BM2PA98F [ROHM]

PWM type DC/DC converter IC Included a Switching MOSFET;


型号：	BM2PA98F
厂家：	ROHM
描述：	PWM type DC/DC converter IC Included a Switching MOSFET
文件：	总23页 (文件大小：1263K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

AC/DC Converter IC

PWM type DC/DC converter IC

Included a Switching MOSFET

BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

●General Description

The PWM type DC/DC converter (BM2PXXXF)

●Basic specifications

Operating Power Supply Voltage Range:

for AC/DC provides an optimal system for all products

that include an electrical outlet.

BM2PXXXF supports both isolated and non-

isolated devices, enabling simpler design of various

types of low-power electrical converters.

VCC

DRAIN

8.9V to 26.0V

to 650V

Normal Operating Current:

The built-in 650V HV starter circuit contributes

to low-power consumption.

(BM2Px5xF) ：0.60mA (Typ.)

(BM2Px9xF) ：0.50mA (Typ.)

A higher degree of design freedom can be

achieved with current detection resistors as external

devices. Current is restricted in each cycle and

excellent performance is demonstrated in bandwidth

and transient response since current mode control is

utilized. The switching frequency is 65 kHz. At light

load, the switching frequency is reduced and high

efficiency is achieved. A frequency hopping function

that contributes to low EMI is also included on chip.

Design can be easily implemented because

includes a 650V switching MOSFET.

■Burst Operating Current:

Oscillation Frequency:

Operating Temperature:

0.30mA(Typ.)

65kHz(Typ.)

- 40deg. to +105deg.

MOSFET ON Resistance:

BM2Px5xF：4.0Ω (Typ.)

BM2Px9xF：8.5Ω (Typ.)

●Package

SOP8

●Features

5.00mm x 6.20mm x 1.71mm pitch 1.27mm

 PWM frequency : 65kHz

 PWM current mode control

(Typ.)

(TYP.)

 Burst operation when load is light

 Frequency reduction function

 Built-in 650V starter circuit

 Built-in 650V switching MOSFET

 VCC pin Under-Voltage protection

 VCC pin Over-Voltage protection

 SOURCE pin Open Protection

 SOURCE pin Short Protection

 SOURCE pin Leading Edge Blanking function

 Per-cycle Over-Current Protection Circuit

 Soft start

●Applications

For AC adapters and household appliances (vacuum

cleaners, humidifiers, air cleaners, air conditioners, IH

cooking heaters, rice cookers, etc.)

 Secondary Over-Current Protection Circuit

●Application Circuit

Figure 1. Application Circuit

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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●Absolute Maximum Ratings （Ta=25C）

Parameter

Maximum applied voltage 1

Maximum applied voltage 2

Symbol

V_max1

V_max2

Rating

-0.3 to 32.0

-0.3 to 6.5

Unit

Conditions

VCC

SOURCE, FB, FADJ

Maximum applied voltage 3

V_max3

650

DRAIN

P_W=10us, Duty cycle=1%

(BM2Px5xF)

Drain current pulse

I_DP

2.60

P_W=10us, Duty cycle=1%

(BM2Px9xF)

When implemented

Drain current pulse

I_DP

P_d

1.30

0.56

Power dissipation

Operating

temperature range

^oC

T_opr

-40 to +105

MAX junction temperature

T_jmax

T_str

150

^oC

Storage

temperature range

-55 to +150

(Note1)

SOP8 : When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate)

Derate by 4.563mW/°C when operating above T_a=25°C.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the

absolute maximum ratings.

●Operating Conditions （Ta=25C）

Parameter

Power supply voltage range 1

Power supply voltage range 2

Symbol

V_CC

V_DRAIN

Rating

8.9 to 26.0

650

Unit

Conditions

VCC pin voltage

DRAIN pin voltage

●Electrical Characteristics of MOSFET (unless otherwise noted, Ta = 25C, VCC = 15V)

Specifications

Parameter

[MOSFET Block]

Symbol

Unit

Conditions

Min

Typ

Max

Between drain and

source voltage

I_D=1mA / V_GS=0V

V_(BR)DDS

I_DSS

650

Ω

Drain leak current

100

5.5

V_DS=650V / V_GS=0V

I_D=0.25A / V_GS=10V

(BM2Px5xF)

