BR24T01F-WGTR [ROHM]
High Reliability Serial EEPROMs;
| 型号： | BR24T01F-WGTR |
| 厂家： | 
ROHM |
| 描述： | High Reliability Serial EEPROMs 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
| 文件： | 总24页 (文件大小：593K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Reliability Serial EEPROMs
I2C BUS
BR24□□□□family
BR24T□□□□Series
No.11001EAT21
●Description
BR24T□□□-W series is a serial EEPROM of I2C BUS interface method
●Features
1) Completely conforming to the world standard I2C BUS.
All controls available by 2 ports of serial clock (SCL) and serial data(SDA)
2) Other devices than EEPROM can be connected to the same port, saving microcontroller port
3) 1.7V～5.5V single power source action most suitable for battery use
4) 1.7V～5.5Vwide limit of action voltage, possible FAST MODE 400KHz action
5) Page write mode useful for initial value write at factory shipment
6) Auto erase and auto end function at data write
7) Low current consumption
8) Write mistake prevention function
Write (write protect) function added
Write mistake prevention function at low voltage
9) DIP-T8/SOP8/SOP-J8/SSOP-B8/TSSOP-B8/TSSOP-B8J/MSOP8/VSON008X2030 various packages
10) Data rewrite up to 1,000,000 times
11) Data kept for 40 years
12) Noise filter built in SCL / SDA terminal
13) Shipment data all address FFh
●BR24T series
Power source
VSON008
Capacity Bit format
Type
DIP-T8
SOP8
SOP-J8 SSOP-B8 TSSOP-B8 TSSOP-B8J MSOP8
Voltage
X2030
1Kbit
2Kbit
128×8
256×8
512×8
1K×8
2K×8
4K×8
8K×8
BR24T01-W 1.7～5.5V
BR24T02-W 1.7～5.5V
BR24T04-W 1.7～5.5V
BR24T08-W 1.7～5.5V
BR24T16-W 1.7～5.5V
BR24T32-W 1.7～5.5V
BR24T64-W 1.7～5.5V
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4Kbit
8Kbit
16Kbit
32Kbit
64Kbit
128Kbit 16K×8 BR24T128-W 1.7～5.5V
256Kbit 32K×8 BR24T256-W 1.7～5.5V
512Kbit 64K×8 BR24T512-W 1.7～5.5V
1024Kbit 128K×8 BR24T1M-W 1.7～5.5V
☆:Developing
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
1/21
Technical Note
BR24T□□□□Series
●Absolute maximum ratings (Ta=25℃)
●Memory cell characteristics (Ta=25℃, Vcc=1.7～
5.5V)
Limits
Typ.
Parameter
Symbol
VCC
Ratings
Unit
V
Parameter
Unit
Min.
Max
Impressed voltage
-0.3～+6.5
450 (SOP8)*1
Number of data
rewrite times *1
1,000,000 －
－
Times
450 (SOP-J8)*2
Data hold years *1
40
－
－
Years
300 (SSOP-B8)*3
330 (TSSOP-B8)*4
310 (TSSOP-B8J)*5
310 (MSOP8) *6
300 (VSON008X2030)*7
800 (DIP-T8)*8
*1Not 100% TESTED
Permissible
dissipation
Pd
mW
●Recommended operating conditions
Storage
temperature range
Action
temperature range
Parameter
Symbol
Vcc
Ratings
Unit
V
Tstg
Topr
‐
－65～+150
－40～+85
-0.3～Vcc+1.0*9
150
℃
℃
V
Power source
voltage
1.7～5.5
0～Vcc
Terminal voltage
Junction
Input voltage
VIN
Tjmax
℃
temperature *10
*1,*2 When using at Ta=25℃ or higher 4.5mW to be reduced per 1℃.
*3,*7 When using at Ta=25℃ or higher 3.0mW to be reduced per 1℃.
*4
When using at Ta=25℃ or higher 3.3mW to be reduced per 1℃.
*5, *6 When using at Ta=25℃ or higher 3.1mW to be reduced per 1℃.
*8
*9
When using at Ta=25℃ or higher 8.1mW to be reduced per 1℃.
The Max value of Terminal Voltage is not over 6.5V.
When the pulse width is 50ns or less, the Min value of
Terminal Voltage is not under -1.0V. (BR24T16/32/64/128/256/512/1M-W)
the Min value of Terminal Voltage is not under -0.8V. (BR24T01/02/04/08-W)
*10 Junction temperature at the storage condition.
●Electrical characteristics
(Unless otherwise specified, Ta=－40～+85℃, VCC=1.7～5.5V)
Limits
Parameter
Symbol
Unit
Conditions
Min.
0.7Vcc
-0.3*2
－
Typ.
－
Max.
Vcc+1.0
0.3Vcc
0.4
“H” input voltage 1
“L” input voltage 1
“L” output voltage 1
“L” output voltage 2
Input leak current
Output leak current
VIH1
VIL1
VOL1
VOL2
ILI
V
V
－
－
V
IOL=3.0mA, 2.5V≦Vcc≦5.5V (SDA)
IOL=0.7mA, 1.7V≦Vcc＜2.5V (SDA)
VIN=0～Vcc
－
－
0.2
V
－1
－
1
µA
µA
ILO
－1
－
1
VOUT=0～Vcc (SDA)
Vcc=5.5V,fSCL=400kHz, tWR=5ms,
Byte write, Page write
BR24T01/02/04/08/16/32/64-W
Vcc=5.5V,fSCL=400kHz, tWR=5ms,
Byte write, Page write
BR24T128/256-W
Vcc=5.5V,fSCL=400kHz, tWR=5ms,
Byte write, Page write
BR24T512/1M-W
Vcc=5.5V,fSCL=400kHz
Random read, current read, sequential read
BR24T01/02/04/08/16/32/64/128/256-W
Vcc=5.5V,fSCL=400kHz
Random read, current read, sequential read
BR24T512/1M-W
Vcc=5.5V, SDA・SCL=Vcc
A0,A1,A2=GND,WP=GND
BR24T01/02/04/08/16/32/64/128/256-W
Vcc=5.5V, SDA・SCL=Vcc
A0, A1, A2=GND, WP=GND
BR24T512/1M-W
－
－
－
－
－
－
－
－
－
－
－
－
－
－
2.0
2.5
4.5
0.5
2.0
2.0
3.0
ICC1
mA
Current consumption
at action
mA
µA
ICC2
Standby current
ISB
○
Radiation resistance design is not made.
