BM6247FS_技术文档

Datasheet

For Air-Conditioner Fan Motor

3-Phase Brushless Fan Motor

Driver

BM6247FS

General Description

Key Specifications

This 3-phase Brushless Fan motor driver IC adopts

MOSFET as the output transistor, and put in a small full

molding package with the 180° sinusoidal commutation

controller chip and the high voltage gate driver chip. The

protection circuits for overcurrent, overheating, under

voltage lock out and the high voltage bootstrap diode

with current regulation are built-in. It provides downsizing

the built-in PCB of the motor.

 Output MOSFET Voltage:

 Driver Output Current (DC):

 Driver Output Current (Pulse):

 Output MOSFET DC On Resistance: 0.93Ω (Typ)

 Duty Control Voltage Range:

 Phase Control Range:

250V

±2.0A (Max)

±4.0A (Max)

2.1V to 5.4V

0° to +40°

+150°C

 Maximum Junction Temperature:

Package

SSOP-A54_36A

W(Typ) x D(Typ) x H(Max)

2.0mm x 14.1mm x 2.4mm

Features

 250V MOSFET Built-in

 Output Current 2.0A

 Bootstrap operation by floating high side driver

(including diode)

 180° Sinusoidal Commutation Logic

 PWM Control (Upper and lower arm switching)

 Phase control supported from 0° to +40° at 1° intervals

 Rotational Direction Switch

 FG signal output with pulse number switch (4 or 12)

 VREG Output (5V/30mA)

 Protection circuits provided: CL, OCP, TSD, UVLO,

MLP and the external fault input

 Fault Output (open drain)

SSOP-A54_36

SSOP-A54_36A

Applications

 Air conditioners; air purifiers; water pumps;

dishwashers; washing machines

Typical Application Circuit

VDC

GND

D1

C5

C6

VCC

R1

VSP

C7

C8

C13

C1

C2~C4

M

R2

C9

HW HV HU

C11

R4

R3

R8

FG

Q1

C12

R7

DTR

Figure 1. Application Circuit Example

〇Product structure : Semiconductor IC 〇This product has no designed protection against radioactive rays

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Contents

General Description........................................................................................................................................................................1

Features..........................................................................................................................................................................................1

Applications ....................................................................................................................................................................................1

Key Specifications ..........................................................................................................................................................................1

Package

..................................................................................................................................................................................1

Typical Application Circuit ...............................................................................................................................................................1

Contents .........................................................................................................................................................................................2

Block Diagram and Pin Configuration.............................................................................................................................................3

Pin Description................................................................................................................................................................................3

Description of Blocks ......................................................................................................................................................................4

Controller Outputs and Operation Mode Summary.........................................................................................................................9

Absolute Maximum Ratings ........................................................................................................................................................10

Thermal Resistance .....................................................................................................................................................................10

Recommended Operating Conditions .........................................................................................................................................11

Electrical Characteristics (Driver part) ..........................................................................................................................................11

Electrical Characteristics (Controller part) ....................................................................................................................................12

Typical Performance Curves (Reference Data) ............................................................................................................................13

Timing Chart .................................................................................................................................................................................21

Application Example .....................................................................................................................................................................23

Parts List.......................................................................................................................................................................................23

Dummy Pin Descriptions...............................................................................................................................................................24

I/O Equivalent Circuits ..................................................................................................................................................................25

Operational Notes.........................................................................................................................................................................26

Ordering Information.....................................................................................................................................................................28

Marking Diagrams.........................................................................................................................................................................28

Physical Dimension and Packing Information...............................................................................................................................29

Revision History............................................................................................................................................................................30

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Block Diagram and Pin Configuration

VCC

1

VDC

BU

36

35

VCC

GND

VCC

VSP

VREG

NC

VDC

5

6

VREG

VSP

TEST

VREG

LEVEL

SHIFT

&

GATE

DRIVER

U

VREG

34

33

7

BU

U

UH

UL

HWN

HWP

HVN

HVP

HUN

HUP

BV

9

HW

HV

HU

HWN

HWP

HVN

HVP

HUN

HUP

PCT

PC

10

11

12

13

14

BV

V

LEVEL

SHIFT

&

GATE

DRIVER

V

VH

VL

32

31

30

M

VDC

BW

PCT

PC

WH

WL

V/I

15

16

VREG

LEVEL

SHIFT

&

GATE

DRIVER

LOGIC

CCW

FGS

FG

VDC

6

A/D

W

29

28

TEST

VREG

PGND

FOB

SNS

NC

CCW

FGS

FG

17

18

19

20

BW

W

26

24

23

GND

VREG

RT

FIB

FOB

GND

VCC

OSC

RT

FAULT

SINE

WAVE

GENE.

