BU12TD3WG [ROHM]

Fixed Positive LDO Regulator, 1.2V, CMOS, PDSO5, SSOP-5;


型号：	BU12TD3WG
厂家：	ROHM
描述：	Fixed Positive LDO Regulator, 1.2V, CMOS, PDSO5, SSOP-5 光电二极管
文件：	总5页 (文件大小：143K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1/4

STRUCTURE

PRODUCT

Silicon Monolithic Integrated Circuit

CMOS-type Series Regulator

NAME

ＢＵＸＸＴＤ３ＷＧ Series

○ BLOCK DIAGRAM and APPLICATION CIRCUIT

○ PIN DESCRIPTION

VIN

PIN No. PIN NAME

DESCRIPTION

INPUT Pin

GROUND Pin

VIN

GND

STBY

N.C.

VREF

VOUT

N.C.

Cin

OUTPUT CONTROL Pin (High: ON, Low: OFF)

NO CONNECT

OCP

TSD

STBY

GND

VOUT

OUTPUT Pin

VSTBY

Discharge

STBY

Cin･･･0.47μF (Ceramic)

Co ･･･0.47μF (Ceramic)

Fig.1 BLOCK DIAGRAM and APPLICATION CIRCUIT

○ ABSOLUTE MAXIMUM RATINGS (Ta=25℃)

PARAMETER

Symbol

VMAX

Limit

Unit

Power Supply Voltage

-0.3 ～ +6.5

540 (*1)

Power Dissipation

℃

Maximum Junction Temperature

Operating Temperature Range

Storage Temperature Range

TjMAX

Topr

+125

-40 ～ +85

-55 ～ +125

℃

Tstg

℃

(*1) Pd deleted at 5.4mW/℃ at temperatures above Ta=25℃, mounted on 70×70×1.6mm glass-epoxy PCB.

○ RECOMMENDED OPERATING RANGE (Not to exceed Pd)

PARAMETER

Symbol

VIN

Limit

1.7～5.5

200

Unit

Power Supply Voltage

Maximum Output Current

IMAX

REV. B

2/4

○ OPERATING CONDITIONS

PARAMETER

Input Capacitor

Output Capacitor

Symbol

MIN.

TYP.

0.47

MAX.

Unit

μF

CONDITION

Cin

0.22 (*2)

Ceramic capacitor recommended

(*2) Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias,

changing as time progresses characteristic.

○ ELECTRICAL CHARACTERISTICS

(Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)

Limit

PARAMETER

Symbol

VOUT

Unit

Conditions

MIN.

TYP.

MAX.

Overall Device

VOUT×0.99

VOUT×1.01

VOUT+25mV

IOUT=10μA, VOUT≧2.5V

Output Voltage

VOUT

VOUT-25mV

IOUT=10μA, VOUT＜2.5V

IOUT=0mA

Operating Current

IIN

μA

Operating Current (STBY)

ISTBY

1.0

STBY=0V

Ripple Rejection Ratio

VRR=-20dBv, fRR=1kHz, IOUT=10mA

2.5V≦VOUT≦2.6V (VIN=0.98*VOUT, IOUT=200mA)

2.7V≦VOUT≦2.85V (VIN=0.98*VOUT, IOUT=200mA)

2.9V≦VOUT≦3.1V (VIN=0.98*VOUT, IOUT=200mA)

3.2V≦VOUT≦3.4V (VIN=0.98*VOUT, IOUT=200mA)

280

260

240

220

540

500

460

420

Dropout Voltage

VSAT

Line Regulation

Load Regulation

VDL

VIN=VOUT+1.0V to 5.5V (*4), IOUT=10μA

IOUT=0.01mA to 100mA

VDLO

Over Current Protection (OCP)

Limit Current

ILMAX

220

400

700

150

Vo=VOUT*0.95

Vo=0V

Short Current

ISHORT

Standby Block

Discharge Resistor

STBY Pin Pull-down Current

RDSC

ISTB

0.1

0.6

2.0

5.5

0.3

μA

VIN=4.0V, STBY=0V, VOUT=4.0V

STBY=1.5V

STBY Control Voltage

OFF

VSTBH

VSTBL

1.2

-0.3

●This product is not designed for protection against radioactive rays.

