BM61S41RFV-C [ROHM]
BM61S41RFV-C是绝缘耐压3750Vrms、输入输出延迟时间65n、最小输入脉冲宽度60ns的栅极驱动器。搭载了UVLO功能、米勒钳位功能。;型号: | BM61S41RFV-C |
厂家: | ROHM |
描述: | BM61S41RFV-C是绝缘耐压3750Vrms、输入输出延迟时间65n、最小输入脉冲宽度60ns的栅极驱动器。搭载了UVLO功能、米勒钳位功能。 栅极驱动 脉冲 驱动器 |
文件: | 总27页 (文件大小:1198K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Gate Driver Providing Galvanic Isolation Series
Isolation Voltage 3750 Vrms
1ch Gate Driver Providing Galvanic Isolation
BM61S41RFV-C
General Description
Key Specifications
The BM61S41RFV-C is a gate driver with an isolation
voltage of 3750 Vrms, I/O delay time of 65 ns, and
minimum input pulse width of 60 ns. It has the
Under-Voltage Lockout (UVLO) function and Miller clamp
function.
Isolation Voltage:
Maximum Gate Drive Voltage:
I/O Delay Time:
Minimum Input Pulse Width:
Output Current
3750 Vrms
24 V
65 ns(Max)
60 ns
4 A
Features
AEC-Q100 Qualified(Note 1 )
Providing Galvanic Isolation
Active Miller Clamping
Under-Voltage Lockout Function
Package
SSOP-B10W
W(Typ) x D(Typ) x H(Max)
3.5 mm x10.2 mm x 1.9 mm
UL1577 Recognized: File E356010
(Note 1) Grade1
Applications
SiC MOSFET Gate Drive
SSOP-B10W
Typical Application Circuits
Isolation
GND2
VCC2
OUT
MC
GND1
UVLO2
UVLO1
VCC1
INA
INB
Pulse
Generator
Logic
CVCC2
CVCC1
-
+
GND1
GND2
Pin 1
2V
Figure 1. For Driving SiC MOSFET without Negative Power Supply
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Key Specifications...........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuits .............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Recommended Range of External Constants.................................................................................................................................3
Pin Configurations ..........................................................................................................................................................................3
Pin Descriptions..............................................................................................................................................................................3
Description of Functions and Examples of Constant Setting ..........................................................................................................5
Absolute Maximum Ratings ............................................................................................................................................................8
Thermal Resistance........................................................................................................................................................................8
Recommended Operating Conditions.............................................................................................................................................9
Insulation Related Characteristics ..................................................................................................................................................9
Electrical Characteristics...............................................................................................................................................................11
Typical Performance Curves.........................................................................................................................................................12
Figure 7. Input-side Circuit Current 1 vs Input-side Supply Voltage ..........................................................................................12
Figure 8. Input-side Circuit Current 1 vs Temperature...............................................................................................................12
Figure 9. Input-side Circuit Current 2 vs Input-side Supply Voltage (At INA=100 kHz, Duty=50 %)..........................................12
Figure 10. Input-side Circuit Current 2 vs Temperature (At INA=100 kHz, Duty=50 %) ............................................................12
Figure 11. Output-side Circuit Current 1 vs Output-side Supply Voltage (At OUT=L)................................................................13
Figure 12. Output-side Circuit Current 1 vs Temperature (At OUT=L).......................................................................................13
Figure 13. Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=H)...............................................................13
Figure 14. Output-side Circuit Current 2 vs Temperature (At OUT=H)......................................................................................13
Figure 15. Logic High/Low Level Input Voltage .........................................................................................................................14
Figure 16. Output Voltage vs Logic Level Input Voltage (INA)...................................................................................................14
Figure 17. Logic Pull-up/down Resistance vs Temperature.......................................................................................................14
Figure 18. Logic Input Minimum Pulse Width vs Temperature ..................................................................................................14
Figure 19. OUT ON Resistance (Source) vs Temperature ........................................................................................................15
Figure 20. OUT ON Resistance (Sink) vs Temperature.............................................................................................................15
Figure 21. Turn ON Time vs Temperature .................................................................................................................................15
Figure 22. Turn OFF Time vs Temperature ...............................................................................................................................15
Figure 23. Turn ON Time vs Temperature (INA=H, INB=PWM) ................................................................................................16
Figure 24. Turn OFF Time vs Temperature (INA=H, INB=PWM)...............................................................................................16
Figure 25. MC ON Resistance vs Temperature.........................................................................................................................16
Figure 26. MC ON Threshold Voltage vs Temperature..............................................................................................................16
Figure 27. VCC1 UVLO ON/OFF Voltage vs Temperature ..........................................................................................................17
Figure 28. VCC1 UVLO Mask Time vs Temperature ...................................................................................................................17
Figure 29. VCC2 UVLO ON/OFF Voltage vs Temperature ..........................................................................................................17
Figure 30. VCC2 UVLO Mask Time vs Temperature ...................................................................................................................17
Application Examples ...................................................................................................................................................................18
I/O Equivalence Circuits................................................................................................................................................................19
Operational Notes.........................................................................................................................................................................20
1.