VREG

FAULT

SNS

VSP

21

PGND

Figure 2. Block Diagram

Figure 3. Pin Configuration

(Top View)

Pin Description

1

Name

Function

36

-

Name

VDC

Function

VCC

GND

VCC

VSP

VREG

NC

Low voltage power supply

Ground

High voltage power supply

2

3

Ground

4

Ground

5

Low voltage power supply

Duty control voltage input pin

Regulator output

35

-

BU

U

Phase U floating power supply

Phase U output

6

7

34

U

8

No connection

9

HWN

HWP

HVN

HVP

HUN

HUP

PCT

PC

Hall input pin phase W-

Hall input pin phase W+

Hall input pin phase V-

Hall input pin phase V+

Hall input pin phase U-

Hall input pin phase U+

VSP offset voltage output pin

Phase control input pin

Direction switch (H:CCW)

FG pulse # switch (H:12, L:4)

FG signal output

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

33

-

BV

V

Phase V floating power supply

Phase V output

32

V

-

VDC

CCW

FGS

FG

31

High voltage power supply

FOB

SNS

NC

Fault signal output (open drain)

Over current sense pin

No connection

30

-

BW

W

Phase W floating power supply

Phase W output

RT

Carrier frequency setting pin

Ground

29

W

GND

VCC

Ground

-

PGND

Low voltage power supply

28

Ground (current sense pin)

Note) All pin cut surfaces visible from the side of package are no connected, except the pin number is expressed as a “-”.

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Description of Blocks

1. Commutation Logic

When the hall frequency is about 1.4Hz or less (e.g. when the motor starts up), the commutation mode is 120° square

wave drive with upper and lower switching (no lead angle). The controller monitors the hall frequency, and switches to

180° sinusoidal commutation drive when the hall frequency reaches or exceeds about 1.4Hz over four consecutive cycles.

Refer to the timing charts in Figures 46 and 47.

2. Duty Control

The switching duty can be controlled by forcing DC voltage with value from V_SPMINto V_SPMAXto the VSP pin. When the

VSP voltage is V_SPTSTor more, the controller forces PC pin voltage to ground (Testing mode, maximum duty and no lead

angle). The VSP pin is pulled down internally by a 200 kΩ resistor. Therefore, note the impedance when setting the VSP

voltage with a resistance voltage divider.

3. Carrier Frequency Setting

The carrier frequency setting can be freely adjusted by connecting an external resistor

400

between the RT pin and ground. The RT pin is biased to a constant voltage, which

determines the charge current to the internal capacitor. Carrier frequencies can be set

within a range from about 16 kHz to 50 kHz. Refer to the formula to the right.



f_OSC[kHz]

]



R_T[k

4. FG Signal Output

The number of FG output pulses can be switched in accordance with the

number of poles and the rotational speed of the motor. The FG signal is output

from the FG pin. The 12-pulse signal is generated from the three hall signals

(exclusive NOR), and the 4-pulse signal is the same as hall U signal. It is

recommended to pull up FGS pin to VREG voltage when malfunctioning

because of the noise.

FGS

No. of pulse

H

L

12

4

5. Direction of Motor Rotation Setting

The direction of rotation can be switched by the CCW pin. When CCW pin is “H”

or open, the motor rotates at CCW direction. When the real direction is different

from the setting, the commutation mode is 120° square wave drive (no lead

angle). It is recommended to pull up CCW pin to VREG voltage when

malfunctioning because of the noise.

CCW

Direction

CCW

H

L

CW

6. Hall Signal Comparator

The hall comparator provides voltage hysteresis to prevent noise malfunctions. The bias current to the hall elements

should be set to the input voltage amplitude from the element, at a value is the minimum input voltage (V_HALLMIN) or more.

We recommend connecting a ceramic capacitor with value from 100 pF to 0.01 µF, between the differential input pins of

the hall comparator. Note that the bias to hall elements must be set within the common mode input voltage range V_HALLCM

.

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Description of Blocks - continued

7. Output Duty Pulse Width Limiter

Pulse width duty is controlled during PWM switching in order to ensure the operation of internal power transistor. The

controller doesn’t output pulse of less than t_MIN(0.8µs minimum). Dead time is forcibly provided to prevent external power

transistors from turning on simultaneously in upper and lower side in driver output (for example, UH and UL) of each arm.

This will not overlap the minimum time t_DT(1.6µs minimum). Because of this, the maximum duty of 120° square wave

drive at start up is 84% (typical).

8. Phase Control Setting

The driving signal phase can be advanced to the hall signal for phase control. The lead angle is set by forcing DC voltage

to the PC pin. The input voltage is converted digitally by a 6-bit A/D converter, in which internal VREG voltage is assumed

to be full-scale, and the converted data is processed by a logic circuit. The lead angle can be set from 0° to +40° at 1°

intervals, and updated fourth hall cycle of phase W falling edge. Phase control function only operates at sinusoidal

commutation mode. However, the controller forces PC pin voltage to ground (no lead angle) during testing mode. The

VSP offset voltage (Figure 32) is buffered to PCT pin, to connect an external resistor between PCT pin and ground. The

internal bias current is determined by PCT voltage and the resistor value (V_PCT/ R_PCT), and mixed to PC pin. PC pin

voltage is V_PC= V_PCT/ R_PCTx R_PCL. As a result, the lead angle setting is followed with the duty control voltage, and the

performance of the motor can be improved. Select the R_PCTvalue from 50 kΩ to 200 kΩ in the range on the basis of 100

kΩ, because the PCT pin current capability is a 100 µA or less.

