BU18RL82-M [ROHM]
用于汽车多屏显示器的SerDes IC;
| 型号： | BU18RL82-M |
| 厂家： | 
ROHM |
| 描述： | 用于汽车多屏显示器的SerDes IC 显示器 |
| 文件： | 总13页 (文件大小：869K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product Brief
Clockless Link-BD
Clockless Link-BD Deserializer
with LVDS Interface for Automotive
BU18RL82-M
General Description
Key Specifications
BU18RL82-M supports LVDS data transmission by
ROHM's original CDR (Clock Data Recovery) technology.
This chip is serial interface receiver IC of the Clockless
Link-BD series.
◼ Supply Voltage Range: VDDIO
1.7 V to 3.6 V
3.0 V to 3.6 V
1.1 V to 1.3 V
1.1 V to 1.3 V
LVDD
AVDD
VDD
BU18RL82-M converts Clockless link stream into a
LVDS format, and transmits through one or two ports of
LVDS.
Flexible Input / Output mode is suitable for a variety of
application interface.
◼ Clockless Link-BD Data Rate:
➢
➢
Forward Channel
Back Channel
3.6 Gbps/lane (Max)
16.875 Mbps/lane (Typ)
135 MHz (Max)
◼ LVDS Frequency:
◼ I2C Clock Frequency:
◼ SSCG:
1 MHz (Max)
➢
➢
Modulation Frequency
Modulation Ratio
30 kHz to 200 kHz
Up to 2 %
Features
◼ AEC-Q100 Qualified (Note 1)
◼ Operating Temperature Range: -40 °C to +105 °C
◼ Functional Safety Supportive Automotive Products
◼ Input Interface: Clockless Link-BD 2-lane
◼ Output Interface: LVDS 2-port
◼ Low EMI Transmission by Original DC Balance
Protocol and Scrambling
Package
VQFN64FBV090
W (Typ) x D (Typ) x H (Max)
9.0 mm x 9.0 mm x 1.0 mm
◼ Support Reduced Swing LVDS Output for Low EMI
◼ Supported Functions
➢
➢
➢
➢
➢
Daisy Chain Mode
Pattern Generator
SSCG (Spread Spectrum Clock Generator)
I2C Master
General-Purpose Input/Output (GPIO) 8 pins
◼ Connect Ability Check
➢
➢
➢
CRC
Frame Stop Detection
Eye Pattern
(Note 1) Grade2
Applications
◼
◼
◼
Car Navigation System
CID (Center Information Display)
HUD (Head up Display)
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© 2022 ROHM Co., Ltd. All rights reserved.
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BU18RL82-M
Block Diagram
VDD
VDDIO
AVDD
LVDD
2
8
CLRX0P
CLRX0N
TXA_0P
TXA_0N
TXA_1P
TXA_1N
TXA_2P
TXA_2N
TXA_3P
TXA_3N
CLL Rx
Analog
LVDS
Tx
BKC Tx
Analog
2
LVDS Tx
PLL
TXA_CKP
TXA_CKN
CLL Rx
Logic
Data Mapping
2
CLRX1P
CLRX1N
CLL Rx
Analog
LVDS Tx
Logic
8
2
TXB_0P
TXB_0N
TXB_1P
TXB_1N
TXB_2P
TXB_2N
TXB_3P
TXB_3N
BKC Tx
Analog
LVDS
Tx
SSCG
LVDS Tx
PLL
CLKIN
TXB_CKP
TXB_CKN
SSCG
CLL Rx
Monitor
Analog
2
EQOUTP
EQOUTN
Fail Detector
GPIO
IRQ
Back channel
Logic
8
GPIO[7:0]
TEST
SDA
SCL
I2C Master
ADC
BKC Rx
Analog
CLL Tx
Analog
OSC
IDS
Hardware reset
XRST
2
CLTXP
CLTXN
RSVD
GND
Figure 1. Block Diagram
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BU18RL82-M
SerDes Application Examples
Figure 2. SerDes Application Example 1 (Normal Connection)
Figure 3. SerDes Application Example 2 (Daisy Chain Connection)
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Product Brief
BU18RL82-M
Application Examples
STP (Shielded Twisted Pair) Cable
Serializer : MIPI DSI 4-lane 2-port Input, Clockless Link-BD 2-lane Output
AVDD = VDD = 1.2 V, VDDIO = LVDD = 1.8 V
Deserializer : Clockless Link-BD 2-lane Input, LVDS 2-port Output
AVDD = VDD = 1.2 V, VDDIO = 1.8 V, LVDD = 3.3 V
*Connect BU18TL82-M MIPI/LVDS pins to GND when not used.
*Leave open when BU18TL82-M CLTX0P/N, CLTX1P/N not used.