(*3) VIN=2.5V for VOUT≦1.5V

(*4) VIN=2.5V to 5.5V for VOUT≦1.5V

○ ELECTRICAL CHARACTERISTICS of each Output Voltage

(Ta=25℃, STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)

Output Voltage

1.0V, 1.2V

PARAMETER

MIN.

TYP.

160

MAX.

Unit

Conditions

VIN=1.7V

200

VIN=2.1V

Maximum

output current

120

VIN=1.8V

1.5V

200

VIN=2.2V

1.8V, 1.85V, 1.9V, 2.0V, 2.1V

VIN=VOUT+0.6V

REV. B

3/4

○ POWER DISSIPATION CURVES

○ DEVICE NAME and MARKING

Device Name: BUXXTD3WG

0.8

0.6

Conditions :

Description

Marking

Output Voltage

Mounted on glass epoxy PCB.

Size : 70mm×70mm×1.6mm

0.54 W

1.0V typ.

1.2V typ.

1.5V typ.

1.8V typ.

1.85V typ.

1.9V typ.

2.0V typ.

2.1V typ.

2.5V typ.

2.6V typ.

2.7V typ.

2.8V typ.

2.85V typ.

2.9V typ.

3.0V typ.

3.1V typ.

3.2V typ.

3.3V typ.

3.4V typ.

0.4

0.2

100

125

75 85

Ta (℃)

Fig.2 Pd reduction (example)

○ PACKAGE DIMENSIONS (SSOP5)

Marking

Lot No.

Fig.3 Package dimensions (Unit : mm)

REV. B

4/4

○ OPERATION NOTES

1.) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC.

Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational

values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of

damaging the IC.

2.) GND potential

The potential of the GND pin must be the minimum potential in the system in all operating conditions. Never connect a potential lower than

GND to any pin, even if only transiently.

3.) Thermal design

Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating conditions.

4.) Inter-pin shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may result

in damage to the IC.

5.) Operation in strong electromagnetic fields

Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong electromagnetic

fields may be present.

6.) Common impedance

Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a

minimum.

7.) Voltage of STBY pin

To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a

voltage between 0.3 V and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a

minimum.

Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage

to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in

applications where these pins are shorted, the output should always be completely discharged before turning the IC on.

8.) Over-current protection circuit (OCP)

This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is

shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be

used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry

will engage.

9.) Thermal shutdown circuit (TSD)

This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds. This

feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active

security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage.

10.) Input/output capacitor

Cout=0.47μF, Cin=0.47μF, Temp=+25℃

Capacitors must be connected between the input/output pins and GND for stable operation,

and should be physically mounted as close to the IC pins as possible (refer to figure 4). The

100

input capacitor helps to counteract increases in power supply impedance, and increases

Unstable region

stability in applications with long or winding power supply traces. The output capacitance

value is directly related to the overall stability and transient response of the regulator, and

should be set to the largest possible value for the application to increase these

characteristics. During design, keep in mind that in general, ceramic capacitors have a wide

Stable region

range of tolerances, temperature coefficients and DC bias characteristics, and that their

capacitance values tend to decrease over time. Confirm these details before choosing

appropriate capacitors for your application..

0.1

(Please refer the technical note, regarding ceramic capacitor of recommendation.)

0.01

100

150

200

IOUT [mA]

Fig.4 Stable region (example)

REV. B

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1010

BU12TD3WG [ROHM]

相关型号：

BU12TD3WG-GTR

BU12TD3WG-TR

BU12TD3WG-XTR

BU12UA3WNVX-TL

BU12UB3WG-GTL

BU12UB3WG-GTR

BU1301F

BU133

BU133

BU134

BU13870

BU13P-TR-P-H