BM67421FV-C [ROHM]
Isolation voltage 2500Vrms Bi-direction 2ch High Speed Digital Isolator;
| 型号： | BM67421FV-C |
| 厂家： | 
ROHM |
| 描述： | Isolation voltage 2500Vrms Bi-direction 2ch High Speed Digital Isolator |
| 文件： | 总24页 (文件大小：1462K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
2ch digital Isolator
Isolation voltage 2500Vrms
Bi-direction 2ch High Speed Digital Isolator
BM67421FV-C
Key Specification
General Description
Supply voltage range:
Propagation delay:
Operating temperature range:
4.5V to 5.5V
40ns (Max)
-40℃to +125℃
The BM67421FV-C is a high-speed isolator IC. This IC
features dielectric strength of 2500 Vrms between I/O.
Maximum propagation delay time is 40ns.
Features
Package
SSOP-B10W
W(Typ) x D(Typ) x H(Max)
Dielectric strength of 2500 Vrms between I/O
Available with 5V signal transmissions
Maximum propagation delay time of 40ns
Built-in 2ch bi-directional propagation
AEC-Q100 Qualified (Note1)
3.50mm x 10.2mm x 1.90mm
(Note 1:Grade1)
Applications
Propagation of logic signal within electric and hybrid
vehicles
Propagation of logic signal within industrial devices
SSOP-B10W
Block diagram/typical application circuit
VCC1
VCC2
2
9
UVLO
UVLO
OUT2
IN1
IN2
3
4
8
7
OUT1
(Note2)
(Note2)
1
5
6
10
GND1
GND2
LVG
HVG
Note2 Please connect bypass capacitor (0.1μF or more) directly to the IC pin.
〇Product structure : Silicon integrated circuit ○This product has no designed protection against radioactive rays.
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Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Key Specification ............................................................................................................................................................................1
Block diagram/typical application circuit .........................................................................................................................................1
Recommended Range of External Constants.................................................................................................................................3
Pin Configurations ..........................................................................................................................................................................3
Pin Description................................................................................................................................................................................3
Description of Operation.................................................................................................................................................................4
Timing chart....................................................................................................................................................................................5
Absolute Maximum Ratings ............................................................................................................................................................6
Thermal Resistance(Note 6) ...............................................................................................................................................................7
Insulation Related Characteristics ..................................................................................................................................................7
Physical Dimension, Tape and Reel Information...........................................................................................................................19
Revision History............................................................................................................................................................................20
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BM67421FV-C
Recommended Range of External Constants
Recommended Value
Pin Name
Symbol
Unit
Min
Typ
1.0
1.0
Max
VCC1
VCC2
CVCC1
CVCC2
0.1(Note 3)
0.1(Note 3)
-
-
µF
µF
(Note 3) The temperature characteristic capacitance of the capacitor, DC bias characteristics, please be set so that it does not
fall below the minimum value in consideration of the like.
Pin Configurations
(TOP VIEW)
GND1
VCC1
10
9
1
2
3
4
5
GND2
VCC2
IN2
8
OUT2
IN1
OUT1
GND2
7
GND1
6
Pin Description
Pin
Name
Pin
Name
No.
Function
Ground 1
No.
10
9
Function
1
2
3
4
5
GND1
VCC1
OUT2
IN1
GND2 Ground 2
Power supply 1
Output2
VCC2
IN2
Power supply 2
8
Input2
Input 1
7
OUT1
Output 1
GND1
Ground
6
GND2 Ground 2
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BM67421FV-C
Description of Operation
1) Input/Output logic
The input/output logic levels for the BM67421FV-C are as shown in the table below:
No.
1
2
3
4
5
6
7
VCC1
UVLO
UVLO
X
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VCC2
UVLO
X
UVLO
ACTIVE
ACTIVE
ACTIVE
ACTIVE
IN1
X
X
X
L
L
H
H
IN2
X
X
X
L
H
L
H
OUT1
OUT2
H
H
H
L
L
H
H
H
H
H
L
H
L
H
Since pull up/pull down resistor has not been connected to IN1 and IN2 pins, it is necessary to connect external resistor
to IN1 and IN2 pins depending on the application.