PCT

VPCT = VSP-VSPMIN

VSP

VSPMIN

L.A.

VPCT

RPCT

PC

L.A.

ADC

RPCL

RPCT

VSP

Figure 4. Phase Control Setting Example 1

VREG

PCT

VPCT = VSP-VSPMIN

VSP

VSPMIN

L.A.

VPCT

RPCT

RPCH

RPCL

PC

L.A.

ADC

RPCT

VSP

Figure 5. Phase Control Setting Example 2

9. Current Limiter (CL) Circuit and Overcurrent Protection (OCP) Circuit

The current limiter circuit can be activated by connecting a low value resistor for current detection between the output

stage ground (PGND) and the controller ground (GND). When the SNS pin voltage reaches or surpasses the threshold

value (V_SNS, 0.5V typical), the controller forces all the upper switching arm inputs low (UH, VH, WH = L, L, L), thus

initiating the current limiter operation. When the SNS pin voltage swings below the ground, it is recommended to insert a

resistor (1.5 kΩ or more) between SNS pin and PGND pin to prevent malfunction. Since this limiter circuit is not a latch

type, it returns to normal operation - synchronizing with the carrier frequency - once the SNS pin voltage falls below the

threshold voltage. A filter is built into the overcurrent detection circuit to prevent malfunctions, and does not activate when

a short pulse of less than t_MASKis present at the input.

When the SNS pin voltage reaches or surpasses the threshold value (V_OVER, 0.9V typical) because of the power fault or

the short circuit except the ground fault, the gate driver outputs low to the gate of all output MOSFETs, thus initiating the

overcurrent protection operation. Since this protection circuit is also not a latch type, it returns to normal operation

synchronizing with the carrier frequency.

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Description of Blocks - continued

10. Under Voltage Lock Out (UVLO) Circuit

To secure the lowest power supply voltage necessary to operate the controller and the driver, and to prevent under

voltage malfunctions, the UVLO circuits are independently built into the upper side floating driver, the lower side driver and

the controller. When the supply voltage falls to V_UVLand below, the controller forces driver outputs low. When the voltage

rises to V_UVHand above, the UVLO circuit ends the lockout operation and returns the chip only after 32 carrier frequency

periods (1.6ms for the default 20kHz frequency) to normal operation. Even if the controller returns to normal operation, the

output begins from the following control input signal.

The voltage monitor circuit (4.0V nominal) is built-in for the VREG voltage. Therefore, the UVLO circuit does not release

operation when the VREG voltage rising is delayed behind the VCC voltage rising even if VCC voltage becomes V_UVHor

more.

11. Thermal Shutdown (TSD) Circuit

The TSD circuit operates when the junction temperature of the controller exceeds the preset temperature (125°C nominal).

At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit, the chip

returns to normal operation when the junction temperature falls below the preset temperature (100°C nominal). The TSD

circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its

operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not use

the IC in an environment where activation of the circuit is assumed.

Moreover, it is not possible to follow the output MOSFET junction temperature rising rapidly because it is a gate driver chip

that monitors the temperature and it is likely not to function effectively.

12. Motor Lock Protection (MLP) Circuit

When the controller detects the motor locking during fixed time of 4 seconds nominal when each edge of the hall signal

doesn't input either, the controller forces all driver outputs low under a fixed time 20 seconds nominal, and self-returns to

normal operation. This circuit is enabled if the voltage force to VSP is over the duty minimum voltage V_SPMIN, and note that

the motor cannot start up when the controller doesn’t detect the motor rotation by the minimum duty control. Even if the

edge of the hall signal is inputted within range of the OFF state by this protection circuit, it is ignored. But if the VSP is

forced to ground level once, the protection can be canceled immediately.

13. Hall Signal Wrong Input Detection

Hall element abnormalities may cause incorrect inputs that vary from the normal logic. When all hall input signals go high

or low, the hall signal wrong input detection circuit forces all driver outputs low. And when the controller detects the

abnormal hall signals continuously for four times or more motor rotation, the controller forces all driver outputs low and

latches the state. It is released if the duty control voltage VSP is forced to ground level once.

14. VREG Output

The internal voltage regulator VREG is output for the bias of the hall

element and the phase control setting. However, when using the VREG

VCC

function, be aware of the I_OMAXvalue. If a capacitor is connected to the

ground in order to stabilize output, a value of 1 µF or more should be

used. In this case, be sure to confirm that there is no oscillation in the

output.