*1 BR24T512/1M-W is a target value because it is developing.
*2 When the pulse width is 50ns or less, it is -1.0V. (BR24T16/32/64/128/256/512/1M-W)
When the pulse width is 50ns or less, it is -0.8V. (BR24T01/02/04/08-W)
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
2/21
Technical Note
BR24T□□□□Series
●Action timing characteristics (Unless otherwise specified, Ta=－40～+85℃, VCC=1.7～5.5V)
Limits
Parameter
Symbol
Unit
Min.
－
Typ.
－
－
－
－
－
－
－
－
－
－
－
－
－
－
－
－
－
－
Max.
400
－
SCL frequency
fSCL
tHIGH
tLOW
tR
kHz
µs
µs
µs
µs
µs
µs
ns
ns
µs
µs
µs
µs
ms
µs
µs
µs
µs
Data clock “HIGH“ time
Data clock “LOW“ time
SDA, SCL rise time *1
SDA, SCL fall time *1
0.6
1.2
－
－
1.0
1.0
－
tF
－
Start condition hold time
Start condition setup time
Input data hold time
tHD:STA
tSU:STA
tHD:DAT
tSU:DAT
tPD
0.6
0.6
0
－
－
Input data setup time
100
0.1
0.1
0.6
1.2
－
－
Output data delay time
Output data hold time
Stop condition setup time
Bus release time before transfer start
Internal write cycle time
Noise removal valid period (SDA, SCL terminal)
WP hold time
0.9
－
tDH
tSU:STO
tBUF
－
－
tWR
5
tI
－
0.1
－
tHD:WP
tSU:WP
tHIGH:WP
1.0
0.1
1.0
WP setup time
－
WP valid time
－
*1 Not 100% TESTED.
Condition Input data level:VIL=0.2×Vcc VIH=0.8×Vcc
Input data timing refarence level: 0.3×Vcc/0.7×Vcc
Output data timing refarence level: 0.3×Vcc/0.7×Vcc
Rise/Fall time : ≦20ns
●Sync data input / output timing
tR
tF
tHIGH
70%
70%
30%
70%
SCL
70% 70%
30%
30%
30%
tLOW
tHD:DAT
DATA(n)
DATA(1)
D0 ACK
tSU:DAT
70%
70%
70%
70%
ACK
D1
70%
30%
tWR
SDA
(input)
tPD
tDH
tBUF
30%
30%
70%
30%
70%
30%
SDA
(output)
tSU:WP
tHD:WP
STOP CONDITION
○Input read at the rise edge of SCL
○Data output in sync with the fall of SCL
Fig.1-(a) Sync data input / output timing
Fig.1-(d) WP timing at write execution
70%
DATA(n)
DATA(1)
D0
70%
70%
70%
D1
ACK
ACK
tSU:STA
tHD:STA
tSU:STO
tWR
tHIGH:WP
70%
70%
30%
30%
70%
STOP CONDITION
START CONDITION
Fig.1-(b) Start-stop bit timing
Fig.1-(e) WP timing at write cancel
70%
70%
ACK
D0
write data
(n-th address)
tWR
STOP CONDITION START CONDITION
Fig.1-(c) Write cycle timing
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
3/21
Technical Note
BR24T□□□□Series
●Block diagram
*2A0
1
8
Vcc
1Kbit～1024Kbit EEPROM array
Vcc
8
1
2
3
A0
A1
BR24T01-W
BR24T02-W
BR24T04-W
BR24T08-W
BR24T16-W
BR24T32-W
BR24T64-W
BR24T128-W
BR24T256-W
BR24T512-W
BR24T1M-W
*1
8bit
WP
7
6
*17bit
13bit
8bit 14bit
9bit 15bit
10bit 16bit
11bit 17bit
12bit
Address
decoder
Word
Data
*2A1
*2 A2
GND
2
3
4
7
6
5
WP
address register
register
SCL
A2
START
STOP
SCL
SDA
Control circuit
4
5
SDA
GND
ACK
High voltage
generating circuit
Power source
voltage detection
*1
7bit: BR24T01-W
8bit: BR24T02-W
9bit: BR24T04-W
10bit: BR24T08-W
11bit: BR24T16-W
12bit: BR24T32-W
13bit: BR24T64-W
14bit: BR24T128-W
15bit: BR24T256-W
16bit: BR24T512-W
17bit: BR24T1M-W
*2 A0= Don't use : BR24T04-W, BR24T1M-W
A0, A1=Don't use: BR24T08-W
A0, A1, A2=Don't use: BR24T16-W
Fig.2 Block diagram
●Pin assignment and description
Terminal Input/
BR24T32/64/
BR24T01-W
BR24T02-W
BR24T04-W
BR24T08-W
BR24T16-W
BR24T1M-W
Name
Output
128/256/512-W
Slave address
setting
Slave address setting
Don’t use*
Don’t use*
A0
Input
Slave address setting
Slave address setting
Don’t use*
Don’t use*
Slave address setting
Slave address setting
A1
A2
Input
Input
－
Reference voltage of all input / output, 0V
Serial data input serial data output
GND
Input/
output
SDA
Serial clock input
Write protect terminal
Connect the power source.
SCL
WP
Vcc
Input
Input
－
*Pins not used as device address may be set to any of ‘H’, 'L', and 'Hi-Z'.
●Characteristic data (The following values are Typ. ones.)