2.
3.
4.
5.
6.
7.
8.
Reverse Connection of Power Supply............................................................................................................................20
Power Supply Lines........................................................................................................................................................20
Ground Voltage...............................................................................................................................................................20
Ground Wiring Pattern....................................................................................................................................................20
Recommended Operating Conditions.............................................................................................................................20
Inrush Current.................................................................................................................................................................20
Testing on Application Boards ........................................................................................................................................20
Inter-pin Short and Mounting Errors ...............................................................................................................................20
Unused Input Pins ..........................................................................................................................................................21
Regarding the Input Pin of the IC ...................................................................................................................................21
Ceramic Capacitor..........................................................................................................................................................21
9.
10.
11.
Ordering Information.....................................................................................................................................................................22
Marking Diagram ..........................................................................................................................................................................22
Physical Dimension and Packing Information...............................................................................................................................23
Revision History............................................................................................................................................................................24
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Recommended Range of External Constants
Recommended Value
Pin Name
Symbol
Unit
Min
0.1
Typ
Max
VCC1
VCC2
CVCC1
CVCC2
1.0
-
-
µF
µF
(Note 2)
0.01
-
(Note 2) Value according to the load
Pin Configurations
(TOP VIEW)
GND1
VCC1
5
4
3
2
1
6
7
GND2
VCC2
OUT
8
INA
INB
9
MC
10
GND1
GND2
Pin Descriptions
Pin No.
Pin Name
GND2
MC
Function
1
2
Output-side ground pin
Miller clamp pin
3
OUT
Output pin
4
VCC2
GND2
GND1
VCC1
INA
Output-side power supply pin
Output-side ground pin
Input-side ground pin
Input-side power supply pin
Control input A pin
5
6
7
8
9
INB
Control input B pin
10
GND1
Input-side ground pin
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Pin Descriptions - continued
1. VCC1 (Input-side Power Supply Pin)
The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the current to drive internal
transformers, connect a bypass capacitor between the VCC1 and the GND1 pins.
2. GND1 (Input-side Ground Pin)
The GND1 pin is a ground pin on the input side.
3. VCC2 (Output-side Power Supply Pin)
The VCC2 pin is a power supply pin on the output side. To reduce voltage fluctuations due to OUT pin output current,
connect a bypass capacitor between the VCC2 and the GND2 pins.
4. GND2 (Output-side Ground Pin)
The GND2 pin is a ground pin on the output side.
5. INA, INB (Control Input A/B Pin)
The INA and INB pins are used to determine output logic.
INB
H
INA
L
OUT
L
L
H
H
L
L
L
L
H
H
6. OUT (Output Pin)
The OUT pin is used to drive the gate of a power device.
7. MC (Miller Clamp Pin)
The MC pin is for preventing the increase in gate voltage due to the Miller current of the power device connected to the
OUT pin. If the Miller Clamp function is not used, short-circuit the MC pin to the GND2 pin.
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Description of Functions and Examples of Constant Setting
1. Miller Clamp Function
When the INA=L or INB=H and OUT pin voltage < VMCON (Typ 2V), the internal MOSFET of the MC pin is turned ON.