VREG

R₁

HUP

HUN

HU

HVP

HVN

HV

HWP

HWN

HW

Controller IC

Figure 6. VREG Output Pin Application Example

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Description of Blocks - continued

15. Fault Signal Output

When the controller detects either state that should be protected the overcurrent (OCP) and the over temperature (TSD),

the FOB pin outputs low (open drain) and it returns to normal operation synchronizing with the carrier frequency. Even

when this function is not used, be pull-up the FOB pin to the voltage of 3V or more and at least a resistor with a value 10k

Ω or more. A filter is built into the fault signal input circuit to prevent malfunctions by the switching noise, and does not

activate when a short pulse of less than t_MASKis present at the input. The time to the fault operation is the sum total of the

propagation delay time of the detection circuit and the filter time, 1.6µs (typical).

VSP

TRIOSC

XH

YL

XHO

YLO

1.6µs (Typ)

SNS

FOB

0.9V(Typ)

0.5V(Typ)

OCP threshold

CL threshold

Figure 7. Fault Operation ~ OCP ~ Timing Chart

10

9

8

7

6

5

4

3

2

1

0

The release time from the protection operation can be

changed by inserting an external capacitor. Refer to the

formula below. Release time of 5ms or more is

recommended.

2.3

V_REG

t  ln(1

)RC

[s]

VREG

R

FOB

C

0.01

0.10

1.00

Figure 8. Release Time Setting Application Circuit

Capacitance : C[µF]

Figure 9. Release Time (Reference Data @R=100kΩ)

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Description of Blocks - continued

16. Bootstrap Operation

VB

HO

VS

VDC

OFF

VDC

D_X

C_B

HO

VS

L

H

L

ON

VCC

LO

H

ON

OFF

Figure 10. Charging Period

Figure 11. Discharging Period

The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap

capacitor (C_B) as shown in the figure above. In a word, this operation is repeated while the output of an external transistor

is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the VCC

power supply to C_Bthrough prevention of backflow diode D_X, it is approximately (VCC-1V). The resistance series

connection with D_Xhas the impedance of approximately 200 Ω. Because the total gate charge is needed only by the

carrier frequency in the upper switching section of 120° commutation driving, set it after confirming actual application

operation.

17. Switching Time

XH, XL

V_DS

t_rr

t_on

t_d(on)

t_r

90%

I_D

10%

t_d(off)

t_off

t_f

Figure 12. Switching Time Definition

Parameter

Symbol

t_dH(on)

t_rH

Reference

800

Unit

ns

Conditions

140

High Side Switching

Time

t_rrH

300

VDC=150V, VCC=15V, I_D=1.0A

Inductive load

t_dH(off)

t_fH

t_dL(on)

t_rL

480

30

The propagation delay time: Internal

gate driver input stage to the driver

IC output.

750

130

Low Side Switching

Time

t_rrL

280

t_dL(off)

t_fL

400

30

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Controller Outputs and Operation Mode Summary

Detected direction

Forward (CW:U~V~W, CCW:U~W~V)

Reverse (CW:U~W~V, CCW:U~V~W)

Conditions

Hall sensor frequency

< 1.4Hz

1.4Hz ≤

< 1.4Hz

1.4Hz ≤

VSP < V_SPMIN

(Duty off)

Upper and lower arm off

180° sinusoidal

Upper and lower

switching

V_SPMIN< VSP < V_SPMAX

(Control range)

Normal

operation

120°

Upper and lower

switching

120°

Upper and lower

switching

120°

Upper switching

180° sinusoidal

Upper and lower

switching

V_SPTST< VSP

(Testing mode)

(No lead angle)

Current limiter ^{(Note 1)}

Overcurrent ^{(Note 2)}

TSD ^{(Note 2)}

Upper arm off

Upper and lower arm off

Protect

operation

External input ^{(Note 2)}

UVLO ^{(Note 3)}

Upper and lower arm off

Motor lock

Hall sensor abnormally

Upper and lower arm off and latch

(Note) The controller monitors both edges of three hall sensors for detecting period.

(Note) Phase control function only operates at sinusoidal commutation mode. However, the controller forces no lead angle during the testing mode.

(Note 1) It returns to normal operation by the carrier frequency synchronization.

(Note 2) It works together with the fault operation, and returns after the release time synchronizing with the carrier frequency.

(Note 3) It returns to normal operation after 32 cycles of the carrier oscillation period.

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Absolute Maximum Ratings (Tj=25°C)

Parameter

Symbol

Ratings

Unit

Output MOSFET

V_DSS

250

V

Supply Voltage

V_DC

V_U, V_V, V_W

V_BU, V_BV, V_BW

V_BU-V_U, V_BV-V_V, V_BW-V_W

V_CC

-0.3 to +250

-0.3 to +20

-0.3 to +5.5

±2.0

Output Voltage

V

High Side Supply Pin Voltage

High Side Floating Supply Voltage

Low Side Supply Voltage

Duty Control Voltage

All Others

V

V_SP

V

V_I/O

V

Driver Outputs (DC)

Driver Outputs (Pulse)

Fault Signal Output

I_OMAX(DC)

A

I_OMAX(PLS)

I_OMAX(FOB)

Tstg

±4.0 ^{(Note 1)}

A

15

mA

°C

Storage Temperature

Maximum Junction Temperature

-55 to +150

150

Tjmax

(Note)

All voltages are with respect to ground unless otherwise specified.