1
0.8
0.6
0.4
0.2
0
6
6
Ta=-40℃
Ta=25℃
Ta=85℃
5
4
3
2
1
0
Ta=-40℃
Ta=25℃
Ta=85℃
5
4
3
2
1
0
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC
SPEC
SPEC
4
0
1
2
3
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
L OUTPUT CURRENT : IOL(mA)
Fig.4ꢀ'L' input voltage VIL1
Fig.5 'L' output voltage VOL1-IOL(Vcc=1.7V)
Fig.3ꢀ'H' input voltage VIH1
(A0,A1,A2,SCL,SDA,WP)
(A0,A1,A2,SCL,SDA,WP)
1.2
1
0.8
0.6
0.4
0.2
0
1.2
1
SPEC
SPEC
1
0.8
0.6
0.4
0.2
0
Ta=-40℃
Ta=25℃
Ta=85℃
0.8
0.6
0.4
0.2
0
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
SUPPLY VOLTAGE : Vcc(V)
5
6
SUPPLYVOLTAGE : Vcc(V)
L OUTPUT CURRENT : IOL(mA)
Fig.6ꢀ'L' output voltage VOL2-IOL(Vcc=2.5V)
Fig.7ꢀInput leak current ILI
Fig.8ꢀOutput leak current ILO(SDA)
(A0,A1,A2,SCL,WP)
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
4/21
Technical Note
BR24T□□□□Series
●Characteristic data (The following values are Typ. ones.)
3.5
2.5
6
5
4
3
2
1
0
3
2.5
2
SPEC
2
1.5
1
SPEC
The plan for
inserting data.
(BR24T512/1M-W)
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
1.5
1
0.5
0
0.5
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.9 Current consumption at WRITE operation ICC
1
Fig.10ꢀCurrent consumption at WRITE operation Icc1
Fig.11ꢀCurrent consumption at WRITE operation Icc1
(fscl=400kHz BR24T01/02/04/08/16/32/64-W)
(fscl=400kHz BR24T128/256-W)
(fscl=400kHz BR24T512/1M-W)
0.6
2.5
0.6
SPEC
SPEC
0.5
0.5
2
The plan for
0.4
0.4
inserting data.
(BR24T512/1M-W)
Ta=-40℃
Ta=25℃
Ta=85℃
1.5
Ta=-40℃
0.3
0.2
0.1
0
0.3
Ta=25℃
1
Ta=85℃
0.2
0.1
0
0.5
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.14ꢀStanby operation ISB
SUPPLY VOLTAGE : Vcc(V)
Fig.12 Current consumption at READ operation ICC
SUPPLY VOLTAGE : Vcc(V)
Fig.13 Current consumption at READ operation ICC
2
2
(fscl=400kHz BR24T01/02/04/08/16/32/64/128/256-W)
(fscl=400kHz BR24T512/1M-W)
(fscl=400kHz BR24T01/02/04/08/16/32/64/128/256-W)
1
2.5
10000
0.8
2
1000
100
10
The plan for
inserting data.
(BR24T512/1M-W)
SPEC
SPEC
0.6
1.5
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
0.4
1
0.2
0
0.5
0
1
0.1
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.15ꢀStanby operation ISB
Fig.16ꢀSCL frequency fSCL
Fig.17 Data clock High Period tHIGH
(fscl=400kHz BR24T512/1M-W)
1.1
0.9
1
1.5
1.2
0.9
0.6
0.3
0
SPEC
0.8
0.6
0.4
0.2
0
SPEC
0.7
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
0.5
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
0.3
0.1
-0.1
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc（V）
SUPPLY VOLTAGE : Vcc(V)
Fig.19 Start Condition Hold Time tHD : STA
Fig.18 Data clock Low PeriodꢀtLOW
Fig.20ꢀStart Condition Setup TimeꢀtSU : STA
300
200
50
50
0
SPEC
SPEC
0
-50
SPEC
100
-50
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
-100
-150
-200
0
Ta=-40℃
Ta=25℃
Ta=85℃
-100
-150
-200
-100
-200
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.21ꢀInput Data Hold Time tHD : DAT（HIGH）
Fig.22 Input Data Hold Time
ꢀ
ｔ
HD : DAT(LOW）
Fig.23ꢀInput Data Setup Time ｔSU: DAT(HIGH)
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
5/21
Technical Note
BR24T□□□□Series
●Characteristic data (The following values are Typ. ones.)
300
200
100
0
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC
SPEC
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
-100
-200
SPEC
SPEC
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.24ꢀInput Data setup time tSU : DAT(LOW)
2.0
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.25ꢀ'L' Data output delay time tPD0
Fig.26 'H' Data output delay time ｔPD1
2
6
5
4
3
2
1
0
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
1.5
1.0
1.5
1
SPEC
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
0.5
Ta=-40℃
Ta=25℃
Ta=85℃
0.5
0
0.0
-0.5
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.28 BUS open time before transmissionꢀｔBUF
SUPPLY VOLTAGE : Vcc(V)
Fig.29 Internal writing cycle timeꢀｔWR
SUPPLY VOLTAGE : Vcc(V)
Fig.27 Stop condition setup time
ꢀｔSU:STO
0.6
0.6
0.6
0.5
0.4
0.3
0.2
0.1
0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
0.5
0.4
0.3
0.2
0.1
0
Ta=-40℃
Ta=25℃
Ta=85℃
0.5
0.4
0.3
0.2
0.1
0
SPEC
SPEC
3
SPEC
0
1
2
3
4
5
6
0
1
2
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.31ꢀNoise reduction efective timeꢀtl（SCL L）
SUPPLY VOLATGE : Vcc(V)
Fig.32ꢀNoise resuction efecctive timeꢀｔｌ（SDA H）
Fig.30 Noise reduction efection time tl（SCL H）
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.6
0.2
SPEC
Ta=-40℃
Ta=25℃
0.1
0.5
SPEC
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=85℃
0.4
Ta=-40℃
Ta=25℃
Ta=85℃
0.3
0.2
SPEC
0.1
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLYVOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.33 Noise reduction efective time tl（SDA L）
Fig.35 WP setup time tSU : WP
Fig.34 WP data hold time tHD:WP
1.2
SPEC
1.0
0.8
Ta=-40℃
Ta=25℃
Ta=85℃
0.6
0.4
0.2
0.0
0
1
2
3
4
5
6
SUPPLYVOLTAGE : Vcc(V)
Fig.36 WP efective time tHIGH : WP
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Technical Note
BR24T□□□□Series
●I2C BUS communication
○I2C BUS data communication
I2C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long,
and acknowledge is always required after each byte. I2C BUS carries out data transmission with plural devices connected
by 2 communication lines of serial data (SDA) and serial clock (SCL).