INA
L
INB
X
MC
Internal MOSFET of the MC Pin
Less Than VMCON
Less Than VMCON
X
ON
ON
X
H
H
L
OFF
X: Don't care
VCC2
GATE
OUT
MC
Logic
-
+
VMCON
GND2
Figure 2. Block Diagram of Miller Clamp Function
tPOFFA
tPONA
H
INA
INB
L
tPONB
tPOFFB
H
L
H
OUT
L
H
VMCON
L
GATE
MC
Hi-z
L
Figure 3. Timing Chart of Miller Clamp Function
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Description of Functions and Examples of Constant Setting - continued
2. Under-Voltage Lockout (UVLO) Function
The BM61S41RFV-C has the Under-Voltage Lockout (UVLO) function both on the Input-side and the output-side. When
the power supply voltage drops to the UVLO ON voltage (input-side Typ 4.0 V, output-side 14.5 V), the OUT pin will output
the “L” signal. In addition, to prevent malfunctions due to noises, a mask time of tUVLO1MSK (Typ 1.5 µs) and tUVLO2MSK (Typ
2.9 µs) are set on both the input-side and the output-side. After the UVLO on Input-side is released, the input signal will
take effect from when the time after the input signal switches.
H
INA
L
H
INB
L
VUVLO1H
VUVLO1L
VCC1
OUT
H
tUVLO1MSK
L
Figure 4. Timing Chart of Input-side UVLO Function
H
INA
INB
L
H
L
VUVLO2H
VUVLO2L
VCC2
OUT
H
Hi-Z
L
tUVLO2MSK
Figure 5. Timing Chart of Output-side UVLO Function
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BM61S41RFV-C
Description of Functions and Examples of Constant Setting - continued
3. I/O Condition Table
Input
Output
No.
Status
VCC1
VCC2
INB
INA
OUT
MC
1
2
3
4
5
VCC1 UVLO
VCC2 UVLO
UVLO
X
X
X
X
H
L
X
L
L
L
L
H
L
L
UVLO
X
INB Active
No UVLO
No UVLO
No UVLO
No UVLO
No UVLO
No UVLO
X
L
Normal Operation L Input
Normal Operation H input
L
L
L
H
Hi-Z
X: Don't care
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Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
Input-side Supply Voltage
Output-side Supply Voltage
INA Pin Input Voltage
VCC1
VCC2
-0.3 to +7.0(Note 3)
-0.3 to +30.0(Note 4)
-0.3 to +VCC1+0.3 or +7.0(Note 3)
-0.3 to +VCC1+0.3 or +7.0(Note 3)
self limited
V
V
VINA
V
INB Pin Input Voltage
VINB
V
OUT Pin Output Current (Peak 10µs)
Storage Temperature Range
Maximum Junction Temperature
IOUTPEAK
Tstg
A
-55 to +150
°C
Tjmax
+150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 3) Relative to GND1.
(Note 4) Relative to GND2.
Thermal Resistance (Note 5)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 7)
2s2p(Note 8)
SSOP-B10W
Input-side Junction to Ambient
θJA1
θJA2
ΨJT1
ΨJT2
172.1
180.2
32
101.8
108.9
27
°C/W
°C/W
°C/W
°C/W
Output-side Junction to Ambient
Input-side Junction to Top Characterization Parameter(Note 6)
Output-side Junction to Top Characterization Parameter(Note 6)
82
60
(Note 5) Based on JESD51-2A (Still-Air)
(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 7) Using a PCB board based on JESD51-3.
(Note 8) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
70 μm
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BM61S41RFV-C
Recommended Operating Conditions
Parameter
Symbol
Min
4.5
16
Max
5.5
Unit
V
(Note 9)
Input-side Supply Voltage
Output-side Supply Voltage
Operating Temperature
VCC1
(Note 10)
VCC2
24
V
Topr
-40
+125
°C
(Note 9) Relative to GND1.
(Note 10) Relative to GND2.
Insulation Related Characteristics
Basic Insulation Requirements according to VDE0884-11(pending)
Parameter
Symbol
Characteristic
Unit
Insulation Classification Per EN 60664-1, Table 1
For Rated Main Voltage< 150 Vrms
For Rated Main Voltage< 300 Vrms
For Rated Main Voltage< 450 Vrms
For Rated Main Voltage< 600 Vrms
Rated Impulse Voltage
I - IV
I - IV
I - III
I - III
-
Climatic Classification
40/125/21
2
-
Pollution Decree(EN 60664-1)
Minimum External Clearance
-
CLR
CPG
8.1
mm
mm
mm
-
Minimum External Creepage
8.1
Minimum Internal Gap (Internal Clearance)
Minimum Comparative Tracking Index
Minimum Repetitive Insulation Voltage
0.012
>400
891
CTI
VIORM
Input to Output Test Voltage, Method b
VIORM × 1.875= VPR, Productive Test, tm = 1 s,
Partial Discharge < 5 pC
VPR
1671
Vpeak
Surge Isolation Voltage
VIOSM
VIOTM
RIO
6000
5300
>109
Highest Allowable Voltage, 1 min
Insulation Resistance at TS, VIO = 500 V
Ω
Recognized under UL 1577
Description
Symbol
VISO
Characteristic
3750
Unit
Vrms
Vrms
Insulation Withstand Voltage / 1 min
Insulation Test Voltage / 1 s
VISO
4500
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UL1577 Ratings Table
Following values are described in UL Report.