(Note 1)

Pw ≤ 10µs, Duty cycle ≤ 1%

Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC

is operated over the absolute maximum ratings.

Caution2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s ^{(Note 3)}

SSOP-A54_36A

Junction to Ambient

Junction to Top Characterization Parameter ^{(Note 2)}

θ_JA

41.7

10

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A(Still-Air)

(Note 2) Refer to Figure 13. for temperature measurement point on the component package top surface.

(Note 3) Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

2.7mm

5.6mm

Measurement point

Figure 13. Temperature Measurement Point

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Recommended Operating Conditions (Tj=25°C)

Parameter

Supply Voltage

Symbol

Min

Typ

Max

Unit

V_DC

-

140

200

16.5

-

V

High Side Floating Supply Voltage

Low Side Supply Voltage

Bootstrap Capacitor

V_BU-V_U, V_BV-V_V, V_BW-V_W

13.5

1.0

0.5

-40

15

-

V_CC

C_B

V

µF

Ω

VCC Bypass Capacitor

Shunt Resistor (PGND)

Junction Temperature

C_VCC

R_S

-

Tj

-

+125

°C

(Note) All voltages are with respect to ground unless otherwise specified.

Electrical Characteristics (Driver part, Unless otherwise specified V_CC=15V and Tj=25°C)

Parameter

Power Supply

Symbol

Min

Typ

Max

Unit

Conditions

HS Quiescence Current

LS Quiescence Current

Output MOSFET

I_BBQ

I_CCQ

30

70

150

1.3

µA

VSP=0V, each phase

VSP=0V

0.2

0.7

mA

D-S Breakdown Voltage

Leak Current

V_(BR)DSS

I_DSS

R_DS(ON)

V_SD

250

-

V

µA

Ω

I_D=1mA, VSP=0V

V_DS=250V, VSP=0V

I_D=1.0A

-

100

1.30

1.5

DC On Resistance

Diode Forward Voltage

Bootstrap Diode

0.93

0.9

V

I_D=1.0A

Leak Current

I_LBD

V_FBD

R_BD

-

1.5

-

10

2.1

-

µA

V

V_BX=250V

Forward Voltage

1.8

200

I_BD=-5mA with series-res.

Series Resistance

Ω

Under Voltage Lock Out

High Side Release Voltage

High Side Lockout Voltage

V_BUVH

V_BUVL

9.5

8.5

10.0

9.0

10.5

9.5

V

V_BX- V_X

(Note) All voltages are with respect to ground unless otherwise specified.

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Electrical Characteristics - continued (Controller part, Unless otherwise specified V_CC=15V and Tj=25°C)

