BU18TM41-C [ROHM]
用于汽车摄像头模块的SerDes IC;
| 型号： | BU18TM41-C |
| 厂家： | 
ROHM |
| 描述： | 用于汽车摄像头模块的SerDes IC |
| 文件： | 总11页 (文件大小：854K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product Brief
Clockless Link-BD
Clockless Link-BD Serializer
with MIPI CSI-2 Interface for Automotive
BU18TM41-C
General Description
Key Specifications
BU18TM41-C supports MIPI CSI-2 data transmission by
ROHM's original CDR (Clock Data Recovery) technology.
This chip is the serial interface transmitter IC of the
Clockless Link-BD series.
BU18TM41-C converts the MIPI CSI-2 data stream into
Clockless Link format transmit through
differential wires.
Supply Voltage Range: VDD18
Clockless Link-BD Data Rate:
1.7 V to 3.6 V
Forward Channel
Back Channel
3.6 Gbps/lane (Max)
16.875 Mbps/lane (TYP)
1.5 Gbps/lane (Max)
1 Mbps (Max)
MIPI CSI-2 Data Rate:
GPIO Output Data Rate:
I2C Clock Frequency:
SSCG:
a pair of
1 MHz (Max)
Modulation Frequency
Modulation Ratio
30 kHz to 200 kHz
Up to 2 %
Features
AEC-Q100 Qualified (Note 1)
Operating Temperature Range: -40 °C to +105 °C
Functional Safety Supportive Automotive Products
Input Interface:
Applications
MIPI D-PHY/CSI-2 4 Lane
Image Sensor Interface
MIPI CSI-2 ver.1.3 / MIPI D-PHY ver1.2
Video Format: YUV422, RAW8/10/12
Output Interface:
Package
W (Typ) x D (Typ) x H (Max)
VQFN32FBV050
5.0 mm x 5.0 mm x 1.0 mm
Clockless Link-BD 1 Lane
Low EMI Transmission by Original DC Balance
Protocol and Scrambling
Supports Coaxial Cable and STP Cable
Supported Functions
SSCG (Spread Spectrum Clock Generator)
I2C Master
General-Purpose Input/Output (GPIO) 5 Pins
Connect Ability Check
CRC
(Note 1) Grade2
Block Diagram
Figure 1. Block Diagram
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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BU18TM41-C
SerDes Typical Applications
ECU
Camera Module
MIPI CSI-2
Serializer
Deserializer
SOC
(BU18TM41)
(BU18RM41)
Figure 2. SerDes Typical Applications1 (1 lane connection)
ECU
Camera Module
V1
Serializer
(BU18TM41)
MIPI CSI-2
SOC
SOC
V2
V2
V3
V4
V1
Serializer
(BU18TM41)
Deserializer
(BU18RM84)
V3
V4
Serializer
(BU18TM41)
MIPI CSI-2
V2
V3
V4
V1
Serializer
(BU18TM41)
Figure 3. SerDes Typical Applications1 (4 lane connection)
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BU18TM41-C
Applications Examples
POC (Power Over Coaxial) Cable
Power Output
Power Input
1.8 V
1.8 V
Inductor
Beads
Inductor
Beads
VDD18
VDD18
VDD18
VDD18
10 μF
10 μF
VDD12
VDD12
VDD12
VDD12
Beads
100 nF
47 nF
Beads
100 nF
47 nF
LDOCAP
CLTXP
CLTXN
LDOCAP
CLRXP
CLRXN
Coaxial Cable
2.2 μF
2.2 μF
50 Ω
50 Ω
1.8 V
1.8 V
1.5 kΩ
BU18TM41-C
BU18RM41-C
1.5 kΩ
1.5 kΩ
1.5 kΩ
SCL
SDA
SCL
SDA
100 nF
100 nF
CMLOUTP
CMLOUTN
MRX0P
MRX0N
MRX1P
MRX1N
MRXCKP
MRXCKN
MRX2P
MRX2N
MRX3P
MRX3N
MTX0P
MTX0N
MTX1P
MTX1N
MTXCKP
MTXCKN
MTX2P
MTX2N
MTX3P
MTX3N
100 Ω
MIPI
Port
MIPI
Port
GPIO4
GPIO3
GPIO2
GPIO2
GPIO1
GPIO0
TEST
TEST
10 kΩ
10 kΩ
GPIO1
GPIO0
REGEN
10 kΩ
1.8 V
1.8 V
MCAP
REGEN
N.C
N.C
10 kΩ
2.2 μF
IDS
IDS
10 kΩ
10 kΩ
1 μF
1 μF
1.8 V
4.7 kΩ
25 MHz to 27 MHz XTAL clk
IRQ
CLKIN
XRST
XRST
GND
GND
GND
GND
GND
EXP-PAD
EXP-PAD
VDD18
VDD18
GND
VDD12
GND
VDD12
VDD18
VDD12
VDD12
VDD18
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
GND
GND
GND
GND
GND
GND
Figure 4. Applications Diagram (POC Cable)
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BU18TM41-C
Applications Examples – continued
STP (Shielded Twisted Pair) Cable
1.8 V
1.8 V
VDD18
VDD18
VDD18
VDD18
10 μF
10 μF
VDD12
VDD12
VDD12
VDD12
100 nF
100 nF
100 nF
100 nF
LDOCAP
CLTXP
CLTXN
LDOCAP
CLRXP
CLRXN
2.2 μF
2.2 μF
STP Cable
1.8 V
1.8 V
1.5 kΩ
BU18TM41-C
BU18RM41-C
1.5 kΩ
1.5 kΩ
1.5 kΩ
SCL
SDA
SCL
SDA
100 nF
100 nF
CMLOUTP
CMLOUTN
MRX0P
MRX0N
MRX1P
MRX1N
MRXCKP
MRXCKN
MRX2P
MRX2N
MRX3P
MRX3N
MTX0P
MTX0N
MTX1P
MTX1N
MTXCKP
MTXCKN
MTX2P
MTX2N
MTX3P
MTX3N
100 Ω
MIPI
Port
MIPI
Port
GPIO4
GPIO3
GPIO2
GPIO1
GPIO0
GPIO2
GPIO1
GPIO0
TEST
TEST
10 kΩ
10 kΩ
REGEN
MCAP
10 kΩ
REGEN
1.8 V
1.8 V
10 kΩ
N.C
N.C
2.2 μF
IDS
IDS
10 kΩ
10 kΩ
1 μF
1 μF
1.8 V
4.7 kΩ
25 MHz to 27 MHz XTAL clk
IRQ
CLKIN
XRST
XRST
GND
GND
GND
GND
GND
EXP-PAD
EXP-PAD
VDD18
VDD18
GND
VDD12
GND
VDD12
VDD18
VDD12
VDD12
VDD18
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
0.1 μF
0.01 μF
GND
GND
GND
GND
GND
GND
Figure 5. Applications Diagram (STP Cable)
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BU18TM41-C
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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BU18TM41-C
Operational Notes – continued
12. Functional Safety
“ISO 26262 Process Compliant to Support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.
“Functional Safety Supportive Automotive Products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the
functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
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BU18TM41-C
Ordering Information
-
B
U
1
8
T
M
4
1
C E 2
Product Rank
C: for Automotive
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
VQFN32FBV050 (TOP VIEW)
Part Number Marking
1 8 T M 4 1
LOT Number
Pin 1 Mark
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BU18TM41-C
Physical Dimension and Packing Information
Package Name
VQFN32FBV050
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BU18TM41-C
Revision History
Date
Revision
001
Changes
New Release
25.Mar.2021
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
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