Parameter
Side 1 (Input Side) Circuit Current
Side 2 (Output Side) Circuit Current
Side 1 (Input Side) Consumption Power
Side 2 (Output Side) Consumption Power
Isolation Voltage
Values
0.4
Units
mA
mA
mW
mW
Vrms
°C
Conditions
VCC1=5.0V, OUT=L
0.7
VCC2=15V, OUT=L
VCC1=5.0V, OUT=L
VCC2=15V, OUT=L
2
12.6
3750
125
150
150
8.33
Maximum Operating (Ambient) Temperature
Maximum Junction Temperature
Maximum Storage Temperature
Maximum Data Transmission Rate
°C
°C
MHz
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BM61S41RFV-C
Electrical Characteristics
(Unless otherwise specified Ta=-40°C to +125°C, VCC1=4.5 V to 5.5 V, VCC2=16 V to 24 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
INA=L,INB=H
General
Input-side Circuit Current 1
Input-side Circuit Current 2
Output-side Circuit Current 1
ICC11
ICC12
ICC21
ICC22
0.2
1.0
0.4
2.0
1.0
4.0
mA
mA
mA
mA
INA=100kHz, Duty=50%
OUT=L
0.30
0.22
0.70
0.52
1.20
0.90
Output-side Circuit Current 2
OUT=H
Logic Block
Logic High Level Input Voltage
Logic Low Level Input Voltage
Logic Pull-down Resistance
Logic Pull-up Resistance
VINH
VINL
RIND
RINU
2.0
0
-
VCC1
0.8
V
V
INA, INB
INA, INB
INA
-
25
25
50
50
100
100
kΩ
kΩ
INB
Logic Input Minimum Pulse Width
tINMIN
60
-
-
ns
INA, INB
Output
0.3
0.15
0.67
0.45
1.5
0.98
IOUT=-40 mA
IOUT=40 mA
OUT ON Resistance (Source)
OUT ON Resistance (Sink)
RONH
RONL
Ω
Ω
VCC2=18 V,
Guaranteed by Design
VCC2=18 V,
Guaranteed by Design
OUT Maximum Current (Source)
OUT Maximum Current (Sink)
IOUTMAXH
IOUTMAXL
4.0
4.0
-
-
-
-
A
A
INA=PWM, INB=L
INA=H, INB=PWM
INA=PWM, INB=L
INA=H, INB=PWM
tPOFFA – tPONA
tPONA
tPONB
tPOFFA
tPOFFB
tPDISTA
tPDISTB
tSK-PP
tRISE
45
45
45
45
-10
-10
-
55
55
55
55
0
65
65
65
65
+10
+10
20
-
ns
ns
Turn ON Time
ns
Turn OFF Time
ns
ns
Propagation Distortion
tPOFFB – tPONB
0
ns
Part to Part Skew
-
ns
2 nF between OUT-GND2
2 nF between OUT-GND2
IMC=40 mA
Rise Time
-
15
15
0.45
2
ns
Fall Time
tFALL
-
-
ns
0.15
1.8
100
0.98
2.2
-
Ω
MC ON Resistance
RONMC
VMCON
CM
MC ON Threshold Voltage
Common Mode Transient Immunity
Protection Functions
VCC1 UVLO OFF Voltage
VCC1 UVLO ON Voltage
VCC1 UVLO Mask Time
VCC2 UVLO OFF Voltage
VCC2 UVLO ON Voltage
VCC2 UVLO Mask Time
V
Guaranteed by Design
-
kV/µs
VUVLO1H
VUVLO1L
tUVLO1MSK
VUVLO2H
VUVLO2L
tUVLO2MSK
3.95
3.75
0.4
4.2
4.0
4.45
4.25
5.0
V
V
1.5
µs
V
14.6
14.1
1.0
15.0
14.5
2.9
15.4
14.9
5.0
V
µs
INA
INB
VINL
VINH
VINH
VINL
tPONB
tPOFFA
tPONA
tPOFFB
90%
tRISE
90%
90%
90%
OUT
10%
10%
tFALL
10%
10%
tFALL
tRISE
Figure 6. Timing Chart of IN-OUT
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Typical Performance Curves
1.00
0.90
0.80
0.70
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
Ta=+125°C
0.60
0.50
0.40
0.30
0.20
VCC1=5.5V
VCC1=5.0V
VCC1=4.5V
Ta=+25°C
5.00 5.25
Ta=-40°C
-40 -20
0
20
40
60
80 100 120
4.50
4.75
5.50
Input-side SupplyVoltage:VCC1[V]
Temperature: Ta [°C]
Figure 7. Input-side Circuit Current 1 vs
Input-side Supply Voltage
Figure 8. Input-side Circuit Current 1 vs
Temperature
4.00
3.50
3.00