On resistance

R_DS(ON)

4.0

I_D=0.25A / V_GS=10V

(BM2Px9xF)

On resistance

R_DS(ON)

8.5

12.0

Ω

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●Electrical Characteristics (unless otherwise noted, Ta = 25C, VCC = 15 V)

Specifications

Parameter

[Circuit Current]

Symbol

Unit

Conditions

Min

Typ

Max

FB=2.0(at pulse operation)

BM2Px5xF

Circuit current (ON) 1

I_ON1

I_ON2

410

350

200

600

500

300

790

650

400

μA

FB=2.0(at pulse operation)

BM2Px9xF

Circuit current (ON) 2

FB=0.0V(at burst operation)

[VCC Protection Function]

VCC UVLO voltage 1

VCC UVLO voltage 2

VCC UVLO hysteresis

VCC OVP voltage 1

VCC OVP voltage 2

VCC OVP hysteresis

Latch released VCC voltage

V_UVLO1

V_UVLO2

V_UVLO3

V_OVP1

V_OVP2

V_OVP3

V_LATCH

12.50

7.50

13.50

8.20

5.30

27.5

23.5

14.50

8.90

VCC rise

VCC fall

V_UVLO3= V_UVLO1- V_UVLO2

VCC rise

BM2Pxx6F/BM2Pxx8F VCC fall

BM2Pxx6F/BM2Pxx8F

26.0

29.0

4.0

V_UVLO2-0.5

VCC recharge start voltage

V_CHG1

7.70

8.70

9.70

VCC recharge stop voltage

Latch mask time

Thermal shut down temperature1

Thermal shut down temperature2

V_CHG2

t_LATCH

T_SD1

12.00

120

13.00

100

145

14.00

150

C

Control IC, temp rise

Control IC, temp fall

T_SD2

115

[PWM Type DCDC Driver Block]

Oscillation frequency 1

Oscillation frequency 2

Frequency hopping width 1

Hopping fluctuation frequency

FADJ source current

FADJ comparator voltage

FADJ max burst frequency

Soft start time 1

Soft start time 2

Soft start time 3

Soft start time 4

Maximum duty

F_SW1

F_SW2

F_DEL1

F_CH

4.0

KHz

FB=2.00V

FB=0.30V

FB=2.0V

125

175

1.20

1.27

0.70

1.40

2.80

4.80

82.0

650

I_BST

0.80

1.13

0.30

0.60

1.20

3.20

68.0

150

1.00

1.20

0.833

0.50

1.00

2.00

4.00

75.0

400

FADJ=0.0V

V_BST

F_BST

t_SS1

t_SS2

t_SS3

t_SS4

D_max

T_min

CFADJ=1000pF

Minimum ON pulse

FB pin pull-up resistance

R_FB

kΩ

V/V

ΔFB / ΔSOURCE gain

FB burst voltage 1

FB burst voltage 2

FB burst hysteresis

FB voltage of

starting frequency reduction mode

FB OLP voltage 1a

FB OLP voltage 1b

FB OLP ON time

Gain

V_BST1

V_BST2

V_BST3

4.00

0.280

0.320

0.04

0.220

0.260

0.340

0.380

FB fall

FB rise

V_BST3= V_BST2- V_BST1

V_DLT

1.100

1.250

1.400

V_FOLP1A

V_FOLP1B

T_FOLP1

T_FOLP2

2.60

2.80

2.60

128

512

3.00

176

692

Overload is detected (FB rise)

Overload is detected (FB fall)

FB OLP OFF time

332

BM2Pxx5F/BM2Pxx6F

[Over Current Detection Block]

Over-current detection voltage

V_SOURCE

V_{S_SS1}

V_{S_SS2}

V_{S_SS3}

V_{S_SS4}

t_LEB

0.375

0.400

0.100

0.150

0.200

0.300

250

0.425

Ton=0us

Over-current detection voltage SS1

Over-current detection voltage SS2

Over-current detection voltage SS3

Over-current detection voltage SS4

Leading edge blanking time

0[ms] to Tss1 [ms]