Among devices, there are “master” that generates clock and control communication start and end, and “slave” that is
controlled by address peculiar to devices. EEPROM becomes “slave”. And the device that outputs data to bus during
data communication is called “transmitter”, and the device that receives data is called “receiver”.
SDA
1-7
1-7
1-7
8
9
8
9
8
9
SCL
S
P
START ADDRESS R/W
condition
ACK
DATA
ACK
DATA
ACK
STOP
condition
Fig.37 Data transfer timing
○Start condition (Start bit recognition)
・Before executing each command, start condition (start bit) where SDA goes from 'HIGH' down to 'LOW' when SCL is
'HIGH' is necessary.
・This IC always detects whether SDA and SCL are in start condition (start bit) or not, therefore, unless this confdition is
satisfied, any command is executed.
○Stop condition (stop bit recongnition)
・Each command can be ended by SDA rising from 'LOW' to 'HIGH' when stop condition (stop bit), namely, SCL is 'HIGH'
○Acknowledge (ACK) signal
・This acknowledge (ACK) signal is a software rule to show whether data transfer has been made normally or not. In
master and slave, the device (µ-COM at slave address input of write command, read command, and this IC at data
output of read command) at the transmitter (sending) side releases the bus after output of 8bit data.
・The device (this IC at slave address input of write command, read command, and µ-COM at data output of read
command) at the receiver (receiving) side sets SDA 'LOW' during 9 clock cycles, and outputs acknowledge signal (ACK
signal) showing that it has received the 8bit data.
・This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ACK signal) 'LOW'.
・Each write action outputs acknowledge signal (ACK signal) 'LOW', at receiving 8bit data (word address and write data).
・Each read action outputs 8bit data (read data), and detects acknowledge signal (ACK signal) 'LOW'. When
acknowledge signal (ACK signal) is detected, and stop condition is not sent from the master (µ-COM) side, this IC
continues data output. When acknowledge signal (ACK signal) is not detected, this IC stops data transfer, and
recognizes stop cindition (stop bit), and ends read action. And this IC gets in status.
○Device addressing
・Output slave address after start condition from master.
・The significant 4 bits of slave address are used for recognizing a device type.
The device code of this IC is fixed to '1010'.
・Next slave addresses (A2 A1 A0 --- device address) are for selecting devices, and plural ones can be used on a same
bus according to the number of device addresses.
・The most insignificant bit (R/W --- READ / WRITE ) of slave address is used for designating write or read action,
and is as shown below.
Setting R/ W to 0 ------- write (setting 0 to word address setting of random read)
Setting R/ W to 1 ------- read
Maximum number of
Connected buses
Type
Slave address
BR24T01-W,BR24T02-W
BR24T04-W
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
A2 A1 A0 R/―W―
8
A2 A1 P0 R/―W―
A2 P1 P0 R/―W―
P2 P1 P0 R/―W―
4
2
1
BR24T08-W
BR24T16-W
BR24T32-W,BR24T64-W,BR24T128-W,
BR24T256-W,BR24T512-W
1
1
0
0
1
1
0
0
A2 A1 A0 R/―W―
A2 A1 P0 R/―W―
8
4
BR24T1M-W
P0～P2 are page select bits.
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Technical Note
BR24T□□□□Series
●Write Command
○Write cycle
・Arbitrary data is written to EEPROM. When to write only 1 byte, byte write is normally used, and when to write
continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. The maximum number of write
bytes is specified per device of each capacity. Up to 256 arbitrary bytes can be written.(In the case of BR24T1M-W)
S
T
A
R
T
W
R
I
T
E
S
T
O
SLAVE
ADDRESS
WORD
ADDRESS
DATA
P
As for WA7, BR24T01-W becomes Don't care.
SDA
LINE
WA
7
WA
0
1
0
1
0 A2A1A0
Note)
D7
D0
A
C
K
A
C
K
R
/
W
A
C
K
Fig.38 Byte write cycle (BR24T01/02/04/08/16-W)
S
T
A
R
T
W
R
I
T
E
S
T
O
SLAVE
ADDRESS
1st WORD
ADDRESS
2nd WORD
ADDRESS
DATA
P
*1 As for WA12, BR24T32-W becomes Don't care.
As for WA13, BR24T32/64-W becomes Don't care.
As for WA14, BR24T32/64/128-W becomes Don't care.
As for WA15, BR24T32/64/128/256-W becomes Don't care.
SDA
LINE
WAWAWA WAWA
15 14 13 12 11
WA
0
1
0
1
0 A2A1A0
Note)
D7
D0
A
C
K
A
C
K
A
C
K
R
/
W
A
C
K
*1
Fig.39 Byte write cycle (BR24T32/64/128/256/512/1M-W)
S
T
A
R
T
W
R
I
T
E
S
T
O
P
*2
SLAVE
ADDRESS
W ORD
ADDRESS(n)
DATA(n)
DATA(n+15)
SDA
LINE
*1 As for WA7, BR24T01-W becomes Don't care.
*2 As for BR24T01/02-W becomes (n+7)
W A
0
W A
7
1
0
1
0 A2A1A0
D7
D0
D0
A
C
K
R
/
W
A
C
K
A
C
K
A
C
K
*1
注)
Fig.40 Page write cycle (BR24T01/02/04/08/16-W)
S
T
A
R
T
W
R
I
T
E
*1 As for WA12, BR24T32-W becomes Don't care.
As for WA13, BR24T32/64-W becomes Don't care.
As for WA14, BR24T32/64/128-W becomes Don't care.
As for WA15, BR24T32/64/128/256-W becomes Don't care.