2)Output pin voltage
Logic levels for OUT1 and OUT2 pins are indicated in the truth table. However, it may be assumed that such logic
levels disable the output circuit to fully turn ON at a low voltage when turning ON or OFF the power supply, thus putting
the output pin into the high impedance state.
3) Power supply monitoring function
This IC has a built-in power supply monitoring function which monitors VCC2 (VCC1) from VCC1 (VCC2). It is
assumed that an abnormal state occurs when VCC2 (VCC1) is controlled by the UVLO function for the period of time
longer than the power supply monitoring time (40µsec (Typ)), and then OUT2 (OUT1) becomes”H”. While power ON,
after the control of the UVLO function is reset as well as VCC1 and VCC2 and the power monitoring time (40µsec
(Typ)) has passed, the logic of IN1 and IN2 is reflected to both OUT1 and OUT2. Until the logic of IN1 and IN2 is
reflected to OUT1 and OUT2, they remain “H”.
4) Under Voltage Lock Out (UVLO) function masking time
This IC provides masking time for the UVLO function to prevent the function from malfunctioning with noises. The
masking time is set to 2.5µsec (Typ). The masking time is applied when the UVLO function is ON. It is not applied when
the UVLO function is OFF.
5) Under Voltage Lock Out (UVLO) function
This IC has a built-in UVLO function to prevent the IC from malfunctioning whenever the power supply voltage drops. It
triggers the UVLO state when VCC1 pin and VCC2 pin are changed to 4.0V (Typ) or less and becomes in operational
state when changed to 4.2V (Typ) or more.
・When VCC2 is 4.2V (Typ) or more and VCC1 pin voltage drops below 4.0V (Typ),the output logic of OUT2 pin
becomes “H” and the output logic of OUT1 pin becomes “H” after the power supply monitoring time has passed.
・When VCC1 is 4.2V (Typ) or more and VCC2 pin voltage drops below 4.0V (Typ), the output logic of OUT1 pin
becomes “H” and the output logic of OUT2 pin becomes “H” after the power supply monitoring time has passed.
・When VCC1 pin voltage is 4.2V (Typ) or more and VCC2 pin voltage changes from 4.0V (Typ) or less to 4.2V (Typ)
or more, the output logic of OUT2 pin changes according to the input logic of input IN2 pin, and the output logic of
OUT1 pin changes according to the input logic of input IN1 pin.
・When VCC2 pin voltage is 4.2V (Typ) or more and VCC2 pin voltage changes from 4.0V (Typ) or less to 4.2V (Typ)
or more, the output logic of OUT1 pin changes according to the input logic of input IN1, and the output logic of OUT2
pin changes according to the input logic of input IN2 pin.
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Timing Chart
UVLO OFF
UVLO
VCC1
UVLO OFF
UVLO
VCC2
OUT1
Power supply
monitoring
time (typ10μs)
Power supply
monitoring
time (typ30μs)
IN1
IN2
mask time
(typ2.5μs)
OUT2
Figure 1. VCC1→VCC2 at Start, VCC1→VCC2 at Stop
UVLO OFF
UVLO
VCC1
UVLO OFF
UVLO
VCC2
OUT1
Power supply
monitoring
time (typ10μs)
mask time
(typ2.5μs)
Power supply
monitoring
time (typ30μs)
I
IN1
IN2
OUT2
Figure 2. VCC1→VCC2 at Start, VCC2→VCC1 at Stop
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Timing chart
UVLO OFF
UVLO
VCC1
UVLO OFF
UVLO
VCC2
OUT1