TSS1 [ms] to TSS2 [ms]

TSS2 [ms] to TSS3 [ms]

TSS3 [ms] to TSS4 [ms]

Over current detection AC voltage

compensation factor

K_SOURCE

mV/us

SOURCE pin short protection voltage

SOURCE pin short protection time

[Start Circuit Block]

V_SHT

0.020

1.80

0.050

3.00

0.080

4.20

T_SOURCESHT

Start current 1

Start current 2

I_START1

I_START2

0.100

1.000

0.500

3.000

1.000

6.000

VCC= 0V

VCC=10V

Inflow current from Drain pin after

UVLO is released and when

MOSFET is OFF

OFF current

I_START3

V_SC

Start current switching voltage

0.800

1.500

2.100

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

●Pin Descriptions

Table 1. Pin Description

ESD Diode

VCC GND

NO.

Pin Name

I/O

Function

VCC

N.C.

Power supply input pin

✔

N.C.

DRAIN

SOURCE

FADJ

GND

I/O

MOSFET DRAIN pin

MOSFET SOURCE pin

MAX Burst Frequency setting pin

GND pin

✔

I/O

Feedback signal input pin

✔

●I/O Equivalent Circuit Diagram

Figure 2. I/O Equivalent Circuit Diagram

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●Block Diagram

FUSE

Diode

Bridge

Filter

VCC

DRAIN

VCC UVLO

13.5V

Starter

4.0V

Line Reg

/ 8.2V

VCC OVP

100us

Filter

10uA

12V Clamp

Circuit

27.5V

Internal Block

FADJ

Burst

Frequency

Control

DRIVER

PWM Control

4.0V

Burst Control

4.0V

30k

OLP

128 ms/

512ms

Timer

Current

Limiter

Leading Edge

Blanking

SOURCE

Burst

Comparator

(typ=250ns)

AC Input

Compensation

Soft Start

PWM

Comparator

MAX

DUTY

GND

Frequency

Hopping

OSC

(65kHz)

Slope

Compensation

FeedBack

With

Isolation

Figure 3. Block Diagram

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

●Line up

On Resistance

[ ohm typ. ]

8.50

VCC OVP

Function

Frequency

Reduction Function

FB OLP

Auto Restart

Latch

BM2P095F

BM2P045F

BM2P096F

BM2P046F

BM2P097F

BM2P047F

BM2P098F

BM2P048F

BM2PA95F

Latch

Auto Restart

Latch

✔

4.00

8.50

4.00

8.50

4.00

8.50

4.00

8.50

4.00

8.50

4.00

8.50

4.00

8.50

4.00

Auto Restart

Latch

Auto Restart

Latch

10 BM2PA45F

11 BM2PA96F

12 BM2PA46F

13 BM2PA97F

14 BM2PA47F

15 BM2PA98F

16 BM2PA48F

Auto Restart

Latch

Auto Restart

Latch

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

●Block Description

(1) Start circuit (DRAIN: Pin 4)

This IC has a built-in start circuit. It enables low standby mode electricity and high speed start.

After start up, consumption power is determined by idling current I_START3（Typ=10uA） only.

Reference values of starting time are shown in Figure 6. When C_vcc=10uF it can start in less than 0.1 sec.

FUSE

Diode

Bridge

85-265 Vac

DRAIN

SW1

VCC

Cvcc

VCCUVLO

Figure 4. Block Diagram of Start Circuit

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

Cvcc [uF]

Figure 5. Start Current vs VCC Voltage

* Start current flows from the DRAIN pin

Figure 6. Start Time (reference value)

Ex) Consumption power of start circuit only when Vac=100V

PVH＝100V*√2*10uA=1.41mW

Ex) Consumption power of start circuit only when Vac=240V

PVH＝240V*√2*10uA=3.38mW

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

(2) Start sequences

(Soft start operation, light load operation, and auto recovery operation during overload protection)

Start sequences are shown in Figure 7. See the sections below for detailed descriptions.

Figure 7. Start Sequences Timing Chart

Input voltage VH is applied.

This IC starts operating when VCC > V_UVLO1(13.5 V Typ).

Switching function starts when other protection functions are judged as normal.