Parameter

Power Supply

Symbol

Min

Typ

Max

Unit

Conditions

Supply Current

I_CC

0.8

4.5

2.0

5.0

3.5

5.5

mA

V

VSP=0V

VREG Voltage

V_REG

I_O=-30mA

Hall Comparators

Input Bias Current

I_HALL

-2.0

0.3

50

-0.1

-

+2.0

µA

V

V_IN=0V

Common Mode Input

Minimum Input Level

Hysteresis Voltage P

Hysteresis Voltage N

Duty Control

V_HALLCM

V_HALLMIN

V_HALLHY+

V_HALLHY-

V_REG-1.5

-

mVp-p

mV

5

13

-13

23

-5

-23

Input Bias Current

I_SP

15

1.8

5.1

8.2

-

25

2.1

5.4

-

35

2.4

5.7

18

-

µA

V

V_IN=5V

Duty Minimum Voltage

Duty Maximum Voltage

Testing Operation Range

Minimum Output Duty

Maximum Output Duty

Mode Switch - FGS, CCW

Input Bias Current

V_SPMIN

V_SPMAX

V_SPTST

D_MIN

V

2

%

f_OSC=20kHz

D_MAX

-

100

-

I_IN

-70

3

-50

-30

V_REG

1

µA

V

V_IN=0V

Input High Voltage

V_INH

V_INL

-

Input Low Voltage

0

V

Fault Input/Output - FOB

Input High Voltage

V_FOBIH

V_FOBIL

V_FOBOL

3

0

-

V_REG

1

V

Input Low Voltage

Output Low Voltage

Monitor Output - FG

Output High Voltage

Output Low Voltage

Current Detection - SNS

Input Bias Current

0.07

0.60

I_O=5mA

V_MONH

V_MONL

V_REG-0.40

0

V_REG-0.10

0.02

V_REG

0.40

V

I_O=-2mA

I_O=2mA

I_SNS

V_SNS

V_OVER

t_MASK

-30

0.48

0.84

0.8

-20

0.50

0.90

1.0

-10

0.52

0.96

1.2

µA

V

V_IN=0V

Current Limiter Voltage

Overcurrent Voltage

Noise Masking Time

Phase Control

V

µs

Minimum Lead Angle

Maximum Lead Angle

Carrier Frequency Oscillator

Carrier Frequency

P_MIN

-

0

1

-

deg

V_PC=0V

P_MAX

39

40

V_PC=2/3·V_REG

f_OSC

18

20

22

kHz

R_T=20kΩ

Under Voltage Lock Out

LS Release Voltage

LS Lockout Voltage

V_CCUVH

V_CCUVL

11.5

10.5

12.0

11.0

12.5

11.5

V

(Note) All voltages are with respect to ground unless otherwise specified.

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Typical Performance Curves (Reference Data)

5

10

9

+125°C

+25°C

-40°C

4.5

4

8

3.5

3

7

6

2.5

2

+125°C

+25°C

-40°C

5

1.5

4

12

14

16

18

20

12

14

16

18

20

Supply Voltage : VCC [V]

Figure 14. Quiescence Current

(Low Side Drivers)

Figure 15. Low Side Drivers Operating Current

(f_PWM: 20kHz)

120

100

80

400

350

300

250

200

150

+125°C

+25°C

-40°C

60

40

+125°C

+25°C

-40°C

20

12

14

16

18

20

12

14

16

18

20

Supply Voltage : VCC [V]

Figure 16. Quiescence Current

(High Side Driver, Each Phase)

Figure 17. High Side Driver Operating Current

(f_PWM: 20kHz, Each Phase)

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Typical Performance Curves (Reference Data) - continued

4

2

1.5

1

+125°C

+25°C

-40°C

+25°C

+125°C

3

2

1

0

0.5

0

0.5

1

1.5

2

2.5

0

0.5

1

1.5

2

2.5

Drain Current : I_DS[A]

Drain Current : I_SD[A]

Figure 18. Output MOSFET ON Resistance

Figure 19. Output MOSFET Body Diode

1.2

4

3

2

1

0

+125°C

+25°C

-40°C

1

0.8

0.6

0.4

0.2

0

-40°C

+25°C

+125°C

0

2

4

6

8

10

0

2

4

6

8

10

Bootstrap Diode Current : I_BD[mA]

Series Resistor Current : I_BR[mA]

Figure 20. Bootstrap Diode Forward Voltage

Figure 21. Bootstrap Series Resistor

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Typical Performance Curves (Reference Data) - continued

200

15

10

5

+125°C

+25°C

-40°C

+125°C

+25°C

-40°C

E_ON

150

100

50

E_OFF

0

0.5

1

1.5

2

0

0.5

1

1.5

2

Drain Current : I_D[A]

Figure 22. High Side Switching Loss

(VDC=150V)

Figure 23. High Side Recovery Loss

(VDC=150V)

200

150

100

50

15

10

5

+125°C

+25°C

-40°C

+125°C

+25°C

-40°C

E_ON

E_OFF

0

0.5

1

1.5

2

0

0.5

1

1.5

2

Drain Current : I_D[A]

Figure 24. Low Side Switching Loss

(VDC=150V)

Figure 25. Low Side Recovery Loss

(VDC=150V)

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Typical Performance Curves (Reference Data) - continued

5.4

5.2

5

-40°C

+25°C

+110°C

5.2

-40°C

+25°C

+110°C

5

4.8

4.6

4.8

4.6

12

14

16

18

20

0

10

20

30

40

Supply Voltage : VCC [V]

Output Current : I_OUT[mA]

Figure 26. VREG vs VCC

Figure 27. VREG Drive Capability

6

5

200

150

100

50

+110°C

+25°C

-40°C

4

3

2

1

+110°C

+25°C

-40°C

0

+110°C

+25°C

-40°C

-1

0

-30

-15

0

15

30

0

5

10

15

20

Differential Voltage : VHUP-VHUN [mV]

VSP Voltage : VSP [V]

Figure 28. Hall Comparator Hysteresis Voltage

Figure 29. VSP Input Bias Current

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Typical Performance Curves (Reference Data) - continued

100

80

1.5

1

60

+110°C

+25°C

-40°C

0.5

0

40

20

0

+110°C

+25°C

-40°C

-0.5

0

2

4

6

8

0

5

10

15

20

VSP Voltage : VSP [V]

Figure 30. Output Duty vs VSP Voltage

Figure 31. Testing Mode Threshold Voltage

5

4

3

2

1

0

4

3

2

1

+110°C

+25°C

-40°C

+25°C

+110°C

0

1

2

3

4

5

6

7

1

2

3

4

VSP Voltage : VSP [V]

PCT Voltage : VPCT [V]

Figure 32. VSP vs PCT Offset Voltage

Figure 33. PCT vs PC Linearity

(R_PCT=R_PC=100kΩ)