Power supply
monitoring
time (typ10μs)
Power supply
monitoring
time (typ30μs)
IN1
IN2
mask time
(typ2.5μs)
OUT2
Figure 3. VCC2→VCC1 at Start, VCC1→VCC2 at Stop
UVLO OFF
UVLO
VCC1
UVLO OFF
UVLO
VCC2
OUT1
Power supply
monitoring
time (typ10μs)
mask time
(typ2.5μs)
IN1
IN2
Power supply
monitoring
time (typ30μs)
OUT2
Figure 4. VCC2→VCC1 at Start, VCC2→VCC1 at Stop
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Absolute Maximum Ratings
Parameter
Symbol
VCC1
VCC2
VIN1
Rating
7.0(Note 4)
Unit
V
Power Supply Voltage 1
Power Supply Voltage2
IN1 Pin Voltage
7.0(Note 5)
V
-0.3 ~ 7.0(Note 4)
-0.3 ~ 7.0(Note 5)
-0.3 ~ 7.0(Note 5)
-0.3 ~ 7.0(Note 4)
±10(Note 6)
V
IN2 Pin Voltage
VIN2
V
OUT1 Pin Voltage
VOUT1
VOUT2
IOMAX
TOPR
TSTG
V
OUT2 Pin Voltage
V
Output Current
mA
°C
°C
°C
Operating Temperature Range
Storage Temperature Range
-40 ~ 125
-55 ~ 150
Maximum Junction
Temperature
Tjmax
150
(Note 4) Reference to GND1
(Note 5) Reference to GND2
(Note 6) Should not exceed Pd and ASO.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance (Note 7)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 8)
180.2
82
2s2p(Note9)
108.9
60
Junction to Ambient
θJA
°C/W
°C/W
Junction to Top Characterization Parameter(Note 10)
ΨJT
(Note 7)Based on JESD51-2A (Still-Air)
(Note 8)Using a PCB board based on JESD51-3.
(Note 9)Using a PCB board based on JESD51-7.
(Note 10)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
Recommended Operating Ratings
Parameter
Power supply Voltage 1
Power supply Voltage 2
Symbol
Rating
4.5 ~ 5.5
4.5 ~ 5.5
Unit
V
(Note 11)
VCC1
VCC2
(Note 12)
V
(Note 11) Reference to GND1
(Note 12) Reference to GND2
Insulation Related Characteristics
Parameter
Symbol
Characteristic
>109
Unit
Insulation Resistance
(VIO=500V)
RS
Ω
Insulation Withstand Voltage
(1min.)
VISO
VISO
2500
3000
Vrms
Vrms
Insulation Test Voltage (1s)
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Electrical Characteristics
(All values at Ta=-40°C to 125°C and VCC1=VCC2=4.5V to 5.5V, unless otherwise specified)
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
<Whole>
VCC1 Power Supply Current,
DC
ICC1Q
ICC2Q
ICC500k1
ICC500k2
-
-
-
-
0.35
0.35
0.6
0.80
0.80
1.8
mA
mA
mA
mA
VIN = 0 or VCC
VCC2 Power Supply Current,
DC
VIN = 0 or VCC
fIN : 250kHz
fIN : 250kHz
VCC1 Power Supply Current,
500kbps
VCC2 Power Supply Current,
500kbps
0.6
1.8
<Output pin: OUT1, OUT2>
High-level Output Voltage
Low-level Output Voltage
<Input pin: IN1, IN2>
VOH
VOL
VCC-0.4
0
VCC-0.2
0.2
Vcc
0.4
V
V
IO=-4mA
IO=4mA
Input Current
IIN
-
VCC×0.7
0
0
-
10
VCC
µA
V
VIN=VCC
High-level Input Threshold
Low-level Input Threshold
<Switching Characteristics>
VINH
VINL
-
VCC×0.3
V
Propagation Delay
(Low to High)
tPLH
tPHL
|tPLH
-
-
25
25
0
40
40
ns
ns
Propagation Delay
(High to Low)
-
Propagation Distortion
Maximum data rate
Rise Time
-
10
-
ns
tPHL
|
fIN
10
-
-
Mbps
ns
tr
tf
2.5
2.5
35
-
-
-
Fall Time
-
ns
Common-Mode Transient
Immunity
CMAC
25
kV/µs
Input/Output Timing
50%
50%
IN1, IN2
TPHL
TPLH
50%
90%
90%
50%
OUT1, OUT2
10%
10%
tr
tf
Figure 5. Input/Output Timing Chart
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Typical Performance Curve (Reference Data)