S
T
O
P
SLAVE
ADDRESS
1st WORD
ADDRESS(n)
2nd WORD
ADDRESS(n)
*2
DATA(n)
DATA(n+31)
SDA
LINE
WAWA WA WA WA
WA
0
1
0
0
1
0
A2 A1A0
D7
D0
D0
0
14 13 12 11
15
*2 As for BR24T128/256-W becomes (n+63)
As for BR24T512-W becomes (n+127)
As for BR24T1M-W becomes (n+255)
A
C
K
R
/
W
A
C
K
A
C
K
A
C
K
A
C
K
*1
)
注
Fig.41 Page write cycle (BR24T32/64/128/256/512/1M-W)
Note)
*1 In BR24T16-W, A2 becomes P2.
*2 In BR24T08/16-W, A1 becomes P1.
*3 In BR24T04/08/16/1M-W A0 becomes P0.
*1 *2 *3
A1
1 0 1 0 A2 A0
Fig.42 Difference of slave address of each type
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Technical Note
BR24T□□□□Series
・During internal write execution, all input commands are ignored, therefore ACK is not sent back.
・Data is written to the address designated by word address (n-th address)
・By issuing stop bit after 8bit data input, write to memory cell inside starts.
・When internal write is started, command is not accepted for tWR (5ms at maximum).
・By page write cycle, the following can be written in bulk : Up to 8Byte (BR24T01-W, BR24T02-W)
Up to 16Byte (BR24T04-W, BR24T08-W, BR24T16-W)
Up to 32Byte (BR24T32-W, BR24T64-W)
Up to 64Byte (BR24T128-W, BR24T256-W)
Up to 128Byte (BR24T512-W)
Up to 256Byte (BR24T1M-W)
And when data of the maximum bytes or higher is sent, data from the first byte is overwritten.
(Refer to "Internal address increment" of "Notes on page write cycle" in P10.)
・As for page write cycle of BR24T01-W and BR24T02-W, after the significant 4 bits (in the case of BR24T01-W) of word
address, or the significant 5 bits (in the case of BR24T02-W) of word address are designated arbitrarily, by continuing
data input of 2 bytes or more, the address of insignificant 3 bits is incremented internally, and data up to 8 bytes can be
written.
・As for page write command of BR24T04-W, BR24T08-W and BR24T16-W, after page select bit ’P0’(in the case of
BR24T04-W), after page select bit ’P0,P1’(in the case of BR24T08-W), after page select bit ’P0,P1,P2’(in the case of
BR24T16-W) of slave address are designated arbitrarily, by continuing data input of 2 bytes or more, the address of
insignificant 4 bits is incremented internally, and data up to 16 bytes can be written.
・As for page write cycle of BR24T32-W and BR24T64-W, after the significant 7 bits (in the case of BR24T32-W) of word
address, or the significant 8 bits (in the case of BR24T64-W) of word address are designated arbitrarily, by continuing
data input of 2 bytes or more, the address of insignificant 5 bits is incremented internally, and data up to 32 bytes can
be written.
・As for page write cycle of BR24T128-W and BR24T256-W, after the significant 8 bits (in the case of BR24T128-W) of
word address, or the significant 9 bits (in the case of BR24T256-W) of word address are designated arbitrarily, by
continuing data input of 2 bytes or more, the address of insignificant 6 bits is incremented internally, and data up to 64
bytes can be written.
・As for page write cycle of BR24T512-W after the significant 9 bits of word address is designated arbitrarily, by continuing
data input of 2 bytes or more, the address of insignificant 7 bits is incremented internally, and data up to 128 bytes can
be written.
・As for page write cycle of BR24T1M-W after page select bit ’P0’ and the significant 8 bit of word address are designated
arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 8 bits is incremented internally, and
data up to 256 bytes can be written.
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Technical Note
BR24T□□□□Series
○Notes on page write cycle
List of numbers of page write
Number of Pages
Product number
8Byte
16Byte
32Byte
64Byte
128Byte
256Byte
BR24T04-W
BR24T08-W
BR24T16-W
BR24T01-W
BR24T02-W
BR24T32-W
BR24T64-W
BR24T128-W
BR24T256-W
BR24T512-W BR24T1M-W
The above numbers are maximum bytes for respective types.
Any bytes below these can be written.
In the case BR24T256-W, 1 page=64bytes, but the page
write cycle time is 5ms at maximum for 64byte bulk write.
It does not stand 5ms at maximum × 64byte=320ms(Max.)
○Internal address increment
Page write mode (in the case of BR24T16-W)
WA7
0
0
WA4 WA3 WA2 WA1 WA0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
Increment
0
For example, when it is started from address 0Eh,
therefore, increment is made as below,
0Eh→0Fh→00h→01h･･･ which please note.
0
0
0
0
0
0
1
1
0
1
1
0
1
1
0
0
1
0
0Eh
※0Eh･･･0E in hexadecimal, therefore,
00001110 becomes a binary number.
Significant bit is fixed.
No digit up
○Write protect (WP) terminal
・Write protect (WP) function
When WP terminal is set Vcc (H level), data rewrite of all addresses is prohibited. When it is set GND (L level), data
rewrite of all address is enabled. Be sure to connect this terminal to Vcc or GND, or control it to H level or L level. Do
not use it open.
In the case of use it as an ROM, it is recommended to connect it to pull up or Vcc.
At extremely low voltage at power ON / OFF, by setting the WP terminal 'H', mistake write can be prevented.
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Technical Note
BR24T□□□□Series
●Read Command
○Read cycle
Data of EEPROM is read. In read cycle, there are random read cycle and current read cycle. Random read cycle is a
command to read data by designating address, and is used generally. Current read cycle is a command to read data of
internal address register without designating address, and is used when to verify just after write cycle. In both the read
cycles, sequential read cycle is available, and the next address data can be read in succession.
W
R
I
T
E
S
T
A
R
T
S
T
A
R
T
R
E
A
D
S
T
O
P
SLAVE
ADDRESS
SLAVE
ADDRESS
WORD
ADDRESS(n)
DATA(n)
*1 As for WA7,BR24T01-W become Don’t care.