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Typical Performance Curves (Reference Data) - continued

60

30

25

20

15

10

+25°C

+110°C

-40°C

+110°C

+25°C

-40°C

50

40

30

20

10

0

0.2

0.4

0.6

0.8

1

14

18

22

26

30

VPC/VREG (Normalized) : [V/V]

External Resistor : R_T[kΩ]

Figure 34. PC Voltage Normalized vs Lead Angle

Figure 35. Carrier Frequency vs RT

0

0.8

0.6

0.4

0.2

0

+110°C

+25°C

-40°C

-0.2

-0.4

-0.6

-0.8

-40°C

+25°C

+110°C

0

2

4

6

0

2

4

6

Output Current : I_OUT[mA]

Figure 36. High Side Output Voltage

(FG)

Figure 37. Low Side Output Voltage

(FG)

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Typical Performance Curves (Reference Data) - continued

60

1.5

1

+110°C

+25°C

-40°C

+110°C

+25°C

-40°C

+110°C

+25°C

-40°C

50

40

30

20

10

0

0.5

0

-0.5

0

1

2

3

4

5

1.5

1.7

1.9

2.1

2.3

2.5

2.7

Input Voltage : V_IN[V]

Figure 38. Input Bias Current

(CCW, FGS)

Figure 39. Input Threshold Voltage

(CCW, FGS, FOB)

30

20

10

0

1.5

1

+110°C

+25°C

-40°C

0.5

0

+110°C

+25°C

-40°C

-0.5

0

1

2

3

4

5

0.48

0.49

0.5

0.51

0.52

SNS Input Voltage : V_SNS[V]

Input Voltage : V_SNS[V]

Figure 40. Input Bias Current

(SNS)

Figure 41. Current Limiter Input Threshold Voltage

(SNS)

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Typical Performance Curves (Reference Data) - continued

1.5

1

-40°C

+25°C

110°C

1

0.5

0

0.5

0

-0.5

0.6

0.7

0.8

0.9

1

1.1

1.2

75

100

125

150

Input Voltage : V_SNS[V]

Junction Temperature : Tj [˚C]

Figure 42. OCP Input Threshold Voltage

(SNS)

Figure 43 Thermal Shutdown

1.5

1

1.5

1

+110°C

+25°C

-40°C

+110°C

+25°C

-40°C

0.5

0

0.5

0

-40°C

+25°C

+125°C

-0.5

8

9

10

11

12

13

8

9

10

11

12

13

Supply Voltage : V_BX-V_X[V]

Supply Voltage : VCC [V]

Figure 44. Under Voltage Lock Out

(High Side Driver, Each Phase)

Figure 45. Under Voltage Lock Out

(Low Side Drivers)

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Timing Chart (CW)

Hall Signals

HALL U

HALL V

HALL W

Spin Up (Hall Period < 1.4Hz)

UH

PWM

VH

PWM

WH

UL

PWM

VL

PWM

WL

CW Direction (Lead=0deg)

UH

VH

WH

UL

VL

WL

CW Direction (Lead=30deg)

UH

VH

WH

UL

VL

WL

FG Output (FGS=H)

FG

Figure 46. Timing Chart (Clockwise)

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Timing Chart (CCW)

Hall Signals

HALL U

HALL V

HALL W

Spin Up (Hall Period < 1.4Hz)

UH

PWM

VH

PWM

WH

UL

PWM

VL

PWM

WL

CCW Direction (Lead=0deg)

UH

VH

WH

UL

VL

WL

CCW Direction (Lead=30deg)

UH

VH

WH

UL

VL

WL

FG Output (FGS=H)

FG

Figure 47. Timing Chart (Counter Clockwise)

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Application Example

VDC

GND

D1

C5

C6

VCC

R1

VSP

C7

C8

C13

C1

C2~C4

M

R2

C9

HW HV HU

C11

R4

R3

R8

FG

Q1

C12

R7

DTR

Figure 48. Application Example (180° Sinusoidal Commutation Driver, CCW="H", FGS="H")

Parts List

Parts

IC₁

R₁

Value

-

Manufacturer

ROHM

-

Type

BM6247FS

Parts

C₁

Value

0.1µF

2200pF

10µF

2.2µF

0.1µF

2.2uF

100pF

0.1µF

-

Ratings

50V

250V

50V

-

Type

Ceramic

1kΩ

150Ω

20kΩ

100kΩ

0.5Ω

10kΩ

0Ω

MCR18EZPF1001

MCR18EZPJ151

MCR18EZPF2002

MCR18EZPF1003

MCR50JZHFL1R50 // 3

MCR18EZPF1002

MCR18EZPJ000

-

C₂

R₂

C₃

R₃

C₄

R₄

C₅

R₅

C₆

R₆

C₇

R₇

C₈

R₈

C₉

R₉

C₁₀

C₁₁

C₁₂

C₁₃

C₁₄

HX

R₁₀

R₁₁

R₁₂

R₁₃

Q₁

-

0Ω

ROHM

-

MCR18EZPJ000

-

100kΩ

-

ROHM

MCR18EZPF1003

DTC124EUA

Hall elements

D₁

-

KDZ20B

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Dummy Pin Descriptions

VCC

PGND

VCC

GND

VCC

VSP

VREG

NC

VDC

(VDC)

Dummy pins handling inside the package

· All VCC pins are electrically connected in the inner lead

frame except 5pin.