When the secondary output voltage becomes constant, VCC pin current causes the VCC voltage to drop. As a result, IC

should be set to start switching until VCC<V_UVLO2(8.2V Typ).

C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.

D: When the switching operation starts, VOUT rises.

Once the output voltage starts, set the rated voltage within the T_FOLPperiod (128ms Typ).

When there is a light load, it makes FB voltage < V_BST(0.3V Typ). Burst operation is used to keep power consumption

down. During burst operation, it operates at low-power consumption mode.

When the FB pin Voltage＞V_FOLP1A（2.8V Typ）, it overloads.

G: When the FB pin voltage keeps V_FOLP1A(= 2.8V Typ) at or goes above T _FOLP(128ms Typ), the overload protection function

is triggered and the switching stops. During the T_FOLPperiod (128ms Typ), if the FB pin voltage becomes <V_FOLP1Beven

once, the IC’s internal timer is reset.

H: If the VCC voltage drops to < V_UVLO2(7.7V Typ) or below, restart is executed.

The IC’s circuit current is reduced and the VCC pin value rises. (same as B)

Same as F

Same as G

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

(3) VCC pin protection function

These ICs have a built-in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage protection

function VCCOVP (Over Voltage Protection), and a VCC recharge function that operates in case of a drop in VCC voltage.

VCC charge function stabilizes the secondary output voltage, charged from high voltage lines by the start circuit when VCC

voltage drops.

(3-1) VCC UVLO ／ VCC OVP function

VCCUVLO is an auto recovery comparator while VCCOVP is a latch type or auto restart type comparator with voltage

hysteresis.

VCCOVP operates in case of continuing VCC pin voltage > V_OVP（Typ=27.5V）.

This function has a built-in mask time T_LATCH（Typ=100us）. Through this function, the IC is protected from pin generated

surge, etc. Figure 8 is showed about VCC OVP latch type.

Vovp1=27.5Vtyp

Vovp1=23.5Vtyp

VCCuvlo1=13.5Vtyp

Vchg1=13.0Vtyp

Vchg2= 8.7Vtyp

VCCuvlo2 8.2Vtyp

OFF

B C

Figure 8. VCC UVLO / OVP Timing Chart

A: DRAIN voltage input, VCC pin voltage starts rising.

B: VCC>V_uvlo1, DC/DC operation starts.

C: VCC< V_CHG1, VCC charge function operates and the VCC voltage rises.

D: VCC > V_CHG2,VCC charge function stops.

E: VCC > V_OVP1,T_LATCH(Typ =100us) continues, switching is stopped by the VCCOVP function.

F: VCC < V_OVP2, DC/DC operation restarts.

G: VH is OPEN. VCC Voltage falls.

H: Same as C

I: Same as D

J: VCC<V_uvlo2, DC/DC operation stops.

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（3-2）VCC charge function

BM2PxxxF has the recharge function.

VCC charge function operates once the VCC pin >V_UVLO1and when the DC/DC operation starts. The VCC pin voltage then

drops to <V_CHG1. At that time the VCC pin is charged from the DRAIN pin through the start circuit.

Through this operation, these series prevent failure.

VCC pin voltage rises until VCC >V_CHG2. The operation is shown in figure 9.

V_UVLO1

V_CHG2

VCC

V_CHG1

V_UVLO2

Switching

VH charge

charge

OUTPUT

voltage

B C D E

F G H

Figure 9. VCC Pin Charge Operation

A: DRAIN pin voltage rises, charges VCC pin through the VCC charge function.

B: VCC > V_UVLO1,VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.

C: When the DC/DC operation starts, the VCC voltage drops.

D: VCC < V_CHG1,VCC recharge function operates.

E: VCC > V_CHG2,VCC recharge function stops.

F: VCC < V_CHG1,VCC recharge function operates.

G: VCC > V_CHG2,VCC recharge function stops.

H: After the output voltage is finished rising, VCC is charged by the auxiliary winding, and VCC pin stabilizes.

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)

BM2PxxxF has a current mode PWM control.

An internal oscillator sets a fixed switching frequency (65 kHz Typ).

BM2PxxxF has an integrated switching frequency hopping function, which causes the switching frequency to fluctuate as

shown in figure 10 below.