*Leave open when BU18RL82-M CLRX0P/N, CLRX1P/N not used.
*Leave open when BU18RL82-M CLTXP/N not used.
1.8 V
VDDIO
VDDIO
10 μF
1.8 V
VDDIO
VDDIO
VDDIO
1.8 V
LVDD
10 μF
LVDD
10 μF
BU18TL82-M
BU18RL82-M
LVDD
3.3 V
1.2 V
LVDD
LVDD
AVDD
AVDD
10 μF
1 µF
1 µF
10 µF
10 µF
1.2 V
100 nF
100 nF
100 nF
100 nF
AVDD
AVDD
AVDD
CLTX0P
CLTX0N
CLRX0P
CLRX0N
VDD
VDD
VDD
VDD
VDD
1 µF
1 µF
10 µF
10 µF
STP Cable
STP Cable
VDD
VDD
VDD
VDD
100 nF
100 nF
100 nF
100 nF
CLTX1P
CLTX1N
CLRX1P
CLRX1N
1.8 V
1.5 kΩ
1.5 kΩ
1.5 kΩ
1.5 kΩ
1.8 V
1.5 kΩ
SCL_A
SDA_A
1.5 kΩ
SCL_B
SDA_B
SCL
SDA
100 nF
100 nF
EQOUTP
EQOUTN
TXA_0P
TXA_0N
TXA_1P
TXA_1N
TXA_2P
TXA_2N
TXA_3P
TXA_3N
TXA_CKP
100 Ω
RMA_0P/RLA_3P
RMA_0N/RLA_3N
RMA_1P/RLA_2P
RMA_1N/RLA_2N
RMA_2P/RLA_1P
RMA_2N/RLA_1N
RMA_3P/RLA_0P
RMA_3N/RLA_0N
RMA_CKP/RLA_CKP
RMA_CKN/RLA_CKN
LVDS
A Port
MIPI
A Port
Need external 100 Ω terminal resistor
closed to LVDS receiver pin
TXA_CKN
TXB_0P
TXB_0N
TXB_1P
TXB_1N
TXB_2P
TXB_2N
TXB_3P
TXB_3N
TXB_CKP
TXB_CKN
RMB_0P/RLB_3P
RMB_0N/RLB_3N
RMB_1P/RLB_2P
RMB_1N/RLB_2N
RMB_2P/RLB_1P
RMB_2N/RLB_1N
RMB_3P/RLB_0P
RMB_3N/RLB_0N
RMB_CKP/RLB_CKP
RMB_CKN/RLB_CKN
LVDS
B Port
Need external 100 Ω terminal
resistor closed to LVDS receiver pin
MIPI
B Port
1.8 V
4.7 kΩ
SEL_MIPI
100 nF
CLTXP
CLTXN
STP Cable connect to
Clockless Link BD Receiver
100 nF
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
1.8 V
3.3 V
N.C
N.C
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
IDS
IDS
10 kΩ
1 μF
10 kΩ
1 μF
CLKIN0
CLKIN1
TEST
RSVD
25 MHz to 27 MHz
XTAL clock
25 MHz to 27 MHz
XTAL clock
CLKIN
TEST
RSVD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
1.8 V
1.8 V
4.7 kΩ
4.7 kΩ
IRQ
IRQ
XRST
XRST
EXP-PAD
EXP-PAD
VDDIO
LVDD
LVDD
VDDIO
LVDD
AVDD
AVDD
VDDIO
VDDIO
VDDIO
LVDD
LVDD
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
VDD
VDD
VDD
VDD
GND
VDD
AVDD
AVDD
VDD
VDD
GND
AVDD
VDD
VDD
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Figure 4. Application Diagram (STP Cable)
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BU18RL82-M
Application Examples - continued
Coaxial Cable
Serializer : LVDS 4-lane 2-port Input, Clockless Link-BD 2-lane Output
AVDD = VDD = 1.2 V, VDDIO = 1.8 V, LVDD = 3.3 V
Deserializer : Clockless Link-BD 2-lane Input, LVDS 2-port Output
AVDD = VDD = 1.2 V, VDDIO = 1.8 V, LVDD = 3.3 V
*Connect BU18TL82-M MIPI/LVDS pins to GND when not used.
*Leave open when BU18TL82-M CLTX0P/N, CLTX1P/N not used.
*Leave open when BU18RL82-M CLRX0P/N, CLRX1P/N not used.
*Leave open when BU18RL82-M CLTXP/N not used.