· GND pins, 2pin, 3pin, 4pin, 24pin, 25pin and 26pin are

electrically connected in the inner lead frame.

· VDC pins, 31pin and 36pin are electrically connected in the

inner lead frame.

BU

U

(U)

(V)

HWN

HWP

HVN

HVP

HUN

HUP

PCT

PC

BV

V

Plural same name pins

· 5pin is an independent VCC pin. 5pin and the other VCC

pins are electrically not connected in the inner lead frame.

Therefore, 5pin and 1pin needs to connect the pins each

other.

· 24pin, 25pin and 26pin are electrically connected in the

inner lead frame, but 24pin is better to use the carrier

frequency setting ground pin, and 26pin is also better to

use the small signal ground, separately. Refer to the

functional block diagram or an application circuit example.

(VDC)

VDC

CCW

FGS

FG

FOB

SNS

NC

BW

W

(W)

RT

GND

VCC

(PGND)

PGND

VCC

PGND

Figure 49. Dummy Pins

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I/O Equivalent Circuits

VCC

VREG

250k

100k

VSP

VREG

RT

SNS

2k

Figure 50. RT

Figure 51. SNS

Figure 52. VSP

Figure 53. VREG, VCC

VREG

HUP

HUN

HVP

HVN

HWP

HWN

FG

2k

Figure 54. FG

Figure 55. HXP, HXN

VREG

100k

VREG

2k

FGS

CCW

PC

PCT

2k

Figure 56. FGS, CCW

Figure 57. PC, PCT

BX

VREG

VDC

FOB

X

VCC

Figure 58. FOB

PGND

Figure 59. VCC, PGND, VDC, BX(BU/BV/BW), X(U/V/W)

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital

and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.

Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the

capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins

that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back

EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause

the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics,

supply voltage, operating frequency and PCB wiring to name a few.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground

caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground

voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.

The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of

connections.

7. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the

IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be

turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage

from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

9. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin

shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional

solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply

or ground line.

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11. Regarding the Input Pin of the IC

Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins

that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the

IC.

When using this IC, the high voltage pins VDC, BU/U, BV/V and BW/W need a resin coating between these pins. It is judged

that the inter-pins distance is not enough. If any special mode in excess of absolute maximum ratings is to be implemented

with this product or its application circuits, it is important to take physical safety measures, such as providing

voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or

ASO. In the event a large capacitor is connected between the output and ground, and if VCC and VDC are short-circuited

with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC.

This IC contains the controller chip, P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic

diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference

among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as

applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.

Resistor

Transistor(NPN)

Pin B

Pin A

Pin B

B

C

E

Pin A

C

E

P

N

P⁺

N

P⁺

N

P

B

N

P⁺

N

P⁺

P Substrate

N

Parasitic

Elements

N

P Substrate

Parasitic

Elements

N Region

close-by

GND

Parasitic

Elements

Parasitic

Elements

Figure 60. Example of IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature

and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation

(ASO).

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Ordering Information

B M 6 2 4 7

F S -

Z E 2

ROHM Part Number

BM6247 : 250V/2.0A, 180° sinusoidal

Package

FS : SSOP-A54_36A

Packaging specification

E2 : Embossed carrier tape

Marking Diagrams

SSOP-A54_36A

(TOP VIEW)

Part Number Marking

BM6247FS

1PIN MARK

LOT Number

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Physical Dimension and Packing Information

Package Name

SSOP-A54_36A

(UNIT : mm)

PKG : SSOP-A54_36A

Tape

Embossed carrier tape

1000pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

*

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TSZ22111 • 15 • 001

BM6247FS

Revision History

Date

Revision

Changes

06.Apr.2018

22.Feb.2019

001

002

New Release

Correct some misdescriptions

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TSZ02201-0P1P0C402190-1-2

22.Feb.2019 Rev.002

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TSZ22111 • 15 • 001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BM6247FS
厂家：	ROHM
描述：	本产品是将250V耐压MOSFET用作输出晶体管，与180°正弦波控制器芯片、栅极驱动器芯片同时收纳到小型表面贴装型全模件封装中的三相无刷风扇电机驱动器。内置过电流、过热、低电压等保护功能及阴极负载二极管，可实现电机电路板的小型化。电机栅极驱动控制器晶体管风扇二极管驱动器
文件：	总33页 (文件大小：2786K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM6247FS [ROHM]

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