2.50
2.00
1.50
1.00
4.00
3.50
3.00
2.50
2.00
1.50
1.00
Ta=+125°C
VCC1=5.5V
VCC1=5.0V
VCC1=4.5V
Ta=+25°C
Ta=-40°C
4.50
4.75
5.00
5.25
5.50
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Input-side SupplyVoltage:VCC1[V]
Figure 9. Input-side Circuit Current 2 vs
Input-side Supply Voltage (At INA=100 kHz,
Duty=50 %)
Figure 10. Input-side Circuit Current 2 vs
Temperature (At INA=100 kHz, Duty=50 %)
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Typical Performance Curves - continued
1.20
1.10
1.20
1.10
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
1.00
Ta=+125°C
0.90
0.80
0.70
0.60
VCC2=24V
VCC2=18V
0.50
0.40
0.30
Ta=-40°C
Ta=+25°C
VCC2=16V
16
17
18
19
20
21
22
23
24
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Output-side SupplyVoltage:VCC2[V]
Figure 11. Output-side Circuit Current 1 vs
Output-side Supply Voltage (At OUT=L)
Figure 12. Output-side Circuit Current 1 vs
Temperature (At OUT=L)
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
Ta=+125°C
VCC2=24V
VCC2=16V
Ta=+25°C
Ta=-40°C
VCC2=18V
16
17
18
19
20
21
22
23
24
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Output-side SupplyVoltage:VCC2[V]
Figure 13. Output-side Circuit Current 2 vs
Output-side Supply Voltage (At OUT=H)
Figure 14. Output-side Circuit Current 2 vs
Temperature (At OUT=H)
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Typical Performance Curves - continued
2.0
24
20
16
12
8
Ta=-40°C
Ta=+125°C
Ta=+25°C
1.8
1.6
1.4
1.2
1.0
0.8
H level
VCC1=5V
Ta=+25°C Ta=+125°C
L level
Ta=-40°C
4
0
4.50
4.75
5.00
5.25
5.50
0
1
2
3
4
5
Input-side SupplyVoltage:VCC1[V]
LogicLevel Input Voltage :VINH/VINL[V]
Figure 15. Logic High/Low Level Input Voltage
vs Input-side Supply Voltage
Figure 16. Output Voltage vs Logic Level Input
Voltage (INA)
(VCC1=5 V, VCC2=18 V, Ta=25 °C)
100
75
50
VCC1=4.5V
VCC1=5V
VCC1=5.5V
40
30
20
10
0
Logic Pull-up
VCC1=4.5V
VCC1=5V
VCC1=5.5V
50
Logic Pull-down
VCC1=4.5V
VCC1=5V
VCC1=5.5V
25
-40 -20
0
20
40
60
80 100 120
-40 -20
0
20
40
60
80 100 120
Temperature: Ta [°C]
Temperature: Ta [°C]
Figure 17. Logic Pull-up/down Resistance vs
Temperature
Figure 18. Logic Input Minimum Pulse Width
vs Temperature
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Typical Performance Curves - continued
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
VCC2=16V
VCC2=18V
VCC2=24V
VCC2=16V
VCC2=18V
VCC2=24V
0.2
0.0
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20
40
60
80 100 120
Temperature: Ta [°C]
Figure 19. OUT ON Resistance (Source) vs
Temperature
Figure 20. OUT ON Resistance (Sink) vs
Temperature
65
60
55
50
45
65
60
55
50
45
VCC2=24V
VCC2=24V
VCC2=18V
VCC2=16V
VCC2=18V
VCC2=16V
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Figure 21. Turn ON Time vs Temperature
(INA=PWM, INB=L)
Figure 22. Turn OFF Time vs Temperature
(INA=PWM, INB=L)
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Typical Performance Curves - continued
65
65
60
55
50
45
VCC2=24V
60
VCC2=24V
55
VCC2=18V
VCC2=18V
VCC2=16V
VCC2=16V
50
45