1.8 V
VDDIO
VDDIO
10 μF
1.8 V
VDDIO
VDDIO
VDDIO
3.3 V
LVDD
10 μF
LVDD
10 μF
BU18TL82-M
BU18RL82-M
LVDD
3.3 V
1.2 V
LVDD
LVDD
AVDD
AVDD
10 μF
1 µF
1 µF
10 µF
10 µF
1.2 V
100 nF
47 nF
100 nF
47 nF
AVDD
AVDD
AVDD
CLTX0P
CLTX0N
CLRX0P
CLRX0N
VDD
VDD
VDD
VDD
VDD
Coaxial Cable
Coaxial Cable
1 µF
1 µF
10 µF
10 µF
50 Ω
50 Ω
50 Ω
50 Ω
VDD
VDD
VDD
VDD
100 nF
47 nF
100 nF
47 nF
CLTX1P
CLTX1N
CLRX1P
CLRX1N
1.8 V
1.5 kΩ
1.5 kΩ
1.5 kΩ
1.5 kΩ
1.8 V
1.5 kΩ
SCL_A
SDA_A
1.5 kΩ
SCL_B
SDA_B
SCL
SDA
100 nF
100 nF
EQOUTP
EQOUTN
TXA_0P
TXA_0N
TXA_1P
TXA_1N
TXA_2P
TXA_2N
TXA_3P
TXA_3N
TXA_CKP
100 Ω
RMA_0P/RLA_3P
RMA_0N/RLA_3N
RMA_1P/RLA_2P
RMA_1N/RLA_2N
RMA_2P/RLA_1P
RMA_2N/RLA_1N
RMA_3P/RLA_0P
RMA_3N/RLA_0N
RMA_CKP/RLA_CKP
RMA_CKN/RLA_CKN
LVDS
A Port
LVDS
A Port
Need external 100 Ω terminal resistor
closed to LVDS receiver pin
Need external 100 Ω terminal
resistor closed to pin
TXA_CKN
TXB_0P
TXB_0N
TXB_1P
TXB_1N
TXB_2P
TXB_2N
TXB_3P
TXB_3N
TXB_CKP
TXB_CKN
RMB_0P/RLB_3P
RMB_0N/RLB_3N
RMB_1P/RLB_2P
RMB_1N/RLB_2N
RMB_2P/RLB_1P
RMB_2N/RLB_1N
RMB_3P/RLB_0P
RMB_3N/RLB_0N
RMB_CKP/RLB_CKP
RMB_CKN/RLB_CKN
LVDS
B Port
Need external 100 Ω terminal
resistor closed to LVDS receiver pin
LVDS
B Port
Need external 100 Ω terminal
SEL_MIPI
resistor closed to pin
4.7 kΩ
100 nF
Coax Cable connect to
Clockless Link BD Receiver
CLTXP
CLTXN
47 nF
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
1.8 V
3.3 V
50 Ω
N.C
N.C
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
IDS
IDS
10 kΩ
1 μF
10 kΩ
1 μF
CLKIN0
CLKIN1
25 MHz to 27 MHz
XTAL clock
TEST
RSVD
25 MHz to 27 MHz
XTAL clock
1.8 V
TEST
RSVD
GND
GND
GND
GND
GND
GND
GND
CLKIN
GND
GND
GND
GND
GND
GND
GND
GND
1.8 V
4.7 kΩ
4.7 kΩ
IRQ
IRQ
XRST
XRST
EXP-PAD
EXP-PAD
VDDIO
LVDD
LVDD
VDDIO
LVDD
AVDD
AVDD
VDDIO
VDDIO
VDDIO
LVDD
LVDD
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
VDD
VDD
VDD
VDD
GND
VDD
AVDD
AVDD
VDD
VDD
GND
AVDD
VDD
VDD
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Figure 5. Application Diagram (Coaxial Cable)
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BU18RL82-M
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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BU18RL82-M
Operational Notes - continued
12. Functional Safety
“ISO 26262 Process Compliant to Support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.
“Functional Safety Supportive Automotive Products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the
functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
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BU18RL82-M
Ordering Information
B U 1 8 R L 8
2
-
M E 2
Part Number
Product Rank
M: for Automotive
Packaging Specification
E2: Embossed tape and reel
Marking Diagram
VQFN64FBV090 (TOP VIEW)
Part Number Marking
BU18RL82
LOT Number
Pin 1 Mark
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BU18RL82-M
Physical Dimension and Packing Information
Package Name
VQFN64FBV090
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BU18RL82-M
Revision History
Date
Revision
001
Changes
7.Jun.2022
New Release
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
BU18SD2MG-M
BUxxSD2-M系列为通用型封装SSOP5 (2.90mm x 2.80mm x 1.25mm)中搭载的200mA高性能FULL CMOS稳压器。电路电流33µA，功耗低且噪音特性、负载响应特性优异，适用于汽车音响、汽车导航等各种应用。
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