operate under the following conditions in thermal design.
1. The ambient temperature Ta shall be 105 °C or less.
2. The power dissipation of the IC is less than or equal to the power dissipation Pd.
Thermal derating characteristics are as follows.
(PCB: 74.2 mm x 74.2 mm x 1.6 mmt when mounting single-layer glass epoxy boards)
1.5
1.0
0.5
0.0
0
25
50
75
100
125
150
Ta [ºC]
Figure 13. DIP7K Thermal Abatement Characteristics
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Absolute Maximum Ratings (Ta = 25 °C)
Item
Symbol
Rating
Unit
V
Conditions
VCC pin voltage
Maximum Applied Voltage 1
VMAX1
-0.3 to +32.0
Maximum Applied Voltage 2
Maximum Applied Voltage 3
VMAX2
-0.3 to +6.5
V
V
SOURCE, FB, BR pin voltage
DRAIN pin voltage
650
730
VMAX3
DRAIN pin voltage
V
(tpulse < 10 μs) (Note 2)
PW = 10 μs, Duty cycle = 1 %
(BM2P06x1J-Z)
DRAIN Pin Current 1 (Pulse)
DRAIN Pin Current 2 (Pulse)
Power Dissipation
IDP1
IDP2
12
A
PW = 10 μs, Duty cycle = 1 %
(BM2P06x3J-Z)
4
A
(Note 3)
Pd
1.00
W
°C
°C
Maximum Junction
Temperature
Tjmax
150
Storage Temperature Range
Tstg
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties
of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size
and copper area so as not to exceed the maximum junction temperature rating.
(Note 2)
(Note 3)
Duty is less than 1 %.
At mounted on a glass epoxy single layer PCB (74.2 mm x 74.2 mm, 1.6 mmt). Derate by 8 mW/°C if the IC is used in the ambient temperature Ta =
25 °C or above.
Recommended Operating Conditions
Item
Symbol
Min
Typ
Max
Unit
Conditions
VCC pin voltage
Power Supply Voltage Range 1
VCC
8.9
-
-
-
26.0
650
V
V
DRAIN pin voltage
Power Supply Voltage Range 2
VDRAIN
DRAIN pin voltage
-
-
-
730
V
(tpulse < 10 μs) (Note 4)
Operating Temperature
Topr
-40
+105
°C
(Note 4) Duty is less than 1 %.
Electrical Characteristics
(Unless otherwise noted, Tj = -40 °C to +105 °C, VCC = 15 V)
Item
[MOSFET Part]
Symbol
Min
Typ
Max
Unit
Conditions
Voltage between the DRAIN
and SOURCE Pins
V(BR)DDS
IDSS
RDS(ON)1
RDS(ON)2
650
-
-
V
μA
Ω
ID = 1 mA, VGS = 0 V
DRAIN Pin Leakage Current
On Resistance 1
-
-
-
-
100
1.4
3.6
VDS = 650 V, VGS = 0 V
ID = 0.25 A, VGS = 10 V
(BM2P06x1J-Z)
1.0
3.0
ID = 0.25 A, VGS = 10 V
(BM2P06x3J-Z)
On Resistance 2
Ω
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BM2P06xxJ-Z series
Electrical Characteristics – continued
(Unless otherwise noted, Tj = -40 °C to +105 °C, VCC = 15 V)
Item
Symbol
Min
Typ
Max
Unit
μA
Conditions
[Circuit Current]
VFB = 2.4 V (in PULSE
operation)
Circuit Current (ON) 1A
Circuit Current (ON) 1B
ION1A
-
800
1350
(BM2P06x1J-Z) (Note 5)
VFB = 2.4 V (in PULSE
operation)
ION1B
ION2
-
600
300
1200
450
μA
μA
(BM2P06x3J-Z) (Note 5)
Circuit Current (ON) 2
[VCC Pin Protective Function]
VCC UVLO Voltage 1
150
VFB = 0.7 V (Note 5)
VUVLO1
VUVLO2
VUVLO3
VOVP1
VOVP2
VOVP3
VCHG1
VCHG2
tPROT
12.5
7.5
-
13.5
8.2
5.3
27.5
23.5
4
14.5
8.9
-
V
V
At VCC pin voltage rising (Note 5)
At VCC pin voltage falling (Note 5)
VCC UVLO Voltage 2
(Note 5)
VCC UVLO Hysteresis
VCC OVP Voltage 1
V
VUVLO3 = VUVLO1 - VUVLO2
26.0
22.0
-
29.0
25.0
-
V
At VCC pin voltage rising (Note 5)
At VCC pin voltage falling (Note 5)
VCC OVP Voltage 2
V
(Note 5)
VCC OVP Hysteresis
V
VOVP3 = VOVP1 - VOVP2
VCC Recharge Start Voltage
VCC Recharge Stop Voltage
Protection-mask Duration
7.7
12.0
-
8.7
13.0
90
9.7
14.0
-
V
V
(Note 5)
μs