The fluctuation cycle is 125 Hz (Typ).

Figure 10. Frequency Hopping Function

Maximum duty cycle is fixed at 75% (Typ) and minimum pulse width is fixed at 400 ns (Typ).

In current mode control, sub-harmonic oscillation may occur when the duty cycle exceeds 50%.

As a countermeasure, this IC has built-in slope compensation circuits.

This IC has built-in burst mode and frequency reduction circuits to achieve lower power consumption when the load is light.

(Only BM2P0xxF series have frequency reduction circuits )

FB pin is pulled up by R_FB(30 kΩ Typ).

FB pin voltage is changed by secondary output voltage (secondary load power).

FB pin is monitored, burst mode operation and frequency detection start.

Figure 11 shows the FB voltage, and the DCDC switching frequency operation.

＜BM2P0xxF＞

＜BM2PAxxF＞

・mode1 : Burst operation

・mode2 : Frequency reduction operation

・mode1 : Burst operation

・mode2 : Fixed frequency operation

( operates at max frequency)

・mode3 : Fixed frequency operation

(operates at max frequency)

・mode3 : Fixed frequency operation

(operates at max frequency)

・mode4 : Overload operation

(detects the overload state and stops the pulse operation)

Figure 11-1. Switching Operation State Changes by FB Pin Voltage

( BM2P0xxF series)

Figure 11-2. Switching Operation State Changes by FB Pin Voltage

( BM2PAxxF series)

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

(4-1) MAX Burst frequency setting

This IC can reduce a burst sound to fix a burst frequency.

This IC has two clocks, so this IC can fix the burst frequency.

Frequency

[kHz]

Frequency

[kHz]

Burst

Mode

Frequency

Reduction Mode

Normal

Mode

Burst

Mode

Frequency

Reduction Mode

Normal

Mode

65kHz

25kHz

65kHz

Switching

frequency

Switching

frequency

25kHz

FADJ

[Region of sound]

Burst frequency

Output Power[W]

Burst frequency

Output Power[W]

Figure 12-1. No setting

Figure 12-2. setting

Setting external capacitor of FADJ pin, the burst frequency is fixed.

It is showed an example of max burst frequency setting using FADJ pin

This frequency is decided by FADJ source current, FADJ comparator voltage and external capacitor.

100000

10000

1000

100

1000

10000

C_FADJ[pF]

Figure 13. Example of max burst frequency setting using FADJ pin

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

(5) Over Current limiter

BM2PxxxF has a built-in over current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching stops. It also

has a built-in AC voltage compensation function. With this function, the over current limiter level is high until the time the AC

voltage is compensated.

Shown in figure-14, 15, and 16.

Figure 14. No AC Voltage Compensation Function

Figure15. Built-in AC Compensation Voltage

Primary peak current is calculated using the formula below.

Primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay

Vcs： Over current limiter voltage (internal), Rs：Current detection resistance, Vdc： Input DC voltage, Lp：Primary inductance,

Tdelay： Delay time after detection of over current limiter

Figure 16. Over Current Limiter Voltage

（6）L. E. B. Blanking Period

When the MOSFET driver is turned ON, surge current flows through each capacitor component and drive current is

generated. Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current

limiter circuit. To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for

250ns by the on-chip LEB (Leading Edge Blanking) function.

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

(7) SOURCE pin (pin 5) short protection function

When the SOURCE pin (pin 5) is shorted, BM2PxxxF overheats.

BM2PxxxF has a built-in short protection function to prevent destruction.

(8) SOURCE pin (pin 5) open protection

If the SOURCE pin becomes OPEN, BM2PxxxF may be damaged.

To prevent it from being damaged, BM2PxxxF has a built-in OPEN protection circuit （auto recovery protection）.

((9) Output over load protection function （FB OLP Comparator）

The output overload protection function monitors the secondary output load status at the FB pin and stops switching

whenever overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to the

photo coupler, so the FB pin voltage rises.

When the FB pin voltage > V_FOLP1A(2.8 V Typ) continuously for the period T_FOLP(128ms Typ), it is judged as an overload and

switching stops.