SDA
LINE
WA
7
WA
0
1 0 1 0 A2A1A0
1
0 1 0 A2A1A0
D7
D0
A
C
K
*1
R
/
W
A
C
K
A
C
K
R A
/
C
Note)
W K
Fig.43 Random read cycle (BR24T01/02/04/08/16-W)
S
T
A
R
T
W
R
I
T
E
S
T
A
R
T
R
E
A
D
S
T
SLAVE
ADDRESS
1st WORD
ADDRESS
2nd WORD
ADDRESS(n)
SLAVE
ADDRESS
O
P
DATA(n)
SDA
LINE
*1 As for WA12, BR24T32-W become Don’t care.
As for WA13, BR24T32/64-W become Don’t care.
As for WA14, BR24T32/64/128-W become Don’t care.
As for WA15, BR24T32/64/128/256-W become Don’t care.
WA
WAWAWA
WAWA
A2
A1 A0
D7
D0
1
0
1
0
A2 A1A0
0
1 0
1
0
13 12 11
15 14
R A
A
C
K
A
C
K
R
A
C
A
C
K
*1
/
C
/
Note)
W K
W K
Fig.44 Random read cycle (BR24T32/64/128/256/512/1M-W)
S
R
E
A
D
S
T
O
P
T
A
R
T
SLAVE
ADDRESS
*1 As for WA7, BR24T01-W becomes Don't care.
*2 As for BR24T01/02-W becomes (n+7)
DATA(n)
SDA
LINE
1 0 1 0 A2A1A0
Note)
D7
D0
A
C
K
R A
/ C
W K
Fig.45 Current read cycle
S
T
A
R
T
*1 As for WA12, BR24T32-W becomes Don't care.
As for WA13, BR24T32/64-W becomes Don't care.
As for WA14, BR24T32/64/128-W becomes Don't care.
As for WA15, BR24T32/64/128/256-W becomes Don't care.
R
E
A
D
S
T
O
P
SLAVE
ADDRESS
DATA(n)
DATA(n+x)
SDA
LINE
A2 A1A0
1
0
1
0
D7
D0
D7
D0
*2 As for BR24T128/256-W becomes (n+63)
As for BR24T512-W becomes (n+127)
As for BR24T1M-W becomes (n+255)
R
/
A
C
A
C
K
A
C
K
A
C
K
Note）
W K
Fig.46 Sequential read cycle (in the case of current read cycle)
・In random read cycle, data of designated word address can be read.
・When the command just before current read cycle is random read cycle, current read cycle (each including sequential
read cycle), data of incremented last read address (n)-th address, i.e., data of the (n+1)-th address is output.
・When ACK signal 'LOW' after D0 is detected, and stop condition is not sent from master (µ-COM) side, the next
address data can be read in succession.
・Read cycle is ended by stop condition where 'H' is input to ACK signal after D0 and SDA signal is started at SCL
signal 'H' .
・When 'H' is not input to ACK signal after D0, sequential read gets in, and the next data is output.
Therefore, read command cycle cannot be ended. When to end read command cycle, be sure input stop condition to
input 'H' to ACK signal after D0, and to start SDA at SCL signal 'H'.
・Sequential read is ended by stop condition where 'H' is input to ACK signal after arbitrary D0 and SDA is started at SCL
signal 'H'.
Note)
*1 In BR24T16-W, A2 becomes P2.
*2 In BR24T08/16-W, A1 becomes P1.
*3 In BR24T08/16/1M-W, A0 becomes P0.
*1 *2 *3
A1
A2 A0
0
1
1
0
Fig.47 Difference of slave address of each type
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Technical Note
BR24T□□□□Series
●Software reset
Software reset is executed when to avoid malfunction after power on, and to reset during command input. Software reset
has several kinds, and 3 kinds of them are shown in the figure below. (Refer to Fig.48-(a), Fig.48-(b), Fig.48-(c).) In
dummy clock input area, release the SDA bus ('H' by pull up). In dummy clock area, ACK output and read data '0' (both 'L'
level) may be output from EEPROM, therefore, if 'H' is input forcibly, output may conflict and over current may flow, leading
to instantaneous power failure of system power source or influence upon devices.
Dummy clock×14
13
Start×2
SCL
SDA
Normal command
Normal command
1
2
14
Fig.48-(a) The case of dummy clock +START+START+ command input
Start
Dummy clock×9
Start
SCL
SDA
Normal command
Normal command
1
2
8
9
Fig.48-(b) The case of START +9 dummy clocks +START+ command input
Start×9
SCL
Normal command
1
2
3
7
8
9
SDA
Normal command
Fig.48-(c) START×9+ command input
※Start command from START input.
●Acknowledge polling
During internal write execution, all input commands are ignored, therefore ACK is not sent back. During internal automatic
write execution after write cycle input, next command (slave address) is sent, and if the first ACK signal sends back 'L', then
it means end of write action, while if it sends back 'H', it means now in writing. By use of acknowledge polling, next
command can be executed without waiting for tWR = 5ms.
When to write continuously, R/ W = 0, when to carry out current read cycle after write, slave address R/ W = 1 is sent,
and if ACK signal sends back 'L', then execute word address input and data output and so forth.
During internal write,
ACK = HIGH is sent back.
First write command
S
T
A
R
T
S
T
A
R
T
S
S
T
A
C
K
H
A
T
A
R
T
Slave
Slave
C
K
H
Write command
O
…
address
address
P
tWR
Second write command
S
T
A
R
T
S
T
A
R
T
S
T
O
P
A
C
K
L
A
C
K
L
A
A
C
K
L
Slave
Word
Slave
C
…
Data
K
address
address
address
H
tWR
After completion of internal write,
ACK=LOW is sent back, so input
next word address and data in
succession.
Fig.49 Case to continuously write by acknowledge polling
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Technical Note
BR24T□□□□Series
●WP valid timing (write cancel)
WP is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so forth, pay attention to the following WP
valid timing. During write cycle execution, in cancel valid area, by setting WP='H', write cycle can be cancelled. In both byte
write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in D0 of
data(in page write cycle, the first byte data) is cancel invalid area.
WP input in this area becomes Don't care. The area from the rise of SCL to take in D0 to input the stop condition is cancel
valid area. And, after execution of forced end by WP, standby status gets in.