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Figure 23. Turn ON Time vs Temperature
(INA=H, INB=PWM)
Figure 24. Turn OFF Time vs Temperature
(INA=H, INB=PWM)
2.2
2.1
2.0
1.9
1.8
1.0
0.8
0.6
0.4
0.2
0.0
VCC2=16V
VCC2=18V
VCC2=24V
VCC2=16V
VCC2=18V
VCC2=24V
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Figure 25. MC ON Resistance vs
Temperature
Figure 26. MC ON Threshold Voltage vs
Temperature
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Typical Performance Curves - continued
4.40
4.30
4.20
5
4
3
2
1
0
4.10
VUVLO1H
4.00
3.90
VUVLO1L
40 60
Temperature: Ta [°C]
3.80
-40 -20
0
20
80 100 120
-40 -20
0
20
40
60
80 100 120
Temperature: Ta [°C]
Figure 27. VCC1 UVLO ON/OFF Voltage vs
Temperature
Figure 28. VCC1 UVLO Mask Time vs
Temperature
5
15.5
15.3
15.1
14.9
14.7
14.5
14.3
4
3
2
1
0
VUVLO2H
VUVLO2L
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20
40
60
80 100 120
Temperature: Ta [°C]
Figure 29. VCC2 UVLO ON/OFF Voltage vs
Temperature
Figure 30. VCC2 UVLO Mask Time vs
Temperature
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Application Examples
GND1
VCC1
INA
GND2
VCC2
OUT
R1
MC
INB
GND1
GND2
Figure 31. Driving SiC MOSFET
GND1
VCC1
GND2
R1
Q1
VCC2
OUT
MC
R1 D1
INA
Q2
INB
GND1
GND2
Figure 32. Driving SiC MOSFET with Buffer Circuit
Recommended Parts
Manufacturer
ROHM
Element
Resistor
Part Number
R1
Q1
Q2
D1
LTR18EZP,LTR50UZP
2SCR542PFRA
ROHM
ROHM
ROHM
NPN Transistor
PNP Transistor
Diode
2SAR542PFRA
RBR3MM30ATF,RBR5LAM30ATF
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I/O Equivalence Circuits
Pin Name
Function
Pin No.
I/O Equivalence Circuits
VCC2
OUT
OUT
Output Pin
MC
3
GND2
VCC2
MC
2
Miller Clamp pin
GND2
VCC1
INA
INA
8
Control Input A pin
GND1
VCC1
INB
INB
9
Control Input B pin
GND1
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BM61S41RFV-C
Operational Notes – continued
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 33. Example of IC structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B M 6 1 S 4 1 R F V -
CE2
Part Number
Package
Product class
FV: SSOP-B10W
C: for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B10W (TOP VIEW)
Pin 1 Mark
Part Number Marking
LOT Number
BM61S41R
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Physical Dimension and Packing Information
Package Name
SSOP-B10W
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Revision History
Date
Revision
Changes
15.Jun.2018
001
New Release
Page 1: Changed Features
Before: UL1577(pending)
→ After: UL1577 Recognized
Page 9: Corrected Insulation Related Characteristic
Before: Reinforced Insulation
Before: VDE0884-10(pending)
→
→
After: Basic Insulation
After: VDE0884-11(pending)
30.Mar.2020
002
Before: Recognized under UL 1577(pending)
After: Recognized under UL 1577
Before: Vpk After: Vpeak
Corrected Highest Allowable Voltage, 1min
Before: 3750Vrms After: 5300Vpeak
Page 10: Added UL1577 Rating Table
→
→
→
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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