When the control IC part
temperature rises
When the control IC part
temperature falls
TSD Temperature 1
TSD Temperature 2
TSD1
TSD2
135
105
160
130
185
155
°C
°C
[PWM-type DC/DC Driver Block]
Oscillation Frequency 1
Oscillation Frequency 2
Frequency Hopping Width 1
Soft Start Time 1
fSW1
fSW2
fDEL1
tSS1
61
20
-
65
25
69
30
-
kHz
kHz
kHz
ms
ms
%
VFB = 2.4 V (Note 5)
VFB = 1.2 V (Note 5)
VFB = 2.4 V (Note 5)
8
0.6
2.4
70
150
23
-
1.0
4.0
80
1.4
5.6
90
650
37
-
Soft Start Time 2
tSS2
Max DUTY
DMAX
tMIN
Minimum ON Width
FB Pin Pull-up Resistor
ΔFB/ΔSOURCE Gain
FB Burst Voltage 1
400
30
ns
RFB
kΩ
V/V
V
(Note 5)
Gain
VBST1
VBST2
VBST3
3
0.95
1.00
-
1.05
1.10
0.05
1.15
1.20
-
At FB pin voltage falling
At FB pin voltage rising
VBST3 = VBST2 - VBST1
(Note 5)
FB Burst Voltage 2
V
FB Burst Hysteresis
V
FB Voltage Stopping
Frequency Reduction
FB Voltage Starting
Frequency Reduction
VDLT1
VDLT2
VFOLP1
1.60
1.90
3.3
1.85
2.20
3.5
2.10
2.50
3.7
V
V
V
V
(Note 5)
Overload detected (at FB pin
voltage rising) (Note 5)
FB OLP Voltage 1
Overload release (at FB pin
FB OLP Voltage 2
VFOLP2
tFOLP1
tFOLP2
3.1
3.3
3.5
voltage falling) (Note 5)
FB OLP ON Detection Timer
40
64
88
ms
ms
FB OLP OFF Timer
332
512
692
(Note 5) Tj = 25 °C warranty.
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BM2P06xxJ-Z series
Electrical Characteristics – continued
(Unless otherwise noted, Tj = -40 °C to +105 °C, VCC = 15 V)
Item
Symbol
Min
Typ
Max
Unit
Conditions
[Over Current Detection Block]
Over Current Detection
Voltage 1
Over Current Detection
Voltage 2
Over Current Detection
Voltage SS1
Over Current Detection
Voltage SS2
Dynamic Over Current
Detection Voltage
Leading Edge Blanking
Time
Lower limit of over current
detection voltage (Note 5)
Upper limit of over current
detection voltage (Note 5)
VOCP1
VOCP2
0.735
0.896
0.095
0.290
1.130
120
0.780
0.950
0.200
0.395
1.230
250
0.825
1.004
0.305
0.500
1.330
380
V
V
VOCP_SS1
VOCP_SS2
VDOC
V
0 ms to tSS1
tSS1 to tSS2
V
Lower limit of over current
detection voltage
V
(Note 6)
tLEB
ns
[Startup Circuit Block]
Startup Current 1
Startup Current 2
ISTART1
ISTART2
0.1
1.0
0.3
3.0
1.0
6.0
mA
mA
VCC = 0 V (Note 5)
VCC = 10 V (Note 5)
The inrush current from the
DRAIN pin after releasing
UVLO. (at MOSFET OFF)
Required for VCC UVLO
cancellation
OFF Current
ISTART3
-
-
10
17
25
-
μA
V
Startup Circuit Response
Voltage
VSTART
DRAIN pin voltage (Note 5)
Startup Current Switching
Voltage
VH UVLO Detection
Voltage
(Note 5)
VSC
0.7
0.7
1.1
0.8
1.5
0.9
V
V
VINLVP1
At BR pin voltage falling
VH UVLO Release Voltage
VH UVLO Timer
VINLVP2
tINLVP
0.8
40
3.40
3.30
-
0.9
64
1.0
88
3.70
3.60
-
V
ms
V
At BR pin voltage rising
(Note 5)
VH OVP Detection Voltage
VH OVP Release Voltage
VH OVP Timer
VINOVP1
VINOVP2
tINOVP
3.55
3.45
90
BM2P06BxJ-Z only (Note 5)
BM2P06BxJ-Z only (Note 5)
V
(Note 5)
μs
V
BR MASK Voltage
VBRMASK
-
0.1
-
(Note 5) Tj = 25 °C warranty.
(Note 6) Measurements are not made.
I/O Equivalence Circuit
3
SOURCE
1
BR
4
FB
GND
2
VREF
VREF
GND
RFB
SOURCE
FB
BR
7
5
VCC
-
-
6
DRAIN
DRAIN
DRAIN
DRAIN
VCC
Internal
Circuit
Internal
Circuit
-
GND
Internal MOSFET
Internal MOSFET
SOURCE
SOURCE
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BM2P06xxJ-Z series
Application Example
A sample flyback circuit is shown in Figure 14.
Note that DRAIN pin voltage generates high voltage due to ringing etc. when the turn is OFF.