When the FB pin > V_FOLP1A(2.8 V Typ), if the voltage goes lower than V_FOLP1B(2.6V Typ) during the period T_FOLP(128ms Typ),

the overload protection timer is reset. The switching operation is performed during this period T_FOLP(128ms Typ).

At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of V_FOLP1A(2.8 V Typ) or

above. Therefore, at startup the FB voltage must be set to V_FOLP1B(2.6 V Typ) or below during the period T_FOLP(128ms Typ),

and the secondary output voltage’s start time must be set within the period T_FOLP(128ms Typ) following startup of the IC.

Recovery is after the period T_FOLP2(512 ms Typ), from the detection of FBOLP.

●Operation mode of protection circuit

Operation mode of protection functions are shown in Table 2.

Table 2. Operation Mode of Protection Circuit

Function

Operation mode

VCC Under Voltage Locked Out

Auto recovery

BM2Pxx5F :Latch（with 100us timer）

BM2Pxx6F :Auto recovery

BM2Pxx7F :Latch（with 100us timer）

BM2Pxx8F :Auto recovery

VCC Over Voltage Protection

TSD

Auto recovery

BM2PXX5F:Auto recovery（with 128ms timer）

BM2PXX6F:Auto recovery （with 128ms timer）

BM2PXX7F:Latch（with 128ms timer）

BM2PXX8F:Latch（with 128ms timer）

Auto recovery

FB Over Limited Protection

SOURCE Short Protection

SOURCE Open Protection

Auto recovery

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● Thermal loss

The thermal design should set the operation for the following conditions.

(Since the temperature shown below is the guaranteed temperature, be sure to take into account a sufficient margin.)

1. The ambient temperature Ta must be 105℃ or less.

2. The IC’s loss must be within the allowable dissipation P_d.

The thermal dissipation characteristics are as follows.

(PCB: 70 mm × 70mm × 1.6 mm, mounted on glass epoxy substrate)

0.8

0.6

0.4

0.2

Ta[℃]

100

125

150

Figure 17. SOP8 Thermal Dissipation Characteristics

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

●Ordering Information

X F

B M 2 P X X

GE 2

Package

F: SOP8

Product

name

Packaging and

forming specification

E2: Embossed tape and reel

●Physical Dimension Tape and Reel Information

(Max 5.35 (include.BURR))

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

(UNIT

PKG

mm)

SOP8

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

●Marking Diagram

●Line Up

Product name

BM2P095F

BM2P045F

BM2P096F

BM2P046F

BM2P097F

BM2P047F

BM2P098F

BM2P048F

BM2PA95F

BM2PA45F

BM2PA96F

BM2PA46F

BM2PA97F

BM2PA47F

BM2PA98F

BM2PA48F

Part Number Marking

P095

P045

P096

P046

P097

P047

P098

P048

PA95

PA45

PA96

PA46

PA97

PA47

PA98

PA48

Part Number

Marking

1PIN MARK

PXXX

LOT No.

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TSZ02201-0F2F0A200210-1-2

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 18. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation

should always be within the IC’s power dissipation rating. If however the rating is exceeded for a

continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn

OFF all output pins. The IC should be powered down and turned ON again to resume normal

operation because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the

TSD threshold.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

www.rohm.com

TSZ02201-0F2F0A200210-1-2

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BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series

date

Rev. NO.

Revision Point

21/Apr/2014

28/Nor/2016

001

002

New release

P3. Electrical Characteristics , add Minimum On pulse

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TSZ02201-0F2F0A200210-1-2

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TSZ22111・15・001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

BM2P045F - Web Page

Part Number

Package

BM2P045F

SOP8

Unit Quantity

2500

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

2500

Taping

inquiry

Yes

BM2PA98F [ROHM]

相关型号：

BM2PA98F-GE2

BM2PAA1Y-Z

BM2PAB1Y-Z

BM2PDA1Y-Z

BM2PDB1Y-Z

BM2SC121FP2-LBZ

BM2SC122FP2-LBZ

BM2SC123FP2-LBZ

BM2SC124FP2-LBZ

BM2SC125FP2-LBZ (开发中)

BM2SCQ121T-LBZ

BM2SCQ122T-LBZ