・Rise of D0 taken clock
・Rise of SDA
SCL
SCL
SDA
D1
D0 ACK
SDA D0
ACK
Enlarged view
Enlarged view
S
A
A
C
K
L
A
C
K
L
A
C
K
L
S
T
O
P
tWR
T
A
R
T
Slave
Word
SDA
WP
D7 D6
D5
D2 D1 D0
D4 D3
C
K
L
Data
address
address
WP cancel invalid area
WP cancel valid area
Data is not written.
WP cancel invalid area
Fig.50 WP valid timing
●Command cancel by start condition and stop condition
During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Fig.51)
However, in ACK output area and during data read, SDA bus may output 'L', and in this case, start condition and stop
condition cannot be input, so reset is not available. Therefore, execute software reset. And when command is cancelled by
start, stop condition, during random read cycle, sequential read cycle, or current read cycle, internal setting address is not
determined, therefore, it is not possible to carry out current read cycle in succession. When to carry out read cycle in
succession, carry out random read cycle.
SCL
SDA
1
0
1
0
Start condition
Stop condition
Fig.51 Case of cancel by start, stop condition during slave address input
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Technical Note
BR24T□□□□Series
●I/O peripheral circuit
○Pull up resistance of SDA terminal
SDA is NMOS open drain, so requires pull up resistance. As for this resistance value (RPU), select an appropriate value to
this resistance value from microcontroller VIL, IL, and VOL-IOL characteristics of this IC. If RPU is large, action frequency is
limited. The smaller the RPU, the larger the consumption current at action.
○Maximum value of RPU
The maximum value of RPU is determined by the following factors.
①SDA rise time to be determined by the capacitance (CBUS) of bus line of RPU and SDA should be tR or below.
And AC timing should be satisfied even when SDA rise time is late.
②The bus electric potential
A to be determined by input leak total (IL) of device connected to bus at output of 'H' to
○
SDA bus and RPU should sufficiently secure the input 'H' level (VIH) of microcontroller and EEPROM including
recommended noise margin 0.2Vcc.
VCC－ILRPU－0.2 VCC ≧ VIH
0.8VCC VIH
Microcontroller
BR24TXX
RPU
IL
Ex.) VCC =3V IL=10µA VIH=0.7 VCC
RPU
from②
SDA terminal
A
0.83 0.73
RPU
10106
IL
IL
Bus line
capacity
CBUS
300 [kΩ]
Fig.52 I/O circuit diagram
○ Minimum value of RPU
The minimum value of RPU is determined by the following factors.
When IC outputs LOW, it should be satisfied that VOLMAX=0.4V and IOLMAX=3mA.
VCC VOL
IOL
RPU
VCC VOL
RPU
IOL
②VOLMAX= should secure the input 'L' level (VIL) of microcontroller and EEPROM
including recommended noise margin 0.1Vcc.
VOLMAX ≦ VIL－0.1 VCC
Ex.) VCC =3V, VOL=0.4V, IOL=3mA, microcontroller, EEPROM VIL=0.3Vcc
3 0.4
3103
from①RPU
867[Ω]
And
VOL=0.4［V］
VIL=0.3×3
=0.9［V］
Therefore, the condition ② is satisfied.
○Pull up resistance of SCL terminal
When SCL control is made at CMOS output port, there is no need, but in the case there is timing where SCL becomes
'Hi-Z', add a pull up resistance. As for the pull up resistance, one of several kΩ ~ several ten kΩ is recommended in
consideration of drive performance of output port of microcontroller.
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
14/21
Technical Note
BR24T□□□□Series
●Cautions on microcontroller connection
○RS
In I2C BUS, it is recommended that SDA port is of open drain input/output. However, when to use CMOS input / output of
tri state to SDA port, insert a series resistance Rs between the pull up resistance Rpu and the SDA terminal of EEPROM.
This is controls over current that occurs when PMOS of the microcontroller and NMOS of EEPROM are turned ON
simultaneously. Rs also plays the role of protection of SDA terminal against surge. Therefore, even when SDA port is
open drain input/output, Rs can be used.
ACK
SCL
RPU
RS
SDA
'H' output of microcontroller
'L' output of EEPROM
EEPROM
Microcontroller
Over current flows to SDA line by 'H'
output of microcontroller and 'L'
output of EEPROM.
Fig.53 I/O circuit diagram
Fig.54 Input / output collision timing
○Maximum value of Rs
The maximum value of Rs is determined by the following relations.
①SDA rise time to be determined by the capacity (CBUS) of bus line of Rpu and SDA should be tR or below.
And AC timing should be satisfied even when SDA rise time is late.
②The bus electric potential
sufficiently secure the input 'L' level (VIL) of microcontroller including recommended noise margin 0.1Vcc.
A to be determined by Rpu and Rs the moment when EEPROM outputs 'L' to SDA bus
○
VCC VOL
RPU RS
VOL 0.1VCC VIL
V
CC
A
R
PU
VCC VOL
1.1VCC VIL
RPU
R
S
RS
V
OL
I
OL
Ex)VCC=3V VIL=0.3VCC VOL=0.4V RPU=20kΩ
Bus line
capacity
CBUS
0.33 0.4 0.13
RS
20103
1.13 0.33
V
IL
EEPROM
Micro controller
Fig.55 I/O Circuit Diagram
1.67[kΩ]
○Minimum value of Rs
The minimum value of Rs is determined by over current at bus collision. When over current flows, noises in power source
line, and instantaneous power failure of power source may occur. When allowable over current is defined as I, the
following relation must be satisfied. Determine the allowable current in consideration of impedance of power source line
in set and so forth. Set the over current to EEPROM 10mA or below.
VCC
I
RS
RPU
'L'output
RS
VCC
I
RS
Over current I
EX) VCC=3V I=1mA
'H' output
3
RS
10103
EEPROM
Fig.56 I/O circuit diagram
Microcontroller
300 [Ω]
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
15/21
Technical Note
BR24T□□□□Series
●I2C BUS input / output circuit
○Input (A0, A1, A2, SCL, WP)
Fig.57 Input pin circuit diagram
○Input / output (SDA)
Fig.58 Input / output pin circuit diagram
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2011.03 - Rev.A
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© 2011 ROHM Co., Ltd. All rights reserved.