This IC can operate up to 730 V.
FUSE
AC
Diode
Bridge
Filter
Input
DRAIN
VCC
FB
DRAIN
ERROR
AMP
SOURCE
GND
BR
Figure 14. Flyback Application Diagram
730 V
650 V
DRAIN
0 V
tpulse < 10 μs (Duty < 1 %)
Figure 15. DRAIN Pin Ringing Waveform
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BM2P06xxJ-Z series
Typical Performance Curves (Reference Data)
Figure 16. Circuit Current (ON) 1A vs Temperature
Figure 17. Circuit Current (ON) 2 vs Temperature
Figure 18. VCC UVLO Voltage 1 vs Temperature
Figure 19. VCC UVLO Voltage 2 vs Temperature
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BM2P06xxJ-Z series
Typical Performance Curves (Reference Data) - continued
29.0
28.5
28.0
27.5
27.0
26.5
26.0
25.0
24.5
24.0
23.5
23.0
22.5
22.0
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Figure 20. VCC OVP Voltage 1 vs Temperature
Figure 21. VCC OVP Voltage 2 vs Temperature
9.7
9.5
9.3
9.1
8.9
8.7
8.5
8.3
8.1
7.9
7.7
14.0
13.8
13.6
13.4
13.2
13.0
12.8
12.6
12.4
12.2
12.0
-40 -20
0
20
40
60
80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 23. VCC Recharge Stop Voltage vs Temperature
Figure 22. VCC Recharge Start Voltage vs Temperature
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BM2P06xxJ-Z series
Typical Performance Curves (Reference Data) - continued
Figure 24. Oscillation Frequency 1 vs Temperature
Figure 25. Oscillation Frequency 2 vs Temperature
Figure 26. Soft Start Time 1 vs Temperature
Figure 27. Soft Start Time 2 vs Temperature
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BM2P06xxJ-Z series
Typical Performance Curves (Reference Data) - continued
1.15
1.13
1.11
1.09
1.07
1.05
1.03
1.01
0.99
0.97
0.95
1.20
1.18
1.16
1.14
1.12
1.10
1.08
1.06
1.04
1.02
1.00
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Figure 29. FB Burst Voltage 2 vs Temperature
Figure 28. FB Burst Voltage 1 vs Temperature
2.05
2.00
1.95
1.90
1.85
1.80
1.75
1.70
1.65
1.60
1.55
2.45
2.35
2.25
2.15
2.05
1.95
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Figure 31. FB Voltage Starting Frequency Reduction
vs Temperature
Figure 30. FB Voltage Stopping Frequency Reduction
vs Temperature
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Typical Performance Curves (Reference Data) - continued
Figure 33. FB OLP Voltage 2 vs Temperature
Figure 32. FB OLP Voltage 1 vs Temperature
Figure 35. FB OLP OFF Timer vs Temperature
Figure 34. FB OLP ON Detection Timer vs Temperature
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Typical Performance Curves (Reference Data) - continued
Figure 37. Over Current Detection Voltage 2
vs Temperature
Figure 36. Over Current Detection Voltage 1 vs Temperature
Figure 38. Dynamic Over Current Detection Voltage
vs Temperature
Figure 39. VH UVLO Detection Voltage vs Temperature
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BM2P06xxJ-Z series
Typical Performance Curves (Reference Data) - continued
1.00
0.98
0.96
0.94
0.92
0.90
0.88
0.86
0.84
0.82
0.80
3.7
3.65
3.6
3.55
3.5
3.45
3.4
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Figure 40. VH UVLO Release Voltage vs Temperature
Figure 41. VH OVP Detection Voltage vs Temperature
3.6
3.55
3.5
3.45
3.4
3.35
3.3
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Figure 42. VH OVP Release Voltage vs Temperature
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BM2P06xxJ-Z series
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BM2P06xxJ-Z series
Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 43. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BM2P06xxJ-Z series
Ordering Information
B M 2
P
0
6
x
y
J
- Z
x: VH Protection Function
A: VH UVLO
B: VH UVLO, VH OVP
Products deployed at
production sites
Z: DIP7K
y: MOSFET ON Resistance
1: 1.0 Ω (Typ)
3: 3.0 Ω (Typ)
Marking Diagram
DIP7K (TOP VIEW)
Part Number Marking
LOT Number
MOSFET ON
Part Number Marking
Product Name
VH UVLO
VH OVP
Resistance
1.0 Ω (Typ)
3.0 Ω (Typ)
1.0 Ω (Typ)
3.0 Ω (Typ)
○
○
○
○
BM2P06A1J
BM2P06A3J
BM2P06B1J
BM2P06B3J
BM2P06A1J-Z
BM2P06A3J-Z
BM2P06B1J-Z
BM2P06B3J-Z
-
-
○
○
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BM2P06xxJ-Z series
Physical Dimension and Packing Information
Package Name
DIP7K
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BM2P06xxJ-Z series
Revision History
Date
Revision
001
Changes
12.Oct.2022
New release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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