0.8
0.7
0.6
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.5
125°C
125°C
-40°C
0.4
0.3
25°C
25°C
-40°C
0.2
0.1
0.0
4.50
4.75
5.00
5.25
5.50
4.50
4.75
5.00
5.25
5.50
SupplyVoltage : Vcc [V]
SupplyVoltage : Vcc [V]
Figure 6. Circuit Current vs Supply Voltage
(VCC1 Power Supply Current, DC
IN1=GND1, IN2=GND2)
Figure 7. Circuit Current vs Supply Voltage
(VCC1 Power Supply Current, DC
IN1=VCC1, IN2=VCC2)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
125°C
125°C
25°C
-40°C
25°C
-40°C
4.50
4.75
5.00
5.25
5.50
4.50
4.75
5.00
5.25
5.50
Supply Voltage : Vcc [V]
SupplyVoltage : Vcc [V]
Figure 8. Circuit Current vs Supply Voltage
(VCC2 Power Supply Current, DC
IN1=GND1, IN2=GND2)
Figure 9. Circuit Current vs Supply Voltage
(VCC2 Power Supply Current, DC
IN1=VCC1, IN2=VCC2)
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Typical Performance Curve (Reference Data)
2.0
1.5
2.0
1.5
1.0
0.5
0.0
1.0
125°C
125°C
-40°C
0.5
25°C
25°C
-40°C
0.0
0.0
0.2
0.4
0.6
0.8
1.0
0.0
0.2
0.4
0.6
0.8
1.0
Input Frequency : [Mbps]
Input Frequency : [Mbps]
Figure 10. Circuit Current vs Supply Voltage
Figure 11. Circuit Current vs Supply Voltage
(VCC1 Power Supply Current, VCC1,VCC2＝4.5V)
(VCC1 Power Supply Current, VCC1,VCC2＝5.0V)
2.0
2.0
1.5
1.0
0.5
0.0
1.5
1.0
0.5
0.0
125°C
125°C
25°C
25°C
-40°C
-40°C
0.0
0.2
0.4
0.6
0.8
1.0
0.0
0.2
0.4
0.6
0.8
1.0
Input Frequency :[Mbps]
Input Frequency : [Mbps]
Figure 12. Circuit Current vs Supply Voltage
(VCC1 Power Supply Current, VCC1,VCC2＝5.5V)
Figure 13. Circuit Current vs Supply Voltage
(VCC2 Power Supply Current, VCC1,VCC2＝4.5V)
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Typical Performance Curve (Reference Data))
2.0
1.5
2.0
1.5
1.0
0.5
0.0
1.0
125°C
-40°C
125°C
0.5
25°C
25°C
-40°C
0.0
0.0
0.2
0.4
0.6
0.8
1.0
0.0
0.2
0.4
0.6
0.8
1.0
Input Frequency : [Mbps]
Input Frequency : [Mbps]
Figure 14. Circuit Current vs Supply Voltage
Figure 15. Circuit Current vs Supply Voltage
(VCC2 Power Supply Current, VCC1,VCC2＝5.0V)
(VCC2 Power Supply Current, VCC1,VCC2＝5.5V)
4.5
5.0
4.8
4.6
4.4
4.2
4.0
4.3
4.1
3.9
3.7
3.5
-40°C
-40°C
25°C
25°C
125°C
125°C
0
2
4
6
8
10
0
2
4
6
8
10
Output Current : lO [mA]
Output Current : lO [mA]
Figure 16. Output Voltage vs Output Current
(High-level Output Voltage, VCC1,VCC2＝4.5V)
Figure 17. Output Voltage vs Output Current
(High-level Output Voltage, VCC1,VCC2＝5.0V)
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Typical Performance Curve (Reference Data)
5.5
5.3
1.0
0.8
0.6
0.4
0.2
0.0
-40°C
5.1
25°C
125°C
125°C
4.9
4.7
4.5
25°C
-40°C
0
2
4
6
8
10
0
2
4
6
8
10
Output Current : lO [mA]
Output Current : lO [mA]
Figure 18. Output Voltage vs Output Current
(High-level Output Voltage, VCC1,VCC2＝5.5V)
Figure 19. Output Voltage vs Output Current
(Low-level Output Voltage, VCC1,VCC2＝4.5V)
1.0
1.0
0.8
0.6
0.4
0.2
0.0
0.8
0.6
0.4
0.2
0.0
125°C
125°C
25°C
25°C
-40°C
-40°C
0
2
4
6
8
10
0
2
4
6
8
10
Output Current : lO [mA]
Output Current : lO [mA]
Figure 20. Output Voltage vs Output Current
(Low-level Output Voltage, VCC1,VCC2＝5.0V)
Figure 21. Output Voltage vs Output Current
(Low-level Output Voltage, VCC1,VCC2＝5.5V)
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BM67421FV-C