Technical Note
BR24T□□□□Series
●Notes on power ON
At power on, in IC internal circuit and set, Vcc rises through unstable low voltage area, and IC inside is not completely reset,
and malfunction may occur. To prevent this, functions of POR circuit and LVCC circuit are equipped. To assure the action,
observe the following conditions at power on.
1. Set SDA = 'H' and SCL ='L' or 'H’
2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit.
tR
Recommended conditions of tR, tOFF,Vbot
VCC
tR
tOFF
Vbot
10ms or below
100msor below
10ms or larger
10msor larger
0.3V or below
0.2V or below
tOFF
Vbot
0
Fig.59 Rise waveform diagram
3. Set SDA and SCL so as not to become 'Hi-Z'.
When the above conditions 1 and 2 cannot be observed, take the following countermeasures.
a) In the case when the above condition 1 cannot be observed. When SDA becomes 'L' at power on .
→Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'.
V
CC
tLOW
SCL
SDA
After Vcc becomes stable
After Vcc becomes stable
tDH tSU:DAT
tSU:DAT
Fig.60 When SCL= 'H' and SDA= 'L'
Fig.61 When SCL='L' and SDA='L'
b) In the case when the above condition 2 cannot be observed.
→After power source becomes stable, execute software reset(P12).
c) In the case when the above conditions 1 and 2 cannot be observed.
→Carry out a), and then carry out b).
●Low voltage malfunction prevention function
LVCC circuit prevents data rewrite action at low power, and prevents wrong write. At LVCC voltage (Typ. =1.2V) or below, it
prevent data rewrite.
●Vcc noise countermeasures
○Bypass capacitor
When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is
recommended to attach a bypass capacitor (0.1µF) between IC Vcc and GND. At that moment, attach it as close to IC as
possible. And, it is also recommended to attach a bypass capacitor between board Vcc and GND.
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2011.03 - Rev.A
17/21
© 2011 ROHM Co., Ltd. All rights reserved.
Technical Note
BR24T□□□□Series
●Notes for use
(1) Described numeric values and data are design representative values, and the values are not guaranteed.
(2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin
in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI.
(3) Absolute maximum ratings
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded,
LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case
of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it
that conditions exceeding the absolute maximum ratings should not be impressed to LSI.
(4) GND electric potential
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that
of GND terminal.
(5) Terminal design
In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin.
(6) Terminal to terminal shortcircuit and wrong packaging
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may
destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND
owing to foreign matter, LSI may be destructed.
(7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
18/21
Technical Note
BR24T□□□□Series
●Order part number
B R
2 4
T
1 2 8
F V T - W
G
E 2
Operating
Part No.
BUS type
Capacity
Package
Blank :DIP-T8
Double
Cell
Halogen Packaging and forming specification
temperature/
Power source
Voltage
24：I2C
01=1K
02=2K
04=4K
08=8K
64=64K
Free
E2: Embossed tape and reel
(SOP8, SOP8-J8, SSOP-B8,
TSSOP-B8, TSSOP-B8J)
TR: Embossed tape and reel
(MSOP8, VSON008X2030)
None: Tube
128=128K
256=256K
512=512K
F
:SOP8
FJ
FV
:SOP-J8
: SSOP-B8
-40℃~+85℃
1.7V~5.5V
16=16K 1M=1024K FVT : TSSOP-B8
32=32K
FVJ : TSSOP-B8J
FVM : MSOP8
(DIP-T8)
NUX :VSON008X2030
DIP-T8
<Tape and Reel information>
Container
Quantity
Tube
9.3± 0.3
2000pcs
8
1
5
Direction of feed Direction of products is fixed in a container tube
4
7.62
0.3± 0.1
0°−15°
2.54
0.5± 0.1
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
∗
SOP8
<Tape and Reel information>
5.0± 0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
2500pcs
+
−
6
°
4°
4
°
Quantity
8
7
6
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
0.595
+0.1
0.17
-
0.05
S
0.1
S
1.27
Direction of feed
1pin
0.42± 0.1
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
∗
SOP-J8
<Tape and Reel information>
4.9± 0.2
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
+
6°
4°
−4°
Quantity
2500pcs
8
7
6
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
0.545
0.2± 0.1
S
1.27
0.42± 0.1
0.1
Direction of feed
1pin
S
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
19/21
Technical Note
BR24T□□□□Series
TSSOP-B8
<Tape and Reel information>
3.0± 0.1
(MAX 3.35 include BURR)
Tape
Embossed carrier tape
3000pcs
4 ± ±4
8
7
6
5
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
1PIN MARK
+0.05
0.145
−0.03
0.525
S
0.08 S
+0.05
0.245
M
−0.04
0.08
Direction of feed
1pin
0.65
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
TSSOP-B8J
<Tape and Reel information>
3.0± 0.1
(MAX 3.35 include BURR)
4 ± ±4
Tape
Embossed carrier tape
8
7
6
5
Quantity
2500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
1PIN MARK
+0.05
0.525
0.145
−0.03
S
0.08
S
+0.05
0.32
−0.04
Direction of feed
1pin
M
0.08
0.65
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
MSOP8
<Tape and Reel information>
2.9± 0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
+
6°
4°
Quantity
3000pcs
−4°
8
7
6
5
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
1PIN MARK
1pin
+0.05
−0.03
0.145
0.475
S
+0.05
−0.04
0.22
0.08
S
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
0.65
Reel
(Unit : mm)
∗
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2011.03 - Rev.A
20/21
© 2011 ROHM Co., Ltd. All rights reserved.
Technical Note
BR24T□□□-W Series
VSON008X2030
<Tape and Reel information>
2.0± 0.1
Tape
Embossed carrier tape
4000pcs
Quantity
TR
1PIN MARK
Direction
of feed
S
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
0.08
S
1.5± 0.1
0.5
C0.25
1
4
8
5
0.25
Direction of feed
1pin
+0.05
−0.04
0.25
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
(Unit : mm)
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.03 - Rev.A
21/21
Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
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