Typical Performance Curve (Reference Data)
10
8
125°C
25°C
-40°C
5.5
4.5
3.5
2.5
1.5
0.5
-0.5
125°C -40°C 25°C
6
4
125°C
25°C
-40°C
2
0
-2
0
1
2
3
4
5
0
1
2
3
4
5
Input Voltage : VIN [V]
Input Voltage : VIN [V]
Figure 22. Input Current vs Input Voltage
(Input Current at Input Pin)
Figure 23. Output voltage vs Input Voltage
(High-/Low-level Input Threshold, VCC1,VCC2＝4.5V)
125°C 25°C -40°C
5.5
5.5
125°C 25°C -40°C
125°C
25°C
-40°C
125°C
25°C
-40°C
4.5
4.5
3.5
2.5
1.5
0.5
-0.5
3.5
2.5
1.5
0.5
-0.5
0
1
2
3
4
5
0
1
2
3
4
5
Input Voltage : VIN[V]
Input Voltage : VIN [V]
Figure 24. Output voltage vs Input Voltage
(High-/Low-level Input Threshold, VCC1,VCC2＝5.0V)
Figure 25. Output voltage vs Input Voltage
(High-/Low-level Input Threshold, VCC1,VCC2＝5.5V)
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BM67421FV-C
Typical Performance Curve (Reference Data)
40
35
40
35
30
25
20
30
TPLH
TPLH
TPHL
25
TPHL
20
-50 -25
0
25
50 75 100 125 150
-50 -25
0
25
50 75 100 125 150
Temperature : [℃]
Temperature : [℃]
Figure 26. Propagation Delay vs Temperature
(VCC1, VCC2 = 4.5V)
Figure 27. Propagation Delay vs Temperature
(VCC1, VCC2 = 5.0V)
40
35
30
25
20
TPLH
TPHL
-50 -25
0
25 50 75 100 125 150
Temperature : [℃]
Figure 28. Propagation Delay vs Temperature
(VCC1, VCC2 = 5.5V)
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I/O Equivalent Circuit
VCC1
VCC2
VCC1
VCC2
OUT2
OUT1
IN1
IN2
GND1
GND2
GND1
GND2
Figure 29. IN1, IN2
Figure 30. OUT1, OUT2
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BM67421FV-C
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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2016.09.21 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
16/20
TSZ22111・15・001
BM67421FV-C
Operational Notes
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 31. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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TSZ02201-0818ABG00010-1-2
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© 2016 ROHM Co., Ltd. All rights reserved.
17/20
TSZ22111・15・001
BM67421FV-C
Ordering Information
B M 6
7
4
2
1
F
V -
CE 2
Package
FV : SSOP-B10W
Packaging and forming specification
E2: Embossed tape and reel
Part Number
Marking Diagram
SSOP-B10W(TOP VIEW)
B M 6 7 4 2 1
1PIN MARK
Part Number Marking
LOT Number
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TSZ02201-0818ABG00010-1-2
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18/20
TSZ22111・15・001
BM67421FV-C
Physical Dimension, Tape and Reel Information
Package Name
SSOP-B10W
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-0818ABG00010-1-2
2016.09.21 Rev.001
19/20
BM67421FV-C
Revision History
Date
Revision
Changes
21.Sep.2016
001
New Release
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TSZ02201-0818ABG00010-1-2
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20/20
TSZ22111・15・001
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
BM67421FV-C - Web Page
Part Number
Package
Unit Quantity
BM67421FV-C
SSOP-B10W
1500
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
1500
Taping
inquiry
Yes
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